TI SNJ54ABT126FK

SN54ABT126, SN74ABT126
QUADRUPLE BUS BUFFER GATES
WITH 3-STATE OUTPUTS
SCBS183H – FEBRUARY 1991 – REVISED MAY 2003
D
High-Drive Outputs (–32-mA IOH, 64-mA IOL)
SN54ABT126 . . . J PACKAGE
SN74ABT126 . . . D, DB, N, NS,
OR PW PACKAGE
(TOP VIEW)
14
2
13
3
12
4
11
5
10
6
9
7
8
VCC
4OE
4A
4Y
3OE
3A
3Y
1A
1Y
2OE
2A
2Y
14
1A
1OE
NC
VCC
4OE
1
2
13 4OE
3
12 4A
4
11 4Y
5
10 3OE
9 3A
6
7
8
SN54ABT126 . . . FK PACKAGE
(TOP VIEW)
1Y
NC
2OE
NC
2A
4
3 2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
4A
NC
4Y
NC
3OE
2Y
GND
NC
3Y
3A
1
VCC
1OE
1A
1Y
2OE
2A
2Y
GND
Ioff and Power-Up 3-State Support Hot
Insertion
Latch-Up Performance Exceeds 500 mA Per
JESD 17
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
SN74ABT126 . . . RGY PACKAGE
(TOP VIEW)
3Y
D
D
1OE
D
D
Typical VOLP (Output Ground Bounce)
<1 V at VCC = 5 V, TA = 25°C
High-Impedance State During Power Up
and Power Down
GND
D
NC – No internal connection
description/ordering information
The ’ABT126 bus buffer gates feature independent line drivers with 3-state outputs. Each output is disabled
when the associated output-enable (OE) input is low.
When VCC is between 0 and 2.1 V, the device is in the high-impedance state during power up or power down.
However, to ensure the high-impedance state above 2.1 V, OE should be tied to GND through a pulldown
resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.
ORDERING INFORMATION
Tape and reel
SN74ABT126RGYR
AB126
PDIP – N
Tube
SN74ABT126N
SN74ABT126N
Tube
SN74ABT126D
Tape and reel
SN74ABT126DR
SOP – NS
Tape and reel
SN74ABT126NSR
ABT126
SSOP – DB
Tape and reel
SN74ABT126DBR
AB126
Tube
SN74ABT126PW
Tape and reel
SN74ABT126PWR
Tube
SNJ54ABT126J
TSSOP – PW
–55°C
55°C to 125°C
TOP-SIDE
MARKING
QFN – RGY
SOIC – D
–40°C
40°C to 85°C
ORDERABLE
PART NUMBER
PACKAGE†
TA
CDIP – J
ABT126
AB126
SNJ54ABT126J
LCCC – FK
Tube
SNJ54ABT126FK
SNJ54ABT126FK
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2003, Texas Instruments Incorporated
UNLESS OTHERWISE NOTED this document contains PRODUCTION
DATA information current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty.
Production processing does not necessarily include testing of all
parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SN54ABT126, SN74ABT126
QUADRUPLE BUS BUFFER GATES
WITH 3-STATE OUTPUTS
SCBS183H – FEBRUARY 1991 – REVISED MAY 2003
FUNCTION TABLE
(each buffer)
INPUTS
OE
A
OUTPUT
Y
H
H
H
H
L
L
L
X
Z
logic diagram (positive logic)
1OE
1A
2OE
2A
1
2
3OE
3
1Y
3A
4
5
4OE
6
2Y
4A
10
9
8
3Y
13
12
11
4Y
Pin numbers shown are for the D, DB, J, N, NS, PW, and RGY packages.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
Voltage range applied to any output in the high or power-off state, VO . . . . . . . . . . . . . . . . . . . –0.5 V to 5.5 V
Current into any output in the low state, IO: SN54ABT126 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 mA
SN74ABT126 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –18 mA
Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –50 mA
Package thermal impedance, θJA (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W
