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1
04-03-2008 CRG
© by SEMIKRON
SKB 26
Fig. 1L Power dissipation vs. output current
Fig. 1R Power dissipation vs. case temperature
Fig. 2 Output current vs. case temperature
Fig. 9 Forward characteristics of a diode arm
2
04-03-2008 CRG
© by SEMIKRON
SKB 26
Dimensions in mm
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J / This technical information specifies semiconductor devices but promises no characteristics. No warranty or guarantee
expressed or implied is made regarding delivery, performance or suitability.
3
04-03-2008 CRG
© by SEMIKRON