SN54174, SN54175, SN54LS174, SN54LS175, SN54S174, SN54S175, SN74174, SN74175, SN74LS174, SN74LS175, SN74S174, SN74S175 HEX/QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR SDLS068A – DECEMBER 1972 – REVISED OCTOBER 2001 Copyright 2001, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SN54174, SN54175, SN54LS174, SN54LS175, SN54S174, SN54S175, SN74174, SN74175, SN74LS174, SN74LS175, SN74S174, SN74S175 HEX/QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR SDLS068A – DECEMBER 1972 – REVISED OCTOBER 2001 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SN54174, SN54175, SN54LS174, SN54LS175, SN54S174, SN54S175, SN74174, SN74175, SN74LS174, SN74LS175, SN74S174, SN74S175 HEX/QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR SDLS068A – DECEMBER 1972 – REVISED OCTOBER 2001 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 SN54174, SN54175, SN74174, SN74175 HEX/QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR SDLS068A – DECEMBER 1972 – REVISED OCTOBER 2001 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SN54LS174, SN54LS175, SN74LS174, SN74LS175 HEX/QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR SDLS068A – DECEMBER 1972 – REVISED OCTOBER 2001 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 SN54S174, SN54S175, SN74S174, SN74S175 HEX/QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR SDLS068A – DECEMBER 1972 – REVISED OCTOBER 2001 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 12-Jul-2005 PACKAGING INFORMATION Orderable Device Status (1) Package Type JM38510/01702BEA OBSOLETE CDIP J 16 TBD Call TI Call TI JM38510/01702BFA OBSOLETE CFP W 16 TBD Call TI Call TI JM38510/07105BEA ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC JM38510/07105BFA ACTIVE CFP W 16 1 TBD Call TI Level-NC-NC-NC JM38510/07106BEA ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) JM38510/30106B2A ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC JM38510/30106BEA ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC JM38510/30106BFA ACTIVE CFP W 16 1 TBD Call TI Level-NC-NC-NC JM38510/30107B2A ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC JM38510/30107BEA ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC JM38510/30107BFA ACTIVE CFP W 16 1 TBD Call TI Level-NC-NC-NC JM38510/30107SEA ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC JM38510/30107SFA ACTIVE CFP W 16 1 TBD Call TI Level-NC-NC-NC SN54175J OBSOLETE CDIP J 16 TBD Call TI Call TI SN54LS174J ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC SN54LS175J ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC SN54S174J ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC SN54S175J ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC SN74174N OBSOLETE PDIP N 16 TBD Call TI Call TI SN74175N OBSOLETE PDIP N 16 TBD Call TI Call TI SN74175N3 OBSOLETE PDIP N 16 TBD Call TI Call TI SN74LS174D ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS174DE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS174DR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS174DRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS174J OBSOLETE CDIP J 16 SN74LS174N ACTIVE PDIP N 16 TBD Call TI 25 Pb-Free (RoHS) CU NIPDAU Call TI TBD Call TI 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC Level-NC-NC-NC SN74LS174N3 OBSOLETE PDIP N 16 SN74LS174NE4 ACTIVE PDIP N 16 SN74LS174NSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS174NSRE4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS175D ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS175DE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS175DR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 1 Call TI PACKAGE OPTION ADDENDUM www.ti.com (1) 12-Jul-2005 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74LS175DRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) Lead/Ball Finish CU NIPDAU MSL Peak Temp (3) Level-1-260C-UNLIM SN74LS175J OBSOLETE CDIP J 16 SN74LS175N ACTIVE PDIP N 16 TBD Call TI Pb-Free (RoHS) CU NIPDAU SN74LS175N3 OBSOLETE PDIP N 16 TBD Call TI SN74LS175NE4 ACTIVE PDIP N 16 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC SN74LS175NSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS175NSRE4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S174J OBSOLETE CDIP J 16 SN74S174N ACTIVE PDIP N 16 SN74S174N3 OBSOLETE PDIP N 16 SN74S174NSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S174NSRE4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S175D ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S175DE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S175DR OBSOLETE SOIC D 16 TBD Call TI SN74S175N ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU 25 25 25 TBD Call TI Pb-Free (RoHS) CU NIPDAU TBD Call TI TBD Call TI Call TI Level-NC-NC-NC Call TI Call TI Level-NC-NC-NC Call TI Call TI Level-NC-NC-NC SN74S175N3 OBSOLETE PDIP N 16 SN74S175NSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Call TI Level-1-260C-UNLIM SN74S175NSRE4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SNJ54175J OBSOLETE CDIP J 16 TBD Call TI Call TI SNJ54175W OBSOLETE CFP W 16 TBD Call TI Call TI SNJ54LS174FK ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC SNJ54LS174J ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC SNJ54LS174W ACTIVE CFP W 16 1 TBD Call TI Level-NC-NC-NC SNJ54LS175FK ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC SNJ54LS175J ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC SNJ54LS175W ACTIVE CFP W 16 1 TBD Call TI Level-NC-NC-NC SNJ54S174FK ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC SNJ54S174J ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC SNJ54S174W ACTIVE CFP W 16 1 TBD Call TI Level-NC-NC-NC SNJ54S175FK ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC SNJ54S175J ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC SNJ54S175W ACTIVE CFP W 16 1 TBD Call TI Level-NC-NC-NC The marketing status values are defined as follows: Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 12-Jul-2005 ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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