STMICROELECTRONICS ST72F262G1M6

ST72260G, ST72262G,
ST72264G
8-BIT MCU WITH FLASH OR ROM MEMORY,
ADC, TWO 16-BIT TIMERS, I2C, SPI, SCI INTERFACES
■
■
■
■
■
Memories
– 4 K or 8 Kbytes Program memory: ROM or
Single voltage extended Flash (XFlash) with
read-out protection write protection and InCircuit Programming and In-Application Programming (ICP and IAP). 10K write/erase cycles guaranteed, data retention: 20 years at
55°C.
– 256 bytes RAM
Clock, Reset and Supply Management
– Enhanced reset system
– Enhanced low voltage supply supervisor
(LVD) with 3 programmable levels and auxiliary voltage detector (AVD) with interrupt capability for implementing safe power-down
procedures
– Clock sources: crystal/ceramic resonator oscillators, internal RC oscillator, clock security
system and bypass for external clock
– PLL for 2x frequency multiplication
– Clock-out capability
– 4 Power Saving Modes: Halt, Active Halt,Wait
and Slow
Interrupt Management
– Nested interrupt controller
– 10 interrupt vectors plus TRAP and RESET
– 22 external interrupt lines (on 2 vectors)
22 I/O Ports
– 22 multifunctional bidirectional I/O lines
– 20 alternate function lines
– 8 high sink outputs
4 Timers
– Main Clock Controller with Real time base and
Clock-out capabilities
– Configurable watchdog timer
SDIP32
SO28
LFBGA 6x6mm
■
■
■
■
– Two 16-bit timers with: 2 input captures, 2 output compares, external clock input on one timer, PWM and Pulse generator modes
3 Communications Interfaces
– SPI synchronous serial interface
– I2C multimaster interface
– SCI asynchronous serial interface (LIN compatible)
1 Analog peripheral
– 10-bit ADC with 6 input channels
Instruction Set
– 8-bit data manipulation
– 63 basic instructions
– 17 main addressing modes
– 8 x 8 unsigned multiply instruction
Development Tools
– Full hardware/software development package
Device Summary
Features
Program memory - bytes
RAM (stack) - bytes
Peripherals
Operating Supply
CPU Frequency
Operating Temperature
Packages
ST72260G1
ST72262G1
ST72262G2
ST72264G1
ST72264G2
4K
4K
8K
4K
8K
256 (128)
Watchdog timer,
RTC,
Two16-bit timers,
SPI
Watchdog timer, RTC
Two 16-bit timers,
SPI, ADC
Watchdog timer, RTC
Two 16-bit timers,
SPI, SCI, I2C, ADC
2.4 V to 5.5 V
Up to 8 MHz (with oscillator up to 16 MHz) PLL 4/8 Mhz
-40° C to +85° C
SO28 / SDIP32
0° C to +70° C
LFBGA
Rev. 1.7
August 2003
1/171
1
Table of Contents
ST72260G, ST72262G,
ST72264G . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2 PIN DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3 REGISTER & MEMORY MAP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 0
4 FLASH PROGRAM MEMORY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
4.1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
4.2
MAIN FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4
4.3
PROGRAMMING MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
4.4
ICC INTERFACE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
4.5
MEMORY PROTECTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
4.6
REGISTER DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
5 CENTRAL PROCESSING UNIT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
5.1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
5.2
MAIN FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
5.3
CPU REGISTERS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
6 SUPPLY, RESET AND CLOCK MANAGEMENT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
6.1 PHASE LOCKED LOOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
6.2
MULTI-OSCILLATOR (MO) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
6.3
RESET SEQUENCE MANAGER (RSM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
6.4
SYSTEM INTEGRITY MANAGEMENT (SI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
7 INTERRUPTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
7.1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
7.2
MASKING AND PROCESSING FLOW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
7.3
INTERRUPTS AND LOW POWER MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
7.4
CONCURRENT & NESTED MANAGEMENT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
7.5
INTERRUPT REGISTER DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
8 POWER SAVING MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
8.1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
8.2
SLOW MODE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
8.3
WAIT MODE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
8.4
ACTIVE-HALT AND HALT MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
8.5
HALT MODE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
9 I/O PORTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
9.1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
9.2
FUNCTIONAL DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
9.3
I/O PORT IMPLEMENTATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
9.4
UNUSED I/O PINS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
9.5
9.6
LOW POWER MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
INTERRUPTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 171
. . . . 41
9.7
DEVICE-SPECIFIC I/O PORT CONFIGURATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
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Table of Contents
9.8
I/O PORT REGISTER DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
10 MISCELLANEOUS REGISTERS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
10.1 I/O PORT INTERRUPT SENSITIVITY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
10.2 I/O PORT ALTERNATE FUNCTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
10.3 MISCELLANEOUS REGISTER DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
11 ON-CHIP PERIPHERALS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
11.1 WATCHDOG TIMER (WDG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
11.2 MAIN CLOCK CONTROLLER WITH REAL TIME CLOCK (MCC/RTC) . . . . . . . . . . . . . 53
11.3 16-BIT TIMER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
11.4 SERIAL PERIPHERAL INTERFACE (SPI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
11.5 SERIAL COMMUNICATIONS INTERFACE (SCI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
11.6 I2C BUS INTERFACE (I2C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
11.7 10-BIT A/D CONVERTER (ADC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112
12 INSTRUCTION SET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116
12.1 CPU ADDRESSING MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116
12.2 INSTRUCTION GROUPS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119
13 ELECTRICAL CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122
13.1 PARAMETER CONDITIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122
13.2 ABSOLUTE MAXIMUM RATINGS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123
13.3 OPERATING CONDITIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124
13.4 SUPPLY CURRENT CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127
13.5 CLOCK AND TIMING CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130
13.6 MEMORY CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135
13.7 EMC CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136
13.8 I/O PORT PIN CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141
13.9 CONTROL PIN CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 147
13.10 TIMER PERIPHERAL CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 148
13.11 COMMUNICATION INTERFACE CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . 149
13.12 10-BIT ADC CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 152
14 PACKAGE CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 154
14.1 PACKAGE MECHANICAL DATA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 154
14.2 THERMAL CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 155
14.3 SOLDERING AND GLUEABILITY INFORMATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . 156
15 DEVICE CONFIGURATION AND ORDERING INFORMATION . . . . . . . . . . . . . . . . . . . . . . . 157
15.1 OPTION BYTES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 157
15.2 DEVICE ORDERING INFORMATION AND TRANSFER OF CUSTOMER CODE . . . . 159
15.3 DEVELOPMENT TOOLS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 161
15.4 ST7 APPLICATION NOTES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 163
16 SUMMARY OF CHANGES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 165
ERRATA SHEET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 166
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ST72260G, ST72262G, ST72264G
17 SILICON IDENTIFICATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
18 REFERENCE SPECIFICATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
19 SILICON LIMITATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
19.1 EXECUTION OF BTJX INSTRUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
166
166
166
166
19.2 I/O PORT B AND C CONFIGURATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 166
19.3 16-BIT TIMER PWM MODE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 167
19.4 SPI MULTIMASTER MODE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 167
19.5 MINIMUM OPERATING VOLTAGE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 167
19.6 CSS FUNCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 67
19.7 INTERNAL AND EXTERNAL RC OSCILLATOR WITH LVD . . . . . . . . . . . . . . . . . . . . 167
19.8 EXTERNAL CLOCK WITH PLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 167
19.9 HALT MODE POWER CONSUMPTION WITH ADC ON . . . . . . . . . . . . . . . . . . . . . . . 168
19.10 ACTIVE HALT WAKE-UP BY EXTERNAL INTERRUPT . . . . . . . . . . . . . . . . . . . . . . . 168
19.11 A/D CONVERTER ACCURACY FOR FIRST CONVERSION . . . . . . . . . . . . . . . . . . . . 168
19.12 NEGATIVE INJECTION IMPACT ON ADC ACCURACY . . . . . . . . . . . . . . . . . . . . . . . 168
19.13 ADC CONVERSION SPURIOUS RESULTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 168
19.14 FUNCTIONAL EMS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 169
20 DEVICE MARKING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 169
21 ERRATA SHEET REVISION HISTORY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170
To obtain the most recent version of this datasheet,
please check at www.st.com>products>technical literature>datasheet
Please note that an errata sheet can be found at the end of this document on page 166.
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ST72260G, ST72262G, ST72264G
1 INTRODUCTION
with byte-by-byte In-Circuit Programming (ICP)
capabilities.
Under software control, all devices can be placed
in WAIT, SLOW, Active-HALT or HALT mode, reducing power consumption when the application is
in idle or stand-by state.
The enhanced instruction set and addressing
modes of the ST7 offer both power and flexibility to
software developers, enabling the design of highly
efficient and compact application code. In addition
to standard 8-bit data management, all ST7 microcontrollers feature true bit manipulation, 8x8 unsigned multiplication and indirect addressing
modes.
For easy reference, all parametric data is located
in Section 13 on page 122.
The ST72260G, ST72262G and ST72264G devices are members of the ST7 microcontroller family.
They can be grouped as follows :
– ST72264G devices are designed for mid-range
applications with ADC, I2C and SCI interface capabilities.
– ST72262G devices target the same range of applications but without I2C interface or SCI.
– ST72260G devices are for applications that do
not need ADC, I2C peripherals or SCI.
All devices are based on a common industrystandard 8-bit core, featuring an enhanced instruction set.
The ST72F260G, ST72F262G, and ST72F264G
versions feature single-voltage FLASH memory
Figure 1. General Block Diagram
OSC1
OSC2
MULTI OSC
+
CLOCK FILTER
Internal
CLOCK
I2C*
SCI*
MCC/RTC
PORT A
PA7:0
(8 bits)
LVD
VDD
RESET
CONTROL
8-BIT CORE
ALU
PROGRAM
MEMORY
(4 or 8K Bytes)
RAM
(256 Bytes)
ICD
ADDRESS AND DATA BUS
VSS
POWER
SUPPLY
SPI
PORT B
PB7:0
(8 bits)
16-BIT TIMER A
PORT C
PC5:0
(6 bits)
10-BIT ADC*
16-BIT TIMER B
WATCHDOG
*Not available on some devices, see device summary on page 1.
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ST72260G, ST72262G, ST72264G
2 PIN DESCRIPTION
Figure 2. 28-Pin SO Package Pinout
RESET
1
28
VDD
OSC1
OSC2
2
27
VSS
3
26
ICCSEL
SS/PB7
4
25
PA0 (HS)/ICCCLK
SCK/PB6
5
24
PA1 (HS)/ICCDATA
MISO/PB5
6
23
PA2 (HS)
22
PA3 (HS)
21
PA4 (HS)/SCLI3
MOSI/PB4
7
OCMP2_A/PB3
8
ICAP2_A/PB2
9
20
PA5(HS)/RDI3
OCMP1_A/PB1
ICAP1_A/PB0
10
19
11
18
PA6 (HS)/SDAI3
PA7 (HS)/TDO3
AIN5/EXTCLK_A/PC5
12
17
2
ei1
AIN4 /OCMP2_B/PC4
13
AIN32/ICAP2_B/PC3
14
ei0
ei0 or ei11
16
PC0/ICAP1_B/AIN02
PC1/OCMP1_B/AIN12
15
PC2/MCO/AIN22
(HS) 20mA high sink capability
eiX associated external interrupt vector
1
Configurable by option byte
Alternate function not available on ST72260
3 Alternate function not available on ST72260 and ST72262
2
Figure 3. 32-Pin SDIP Package Pinout
RESET
1
32
VDD
OSC1
OSC2
2
31
VSS
3
30
SS/PB7
4
29
ICCSEL
PA0 (HS)/ICCCLK
SCK/PB6
5
28
PA1 (HS)/ICCDATA
MISO/PB5
MOSI/PB4
NC
6
27
7
26
PA2 (HS)
PA3 (HS)
8
25
NC
9
24
10
23
NC
NC
PA4 (HS)/SCLI3
22
PA5 (HS)/RDI3
21
18
PA6 (HSI/SDAI3
PA7 (HS)/TDO3
PC0/ICAP1_B/AIN02
PC1/OCMP1_B/AIN12
17
PC2/MCO/AIN22
OCMP2_A/PB3
ICAP2_A/PB2
11
OCMP1_A/PB1
12
ICAP1_A/PB0
13
AIN52/EXTCLK_A/PC5
AIN42/OCMP2_B/PC4
14
AIN32/ICAP2_B/PC3
16
15
ei1
ei1
ei0
ei0
20
19
ei0 or ei1
1
1
Configurable by option byte
Alternate function not available on ST72260
3
Alternate function not available on ST72260 and ST72262
2
6/171
(HS) 20mA high sink capability
eiX associated external interrupt vector
ST72260G, ST72262G, ST72264G
Figure 4. TFBGA Package Pinout (view through package)
1
2
3
4
5
6
A
B
C
D
E
F
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ST72260G, ST72262G, ST72264G
PIN DESCRIPTION (Cont’d)
For external pin connection guidelines, refer to Section 13 "ELECTRICAL CHARACTERISTICS" on page
122.
Legend / Abbreviations for Table 1:
Type:
I = input, O = output, S = supply
Input level:
A = Dedicated analog input
In/Output level: CT= CMOS 0.3 VDD/0.7 VDD with input trigger
Output level:
HS = 20 mA high sink (on N-buffer only)
Port and control configuration:
– Input:
float = floating, wpu = weak pull-up, int = interrupt 1), ana = analog
– Output:
OD = open drain 2), PP = push-pull
Refer to Section 9 "I/O PORTS" on page 38 for more details on the software configuration of the I/O ports.
The RESET configuration of each pin is shown in bold. This configuration is valid as long as the device is
in reset state.
Table 1. Device Pin Description
Level
Port / Control
Main
Output Function
(after
reset)
I
3
3
B3 OSC2 3)
O
4
4
A2 PB7/SS
I/O
CT
X
ei1
X
X
Port B7
SPI Slave Select (active low)
5
5
A1 PB6/SCK
I/O
CT
X
ei1
X
X
Port B6
SPI Serial Clock
6
6
B1 PB5/MISO
I/O
CT
X
ei1
X
X
Port B5
SPI Master In/ Slave Out Data
7
7
B2 PB4/MOSI
I/O
CT
X
ei1
X
X
Port B4
SPI Master Out / Slave In Data
8
C1 NC
9
C2 NC
X
Alternate Function
PP
Input
OD
C4 OSC1 3)
ana
2
int
2
I/O CT
wpu
A3 RESET
float
1
Pin Name
Output
1
BGA
SO28
Input
SDIP32
Type
Pin n°
Top priority non maskable interrupt (active low)
External clock input or Resonator oscillator inverter input or resistor input for RC
oscillator
Resonator oscillator inverter output or capacitor input for RC oscillator
X
Not Connected
D1 NC
10
8
C3 PB3/OCMP2_A
I/O
CT
X
ei1
X
X
Port B3
Timer A Output Compare 2
11
9
D2 PB2/ICAP2_A
I/O
CT
X
ei1
X
X
Port B2
Timer A Input Capture 2
12
10 E1 PB1 /OCMP1_A
I/O
CT
X
ei1
X
X
Port B1
Timer A Output Compare 1
13
11 F1 PB0 /ICAP1_A
I/O
CT
X
ei1
X
X
Port B0
Timer A Input Capture 1
14
12 F2 PC5/EXTCLK_A/AIN5 I/O
CT
X
ei0/ei1 X
X
X
Port C5
15
13 E2 PC4/OCMP2_B/AIN4
I/O
CT
X
ei0/ei1 X
X
X
Port C4
16
14 F3 PC3/ ICAP2_B/AIN3
I/O
CT
X
ei0/ei1 X
X
X
Port C3
8/171
Timer A Input Clock or ADC
Analog Input 5
Timer B Output Compare 2 or
ADC Analog Input 4
Timer B Input Capture 2 or
ADC Analog Input 3
ST72260G, ST72262G, ST72264G
Pin n°
Port / Control
Type
float
wpu
OD
PP
17
15 E3 PC2/MCO/AIN2
I/O
CT
X
ei0/ei1 X
X
X
Port C2
18
16 F4 PC1/OCMP1_B/AIN1
I/O
CT
X
ei0/ei1 X
X
X
Port C1
19
17 D3 PC0/ICAP1_B/AIN0
I/O
CT
X
ei0/ei1 X
X
X
Port C0
20
18 E4 PA7/TDO
I/O CT HS
X
X
X
Port A7
SCI output
21
19 F5 PA6/SDAI
I/O CT HS
X
Port A6
I2C DATA
22
20 F6 PA5 /RDI
I/O CT HS
X
Port A5
SCI input
23
21 E6 PA4/SCLI
I/O CT HS
X
Port A4
I2C CLOCK
24
E5 NC
25
D6 NC
ei0
ei0
ei0
ei0
ana
Input
int
Input
Output
Pin Name
BGA
SO28
Main
Output Function
(after
reset)
SDIP32
Level
T
X
X
T
Alternate Function
Main clock output (fCPU) or
ADC Analog Input 2
Timer B Output Compare 1 or
ADC Analog Input 1
Timer B Input Capture 1 or
ADC Analog Input 0
Not Connected
D5 NC
26
22 C6 PA3
I/O CT HS
X
ei0
X
X
Port A3
27
23 D4 PA2
I/O CT HS
X
ei0
X
X
Port A2
C5 NC
Not Connected
B6 NC
28
24 A6 PA1/ICCDATA
I/O CT HS
X
ei0
X
X
Port A1
In Circuit Communication Data
29
25 A5 PA0/ICCCLK
I/O CT HS
X
ei0
X
X
Port A0
In Circuit Communication
Clock
30
26 B5 ICCSEL
I
31
27 A4 VSS
S
Ground
32
28 B4 VDD
S
Main power supply
CT
X
ICC mode pin, must be tied low
Notes:
1. In the interrupt input column, “eiX” defines the associated external interrupt vector. If the weak pull-up
column (wpu) is merged with the interrupt column (int), then the I/O configuration is a pull-up interrupt input, otherwise the configuration is a floating interrupt input. Port C is mapped to ei0 or ei1 by option byte.
2. In the open drain output column, “T” defines a true open drain I/O (P-Buffer and protection diode to VDD
are not implemented). See Section 9 "I/O PORTS" on page 38 for more details.
3. OSC1 and OSC2 pins connect a crystal or ceramic resonator, an external RC, or an external source to
the on-chip oscillator see Section 2 "PIN DESCRIPTION" on page 6 and Section 6.2 "MULTI-OSCILLATOR (MO)" on page 21 for more details.
9/171
ST72260G, ST72262G, ST72264G
3 REGISTER & MEMORY MAP
As shown in Figure 5, the MCU is capable of addressing 64K bytes of memories and I/O registers.
The available memory locations consist of 128
bytes of register location, 256 bytes of RAM and
up to 8 Kbytes of user program memory. The RAM
space includes up to 128 bytes for the stack from
0100h to 017Fh.
The highest address bytes contain the user reset
and interrupt vectors.
The Flash memory contains two sectors (see Figure 5) mapped in the upper part of the ST7 ad-
dressing space so the reset and interrupt vectors
are located in Sector 0 (F000h-FFFFh).
The size of Flash Sector 0 and other device options are configurable by Option byte (refer to Section 15.1 on page 157).
IMPORTANT: Memory locations marked as “Reserved” must never be accessed. Accessing a reseved area can have unpredictable effects on the
device.
Figure 5. Memory Map
0000h
HW Registers
(see Table 2)
0080h
RAM
(256 Bytes)
00FFh
0100h
007Fh
0080h
017Fh
0180h
017Fh
E000h
Program Memory
(4K, 8 KBytes)
FFDFh
FFE0h
FFFFh
10/171
EFFFh
F000h
FFFFh
Interrupt & Reset Vectors
(see Table 5 on page 32)
Stack or
16-bit Addressing RAM
(128 Bytes)
8K FLASH
PROGRAM MEMORY
Reserved
DFFFh
E000h
Short Addressing RAM
Zero page
(128 Bytes)
4 Kbytes
SECTOR 1
4 Kbytes
SECTOR 0
ST72260G, ST72262G, ST72264G
Table 2. Hardware Register Map
Address
0000h
0001h
0002h
Block
Port C
Register
Label
PCDR
PCDDR
PCOR
Register Name
Port C Data Register
Port C Data Direction Register
Port C Option Register
0003h
0004h
0005h
0006h
Remarks
xx000000h1) R/W 2)
00h
R/W 2)
00h
R/W 2)
Reserved (1 Byte)
Port B
PBDR
PBDDR
PBOR
Port B Data Register
Port B Data Direction Register
Port B Option Register
0007h
0008h
0009h
000Ah
Reset
Status
00h 1)
00h
00h
R/W
R/W
R/W.
