SN74LVC245A www.ti.com SCAS218U – JANUARY 1993 – REVISED FEBRUARY 2010 OCTAL BUS TRANSCEIVER WITH 3-STATE OUTPUTS Check for Samples: SN74LVC245A FEATURES 1 • • DESCRIPTION/ORDERING INFORMATION This octal bus transceiver is designed for 1.65-V to 3.6-V VCC operation. The SN74LVC245A is designed for asynchronous communication between data buses. The device transmits data from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the direction-control (DIR) input. The output-enable (OE) input can be used to disable the device so the buses effectively are isolated. 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 VCC OE B1 B2 B3 B4 B5 B6 B7 B8 RGY PACKAGE (TOP VIEW) A1 A2 A3 A4 A5 A6 A7 A8 VCC • DIR A1 A2 A3 A4 A5 A6 A7 A8 GND 1 20 3 4 19 OE 18 B1 17 B2 5 6 16 B3 15 B4 7 8 14 B5 13 B6 2 12 B7 9 10 11 B8 • DB, DGV, DW, N, NS, OR PW PACKAGE (TOP VIEW) DIR • Operates From 1.65 V to 3.6 V Inputs Accept Voltages to 5.5 V Max tpd of 6.3 ns at 3.3 V Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25°C Typical VOHV (Output VOH Undershoot) >2 V at VCC = 3.3 V, TA = 25°C Ioff Supports Partial-Power-Down Mode Operation Supports Mixed-Mode Signal Operation on All Ports (5-V Input/Output Voltage With 3.3-V VCC) Latch-Up Performance Exceeds 250 mA Per JESD 17 ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 1000-V Charged-Device Model (C101) GND • • • • To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of this device as a translator in a mixed 3.3-V/5-V system environment. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1993–2010, Texas Instruments Incorporated SN74LVC245A SCAS218U – JANUARY 1993 – REVISED FEBRUARY 2010 www.ti.com ORDERING INFORMATION TA PACKAGE (1) SN74LVC245AN SN74LVC245AN QFN – RGY Reel of 3000 SN74LVC245ARGYR LC245A Tube of 25 SN74LVC245ADW Reel of 2000 SN74LVC245ADWR SOP – NS Reel of 2000 SN74LVC245ANSR LVC245A SSOP – DB Reel of 2000 SN74LVC245ADBR LC245A Tube of 70 SN74LVC245APW Reel of 2000 SN74LVC245APWR Reel of 250 SN74LVC245APWT Reel of 2000 SN74LVC245ADGVR TSSOP – PW TVSOP – DGV VFBGA – GQN LVC245A LC245A LC245A SN74LVC245AGQNR Reel of 1000 VFBGA – ZQN (Pb-Free) (1) TOP-SIDE MARKING Tube of 20 SOIC – DW –40°C to 85°C ORDERABLE PART NUMBER PDIP – N LC245A SN74LVC245AZQNR Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. GQN OR ZQN PACKAGE (TOP VIEW) 1 2 3 4 A B C D E TERMINAL ASSIGNMENTS 1 2 3 4 A A1 DIR VCC OE B A3 B2 A2 B1 C A5 A4 B4 B3 D A7 B6 A6 B5 E GND A8 B8 B7 FUNCTION TABLE INPUTS 2 OPERATION OE DIR L L B data to A bus L H A data to B bus H X Isolation Submit Documentation Feedback Copyright © 1993–2010, Texas Instruments Incorporated Product Folder Link(s): SN74LVC245A SN74LVC245A www.ti.com SCAS218U – JANUARY 1993 – REVISED FEBRUARY 2010 LOGIC DIAGRAM (POSITIVE LOGIC) DIR 1 19 A1 OE 2 18 B1 To Seven Other Channels Pin numbers shown are for the DB, DGV, DW, N, NS, PW, and RGY packages. ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) VCC MIN MAX Supply voltage range –0.5 6.5 UNIT V (2) VI Input voltage range –0.5 6.5 V VO Voltage range applied to any output in the high-impedance or power-off state (2) –0.5 6.5 V VO Voltage range applied to any output in the high or low state (2) –0.5 VCC + 0.5 V IIK Input clamp current VI < 0 –50 mA IOK Output clamp current VO < 0 –50 mA IO Continuous output current ±50 mA ±100 mA (3) Continuous current through VCC or GND DB package (4) DGV package Package thermal impedance (4) 92 (4) DW package qJA 70 GQN/ZQN package 58 (4) 78 N package (4) 69 NS package (4) 60 PW package (4) 83 RGY package (5) Tstg (1) (2) (3) (4) (5) Storage temperature range °C/W 37 –65 150 °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed. The value of VCC is provided in the recommended operating conditions table. The package thermal impedance is calculated in accordance with JESD 51-7. The package thermal impedance is calculated in accordance with JESD 51-5. Submit Documentation Feedback Copyright © 1993–2010, Texas Instruments Incorporated Product Folder Link(s): SN74LVC245A 3 SN74LVC245A SCAS218U – JANUARY 1993 – REVISED FEBRUARY 2010 www.ti.com RECOMMENDED OPERATING CONDITIONS (1) TA = 25°C VCC Supply voltage VIH High-level input voltage Operating Data retention only VCC = 1.65 V to 1.95 V –40°C TO 85°C MIN MAX MIN MAX 1.65 3.6 1.65 3.6 1.5 1.5 0.65 × VCC 0.65 × VCC VCC = 2.3 V to 2.7 V 1.7 1.7 VCC = 2.7 V to 3.6 V 2 VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V UNIT V V 2 0.35 × VCC 0.35 × VCC 0.7 0.7 VIL Low-level input voltage VI Input voltage 0 5.5 0 5.5 V VO Output voltage 0 VCC 0 VCC V VCC = 2.7 V to 3.6 V 0.8 VCC = 1.65 V IOH High-level output current IOL Low-level output current Δt/Δv Input transition rise or fall rate (1) 4 –4 V 0.8 –4 VCC = 2.3 V –8 –8 VCC = 2.7 V –12 –12 VCC = 3 V –24 –24 VCC = 1.65 V 4 4 VCC = 2.3 V 8 8 VCC = 2.7 V 12 12 VCC = 3 V 24 24 10 10 mA mA ns/V All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. Submit Documentation Feedback Copyright © 1993–2010, Texas Instruments Incorporated Product Folder Link(s): SN74LVC245A SN74LVC245A www.ti.com SCAS218U – JANUARY 1993 – REVISED FEBRUARY 2010 ELECTRICAL CHARACTERISTICS over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS IOH = –100 mA VOH 1.65 V to 3.6 V Control inputs Ioff IOZ (1) VCC – 0.2 1.29 1.2 IOH = –8 mA 2.3 V 1.9 1.7 2.7 V 2.2 2.2 3V 2.4 2.4 IOH = –24 mA 3V 2.3 IOL = 100 mA 1.65 V to 3.6 V 0.1 0.2 IOL = 4 mA 1.65 V 0.24 0.45 IOL = 8 mA 2.3 V 0.3 0.7 IOL = 12 mA 2.7 V 0.4 0.4 3V UNIT V 2.2 V 0.55 0.55 3.6 V ±1 ±5 mA VI or VO = 5.5 V 0 ±1 ±10 mA VO = 0 to 5.5 V 3.6 V ±1 ±10 mA 1 10 1 10 500 500 VI = 0 to 5.5 V IO = 0 3.6 V ≤ VI ≤ 5.5 V (2) One input at VCC – 0.6 V, Other inputs at VCC or GND ΔICC MIN MAX VCC – 0.2 VI = VCC or GND ICC –40°C TO 85°C TYP MAX 1.65 V IOL = 24 mA II MIN IOH = –4 mA IOH = –12 mA VOL TA = 25°C VCC 3.6 V 2.7 V to 3.6 V mA mA Ci Control inputs VI = VCC or GND 3.3 V 4 pF Cio A or B ports VI = VCC or GND 3.3 V 5.5 pF (1) (2) For I/O ports, the parameter IOZ includes the input leakage current. This applies in the disabled state only. SWITCHING CHARACTERISTICS over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) PARAMETER tpd ten tdis FROM (INPUT) A or B OE OE TO (OUTPUT) B or A A or B A or B VCC –40°C TO 85°C TYP MAX MIN MAX 1.8 V ± 0.15 V 1 6 12.2 1 12.7 2.5 V ± 0.2 V 1 3.9 7.8 1 8.3 2.7 V 1 4.2 7.1 1 7.3 3.3 V ± 0.3 V 1.5 3.8 6.1 1.5 6.3 1.8 V ± 0.15 V 1 7 14.8 1 15.3 2.5 V ± 0.2 V 1 4.5 10 1 10.5 2.7 V 1 5.4 9.3 1 9.5 8.5 3.3 V ± 0.3 V 1.5 4.4 8.3 1.5 1.8 V ± 0.15 V 1 7.8 16.5 1 17 2.5 V ± 0.2 V 1 4 9 1 9.5 2.7 V 1 4.4 8.3 1 8.5 1.7 4.1 7.3 1.7 7.5 3.3 V ± 0.3 V tsk(o) TA = 25°C MIN 3.3 V ± 0.3 V 1 Submit Documentation Feedback Copyright © 1993–2010, Texas Instruments Incorporated Product Folder Link(s): SN74LVC245A UNIT ns