TI SN74AUP1T98YZPR

SN74AUP1T98
www.ti.com
SCES614H – OCTOBER 2004 – REVISED MAY 2010
SINGLE-SUPPLY VOLTAGE-LEVEL TRANSLATOR
WITH NINE CONFIGURABLE GATE LOGIC FUNCTIONS
Check for Samples: SN74AUP1T98
FEATURES
1
•
2
•
•
•
•
•
•
•
•
•
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Available in the Texas Instruments NanoStar™
Packages
Single-Supply Voltage Translator
1.8 V to 3.3 V (at VCC = 3.3 V)
2.5 V to 3.3 V (at VCC = 3.3 V)
1.8 V to 2.5 V (at VCC = 2.5 V)
3.3 V to 2.5 V (at VCC = 2.5 V)
Nine Configurable Gate Logic Functions
Schmitt-Trigger Inputs Reject Input Noise and
Provide Better Output Signal Integrity
Ioff Supports Partial-Power-Down Mode With
Low Leakage Current (0.5 mA)
Very Low Static and Dynamic Power
Consumption
Pb-Free Packages Available: SOT-23 (DBV),
SC-70 (DCK), and WCSP (NanoStar)
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Performance Tested Per JESD 22
– 2000-V Human-Body Model
(A114-B, Class II)
– 1000-V Charged-Device Model (C101)
Related Devices: SN74AUP1T97,
SN74AUP1T57, and SN74AUP1T58
DBV OR DCK PACKAGE
(TOP VIEW)
B
GND
A
1
6
2
5
3
4
C
VCC
Y
DRY OR DSF PACKAGE
(TOP VIEW)
B
1
6
C
GND
2
5
VCC
A
3
4
Y
YFP OR YZP PACKAGE
(TOP VIEW)
B
GND
A
A1
1 6
A2
B1
2 5
B2
C
VCC
C1
3 4
C2
Y
DESCRIPTION/ORDERING INFORMATION
AUP technology is the industry's lowest-power logic technology designed for use in battery-operated or battery
backed-up equipment. The SN74AUP1T98 is designed for logic-level translation applications with input switching
levels that accept 1.8-V LVCMOS signals, while operating from either a single 3.3-V or 2.5-V VCC supply.
The wide VCC range of 2.3 V to 3.6 V allows the possibility of battery voltage drop during system operation and
ensures normal operation between this range.
Schmitt-trigger inputs (ΔVT = 210 mV between positive and negative input transitions) offer improved noise
immunity during switching transitions, which is especially useful on analog mixed-mode designs. Schmitt-trigger
inputs reject input noise, ensure integrity of output signals, and allow for slow input signal transition.
The SN74AUP1T98 can be easily configured to perform a required gate function by connecting A, B, and C
inputs to VCC or ground (see Function Selection table). Up to nine commonly used logic gate functions can be
performed.
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2004–2010, Texas Instruments Incorporated
SN74AUP1T98
SCES614H – OCTOBER 2004 – REVISED MAY 2010
www.ti.com
Ioff is a feature that allows for powered-down conditions (VCC = 0 V) and is important in portable and mobile
applications. When VCC = 0 V, signals in the range from 0 V to 3.6 V can be applied to the inputs and outputs of
the device. No damage occurs to the device under these conditions.
The SN74AUP1T98 is designed with optimized current-drive capability of 4 mA to reduce line reflections,
overshoot, and undershoot caused by high-drive outputs.
NanoStar package technology is a major breakthrough in IC packaging concepts, using the die as the package.
ORDERING INFORMATION (1)
PACKAGE (2)
TA
–40°C to 85°C
(1)
(2)
(3)
TOP-SIDE
MARKING (3)
ORDERABLE PART NUMBER
NanoStar™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
Reel of 3000
SN74AUP1T98YZPR
_ _ _TK_
NanoStar™ – WCSP (DSBGA)
0.23-mm Large Bump – YFP
Reel of 3000
SN74AUP1T98YFPR
_ _ _TK_
QFN – DRY
Reel of 5000
SN74AUP1T98DRYR
TK
uQFN – DSF
Reel of 5000
SN74AUP1T98DSFR
TK
SOT (SOT-23) – DBV
Reel of 3000
SN74AUP1T98DBVR
HT6_
SOT (SC-70) – DCK
Reel of 3000
SN74AUP1T98DCKR
TK_
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
DBV/DCK: The actual top-side marking has one additional character that designates the wafer fab/assembly site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, ● = Pb-free).