00h 1)
00h
00h
R/W
R/W
Reserved (1 Byte)
Port A
PADR
PADDR
PAOR
Port A Data Register
Port A Data Direction Register
Port A Option Register
000Bh
to
001Bh
R/W
Reserved (17 Bytes)
001Ch
ISPR0
Interrupt software priority register0
FFh
R/W
001Dh
ISPR1
Interrupt software priority register1
FFh
R/W
001Eh
ITC
ISPR2
Interrupt software priority register2
FFh
R/W
001Fh
ISPR3
Interrupt software priority register3
FFh
R/W
0020h
MISCR1
Miscellanous register 1
00h
R/W
0021h
0022h
0023h
SPI
SPIDR
SPICR
SPICSR
SPI Data I/O Register
SPI Control Register
SPI Status Register
xxh
0xh
00h
R/W
R/W
R/W
0024h
WATCHDOG
WDGCR
Watchdog Control Register
7Fh
R/W
SICSR
System Integrity Control / Status Register
000x 000x
R/W
MCCSR
Main Clock Control / Status Register
00h
R/W
I2CCR
I2CSR1
I2CSR2
I2CCCR
I2COAR1
I2COAR2
I2CDR
I2C
00h
00h
00h
00h
00h
40h
00h
R/W
Read Only
Read Only
R/W
R/W
R/W
R/W
0025h
0026h
MCC
0027h
0028h
0029h
002Ah
002Bh
002Ch
002Dh
002Eh
002Fh
0030h
Reserved (1 Byte)
I2C
Control Register
I2C Status Register 1
I2C Status Register 2
I2C Clock Control Register
I2C Own Address Register 1
I2C Own Address Register2
I2C Data Register
Reserved (2 Bytes)
11/171
ST72260G, ST72262G, ST72264G
Address
Block
Register
Label
Register Name
R/W
R/W
R/W
Read
Read
R/W
R/W
Read
Read
Read
Read
Read
Read
R/W
R/W
Miscellanous register 2
00h
R/W
TIMER B
TBCR2
TBCR1
TBSCSR
TBIC1HR
TBIC1LR
TBOC1HR
TBOC1LR
TBCHR
TBCLR
TBACHR
TBACLR
TBIC2HR
TBIC2LR
TBOC2HR
TBOC2LR
Timer
Timer
Timer
Timer
Timer
Timer
Timer
Timer
Timer
Timer
Timer
Timer
Timer
Timer
Timer
00h
00h
xxh
xxh
xxh
80h
00h
FFh
FCh
FFh
FCh
xxh
xxh
80h
00h
R/W
R/W
R/W
Read
Read
R/W
R/W
Read
Read
Read
Read
Read
Read
R/W
R/W
SCI
SCISR
SCIDR
SCIBRR
SCICR1
SCICR2
SCIERPR
SCIETPR
SCI Status Register
SCI Data Register
SCI Baud Rate Register
SCI Control Register1
SCI Control Register2
SCI Extended Receive Prescaler Register
SCI Extended Transmit Prescaler Register
Timer
Timer
Timer
Timer
Timer
Timer
Timer
Timer
Timer
Timer
Timer
Timer
Timer
Timer
Timer
0040h
MISCR2
0041h
0042h
0043h
0044h
0045h
0046h
0047h
0048h
0049h
004Ah
004Bh
004Ch
004Dh
004Eh
004Fh
0050h
0051h
0052h
0053h
0054h
0055h
0056h
TIMER A
0057h
to
006Eh
ADC
0072h
FLASH
12/171
A Control Register 2
A Control Register 1
A Control/Status Register
A Input Capture 1 High Register
A Input Capture 1 Low Register
A Output Compare 1 High Register
A Output Compare 1 Low Register
A Counter High Register
A Counter Low Register
A Alternate Counter High Register
A Alternate Counter Low Register
A Input Capture 2 High Register
A Input Capture 2 Low Register
A Output Compare 2 High Register
A Output Compare 2 Low Register
B Control Register 2
B Control Register 1
B Control/Status Register
B Input Capture 1 High Register
B Input Capture 1 Low Register
B Output Compare 1 High Register
B Output Compare 1 Low Register
B Counter High Register
B Counter Low Register
B Alternate Counter High Register
B Alternate Counter Low Register
B Input Capture 2 High Register
B Input Capture 2 Low Register
B Output Compare 2 High Register
B Output Compare 2 Low Register
Only
Only
Only
Only
Only
Only
Only
Only
Only
Only
Only
Only
Only
Only
Only
Only
C0h
xxh
00h
x000 0000h
00h
00h
00h
Read Only
R/W
R/W
R/W
R/W
R/W
R/W
Data Register Low3)
Data Register High3)
Control/Status Register
00h
00h
00h
Read Only
Read Only
R/W
Flash Control Register
00h
Reserved (24 Bytes)
006Fh
0070h
0071h
0073h
to
007Fh
Remarks
00h
00h
xxh
xxh
xxh
80h
00h
FFh
FCh
FFh
FCh
xxh
xxh
80h
00h
TACR2
TACR1
TASCSR
TAIC1HR
TAIC1LR
TAOC1HR
TAOC1LR
TACHR
TACLR
TAACHR
TAACLR
TAIC2HR
TAIC2LR
TAOC2HR
TAOC2LR
0031h
0032h
0033h
0034h
0035h
0036h
0037h
0038h
0039h
003Ah
003Bh
003Ch
003Dh
003Eh
003Fh
Reset
Status
ADCDRL
ADCDRH
ADCCSR
FCSR
Reserved (13 Bytes)
R/W
ST72260G, ST72262G, ST72264G
Legend: x=Undefined, R/W=Read/Write
Notes:
1. The contents of the I/O port DR registers are readable only in output configuration. In input configuration, the values of the I/O pins are returned instead of the DR register contents.
2. The bits associated with unavailable pins must always keep their reset value.
3. For compatibility with the ST72C254, the ADCDRL and ADCDRH data registers are located with the
LSB on the lower address (6Fh) and the MSB on the higher address (70h). As this scheme is not little Endian, the ADC data registers cannot be treated by C programs as an integer, but have to be treated as two
char registers.
13/171
ST72260G, ST72262G, ST72264G
4 FLASH PROGRAM MEMORY
4.1 Introduction
The ST7 single voltage extended Flash (XFlash) is
a non-volatile memory that can be electrically
erased and programmed either on a byte-by-byte
basis or up to 32 bytes in parallel.
The XFlash devices can be programmed off-board
(plugged in a programming tool) or on-board using
In-Circuit Programming or In-Application Programming.
The array matrix organisation allows each sector
to be erased and reprogrammed without affecting
other sectors.
4.2 Main Features
■
■
■
■
■
ICP (In-Circuit Programming)
IAP (In-Application Programming)
ICT (In-Circuit Testing) for downloading and
executing user application test patterns in RAM
Sector 0 size configurable by option byte
Read-out and write protection against piracy
4.3 PROGRAMMING MODES
The ST7 can be programmed in three different
ways:
– Insertion in a programming tool. In this mode,
FLASH sectors 0 and 1 and option byte row
can be programmed or erased.
– In-Circuit Programming. In this mode, FLASH
sectors 0 and 1 and option byte row can be
programmed or erased without removing the
device from the application board.
– In-Application Programming. In this mode,
sector 1 can be programmed or erased without removing the device from the application
14/171
board and while the application is running.
4.3.1 In-Circuit Programming (ICP)
ICP uses a protocol called ICC (In-Circuit Communication) which allows an ST7 plugged on a printed circuit board (PCB) to communicate with an external programming device connected via cable.
ICP is performed in three steps:
Switch the ST7 to ICC mode (In-Circuit Communications). This is done by driving a specific signal
sequence on the ICCCLK/DATA pins while the
RESET pin is pulled low. When the ST7 enters
ICC mode, it fetches a specific RESET vector
which points to the ST7 System Memory containing the ICC protocol routine. This routine enables
the ST7 to receive bytes from the ICC interface.
– Download ICP Driver code in RAM from the
ICCDATA pin
– Execute ICP Driver code in RAM to program
the FLASH memory
Depending on the ICP Driver code downloaded in
RAM, FLASH memory programming can be fully
customized (number of bytes to program, program
locations, or selection of the serial communication
interface for downloading).
4.3.2 In Application Programming (IAP)
This mode uses an IAP Driver program previously
programmed in Sector 0 by the user (in ICP
mode).
This mode is fully controlled by user software. This
allows it to be adapted to the user application, (user-defined strategy for entering programming
mode, choice of communications protocol used to
fetch the data to be stored etc.)
IAP mode can be used to program any memory areas except Sector 0, which is write/erase protected to allow recovery in case errors occur during
the programming operation.
ST72260G, ST72262G, ST72264G
FLASH PROGRAM MEMORY (Cont’d)
Tool documentation for recommended resistor values.
2. During the ICP session, the programming tool
must control the RESET pin. This can lead to conflicts between the programming tool and the application reset circuit if it drives more than 5mA at
high level (push pull output or pull-up resistor<1K).
A schottky diode can be used to isolate the application RESET circuit in this case. When using a
classical RC network with R>1K or a reset management IC with open drain output and pull-up resistor>1K, no additional components are needed.
In all cases the user must ensure that no external
reset is generated by the application during the
ICC session.
3. The use of Pin 7 of the ICC connector depends
on the Programming Tool architecture. This pin
must be connected when using most ST Programming Tools (it is used to monitor the application
power supply). Please refer to the Programming
Tool manual.
4. Pin 9 has to be connected to the OSC1 pin of
the ST7 when the clock is not available in the application or if the selected clock option is not programmed in the option byte. ST7 devices with multi-oscillator capability need to have OSC2 grounded in this case.
4.4 ICC interface
ICP needs a minimum of 4 and up to 7 pins to be
connected to the programming tool. These pins
are:
– RESET: device reset
– VSS: device power supply ground
– ICCCLK: ICC output serial clock pin
– ICCDATA: ICC input serial data pin
– ICCSEL: ICC selection (not required on devices without ICCSEL pin)
– OSC1: main clock input for external source
(not required on devices without OSC1/OSC2
pins)
– VDD: application board power supply (optional, see Note 3)
Notes:
1. If the ICCCLK or ICCDATA pins are only used
as outputs in the application, no signal isolation is
necessary. As soon as the Programming Tool is
plugged to the board, even if an ICC session is not
in progress, the ICCCLK and ICCDATA pins are
not available for the application. If they are used as
inputs by the application, isolation such as a serial
resistor has to be implemented in case another device forces the signal. Refer to the Programming
Figure 6. Typical ICC Interface
PROGRAMMING TOOL
ICC CONNECTOR
ICC Cable
ICC CONNECTOR
HE10 CONNECTOR TYPE
OPTIONAL
(See Note 3)
OPTIONAL
(See Note 4)
9
7
5
3
1
10
8
6
4
2
APPLICATION BOARD
APPLICATION
RESET SOURCE
See Note 2
10kΩ
ICCDATA
ICCCLK
ST7
RESET
See Note 1 APPLICATION
I/O
ICCSEL
OSC1
CL1
OSC2
VDD
CL2
VSS
APPLICATION
POWER SUPPLY
15/171
ST72260G, ST72262G, ST72264G
FLASH PROGRAM MEMORY (Cont’d)
4.5 Memory Protection
There are two different types of memory protection: Read Out Protection and Write/Erase Protection which can be applied individually.
4.5.1 Read out Protection
Read out protection, when selected, makes it impossible to extract the memory content from the
microcontroller, thus preventing piracy.
In flash devices, this protection is removed by reprogramming the option. In this case the program
memory is automatically erased and the device
can be reprogrammed.
Read-out protection selection depends on the device type:
– In Flash devices it is enabled and removed
through the FMP_R bit in the option byte.
– In ROM devices it is enabled by mask option
specified in the Option List.
4.5.2 Flash Write/Erase Protection
Write/erase protection, when set, makes it impossible to both overwrite and erase program memory. Its purpose is to provide advanced security to
applications and prevent any change being made
to the memory content.
16/171
Warning: Once set, Write/erase protection can
never be removed. A write-protected flash device
is no longer reprogrammable.
Write/erase protection is enabled through the
FMP_W bit in the option byte.
4.6 Register Description
FLASH CONTROL/STATUS REGISTER (FCSR)
Read /Write
Reset Value: 000 0000 (00h)
1st RASS Key: 0101 0110 (56h)
2nd RASS Key: 1010 1110 (AEh)
7
0
0
0
0
0
0
OPT
LAT
PGM
Note: This register is reserved for programming
using ICP, IAP or other programming methods. It
controls the XFlash programming and erasing operations. For details on XFlash programming, refer
to the ST7 Flash Programming Reference Manual.
When an EPB or another programming tool is
used (in socket or ICP mode), the RASS keys are
sent automatically.
ST72260G, ST72262G, ST72264G
5 CENTRAL PROCESSING UNIT
5.1 INTRODUCTION
5.3 CPU REGISTERS
This CPU has a full 8-bit architecture and contains
six internal registers allowing efficient 8-bit data
manipulation.
The 6 CPU registers shown in Figure 7 are not
present in the memory mapping and are accessed
by specific instructions.
Accumulator (A)
The Accumulator is an 8-bit general purpose register used to hold operands and the results of the
arithmetic and logic calculations and to manipulate
data.
Index Registers (X and Y)
These 8-bit registers are used to create effective
addresses or as temporary storage areas for data
manipulation. (The Cross-Assembler generates a
precede instruction (PRE) to indicate that the following instruction refers to the Y register.)
The Y register is not affected by the interrupt automatic procedures.
Program Counter (PC)
The program counter is a 16-bit register containing
the address of the next instruction to be executed
by the CPU. It is made of two 8-bit registers PCL
(Program Counter Low which is the LSB) and PCH
(Program Counter High which is the MSB).
5.2 MAIN FEATURES
■
■
■
■
■
■
■
■
Enable executing 63 basic instructions
Fast 8-bit by 8-bit multiply
17 main addressing modes (with indirect
addressing mode)
Two 8-bit index registers
16-bit stack pointer
Low power HALT and WAIT modes
Priority maskable hardware interrupts
Non-maskable software/hardware interrupts
Figure 7. CPU Registers
7
0
ACCUMULATOR
RESET VALUE = XXh
7
0
X INDEX REGISTER
RESET VALUE = XXh
7
0
Y INDEX REGISTER
RESET VALUE = XXh
15
PCH
8 7
PCL
0
PROGRAM COUNTER
RESET VALUE = RESET VECTOR @ FFFEh-FFFFh
7
0
1 1 I1 H I0 N Z C
CONDITION CODE REGISTER
RESET VALUE = 1 1 1 X 1 X X X
15
8 7
0
STACK POINTER
RESET VALUE = STACK HIGHER ADDRESS
X = Undefined Value
17/171
ST72260G, ST72262G, ST72264G
CENTRAL PROCESSING UNIT (Cont’d)
Bit 1 = Z Zero.
Condition Code Register (CC)
Read/Write
Reset Value: 111x1xxx
7
1
0
1
I1
H
I0
N
Z
C
The 8-bit Condition Code register contains the interrupt masks and four flags representative of the
result of the instruction just executed. This register
can also be handled by the PUSH and POP instructions.
These bits can be individually tested and/or controlled by specific instructions.
Arithmetic Management Bits
Bit 4 = H Half carry.
This bit is set by hardware when a carry occurs between bits 3 and 4 of the ALU during an ADD or
ADC instructions. It is reset by hardware during
the same instructions.
0: No half carry has occurred.
1: A half carry has occurred.
This bit is tested using the JRH or JRNH instruction. The H bit is useful in BCD arithmetic subroutines.
Bit 2 = N Negative .
This bit is set and cleared by hardware. It is representative of the result sign of the last arithmetic,
logical or data manipulation. It’s a copy of the result 7th bit.
0: The result of the last operation is positive or null.
1: The result of the last operation is negative
(i.e. the most significant bit is a logic 1).
This bit is accessed by the JRMI and JRPL instructions.
18/171
This bit is set and cleared by hardware. This bit indicates that the result of the last arithmetic, logical
or data manipulation is zero.
0: The result of the last operation is different from
zero.
1: The result of the last operation is zero.
This bit is accessed by the JREQ and JRNE test
instructions.
Bit 0 = C Carry/borrow.
This bit is set and cleared by hardware and software. It indicates an overflow or an underflow has
occurred during the last arithmetic operation.
0: No overflow or underflow has occurred.
1: An overflow or underflow has occurred.
This bit is driven by the SCF and RCF instructions
and tested by the JRC and JRNC instructions. It is
also affected by the “bit test and branch”, shift and
rotate instructions.
Interrupt Management Bits
Bit 5,3 = I1, I0 Interrupt
The combination of the I1 and I0 bits gives the current interrupt software priority.
Interrupt Software Priority
Level 0 (main)
Level 1
Level 2
Level 3 (= interrupt disable)
I1
1
0
0
1
I0
0
1
0
1
These two bits are set/cleared by hardware when
entering in interrupt. The loaded value is given by
the corresponding bits in the interrupt software priority registers (IxSPR). They can be also set/
cleared by software with the RIM, SIM, IRET,
HALT, WFI and PUSH/POP instructions.
See the interrupt management chapter for more
details.
ST72260G, ST72262G, ST72264G
CENTRAL PROCESSING UNIT (Cont’d)
Stack Pointer (SP)
Read/Write
Reset Value: 01 7Fh
15
0
8
0
0
0
0
0
0
7
SP7
1
0
SP6
SP5
SP4
SP3
SP2
SP1
SP0
The Stack Pointer is a 16-bit register which is always pointing to the next free location in the stack.
It is then decremented after data has been pushed
onto the stack and incremented before data is
popped from the stack (see Figure 8).
Since the stack is 128 bytes deep, the 8 most significant bits are forced by hardware. Following an
MCU Reset, or after a Reset Stack Pointer instruction (RSP), the Stack Pointer contains its reset value (the SP7 to SP0 bits are set) which is the stack
higher address.
The least significant byte of the Stack Pointer
(called S) can be directly accessed by a LD instruction.
Note: When the lower limit is exceeded, the Stack
Pointer wraps around to the stack upper limit, without indicating the stack overflow. The previously
stored information is then overwritten and therefore lost. The stack also wraps in case of an underflow.
The stack is used to save the return address during a subroutine call and the CPU context during
an interrupt. The user may also directly manipulate
the stack by means of the PUSH and POP instructions. In the case of an interrupt, the PCL is stored
at the first location pointed to by the SP. Then the
other registers are stored in the next locations as
shown in Figure 8
– When an interrupt is received, the SP is decremented and the context is pushed on the stack.
– On return from interrupt, the SP is incremented
and the context is popped from the stack.
A subroutine call occupies two locations and an interrupt five locations in the stack area.
Figure 8. Stack Manipulation Example
CALL
Subroutine
PUSH Y
Interrupt
Event
POP Y
RET
or RSP
IRET
@ 0100h
SP
SP
CC
A
SP
CC
A
X
X
X
PCH
PCH
PCH
PCL
PCL
PCL
PCH
PCH
PCH
PCH
PCH
PCL
PCL
PCL
PCL
PCL
SP
@ 017Fh
Y
CC
A
SP
SP
Stack Higher Address = 017Fh
Stack Lower Address = 0100h
19/171
ST72260G, ST72262G, ST72264G
6 SUPPLY, RESET AND CLOCK MANAGEMENT
6.1 PHASE LOCKED LOOP
The device includes a range of utility features for
securing the application in critical situations (for
example in case of a power brown-out), and reducing the number of external components. An
overview is shown in Figure 10.
For more details, refer to dedicated parametric
section.
If the clock frequency input to the PLL is in the 2 to
4 MHz range, the PLL can be used to multiply the
frequency by two to obtain an fOSC2 of 4 to 8 MHz.
The PLL is enabled by option byte. If the PLL is
disabled, then fOSC2 = fOSC/2.
Caution: The PLL is not recommended for applications where timing accuracy is required. See
“PLL Characteristics” on page 134.
Main Features
■ Optional PLL for multiplying the frequency by 2
(not to be used with internal RC oscillator)
■ Reset Sequence Manager (RSM)
■ Multi-Oscillator Clock Management (MO)
– 4 Crystal/Ceramic resonator oscillators
– 1 Internal RC oscillator
■ System Integrity Management (SI)
– Main supply Low Voltage Detector (LVD)
– Auxiliary Voltage Detector (AVD) with interrupt capability for monitoring the main supply
– Clock Security System (CSS) with Clock Filter
and Backup Safe Oscillator (enabled by option byte)
Figure 9. PLL Block Diagram
PLL x 2
0
/2
1
fOSC
fOSC2
PLL OPTION BIT
Figure 10. Clock, Reset and Supply Block Diagram
SYSTEM INTEGRITY MANAGEMENT
CLOCK SECURITY SYSTEM
(CSS)
OSC2
MULTIOSCILLATOR
OSC1
fOSC PLL
fOSC2
(option)
(MO)
RESET SEQUENCE
RESET
MANAGER
(RSM)
CLOCK
SAFE
FILTER
OSC
fOSC2
AVD Interrupt Request
SICSR
0 AVD AVD LVD
IE
F RF
MAIN CLOCK
fCPU
CONTROLLER
WITH REALTIME
CLOCK (MCC/RTC)
WATCHDOG
TIMER (WDG)
0
CSS CSS WDG
IE D RF
CSS Interrupt Request
LOW VOLTAGE
VSS
DETECTOR
VDD
(LVD)
AUXILIARY VOLTAGE
DETECTOR
(AVD)
20/171
ST72260G, ST72262G, ST72264G
6.2 MULTI-OSCILLATOR (MO)
Table 3. ST7 Clock Sources
External Clock
Hardware Configuration
Crystal/Ceramic Resonators
External Clock Source
In this external clock mode, a clock signal (square,
sinus or triangle) with ~50% duty cycle has to drive
the OSC1 pin while the OSC2 pin is tied to ground.
Crystal/Ceramic Oscillators
This family of oscillators has the advantage of producing a very accurate rate on the main clock of
the ST7. The selection within a list of 5 oscillators
with different frequency ranges has to be done by
option byte in order to reduce consumption (refer
to Section 15.1 on page 157 for more details on
the frequency ranges). In this mode of the multioscillator, the resonator and the load capacitors
have to be placed as close as possible to the oscillator pins in order to minimize output distortion and
start-up stabilization time. The loading capacitance values must be adjusted according to the
selected oscillator.
These oscillators are not stopped during the
RESET phase to avoid losing time in the oscillator
start-up phase.
Internal RC Oscillator
This oscillator allows a low cost solution for the
main clock of the ST7 using only an internal resistor and capacitor. Internal RC oscillator mode has
the drawback of a lower frequency accuracy and
should not be used in applications that require accurate timing.
In this mode, the two oscillator pins have to be tied
to ground.
Internal RC Oscillator
The main clock of the ST7 can be generated by
four different source types coming from the multioscillator block:
■ an external source
■ 5 crystal or ceramic resonator oscillators
■ an internal high frequency RC oscillator
Each oscillator is optimized for a given frequency
range in terms of consumption and is selectable
through the option byte. The associated hardware
configurations are shown in Table 3. Refer to the
electrical characteristics section for more details.
Caution: The OSC1 and/or OSC2 pins must not
be left unconnected. For the purposes of Failure
Mode and Effects Analysis, it should be noted that
if the OSC1 and/or OSC2 pins are left unconnected, the ST7 main oscillator may start and, in this
configuration, could generate an fOSC clock frequency in excess of the allowed maximum
(>16MHz.), putting the ST7 in an unsafe/undefined state. The product behaviour must therefore
be considered undefined when the OSC pins are
left unconnected.
ST7
OSC1
OSC2
EXTERNAL
SOURCE
ST7
OSC1
CL1
OSC2
LOAD
CAPACITORS
CL2
ST7
OSC1
OSC2
21/171
ST72260G, ST72262G, ST72264G
6.3 RESET SEQUENCE MANAGER (RSM)
6.3.1 Introduction
The reset sequence manager includes three RESET sources as shown in Figure 12:
■ External RESET source pulse
■ Internal LVD RESET (Low Voltage Detection)
■ Internal WATCHDOG RESET
These sources act on the RESET pin and it is always kept low during the delay phase.
