SDLS047 − DECEMBER 1983 − REVISED MARCH 1988
Copyright 1988, Texas Instruments Incorporated
!"# $ %&'# "$ (&)*%"# +"#',
+&%#$ %! # $('%%"#$ (' #-' #'!$ '."$ $#&!'#$
$#"+"+ /""#0, +&%# (%'$$1 +'$ # '%'$$"*0 %*&+'
#'$#1 "** (""!'#'$,
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SDLS047 − DECEMBER 1983 − REVISED MARCH 1988
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SDLS047 − DECEMBER 1983 − REVISED MARCH 1988
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
SDLS047 − DECEMBER 1983 − REVISED MARCH 1988
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SDLS047 − DECEMBER 1983 − REVISED MARCH 1988
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
SDLS047 − DECEMBER 1983 − REVISED MARCH 1988
6
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SDLS047 − DECEMBER 1983 − REVISED MARCH 1988
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
7
SDLS047 − DECEMBER 1983 − REVISED MARCH 1988
8
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SDLS047 − DECEMBER 1983 − REVISED MARCH 1988
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
9
SDLS047 − DECEMBER 1983 − REVISED MARCH 1988
10
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SDLS047 − DECEMBER 1983 − REVISED MARCH 1988
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
11
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
7600401CA
ACTIVE
CDIP
J
14
1
TBD
A42 SNPB
N / A for Pkg Type
7600401DA
ACTIVE
CFP
W
14
1
TBD
A42
N / A for Pkg Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
Lead/Ball Finish
MSL Peak Temp (3)
7600401DA
ACTIVE
CFP
W
14
1
TBD
A42
N / A for Pkg Type
JM38510/31303BCA
ACTIVE
CDIP
J
14
1
TBD
A42 SNPB
N / A for Pkg Type
JM38510/31303BCA
ACTIVE
CDIP
J
14
1
TBD
A42 SNPB
N / A for Pkg Type
SN54132J
OBSOLETE
CDIP
J
14
TBD
Call TI
Call TI
SN54132J
OBSOLETE
CDIP
J
14
TBD
Call TI
Call TI
SN54LS132J
ACTIVE
CDIP
J
14
1
TBD
A42 SNPB
N / A for Pkg Type
SN54LS132J
ACTIVE
CDIP
J
14
1
TBD
A42 SNPB
N / A for Pkg Type
SN54S132J
ACTIVE
CDIP
J
14
1
TBD
A42 SNPB
N / A for Pkg Type
SN54S132J
ACTIVE
CDIP
J
14
1
TBD
A42 SNPB
N / A for Pkg Type
SN74132N
OBSOLETE
PDIP
N
14
TBD
Call TI
Call TI
SN74132N
OBSOLETE
PDIP
N
14
TBD
Call TI
Call TI
SN74132N3
OBSOLETE
PDIP
N
14
TBD
Call TI
Call TI
Call TI
SN74132N3
OBSOLETE
PDIP
N
14
TBD
Call TI
SN74LS132D
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS132D
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS132DE4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS132DE4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS132DG4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS132DG4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS132DR
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS132DR
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS132DRE4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS132DRE4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS132DRG4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS132DRG4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS132J
OBSOLETE
CDIP
J
14
TBD
Call TI
Call TI
SN74LS132J
OBSOLETE
CDIP
J
14
TBD
Call TI
Call TI
SN74LS132N
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74LS132N
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74LS132N3
OBSOLETE
PDIP
N
14
TBD
Call TI
Addendum-Page 1
Call TI
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
Lead/Ball Finish
MSL Peak Temp (3)
SN74LS132N3
OBSOLETE
PDIP
N
14
TBD
Call TI
SN74LS132NE4
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74LS132NE4
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74LS132NSR
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS132NSR
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS132NSRE4
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS132NSRE4
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS132NSRG4
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS132NSRG4
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74S132D
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74S132D
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74S132DE4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74S132DE4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74S132DG4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74S132DG4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74S132DR
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74S132DR
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74S132DRE4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74S132DRE4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74S132DRG4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74S132DRG4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74S132N
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74S132N
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74S132N3
OBSOLETE
PDIP
N
14
TBD
Call TI
Call TI
SN74S132N3
OBSOLETE
PDIP
N
14
TBD
Call TI
Call TI
SN74S132NE4
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74S132NE4
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
Addendum-Page 2
Call TI
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SNJ54132J
OBSOLETE
CDIP
J
14
TBD
Call TI
Call TI
SNJ54132J
OBSOLETE
CDIP
J
14
TBD
Call TI
Call TI
SNJ54LS132FK
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE N / A for Pkg Type
SNJ54LS132FK
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE N / A for Pkg Type
SNJ54LS132J
ACTIVE
CDIP
J
14
1
TBD
A42 SNPB
N / A for Pkg Type
Lead/Ball Finish
MSL Peak Temp (3)
SNJ54LS132J
ACTIVE
CDIP
J
14
1
TBD
A42 SNPB
N / A for Pkg Type
SNJ54LS132W
ACTIVE
CFP
W
14
1
TBD
A42
N / A for Pkg Type
SNJ54LS132W
ACTIVE
CFP
W
14
1
TBD
A42
N / A for Pkg Type
SNJ54S132FK
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE N / A for Pkg Type
SNJ54S132FK
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE N / A for Pkg Type
SNJ54S132J
ACTIVE
CDIP
J
14
1
TBD
A42 SNPB
N / A for Pkg Type
SNJ54S132J
ACTIVE
CDIP
J
14
1
TBD
A42 SNPB
N / A for Pkg Type
SNJ54S132W
ACTIVE
CFP
W
14
1
TBD
A42
N / A for Pkg Type
SNJ54S132W
ACTIVE
CFP
W
14
1
TBD
A42
N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Oct-2007
TAPE AND REEL BOX INFORMATION
Device
Package Pins
Site
Reel
Diameter
(mm)
Reel
Width
(mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN74LS132DR
D
14
SITE 41
330
16
6.5
9.0
2.1
8
16
Q1
SN74LS132NSR
NS
14
SITE 41
330
16
8.2
10.5
2.5
12
16
Q1
SN74S132DR
D
14
SITE 41
330
16
6.5
9.0
2.1
8
16
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
Device
4-Oct-2007
Package
Pins
Site
Length (mm)
Width (mm)
Height (mm)
SN74LS132DR
D
14
SITE 41
346.0
346.0
33.0
SN74LS132NSR
NS
14
SITE 41
346.0
346.0
33.0
SN74S132DR
D
14
SITE 41
346.0
346.0
33.0
Pack Materials-Page 2
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
18
17
16
15
14
13
NO. OF
TERMINALS
**
12
19
11
20
10
A
B
MIN
MAX
MIN
MAX
20
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
28
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
9
22
8
44
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
23
7
52
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
24
6
68
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
84
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
B SQ
A SQ
25
5
26
27
28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140 / D 10/96
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a metal lid.
The terminals are gold plated.
Falls within JEDEC MS-004
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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