DIODES SBR0220LP

SPICE MODEL: SBR0220LP
SBR0220LP
0.2A SBR®
Super Barrier Rectifier
NEW PRODUCT
Features
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Mechanical Data
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Low Leakage Current
Patented Super Barrier Rectifier Technology
Excellent High Temperature Stability
Soft, Fast Switching Capability
150ºC Operating Junction Temperature
Lead Free Finish, RoHS Compliant (Note 1)
“Green” Molding Compound (No Br, Sb)
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Case: DFN1006-2
Case Material: Molded Plastic, “Green” Molding
compound. UL Flammability Classification Rating
94V-0
Moisture Sensitivity: Level 1 per J-STD-020C
Polarity Indicator: Cathode Dot
Terminals: Finish - NiPdAu annealed over
Copper leadframe. Solderable per MIL-STD-202,
Method 208
Marking Information: See Page 3
Ordering Information: See Page 3
Weight: 0.001 grams (Approx.)
Maximum Ratings @ TA = 25ºC unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Rectified Output Current (See Figure 1)
Non-Repetitive Peak Forward Surge Current 8.3ms
Single Half Sine-Wave Superimposed on Rated Load
Maximum Thermal Resistance
Thermal Resistance Junction to Soldering (Note 2)
Thermal Resistance Junction to Ambient (Note 3)
Operating and Storage Temperature Range
Symbol
VRRM
VRWM
VRM
VR(RMS)
IO
Value
Unit
20
V
14
0.2
V
A
IFSM
5.0
A
RӨJS
RӨJA
17
304
ºC/W
-65 to +150
ºC
TJ, TSTG
Electrical Characteristics @ TA = 25ºC unless otherwise specified
Characteristic
Symbol
Min
Typ
Max
Unit
Reverse Breakdown Voltage (Note 4)
V(BR)R
20
-
-
V
IR = 400 µA
0.42
0.33
0.48
0.41
V
IF = 0.1A, TJ = 25ºC
IF = 0.1A, TJ = 150ºC
IF = 0.2A, TJ = 25ºC
IF = 0.2A, TJ = 150ºC
50
1.3
µA
mA
VR = 20V, TJ = 25ºC
VR = 20V, TJ = 150ºC
Forward Voltage Drop
VF
-
0.38
0.30
0.44
0.38
Leakage Current (Note 4)
IR
-
2
0.43
Notes:
Test Condition
1. RoHS revision 13.2.2003. High temperature solder exemption applied, see EU Directive Annex Note 7.
2. Theoretical RӨJS calculated from the top center of the die straight down to the PCB cathode tab solder junction.
3. FR-4 PCB, 2oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.
4. Short duration pulse test used to minimize self-heating effect.
__________
SBR is a registered trademark of Diodes Incorporated.
SBR0220LP Rev. 3 - 2
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© Diodes Incorporated
NEW PRODUCT
SBR0220LP
IF(AV), AVERAGE FORWARD CURRENT(A)
0.25
Note 3
0.2
0.15
0.1
0.05
0
0
Fig. 3 Typical Total Capacitance
25
50
75 100 125 150 175
TA, AMBIENT TEMPERATURE (°C)
Fig. 4 Forward Current Derating Curve
200
PF(AV), AVERAGE FORWARD
POWER DISSIPATION (W)
0.4
0.3
TJ =150°C
0.2
0.1
0
0
0.1
0.2
0.3
0.4
0.5
0.6
IF(AV), AVERAGE FORWARD CURRENT (A)
Fig. 5 Forward Power Dissipation
SBR0220LP Rev. 3 - 2
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SBR0220LP
Package Outline Drawing
NEW PRODUCT
TOP VIEW
Cathode Indicator
DFN1006-2
G
H
A
R
B
C
Dim
Min Max Typ
A
0.95 1.075 1.00
B
0.55 0.675 0.60
C
0.45 0.55 0.50
D
0.20 0.30 0.25
G
0.47 0.53 0.50
H
0
N
⎯
R
D
N
0.05 0.03
⎯
0.40
0.05 0.15 0.10
All Dimensions in mm
SBR0220LP
Marking, Polarity, Weight & Ordering Information
Case Style
Marking
(DFN1006-2)
Weight
22
Top View
SBR0220LP Rev. 3 - 2
0.001g (approx.)
Back View
Ordering Information
Date Code
SBR0220LP-7
3000/Tape & Reel
22 = Product Type Marking Code
Dot Denotes Cathode Side
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SBR0220LP
NEW PRODUCT
Suggested Pad Layout
IMPORTANT NOTICE
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product
described herein; neither does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall
assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on our website,
harmless against all damages.
LIFE SUPPORT
Diodes Incorporated products are not authorized for use as critical components in life support devices or systems without the expressed written
approval of the President of Diodes Incorporated.
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