The RESET service routine vector is fixed at addresses FFFEh-FFFFh in the ST7 memory map.
The basic RESET sequence consists of 3 phases
as shown in Figure 11:
■ Active Phase depending on the RESET source
■ 4096 CPU clock cycle delay (selected by option
byte)
■ RESET vector fetch
The 4096 CPU clock cycle delay allows the oscillator to stabilise and ensures that recovery has
taken place from the Reset state. The shorter or
longer clock cycle delay should be selected by option byte to correspond to the stabilization time of
the external oscillator used in the application.
The RESET vector fetch phase duration is 2 clock
cycles.
Figure 11. RESET Sequence Phases
RESET
Active Phase
INTERNAL RESET
4096 CLOCK CYCLES
FETCH
VECTOR
6.3.2 Asynchronous External RESET pin
The RESET pin is both an input and an open-drain
output with integrated RON weak pull-up resistor.
This pull-up has no fixed value but varies in accordance with the input voltage. It can be pulled
low by external circuitry to reset the device. See
Electrical Characteristic section for more details.
A RESET signal originating from an external
source must have a duration of at least th(RSTL)in in
order to be recognized (see Figure 13). This detection is asynchronous and therefore the MCU
can enter reset state even in HALT mode.
Figure 12. Reset Block Diagram
VDD
RON
RESET
INTERNAL
RESET
Filter
PULSE
GENERATOR
22/171
WATCHDOG RESET
LVD RESET
ST72260G, ST72262G, ST72264G
RESET SEQUENCE MANAGER (Cont’d)
The RESET pin is an asynchronous signal which
plays a major role in EMS performance. In a noisy
environment, it is recommended to follow the
guidelines mentioned in the electrical characteristics section.
6.3.3 External Power-On RESET
If the LVD is disabled by option byte, to start up the
microcontroller correctly, the user must ensure by
means of an external reset circuit that the reset
signal is held low until VDD is over the minimum
level specified for the selected fOSC frequency.
A proper reset signal for a slow rising VDD supply
can generally be provided by an external RC network connected to the RESET pin.
6.3.4 Internal Low Voltage Detector (LVD)
RESET
Two different RESET sequences caused by the internal LVD circuitry can be distinguished:
■ Power-On RESET
■ Voltage Drop RESET
The device RESET pin acts as an output that is
pulled low when VDD<VIT+ (rising edge) or
VDD<VIT- (falling edge) as shown in Figure 13.
The LVD filters spikes on VDD larger than tg(VDD) to
avoid parasitic resets.
6.3.5 Internal Watchdog RESET
The RESET sequence generated by a internal
Watchdog counter overflow is shown in Figure 13.
Starting from the Watchdog counter underflow, the
device RESET pin acts as an output that is pulled
low during at least tw(RSTL)out.
Figure 13. RESET Sequences
VDD
VIT+(LVD)
VIT-(LVD)
LVD
RESET
RUN
EXTERNAL
RESET
RUN
ACTIVE PHASE
ACTIVE
PHASE
WATCHDOG
RESET
RUN
ACTIVE
PHASE
RUN
tw(RSTL)out
th(RSTL)in
EXTERNAL
RESET
SOURCE
RESET PIN
WATCHDOG
RESET
WATCHDOG UNDERFLOW
INTERNAL RESET (4096 TCPU)
VECTOR FETCH
23/171
ST72260G, ST72262G, ST72264G
6.4 SYSTEM INTEGRITY MANAGEMENT (SI)
The System Integrity Management block contains
group the Low voltage Detector (LVD), Auxiliary
Voltage Detector (AVD) and Clock Security System (CSS) functions. It is managed by the SICSR
register.
6.4.1 Low Voltage Detector (LVD)
The Low Voltage Detector function (LVD) generates a static reset when the VDD supply voltage is
below a VIT- reference value. This means that it
secures the power-up as well as the power-down
keeping the ST7 in reset.
The VIT- reference value for a voltage drop is lower
than the VIT+ reference value for power-on in order
to avoid a parasitic reset when the MCU starts running and sinks current on the supply (hysteresis).
The LVD Reset circuitry generates a reset when
VDD is below:
– VIT+ when VDD is rising
– VIT- when VDD is falling
The LVD function is illustrated in Figure 14.
The voltage threshold can be configured by option
byte to be low, medium or high.
Provided the minimum VDD value (guaranteed for
the oscillator frequency) is above VIT-, the MCU
can only be in two modes:
– under full software control
– in static safe reset
In these conditions, secure operation is always ensured for the application without the need for external reset hardware.
During a Low Voltage Detector Reset, the RESET
pin is held low, thus permitting the MCU to reset
other devices.
Notes:
The LVD allows the device to be used without any
external RESET circuitry.
The LVD is an optional function which can be selected by option byte.
Figure 14. Low Voltage Detector vs Reset
VDD
Vhys
VIT+
VIT-
RESET
24/171
ST72260G, ST72262G, ST72264G
SYSTEM INTEGRITY MANAGEMENT (Cont’d)
6.4.2 Auxiliary Voltage Detector (AVD)
The Voltage Detector function (AVD) is based on
an analog comparison between a VIT- and VIT+ reference value and the VDD main supply. The VITreference value for falling voltage is lower than the
VIT+ reference value for rising voltage in order to
avoid parasitic detection (hysteresis).
The output of the AVD comparator is directly readable by the application software through a real
time status bit (VDF) in the SICSR register. This bit
is read only.
Caution: The AVD functions only if the LVD is enabled through the option byte.
6.4.2.1 Monitoring the VDD Main Supply
The AVD voltage threshold value is relative to the
selected LVD threshold configured by option byte
(see Section 15.1 on page 157).
If the AVD interrupt is enabled, an interrupt is generated when the voltage crosses the VIT+(AVD) or
VIT-(AVD) threshold (AVDF bit toggles).
In the case of a drop in voltage, the AVD interrupt
acts as an early warning, allowing software to shut
down safely before the LVD resets the microcontroller. See Figure 15.
The interrupt on the rising edge is used to inform
the application that the VDD warning state is over.
If the voltage rise time trv is less than 256 or 4096
CPU cycles (depending on the reset delay selected by option byte), no AVD interrupt will be generated when VIT+(AVD) is reached.
If trv is greater than 256 or 4096 cycles then:
– If the AVD interrupt is enabled before the
VIT+(AVD) threshold is reached, then 2 AVD interrupts will be received: the first when the AVDIE
bit is set, and the second when the threshold is
reached.
– If the AVD interrupt is enabled after the VIT+(AVD)
threshold is reached then only one AVD interrupt
will occur.
Figure 15. Using the AVD to Monitor VDD
VDD
Early Warning Interrupt
(Power has dropped, MCU not
not yet in reset)
Vhyst
VIT+(AVD)
VIT-(AVD)
VIT+(LVD)
VIT-(LVD)
AVDF bit
trv VOLTAGE RISE TIME
0
1
RESET VALUE
1
0
AVD INTERRUPT
REQUEST
IF AVDIE bit = 1
INTERRUPT PROCESS
INTERRUPT PROCESS
LVD RESET
25/171
ST72260G, ST72262G, ST72264G
SYSTEM INTEGRITY MANAGEMENT (Cont’d)
6.4.3 Clock Security System (CSS)
The Clock Security System (CSS) protects the
ST7 against breakdowns, spikes and overfrequencies occurring on the main clock source (fOSC). It
is based on a clock filter and a clock detection control with an internal safe oscillator (fSFOSC).
6.4.3.1 Clock Filter Control
The PLL has an integrated glitch filtering capability
making it possible to protect the internal clock from
overfrequencies created by individual spikes. This
feature is available only when the PLL is enabled.
If glitches occur on fOSC (for example, due to loose
connection or noise), the CSS filters these automatically, so the internal CPU frequency (fCPU)
continues deliver a glitch-free signal (see Figure
16).
6.4.3.2 Clock detection Control
If the clock signal disappears (due to a broken or
disconnected resonator...), the safe oscillator delivers a low frequency clock signal (fSFOSC) which
allows the ST7 to perform some rescue operations.
Automatically, the ST7 clock source switches back
from the safe oscillator (fSFOSC) if the main clock
source (fOSC) recovers.
When the internal clock (fCPU) is driven by the safe
oscillator (fSFOSC), the application software is notified by hardware setting the CSSD bit in the SICSR register. An interrupt can be generated if the
Figure 16. Clock Filter Function
PLL ON
Clock Filter Function
fOSC2
fCPU
Clock Detection Function
fOSC2
fSFOSC
fCPU
26/171
CSSIE bit has been previously set.
These two bits are described in the SICSR register
description.
6.4.4 Low Power Modes
Mode
WAIT
HALT
Description
No effect on SI. CSS and AVD interrupts
cause the device to exit from Wait mode.
The SICSR register is frozen.
The CSS (including the safe oscillator) is
disabled until HALT mode is exited. The
previous CSS configuration resumes when
the MCU is woken up by an interrupt with
“exit from HALT mode” capability or from
the counter reset value when the MCU is
woken up by a RESET.
6.4.4.1 Interrupts
The CSS or AVD interrupt events generate an interrupt if the corresponding Enable Control Bit
(CSSIE or AVDIE) is set and the interrupt mask in
the CC register is reset (RIM instruction).
Interrupt Event
Enable
Event
Control
Flag
Bit
CSS event detection
(safe oscillator acti- CSSD
vated as main clock)
AVD event
AVDF
Exit
from
Wait
Exit
from
Halt
CSSIE
Yes
No
AVDIE
Yes
No
ST72260G, ST72262G, ST72264G
SYSTEM INTEGRITY MANAGEMENT (Cont’d)
6.4.5 Register Description
SYSTEM INTEGRITY (SI) CONTROL/STATUS REGISTER (SICSR)
Read /Write
bit set). It is set and cleared by software.
0: Clock security system interrupt disabled
Reset Value: 000x 000x (00h)
1: Clock security system interrupt enabled
When the CSS is disabled by OPTION BYTE, the
7
0
CSSIE bit has no effect.
0
AVD
IE
AVD
F
LVD
RF
CSS
IE
0
CSS WDG
D
RF
Bit 7 = Reserved, always read as 0.
Bit 6 = AVDIE Voltage Detector interrupt enable
This bit is set and cleared by software. It enables
an interrupt to be generated when the AVDF flag
changes (toggles). The pending interrupt information is automatically cleared when software enters
the AVD interrupt routine.
0: AVD interrupt disabled
1: AVD interrupt enabled
Bit 5 = AVDF Voltage Detector flag
This read-only bit is set and cleared by hardware.
If the AVDIE bit is set, an interrupt request is generated when the AVDF bit changes value.
0: VDD over VIT+(AVD) threshold
1: VDD under VIT-(AVD) threshold
Bit 1 = CSSD Clock security system detection
This bit indicates that the safe oscillator of the
Clock Security System block has been selected by
hardware due to a disturbance on the main clock
signal (fOSC). It is set by hardware and cleared by
reading the SICSR register when the original oscillator recovers.
0: Safe oscillator is not active
1: Safe oscillator has been activated
When the CSS is disabled by OPTION BYTE, the
CSSD bit value is forced to 0.
Bit 0 = WDGRF Watchdog reset flag
This bit indicates that the last Reset was generated by the Watchdog peripheral. It is set by hardware (watchdog reset) and cleared by software
(writing zero) or an LVD Reset (to ensure a stable
cleared state of the WDGRF flag when CPU
starts).
Combined with the LVDRF flag information, the
flag description is given by the following table.
Bit 4 = LVDRF LVD reset flag
This bit indicates that the last Reset was generated by the LVD block. It is set by hardware (LVD reset) and cleared by software (writing zero). See
WDGRF flag description for more details. When
the LVD is disabled by OPTION BYTE, the LVDRF
bit value is undefined.
Bit 3 = Reserved, must be kept cleared.
Bit 2 = CSSIE Clock security syst interrupt enable
This bit enables the interrupt when a disturbance
is detected by the Clock Security System (CSSD
.
Address
(Hex.)
Register
Label
0025h
SICSR
Reset Value
RESET Sources
LVDRF
WDGRF
External RESET pin
Watchdog
LVD
0
0
1
0
1
X
Application Notes
The LVDRF flag is not cleared when another RESET type occurs (external or watchdog), the
LVDRF flag remains set to keep trace of the original failure. In this case, a watchdog reset can be
detected by software while an external reset can
not.
7
6
5
4
3
2
1
0
0
AVDIE
0
AVDF
0
LVDRF
x
0
CSSIE
0
CSSD
0
WDGRF
x
27/171
ST72260G, ST72262G, ST72264G
7 INTERRUPTS
7.1 INTRODUCTION
The ST7 enhanced interrupt management provides the following features:
■ Hardware interrupts
■ Software interrupt (TRAP)
■ Nested or concurrent interrupt management
with flexible interrupt priority and level
management:
– Up to 4 software programmable nesting levels
– Up to 16 interrupt vectors fixed by hardware
– 2 non-maskable events: RESET and TRAP
This interrupt management is based on:
– Bit 5 and bit 3 of the CPU CC register (I1:0),
– Interrupt software priority registers (ISPRx),
– Fixed interrupt vector addresses located at the
high addresses of the memory map (FFE0h to
FFFFh) sorted by hardware priority order.
This enhanced interrupt controller guarantees full
upward compatibility with the standard (not nested) ST7 interrupt controller.
When an interrupt request has to be serviced:
– Normal processing is suspended at the end of
the current instruction execution.
– The PC, X, A and CC registers are saved onto
the stack.
– I1 and I0 bits of CC register are set according to
the corresponding values in the ISPRx registers
of the serviced interrupt vector.
– The PC is then loaded with the interrupt vector of
the interrupt to service and the first instruction of
the interrupt service routine is fetched (refer to
“Interrupt Mapping” table for vector addresses).
The interrupt service routine should end with the
IRET instruction which causes the contents of the
saved registers to be recovered from the stack.
Note: As a consequence of the IRET instruction,
the I1 and I0 bits will be restored from the stack
and the program in the previous level will resume.
Table 4. Interrupt Software Priority Levels
Interrupt software priority
Level 0 (main)
Level 1
Level 2
Level 3 (= interrupt disable)
7.2 MASKING AND PROCESSING FLOW
The interrupt masking is managed by the I1 and I0
bits of the CC register and the ISPRx registers
which give the interrupt software priority level of
each interrupt vector (see Table 4). The processing flow is shown in Figure 17
Level
Low
I1
1
0
0
1
High
Figure 17. Interrupt Processing Flowchart
N
FETCH NEXT
INSTRUCTION
Y
“IRET”
N
RESTORE PC, X, A, CC
FROM STACK
EXECUTE
INSTRUCTION
Y
Interrupt has the same or a
lower software priority
than current one
THE INTERRUPT
STAYS PENDING
I1:0
Interrupt has a higher
software priority
than current one
PENDING
INTERRUPT
RESET
STACK PC, X, A, CC
LOAD I1:0 FROM INTERRUPT SW REG.
LOAD PC FROM INTERRUPT VECTOR
28/171
I0
0
1
0
1
ST72260G, ST72262G, ST72264G
INTERRUPTS (Cont’d)
Servicing Pending Interrupts
As several interrupts can be pending at the same
time, the interrupt to be taken into account is determined by the following two-step process:
– the highest software priority interrupt is serviced,
– if several interrupts have the same software priority then the interrupt with the highest hardware
priority is serviced first.
Figure 18 describes this decision process.
Figure 18. Priority Decision Process
PENDING
INTERRUPTS
Same
SOFTWARE
PRIORITY
Different
HIGHEST SOFTWARE
PRIORITY SERVICED
HIGHEST HARDWARE
PRIORITY SERVICED
When an interrupt request is not serviced immediately, it is latched and then processed when its
software priority combined with the hardware priority becomes the highest one.
Note 1: The hardware priority is exclusive while
the software one is not. This allows the previous
process to succeed with only one interrupt.
Note 2: RESET and TRAP are non-maskable and
they can be considered as having the highest software priority in the decision process.
Different Interrupt Vector Sources
Two interrupt source types are managed by the
ST7 interrupt controller: the non-maskable type
(RESET and TRAP) and the maskable type (external or from internal peripherals).
Non-Maskable Sources
These sources are processed regardless of the
state of the I1 and I0 bits of the CC register (see
Figure 17). After stacking the PC, X, A and CC
registers (except for RESET), the corresponding
vector is loaded in the PC register and the I1 and
I0 bits of the CC are set to disable interrupts (level
3). These sources allow the processor to exit
HALT mode.
■ TRAP (Non Maskable Software Interrupt)
This software interrupt is serviced when the TRAP
instruction is executed. It will be serviced according to the flowchart on Figure 17 as a TLI.
■ RESET
The RESET source has the highest priority in the
ST7. This means that the first current routine has
the highest software priority (level 3) and the highest hardware priority.
See the RESET chapter for more details.
Maskable Sources
Maskable interrupt vector sources can be serviced
if the corresponding interrupt is enabled and if its
own interrupt software priority (in ISPRx registers)
is higher than the one currently being serviced (I1
and I0 in CC register). If any of these two conditions is false, the interrupt is latched and thus remains pending.
■ External Interrupts
External interrupts allow the processor to exit from
HALT low power mode.
External interrupt sensitivity is software selectable
through the Miscellaneous registers (MISCRx).
External interrupt triggered on edge will be latched
and the interrupt request automatically cleared
upon entering the interrupt service routine.
If several input pins of a group connected to the
same interrupt vector request an interrupt simultaneously, the interrupt vector will be serviced. Software can read the pin levels to identify which
pin(s) are the source of the interrupt.
If several input pins are selected simultaneously
as interrupt source, these are logically NANDed.
For this reason if one of the interrupt pins is tied
low, it masks the other ones.
■ Peripheral Interrupts
Usually the peripheral interrupts cause the MCU to
exit from HALT mode except those mentioned in
the “Interrupt Mapping” table.
A peripheral interrupt occurs when a specific flag
is set in the peripheral status registers and if the
corresponding enable bit is set in the peripheral
control register.
The general sequence for clearing an interrupt is
based on an access to the status register followed
by a read or write to an associated register.
Note: The clearing sequence resets the internal
latch. A pending interrupt (i.e. waiting for being
serviced) will therefore be lost if the clear sequence is executed.
29/171
ST72260G, ST72262G, ST72264G
INTERRUPTS (Cont’d)
7.3 INTERRUPTS AND LOW POWER MODES
7.4 CONCURRENT & NESTED MANAGEMENT
All interrupts allow the processor to exit the WAIT
low power mode. On the contrary, only external
and other specified interrupts allow the processor
to exit the HALT modes (see column “Exit from
HALT” in “Interrupt Mapping” table). When several
pending interrupts are present while exiting HALT
mode, the first one serviced can only be an interrupt with exit from HALT mode capability and it is
selected through the same decision process
shown in Figure 18.
Note: If an interrupt, that is not able to Exit from
HALT mode, is pending with the highest priority
when exiting HALT mode, this interrupt is serviced
after the first one serviced.
The following Figure 19 and Figure 20 show two
different interrupt management modes. The first is
called concurrent mode and does not allow an interrupt to be interrupted, unlike the nested mode in
Figure 20. The interrupt hardware priority is given
in this order from the lowest to the highest: MAIN,
IT4, IT3, IT2, IT1, IT0. The software priority is given for each interrupt.
Warning: A stack overflow may occur without notifying the software of the failure.
Note: TLI (Top Level Interrupt) is not available in
this product.
IT0
TLI
IT3
IT4
IT1
SOFTWARE
PRIORITY
LEVEL
TLI
IT0
IT1
IT1
IT2
IT3
I1
I0
3
1 1
3
1 1
3
1 1
3
1 1
3
1 1
3
1 1
USED STACK = 10 BYTES
HARDWARE PRIORITY
IT2
Figure 19. Concurrent Interrupt Management
RIM
IT4
MAIN
MAIN
11 / 10
3/0
10
IT0
TLI
IT3
IT4
IT1
TLI
IT0
IT1
IT1
IT2
IT2
IT3
I1
I0
3
1 1
3
1 1
2
0 0
1
0 1
3
1 1
3
1 1
RIM
IT4
MAIN
11 / 10
30/171
SOFTWARE
PRIORITY
LEVEL
IT4
MAIN
10
3/0
USED STACK = 20 BYTES
HARDWARE PRIORITY
IT2
Figure 20. Nested Interrupt Management
ST72260G, ST72262G, ST72264G
INTERRUPTS (Cont’d)
7.5 INTERRUPT REGISTER DESCRIPTION
INTERRUPT SOFTWARE PRIORITY REGISTERS (ISPRX)
Read/Write (bits 7:4 of ISPR3 are read only)
Reset Value: 1111 1111 (FFh)
CPU CC REGISTER INTERRUPT BITS
Read /Write
Reset Value: 111x 1010 (xAh)
7
1
7
0
1
I1
H
I0
N
Z
C
Bit 5, 3 = I1, I0 Software Interrupt Priority
These two bits indicate the current interrupt software priority.
Interrupt Software Priority
Level 0 (main)
Level 1
Level 2
Level 3 (= interrupt disable*)
Level
Low
High
I1
1
0
0
1
I0
0
1
0
1
These two bits are set/cleared by hardware when
entering in interrupt. The loaded value is given by
the corresponding bits in the interrupt software priority registers (ISPRx).
They can be also set/cleared by software with the
RIM, SIM, HALT, WFI, IRET and PUSH/POP instructions (see “Interrupt Dedicated Instruction
Set” table).
*Note: TRAP and RESET events are non maskable sources and can interrupt a level 3 program.
0
ISPR0
I1_3
I0_3
I1_2
I0_2
I1_1
I0_1
I1_0
I0_0
ISPR1
I1_7
I0_7
I1_6
I0_6
I1_5
I0_5
I1_4
I0_4
ISPR2
I1_11 I0_11 I1_10 I0_10 I1_9
I0_9
I1_8
I0_8
ISPR3
1
1
1
1
I1_13 I0_13 I1_12 I0_12
These four registers contain the interrupt software
priority of each interrupt vector.
– Each interrupt vector (except RESET and TRAP)
has corresponding bits in these registers where
its own software priority is stored. This correspondance is shown in the following table.
