SSC SS809-26GU

SS809/810G
3-Pin Microprocessor Reset Circuits
FEATURES
DESCRIPTION
Ultra-low supply current 1µA (typ.)
The SS809G and SS810G are low-power microprocessor
Guaranteed reset valid to Vcc=0.9V
(µP) supervisory circuits used to monitor power supplies
Available in three output types:
in µP and digital systems. They improve circuit reliability
Open-drain active low (SS809N-xxGx)
Push-pull active low
and reduce cost by eliminating external components.
(SS809-xxGx)
Push-pull active high (SS810-xxGx)
These devices provide valid signals in applications
Power-on reset pulse width min. 140ms
Internally fixed threshold 2.3V, 2.6V, 2.9V, 3.1V,
with Vcc ranging from 6.0V down to 0.9V. The reset
4.0V, 4.4V, 4.6V
signal lasts for a minimum period of 140ms whenever the
Tight voltage threshold tolerance: 1.5%
VCC supply voltage falls below a preset threshold. Both
Packaged in RoHS-compliant SOT-23-3
the SS809G and SS810G were designed with a reset
comparator to help identify invalid signals lasting less
APPLICATIONS
than 140ms. The only difference between the two
l
Notebook Computers
l
Digital Still Cameras
devices is that one has an active -low RESET output
l
PDAs
and the other an active -high RESET output .
l
Critical Microprocessor Monitoring
Low supply current (1µA) makes the SS809G and SS810G
ideal for portable equipment. The devices are available in
a SOT-23-3 package.
TYPICAL APPLICATION CIRCUIT
VCC
VCC
VCC
SS809G
( SS810G)
RESET
(RESET)
µP
RESET
INPUT
GND
GND
Push -Pull Output
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SS809/810G
ORDERING INFORMATION
PIN CONFIGURATION
SS809X-XXGU XX
SS810 -XXGU XX
SOT-23-3
TOP VIEW
1: GND
2: RESET (RESET)
3: VCC
Packing type
TR: T ape and reel
3
1
2
Package type
GU: RoHS-compliant Pb-free SOT-23-3
Reset threshold voltage
23: 2.3V
26: 2.6V
29: 2.9V
31: 3.1V
40: 4.0V
44: 4.4V
46: 4.6V
Output type
Default: Push-Pull type
N: N-ch open-drain type
Example: SS809 -31GU TR
à 3.1V , push- pull version in RoHS-compliant SOT -23-3 , shipped in tape and reel
SOT -23 Part Marking
Part No.
Marking
Part No.
Marking
Part No.
Marking
SS809-23GU
RA23P
SS809N-23GU
RB23P
SS810-23GU
RD23P
SS809-26GU
RA26P
SS809N-26GU
RB26P
SS810-26GU
RD26P
SS809-29GU
RA29P
SS809N-29GU
RB29P
SS810-29GU
RD29P
SS809-31GU
RA31P
SS809N-31GU
RB31P
SS810-31GU
RD31P
SS809-40GU
RA40P
SS809N-40GU
RB40P
SS810-40GU
RD40P
SS809-44GU
RA44P
SS809N-44GU
RB44P
SS810-44GU
RD44P
SS809-46GU
RA46P
SS809N-46GU
RB46P
SS810-46GU
RD46P
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SS809/810G
ABSOLUTE MAXIMUM RATINGS
VCC
-0.3V ~6.5V
RESET, RESET
-0.3V ~ (VCC+0.3V)
Input Current (V CC)
20mA
Output Current (RESET or RESET )
20mA
Continuous Power Dissipation (TA = +70°C)
320mW
Operating Junction Temperature Range
-40°C ~ 85°C
Storage Temperature Range
- 65°C ~ 125°C
Lead Temperature (Soldering) 10 sec
260°C
Note1: Any stress beyond the Absolute Maximum Ratings above may cause permanent damage to the device.
TEST CIRCUIT
Vin
3
Iin
VCC
RESET
2
GND
SS809G 1
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SS809/810G
ELECTRICAL CHARACTERISTICS
(Typical values are at TA=25°C, unless otherwise specified.)