(see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96°C/W
(see Note 2): N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80°C/W
(see Note 2): NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76°C/W
(see Note 2): PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113°C/W
(see Note 3): RGY package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
3. The package thermal impedance is calculated in accordance with JESD 51-5.
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SN54ABT126, SN74ABT126
QUADRUPLE BUS BUFFER GATES
WITH 3-STATE OUTPUTS
SCBS183H – FEBRUARY 1991 – REVISED MAY 2003
recommended operating conditions (see Note 4)
SN54ABT126
SN74ABT126
MIN
MAX
MIN
MAX
4.5
5.5
4.5
5.5
UNIT
VCC
VIH
Supply voltage
VIL
VI
Low-level input voltage
IOH
IOL
High-level output current
VCC
–24
Low-level output current
48
64
mA
∆t/∆v
Input transition rise or fall rate
10
10
ns/V
∆t/∆VCC
TA
Power-up ramp rate
200
Operating free-air temperature
–55
High-level input voltage
2
2
0.8
Input voltage
0
V
0.8
0
VCC
–32
–40
V
V
mA
µs/V
200
125
V
85
°C
NOTE 4: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
VIK
VOH
TEST CONDITIONS
VCC = 4.5 V,
VCC = 4.5 V,
II = –18 mA
IOH = –3 mA
VCC = 5 V,
VCC = 4
4.5
5V
VOL
Vhys
II
VCC = 4
4.5
5V
MIN
–1.2
MAX
SN74ABT126
MIN
–1.2
MAX
–1.2
2.5
IOH = –3 mA
IOH = –24 mA
3
3
3
2
2
IOH = –32 mA
IOL = 48 mA
2*
Ioff
ICEX
IO§
VCC = 0,
VCC = 5.5 V, VO = 5.5 V
VI or VO ≤ 4.5 V
Outputs high
VCC = 5.5 V,
VO = 2.5 V
Outputs high
0.55
0.55*
0.55
VCC = 5.5
5 5 V,
V IO = 0,
0
VI = VCC or GND
VCC = 5.5 V,
One input at 3.4
3 4 V,
V
Other inputs at VCC or GND
VI = 2.5 V or 0.5 V
V
mV
±1
±1
±1
µA
±50
±50
±50
µA
±50
±50
±50
µA
10
10
10
µA
–10
–10
–10
µA
±100
µA
±100
50
–50
V
V
100
VCC = 2.1 V to 5.5 V, VO = 2.7 V, OE ≤ 0.8 V
VCC = 2.1 V to 5.5 V, VO = 0.5 V, OE ≤ 0.8 V
UNIT
2
0.55
IOL = 64 mA
IOZH
IOZL
Ci
SN54ABT126
2.5
IOZPU
IOZPD
∆ICC¶
TA = 25°C
TYP†
MAX
2.5
VCC = 0 to 5.5 V,
VI = VCC or GND
VCC = 0 to 2.1 V, VO = 0.5 V to 2.7 V, OE = X‡
VCC = 2.1 V to 0, VO = 0.5 V to 2.7 V, OE = X‡
ICC
MIN
–100
–200
50
–50
–200
–50
50
µA
–200
mA
1
250
250
250
µA
Outputs low
24
30
30
30
mA
Outputs disabled
0.5
250
250
250
µA
Outputs enabled
1.5
1.5
1.5
mA
Outputs disabled
50
50
50
µA
3
Co
VO = 2.5 V or 0.5 V
7
* On products compliant to MIL-PRF-38535, this parameter does not apply.
† All typical values are at VCC = 5 V.
‡ For VCC between 2.1 V and 4 V, OE should be less than or equal to 0.5 V to ensure a low state.
§ Not more than one output should be tested at a time, and the duration of the test should not exceed one second.
¶ This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND.
pF
pF
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
SN54ABT126, SN74ABT126
QUADRUPLE BUS BUFFER GATES
WITH 3-STATE OUTPUTS
SCBS183H – FEBRUARY 1991 – REVISED MAY 2003
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 5 and Figure 1)
FROM
(INPUT)
TO
(OUTPUT)
tPLH
tPHL
A
Y
tPZH
tPZL
OE
Y
tPHZ
tPLZ
OE
Y
PARAMETER
VCC = 5 V,
TA = 25°C
TYP
MAX
MIN
MAX
MIN
MAX
1
2.9
4.9
1
7.3
1
6.3
1
2.5
5.1
1
5.9
1
5.7
1
4.4
5.8
1
5.3
1
6.5
1
4.4
5.9
1
6.4
1
6.5
1
3
5.7
1
6.9
1
6.8
1
3
5.8
1
7.2
1
6.7
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
POST OFFICE BOX 655303
SN74ABT126
MIN
NOTE 5: Limits may vary among suppliers.