Vector Address
ISPRx Bits
FFFBh-FFFAh
FFF9h-FFF8h
...
FFE1h-FFE0h
ei0
ei1
...
Not used
– Each I1_x and I0_x bit value in the ISPRx registers has the same meaning as the I1 and I0 bits
in the CC register.
– Level 0 can not be written (I1_x=1, I0_x=0). In
this case, the previously stored value is kept. (example: previous=CFh, write=64h, result=44h)
The RESET and TRAP vectors have no software
priorities. When one is serviced, the I1 and I0 bits
of the CC register are both set.
Caution: If the I1_x and I0_x bits are modified
while the interrupt x is executed the following behaviour has to be considered: If the interrupt x is
still pending (new interrupt or flag not cleared) and
the new software priority is higher than the previous one, the interrupt x is re-entered. Otherwise,
the software priority stays unchanged up to the
next interrupt request (after the IRET of the interrupt x).
31/171
ST72260G, ST72262G, ST72264G
Table 5. Interrupt Mapping
Source
Block
N°
RESET
TRAP
0
ei0
Register
Label
Description
Priority
Order
Reset
Exit
from
HALT
Address
Vector
yes
FFFEh-FFFFh
no
FFFCh-FFFDh
Highest
Priority
Software Interrupt
N/A
External Interrupt Port A7..0 (C5..01)
FFFAh-FFFBh
yes
1
1
ei1
2
CSS
Clock Filter Interrupt
External Interrupt Port B7..0 (C5..0 )
CRSR
no
FFF6h-FFF7h
3
SPI
SPI Peripheral Interrupts
SPISR
yes
FFF4h-FFF5h
4
TIMER A
5
MCC
6
TIMER B
7
AVD
TIMER A Peripheral Interrupts
Time base interrupt
TBSR
Not used
11
2
FFF2h-FFF3h
FFF0h-FFF1h
SICSR
Not used
SCI
no
yes
Auxiliary Voltage Detector interrupt
9
10
TASR
MCCSR
TIMER B Peripheral Interrupts
8
I C Peripheral Interrupt
Not Used
13
Not Used
FFEEh-FFEFh
FFECh-FFEDh
FFE8h-FFE9h
2
I C
no
FFEAh-FFEBh
SCI Peripheral Interrupt
12
FFF8h-FFF9h
SCISR
no
I2CSRx
no
FFE6h-FFE7h
FFE4h-FFE5h
FFE2h-FFE3h
Lowest
Priority
FFE0h-FFE1h
Note 1. Configurable by option byte.
Table 6. Nested Interrupts Register Map and Reset Values
Address
(Hex.)
Register
Label
7
6
5
4
SPI
001Ch
ISPR0
Reset Value
I1_3
1
ISPR1
Reset Value
I0_3
1
I1_7
1
I1_2
1
I0_7
1
ISPR2
Reset Value
I1_11
1
I0_2
1
I1_6
1
I1_10
1
I1_1
1
I0_1
1
I0_6
1
I1_5
1
I0_5
1
Not Used
I0_10
1
I1_9
1
32/171
ISPR3
Reset Value
1
1
1
1
I1_13
1
I0_1
1
I0_0
1
TIMERA
I0_9
1
Not Used
001Fh
0
EI0
MCC
SCI
I0_11
1
1
EI1
TIMERB
I 2C
001Eh
2
CSS
AVD
001Dh
3
I0_13
1
I1_4
1
I0_4
1
Not Used
I1_8
1
I0_8
1
Not Used
I1_12
1
I0_12
1
ST72260G, ST72262G, ST72264G
8 POWER SAVING MODES
8.1 INTRODUCTION
8.2 SLOW MODE
To give a large measure of flexibility to the application in terms of power consumption, three main
power saving modes are implemented in the ST7
(see Figure 21).
After a RESET the normal operating mode is selected by default (RUN mode). This mode drives
the device (CPU and embedded peripherals) by
means of a master clock which is based on the
main oscillator frequency divided by 2 (fCPU).
From Run mode, the different power saving
modes may be selected by setting the relevant
register bits or by calling the specific ST7 software
instruction whose action depends on the oscillator
status.
This mode has two targets:
– To reduce power consumption by decreasing the
internal clock in the device,
– To adapt the internal clock frequency (fCPU) to
the available supply voltage.
SLOW mode is controlled by three bits in the
MISR1 register: the SMS bit which enables or disables Slow mode and two CPx bits which select
the internal slow frequency (fCPU).
In this mode, the oscillator frequency can be divided by 4, 8, 16 or 32 instead of 2 in normal operating mode. The CPU and peripherals are clocked at
this lower frequency.
Note: SLOW-WAIT mode is activated when enterring the WAIT mode while the device is already in
SLOW mode.
Figure 21. Power Saving Mode Transitions
High
Figure 22. SLOW Mode Clock Transitions
RUN
fOSC2/2
fOSC2/4
fOSC2
fCPU
SLOW
fOSC2
MISCR1
WAIT
SLOW WAIT
CP1:0
00
01
SMS
HALT
Low
POWER CONSUMPTION
NEW SLOW
FREQUENCY
REQUEST
NORMAL RUN MODE
REQUEST
33/171
ST72260G, ST72262G, ST72264G
POWER SAVING MODES (Cont’d)
8.3 WAIT MODE
WAIT mode places the MCU in a low power consumption mode by stopping the CPU.
This power saving mode is selected by calling the
“WFI” ST7 software instruction.
All peripherals remain active. During WAIT mode,
the I [1:0] bits in the CC register are forced to ‘10b’,
to enable all interrupts. All other registers and
memory remain unchanged. The MCU remains in
WAIT mode until an interrupt or Reset occurs,
whereupon the Program Counter branches to the
starting address of the interrupt or Reset service
routine.
The MCU will remain in WAIT mode until a Reset
or an Interrupt occurs, causing it to wake up.
Refer to Figure 23.
Figure 23. WAIT Mode Flowchart
WFI INSTRUCTION
OSCILLATOR
PERIPHERALS
CPU
I[1:0] BITS
ON
ON
OFF
0
N
RESET
Y
N
INTERRUPT
Y
OSCILLATOR
PERIPHERALS
CPU
I[1:0] BITS
ON
OFF
ON
1
4096 CPU CLOCK CYCLE
DELAY
OSCILLATOR
ON
PERIPHERALS ON
CPU
ON
XX 1)
I[1:0] BITS
FETCH RESET VECTOR
OR SERVICE INTERRUPT
Note:
1. Before servicing an interrupt, the CC register is
pushed on the stack. The I[1:0] bits in the CC register are set during the interrupt routine and
cleared when the CC register is popped.
34/171
ST72260G, ST72262G, ST72264G
8.4 ACTIVE-HALT AND HALT MODES
ACTIVE-HALT and HALT modes are the two lowest power consumption modes of the MCU. They
are both entered by executing the ‘HALT’ instruction. The decision to enter either in ACTIVE-HALT
or HALT mode is given by the MCC/RTC interrupt
enable flag (OIE bit in MCCSR register).
MCCSR
OIE bit
Power Saving Mode entered when HALT
instruction is executed
0
HALT mode
1
ACTIVE-HALT mode
8.4.1 ACTIVE-HALT MODE
ACTIVE-HALT mode is the lowest power consumption mode of the MCU with a real time clock
available. It is entered by executing the ‘HALT’ instruction when the OIE bit of the Main Clock Controller Status register (MCCSR) is set.
The MCU can exit ACTIVE-HALT mode on reception of either an MCC/RTC interrupt, a specific interrupt (see Table 5, “Interrupt Mapping,” on page
32) or a RESET. When exiting ACTIVE-HALT
mode by means of an interrupt, no 4096 CPU cycle delay occurs. The CPU resumes operation by
servicing the interrupt or by fetching the reset vector which woke it up (see Figure 25).
When entering ACTIVE-HALT mode, the I[1:0] bits
in the CC register are forced to ‘10b’ to enable interrupts. Therefore, if an interrupt is pending, the
MCU wakes up immediately.
In ACTIVE-HALT mode, only the main oscillator
and its associated counter (MCC/RTC) are running to keep a wake-up time base. All other peripherals are not clocked except those which get their
clock supply from another clock generator (such
as external or auxiliary oscillator).
The safeguard against staying locked in ACTIVEHALT mode is provided by the oscillator interrupt.
Note: As soon as the interrupt capability of one of
the oscillators is selected (MCCSR.OIE bit set),
entering ACTIVE-HALT mode while the Watchdog
is active does not generate a RESET.
This means that the device cannot spend more
than a defined delay in this power saving mode.
Figure 24. ACTIVE-HALT Timing Overview
RUN
ACTIVE
HALT
HALT
INSTRUCTION
[MCCSR.OIE=1]
4096 CPU
CYCLE DELAY 1)
RESET
OR
INTERRUPT
RUN
FETCH
VECTOR
Figure 25. ACTIVE-HALT Mode Flowchart
HALT INSTRUCTION
(MCCSR.OIE=1)
OSCILLATOR
ON
PERIPHERALS 2) OFF
CPU
OFF
I[1:0] BITS
10
N
RESET
N
Y
INTERRUPT 3)
Y
OSCILLATOR
PERIPHERALS
CPU
I[1:0] BITS
ON
OFF
ON
XX 4)
4096 CPU CLOCK
CYCLE DELAY
OSCILLATOR
PERIPHERALS
CPU
I[1:0] BITS
ON
ON
ON
XX 4)
FETCH RESET VECTOR
OR SERVICE INTERRUPT
Notes:
1. This delay occurs only if the MCU exits ACTIVEHALT mode by means of a RESET.
2. Peripheral clocked with an external clock source
can still be active.
3. Only the MCC/RTC interrupt and some specific
interrupts can exit the MCU from ACTIVE-HALT
mode (such as external interrupt). Refer to Table
5, “Interrupt Mapping,” on page 32 for more details.
4. Before servicing an interrupt, the CC register is
pushed on the stack. The I[1:0] bits of the CC register are set to the current software priority level of
the interrupt routine and restored when the CC
register is popped.
35/171
ST72260G, ST72262G, ST72264G
POWER SAVING MODES (Cont’d)
8.5 HALT MODE
Figure 27. HALT Mode Flowchart
The HALT mode is the lowest power consumption
mode of the MCU. It is entered by executing the
ST7 HALT instruction (see Figure 27).
The MCU can exit HALT mode on reception of either a specific interrupt (see Table 5, “Interrupt
Mapping,” on page 32) or a RESET. When exiting
HALT mode by means of a RESET or an interrupt,
the oscillator is immediately turned on and the
4096 CPU cycle delay is used to stabilize the oscillator. After the start up delay, the CPU resumes
operation by servicing the interrupt or by fetching
the reset vector which woke it up (see Figure 26).
When entering HALT mode, the I[1:0] bits in the
CC register are forced to ‘10b’ to enable interrupts.
Therefore, if an interrupt is pending, the MCU
wakes immediately.
In the HALT mode the main oscillator is turned off
causing all internal processing to be stopped, including the operation of the on-chip peripherals.
All peripherals are not clocked except the ones
which get their clock supply from another clock
generator (such as an external or auxiliary oscillator).
The compatibility of Watchdog operation with
HALT mode is configured by the “WDGHALT” option bit of the option byte. The HALT instruction
when executed while the Watchdog system is enabled, can generate a Watchdog RESET (see
Section 15.1 "OPTION BYTES" on page 157 for
more details).
Figure 26. HALT Mode Timing Overview
RUN
HALT
4096 CPU CYCLE
DELAY
36/171
ENABLE
WDGHALT 1)
WATCHDOG
DISABLE
0
1
WATCHDOG
RESET
OSCILLATOR
OFF
PERIPHERALS 2) OFF
CPU
OFF
0
I[1:0] BITS
N
RESET
N
Y
INTERRUPT 3)
Y
OSCILLATOR
PERIPHERALS
CPU
I[1:0] BITS
ON
OFF
ON
1
4096 CPU CLOCK CYCLE
DELAY
OSCILLATOR
PERIPHERALS
CPU
I[1:0] BITS
ON
ON
ON
XX 4)
RUN
HALT
INSTRUCTION
RESET
OR
INTERRUPT
HALT INSTRUCTION
FETCH
VECTOR
FETCH RESET VECTOR
OR SERVICE INTERRUPT
Notes:
1. WDGHALT is an option bit. See option byte section for more details.
2. Peripheral clocked with an external clock source
can still be active.
3. Only some specific interrupts can exit the MCU
from HALT mode (such as external interrupt). Refer to Table 5, “Interrupt Mapping,” on page 32 for
more details.
4. Before servicing an interrupt, the CC register is
pushed on the stack. The I[1:0] bits in the CC register are set during the interrupt routine and
cleared when the CC register is popped.
ST72260G, ST72262G, ST72264G
POWER SAVING MODES (Cont’d)
8.5.0.1 Halt Mode Recommendations
– Make sure that an external event is available to
wake up the microcontroller from Halt mode.
– When using an external interrupt to wake up the
microcontroller, reinitialize the corresponding I/O
as “Input Pull-up with Interrupt” before executing
the HALT instruction. The main reason for this is
that the I/O may be wrongly configured due to external interference or by an unforeseen logical
condition.
– For the same reason, reinitialize the level sensitiveness of each external interrupt as a precautionary measure.
– The opcode for the HALT instruction is 0x8E. To
avoid an unexpected HALT instruction due to a
program counter failure, it is advised to clear all
occurrences of the data value 0x8E from memory. For example, avoid defining a constant in
ROM with the value 0x8E.
– As the HALT instruction clears the interrupt mask
in the CC register to allow interrupts, the user
may choose to clear all pending interrupt bits before executing the HALT instruction. This avoids
entering other peripheral interrupt routines after
executing the external interrupt routine corresponding to the wake-up event (reset or external
interrupt).
37/171
ST72260G, ST72262G, ST72264G
9 I/O PORTS
9.1 INTRODUCTION
The I/O ports allow data transfer. An I/O port can
contain up to 8 pins. Each pin can be programmed
independently either as a digital input or digital
output. In addition, specific pins may have several
other functions. These functions can include external interrupt, alternate signal input/output for onchip peripherals or analog input.
9.2 FUNCTIONAL DESCRIPTION
A Data Register (DR) and a Data Direction Register (DDR) are always associated with each port.
The Option Register (OR), which allows input/output options, may or may not be implemented. The
following description takes into account the OR
register. Refer to the Port Configuration table for
device specific information.
An I/O pin is programmed using the corresponding
bits in the DDR, DR and OR registers: bit x corresponding to pin x of the port.
Figure 28 shows the generic I/O block diagram.
9.2.1 Input Modes
Clearing the DDRx bit selects input mode. In this
mode, reading its DR bit returns the digital value
from that I/O pin.
If an OR bit is available, different input modes can
be configured by software: floating or pull-up. Refer to I/O Port Implementation section for configuration.
Notes:
1. Writing to the DR modifies the latch value but
does not change the state of the input pin.
2. Do not use read/modify/write instructions
(BSET/BRES) to modify the DR register.
External Interrupt Function
Depending on the device, setting the ORx bit while
in input mode can configure an I/O as an input with
interrupt. In this configuration, a signal edge or level input on the I/O generates an interrupt request
via the corresponding interrupt vector (eix).
Falling or rising edge sensitivity is programmed independently for each interrupt vector. The External Interrupt Control Register (EICR) or the Miscellaneous Register controls this sensitivity, depending on the device.
A device may have up to 7 external interrupts.
Several pins may be tied to one external interrupt
vector. Refer to Pin Description to see which ports
have external interrupts.
38/171
If several I/O interrupt pins on the same interrupt
vector are selected simultaneously, they are logically combined. For this reason if one of the interrupt pins is tied low, it may mask the others.
External interrupts are hardware interrupts. Fetching the corresponding interrupt vector automatically clears the request latch. Modifying the sensitivity
bits will clear any pending interrupts.
9.2.2 Output Modes
Setting the DDRx bit selects output mode. Writing
to the DR bits applies a digital value to the I/O
through the latch. Reading the DR bits returns the
previously stored value.
If an OR bit is available, different output modes
can be selected by software: push-pull or opendrain. Refer to I/O Port Implementation section for
configuration.
DR Value and Output Pin Status
DR
Push-Pull
Open-Drain
0
1
VOL
VOH
VOL
Floating
9.2.3 Alternate Functions
Many ST7s I/Os have one or more alternate functions. These may include output signals from, or
input signals to, on-chip peripherals. The Device
Pin Description table describes which peripheral
signals can be input/output to which ports.
A signal coming from an on-chip peripheral can be
output on an I/O. To do this, enable the on-chip
peripheral as an output (enable bit in the peripheral’s control register). The peripheral configures the
I/O as an output and takes priority over standard I/
O programming. The I/O’s state is readable by addressing the corresponding I/O data register.
Configuring an I/O as floating enables alternate
function input. It is not recommended to configure
an I/O as pull-up as this will increase current consumption. Before using an I/O as an alternate input, configure it without interrupt. Otherwise spurious interrupts can occur.
Configure an I/O as input floating for an on-chip
peripheral signal which can be input and output.
Caution:
I/Os which can be configured as both an analog
and digital alternate function need special attention. The user must control the peripherals so that
the signals do not arrive at the same time on the
same pin. If an external clock is used, only the
clock alternate function should be employed on
that I/O pin and not the other alternate function.
ST72260G, ST72262G, ST72264G
I/O PORTS (Cont’d)
Figure 28. I/O Port General Block Diagram
ALTERNATE
OUTPUT
REGISTER
ACCESS
From on-chip peripheral
1
VDD
0
P-BUFFER
(see table below)
ALTERNATE
ENABLE
BIT
PULL-UP
(see table below)
DR
VDD
DDR
PULL-UP
CONDITION
DATA BUS
OR
PAD
If implemented
OR SEL
N-BUFFER
DIODES
(see table below)
DDR SEL
DR SEL
ANALOG
INPUT
CMOS
SCHMITT
TRIGGER
1
0
EXTERNAL
INTERRUPT
REQUEST (eix)
ALTERNATE
INPUT
Combinational
Logic
SENSITIVITY
SELECTION
To on-chip peripheral
FROM
OTHER
BITS Note: Refer to the Port Configuration
table for device specific information.
Table 7. I/O Port Mode Options
Configuration Mode
Input
Output
Floating with/without Interrupt
Pull-up with/without Interrupt
Push-pull
Open Drain (logic level)
True Open Drain
Legend: NI - not implemented
Off - implemented not activated
On - implemented and activated
Pull-Up
P-Buffer
Off
On
Off
Off
NI
On
Off
NI
Diodes
to VDD
On
to VSS
On
NI (see note)
Note: The diode to VDD is not implemented in the
true open drain pads. A local protection between
the pad and VOL is implemented to protect the device against positive stress.
39/171
ST72260G, ST72262G, ST72264G
I/O PORTS (Cont’d)
Table 8. I/O Configurations
Hardware Configuration
VDD
RPU
DR REGISTER ACCESS
NOTE 3
PULL-UP
CONDITION
DR
REGISTER
PAD
W
DATA BUS
INPUT 1)
R
ALTERNATE INPUT
To on-chip peripheral
FROM
OTHER
PINS
EXTERNAL INTERRUPT
SOURCE (eix)
INTERRUPT COMBINATIONAL POLARITY
LOGIC SELECTION
CONDITION
PUSH-PULL OUTPUT 2)
OPEN-DRAIN OUTPUT 2)
ANALOG INPUT
VDD
NOTE 3
DR REGISTER ACCESS
RPU
PAD
DR
REGISTER
VDD
R/W
DATA BUS
DR REGISTER ACCESS
NOTE 3
RPU
PAD
DR
REGISTER
ALTERNATE
ENABLE
BIT
R/W
DATA BUS
ALTERNATE
OUTPUT
From on-chip peripheral
Notes:
1. When the I/O port is in input configuration and the associated alternate function is enabled as an output,
reading the DR register will read the alternate function output status.
2. When the I/O port is in output configuration and the associated alternate function is enabled as an input,
the alternate function reads the pin status given by the DR register content.
3. For true open drain, these elements are not implemented.
40/171
ST72260G, ST72262G, ST72264G
I/O PORTS (Cont’d)
Analog alternate function
Configure the I/O as floating input to use an ADC
input. The analog multiplexer (controlled by the
ADC registers) switches the analog voltage
present on the selected pin to the common analog
rail, connected to the ADC input.
Analog Recommendations
Do not change the voltage level or loading on any
I/O while conversion is in progress. Do not have
clocking pins located close to a selected analog
pin.
WARNING: The analog input voltage level must
be within the limits stated in the absolute maximum ratings.
9.3 I/O PORT IMPLEMENTATION
The hardware implementation on each I/O port depends on the settings in the DDR and OR registers
and specific I/O port features such as ADC input or
open drain.
Switching these I/O ports from one state to another should be done in a sequence that prevents unwanted side effects. Recommended safe transitions are illustrated in Figure 29. Other transitions
are potentially risky and should be avoided, since
they may present unwanted side-effects such as
spurious interrupt generation.
9.4 UNUSED I/O PINS
Unused I/O pins must be connected to fixed voltage levels. Refer to Section 13.8.
9.5 LOW POWER MODES
Mode
WAIT
HALT
Description
No effect on I/O ports. External interrupts
cause the device to exit from WAIT mode.
No effect on I/O ports. External interrupts
cause the device to exit from HALT mode.
9.6 INTERRUPTS
The external interrupt event generates an interrupt
if the corresponding configuration is selected with
DDR and OR registers and if the I bit in the CC
register is cleared (RIM instruction).
Interrupt Event
External interrupt on
selected external
event
Enable
Event
Control
Flag
Bit
-
DDRx
ORx
Exit
from
Wait
Exit
from
Halt
Yes
Yes
Figure 29. Interrupt I/O Port State Transitions
01
00
10
11
INPUT
floating/pull-up
interrupt
INPUT
floating
(reset state)
OUTPUT
open-drain
OUTPUT
push-pull
XX
= DDR, OR
41/171
ST72260G, ST72262G, ST72264G
I/O PORTS (Cont’d)
9.7 DEVICE-SPECIFIC I/O PORT CONFIGURATION
The I/O port register configurations are summarised as follows.