PARAMETER
SYMBOL
Operating Voltage Range
VCC
Supply Current
ICC
TEST CONDITIONS
VCC = VTH +0.1V
SS809-26
SS809-29
VTH
SS809-31
SS809-40
SS809-44
SS809-46
TA=+25°C
2.265
TA= -40°C to +85°C
2.254
TA=+25°C
2.561
TA= -40°C to +85°C
2.548
TA=+25°C
2.857
TA= -40°C to +85°C
2.842
TA=+25°C
3.054
TA= -40°C to +85°C
3.038
TA=+25°C
3.940
TA= -40°C to +85°C
3.920
TA=+25°C
4.334
TA= -40°C to +85°C
4.312
TA=+25°C
4.531
TA=-40°C to +85°C
4.508
VCC to Reset Delay
TRD
VCC=VTH to (VTH -0.1V), VTH=3.1V
Reset Active Timeout Period
TRP
VCC = VTH ( MAX)
VOH
VCC=VTH+0.1V, ISOURCE =1mA
VOL
VCC=VTH - 0.1V, ISINK =1mA
VOH
VCC=VTH-0.1V, ISOURCE =1mA
VOL
VCC=VTH+0.1V, ISINK =1mA
RESET Output Voltage
RESET Output Voltage
TYP.
MAX.
UNIT
6
V
1
3
µA
2.3
2.335
0.9
SS809-23
Reset Threshold
MIN.
2.346
2.6
2.639
2.652
2.9
2.944
2.958
3.1
3.147
3.162
4.0
4.060
4.080
4.4
4.466
4.488
4.6
4.669
4.692
µS
20
TA=+25°C
140
TA= -40°C to +85°C
100
V
230
560
1030
0.8V CC
0.2Vcc
0.8V CC
mS
V
V
0.2Vcc
Note2: RESET output is for the SS809G; RESET output is for the SS810G.
Note3: Specifications for operating temperature ranges from -40°C to 85°C are guaranteed by Statistical Quality
Controls (SQC), with no production testing.
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SS809/810G
TYPICAL PERFORMANCE CHARACTERISTICS
120
Supply Current (µA)
1.4
VTH=2.3V
1.3
1.2
1.1
VTH=3.1V
1.0
VTH=4.6V
0.9
0.8
0.7
0.6
Power -Down Reset Delay (µs )
1.5
110
VTH=2.3V
VO D=VTH-VCC
100
90
80
70
VOD=50mV
60
50
VOD=100mV
40
30
VOD=200mV
20
10
0
0.5
- 20
-40
0
40
20
60
80
100
-60
Temperature (° C)
-40
-20
0
20
40
60
80
100
Temperature (° C)
Fig 2 Power-Down Reset Delay vs. Temperature
Fig 1 Supply Current vs. Temperature
VTH=3.1V
VO D=VTH-VCC
220
200
Power -Down Reset Delay (µs )
Power -Down Reset Delay (µs )
240
180
160
140
VOD=50mV
120
100
80
60
VOD=100mV
40
VOD=200mV
20
0
VTH=4.6V
VOD=50mV
400
VOD=VTH-VCC
300
200
VOD=100mV
100
VOD=200mV
0
-60
- 40
0
-20
20
40
60
80
100
-60
- 40
- 20
0
20
40
60
80
100
Temperature (° C)
Temperature (° C)
Fig 3 Power-Down Reset Delay vs. Temperature
Fig 4 Power-Down Reset Delay vs. Temperature
Power -Up Reset Timeout (ms)
Normalized Reset Threshold (V)
600
1.015
VTH=4.6V
1.010
1.005
1.000
VTH=3.1V
0.995
VTH=2.3V
0.990
0.985
-40
-20
0
20
40
60
80
100
Temperature (° C)
Fig 5 Normalized Reset Threshold vs. Temperature
9/20/2006 Rev.3.01
500
400
VTH=3.1V
VTH=4.6V
300
200
VTH=2.3V
100
0
-60
-40
-20
0
20
40
60
80
100
Temperature (° C)
Fig 6 Power-Up Reset Timeout vs. Temperature
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SS809/810G
BLOCK DIAGRAM
VCC
R1
Bandgap
-
RESET
+
Reset Generator
NMOS
R2
GND
N-ch Open-Drain Type
VCC
R1
Bandgap
-
Reset Generator
+
RESET
(RESET)
R2
GND
Push-Pull Type
PIN DESCRIPTIONS
GND Pin
:
Ground.
