SCAS513E − JUNE 1995 − REVISED OCTOBER 2003
D 2-V to 6-V VCC Operation
D Inputs Accept Voltages to 6 V
D Max tpd of 7.5 ns at 5 V
SN54AC241 . . . J OR W PACKAGE
SN54AC241 . . . DB, DW, N, NS, OR PW PACKAGE
(TOP VIEW)
1OE
1A1
2Y4
1A2
2Y3
1A3
2Y2
1A4
2Y1
GND
description/ordering information
These octal buffers and line drivers are designed
specifically to improve the performance and
density of 3-state memory address drivers, clock
drivers, and bus-oriented receivers and
transmitters.
The ’AC241 devices are organized as two 4-bit
buffers/drivers with separate complementary
output-enable (1OE and 2OE) inputs. When 1OE
is low or 2OE is high, the device passes
noninverted data from the A inputs to the
Y outputs. When 1OE is high or 2OE is low, the
outputs are in the high-impedance state.
1
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
VCC
2OE
1Y1
2A4
1Y2
2A3
1Y3
2A2
1Y4
2A1
To ensure the high-impedance state during power
up or power down, OE should be tied to VCC
through a pullup resistor and OE should be tied to
GND through a pulldown resistor; the minimum
value of the resistor is determined by the
current-sinking or the current-sourcing capability
of the driver.
4
3 2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
1Y1
2A4
1Y2
2A3
1Y3
2Y1
GND
2A1
1Y4
2A2
1A2
2Y3
1A3
2Y2
1A4
2OE
2Y4
1A1
1OE
VCC
SN54AC241 . . . FK PACKAGE
(TOP VIEW)
ORDERING INFORMATION
PDIP − N
SN74AC241N
Tube
SN74AC241DW
Tape and reel
SN74AC241DWR
SOP − NS
Tape and reel
SN74AC241NSR
AC241
SSOP − DB
Tape and reel
SN74AC241DBR
AC241
Tube
SN74AC241PW
Tape and reel
SN74AC241PWR
CDIP − J
Tube
SNJ54AC241J
SNJ54AC241J
CFP − W
Tube
SNJ54AC241W
SNJ54AC241W
LCCC − FK
Tube
SNJ54AC241FK
SNJ54AC241FK
TSSOP − PW
−55°C
−55
C to 125
125°C
C
TOP-SIDE
MARKING
Tube
SOIC − DW
−40°C
−40
C to 85
85°C
C
ORDERABLE
PART NUMBER
PACKAGE†
TA
SN74AC241N
AC241
AC241
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2003, Texas Instruments Incorporated
!"#$%&' #"'(' ')"*%("' #$**&' ( ") +$,-#("' !(&. *"!$# #"')"*% "
+&#)#("' +&* & &*% ") &/( '*$%&' ('!(*! 0(**('1.
*"!$#"' +*"#&'2 !"& '" '&#&(*-1 '#-$!& &'2 ") (-+(*(%&&*.
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1
SCAS513E − JUNE 1995 − REVISED OCTOBER 2003
FUNCTION TABLES
INPUTS
1OE
1A
OUTPUT
1Y
L
H
H
L
L
L
H
X
Z
INPUTS
2OE
2A
OUTPUT
2Y
H
H
H
H
L
L
L
X
Z
logic diagram (positive logic)
1OE
1A1
1A2
1A3
1A4
1
2OE
2
18
4
16
6
14
8
12
1Y1
2A1
1Y2
2A2
1Y3
2A3
1Y4
2A4
19
11
9
13
7
15
5
17
3
2Y1
2Y2
2Y3
2Y4
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V
Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0 or VI > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±200 mA
Package thermal impedance, θJA (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W
DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
2
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SCAS513E − JUNE 1995 − REVISED OCTOBER 2003
recommended operating conditions (see Note 3)
SN54AC241
VCC
VIH
Supply voltage
VCC = 3 V
VCC = 4.5 V
High-level input voltage
VCC = 5.5 V
VCC = 3 V
VIL
VI
VO
IOH
IOL
∆t/∆v
MIN
MAX
2
6
Input voltage
Low-level output current
2
6
3.15
3.15
3.85
3.85
0
High-level output current
MAX
2.1
0
Output voltage
MIN
2.1
VCC = 4.5V
VCC = 5.5 V
Low-level input voltage
SN74AC241
0.9
1.35
1.35
1.65
1.65
0
0
VCC
VCC
VCC = 3 V
VCC = 4.5 V
−12
−12
−24
−24
VCC = 5.5 V
VCC = 3 V
−24
−24
12
12
VCC = 4.5 V
VCC = 5.5 V
24
24
24
24
8
8
Input transition rise or fall rate
V
V
0.9
VCC
VCC
UNIT
V
V
V
mA
mA
ns/V
TA
Operating free-air temperature
−55
125
−40
85
°C
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
')"*%("' #"'#&*' +*"!$# ' & )"*%(3& "*
!&2' +(& ") !&3&-"+%&'. (*(#&*# !(( ('! "&*
+&#)#("' (*& !&2' 2"(-. &/( '*$%&' *&&*3& & *2 "
#('2& "* !#"''$& && +*"!$# 0"$ '"#&.