Interrupt Ports
PA7, PA5, PA3:0, PB7:0, PC5:0 (with pull-up)
MODE
floating input
pull-up interrupt input
open drain output
push-pull output
DDR
OR
0
0
1
1
0
1
0
1
True Open Drain Interrupt Ports
PA6, PA4 (without pull-up)
MODE
floating input
floating interrupt input
open drain (high sink ports)
DDR
OR
0
0
1
0
1
X
Table 9. Port Configuration
Input (DDR = 0)
Port
Port A
Port B
Port C
42/171
Output (DDR = 1)
Pin Name
PA7
PA6
PA5
PA4
PA3:0
PB7:0
PC5:0
OR = 0
OR = 1
floating
floating
floating
floating
floating
floating
floating
pull-up interrupt
floating interrupt
pull-up interrupt
floating interrupt
pull-up interrupt
pull-up interrupt
pull-up interrupt
OR = 0
OR = 1
open drain
push-pull
true open-drain
open drain
push-pull
true open-drain
open drain
push-pull
open drain
push-pull
open drain
push-pull
High-Sink
Yes
No
ST72260G, ST72262G, ST72264G
I/O PORTS (Cont’d)
Bits 7:0 = DD[7:0] Data direction register 8 bits.
The DDR register gives the input/output direction
configuration of the pins. Each bit is set and
cleared by software.
0: Input mode
1: Output mode
9.8 I/O PORT REGISTER DESCRIPTION
DATA REGISTER (DR)
Port x Data Register
PxDR with x = A, B or C.
Read /Write
Reset Value: 0000 0000 (00h)
7
D7
0
D6
D5
D4
D3
D2
D1
D0
Bits 7:0 = D[7:0] Data register 8 bits.
The DR register has a specific behaviour according to the selected input/output configuration. Writing the DR register is always taken into account
even if the pin is configured as an input; this allows
always having the expected level on the pin when
toggling to output mode. Reading the DR register
returns either the DR register latch content (pin
configured as output) or the digital value applied to
the I/O pin (pin configured as input).
DATA DIRECTION REGISTER (DDR)
Port x Data Direction Register
PxDDR with x = A, B or C.
Read /Write
Reset Value: 0000 0000 (00h)
7
DD7
0
DD6
DD5
DD4
DD3
DD2
DD1
DD0
OPTION REGISTER (OR)
Port x Option Register
PxOR with x = A, B or C.
Read /Write
Reset Value: 0000 0000 (00h)
7
O7
0
O6
O5
O4
O3
O2
O1
O0
Bits 7:0 = O[7:0] Option register 8 bits.
For specific I/O pins, this register is not implemented. In this case the DDR register is enough to select the I/O pin configuration.
The OR register allows to distinguish: in input
mode if the pull-up with interrupt capability or the
basic pull-up configuration is selected, in output
mode if the push-pull or open drain configuration is
selected.
Each bit is set and cleared by software.
Input mode:
0: Floating input
1: Pull-up input with or without interrupt
Output mode:
0: Output open drain (with P-Buffer unactivated)
1: Output push-pull (when available)
43/171
ST72260G, ST72262G, ST72264G
I/O PORTS (Cont’d)
Table 10. I/O Port Register Map and Reset Values
Address
(Hex.)
Register
Label
Reset Value
of all I/O port registers
0000h
PCDR
0001h
PCDDR
0002h
PCOR
0004h
PBDR
0005h
PBDDR
0006h
PBOR
0008h
PADR
0009h
PADDR
000Ah
PAOR
44/171
7
6
5
4
3
2
1
0
0
0
0
0
0
0
0
0
MSB
LSB
MSB
LSB
MSB
LSB
ST72260G, ST72262G, ST72264G
10 MISCELLANEOUS REGISTERS
The miscellaneous registers allow control over
several different features such as the external interrupts or the I/O alternate functions.
Figure 30. Ext. Interrupt Sensitivity (EXTIT=0)
MISCR1
PA7
10.1 I/O PORT INTERRUPT SENSITIVITY
The external interrupt sensitivity is controlled by
the ISxx bits of the Miscellaneous register and the
OPTION BYTE. This control allows you to have
two fully independent external interrupt source
sensitivities with configurable sources (using the
EXTIT option bit) as shown in Figure 30 and Figure 31.
Each external interrupt source can be generated
on four different events on the pin:
■ Falling edge
■ Rising edge
■ Falling and rising edge
■ Falling edge and low level
To guarantee correct functionality, the sensitivity
bits in the MISCR1 register must be modified only
when the I[1:0] bits in the CC register are set to 1
(interrupt masked). See Section 9.8 "I/O PORT
REGISTER DESCRIPTION" on page 43 and Section 10.3 "MISCELLANEOUS REGISTER DESCRIPTION" on page 46 for more details on the
programming.
PA0
PC5
ei0
INTERRUPT
SOURCE
IS00
IS01
SENSITIVITY
CONTROL
PC0
MISCR1
PB7
ei1
INTERRUPT
SOURCE
IS10
IS11
SENSITIVITY
CONTROL
PB0
Figure 31. Ext. Interrupt Sensitivity (EXTIT=1)
MISCR1
PA7
ei0
INTERRUPT
SOURCE
IS00
IS01
SENSITIVITY
CONTROL
PA0
10.2 I/O PORT ALTERNATE FUNCTIONS
The MISCR registers manage four I/O port miscellaneous alternate functions:
■ Main clock signal (fCPU) output on PC2
■ SPI pin configuration:
– SS pin internal control to use the PB7 I/O port
function while the SPI is active.
– Master output capability on the MOSI pin
(PB4) deactivated while the SPI is active.
– Slave output capability on the MISO pin (PB5)
deactivated while the SPI is active.
These functions are described in detail in the Section 10.3 "MISCELLANEOUS REGISTER DESCRIPTION" on page 46.
MISCR1
PB7
PB0
PC5
ei1
INTERRUPT
SOURCE
IS10
IS11
SENSITIVITY
CONTROL
PC0
45/171
ST72260G, ST72262G, ST72264G
MISCELLANEOUS REGISTERS (Cont’d)
10.3 MISCELLANEOUS REGISTER DESCRIPTION
Bits 2:1 = CP[1:0] CPU clock prescaler
These bits select the CPU clock prescaler which is
applied in the various slow modes. Their action is
conditioned by the setting of the SMS bit. These
two bits are set and cleared by software
MISCELLANEOUS REGISTER 1 (MISCR1)
Read /Write
Reset Value: 0000 0000 (00h)
7
0
IS11
IS10 MCO IS01
IS00
CP1
CP0
SMS
Bits 7:6 = IS1[1:0] ei1 sensitivity
The interrupt sensitivity, defined using the IS1[1:0]
bits, is applied to the ei1 external interrupts. These
two bits can be written only when the I[1:0] bits in
the CC register are set to 1 (interrupt masked).
ei1: Port B (C optional)
External Interrupt Sensitivity
IS11 IS10
Falling edge & low level
0
0
Rising edge only
0
1
Falling edge only
1
0
Rising and falling edge
1
1
Bit 5 = MCO Main clock out selection
This bit enables the MCO alternate function on the
PC2 I/O port. It is set and cleared by software.
0: MCO alternate function disabled (I/O pin free for
general-purpose I/O)
1: MCO alternate function enabled (fCPU on I/O
port)
Bits 4:3 = IS0[1:0] ei0 sensitivity
The interrupt sensitivity, defined using the IS0[1:0]
bits, is applied to the ei0 external interrupts. These
two bits can be written only when the I[1:0] bits inthe CC register are set to 1 (interrupt masked).
ei0: Port A (C optional)
External Interrupt Sensitivity
IS01 IS00
Falling edge & low level
0
0
Rising edge only
0
1
Falling edge only
1
0
Rising and falling edge
1
1
46/171
fCPU in SLOW mode
CP1
CP0
fOSC2 / 2
0
0
fOSC2 / 4
1
0
fOSC2 / 8
0
1
fOSC2 / 16
1
1
Bit 0 = SMS Slow mode select
This bit is set and cleared by software.
0: Normal mode. fCPU = fOSC2
1: Slow mode. fCPU is given by CP1, CP0
See low power consumption mode and MCC
chapters for more details.
ST72260G, ST72262G, ST72264G
MISCELLANEOUS REGISTERS (Cont’d)
MISCELLANEOUS REGISTER 2 (MISCR2)
Read /Write
Reset Value: 0000 0000 (00h)
7
0
0
0
0
0
MOD SOD
SSM
SSI
Caution: This register has been provided for compatibility with the ST72254 family only. The same
bits are available in the SPICSR register. New applications must use the SPICSR register. Do not
use both registers, this will cause the SPI to malfunction.
Bits 7:4 = Reserved always read as 0
Bits 3 = MOD SPI Master Output Disable
This bit is set and cleared by software. When set, it
disables the SPI Master (MOSI) output signal.
0: SPI Master Output enabled.
1: SPI Master Output disabled.
Bit 2 = SOD SPI Slave Output Disable
This bit is set and cleared by software. When set it
disable the SPI Slave (MISO) output signal.
0: SPI Slave Output enabled.
1: SPI Slave Output disabled.
Bit 1 = SSM SS mode selection
This bit is set and cleared by software.
0: Normal mode - the level of the SPI SS signal is
input from the external SS pin.
1: I/O mode, the level of the SPI SS signal is read
from the SSI bit.
Bit 0 = SSI SS internal mode
This bit replaces the SS pin of the SPI when the
SSM bit is set to 1. (see SPI description). It is set
and cleared by software.
Table 11. Miscellaneous Register Map and Reset Values
Address
(Hex.)
Register
Label
7
6
5
4
3
2
1
0
0020h
MISCR1
Reset Value
IS11
0
IS10
0
MCO
0
IS01
0
IS00
0
CP1
0
CP0
0
SMS
0
0040h
MISCR2
Reset Value
0
0
0
0
MOD
0
SOD
0
SSM
0
SSI
0
47/171
ST72260G, ST72262G, ST72264G
11 ON-CHIP PERIPHERALS
11.1 WATCHDOG TIMER (WDG)
11.1.1 Introduction
The Watchdog timer is used to detect the occurrence of a software fault, usually generated by external interference or by unforeseen logical conditions, which causes the application program to
abandon its normal sequence. The Watchdog circuit generates an MCU reset on expiry of a programmed time period, unless the program refreshes the counter’s contents before the T6 bit becomes cleared.
11.1.2 Main Features
■ Programmable free-running downcounter
■ Programmable reset
■ Reset (if watchdog activated) when the T6 bit
reaches zero
■ Optional
reset
on
HALT
instruction
(configurable by option byte)
■ Hardware Watchdog selectable by option byte
11.1.3 Functional Description
The counter value stored in the Watchdog Control
register (WDGCR bits T[6:0]), is decremented
every 16384 fOSC2 cycles (approx.), and the
length of the timeout period can be programmed
by the user in 64 increments.
If the watchdog is activated (the WDGA bit is set)
and when the 7-bit timer (bits T[6:0]) rolls over
from 40h to 3Fh (T6 becomes cleared), it initiates
a reset cycle pulling low the reset pin for typically
500ns.
The application program must write in the
WDGCR register at regular intervals during normal
operation to prevent an MCU reset. This downcounter is free-running: it counts down even if the
watchdog is disabled. The value to be stored in the
WDGCR register must be between FFh and C0h:
– The WDGA bit is set (watchdog enabled)
– The T6 bit is set to prevent generating an immediate reset
– The T[5:0] bits contain the number of increments
which represents the time delay before the
watchdog produces a reset (see Figure 33. Approximate Timeout Duration). The timing varies
between a minimum and a maximum value due
to the unknown status of the prescaler when writing to the WDGCR register (see Figure 34).
Following a reset, the watchdog is disabled. Once
activated it cannot be disabled, except by a reset.
The T6 bit can be used to generate a software reset (the WDGA bit is set and the T6 bit is cleared).
If the watchdog is activated, the HALT instruction
will generate a Reset.
Figure 32. Watchdog Block Diagram
RESET
fOSC2
MCC/RTC
WATCHDOG CONTROL REGISTER (WDGCR)
DIV 64
WDGA
T6
T5
T4
T3
T2
T1
6-BIT DOWNCOUNTER (CNT)
12-BIT MCC
RTC COUNTER
MSB
11
48/171
LSB
6 5
0
TB[1:0] bits
(MCCSR
Register)
WDG PRESCALER
DIV 4
T0
ST72260G, ST72262G, ST72264G
WATCHDOG TIMER (Cont’d)
11.1.4 How to Program the Watchdog Timeout
Figure 33 shows the linear relationship between
the 6-bit value to be loaded in the Watchdog Counter (CNT) and the resulting timeout duration in milliseconds. This can be used for a quick calculation
without taking the timing variations into account. If
more precision is needed, use the formulae in Figure 34.
Caution: When writing to the WDGCR register, always write 1 in the T6 bit to avoid generating an
immediate reset.
Figure 33. Approximate Timeout Duration
3F
38
CNT Value (hex.)
30
28
20
18
10
08
00
1.5
18
34
50
65
82
98
114
128
Watchdog timeout (ms) @ 8 MHz. fOSC2
49/171
ST72260G, ST72262G, ST72264G
WATCHDOG TIMER (Cont’d)
Figure 34. Exact Timeout Duration (tmin and tmax)
WHERE:
tmin0 = (LSB + 128) x 64 x tOSC2
tmax0 = 16384 x tOSC2
tOSC2 = 125ns if fOSC2=8 MHz
CNT = Value of T[5:0] bits in the WDGCR register (6 bits)
MSB and LSB are values from the table below depending on the timebase selected by the TB[1:0] bits
in the MCCSR register
TB1 Bit
TB0 Bit
(MCCSR Reg.) (MCCSR Reg.)
0
0
0
1
1
0
1
1
Selected MCCSR
Timebase
MSB
LSB
2ms
4ms
10ms
25ms
4
8
20
49
59
53
35
54
To calculate the minimum Watchdog Timeout (tmin):
IF CNT < MSB
------------4
THEN t min = t m in0 + 16384 × CNT × t osc2
CNT
ELSE t min = tm in0 + 16384 ×  CN T – 4---------------MSB


+ ( 192 + L SB ) × 64 ×
4CNT
----------------MSB
× tosc2
+ ( 192 + LSB ) × 64 ×
4CNT
----------------MS B
× to sc2
To calculate the maximum Watchdog Timeout (tmax):
IF CNT ≤ MSB
------------4
THEN t
max = t m ax0 + 16384 × CNT × t osc2
ELSE t
max
4CNT
= t
+ 16384 ×  C NT – ----------------m ax0

MSB


Note: In the above formulae, division results must be rounded down to the next integer value.
Example:
With 2ms timeout selected in MCCSR register
Value of T[5:0] Bits in
WDGCR Register (Hex.)
00
3F
50/171
Min. Watchdog
Timeout (ms)
tmin
1.496
128
Max. Watchdog
Timeout (ms)
tmax
2.048
128.552
ST72260G, ST72262G, ST72264G
WATCHDOG TIMER (Cont’d)
11.1.5 Low Power Modes
Mode
SLOW
WAIT
Description
No effect on Watchdog.
No effect on Watchdog.
OIE bit in
MCCSR
register
WDGHALT bit
in Option
Byte
0
0
0
1
1
x
HALT
No Watchdog reset is generated. The MCU enters Halt mode. The Watchdog counter is decremented once and then stops counting and is no longer
able to generate a watchdog reset until the MCU receives an external interrupt or a reset.
If an external interrupt is received, the Watchdog restarts counting after 256
or 4096 CPU clocks. If a reset is generated, the Watchdog is disabled (reset
state) unless Hardware Watchdog is selected by option byte. For application recommendations see Section 11.1.7 below.
A reset is generated.
No reset is generated. The MCU enters Active Halt mode. The Watchdog
counter is not decremented. It stop counting. When the MCU receives an
oscillator interrupt or external interrupt, the Watchdog restarts counting immediately. When the MCU receives a reset the Watchdog restarts counting
after 256 or 4096 CPU clocks.
11.1.6 Hardware Watchdog Option
If Hardware Watchdog is selected by option byte,
the watchdog is always active and the WDGA bit in
the WDGCR is not used. Refer to the Option Byte
description.
11.1.7 Using Halt Mode with the WDG
(WDGHALT option)
The following recommendation applies if Halt
mode is used when the watchdog is enabled.
– Before executing the HALT instruction, refresh
the WDG counter, to avoid an unexpected WDG
reset immediately after waking up the microcontroller.
11.1.8 Interrupts
None.
11.1.9 Register Description
CONTROL REGISTER (WDGCR)
Read /Write
Reset Value: 0111 1111 (7Fh)
7
WDGA
0
T6
T5
T4
T3
T2
T1
T0
Bit 7 = WDGA Activation bit.
This bit is set by software and only cleared by
hardware after a reset. When WDGA = 1, the
watchdog can generate a reset.
0: Watchdog disabled
1: Watchdog enabled
Note: This bit is not used if the hardware watchdog option is enabled by option byte.
Bit 6:0 = T[6:0] 7-bit counter (MSB to LSB).
These bits contain the value of the watchdog
counter. It is decremented every 16384 fOSC2 cycles (approx.). A reset is produced when it rolls
over from 40h to 3Fh (T6 becomes cleared).
51/171
ST72260G, ST72262G, ST72264G
Table 12. Watchdog Timer Register Map and Reset Values
Address
(Hex.)
0024h
52/171
Register
Label
7
6
5
4
3
2
1
0
WDGCR
Reset Value
WDGA
0
T6
1
T5
1
T4
1
T3
1
T2
1
T1
1
T0
1
ST72260G, ST72262G, ST72264G
11.2 MAIN CLOCK CONTROLLER WITH REAL TIME CLOCK (MCC/RTC)
The Main Clock Controller consists of a real time
clock timer with interrupt capability
11.2.1 Real Time Clock Timer (RTC)
The counter of the real time clock timer allows an
interrupt to be generated based on an accurate
real time clock. Four different time bases depending directly on fOSC2 are available. The whole
functionality is controlled by four bits of the MCCSR register: TB[1:0], OIE and OIF.
When the RTC interrupt is enabled (OIE bit set),
the ST7 enters ACTIVE-HALT mode when the
HALT instruction is executed. See Section 8.4
"ACTIVE-HALT AND HALT MODES" on page 35
for more details.
Figure 35. Main Clock Controller (MCC/RTC) Block Diagram
fOSC2
TB1 TB0
MCCSR
TO WATCHDOG
RTC
COUNTER
OIE
OIF
MCC/RTC INTERRUPT
53/171
ST72260G, ST72262G, ST72264G
MAIN CLOCK CONTROLLER WITH REAL TIME CLOCK (Cont’d)
11.2.2 Low Power Modes
Bit 7:4 = reserved
Mode
Description
No effect on MCC/RTC peripheral.
MCC/RTC interrupt cause the device to exit
from WAIT mode.
No effect on MCC/RTC counter (OIE bit is
set), the registers are frozen.
MCC/RTC interrupt cause the device to exit
from ACTIVE-HALT mode.
MCC/RTC counter and registers are frozen.
MCC/RTC operation resumes when the
MCU is woken up by an interrupt with “exit
from HALT” capability.
WAIT
ACTIVEHALT
HALT
11.2.3 Interrupts
The MCC/RTC interrupt event generates an interrupt if the OIE bit of the MCCSR register is set and
the interrupt mask in the CC register is not active
(RIM instruction).
Interrupt Event
Time base overflow
event
Enable
Event
Control
Flag
Bit
OIF
OIE
Exit
from
Wait
Exit
from
Halt
Yes
No 1)
Note:
The MCC/RTC interrupt wakes up the MCU from
ACTIVE-HALT mode, not from HALT mode.
11.2.4 Register Description
MCC CONTROL/STATUS REGISTER (MCCSR)
Read /Write
Reset Value: 0000 0000 (00h )
7
0
0
0
0
0
TB1
TB0
OIE
OIF
Bit 3:2 = TB[1:0] Time base control
These bits select the programmable divider time
base. They are set and cleared by software.
Time Base
Counter
Prescaler f
OSC2 =4MHz fOSC2=8MHz
TB1
TB0
16000
4ms
2ms
0
0
32000
8ms
4ms
0
1
80000
20ms
10ms
1
0
200000
50ms
25ms
1
1
A modification of the time base is taken into account at the end of the current period (previously
set) to avoid an unwanted time shift. This allows to
use this time base as a real time clock.
Bit 1 = OIE Oscillator interrupt enable
This bit set and cleared by software.
0: Oscillator interrupt disabled
1: Oscillator interrupt enabled
This interrupt can be used to exit from ACTIVEHALT mode.
When this bit is set, calling the ST7 software HALT
instruction enters the ACTIVE-HALT power saving
mode.MAIN CLOCK CONTROLLER WITH REAL
TIME CLOCK (Cont’d)
Bit 0 = OIF Oscillator interrupt flag
This bit is set by hardware and cleared by software
reading the CSR register. It indicates when set
that the main oscillator has reached the selected
elapsed time (TB1:0).
0: Timeout not reached
1: Timeout reached
CAUTION: The BRES and BSET instructions
must not be used on the MCCSR register to avoid
unintentionally clearing the OIF bit.
Table 13. Main Clock Controller Register Map and Reset Values
Address
(Hex.)
0025h
0026h
54/171
Register
Label
SICSR
Reset Value
MCCSR
Reset Value
7
6
5
4
VDS
0
VDIE
0
VDF
0
LVDRF
x
0
0
0
0
3
2
1
0
0
TB1
0
CFIE
0
TB0
0
CSSD
0
OIE
0
WDGRF
x
OIF
0
ST72260G, ST72262G, ST72264G
11.3 16-BIT TIMER
11.3.1 Introduction
The timer consists of a 16-bit free-running counter
driven by a programmable prescaler.
It may be used for a variety of purposes, including
pulse length measurement of up to two input signals (input capture) or generation of up to two output waveforms (output compare and PWM).
Pulse lengths and waveform periods can be modulated from a few microseconds to several milliseconds using the timer prescaler and the CPU
clock prescaler.
Some ST7 devices have two on-chip 16-bit timers.
They are completely independent, and do not
share any resources. They are synchronized after
a MCU reset as long as the timer clock frequencies are not modified.
This description covers one or two 16-bit timers. In
ST7 devices with two timers, register names are
prefixed with TA (Timer A) or TB (Timer B).
11.3.2 Main Features
■ Programmable prescaler: fCPU divided by 2, 4 or 8.
