SLLS353G − JUNE 1999 − REVISED NOVEMBER 2004
D Operate With 3-V to 5.5-V VCC Supply
D Always-Active Noninverting Receiver
D
D
D
D
D
D
D
D
DB, DW, OR PW PACKAGE
(TOP VIEW)
Output (ROUT2B)
Low Standby Current . . . 1 µA Typ
External Capacitors . . . 4 × 0.1 µF
Accept 5-V Logic Input With 3.3-V Supply
Inter-Operable With SN65C3238,
SN75C3238
Support Operation From 250 kbit/s to
1 Mbit/s
RS-232 Bus-Pin ESD Protection Exceeds
±15-kV Using Human-Body Model (HBM)
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
Applications
− Battery-Powered Systems, PDAs,
Notebooks, Laptops, Palmtop PCs, and
Hand-Held Equipment
C2+
C2−
V−
RIN1
RIN2
RIN3
RIN4
RIN5
DOUT1
DOUT2
DOUT3
DIN3
DIN2
DIN1
1
28
2
27
3
26
4
25
5
24
6
23
7
22
8
21
9
20
10
19
11
18
12
17
13
16
14
15
C1+
V+
VCC
GND
C1−
FORCEON
FORCEOFF
INVALID
ROUT2B
ROUT1
ROUT2
ROUT3
ROUT4
ROUT5
description/ordering information
The SN65C3243 and SN75C3243 consist of three line drivers, five line receivers, and a dual charge-pump
circuit with ±15-kV ESD protection pin-to-pin (serial-port connection pins, including GND). These devices
provide the electrical interface between an asynchronous communication controller and the serial-port
connector. The charge pump and four small external capacitors allow operation from a single 3-V to 5.5-V
supply. In addition, these devices include an always-active noninverting output (ROUT2B), which allows
applications using the ring indicator to transmit data while the devices are powered down. The devices operate
at data signaling rates up to 1 Mbit/s and an increased slew-rate range of 24 V/µs to 150 V/µs.
ORDERING INFORMATION
SOIC (DW)
−0°C
70°C
−0
C to 70
C
SSOP (DB)
TSSOP (PW)
SOIC (DW)
−40°C
85°C
−40
C to 85
C
ORDERABLE
PART NUMBER
PACKAGE†
TA
SSOP (DB)
TSSOP (PW)
Tube of 20
SN75C3243DW
Reel of 1000
SN75C3243DWR
Reel of 2000
SN75C3243DBR
Tube of 50
SN75C3243PW
Reel of 2000
SN75C3243PWR
Tube of 20
SN65C3243DW
Reel of 1000
SN65C3243DWR
Reel of 2000
SN65C3243DBR
Tube of 50
SN65C3243PW
Reel of 2000
SN65C3243PWR
TOP-SIDE
MARKING
75C3243
75C3243
CA3243
65C3243
65C3243
CB3243
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2004, Texas Instruments Incorporated
!"#$%! & '("")% $& ! *(+,'$%! -$%)
"!-('%& '!!"# %! &*)''$%!& *)" %.) %)"#& ! )/$& &%"(#)%&
&%$-$"- 0$""$%1 "!-('%! *"!')&&2 -!)& !% )')&&$",1 ',(-)
%)&%2 ! $,, *$"$#)%)"&
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SLLS353G − JUNE 1999 − REVISED NOVEMBER 2004
description/ordering information (continued)
Flexible control options for power management are available when the serial port is inactive. The
auto-powerdown feature functions when FORCEON is low and FORCEOFF is high. During this mode of
operation, if the devices do not sense a valid RS-232 signal, the driver outputs are disabled. If FORCEOFF is
set low, both drivers and receivers (except ROUT2B) are shut off, and the supply current is reduced to 1 µA.
Disconnecting the serial port or turning off the peripheral drivers causes the auto-powerdown condition to occur.
