SN54F541, SN74F541 OCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTS SDFS021A – D3126, JANUARY 1989 – REVISED OCTOBER 1993 • • • SN54F541 . . . J PACKAGE SN74F541 . . . DW OR N PACKAGE (TOP VIEW) 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers Data Flow-Through Pinout (All Inputs on Opposite Side From Outputs) Package Options Include Plastic Small-Outline Packages, Ceramic Chip Carriers, and Plastic and Ceramic DIPs OE1 A1 A2 A3 A4 A5 A6 A7 A8 GND description The ′F541 octal buffer/line driver is ideal for driving bus lines or buffering memory address registers. The device features inputs and outputs on opposite sides of the package to facilitate printed-circuit-board layout. The 3-state control gate is a 2-input AND gate with active-low inputs so that if either output enable (OE1 or OE2) input is high, all eight outputs are in the high-impedance state. 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 VCC OE2 Y1 Y2 Y3 Y4 Y5 Y6 Y7 Y8 A2 A1 OE1 VCC OE2 SN54F541 . . . FK PACKAGE (TOP VIEW) The SN54F541 is characterized for operation over the full military temperature range of – 55°C to 125°C. The SN74F251 is characterized for operation from 0°C to 70°C. 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 Y1 Y2 Y3 Y4 Y5 A8 GND Y8 Y7 Y6 A3 A4 A5 A6 A7 FUNCTION TABLE INPUTS A OUTPUT Y OE1 OE2 L L L L L L H H H X X Z X H X Z Copyright 1993, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 2–1 SN54F541, SN74F541 OCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTS SDFS021A – D3126, JANUARY 1989 – REVISED OCTOBER 1993 logic symbol† 1 logic diagram (positive logic) OE1 OE2 A1 A2 A3 A4 A5 A6 A7 A8 EN 19 2 1 OE1 & 19 OE2 18 1 3 17 4 16 5 15 6 14 7 13 8 12 9 11 2 A1 Y1 18 Y1 Y2 Y3 Y4 To Seven Other Channels Y5 Y6 Y7 Y8 † This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12. absolute maximum ratings over operating free-air temperature range (unless otherwise noted)‡ Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.5 V to 7 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 1.2 V to 7 V Input current range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 30 mA to 5 mA Voltage range applied to any output in the disabled or power-off state . . . . . . . . . . . . . . . . . . . – 0.5 V to 5.5 V Voltage range applied to any output in the high state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.5 V to VCC Current into any output in the low state: SN54F541 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 mA SN74F541 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA Operating free-air temperature range: SN54F541 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 55°C to 125°C SN74F541 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 65°C to 150°C ‡ Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 1: The input voltage ratings may be exceeded provided the input current ratings are observed. recommended operating conditions SN54F541 VCC VIH Supply voltage VIL IIK Low-level input voltage High-level input voltage SN74F541 MIN NOM MAX MIN NOM MAX 4.5 5 5.5 4.5 5 5.5 2 2 UNIT V V 0.8 0.8 V Input clamp current – 18 – 18 mA IOH IOL High-level output current – 12 – 15 mA Low-level output current 48 64 mA TA Operating free-air temperature 70 °C 2–2 – 55 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 125 0 SN54F541, SN74F541 OCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTS SDFS021A – D3126, JANUARY 1989 – REVISED OCTOBER 1993 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VIK VOH VCC = 4.5 V, VCC = 4.5 V VCC = 4.75 V, VOL VCC = 4 4.5 5V IOZH IOZL VCC = 5.5 V, VCC = 5.5 V, II IIH VCC = 5.5 V, VCC = 5.5 V, IIL IOS‡ VCC = 5.5 V, VCC = 5.5 V, ICC SN54F541 TYP† MAX TEST CONDITIONS VCC = 5.5 V MIN II = – 18 mA IOH = – 3 mA SN74F541 TYP† MAX MIN – 1.2 IOH = – 12 mA IOH = – 15 mA 2.4 3.3 2 3.2 IOH = – 3 mA IOL = 48 mA – 1.2 2.4 3.3 2 3.1 UNIT V V 2.7 0.38 IOL = 64 mA VO = 2.7 V 0.55 0.42 VO = 0.5 V VI = 7 V VI = 2.7 V VI = 0.5 V – 100 V 50 50 µA – 50 – 50 µA 0.1 0.1 mA 20 20 µA – 0.6 mA – 225 mA – 0.6 VO = 0 Outputs high 0.55 – 225 – 100 28 35 28 35 Outputs low 62 75 62 75 Outputs disabled 40 55 40 55 mA † All typical values are at VCC = 5 V, TA = 25°C. ‡ Not more than one output should be shorted at a time, and the duration of the short circuit should not exceed one second. switching characteristics (see Note 2) PARAMETER FROM (INPUT) TO (OUTPUT) VCC = 5 V, CL = 50 pF, RL = 500 Ω, TA = 25°C VCC = 4.5 V to 5.5 V, CL = 50 pF, RL = 500 Ω, TA = MIN to MAX§ ′F541 tPLH tPHL Any A Y tPZH tPZL OE Y tPHZ tPLZ OE Y UNIT SN54F541 SN74F541 MIN TYP MAX MIN MAX MIN MAX 1.5 3.3 5.5 1 6.5 1.5 6 1.5 2.7 5.5 1 6.5 1.5 6 3 5.8 8 1.7 10 2.5 9.5 3.5 6.1 8.5 2.2 10 3 9.5 1.5 3.4 6 1 7 1.5 6.5 1.5 2.9 5.5 1 7.5 1.5 6 ns ns ns § For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions. NOTE 2: Load circuits and waveforms are shown in Section 1. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 2–3 SN54F541, SN74F541 OCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTS SDFS021A – D3126, JANUARY 1989 – REVISED OCTOBER 1993 2–4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 23-Apr-2008 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 5962-9175301M2A ACTIVE LCCC FK 20 1 TBD 5962-9175301MRA ACTIVE CDIP J 20 1 TBD 5962-9175301MSA ACTIVE CFP W 20 1 SN74F541DW ACTIVE SOIC DW 20 25 SN74F541DWE4 ACTIVE SOIC DW 20 25 SN74F541DWG4 ACTIVE SOIC DW 20 25 SN74F541DWR ACTIVE SOIC DW SN74F541DWRE4 ACTIVE SOIC SN74F541DWRG4 ACTIVE SN74F541N Lead/Ball Finish MSL Peak Temp (3) POST-PLATE N / A for Pkg Type A42 SNPB N / A for Pkg Type TBD Call TI N / A for Pkg Type Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74F541NE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74F541NSR ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F541NSRE4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F541NSRG4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SNJ54F541FK ACTIVE LCCC FK 20 1 TBD SNJ54F541J ACTIVE CDIP J 20 1 TBD A42 SNPB N / A for Pkg Type SNJ54F541W ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type POST-PLATE N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 23-Apr-2008 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device SN74F541DWR Package Package Pins Type Drawing SOIC DW 20 SPQ Reel Reel Diameter Width (mm) W1 (mm) 2000 330.0 24.4 Pack Materials-Page 1 A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 10.8 13.0 2.7 12.0 24.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74F541DWR SOIC DW 20 2000 346.0 346.0 41.0 Pack Materials-Page 2 MECHANICAL DATA MLCC006B – OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. 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