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3
SCAS513E − JUNE 1995 − REVISED OCTOBER 2003
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
IOH = −50 µA
IOH = −12 mA
VOH
IOH = −24 mA
MIN
MAX
SN74AC241
MIN
3V
2.9
2.9
2.9
4.5 V
4.4
4.4
4.4
5.5 V
5.4
5.4
5.4
3V
2.56
2.4
2.46
4.5 V
3.86
3.7
3.76
5.5 V
4.86
4.7
4.76
MAX
3V
0.1
0.1
0.1
4.5 V
0.1
0.1
0.1
5.5 V
0.1
0.1
0.1
3.85
3.85
3V
0.36
0.5
0.44
4.5 V
0.36
0.5
0.44
5.5 V
0.36
0.5
0.44
5.5 V
V
1.65
5.5 V
1.65
±0.1
±1
±1
±0.1
±1
±1
5.5 V
±0.25
±5
±2.5
µA
5.5 V
4
80
40
µA
5.5 V
IOZ
VO = VCC or GND,
VI(OE) = VIL or VIH
ICC
Ci
VI = VCC or GND,
VI = VCC or GND
IO = 0
UNIT
V
IOL = 50 µA
VI = VCC or GND
VI = VCC or GND
Control inputs
SN54AC241
5.5 V
IOL = 50 mA†
IOL = 75 mA†
II
TA = 25°C
TYP
MAX
5.5 V
IOL = 24 mA
Data inputs
MIN
IOH = −50 mA†
IOH = −75 mA†
IOL = 12 mA
VOL
VCC
5V
2.5
† Not more than one output should be tested at a time, and the duration of the test should not exceed 10 ms.
A
µA
pF
switching characteristics over recommended operating free-air temperature range,
VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
tPLH
tPHL
A
Y
tPZH
tPZL
OE or OE
Y
tPHZ
tPLZ
OE or OE
Y
MIN
TA = 25°C
TYP
MAX
1.5
6
9
1.5
6
9
1.5
6.5
1.5
7
2
1.5
POST OFFICE BOX 655303
MIN
1
12
1.5
10
1
11.5
1
10.5
12.5
1
13
1
13
12
1
13
1.5
13
8
12
1
13
2
12.5
7
12.5
1
13
1
13.5
• DALLAS, TEXAS 75265
MIN
SN74AC241
MAX
')"*%("' #"'#&*' +*"!$# ' & )"*%(3& "*
!&2' +(& ") !&3&-"+%&'. (*(#&*# !(( ('! "&*
+&#)#("' (*& !&2' 2"(-. &/( '*$%&' *&&*3& & *2 "
#('2& "* !#"''$& && +*"!$# 0"$ '"#&.
4
SN54AC241
MAX
UNIT
ns
ns
ns
SCAS513E − JUNE 1995 − REVISED OCTOBER 2003
switching characteristics over recommended operating
VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
tPLH
tPHL
A
Y
tPZH
tPZL
OE or OE
Y
tPHZ
tPLZ
OE or OE
Y
MIN
free-air
TA = 25°C
TYP
MAX
temperature
SN54AC241
range,
SN74AC241
MIN
MAX
MIN
MAX
1.5
5
7
1
9.5
1
7.5
1.5
4.5
7
1
9
1
7.5
1.5
5.5
9
1
10
1
9.5
1.5
5.5
9
1
10
1
9.5
1.5
6.5
10
1
11.5
1
10.5
1.5
6
10
1
11.5
1
10.5
UNIT
ns
ns
ns
operating characteristics, VCC = 5 V, TA = 25°C
PARAMETER
Cpd
TEST CONDITIONS
Power dissipation capacitance per buffer/driver
CL = 50 pF,
TYP
f = 1 MHz
45
UNIT
pF
PARAMETER MEASUREMENT INFORMATION
2 × VCC
S1
500 Ω
From Output
Under Test
CL = 50 pF
(see Note A)
Open
500 Ω
Output
Control
(low-level
enabling)
LOAD CIRCUIT
VCC
Input
50% VCC
50% VCC
0V
tPLH
tPHL
Output
VOH
50% VCC
VOL
50% VCC
TEST
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
2 × VCC
Open
VCC
50% VCC
50% VCC
0V
tPLZ
tPZL
Output
Waveform 1
S1 at 2 × VCC
(see Note B)
≈VCC
50% VCC
tPHZ
tPZH
Output
Waveform 2
S1 at Open
(see Note B)
VOLTAGE WAVEFORMS
VOL + 0.3 V
VOL
50% VCC
VOH − 0.3 V
VOH
≈0 V
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
D. The outputs are measured one at a time with one input transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
')"*%("' #"'#&*' +*"!$# ' & )"*%(3& "*
!&2' +(& ") !&3&-"+%&'. (*(#&*# !(( ('! "&*
+&#)#("' (*& !&2' 2"(-. &/( '*$%&' *&&*3& & *2 "
#('2& "* !#"''$& && +*"!$# 0"$ '"#&.
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PACKAGE OPTION ADDENDUM
www.ti.com
18-Jul-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74AC241DBLE
OBSOLETE
SSOP
DB
20
SN74AC241DBR
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AC241DBRE4
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AC241DW
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AC241DWE4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AC241DWR
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AC241DWRE4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AC241N
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74AC241NE4
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74AC241NSR
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AC241NSRE4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AC241PW
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AC241PWE4
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AC241PWLE
OBSOLETE
TSSOP
PW
20
TBD
Call TI
SN74AC241PWR
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AC241PWRE4
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TBD
Lead/Ball Finish
Call TI
MSL Peak Temp (3)
Call TI
Call TI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
18-Jul-2006
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
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MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
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