TI SN74BCT25642

Ω
SCBS047C − DECEMBER 1989 − REVISED NOVEMBER 1993
•
•
•
•
•
•
•
DW OR NT PACKAGE
(TOP VIEW)
State-of-the-Art BiCMOS Design
Significantly Reduces ICCZ
ESD Protection Exceeds 2000 V Per
MIL-STD-883C, Method 3015; Exceeds
200 V Using Machine Model (C = 200 pF,
R = 0)
Designed to Facilitate Incident-Wave
Switching for Line Impedances of 25 Ω
or Greater
Distributed VCC and GND Pins Minimize
Noise Generated by the Simultaneous
Switching of Outputs
The A Port Features Open-Collector
Outputs That Provide 188-mA IOL to Allow
for Heavy DC Loading on Open-Collector
Outputs
Eliminates Need for 3-State Overlap
Protection on A Ports
Package Options Include Plastic
Small-Outline (DW) Packages and Standard
Plastic 300-mil DIPs (NT)
A1
GND
A2
A3
GND
A4
A5
GND
A6
A7
GND
A8
1
24
2
23
3
22
4
21
5
20
6
19
7
18
8
17
9
16
10
15
11
14
12
13
DIR
B1
B2
VCC
B3
B4
B5
B6
VCC
B7
B8
OE
description
This 25-Ω octal bus transceiver is designed for asynchronous communication between data buses. The device
transmits data from the A bus to the B bus or from the B bus to the A bus depending upon the level at the
direction-control (DIR) input. The output-enable (OE) input can be used to disable the device so the buses are
effectively isolated.
The SN74BCT25642 is capable of sinking 188-mA IOL (A port), which facilitates switching 25-Ω transmission
lines on the incident wave. It is designed specifically to improve both the performance and density of 3-state
memory address drivers, clock drivers, and bus-oriented transceivers. The distributed VCC and GND pins
minimize the noise generated by the simultaneous switching of the outputs.
The SN74BCT25642 is characterized for operation from 0°C to 70°C.
FUNCTION TABLE
INPUTS
OPERATION
OE
DIR
L
L
B data to A bus
L
H
A data to B bus
H
X
Isolation
Copyright  1993, Texas Instruments Incorporated
! "#$ ! %#&'" ($)
(#"! " !%$""! %$ *$ $! $+! !#$!
!(( ,-) (#" %"$!!. ($! $"$!!'- "'#($
$!. '' %$$!)
• DALLAS, TEXAS 75265
• HOUSTON, TEXAS 77251−1443
POST OFFICE BOX 655303
POST OFFICE BOX 1443
2−1
Ω
SCBS047C − DECEMBER 1989 − REVISED NOVEMBER 1993
logic symbol†
OE
DIR
13
24
logic diagram (positive logic)
OE
G3
3 EN1 [BA]
3 EN2 [AB]
A1
A2
A3
A4
A5
A6
A7
A8
23
1
1
3
13
2
22
4
20
6
19
7
18
9
17
10
15
12
14
DIR
24
B1
A1
23
1
B1
B2
B3
B4
B5
B6
To Seven Other Channels
B7
B8
† This symbol is in accordance with ANSI/IEEE Std 91-1984
and IEC Publication 617-12.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)‡
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input voltage range, VI: Control inputs (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
I/O ports (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 5.5 V
Voltage range applied to any output in the disabled or power-off state, VO . . . . . . . . . . . . . . . . −0.5 V to 5.5 V
Voltage range applied to any output in the high state, VO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −30 mA
Current into any output in the low state, IO: A ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 376 mA
B ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 mA
Operating free-air temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
‡ Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2−2
•
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443
•
Ω
SCBS047C − DECEMBER 1989 − REVISED NOVEMBER 1993
recommended operating conditions (see Note 2)
VCC
VIH
Supply voltage
VIL
VOH
Low-level input voltage
IIK
IOH
Input clamp current
IOL
High-level input voltage
MIN
NOM
MAX
4.5
5
5.5
2
A port
High-level output current
Low-level output current
V
V
0.8
High-level output voltage
UNIT
V
5.5
V
−18
mA
B port
−3
mA
A port
188
B port
24
TA
Operating free-air temperature
NOTE 2: Unused or floating pins (input or I/O) must be held high or low.