Auto-powerdown can be disabled when FORCEON and FORCEOFF are high and should be done when driving
a serial mouse. With auto-powerdown enabled, the device is activated automatically when a valid signal is
applied to any receiver input. The INVALID output is used to notify the user if an RS-232 signal is present at any
receiver input. INVALID is high (valid data) if any receiver input voltage is greater than 2.7 V or less than −2.7 V
or has been between −0.3 V and 0.3 V for less than 30 µs. INVALID is low (invalid data) if all receiver input
voltages are between −0.3 V and 0.3 V for more than 30 µs. Refer to Figure 5 for receiver input levels.
Function Tables
EACH DRIVER
INPUTS
DIN
FORCEON
FORCEOFF
VALID RIN
RS-232 LEVEL
OUTPUT
DOUT
DRIVER STATUS
X
X
L
X
Z
Powered off
L
H
H
X
H
H
H
H
X
L
Normal operation with
auto-powerdown disabled
L
L
H
Yes
H
H
L
H
Yes
L
L
L
H
No
Z
H
L
H
No
Z
Normal operation with
auto-powerdown enabled
Powered off by
auto-powerdown feature
H = high level, L = low level, X = irrelevant, Z = high impedance
EACH RECEIVER
INPUTS
OUTPUTS
RIN2
RIN1,
RIN3−RIN5
FORCEOFF
VALID RIN
RS-232 LEVEL
ROUT2B
ROUT
L
X
L
X
L
Z
H
X
L
X
H
Z
L
L
H
Yes
L
H
L
H
H
Yes
L
L
H
L
H
Yes
H
H
H
H
H
Yes
H
L
Open
Open
H
No
L
H
RECEIVER STATUS
Powered off while
ROUT2B is active
Normal operation with
auto-powerdown
disabled/enabled
H = high level, L = low level, X = irrelevant, Z = high impedance (off), Open = input disconnected or connected
driver off
2
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• DALLAS, TEXAS 75265
SLLS353G − JUNE 1999 − REVISED NOVEMBER 2004
logic diagram (positive logic)
DIN1
DIN2
DIN3
FORCEOFF
FORCEON
ROUT1
ROUT2B
ROUT2
ROUT3
ROUT4
ROUT5
14
9
13
10
12
11
DOUT1
DOUT2
DOUT3
22
23
Auto-powerdown
19
21
4
INVALID
RIN1
20
18
5
17
6
16
7
15
8
RIN2
RIN3
RIN4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
RIN5
3
SLLS353G − JUNE 1999 − REVISED NOVEMBER 2004
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 6 V
Positive output supply voltage range, V+ (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 7 V
Negative output supply voltage range, V− (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to −7 V
Supply voltage difference, V+ − V− (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 V
Input voltage range, VI: Driver (FORCEOFF, FORCEON) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 6 V
Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −25 V to 25 V
Output voltage range, VO: Driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −13.2 V to 13.2 V
Package thermal impedance, θJA (see Notes 2 and 3): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . 62°C/W
DW package . . . . . . . . . . . . . . . . . . . . . . . . . . 46°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . 62°C/W
Operating virtual junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltages are with respect to network GND.
2. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable
ambient temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
3. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 4 and Figure 6)
VCC = 3.3 V
VCC = 5 V
Supply voltage
VIH
Driver and control high-level input voltage
DIN, FORCEOFF, FORCEON
VIL
VI
Driver and control low-level input voltage
DIN, FORCEOFF, FORCEON
Driver and control input voltage
DIN, FORCEOFF, FORCEON
VI
Receiver input voltage
TA
Operating free-air temperature
VCC = 3.3 V
VCC = 5 V
MIN
NOM
MAX
3
3.3
3.6
4.5
5
5.5
UNIT
V
2
V
2.4
0.8
V
0
5.5
V
V
−25
25
SN65C3243
−40
85
SN75C3243
0
70
°C
NOTE 4: Test conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 6)
PARAMETER
II
ICC
Input leakage current
TEST CONDITIONS
FORCEOFF, FORCEON
MIN
TYP‡
MAX
±0.01
±1
µA
0.3
1
mA
Auto-powerdown disabled
No load,
FORCEOFF and FORCEON = VCC
Powered off
No load, FORCEOFF = GND
1
10
Auto-powerdown enabled
No load, FORCEOFF = VCC,
FORCEON = GND,
All RIN are open or grounded,
All DIN are grounded
1
10
Supply current
‡ All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
NOTE 4. Test conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
UNIT
µA
SLLS353G − JUNE 1999 − REVISED NOVEMBER 2004
DRIVER SECTION
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 6)
PARAMETER
VOH
VOL
VO
IIH
IIL
TEST CONDITIONS
MIN
TYP†
MAX
UNIT
High-level output voltage
All DOUT at RL = 3 kΩ to GND
5
5.4
V
Low-level output voltage
All DOUT at RL = 3 kΩ to GND
−5
−5.4
V
Output voltage
(mouse driveability)
DIN1 = DIN2 = GND, DIN3 = VCC,
3-kΩ to GND at DOUT3,
DOUT1 = DOUT2 = 2.5 mA
±5
High-level input current
Low-level input current
VI = VCC
VI = GND
VCC = 3.6 V,
VCC = 5.5 V,
VCC, V+, and V− = 0
V,
IOS
Short-circuit output
current‡
ro
Output resistance
Ioff
Output leakage current
FORCEOFF = GND
VO = 0 V
VO = 0 V
VO = ±2 V
300
V
±0.01
±1
µA
±0.01
±1
µA
±35
±60
±35
±90
mA
Ω
10M
VO = ±12 V,
VCC = 3 V to 3.6 V
±25
VO = ±10 V,
VCC = 4.5 V to 5.5
V
±25
µA
† All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
‡ Short-circuit durations should be controlled to prevent exceeding the device absolute power-dissipation ratings, and not more than one output
should be shorted at a time.
NOTE 4. Test conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 6)
PARAMETER
Maximum data rate
(see Figure 1)
TEST CONDITIONS
RL = 3 kΩ,
kΩ
One DOUT switching
MIN
CL = 1000 pF
CL = 250 pF,
TYP†
MAX
UNIT
250
CL = 1000 pF,
VCC = 3 V to 4.5 V
VCC = 4.5 V to 5.5 V
tsk(p)
Pulse skew§
CL = 150 pF to 2500 pF,
RL = 3 kΩ to 7 kΩ,
See Figure 2
SR(tr)
Slew rate,
transition region
(see Figure 1)
CL = 150 pF to 1000 pF,
RL = 3 kΩ to 7 kΩ,
VCC = 3.3 V
1000
kbit/s
1000
25
18
ns
150
V/µs
† All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
§ Pulse skew is defined as |tPLH − tPHL| of each channel of the same device.
NOTE 4. Test conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
SLLS353G − JUNE 1999 − REVISED NOVEMBER 2004
RECEIVER SECTION
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 6)
PARAMETER
VOH
VOL
TEST CONDITIONS
High-level output voltage
IOH = −1 mA
IOL = 1.6 mA
Low-level output voltage
VIT+
Positive-going input threshold voltage
VCC = 3.3 V
VCC = 5 V
VIT−
Negative-going input threshold voltage
VCC = 3.3 V
VCC = 5 V
Vhys
Ioff
Input hysteresis (VIT+ − VIT−)
MIN
TYP†
VCC − 0.6 V
VCC − 0.1 V
MAX
V
0.4
1.6
2.4
1.9
2.4
0.6
1.1
0.8
1.4
FORCEOFF = 0 V
V
V
V
0.5
Output leakage current (except ROUT2B)
UNIT
V
±0.05
ri
Input resistance
VI = ±3 V to ±25 V
3
5
† All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
NOTE 4. Test conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
±10
µA
7
kΩ
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4)
PARAMETER
TEST CONDITIONS
TYP†
tPLH
tPHL
Propagation delay time, low- to high-level output
CL = 150 pF, See Figure 3
150
ns
Propagation delay time, high- to low-level output
CL = 150 pF, See Figure 3
150
ns
ten
tdis
Output enable time
CL = 150 pF, RL = 3 kΩ, See Figure 4
200
ns
Output disable time
Pulse skew‡
CL = 150 pF, RL = 3 kΩ, See Figure 4
200
ns
50
ns
tsk(p)
See Figure 3
† All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
‡ Pulse skew is defined as |tPLH − tPHL| of each channel of the same device.