■ Overflow status flag and maskable interrupt
■ External clock input (must be at least 4 times
slower than the CPU clock speed) with the choice
of active edge
■ 1 or 2 Output Compare functions each with:
– 2 dedicated 16-bit registers
– 2 dedicated programmable signals
– 2 dedicated status flags
– 1 dedicated maskable interrupt
■ 1 or 2 Input Capture functions each with:
– 2 dedicated 16-bit registers
– 2 dedicated active edge selection signals
– 2 dedicated status flags
– 1 dedicated maskable interrupt
■ Pulse width modulation mode (PWM)
■ One pulse mode
■ Reduced Power Mode
■ 5 alternate functions on I/O ports (ICAP1, ICAP2,
OCMP1, OCMP2, EXTCLK)*
When reading an input signal on a non-bonded
pin, the value will always be ‘1’.
11.3.3 Functional Description
11.3.3.1 Counter
The main block of the Programmable Timer is a
16-bit free running upcounter and its associated
16-bit registers. The 16-bit registers are made up
of two 8-bit registers called high & low.
Counter Register (CR):
– Counter High Register (CHR) is the most significant byte (MS Byte).
– Counter Low Register (CLR) is the least significant byte (LS Byte).
Alternate Counter Register (ACR)
– Alternate Counter High Register (ACHR) is the
most significant byte (MS Byte).
– Alternate Counter Low Register (ACLR) is the
least significant byte (LS Byte).
These two read-only 16-bit registers contain the
same value but with the difference that reading the
ACLR register does not clear the TOF bit (Timer
overflow flag), located in the Status register, (SR),
(see note at the end of paragraph titled 16-bit read
sequence).
Writing in the CLR register or ACLR register resets
the free running counter to the FFFCh value.
Both counters have a reset value of FFFCh (this is
the only value which is reloaded in the 16-bit timer). The reset value of both counters is also
FFFCh in One Pulse mode and PWM mode.
The timer clock depends on the clock control bits
of the CR2 register, as illustrated in Table 14 Clock
Control Bits. The value in the counter register repeats every 131072, 262144 or 524288 CPU clock
cycles depending on the CC[1:0] bits.
The timer frequency can be fCPU/2, fCPU/4, fCPU/8
or an external frequency.
The Block Diagram is shown in Figure 36.
*Note: Some timer pins may not available (not
bonded) in some ST7 devices. Refer to the device
pin out description.
55/171
ST72260G, ST72262G, ST72264G
16-BIT TIMER (Cont’d)
Figure 36. Timer Block Diagram
ST7 INTERNAL BUS
fCPU
MCU-PERIPHERAL INTERFACE
8 low
8
8
8
low
8
high
8
low
8
high
EXEDG
8
low
high
8
high
8-bit
buffer
low
8 high
16
1/2
1/4
1/8
OUTPUT
COMPARE
REGISTER
2
OUTPUT
COMPARE
REGISTER
1
COUNTER
REGISTER
ALTERNATE
COUNTER
REGISTER
EXTCLK
pin
INPUT
CAPTURE
REGISTER
1
INPUT
CAPTURE
REGISTER
2
16
16
16
CC[1:0]
TIMER INTERNAL BUS
16 16
OVERFLOW
DETECT
CIRCUIT
OUTPUT COMPARE
CIRCUIT
6
ICF1 OCF1 TOF ICF2 OCF2 TIMD
0
EDGE DETECT
CIRCUIT1
ICAP1
pin
EDGE DETECT
CIRCUIT2
ICAP2
pin
LATCH1
OCMP1
pin
LATCH2
OCMP2
pin
0
(Control/Status Register)
CSR
ICIE OCIE TOIE FOLV2 FOLV1 OLVL2 IEDG1 OLVL1
(Control Register 1) CR1
OC1E OC2E OPM PWM
CC1
CC0 IEDG2 EXEDG
(Control Register 2) CR2
(See note)
TIMER INTERRUPT
56/171
Note: If IC, OC and TO interrupt requests have separate vectors
then the last OR is not present (See device Interrupt Vector Table)
ST72260G, ST72262G, ST72264G
16-BIT TIMER (Cont’d)
16-bit read sequence: (from either the Counter
Register or the Alternate Counter Register).
Beginning of the sequence
At t0
Read
MS Byte
LS Byte
is buffered
Other
instructions
Read
At t0 +∆t LS Byte
Returns the buffered
LS Byte value at t0
Sequence completed
The user must read the MS Byte first, then the LS
Byte value is buffered automatically.
This buffered value remains unchanged until the
16-bit read sequence is completed, even if the
user reads the MS Byte several times.
After a complete reading sequence, if only the
CLR register or ACLR register are read, they return the LS Byte of the count value at the time of
the read.
Whatever the timer mode used (input capture, output compare, one pulse mode or PWM mode) an
overflow occurs when the counter rolls over from
FFFFh to 0000h then:
– The TOF bit of the SR register is set.
– A timer interrupt is generated if:
– TOIE bit of the CR1 register is set and
– I bit of the CC register is cleared.
If one of these conditions is false, the interrupt remains pending to be issued as soon as they are
both true.
Clearing the overflow interrupt request is done in
two steps:
1. Reading the SR register while the TOF bit is set.
2. An access (read or write) to the CLR register.
Notes: The TOF bit is not cleared by accesses to
ACLR register. The advantage of accessing the
ACLR register rather than the CLR register is that
it allows simultaneous use of the overflow function
and reading the free running counter at random
times (for example, to measure elapsed time) without the risk of clearing the TOF bit erroneously.
The timer is not affected by WAIT mode.
In HALT mode, the counter stops counting until the
mode is exited. Counting then resumes from the
previous count (MCU awakened by an interrupt) or
from the reset count (MCU awakened by a Reset).
11.3.3.2 External Clock
The external clock (where available) is selected if
CC0=1 and CC1=1 in the CR2 register.
The status of the EXEDG bit in the CR2 register
determines the type of level transition on the external clock pin EXTCLK that will trigger the free running counter.
The counter is synchronized with the falling edge
of the internal CPU clock.
A minimum of four falling edges of the CPU clock
must occur between two consecutive active edges
of the external clock; thus the external clock frequency must be less than a quarter of the CPU
clock frequency.
57/171
ST72260G, ST72262G, ST72264G
16-BIT TIMER (Cont’d)
Figure 37. Counter Timing Diagram, internal clock divided by 2
CPU CLOCK
INTERNAL RESET
TIMER CLOCK
FFFD FFFE FFFF 0000
COUNTER REGISTER
0001
0002
0003
TIMER OVERFLOW FLAG (TOF)
Figure 38. Counter Timing Diagram, internal clock divided by 4
CPU CLOCK
INTERNAL RESET
TIMER CLOCK
COUNTER REGISTER
FFFC
FFFD
0000
0001
TIMER OVERFLOW FLAG (TOF)
Figure 39. Counter Timing Diagram, internal clock divided by 8
CPU CLOCK
INTERNAL RESET
TIMER CLOCK
COUNTER REGISTER
FFFC
FFFD
0000
TIMER OVERFLOW FLAG (TOF)
Note: The MCU is in reset state when the internal reset signal is high, when it is low the MCU is running.
58/171
ST72260G, ST72262G, ST72264G
16-BIT TIMER (Cont’d)
11.3.3.3 Input Capture
In this section, the index, i, may be 1 or 2 because
there are 2 input capture functions in the 16-bit
timer.
The two 16-bit input capture registers (IC1R and
IC2R) are used to latch the value of the free running counter after a transition is detected on the
ICAPi pin (see figure 5).
ICiR
MS Byte
ICiHR
LS Byte
ICiLR
ICiR register is a read-only register.
The active transition is software programmable
through the IEDGi bit of Control Registers (CRi).
Timing resolution is one count of the free running
counter: (fCPU/CC[1:0]).
Procedure:
To use the input capture function select the following in the CR2 register:
– Select the timer clock (CC[1:0]) (see Table 14
Clock Control Bits).
– Select the edge of the active transition on the
ICAP2 pin with the IEDG2 bit (the ICAP2 pin
must be configured as floating input or input with
pull-up without interrupt if this configuration is
available).
And select the following in the CR1 register:
– Set the ICIE bit to generate an interrupt after an
input capture coming from either the ICAP1 pin
or the ICAP2 pin
– Select the edge of the active transition on the
ICAP1 pin with the IEDG1 bit (the ICAP1pin must
be configured as floating input or input with pullup without interrupt if this configuration is available).
When an input capture occurs:
– ICFi bit is set.
– The IC iR register contains the value of the free
running counter on the active transition on the
ICAPi pin (see Figure 41).
– A timer interrupt is generated if the ICIE bit is set
and the I bit is cleared in the CC register. Otherwise, the interrupt remains pending until both
conditions become true.
Clearing the Input Capture interrupt request (i.e.
clearing the ICFi bit) is done in two steps:
1. Reading the SR register while the ICFi bit is set.
2. An access (read or write) to the ICiLR register.
Notes:
1. After reading the ICiHR register, transfer of
input capture data is inhibited and ICFi will
never be set until the ICiLR register is also
read.
2. The ICiR register contains the free running
counter value which corresponds to the most
recent input capture.
3. The 2 input capture functions can be used
together even if the timer also uses the 2 output
compare functions.
4. In One pulse Mode and PWM mode only Input
Capture 2 can be used.
5. The alternate inputs (ICAP1 & ICAP2) are
always directly connected to the timer. So any
transitions on these pins activates the input
capture function.
Moreover if one of the ICAPi pins is configured
as an input and the second one as an output,
an interrupt can be generated if the user toggles the output pin and if the ICIE bit is set.
This can be avoided if the input capture function i is disabled by reading the IC iHR (see note
1).
6. The TOF bit can be used with interrupt generation in order to measure events that go beyond
the timer range (FFFFh).
59/171
ST72260G, ST72262G, ST72264G
16-BIT TIMER (Cont’d)
Figure 40. Input Capture Block Diagram
ICAP1
pin
ICAP2
pin
(Control Register 1) CR1
EDGE DETECT
CIRCUIT2
EDGE DETECT
CIRCUIT1
ICIE
IEDG1
(Status Register) SR
IC2R Register
IC1R Register
ICF1
ICF2
0
16-BIT FREE RUNNING
COUNTER
CC1
CC0 IEDG2
Figure 41. Input Capture Timing Diagram
TIMER CLOCK
FF01
FF02
FF03
ICAPi PIN
ICAPi FLAG
ICAPi REGISTER
Note: The rising edge is the active edge.
60/171
0
(Control Register 2) CR2
16-BIT
COUNTER REGISTER
0
FF03
ST72260G, ST72262G, ST72264G
16-BIT TIMER (Cont’d)
11.3.3.4 Output Compare
In this section, the index, i, may be 1 or 2 because
there are 2 output compare functions in the 16-bit
timer.
This function can be used to control an output
waveform or indicate when a period of time has
elapsed.
When a match is found between the Output Compare register and the free running counter, the output compare function:
– Assigns pins with a programmable value if the
OCiE bit is set
– Sets a flag in the status register
– Generates an interrupt if enabled
Two 16-bit registers Output Compare Register 1
(OC1R) and Output Compare Register 2 (OC2R)
contain the value to be compared to the counter
register each timer clock cycle.
OCiR
MS Byte
OCiHR
LS Byte
OCiLR
These registers are readable and writable and are
not affected by the timer hardware. A reset event
changes the OCiR value to 8000h.
Timing resolution is one count of the free running
counter: (fCPU/CC[1:0]).
Procedure:
To use the output compare function, select the following in the CR2 register:
– Set the OCiE bit if an output is needed then the
OCMPi pin is dedicated to the output compare i
signal.
– Select the timer clock (CC[1:0]) (see Table 14
Clock Control Bits).
And select the following in the CR1 register:
– Select the OLVLi bit to applied to the OCMP i pins
after the match occurs.
– Set the OCIE bit to generate an interrupt if it is
needed.
When a match is found between OCRi register
and CR register:
– OCFi bit is set.
– The OCMPi pin takes OLVLi bit value (OCMPi
pin latch is forced low during reset).
– A timer interrupt is generated if the OCIE bit is
set in the CR1 register and the I bit is cleared in
the CC register (CC).
The OCiR register value required for a specific timing application can be calculated using the following formula:
∆ OCiR =
∆t * fCPU
PRESC
Where:
∆t
= Output compare period (in seconds)
= CPU clock frequency (in hertz)
fCPU
PRESC = Timer prescaler factor (2, 4 or 8 depending on CC[1:0] bits, see Table 14
Clock Control Bits)
If the timer clock is an external clock, the formula
is:
∆ OCiR = ∆t * fEXT
Where:
∆t
= Output compare period (in seconds)
= External timer clock frequency (in hertz)
fEXT
Clearing the output compare interrupt request (i.e.
clearing the OCFi bit) is done by:
1. Reading the SR register while the OCFi bit is
set.
2. An access (read or write) to the OCiLR register.
The following procedure is recommended to prevent the OCFi bit from being set between the time
it is read and the write to the OCiR register:
– Write to the OCiHR register (further compares
are inhibited).
– Read the SR register (first step of the clearance
of the OCFi bit, which may be already set).
– Write to the OCiLR register (enables the output
compare function and clears the OCFi bit).
61/171
ST72260G, ST72262G, ST72264G
16-BIT TIMER (Cont’d)
Notes:
1. After a processor write cycle to the OCiHR register, the output compare function is inhibited
until the OCiLR register is also written.
2. If the OCiE bit is not set, the OCMPi pin is a
general I/O port and the OLVLi bit will not
appear when a match is found but an interrupt
could be generated if the OCIE bit is set.
3. When the timer clock is fCPU/2, OCFi and
OCMPi are set while the counter value equals
the OCiR register value (see Figure 43 on page
63). This behaviour is the same in OPM or
PWM mode.
When the timer clock is fCPU/4, fCPU/8 or in
external clock mode, OCFi and OCMPi are set
while the counter value equals the OC iR register value plus 1 (see Figure 44 on page 63).
4. The output compare functions can be used both
for generating external events on the OCMPi
pins even if the input capture mode is also
used.
5. The value in the 16-bit OCiR register and the
OLVi bit should be changed after each successful comparison in order to control an output
waveform or establish a new elapsed timeout.
Forced Compare Output capability
When the FOLVi bit is set by software, the OLVLi
bit is copied to the OCMPi pin. The OLVi bit has to
be toggled in order to toggle the OCMPi pin when
it is enabled (OCiE bit=1). The OCFi bit is then not
set by hardware, and thus no interrupt request is
generated.
The FOLVLi bits have no effect in both one pulse
mode and PWM mode.
Figure 42. Output Compare Block Diagram
16 BIT FREE RUNNING
COUNTER
OC1E OC2E
CC1
CC0
(Control Register 2) CR2
16-bit
(Control Register 1) CR1
OUTPUT COMPARE
CIRCUIT
16-bit
OCIE
FOLV2 FOLV1 OLVL2
OLVL1
16-bit
Latch
2
OC1R Register
OCF1
OCF2
0
0
0
OC2R Register
(Status Register) SR
62/171
Latch
1
OCMP1
Pin
OCMP2
Pin
ST72260G, ST72262G, ST72264G
16-BIT TIMER (Cont’d)
Figure 43. Output Compare Timing Diagram, fTIMER =fCPU/2
INTERNAL CPU CLOCK
TIMER CLOCK
COUNTER REGISTER
2ECF 2ED0
2ED1 2ED2 2ED3 2ED4
OUTPUT COMPARE REGISTER i (OCRi)
2ED3
OUTPUT COMPARE FLAG i (OCFi)
OCMPi PIN (OLVLi=1)
Figure 44. Output Compare Timing Diagram, fTIMER =fCPU/4
INTERNAL CPU CLOCK
TIMER CLOCK
COUNTER REGISTER
OUTPUT COMPARE REGISTER i (OCRi)
2ECF 2ED0
2ED1 2ED2 2ED3 2ED4
2ED3
COMPARE REGISTER i LATCH
OUTPUT COMPARE FLAG i (OCFi)
OCMPi PIN (OLVLi=1)
63/171
ST72260G, ST72262G, ST72264G
16-BIT TIMER (Cont’d)
11.3.3.5 One Pulse Mode
One Pulse mode enables the generation of a
pulse when an external event occurs. This mode is
selected via the OPM bit in the CR2 register.
The one pulse mode uses the Input Capture1
function and the Output Compare1 function.
Procedure:
To use one pulse mode:
1. Load the OC1R register with the value corresponding to the length of the pulse (see the formula in the opposite column).
2. Select the following in the CR1 register:
– Using the OLVL1 bit, select the level to be applied to the OCMP1 pin after the pulse.
– Using the OLVL2 bit, select the level to be applied to the OCMP1 pin during the pulse.
– Select the edge of the active transition on the
ICAP1 pin with the IEDG1 bit (the ICAP1 pin
must be configured as floating input).
3. Select the following in the CR2 register:
– Set the OC1E bit, the OCMP1 pin is then dedicated to the Output Compare 1 function.
– Set the OPM bit.
– Select the timer clock CC[1:0] (see Table 14
Clock Control Bits).
One pulse mode cycle
When
event occurs
on ICAP1
ICR1 = Counter
OCMP1 = OLVL2
Counter is reset
to FFFCh
ICF1 bit is set
When
Counter
= OC1R
OCMP1 = OLVL1
Then, on a valid event on the ICAP1 pin, the counter is initialized to FFFCh and OLVL2 bit is loaded
on the OCMP1 pin, the ICF1 bit is set and the value FFFDh is loaded in the IC1R register.
Because the ICF1 bit is set when an active edge
occurs, an interrupt can be generated if the ICIE
bit is set.
64/171
Clearing the Input Capture interrupt request (i.e.
clearing the ICFi bit) is done in two steps:
1. Reading the SR register while the ICFi bit is set.
2. An access (read or write) to the ICiLR register.
The OC1R register value required for a specific
timing application can be calculated using the following formula:
OCiR Value =
t * fCPU
-5
PRESC
Where:
t
= Pulse period (in seconds)
fCPU = CPU clock frequency (in hertz)
PRESC = Timer prescaler factor (2, 4 or 8 depending on the CC[1:0] bits, see Table 14
Clock Control Bits)
If the timer clock is an external clock the formula is:
OCiR = t * fEXT -5
Where:
t
= Pulse period (in seconds)
fEXT
= External timer clock frequency (in hertz)
When the value of the counter is equal to the value
of the contents of the OC1R register, the OLVL1
bit is output on the OCMP1 pin, (See Figure 45).
Notes:
1. The OCF1 bit cannot be set by hardware in one
pulse mode but the OCF2 bit can generate an
Output Compare interrupt.
2. When the Pulse Width Modulation (PWM) and
One Pulse Mode (OPM) bits are both set, the
PWM mode is the only active one.
3. If OLVL1=OLVL2 a continuous signal will be
seen on the OCMP1 pin.
4. The ICAP1 pin can not be used to perform input
capture. The ICAP2 pin can be used to perform
input capture (ICF2 can be set and IC2R can be
loaded) but the user must take care that the
counter is reset each time a valid edge occurs
on the ICAP1 pin and ICF1 can also generates
interrupt if ICIE is set.
5. When one pulse mode is used OC1R is dedicated to this mode. Nevertheless OC2R and
OCF2 can be used to indicate a period of time
has been elapsed but cannot generate an output waveform because the level OLVL2 is dedicated to the one pulse mode.
ST72260G, ST72262G, ST72264G
16-BIT TIMER (Cont’d)
Figure 45. One Pulse Mode Timing Example
COUNTER
2ED3
01F8
IC1R
01F8
FFFC FFFD FFFE
2ED0 2ED1 2ED2
FFFC FFFD
2ED3
ICAP1
OLVL2
OCMP1
OLVL1
OLVL2
compare1
Note: IEDG1=1, OC1R=2ED0h, OLVL1=0, OLVL2=1
Figure 46. Pulse Width Modulation Mode Timing Example with 2 Output Compare Functions
COUNTER 34E2 FFFC FFFD FFFE
2ED0 2ED1 2ED2
OLVL2
OCMP1
compare2
OLVL1
compare1
34E2
FFFC
OLVL2
compare2
Note: OC1R=2ED0h, OC2R=34E2, OLVL1=0, OLVL2= 1
Note: On timers with only 1 Output Compare register, a fixed frequency PWM signal can be generated using the output compare and the counter overflow to define the pulse length.
65/171
ST72260G, ST72262G, ST72264G
16-BIT TIMER (Cont’d)
11.3.3.6 Pulse Width Modulation Mode
Pulse Width Modulation (PWM) mode enables the
generation of a signal with a frequency and pulse
length determined by the value of the OC1R and
OC2R registers.
Pulse Width Modulation mode uses the complete
Output Compare 1 function plus the OC2R register, and so this functionality can not be used when
PWM mode is activated.
In PWM mode, double buffering is implemented on
the output compare registers. Any new values written in the OC1R and OC2R registers are taken
into account only at the end of the PWM period
(OC2) to avoid spikes on the PWM output pin
(OCMP1).
Procedure
To use pulse width modulation mode:
1. Load the OC2R register with the value corresponding to the period of the signal using the
formula in the opposite column.
2. Load the OC1R register with the value corresponding to the period of the pulse if (OLVL1=0
and OLVL2=1) using the formula in the opposite column.
3. Select the following in the CR1 register:
– Using the OLVL1 bit, select the level to be applied to the OCMP1 pin after a successful
comparison with the OC1R register.
– Using the OLVL2 bit, select the level to be applied to the OCMP1 pin after a successful
comparison with the OC2R register.
4. Select the following in the CR2 register:
– Set OC1E bit: the OCMP1 pin is then dedicated to the output compare 1 function.
– Set the PWM bit.
– Select the timer clock (CC[1:0]) (see Table 14
Clock Control Bits).
Pulse Width Modulation cycle
When
Counter
= OC1R
When
Counter
= OC2R
OCMP1 = OLVL1
OCMP1 = OLVL2
Counter is reset
to FFFCh
ICF1 bit is set
66/171
If OLVL1=1 and OLVL2=0 the length of the positive pulse is the difference between the OC2R and
OC1R registers.
If OLVL1=OLVL2 a continuous signal will be seen
on the OCMP1 pin.