4
SN54ABT126
• DALLAS, TEXAS 75265
UNIT
ns
ns
ns
SN54ABT126, SN74ABT126
QUADRUPLE BUS BUFFER GATES
WITH 3-STATE OUTPUTS
SCBS183H – FEBRUARY 1991 – REVISED MAY 2003
PARAMETER MEASUREMENT INFORMATION
500 Ω
From Output
Under Test
S1
7V
Open
GND
CL = 50 pF
(see Note A)
500 Ω
TEST
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
7V
Open
3V
LOAD CIRCUIT
Timing Input
1.5 V
0V
tw
tsu
3V
th
3V
1.5 V
Input
1.5 V
Data Input
0V
1.5 V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
3V
3V
1.5 V
Input
Output
Control
1.5 V
0V
1.5 V
VOL
VOH
Output
1.5 V
tPLZ
3.5 V
1.5 V
1.5 V
VOL
Output
Waveform 2
S1 at Open
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOL + 0.3 V
VOL
tPHZ
tPZH
tPLH
tPHL
1.5 V
0V
Output
Waveform 1
S1 at 7 V
(see Note B)
VOH
1.5 V
Output
1.5 V
tPZL
tPHL
tPLH
1.5 V
1.5 V
VOH – 0.3 V
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
D. The outputs are measured one at a time with one transition per measurement.
E. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74ABT126D
ACTIVE
SOIC
D
14
SN74ABT126DBLE
OBSOLETE
SSOP
DB
14
SN74ABT126DBR
ACTIVE
SSOP
DB
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT126DBRE4
ACTIVE
SSOP
DB
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT126DE4
ACTIVE
SOIC
D
14
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT126DR
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT126DRE4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT126N
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74ABT126NE4
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74ABT126NSR
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT126NSRE4
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT126PW
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT126PWE4
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT126PWLE
OBSOLETE
TSSOP
PW
14
TBD
Call TI
SN74ABT126PWR
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT126PWRE4
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT126RGYR
ACTIVE
QFN
RGY
14
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1YEAR
SN74ABT126RGYRG4
ACTIVE
QFN
RGY
14
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1YEAR
50
Green (RoHS &
no Sb/Br)
TBD
50
Lead/Ball Finish
CU NIPDAU
Call TI
MSL Peak Temp (3)
Level-1-260C-UNLIM
Call TI
Call TI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
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Copyright © 2007, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
4-Jun-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74ABT126D
ACTIVE
SOIC
D
14
SN74ABT126DBLE
OBSOLETE
SSOP
DB
14
SN74ABT126DBR
ACTIVE
SSOP
DB
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT126DBRE4
ACTIVE
SSOP
DB
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT126DBRG4
ACTIVE
SSOP
DB
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT126DE4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT126DG4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT126DR
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT126DRE4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT126DRG4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT126N
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74ABT126NE4
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74ABT126NSR
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT126NSRE4
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT126NSRG4
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT126PW
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT126PWE4
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT126PWG4
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT126PWLE
OBSOLETE
TSSOP
PW
14
TBD
Call TI
SN74ABT126PWR
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT126PWRE4
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT126PWRG4
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT126RGYR
ACTIVE
QFN
RGY
14
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
SN74ABT126RGYRG4
ACTIVE
QFN
RGY
14
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
50
Green (RoHS &
no Sb/Br)
TBD
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
Addendum-Page 1
Lead/Ball Finish
CU NIPDAU
Call TI
MSL Peak Temp (3)
Level-1-260C-UNLIM
Call TI
Call TI
PACKAGE OPTION ADDENDUM
www.ti.com
4-Jun-2007
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Oct-2007
TAPE AND REEL BOX INFORMATION
Device
Package Pins
Site
Reel
Diameter
(mm)
Reel
Width
(mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN74ABT126DBR
DB
14
SITE 41
330
16
8.2
6.6
2.5
12
16
Q1
SN74ABT126DR
D
14
SITE 41
330
16
6.5
9.0
2.1
8
16
Q1
SN74ABT126NSR
NS
14
SITE 41
330
16
8.2
10.5
2.5
12
16
Q1
SN74ABT126PWR
PW
14
SITE 41
330
12
7.0
5.6
1.6
8
12
Q1
SN74ABT126RGYR
RGY
14
SITE 41
180
12
3.85
3.85
1.35
8
12
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Oct-2007
Device
Package
Pins
Site
Length (mm)
Width (mm)
Height (mm)
SN74ABT126DBR
DB
14
SITE 41
346.0
346.0
33.0
SN74ABT126DR
D
14
SITE 41
346.0
346.0
33.0
33.0
SN74ABT126NSR
NS
14
SITE 41
346.0
346.0
SN74ABT126PWR
PW
14
SITE 41
346.0
346.0
29.0
SN74ABT126RGYR
RGY
14
SITE 41
190.0
212.7
31.75
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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