NOTE 4. Test conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
6
UNIT
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SLLS353G − JUNE 1999 − REVISED NOVEMBER 2004
AUTO-POWERDOWN SECTION
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Figure 5)
PARAMETER
TEST CONDITIONS
MIN
VT+(valid)
Receiver input threshold
for INVALID high-level output voltage
FORCEON = GND,
FORCEOFF = VCC
VT−(valid)
Receiver input threshold
for INVALID high-level output voltage
FORCEON = GND,
FORCEOFF = VCC
−2.7
VT(invalid)
Receiver input threshold
for INVALID low-level output voltage
FORCEON = GND,
FORCEOFF = VCC
−0.3
VOH
INVALID high-level output voltage
IOH = −1 mA, FORCEON = GND,
FORCEOFF = VCC
VOL
INVALID low-level output voltage
IOL = 1.6 mA, FORCEON = GND,
FORCEOFF = VCC
MAX
2.7
UNIT
V
V
0.3
VCC − 0.6
V
V
0.4
V
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Figure 5)
TYP†
PARAMETER
tvalid
tinvalid
UNIT
Propagation delay time, low- to high-level output
1
µs
Propagation delay time, high- to low-level output
30
µs
100
µs
ten
Supply enable time
† All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
POST OFFICE BOX 655303
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7
SLLS353G − JUNE 1999 − REVISED NOVEMBER 2004
PARAMETER MEASUREMENT INFORMATION
3V
Generator
(see Note B)
Input
RS-232
Output
50 Ω
RL
CL
(see Note A)
3V
FORCEOFF
TEST CIRCUIT
0V
tTHL
Output
6V
SR(tr) +
t THL or t TLH
tTLH
VOH
3V
3V
−3 V
−3 V
VOL
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 1 Mbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 1. Driver Slew Rate
3V
Generator
(see Note B)
RS-232
Output
50 Ω
RL
Input
1.5 V
1.5 V
0V
CL
(see Note A)
tPHL
tPLH
VOH
3V
FORCEOFF
50%
50%
Output
VOL
TEST CIRCUIT
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 1 Mbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 2. Driver Pulse Skew
3 V or 0 V
FORCEON
3V
Input
1.5 V
1.5 V
−3 V
Output
Generator
(see Note B)
50 Ω
3V
FORCEOFF
tPHL
CL
(see Note A)
tPLH
VOH
50%
Output
50%
VOL
TEST CIRCUIT
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 3. Receiver Propagation Delay Times
8
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SLLS353G − JUNE 1999 − REVISED NOVEMBER 2004
PARAMETER MEASUREMENT INFORMATION
3V
Input
3 V or 0 V
FORCEON
VCC
S1
1.5 V
0V
tPZH
(S1 at GND)
tPHZ
(S1 at GND)
RL
±3 V
1.5 V
GND
VOH
Output
50%
Output
CL
(see Note A)
FORCEOFF
Generator
(see Note B)
50 Ω
0.3 V
tPZL
(S1 at VCC)
tPLZ
(S1 at VCC)
0.3 V
Output
50%
VOL
TEST CIRCUIT
NOTES: A.
B.
C.
D.
VOLTAGE WAVEFORMS
CL includes probe and jig capacitance.
The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
tPLZ and tPHZ are the same as tdis.
tPZL and tPZH are the same as ten.