FUNCTION SELECTION TABLE
LOGIC FUNCTION
5
2-input AND gate
6
2-input OR gate with one inverted input
7
2-input NAND gate with one inverted input
7
2-input AND gate with one inverted input
8
2-input NOR gate with one inverted input
8
2-input OR gate
9
Inverter
10
Noninverted buffer
11
Static-Power Consumption
(µA)
Dynamic-Power Consumption
(pF)
3
80%
2.5
60%
3.3-V
LVC
Logic†
40%
Voltage − V
100%
80%
3.3-V
40%
Logic†
20%
20%
AUP
0%
†
0%
AUP
Single, dual, and triple gates
Switching Characteristics
at 25 MHz†
3.5
100%
60%
2
1.5
1
Input
Output
0.5
0
−0.5
0
5
10
15
20 25 30
Time − ns
35
40
45
† AUP1G08 data at C = 15 pF
L
Figure 1. AUP – The Lowest-Power Family
2
FIGURE NO.
2-to-1 data selector
Figure 2. Excellent Signal Integrity
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Product Folder Link(s): SN74AUP1T98
SN74AUP1T98
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SCES614H – OCTOBER 2004 – REVISED MAY 2010
3.3 V
3.3 V
VIH = 1.19 V
VIL = 0.5 V
VIH = 1.19 V
VIL = 0.5 V
1.8-V
System
2.5-V
System
3.3-V
System
3.3-V
System
SN74AUP1T98
SN74AUP1T98
2.5 V
2.5 V
VIH = 1.10 V
VIL = 0.35 V
VIH = 1.10 V
VIL = 0.35 V
1.8-V
System
2.5-V
System
3.3-V
System
SN74AUP1T98
2.5-V
System
SN74AUP1T98
Figure 3. Possible Voltage-Translation Combinations
3.3 V
1.8-V
System
3.3-V
System
SN74AUP1T98
VOH min
VT+ max = VIH min = 1.19 V
VT− min = VIL max = 0.5 V
VOL max
Input Switching Waveform
Output Switching Waveform
Figure 4. Switching Thresholds for 1.8-V to 3.3-V Translation
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SN74AUP1T98
SCES614H – OCTOBER 2004 – REVISED MAY 2010
www.ti.com
FUNCTION TABLE
INPUTS
C
B
A
OUTPUT
Y
L
L
L
H
L
L
H
H
L
H
L
L
L
H
H
L
H
L
L
H
H
L
H
L
H
H
L
H
H
H
H
L
LOGIC DIAGRAM (POSITIVE LOGIC)
A
3
4
B
C
1
Y
6
LOGIC CONFIGURATIONS
VCC
C
B
B
Y
A
A
1
6
2
5
3
4
C
Y
GND
Figure 5. 157+04: 2-to-1 Data Selector With Inverted Output
When C is L, Y = B
When C is H, Y = A
VCC
C
Y
A
A
1
6
2
5
3
4
C
Y
GND
Figure 6. 00: 2-Input NAND Gate
4
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SN74AUP1T98
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SCES614H – OCTOBER 2004 – REVISED MAY 2010
VCC
C
Y
A
C
Y
A
A
1
6
2
5
3
4
C
Y
GND
Figure 7. 14+02/14+08: 2-Input NOR Gate With One Inverted Input
2-Input AND Gate With One Inverted Input
VCC
C
Y
B
B
C
Y
B
1
6
2
5
3
4
C
Y
GND
Figure 8. 14+00/14+32: 2-Input NAND Gate With One Inverted Input
2-Input OR Gate With One Inverted Input
VCC
C
Y
B
B
1
6
2
5
3
4
C
Y
GND
Figure 9. 32: 2-Input NOR Gate
VCC
C
Y
1
6
2
5
3
4
C
Y
GND
Figure 10. 17/34: Noninverted Buffer
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SN74AUP1T98
SCES614H – OCTOBER 2004 – REVISED MAY 2010
www.ti.com
VCC
B
B
Y
1
6
2
5
3
4
Y
GND
Figure 11. 04/14: Inverter
6
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SCES614H – OCTOBER 2004 – REVISED MAY 2010
ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
VCC
Supply voltage range
–0.5
4.6
V
VI
Input voltage range (2)
–0.5
4.6
V
VO
Voltage range applied to any output in the high-impedance or power-off state (2)
–0.5
4.6
V
–0.5
VCC + 0.5
(2)
UNIT
VO
Output voltage range in the high or low state
IIK
Input clamp current
VI < 0
–50
mA
IOK
Output clamp current
VO < 0
–50
mA
IO
Continuous output current
±20
mA
Continuous current through VCC or GND
±50
mA
qJA
Package thermal impedance (3)
DBV package
165
DCK package
259
DRY package
340
DSF package
300
YFP package
123
YZP package
Tstg
(1)
(2)
(3)
V
°C/W
123
Storage temperature range
–65
150
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
The package thermal impedance is calculated in accordance with JESD 51-7.