RESET Pin (SS809G) :
Active low output pin. RESET Output remains low while Vcc is below the reset
RESET P in (SS810G)
:
Active high output pin. RESET output remains high while Vcc is below the reset threshold.
Vcc Pin
:
Supply voltage.
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SS809/810G
DETAIL ED DESCRIPTIONS OF TECHNICAL TERMS
threshold, and RESET remains low for the reset
RESET OUTPUT
The µP will be activated at a valid reset state. These
timeout period.
µP supervisory circuits assert reset to prevent code
BENEFITS
execution errors during power-up, power-down, or
THRESHOLD
brownout conditions.
RESET is guaranteed to be a logic low for
The SS809G and SS810G with specified voltage as 5V±
VTH>VCC>0.9V. Once VCC exceeds the reset
threshold, an internal timer keeps RESET low for
or 3V ±5% power supply. The reset is guaranteed to
the reset timeout period; after this interval, RESET
goes high.
but before the power drops below the minimum
specified operating voltage range of the system ICs.
If a brownout condition occurs (VCC drops below the
reset threshold), RESET goes low. Any time VCC
The pre-trimmed thresholds reduc e the range over
which an undesirable reset may occur.
OF
HIGHLY
ACCURATE
RESET
10% or 3V±10% are ideal for systems using a 5V±5%
assert after the power supply falls out of regulation,
goes below the reset threshold, the internal timer
resets to zero, and RESET goes low. The internal
timer is activated after VCC returns above the reset
APPLICATION INFORMATION
NEGATIVE-GOING VCC TRANSIENTS
of 0.9V. However in applications where RESET
In addition to issuing a reset to the µ P during
must be valid down to 0V, adding a pull-down resistor
power-up, power-down, and brownout conditions, the
to RESET causes any leakage currents to flow to
SS809G series are relatively resistant to short -duration
ground, holding RESET low.
negative-going VCC transients.
INTERFACING TO A MICROPROCESSOR WITH
ENSURING A VALID RESET OUTPUT DOWN TO
BIDIRECTIONAL RESET PINS
VCC=0
The RESET output on the SS809N is open drain,
When VCC falls below 0.9V, the SS809G RESET
and this device interfaces easily with µPs that have
output no longer sinks current; it becomes an open
bidirectional
reset
circuit. In this case, high-impedance CMOS logic
supervisor’s
RESET
inputs
connected
to
RESET
can
drift
to
undetermined voltages. Therefore, the SS809G/810G
pins.
Connecting
output
directly
the
µP
to
the
microcontroller’s RESET pin with a single pull-up
resistor allows either device to assert reset.
are perfect for most CMOS applications down to VCC
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SS809/810G
PHYSICAL DIMENSIONS
SOT -23-3 (unit: mm)
C
D
SYMBOL
MIN
MAX
A
1.00
1.30
A1
—
0.10
A2
0.70
0.90
b
0.35
0.50
C
0.10
0.25
D
2.70
3.10
E
1.40
1.80
L
E
H
θ1
e
e
A
A2
A1
b
1.90 (TYP)
H
2.60
3.00
L
0.37
—
θ1
1°
9°
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responsibility for its use, or for infringement of any patent or other intellectual property rights of third parties that may result from its
use. Silicon Standard reserves the right to make changes as it deems necessary to any products described herein for any reason, including
without limitation enhancement in reliability, functionality or design. No license is granted, whether expressly or by implication, in relation to
the use of any products described herein or to the use of any information provided herein, under any patent or other intellectual property rights of
Silicon Standard Corporation or any third parties.
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