Figure 4. Receiver Enable and Disable Times
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
9
SLLS353G − JUNE 1999 − REVISED NOVEMBER 2004
PARAMETER MEASUREMENT INFORMATION
2.7 V
2.7 V
0V
Receiver
Input
0V
−2.7 V
−2.7 V
ROUT
Generator
(see Note B)
3V
50 Ω
tinvalid
tvalid
50% VCC
50% VCC
−3 V
VCC
INVALID
Output
Autopowerdown
FORCEOFF
FORCEON
DIN
ten
INVALID
CL = 30 pF
(see Note A)
0V
≈V+
V+
0.3 V
VCC
0V
0.3 V
Supply
Voltages
DOUT
≈V−
V−
TEST CIRCUIT
VOLTAGE WAVEFORMS
Valid RS-232 Level, INVALID High
2.7 V
ÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎ
Indeterminate
0.3 V
0V
−0.3 V
If Signal Remains Within This Region
For More Than 30 µs, INVALID Is Low†
Indeterminate
−2.7 V
Valid RS-232 Level, INVALID High
† Auto-powerdown disables drivers and reduces
supply current to 1 µA.
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 5 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 5. INVALID Propagation Delay Times and Supply Enabling Time
10
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SLLS353G − JUNE 1999 − REVISED NOVEMBER 2004
APPLICATION INFORMATION
C1+
1
+
C2
−
2
C2−
3
V−
−
C1−
RIN2
RIN3
RIN4
RIN5
DOUT1
Serial-Port Outputs
GND
+
RIN1
Serial-Port Inputs
VCC
DOUT2
4
27
+
−
26
25
C3†
+ CBYPASS
− = 0.1 µF
+
−
C1
24
23
FORCEON
5
Autopowerdown
C4
V+
C2+
28
6
7
22
FORCEOFF
8
21
9
20
10
19
INVALID
ROUT2B
ROUT1
5 kΩ
DOUT3
11
18
ROUT2
5 kΩ
DIN3
12
Logic Outputs
17
ROUT3
5 kΩ
Logic Inputs
DIN2
13
16
ROUT4
5 kΩ
DIN1
14
15
ROUT5
5 kΩ
† C3 can be connected to VCC or GND.
NOTE A: Resistor values shown are nominal.
VCC vs CAPACITOR VALUES
VCC
C1
C2, C3, and C4
3.3 V ± 0.3 V
5 V ± 0.5 V
3 V to 5.5 V
0.1 µF
0.047 µF
0.1 µF
0.1 µF
0.33 µF
0.47 µF
Figure 6. Typical Operating Circuit and Capacitor Values
POST OFFICE BOX 655303
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11
PACKAGE OPTION ADDENDUM
www.ti.com
18-Jul-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN65C3243DBR
ACTIVE
SSOP
DB
28
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65C3243DBRE4
ACTIVE
SSOP
DB
28
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65C3243DW
ACTIVE
SOIC
DW
28
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65C3243DWE4
ACTIVE
SOIC
DW
28
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65C3243DWR
ACTIVE
SOIC
DW
28
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65C3243DWRE4
ACTIVE
SOIC
DW
28
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65C3243PW
ACTIVE
TSSOP
PW
28
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65C3243PWE4
ACTIVE
TSSOP
PW
28
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65C3243PWR
ACTIVE
TSSOP
PW
28
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65C3243PWRE4
ACTIVE
TSSOP
PW
28
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN75C3243DBR
ACTIVE
SSOP
DB
28
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN75C3243DBRE4
ACTIVE
SSOP
DB
28
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN75C3243DW
ACTIVE
SOIC
DW
28
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN75C3243DWE4
ACTIVE
SOIC
DW
28
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN75C3243DWR
ACTIVE
SOIC
DW
28
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN75C3243DWRE4
ACTIVE
SOIC
DW
28
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN75C3243PW
ACTIVE
TSSOP
PW
28
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN75C3243PWE4
ACTIVE
TSSOP
PW
28
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN75C3243PWG4
ACTIVE
TSSOP
PW
28
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN75C3243PWR
ACTIVE
TSSOP
PW
28
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN75C3243PWRE4
ACTIVE
TSSOP
PW
28
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN75C3243PWRG4
ACTIVE
TSSOP
PW
28
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
(1)
Lead/Ball Finish
MSL Peak Temp (3)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
18-Jul-2006
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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