RECOMMENDED OPERATING CONDITIONS (1)
MIN MAX
UNIT
VCC
Supply voltage
2.3
3.6
V
VI
Input voltage
0
3.6
V
VO
Output voltage
0
VCC
V
IOH
High-level output current
IOL
Low-level output current
TA
Operating free-air temperature
(1)
VCC = 2.3 V
–3.1
VCC = 3 V
–4
VCC = 2.3 V
3.1
VCC = 3 V
4
–40
85
mA
mA
°C
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. See the TI application report Implications
of Slow or Floating CMOS Inputs, literature number SCBA004.
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SCES614H – OCTOBER 2004 – REVISED MAY 2010
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ELECTRICAL CHARACTERISTICS
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
TA = –40°C
to 85°C
TA = 25°C
VCC
MIN
TYP MAX
UNIT
MIN MAX
VT+
Positive-going
input threshold
voltage
2.3 V to 2.7 V
0.6
1.1
0.6
1.1
3 V to 3.6 V
0.75
1.16
0.75
1.19
VT–
Negative-going
input threshold
voltage
2.3 V to 2.7 V
0.35
0.6
0.35
0.6
3 V to 3.6 V
0.5
0.85
0.5
0.85
ΔVT
Hysteresis
(VT+ – VT–)
2.3 V to 2.7 V
0.23
0.6
0.1
0.6
3 V to 3.6 V
0.25
0.56
0.15
0.56
IOH = –20 mA
2.3 V to 3.6 V
IOH = –2.3 mA
VOH
IOH = –2.7 mA
IOL = 20 mA
IOL = 2.7 mA
VI = 3.6 V or GND
VI or VO = 0 V to 3.6 V
VI or VO = 3.6 V
ICC
ΔICC
2.67
2.6
2.55
V
V
V
0.1
0.1
0.31
0.33
0.44
0.45
0.31
0.33
0.44
0.45
0 V to 3.6 V
0.1
0.5
mA
3V
IOL = 4 mA
ΔIoff
1.85
2.72
2.3 V
IOL = 3.1 mA
Ioff
1.97
1.9
2.3 V to 3.6 V
IOL = 2.3 mA
All inputs
2.05
3V
IOH = –4 mA
II
VCC – 0.1
2.3 V
IOH = –3.1 mA
VOL
VCC – 0.1
V
V
0V
0.1
0.5
mA
0 V to 0.2 V
0.2
0.5
mA
VI = 3.6 V or GND, IO = 0
2.3 V to 3.6 V
0.5
0.9
mA
One input at 0.3 V or 1.1 V,
Other inputs at 0 or VCC, IO = 0
2.3 V to 2.7 V
4
One input at 0.45 V or 1.2 V,
Other inputs at 0 or VCC, IO = 0
3 V to 3.6 V
12
mA
Ci
VI = VCC or GND
3.3 V
1.5
pF
Co
VO = VCC or GND
3.3 V
3
pF
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCC = 2.5 V ± 0.2 V, VI = 1.8 V ± 0.15 V (unless otherwise noted)
(see Figure 12)
PARAMETER
tpd
8
FROM
(INPUT)
A, B, or C
TO
(OUTPUT)
Y
TA = –40°C
to 85°C
TA = 25°C
CL
MIN
TYP
MAX
MIN
MAX
5 pF
1.8
2.3
2.9
0.5
6.8
10 pF
2.3
2.8
3.4
1
7.9
15 pF
2.6
3.1
3.8
1
8.7
30 pF
3.8
4.4
5.1
1.5
10.8
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UNIT
ns
Copyright © 2004–2010, Texas Instruments Incorporated
Product Folder Link(s): SN74AUP1T98
SN74AUP1T98
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SCES614H – OCTOBER 2004 – REVISED MAY 2010
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCC = 2.5 V ± 0.2 V, VI = 2.5 V ± 0.2 V (unless otherwise noted)