ns ns ns 5 SN74LVC245A SCAS218U – JANUARY 1993 – REVISED FEBRUARY 2010 www.ti.com OPERATING CHARACTERISTICS TA = 25°C TEST CONDITIONS PARAMETER Outputs enabled Cpd Power dissipation capacitance per transceiver f = 10 MHz Outputs disabled 6 Submit Documentation Feedback VCC TYP 1.8 V 42 2.5 V 43 3.3 V 45 1.8 V 1 2.5 V 1 3.3 V 2 UNIT pF Copyright © 1993–2010, Texas Instruments Incorporated Product Folder Link(s): SN74LVC245A SN74LVC245A www.ti.com SCAS218U – JANUARY 1993 – REVISED FEBRUARY 2010 PARAMETER MEASUREMENT INFORMATION VLOAD S1 RL From Output Under Test CL (see Note A) Open GND RL TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open VLOAD GND LOAD CIRCUIT INPUTS VCC 1.8 V ± 0.15 V 2.5 V ± 0.2 V 2.7 V 3.3 V ± 0.3 V VI tr/tf VCC VCC 2.7 V 2.7 V ≤2 ns ≤2 ns ≤2.5 ns ≤2.5 ns VM VLOAD CL RL V∆ VCC/2 VCC/2 1.5 V 1.5 V 2 × VCC 2 × VCC 6V 6V 30 pF 30 pF 50 pF 50 pF 1 kΩ 500 Ω 500 Ω 500 Ω 0.15 V 0.15 V 0.3 V 0.3 V VI Timing Input VM 0V tw tsu VI Input VM VM th VI Data Input VM VM 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VI VM Input VM 0V VOH VM Output VM VOL VM 0V VLOAD/2 VM tPZH VOH Output VM tPLZ Output Waveform 1 S1 at VLOAD (see Note B) tPLH tPHL VM tPZL tPHL tPLH VI Output Control VM VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS VOL + V∆ VOL tPHZ Output Waveform 2 S1 at GND (see Note B) VM VOH - V∆ VOH ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. H. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms Submit Documentation Feedback Copyright © 1993–2010, Texas Instruments Incorporated Product Folder Link(s): SN74LVC245A 7 PACKAGE OPTION ADDENDUM www.ti.com 14-May-2010 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing SN74LVC245ADBLE OBSOLETE SSOP DB 20 SN74LVC245ADBR ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC245ADBRE4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC245ADBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC245ADGVR ACTIVE TVSOP DGV 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC245ADGVRE4 ACTIVE TVSOP DGV 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC245ADGVRG4 ACTIVE TVSOP DGV 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC245ADW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC245ADWE4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC245ADWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC245ADWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC245ADWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC245ADWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC245AGQNR NRND GQN 20 1000 TBD SNPB Level-1-240C-UNLIM SN74LVC245AN ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LVC245ANE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74LVC245ANSR ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC245ANSRE4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC245ANSRG4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC245APW ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC245APWE4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC245APWG4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC245APWLE OBSOLETE TSSOP PW 20 TBD Call TI SN74LVC245APWR ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC245APWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM BGA MI CROSTA R JUNI OR Pins Package Eco Plan (2) Qty TBD Addendum-Page 1 Lead/Ball Finish Call TI MSL Peak Temp (3) Call TI Call TI PACKAGE OPTION ADDENDUM www.ti.com 14-May-2010 Orderable Device Status (1) Package Type Package Drawing SN74LVC245APWRG3 PREVIEW TSSOP PW 20 2000 SN74LVC245APWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC245APWT ACTIVE TSSOP PW 20 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC245APWTE4 ACTIVE TSSOP PW 20 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC245APWTG4 ACTIVE TSSOP PW 20 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC245ARGYR ACTIVE VQFN RGY 20 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR SN74LVC245ARGYRG4 ACTIVE VQFN RGY 20 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR SN74LVC245AZQNR ACTIVE ZQN 20 1000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM BGA MI CROSTA R JUNI OR Pins Package Eco Plan (2) Qty TBD Lead/Ball Finish Call TI MSL Peak Temp (3) Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN74LVC245A : • Enhanced Product: SN74LVC245A-EP NOTE: Qualified Version Definitions: • Enhanced Product - Supports Defense, Aerospace and Medical Applications Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 30-Jul-2010 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 8.2 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 7.5 2.5 12.0 16.0 Q1 SN74LVC245ADBR SSOP DB 20 2000 330.0 16.4 SN74LVC245ADGVR TVSOP DGV 20 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 SN74LVC245ADWR SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1 SN74LVC245AGQNR BGA MI CROSTA R JUNI OR GQN 20 1000 330.0 12.4 3.3 4.3 1.6 8.0 12.0 Q1 SN74LVC245AGQNR BGA MI CROSTA R JUNI OR GQN 20 1000 330.0 12.4 3.3 4.3 1.5 8.0 12.0 Q1 SN74LVC245ANSR SO NS 20 2000 330.0 24.4 8.2 13.0 2.5 12.0 24.0 Q1 SN74LVC245APWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1 SN74LVC245ARGYR VQFN RGY 20 3000 330.0 12.4 3.8 4.8 1.6 8.0 12.0 Q1 SN74LVC245AZQNR BGA MI CROSTA R JUNI OR ZQN 20 1000 330.0 12.4 3.3 4.3 1.6 8.0 12.0 Q1 SN74LVC245AZQNR BGA MI CROSTA R JUNI ZQN 20 1000 330.0 12.4 3.3 4.3 1.5 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 30-Jul-2010 Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant OR *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74LVC245ADBR SSOP DB 20 2000 346.0 346.0 33.0 SN74LVC245ADGVR TVSOP DGV 20 2000 346.0 346.0 29.0 SN74LVC245ADWR SOIC DW 20 2000 346.0 346.0 41.0 SN74LVC245AGQNR BGA MICROSTAR JUNIOR GQN 20 1000 340.5 338.1 20.6 SN74LVC245AGQNR BGA MICROSTAR JUNIOR GQN 20 1000 346.0 346.0 29.0 SN74LVC245ANSR SO NS 20 2000 346.0 346.0 41.0 SN74LVC245APWR TSSOP PW 20 2000 346.0 346.0 33.0 SN74LVC245ARGYR VQFN RGY 20 3000 346.0 346.0 29.0 SN74LVC245AZQNR BGA MICROSTAR JUNIOR ZQN 20 1000 340.5 338.1 20.6 SN74LVC245AZQNR BGA MICROSTAR JUNIOR ZQN 20 1000 346.0 346.0 29.0 Pack Materials-Page 2 MECHANICAL DATA MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE 24 PINS SHOWN 0,40 0,23 0,13 24 13 0,07 M 0,16 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 0°–8° 1 0,75 0,50 12 A Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,08 14 16 20 24 38 48 56 A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40 A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11,20 DIM 4073251/E 08/00 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. Falls within JEDEC: 24/48 Pins – MO-153 14/16/20/56 Pins – MO-194 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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