The OCiR register value required for a specific timing application can be calculated using the following formula:
OCiR Value =
t * fCPU
-5
PRESC
Where:
t
= Signal or pulse period (in seconds)
fCPU = CPU clock frequency (in hertz)
PRESC = Timer prescaler factor (2, 4 or 8 depending on CC[1:0] bits, see Table 14 Clock
Control Bits)
If the timer clock is an external clock the formula is:
OCiR = t * fEXT -5
Where:
t
= Signal or pulse period (in seconds)
fEXT
= External timer clock frequency (in hertz)
The Output Compare 2 event causes the counter
to be initialized to FFFCh (See Figure 46)
Notes:
1. After a write instruction to the OC iHR register,
the output compare function is inhibited until the
OCiLR register is also written.
2. The OCF1 and OCF2 bits cannot be set by
hardware in PWM mode therefore the Output
Compare interrupt is inhibited.
3. The ICF1 bit is set by hardware when the counter reaches the OC2R value and can produce a
timer interrupt if the ICIE bit is set and the I bit is
cleared.
4. In PWM mode the ICAP1 pin can not be used
to perform input capture because it is disconnected to the timer. The ICAP2 pin can be used
to perform input capture (ICF2 can be set and
IC2R can be loaded) but the user must take
care that the counter is reset each period and
ICF1 can also generates interrupt if ICIE is set.
5. When the Pulse Width Modulation (PWM) and
One Pulse Mode (OPM) bits are both set, the
PWM mode is the only active one.
ST72260G, ST72262G, ST72264G
16-BIT TIMER (Cont’d)
11.3.4 Low Power Modes
Mode
WAIT
HALT
Description
No effect on 16-bit Timer.
Timer interrupts cause the device to exit from WAIT mode.
16-bit Timer registers are frozen.
In HALT mode, the counter stops counting until Halt mode is exited. Counting resumes from the previous
count when the MCU is woken up by an interrupt with “exit from HALT mode” capability or from the counter
reset value when the MCU is woken up by a RESET.
If an input capture event occurs on the ICAPi pin, the input capture detection circuitry is armed. Consequently, when the MCU is woken up by an interrupt with “exit from HALT mode” capability, the ICFi bit is set, and
the counter value present when exiting from HALT mode is captured into the ICiR register.
11.3.5 Interrupts
Event
Flag
Interrupt Event
Input Capture 1 event/Counter reset in PWM mode
Input Capture 2 event
Output Compare 1 event (not available in PWM mode)
Output Compare 2 event (not available in PWM mode)
Timer Overflow event
ICF1
ICF2
OCF1
OCF2
TOF
Enable
Control
Bit
ICIE
OCIE
TOIE
Exit
from
Wait
Yes
Yes
Yes
Yes
Yes
Exit
from
Halt
No
No
No
No
No
Note: The 16-bit Timer interrupt events are connected to the same interrupt vector (see Interrupts chapter). These events generate an interrupt if the corresponding Enable Control Bit is set and the interrupt
mask in the CC register is reset (RIM instruction).
11.3.6 Summary of Timer modes
MODES
Input Capture (1 and/or 2)
Output Compare (1 and/or 2)
One Pulse Mode
PWM Mode
Input Capture 1
Yes
Yes
No
No
TIMER RESOURCES
Input Capture 2
Output Compare 1 Output Compare 2
Yes
Yes
Yes
Yes
Yes
Yes
1)
Not Recommended
No
Partially 2)
3)
Not Recommended
No
No
1) See note 4 in Section 11.3.3.5 "One Pulse Mode" on page 64
2) See note 5 in Section 11.3.3.5 "One Pulse Mode" on page 64
3) See note 4 in Section 11.3.3.6 "Pulse Width Modulation Mode" on page 66
67/171
ST72260G, ST72262G, ST72264G
16-BIT TIMER (Cont’d)
11.3.7 Register Description
Each Timer is associated with three control and
status registers, and with six pairs of data registers
(16-bit values) relating to the two input captures,
the two output compares, the counter and the alternate counter.
CONTROL REGISTER 1 (CR1)
Read/Write
Reset Value: 0000 0000 (00h)
7
0
Bit 4 = FOLV2 Forced Output Compare 2.
This bit is set and cleared by software.
0: No effect on the OCMP2 pin.
1: Forces the OLVL2 bit to be copied to the
OCMP2 pin, if the OC2E bit is set and even if
there is no successful comparison.
Bit 3 = FOLV1 Forced Output Compare 1.
This bit is set and cleared by software.
0: No effect on the OCMP1 pin.
1: Forces OLVL1 to be copied to the OCMP1 pin, if
the OC1E bit is set and even if there is no successful comparison.
ICIE OCIE TOIE FOLV2 FOLV1 OLVL2 IEDG1 OLVL1
Bit 7 = ICIE Input Capture Interrupt Enable.
0: Interrupt is inhibited.
1: A timer interrupt is generated whenever the
ICF1 or ICF2 bit of the SR register is set.
Bit 6 = OCIE Output Compare Interrupt Enable.
0: Interrupt is inhibited.
1: A timer interrupt is generated whenever the
OCF1 or OCF2 bit of the SR register is set.
Bit 5 = TOIE Timer Overflow Interrupt Enable.
0: Interrupt is inhibited.
1: A timer interrupt is enabled whenever the TOF
bit of the SR register is set.
68/171
Bit 2 = OLVL2 Output Level 2.
This bit is copied to the OCMP2 pin whenever a
successful comparison occurs with the OC2R register and OCxE is set in the CR2 register. This value is copied to the OCMP1 pin in One Pulse Mode
and Pulse Width Modulation mode.
Bit 1 = IEDG1 Input Edge 1.
This bit determines which type of level transition
on the ICAP1 pin will trigger the capture.
0: A falling edge triggers the capture.
1: A rising edge triggers the capture.
Bit 0 = OLVL1 Output Level 1.
The OLVL1 bit is copied to the OCMP1 pin whenever a successful comparison occurs with the
OC1R register and the OC1E bit is set in the CR2
register.
ST72260G, ST72262G, ST72264G
16-BIT TIMER (Cont’d)
CONTROL REGISTER 2 (CR2)
Read/Write
Reset Value: 0000 0000 (00h)
7
0
OC1E OC2E OPM PWM CC1 CC0 IEDG2 EXEDG
Bit 7 = OC1E Output Compare 1 Pin Enable.
This bit is used only to output the signal from the
timer on the OCMP1 pin (OLV1 in Output Compare mode, both OLV1 and OLV2 in PWM and
one-pulse mode). Whatever the value of the OC1E
bit, the Output Compare 1 function of the timer remains active.
0: OCMP1 pin alternate function disabled (I/O pin
free for general-purpose I/O).
1: OCMP1 pin alternate function enabled.
Bit 6 = OC2E Output Compare 2 Pin Enable.
This bit is used only to output the signal from the
timer on the OCMP2 pin (OLV2 in Output Compare mode). Whatever the value of the OC2E bit,
the Output Compare 2 function of the timer remains active.
0: OCMP2 pin alternate function disabled (I/O pin
free for general-purpose I/O).
1: OCMP2 pin alternate function enabled.
Bit 5 = OPM One Pulse Mode.
0: One Pulse Mode is not active.
1: One Pulse Mode is active, the ICAP1 pin can be
used to trigger one pulse on the OCMP1 pin; the
active transition is given by the IEDG1 bit. The
length of the generated pulse depends on the
contents of the OC1R register.
Bit 4 = PWM Pulse Width Modulation.
0: PWM mode is not active.
1: PWM mode is active, the OCMP1 pin outputs a
programmable cyclic signal; the length of the
pulse depends on the value of OC1R register;
the period depends on the value of OC2R register.
Bit 3, 2 = CC[1:0] Clock Control.
The timer clock mode depends on these bits:
Table 14. Clock Control Bits
Timer Clock
fCPU / 4
fCPU / 2
fCPU / 8
External Clock (where
available)
CC1
0
0
1
CC0
0
1
0
1
1
Note: If the external clock pin is not available, programming the external clock configuration stops
the counter.
Bit 1 = IEDG2 Input Edge 2.
This bit determines which type of level transition
on the ICAP2 pin will trigger the capture.
0: A falling edge triggers the capture.
1: A rising edge triggers the capture.
Bit 0 = EXEDG External Clock Edge.
This bit determines which type of level transition
on the external clock pin EXTCLK will trigger the
counter register.
0: A falling edge triggers the counter register.
1: A rising edge triggers the counter register.
69/171
ST72260G, ST72262G, ST72264G
16-BIT TIMER (Cont’d)
CONTROL/STATUS REGISTER (CSR)
Read Only (except bit 2 R/W)
Reset Value: xxxx x0xx (xxh)
Note: Reading or writing the ACLR register does
not clear TOF.
7
ICF1
0
OCF1
TOF
ICF2
OCF2 TIMD
0
0
Bit 7 = ICF1 Input Capture Flag 1.
0: No input capture (reset value).
1: An input capture has occurred on the ICAP1 pin
or the counter has reached the OC2R value in
PWM mode. To clear this bit, first read the SR
register, then read or write the low byte of the
IC1R (IC1LR) register.
Bit 6 = OCF1 Output Compare Flag 1.
0: No match (reset value).
1: The content of the free running counter has
matched the content of the OC1R register. To
clear this bit, first read the SR register, then read
or write the low byte of the OC1R (OC1LR) register.
Bit 5 = TOF Timer Overflow Flag.
0: No timer overflow (reset value).
1: The free running counter rolled over from FFFFh
to 0000h. To clear this bit, first read the SR register, then read or write the low byte of the CR
(CLR) register.
70/171
Bit 4 = ICF2 Input Capture Flag 2.
0: No input capture (reset value).
1: An input capture has occurred on the ICAP2
pin. To clear this bit, first read the SR register,
then read or write the low byte of the IC2R
(IC2LR) register.
Bit 3 = OCF2 Output Compare Flag 2.
0: No match (reset value).
1: The content of the free running counter has
matched the content of the OC2R register. To
clear this bit, first read the SR register, then read
or write the low byte of the OC2R (OC2LR) register.
Bit 2 = TIMD Timer disable.
This bit is set and cleared by software. When set, it
freezes the timer prescaler and counter and disabled the output functions (OCMP1 and OCMP2
pins) to reduce power consumption. Access to the
timer registers is still available, allowing the timer
configuration to be changed, or the counter reset,
while it is disabled.
0: Timer enabled
1: Timer prescaler, counter and outputs disabled
Bits 1:0 = Reserved, must be kept cleared.
ST72260G, ST72262G, ST72264G
16-BIT TIMER (Cont’d)
INPUT CAPTURE 1 HIGH REGISTER (IC1HR)
Read Only
Reset Value: Undefined
This is an 8-bit read only register that contains the
high part of the counter value (transferred by the
input capture 1 event).
OUTPUT COMPARE 1 HIGH REGISTER
(OC1HR)
Read/Write
Reset Value: 1000 0000 (80h)
This is an 8-bit register that contains the high part
of the value to be compared to the CHR register.
7
0
7
0
MSB
LSB
MSB
LSB
INPUT CAPTURE 1 LOW REGISTER (IC1LR)
Read Only
Reset Value: Undefined
This is an 8-bit read only register that contains the
low part of the counter value (transferred by the input capture 1 event).
OUTPUT COMPARE 1 LOW REGISTER
(OC1LR)
Read/Write
Reset Value: 0000 0000 (00h)
This is an 8-bit register that contains the low part of
the value to be compared to the CLR register.
7
0
7
0
MSB
LSB
MSB
LSB
71/171
ST72260G, ST72262G, ST72264G
16-BIT TIMER (Cont’d)
OUTPUT COMPARE 2 HIGH REGISTER
(OC2HR)
Read/Write
Reset Value: 1000 0000 (80h)
This is an 8-bit register that contains the high part
of the value to be compared to the CHR register.
ALTERNATE COUNTER HIGH REGISTER
(ACHR)
Read Only
Reset Value: 1111 1111 (FFh)
This is an 8-bit register that contains the high part
of the counter value.
7
0
7
0
MSB
LSB
MSB
LSB
OUTPUT COMPARE 2 LOW REGISTER
(OC2LR)
Read/Write
Reset Value: 0000 0000 (00h)
This is an 8-bit register that contains the low part of
the value to be compared to the CLR register.
7
0
MSB
LSB
COUNTER HIGH REGISTER (CHR)
Read Only
Reset Value: 1111 1111 (FFh)
This is an 8-bit register that contains the high part
of the counter value.
7
0
MSB
LSB
COUNTER LOW REGISTER (CLR)
Read Only
Reset Value: 1111 1100 (FCh)
This is an 8-bit register that contains the low part of
the counter value. A write to this register resets the
counter. An access to this register after accessing
the CSR register clears the TOF bit.
7
0
MSB
LSB
72/171
ALTERNATE COUNTER LOW REGISTER
(ACLR)
Read Only
Reset Value: 1111 1100 (FCh)
This is an 8-bit register that contains the low part of
the counter value. A write to this register resets the
counter. An access to this register after an access
to CSR register does not clear the TOF bit in the
CSR register.
7
0
MSB
LSB
INPUT CAPTURE 2 HIGH REGISTER (IC2HR)
Read Only
Reset Value: Undefined
This is an 8-bit read only register that contains the
high part of the counter value (transferred by the
Input Capture 2 event).
7
0
MSB
LSB
INPUT CAPTURE 2 LOW REGISTER (IC2LR)
Read Only
Reset Value: Undefined
This is an 8-bit read only register that contains the
low part of the counter value (transferred by the Input Capture 2 event).
7
0
MSB
LSB
ST72260G, ST72262G, ST72264G
16-BIT TIMER (Cont’d)
Table 15. 16-Bit Timer Register Map and Reset Values
Address
(Hex.)
Register
Label
Timer A: 32 CR1
Timer B: 42 Reset Value
Timer A: 31 CR2
Timer B: 41 Reset Value
Timer A: 33 CSR
Timer B: 43 Reset Value
Timer A: 34 IC1HR
Timer B: 44 Reset Value
Timer A: 35 IC1LR
Timer B: 45 Reset Value
Timer A: 36 OC1HR
Timer B: 46 Reset Value
Timer A: 37 OC1LR
Timer B: 47 Reset Value
Timer A: 3E OC2HR
Timer B: 4E Reset Value
Timer A: 3F OC2LR
Timer B: 4F Reset Value
Timer A: 38 CHR
Timer B: 48 Reset Value
Timer A: 39 CLR
Timer B: 49 Reset Value
Timer A: 3A ACHR
Timer B: 4A Reset Value
Timer A: 3B ACLR
Timer B: 4B Reset Value
Timer A: 3C ICHR2
Timer B: 4C Reset Value
Timer A: 3D ICLR2
Timer B: 4D Reset Value
7
6
5
4
3
2
1
0
ICIE
OCIE
TOIE
FOLV2
FOLV1
OLVL2
IEDG1
OLVL1
0
0
0
0
0
0
0
0
OC1E
OC2E
OPM
PWM
CC1
CC0
IEDG2
EXEDG
0
0
0
0
0
0
0
0
ICF1
OCF1
TOF
ICF2
OCF2
TIMD
-
-
x
x
x
x
x
0
x
x
MSB
-
-
-
-
-
-
-
LSB
-
MSB
-
-
-
-
-
-
-
LSB
-
MSB
-
-
-
-
-
-
-
LSB
-
MSB
-
-
-
-
-
-
-
LSB
-
MSB
-
-
-
-
-
-
-
LSB
-
MSB
-
-
-
-
-
-
-
LSB
-
MSB
1
1
1
1
1
1
1
LSB
1
MSB
1
1
1
1
1
1
0
LSB
0
MSB
1
1
1
1
1
1
1
LSB
1
MSB
1
1
1
1
1
1
0
LSB
0
MSB
-
-
-
-
-
-
-
LSB
-
MSB
-
-
-
-
-
-
-
LSB
-
73/171
ST72260G, ST72262G, ST72264G
11.4 SERIAL PERIPHERAL INTERFACE (SPI)
11.4.1 Introduction
The Serial Peripheral Interface (SPI) allows fullduplex, synchronous, serial communication with
external devices. An SPI system may consist of a
master and one or more slaves or a system in
which devices may be either masters or slaves.
11.4.2 Main Features
■ Full duplex synchronous transfers (on 3 lines)
■ Simplex synchronous transfers (on 2 lines)
■ Master or slave operation
■ Six master mode frequencies (fCPU/4 max.)
■ fCPU/2 max. slave mode frequency
■ SS Management by software or hardware
■ Programmable clock polarity and phase
■ End of transfer interrupt flag
■ Write collision, Master Mode Fault and Overrun
flags
11.4.3 General Description
Figure 47 shows the serial peripheral interface
(SPI) block diagram. There are 3 registers:
– SPI Control Register (SPICR)
– SPI Control/Status Register (SPICSR)
– SPI Data Register (SPIDR)
The SPI is connected to external devices through
3 pins:
– MISO: Master In / Slave Out data
– MOSI: Master Out / Slave In data
– SCK: Serial Clock out by SPI masters and input by SPI slaves
– SS: Slave select:
This input signal acts as a ‘chip select’ to let
the SPI master communicate with slaves individually and to avoid contention on the data
lines. Slave SS inputs can be driven by standard I/O ports on the master Device.
Figure 47. Serial Peripheral Interface Block Diagram
Data/Address Bus
SPIDR
Read
Interrupt
request
Read Buffer
MOSI
MISO
8-Bit Shift Register
SPICSR
7
SPIF WCOL OVR MODF
SOD
bit
SS
SPI
STATE
CONTROL
7
SPIE
MASTER
CONTROL
SERIAL CLOCK
GENERATOR
74/171
SOD SSM
SSI
Write
SCK
SS
0
0
1
0
SPICR
0
SPE SPR2 MSTR CPOL CPHA SPR1 SPR0
ST72260G, ST72262G, ST72264G
SERIAL PERIPHERAL INTERFACE (Cont’d)
11.4.3.1 Functional Description
A basic example of interconnections between a
single master and a single slave is illustrated in
Figure 48.
The MOSI pins are connected together and the
MISO pins are connected together. In this way
data is transferred serially between master and
slave (most significant bit first).
The communication is always initiated by the master. When the master device transmits data to a
slave device via MOSI pin, the slave device re-
sponds by sending data to the master device via
the MISO pin. This implies full duplex communication with both data out and data in synchronized
with the same clock signal (which is provided by
the master device via the SCK pin).
To use a single data line, the MISO and MOSI pins
must be connected at each node ( in this case only
simplex communication is possible).
Four possible data/clock timing relationships may
be chosen (see Figure 51) but master and slave
must be programmed with the same timing mode.
Figure 48. Single Master/ Single Slave Application
SLAVE
MASTER
MSBit
LSBit
8-BIT SHIFT REGISTER
SPI
CLOCK
GENERATOR
MSBit
MISO
MISO
MOSI
MOSI
SCK
SS
LSBit
8-BIT SHIFT REGISTER
SCK
+5V
SS
Not used if SS is managed
by software
75/171
ST72260G, ST72262G, ST72264G
SERIAL PERIPHERAL INTERFACE (Cont’d)
11.4.3.2 Slave Select Management
As an alternative to using the SS pin to control the
Slave Select signal, the application can choose to
manage the Slave Select signal by software. This
is configured by the SSM bit in the SPICSR register (see Figure 50)
In software management, the external SS pin is
free for other application uses and the internal SS
signal level is driven by writing to the SSI bit in the
SPICSR register.
In Master mode:
– SS internal must be held high continuously
In Slave Mode:
There are two cases depending on the data/clock
timing relationship (see Figure 49):
If CPHA=1 (data latched on 2nd clock edge):
– SS internal must be held low during the entire
transmission. This implies that in single slave
applications the SS pin either can be tied to
VSS, or made free for standard I/O by managing the SS function by software (SSM= 1 and
SSI=0 in the in the SPICSR register)
If CPHA=0 (data latched on 1st clock edge):
– SS internal must be held low during byte
transmission and pulled high between each
byte to allow the slave to write to the shift register. If SS is not pulled high, a Write Collision
error will occur when the slave writes to the
shift register (see Section 11.4.5.3).
Figure 49. Generic SS Timing Diagram
MOSI/MISO
Byte 1
Byte 2
Master SS
Slave SS
(if CPHA=0)
Slave SS
(if CPHA=1)
Figure 50. Hardware/Software Slave Select Management
SSM bit
76/171
SSI bit
1
SS external pin
0
SS internal
Byte 3
ST72260G, ST72262G, ST72264G
SERIAL PERIPHERAL INTERFACE (Cont’d)
11.4.3.3 Master Mode Operation
In master mode, the serial clock is output on the
SCK pin. The clock frequency, polarity and phase
are configured by software (refer to the description
of the SPICSR register).
Note: The idle state of SCK must correspond to
the polarity selected in the SPICSR register (by
pulling up SCK if CPOL=1 or pulling down SCK if
CPOL=0).
To operate the SPI in master mode, perform the
following two steps in order (if the SPICSR register
is not written first, the SPICR register setting may
be not taken into account):
1. Write to the SPICSR register:
– Select the clock frequency by configuring the
SPR[2:0] bits.
– Select the clock polarity and clock phase by
configuring the CPOL and CPHA bits. Figure
51 shows the four possible configurations.
Note: The slave must have the same CPOL
and CPHA settings as the master.
– Either set the SSM bit and set the SSI bit or
clear the SSM bit and tie the SS pin high for
the complete byte transmit sequence.
2. Write to the SPICR register:
– Set the MSTR and SPE bits
Note: MSTR and SPE bits remain set only if
SS is high).
The transmit sequence begins when software
writes a byte in the SPIDR register.
11.4.3.4 Master Mode Transmit Sequence
When software writes to the SPIDR register, the
data byte is loaded into the 8-bit shift register and
then shifted out serially to the MOSI pin most significant bit first.
When data transfer is complete:
– The SPIF bit is set by hardware
– An interrupt request is generated if the SPIE
bit is set and the interrupt mask in the CCR
register is cleared.
Clearing the SPIF bit is performed by the following
software sequence:
1. An access to the SPICSR register while the
SPIF bit is set
2. A read to the SPIDR register.
Note: While the SPIF bit is set, all writes to the
SPIDR register are inhibited until the SPICSR register is read.
11.4.3.5 Slave Mode Operation
In slave mode, the serial clock is received on the
SCK pin from the master device.
To operate the SPI in slave mode:
1. Write to the SPICSR register to perform the following actions:
– Select the clock polarity and clock phase by
configuring the CPOL and CPHA bits (see
Figure 51).