(see Figure 12)
PARAMETER
tpd
FROM
(INPUT)
A, B, or C
TO
(OUTPUT)
Y
TA = –40°C
to 85°C
TA = 25°C
CL
MIN
TYP
MAX
MIN
UNIT
MAX
5 pF
1.8
2.3
3.1
0.5
6
10 pF
2.2
2.8
3.5
1
7.1
15 pF
2.6
3.2
5.2
1
7.9
30 pF
3.7
4.4
5.2
1.5
10
ns
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCC = 2.5 V ± 0.2 V, VI = 3.3 V ± 0.3 V (unless otherwise noted)
(see Figure 12)
PARAMETER
tpd
FROM
(INPUT)
A, B, or C
TO
(OUTPUT)
Y
TA = –40°C
to 85°C
TA = 25°C
CL
UNIT
MIN
TYP
MAX
MIN
MAX
5 pF
2
2.7
3.5
0.5
5.5
10 pF
2.4
3.1
3.9
1
6.5
15 pF
2.8
3.5
4.3
1
7.4
30 pF
4
4.7
5.5
1.5
9.5
ns
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCC = 3.3 V ± 0.3 V, VI = 1.8 V ± 0.15 V (unless otherwise noted)
(see Figure 12)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
A, B, or C
Y
UNIT
MIN
TYP
MAX
MIN
MAX
1.6
2
2.5
0.5
8
10 pF
2
2.4
2.9
1
8.5
15 pF
2.3
2.8
3.3
1
9.1
30 pF
3.4
3.9
4.4
1.5
9.8
5 pF
tpd
TA = –40°C
to 85°C
TA = 25°C
CL
ns
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCC = 3.3 V ± 0.3 V, VI = 2.5 V ± 0.2 V (unless otherwise noted)
(see Figure 12)
PARAMETER
tpd
FROM
(INPUT)
A, B, or C
TO
(OUTPUT)
Y
TA = –40°C
to 85°C
TA = 25°C
CL
MIN
TYP
MAX
MIN
MAX
5 pF
1.6
1.9
2.4
0.5
5.3
10 pF
2
2.3
2.7
1
6.1
15 pF
2.3
2.7
3.1
1
6.8
30 pF
3.4
3.8
4.2
1.5
8.5
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UNIT
ns
9
SN74AUP1T98
SCES614H – OCTOBER 2004 – REVISED MAY 2010
www.ti.com
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCC = 3.3 V ± 0.3 V, VI = 3.3 V ± 0.3 V (unless otherwise noted)
(see Figure 12)
PARAMETER
tpd
FROM
(INPUT)
A, B, or C
TO
(OUTPUT)
Y
TA = –40°C
to 85°C
TA = 25°C
CL
MIN
TYP
MAX
MIN
MAX
5 pF
1.6
2.1
2.7
0.5
4.7
10 pF
2
2.4
3
1
5.7
15 pF
2.3
2.7
3.3
1
6.2
30 pF
3.4
3.8
4.4
1.5
7.8
UNIT
ns
OPERATING CHARACTERISTICS
TA = 25°C
PARAMETER
Cpd
10
Power dissipation capacitance
TEST CONDITIONS
f = 10 MHz
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VCC = 2.5 V
VCC = 3.3 V
TYP
TYP
4
5
UNIT
pF
Copyright © 2004–2010, Texas Instruments Incorporated
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SCES614H – OCTOBER 2004 – REVISED MAY 2010
PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
CL
(see Note A)
VCC = 2.5 V
± 0.2 V
VCC = 3.3 V
± 0.3 V
5, 10, 15, 30 pF
VI/2
VCC/2
5, 10, 15, 30 pF
VI/2
VCC/2
1 MΩ
CL
VMI
VMO
LOAD CIRCUIT
VI
VMI
Input
VMI
0V
tPHL
tPLH
VOH
VMO
Output
VMo
VOL
tPHL
tPLH
VOH
VMo
Output
VMo
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
NOTES: A.