0
70
mA
°C
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
VIK
VOH
VOL
IOH
Any B
TEST CONDITIONS
VCC = 4.5 V,
VCC = 4.75 V,
II = − 18 mA
IOH = − 1 mA
VCC = 4.5 V,
IOH = − 3 mA
IOL = 94 mA
Any A
VCC = 4.5 V
Any B
VCC = 4.5 V,
VCC = 4.5 V,
Any A
MIN
TYP†
2.4
IIH‡
IIL‡
IOS§
VCC = 5.5 V,
VI = 2.7 V
DIR and OE
VCC = 5.5 V,
VI = 0.5 V
Any B
VCC = 5.5 V,
VO = 0
0.1
70
20
A and B
ICCZ
Ci
Cio
B to A
A to B
Control inputs
A port
B port
mA
mA
µA
A
−0.6
−0.6
−60
VCC = 5.5 V
A to B
ICCH
V
0.5
0.1
A and B
B to A
0.55
0.25
A to B
ICCL
V
0.7
0.35
VOH = 5.5 V
VI = 5.5 V
DIR and OE
V
3.3
0.42
IOL = 188 mA
IOL = 24 mA
VCC = 5.5 V,
DIR and OE
UNIT
−1.2
2.7
A and B
II
MAX
VCC = 5.5 V
VCC = 5.5 V
VCC = 5 V,
VO = 2.5 V or 0.5 V
VCC = 5 V,
VI = 2.5 V or 0.5 V
−150
40
64
78
125
25
40
34
55
7.6
13
8
15
8
mA
mA
mA
mA
mA
pF
pF
† All typical values are at VCC = 5 V, TA = 25°C.
‡ For I/O ports, the parameters IIH and IIL include the off-state output current.
§ Not more than one output should be shorted at a time, and the duration of the short-circuit should not exceed 10 ms.
•
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443
•
2−3
Ω
SCBS047C − DECEMBER 1989 − REVISED NOVEMBER 1993
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature, CL = 50 pF (unless otherwise noted) (see Note 3)
FROM
(INPUT)
TO
(OUTPUT)
tPLH
tPHL
A
B
tPLH
tPHL
B
A
tPLH
tPHL
OE
A
tPZH
tPZL
OE
B
tPHZ
tPLZ
OE
B
PARAMETER
MIN
TYP
MAX
MIN
MAX
0.8
3.2
6
0.8
6.2
0.5
2
3.9
0.5
4
1.5
3.2
5.7
1.5
6.3
1.7
4.5
4.8
1.7
5.9
2.8
5.5
10.4
2.8
11.6
4.6
8.6
11.3
4.6
11.3
3.3
5.7
8.1
3.3
9.1
3.8
6.6
8.8
3.8
9.8
1.8
4.6
7
1.8
7.3
1.4
4.3
6.7
1.4
7.3
† For A port, R1 = 100 Ω.
NOTE 3: Load circuits and voltage waveforms are shown in Section 1.
2−4
•
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443
•
R1 = 500 Ω†,
R2 = 500 Ω
VCC = 5 V,
TA = 25°C
UNIT
ns
ns
ns
ns
ns
PACKAGE OPTION ADDENDUM
www.ti.com
10-May-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74BCT25642DW
ACTIVE
SOIC
DW
24
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74BCT25642DWE4
ACTIVE
SOIC
DW
24
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74BCT25642DWG4
ACTIVE
SOIC
DW
24
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74BCT25642DWR
ACTIVE
SOIC
DW
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74BCT25642DWRE4
ACTIVE
SOIC
DW
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74BCT25642DWRG4
ACTIVE
SOIC
DW
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74BCT25642NT
ACTIVE
PDIP
NT
24
15
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74BCT25642NTE4
ACTIVE
PDIP
NT
24
15
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
SN74BCT25642DWR
Package Package Pins
Type Drawing
SOIC
DW
24
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
2000
330.0
24.4
Pack Materials-Page 1
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
10.75
15.7
2.7
12.0
24.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74BCT25642DWR
SOIC
DW
24
2000
346.0
346.0
41.0
Pack Materials-Page 2
MECHANICAL DATA
MPDI004 – OCTOBER 1994
NT (R-PDIP-T**)
PLASTIC DUAL-IN-LINE PACKAGE
24 PINS SHOWN
PINS **
A
24
28
A MAX
1.260
(32,04)
1.425
(36,20)
A MIN
1.230
(31,24)
1.385
(35,18)
B MAX
0.310
(7,87)
0.315
(8,00)
B MIN
0.290
(7,37)
0.295
(7,49)
DIM
24
13
0.280 (7,11)
0.250 (6,35)
1
12
0.070 (1,78) MAX
B
0.020 (0,51) MIN
0.200 (5,08) MAX
Seating Plane
0.125 (3,18) MIN
0.100 (2,54)
0.021 (0,53)
0.015 (0,38)
0°– 15°
0.010 (0,25) M
0.010 (0,25) NOM
4040050 / B 04/95
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Clocks and Timers
Interface
Logic
Power Mgmt
Microcontrollers
RFID
RF/IF and ZigBee® Solutions
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lprf
Applications
Audio
Automotive
Broadband
Digital Control
Medical
Military
Optical Networking
Security
Telephony
Video & Imaging
Wireless
www.ti.com/audio
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
www.ti.com/military
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2008, Texas Instruments Incorporated