B.
C.
D.
CL includes probe and jig capacitance.
All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, slew rate ≥ 1 V/ns.
The outputs are measured one at a time, with one transition per measurement.
tPLH and tPHL are the same as tpd.
Figure 12. Load Circuit and Voltage Waveforms
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PACKAGE OPTION ADDENDUM
www.ti.com
28-May-2010
PACKAGING INFORMATION
Orderable Device
(1)
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
SN74AUP1T98DBVR
ACTIVE
SOT-23
DBV
6
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Request Free Samples
SN74AUP1T98DBVRE4
ACTIVE
SOT-23
DBV
6
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Request Free Samples
SN74AUP1T98DBVRG4
ACTIVE
SOT-23
DBV
6
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Request Free Samples
SN74AUP1T98DBVT
ACTIVE
SOT-23
DBV
6
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
SN74AUP1T98DBVTE4
ACTIVE
SOT-23
DBV
6
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
SN74AUP1T98DBVTG4
ACTIVE
SOT-23
DBV
6
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
SN74AUP1T98DCKR
ACTIVE
SC70
DCK
6
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Request Free Samples
SN74AUP1T98DCKRE4
ACTIVE
SC70
DCK
6
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Request Free Samples
SN74AUP1T98DCKRG4
ACTIVE
SC70
DCK
6
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Request Free Samples
SN74AUP1T98DCKT
ACTIVE
SC70
DCK
6
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
SN74AUP1T98DCKTE4
ACTIVE
SC70
DCK
6
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
SN74AUP1T98DCKTG4
ACTIVE
SC70
DCK
6
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
SN74AUP1T98DRYR
ACTIVE
SON
DRY
6
5000
Green (RoHS
& no Sb/Br)
NIPDAU
Level-1-260C-UNLIM
Request Free Samples
SN74AUP1T98DSFR
ACTIVE
SON
DSF
6
5000
Green (RoHS
& no Sb/Br)
NIPDAU
Level-1-260C-UNLIM
Request Free Samples
SN74AUP1T98YFPR
ACTIVE
DSBGA
YFP
6
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
Purchase Samples
SN74AUP1T98YZPR
ACTIVE
DSBGA
YZP
6
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
Request Free Samples
The marketing status values are defined as follows:
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
28-May-2010
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
13-Apr-2010
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
SN74AUP1T98DBVR
SOT-23
3000
180.0
9.2
DBV
6
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
3.23
3.17
1.37
4.0
8.0
Q3
SN74AUP1T98DBVT
SOT-23
DBV
6
250
180.0
9.2
3.23
3.17
1.37
4.0
8.0
Q3
SN74AUP1T98DCKR
SC70
DCK
6
3000
180.0
8.4
2.24
2.34
1.22
4.0
8.0
Q3
SN74AUP1T98DCKT
SC70
DCK
6
250
180.0
8.4
2.24
2.34
1.22
4.0
8.0
Q3
SN74AUP1T98YZPR
DSBGA
YZP
6
3000
180.0
8.4
1.02
1.52
0.63
4.0
8.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
13-Apr-2010
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74AUP1T98DBVR
SOT-23
DBV
6
3000
202.0
201.0
28.0
SN74AUP1T98DBVT
SOT-23
DBV
6
250
202.0
201.0
28.0
SN74AUP1T98DCKR
SC70
DCK
6
3000
202.0
201.0
28.0
SN74AUP1T98DCKT
SC70
DCK
6
250
202.0
201.0
28.0
SN74AUP1T98YZPR
DSBGA
YZP
6
3000
220.0
220.0
34.0
Pack Materials-Page 2
D: Max = 1418 µm, Min = 1358 µm
E: Max = 918 µm, Min = 858 µm
D: Max = 1418 µm, Min = 1358 µm
E: Max = 918 µm, Min = 858 µm
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