Note: The slave must have the same CPOL
and CPHA settings as the master.
– Manage the SS pin as described in Section
11.4.3.2 and Figure 49. If CPHA=1 SS must
be held low continuously. If CPHA=0 SS must
be held low during byte transmission and
pulled up between each byte to let the slave
write in the shift register.
2. Write to the SPICR register to clear the MSTR
bit and set the SPE bit to enable the SPI I/O
functions.
11.4.3.6 Slave Mode Transmit Sequence
When software writes to the SPIDR register, the
data byte is loaded into the 8-bit shift register and
then shifted out serially to the MISO pin most significant bit first.
The transmit sequence begins when the slave device receives the clock signal and the most significant bit of the data on its MOSI pin.
When data transfer is complete:
– The SPIF bit is set by hardware
– An interrupt request is generated if SPIE bit is
set and interrupt mask in the CCR register is
cleared.
Clearing the SPIF bit is performed by the following
software sequence:
1. An access to the SPICSR register while the
SPIF bit is set.
2. A write or a read to the SPIDR register.
Notes: While the SPIF bit is set, all writes to the
SPIDR register are inhibited until the SPICSR register is read.
The SPIF bit can be cleared during a second
transmission; however, it must be cleared before
the second SPIF bit in order to prevent an Overrun
condition (see Section 11.4.5.2).
77/171
ST72260G, ST72262G, ST72264G
SERIAL PERIPHERAL INTERFACE (Cont’d)
11.4.4 Clock Phase and Clock Polarity
Four possible timing relationships may be chosen
by software, using the CPOL and CPHA bits (See
Figure 51).
Note: The idle state of SCK must correspond to
the polarity selected in the SPICSR register (by
pulling up SCK if CPOL=1 or pulling down SCK if
CPOL=0).
The combination of the CPOL clock polarity and
CPHA (clock phase) bits selects the data capture
clock edge
Figure 51, shows an SPI transfer with the four
combinations of the CPHA and CPOL bits. The diagram may be interpreted as a master or slave
timing diagram where the SCK pin, the MISO pin,
the MOSI pin are directly connected between the
master and the slave device.
Note: If CPOL is changed at the communication
byte boundaries, the SPI must be disabled by resetting the SPE bit.
Figure 51. Data Clock Timing Diagram
CPHA =1
SCK
(CPOL = 1)
SCK
(CPOL = 0)
MISO
(from master)
MOSI
(from slave)
MSBit
Bit 6
Bit 5
Bit 4
Bit3
Bit 2
Bit 1
LSBit
MSBit
Bit 6
Bit 5
Bit 4
Bit3
Bit 2
Bit 1
LSBit
SS
(to slave)
CAPTURE STROBE
CPHA =0
SCK
(CPOL = 1)
SCK
(CPOL = 0)
MISO
(from master)
MOSI
(from slave)
MSBit
MSBit
Bit 6
Bit 5
Bit 4
Bit3
Bit 2
Bit 1
LSBit
Bit 6
Bit 5
Bit 4
Bit3
Bit 2
Bit 1
LSBit
SS
(to slave)
CAPTURE STROBE
Note: This figure should not be used as a replacement for parametric information.
Refer to the Electrical Characteristics chapter.
78/171
ST72260G, ST72262G, ST72264G
SERIAL PERIPHERAL INTERFACE (Cont’d)
11.4.5 Error Flags
11.4.5.1 Master Mode Fault (MODF)
Master mode fault occurs when the master device
has its SS pin pulled low.
When a Master mode fault occurs:
– The MODF bit is set and an SPI interrupt request is generated if the SPIE bit is set.
– The SPE bit is reset. This blocks all output
from the Device and disables the SPI peripheral.
– The MSTR bit is reset, thus forcing the Device
into slave mode.
Clearing the MODF bit is done through a software
sequence:
1. A read access to the SPICSR register while the
MODF bit is set.
2. A write to the SPICR register.
Notes: To avoid any conflicts in an application
with multiple slaves, the SS pin must be pulled
high during the MODF bit clearing sequence. The
SPE and MSTR bits may be restored to their original state during or after this clearing sequence.
Hardware does not allow the user to set the SPE
and MSTR bits while the MODF bit is set except in
the MODF bit clearing sequence.
In a slave device, the MODF bit can not be set, but
in a multi master configuration the Device can be in
slave mode with the MODF bit set.
The MODF bit indicates that there might have
been a multi-master conflict and allows software to
handle this using an interrupt routine and either
perform to a reset or return to an application default state.
11.4.5.2 Overrun Condition (OVR)
An overrun condition occurs, when the master device has sent a data byte and the slave device has
not cleared the SPIF bit issued from the previously
transmitted byte.
When an Overrun occurs:
– The OVR bit is set and an interrupt request is
generated if the SPIE bit is set.
In this case, the receiver buffer contains the byte
sent after the SPIF bit was last cleared. A read to
the SPIDR register returns this byte. All other
bytes are lost.
The OVR bit is cleared by reading the SPICSR
register.
11.4.5.3 Write Collision Error (WCOL)
A write collision occurs when the software tries to
write to the SPIDR register while a data transfer is
taking place with an external device. When this
happens, the transfer continues uninterrupted;
and the software write will be unsuccessful.
Write collisions can occur both in master and slave
mode. See also Section 11.4.3.2 "Slave Select
Management" on page 76.
Note: a "read collision" will never occur since the
received data byte is placed in a buffer in which
access is always synchronous with the CPU operation.
The WCOL bit in the SPICSR register is set if a
write collision occurs.
No SPI interrupt is generated when the WCOL bit
is set (the WCOL bit is a status flag only).
Clearing the WCOL bit is done through a software
sequence (see Figure 52).
Figure 52. Clearing the WCOL bit (Write Collision Flag) Software Sequence
Clearing sequence after SPIF = 1 (end of a data byte transfer)
1st Step
Read SPICSR
RESULT
2nd Step
Read SPIDR
SPIF =0
WCOL=0
Clearing sequence before SPIF = 1 (during a data byte transfer)
1st Step
Read SPICSR
RESULT
2nd Step
Read SPIDR
WCOL=0
Note: Writing to the SPIDR register instead of reading it does not
reset the WCOL bit
79/171
ST72260G, ST72262G, ST72264G
SERIAL PERIPHERAL INTERFACE (Cont’d)
11.4.5.4 Single Master and Multimaster
Configurations
There are two types of SPI systems:
– Single Master System
– Multimaster System
Single Master System
A typical single master system may be configured,
using a device as the master and four devices as
slaves (see Figure 53).
The master device selects the individual slave devices by using four pins of a parallel port to control
the four SS pins of the slave devices.
The SS pins are pulled high during reset since the
master device ports will be forced to be inputs at
that time, thus disabling the slave devices.
Note: To prevent a bus conflict on the MISO line
the master allows only one active slave device
during a transmission.
For more security, the slave device may respond
to the master with the received data byte. Then the
master will receive the previous byte back from the
slave device if all MISO and MOSI pins are connected and the slave has not written to its SPIDR
register.
Other transmission security methods can use
ports for handshake lines or data bytes with command fields.
Multi-Master System
A multi-master system may also be configured by
the user. Transfer of master control could be implemented using a handshake method through the
I/O ports or by an exchange of code messages
through the serial peripheral interface system.
The multi-master system is principally handled by
the MSTR bit in the SPICR register and the MODF
bit in the SPICSR register.
Figure 53. Single Master / Multiple Slave Configuration
SS
SCK
Slave
Device
SS
SCK
Slave
Device
SS
SCK
Slave
Device
SS
SCK
Slave
Device
MOSI MISO
MOSI MISO
MOSI MISO
MOSI MISO
SCK
Master
Device
5V
80/171
SS
Ports
MOSI MISO
ST72260G, ST72262G, ST72264G
SERIAL PERIPHERAL INTERFACE (Cont’d)
11.4.6 Low Power Modes
Mode
WAIT
HALT
Description
No effect on SPI.
SPI interrupt events cause the Device to exit
from WAIT mode.
SPI registers are frozen.
In HALT mode, the SPI is inactive. SPI operation resumes when the Device is woken up
by an interrupt with “exit from HALT mode”
capability. The data received is subsequently
read from the SPIDR register when the software is running (interrupt vector fetching). If
several data are received before the wakeup event, then an overrun error is generated.
This error can be detected after the fetch of
the interrupt routine that woke up the Device.
11.4.6.1 Using the SPI to wake-up the Device
from Halt mode
In slave configuration, the SPI is able to wake-up
the Device from HALT mode through a SPIF interrupt. The data received is subsequently read from
the SPIDR register when the software is running
(interrupt vector fetch). If multiple data transfers
have been performed before software clears the
SPIF bit, then the OVR bit is set by hardware.
Note: When waking up from Halt mode, if the SPI
remains in Slave mode, it is recommended to perform an extra communications cycle to bring the
SPI from Halt mode state to normal state. If the
SPI exits from Slave mode, it returns to normal
state immediately.
Caution: The SPI can wake-up the Device from
Halt mode only if the Slave Select signal (external
SS pin or the SSI bit in the SPICSR register) is low
when the Device enters Halt mode. So if Slave selection is configured as external (see Section
11.4.3.2), make sure the master drives a low level
on the SS pin when the slave enters Halt mode.
11.4.7 Interrupts
Interrupt Event
Event
Flag
SPI End of TransSPIF
fer Event
Master Mode
MODF
Fault Event
Overrun Error
OVR
Enable
Control
Bit
SPIE
Exit
from
Wait
Exit
from
Halt
Yes
Yes
Yes
No
Yes
No
Note: The SPI interrupt events are connected to
the same interrupt vector (see Interrupts chapter).
They generate an interrupt if the corresponding
Enable Control Bit is set and the interrupt mask in
the CC register is reset (RIM instruction).
81/171
ST72260G, ST72262G, ST72264G
SERIAL PERIPHERAL INTERFACE (Cont’d)
11.4.8 Register Description
CONTROL REGISTER (SPICR)
Read/Write
Reset Value: 0000 xxxx (0xh)
7
SPIE
0
SPE
SPR2
MSTR
CPOL
CPHA
SPR1
SPR0
Bit 7 = SPIE Serial Peripheral Interrupt Enable.
This bit is set and cleared by software.
0: Interrupt is inhibited
1: An SPI interrupt is generated whenever an End
of Transfer event, Master Mode Fault or Overrun error occurs (SPIF=1, MODF=1 or OVR=1
in the SPICSR register)
Bit 6 = SPE Serial Peripheral Output Enable.
This bit is set and cleared by software. It is also
cleared by hardware when, in master mode, SS=0
(see Section 11.4.5.1 "Master Mode Fault
(MODF)" on page 79). The SPE bit is cleared by
reset, so the SPI peripheral is not initially connected to the external pins.
0: I/O pins free for general purpose I/O
1: SPI I/O pin alternate functions enabled
Bit 5 = SPR2 Divider Enable.
This bit is set and cleared by software and is
cleared by reset. It is used with the SPR[1:0] bits to
set the baud rate. Refer to Table 16 SPI Master
mode SCK Frequency.
0: Divider by 2 enabled
1: Divider by 2 disabled
Note: This bit has no effect in slave mode.
Bit 4 = MSTR Master Mode.
This bit is set and cleared by software. It is also
cleared by hardware when, in master mode, SS=0
(see Section 11.4.5.1 "Master Mode Fault
(MODF)" on page 79).
0: Slave mode
1: Master mode. The function of the SCK pin
changes from an input to an output and the functions of the MISO and MOSI pins are reversed.
82/171
Bit 3 = CPOL Clock Polarity.
This bit is set and cleared by software. This bit determines the idle state of the serial Clock. The
CPOL bit affects both the master and slave
modes.
0: SCK pin has a low level idle state
1: SCK pin has a high level idle state
Note: If CPOL is changed at the communication
byte boundaries, the SPI must be disabled by resetting the SPE bit.
Bit 2 = CPHA Clock Phase.
This bit is set and cleared by software.
0: The first clock transition is the first data capture
edge.
1: The second clock transition is the first capture
edge.
Note: The slave must have the same CPOL and
CPHA settings as the master.
Bits 1:0 = SPR[1:0] Serial Clock Frequency.
These bits are set and cleared by software. Used
with the SPR2 bit, they select the baud rate of the
SPI serial clock SCK output by the SPI in master
mode.
Note: These 2 bits have no effect in slave mode.
Table 16. SPI Master mode SCK Frequency
Serial Clock
SPR2
SPR1
SPR0
fCPU/4
1
0
0
fCPU/8
0
0
0
fCPU/16
0
0
1
fCPU/32
1
1
0
fCPU/64
0
1
0
fCPU/128
0
1
1
ST72260G, ST72262G, ST72264G
SERIAL PERIPHERAL INTERFACE (Cont’d)
CONTROL/STATUS REGISTER (SPICSR)
Read/Write (some bits Read Only)
Reset Value: 0000 0000 (00h)
7
SPIF
Bit 3 = Reserved, must be kept cleared.
0
WCOL
OVR
MODF
-
SOD
SSM
SSI
Bit 7 = SPIF Serial Peripheral Data Transfer Flag
(Read only).
This bit is set by hardware when a transfer has
been completed. An interrupt is generated if
SPIE=1 in the SPICR register. It is cleared by a
software sequence (an access to the SPICSR
register followed by a write or a read to the
SPIDR register).
0: Data transfer is in progress or the flag has been
cleared.
1: Data transfer between the Device and an external device has been completed.
Note: While the SPIF bit is set, all writes to the
SPIDR register are inhibited until the SPICSR register is read.
Bit 6 = WCOL Write Collision status (Read only).
This bit is set by hardware when a write to the
SPIDR register is done during a transmit sequence. It is cleared by a software sequence (see
Figure 52).
0: No write collision occurred
1: A write collision has been detected
Bit 2 = SOD SPI Output Disable.
This bit is set and cleared by software. When set, it
disables the alternate function of the SPI output
(MOSI in master mode / MISO in slave mode)
0: SPI output enabled (if SPE=1)
1: SPI output disabled
Bit 1 = SSM SS Management.
This bit is set and cleared by software. When set, it
disables the alternate function of the SPI SS pin
and uses the SSI bit value instead. See Section
11.4.3.2 "Slave Select Management" on page 76.
0: Hardware management (SS managed by external pin)
1: Software management (internal SS signal controlled by SSI bit. External SS pin free for general-purpose I/O)
Bit 0 = SSI SS Internal Mode.
This bit is set and cleared by software. It acts as a
‘chip select’ by controlling the level of the SS slave
select signal when the SSM bit is set.
0 : Slave selected
1 : Slave deselected
DATA I/O REGISTER (SPIDR)
Read/Write
Reset Value: Undefined
7
Bit 5 = OVR SPI Overrun error (Read only).
This bit is set by hardware when the byte currently
being received in the shift register is ready to be
transferred into the SPIDR register while SPIF = 1
(See Section 11.4.5.2). An interrupt is generated if
SPIE = 1 in SPICSR register. The OVR bit is
cleared by software reading the SPICSR register.
0: No overrun error
1: Overrun error detected
Bit 4 = MODF Mode Fault flag (Read only).
This bit is set by hardware when the SS pin is
pulled low in master mode (see Section 11.4.5.1
"Master Mode Fault (MODF)" on page 79). An SPI
interrupt can be generated if SPIE=1 in the SPICSR register. This bit is cleared by a software sequence (An access to the SPICSR register while
MODF=1 followed by a write to the SPICR register).
0: No master mode fault detected
1: A fault in master mode has been detected
D7
0
D6
D5
D4
D3
D2
D1
D0
The SPIDR register is used to transmit and receive
data on the serial bus. In a master device, a write
to this register will initiate transmission/reception
of another byte.
Notes: During the last clock cycle the SPIF bit is
set, a copy of the received data byte in the shift
register is moved to a buffer. When the user reads
the serial peripheral data I/O register, the buffer is
actually being read.
While the SPIF bit is set, all writes to the SPIDR
register are inhibited until the SPICSR register is
read.
Warning: A write to the SPIDR register places
data directly into the shift register for transmission.
A read to the SPIDR register returns the value located in the buffer and not the content of the shift
register (see Figure 47).
83/171
ST72260G, ST72262G, ST72264G
SERIAL PERIPHERAL INTERFACE (Cont’d)
Table 17. SPI Register Map and Reset Values
Address
Register
Label
7
6
5
4
3
2
1
0
0021h
SPIDR
Reset Value
MSB
x
x
x
x
x
x
x
LSB
x
0022h
SPICR
Reset Value
SPIE
0
SPE
0
SPR2
0
MSTR
0
CPOL
x
CPHA
x
SPR1
x
SPR0
x
0023h
SPICSR
Reset Value
SPIF
0
WCOL
0
OR
0
MODF
0
0
SOD
0
SSM
0
SSI
0
(Hex.)
84/171
ST72260G, ST72262G, ST72264G
11.5 SERIAL COMMUNICATIONS INTERFACE (SCI)
11.5.1 Introduction
The Serial Communications Interface (SCI) offers
a flexible means of full-duplex data exchange with
external equipment requiring an industry standard
NRZ asynchronous serial data format. The SCI offers a very wide range of baud rates using two
baud rate generator systems.
11.5.2 Main Features
■ Full duplex, asynchronous communications
■ NRZ standard format (Mark/Space)
■ Dual baud rate generator systems
■ Independently
programmable transmit and
receive baud rates up to 500K baud.
■ Programmable data word length (8 or 9 bits)
■ Receive buffer full, Transmit buffer empty and
End of Transmission flags
■ Two receiver wake-up modes:
– Address bit (MSB)
– Idle line
■ Muting function for multiprocessor configurations
■ Separate enable bits for Transmitter and
Receiver
■ Four error detection flags:
– Overrun error
– Noise error
– Frame error
– Parity error
■ Five interrupt sources with flags:
– Transmit data register empty
– Transmission complete
– Receive data register full
– Idle line received
– Overrun error detected
■ Parity control:
– Transmits parity bit
– Checks parity of received data byte
■ Reduced power consumption mode
11.5.3 General Description
The interface is externally connected to another
device by two pins (see Figure 55):
– TDO: Transmit Data Output. When the transmitter and the receiver are disabled, the output pin
returns to its I/O port configuration. When the
transmitter and/or the receiver are enabled and
nothing is to be transmitted, the TDO pin is at
high level.
– RDI: Receive Data Input is the serial data input.
Oversampling techniques are used for data recovery by discriminating between valid incoming
data and noise.
Through these pins, serial data is transmitted and
received as frames comprising:
– An Idle Line prior to transmission or reception
– A start bit
– A data word (8 or 9 bits) least significant bit first
– A Stop bit indicating that the frame is complete.
This interface uses two types of baud rate generator:
– A conventional type for commonly-used baud
rates,
– An extended type with a prescaler offering a very
wide range of baud rates even with non-standard
oscillator frequencies.
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ST72260G, ST72262G, ST72264G
SERIAL COMMUNICATIONS INTERFACE (Cont’d)
Figure 54. SCI Block Diagram
Write
Read
(DATA REGISTER) DR
Received Data Register (RDR)
Transmit Data Register (TDR)
TDO
Received Shift Register
Transmit Shift Register
RDI
CR1
R8
TRANSMIT
WAKE
UP
CONTROL
UNIT
T8
SCID
M WAKE PCE PS
PIE
RECEIVER
CLOCK
RECEIVER
CONTROL
CR2
SR
TIE TCIE RIE
ILIE
TE
RE RWU SBK
TDRE TC RDRF IDLE OR
NF
FE
SCI
INTERRUPT
CONTROL
TRANSMITTER
CLOCK
TRANSMITTER RATE
fCPU
CONTROL
/16
/PR
BRR
SCP1 SCP0 SCT2 SCT1 SCT0 SCR2 SCR1SCR0
RECEIVER RATE
CONTROL
CONVENTIONAL BAUD RATE GENERATOR
86/171
PE
ST72260G, ST72262G, ST72264G
SERIAL COMMUNICATIONS INTERFACE (Cont’d)
11.5.4 Functional Description
The block diagram of the Serial Control Interface,
is shown in Figure 54. It contains 6 dedicated registers:
– Two control registers (SCICR1 & SCICR2)
– A status register (SCISR)
– A baud rate register (SCIBRR)
– An extended prescaler receiver register (SCIERPR)
– An extended prescaler transmitter register (SCIETPR)
Refer to the register descriptions in Section
11.5.7for the definitions of each bit.
11.5.4.1 Serial Data Format
Word length may be selected as being either 8 or 9
bits by programming the M bit in the SCICR1 register (see Figure 54).
The TDO pin is in low state during the start bit.
The TDO pin is in high state during the stop bit.
An Idle character is interpreted as an entire frame
of “1”s followed by the start bit of the next frame
which contains data.
A Break character is interpreted on receiving “0”s
for some multiple of the frame period. At the end of
the last break frame the transmitter inserts an extra “1” bit to acknowledge the start bit.
Transmission and reception are driven by their
own baud rate generator.
Figure 55. Word Length Programming
9-bit Word length (M bit is set)
Possible
Parity
Bit
Data Frame
Start
Bit
Bit0
Bit2
Bit1
Bit3
Bit4
Bit5
Bit6
Start
Bit
Break Frame
Extra
’1’
Possible
Parity
Bit
Data Frame
Bit0
Bit8
Next
Stop Start
Bit
Bit
Idle Frame
8-bit Word length (M bit is reset)
Start
Bit
Bit7
Next Data Frame
Bit1
Bit2
Bit3
Bit4
Bit5
Bit6
Bit7
Start
Bit
Next Data Frame
Stop
Bit
Next
Start
Bit
Idle Frame
Start
Bit
Break Frame
Extra Start
Bit
’1’
87/171
ST72260G, ST72262G, ST72264G
SERIAL COMMUNICATIONS INTERFACE (Cont’d)
11.5.4.2 Transmitter
The transmitter can send data words of either 8 or
9 bits depending on the M bit status. When the M
bit is set, word length is 9 bits and the 9th bit (the
MSB) has to be stored in the T8 bit in the SCICR1
register.
Character Transmission
During an SCI transmission, data shifts out least
significant bit first on the TDO pin. In this mode,
the SCIDR register consists of a buffer (TDR) between the internal bus and the transmit shift register (see Figure 54).
Procedure
– Select the M bit to define the word length.
– Select the desired baud rate using the SCIBRR
and the SCIETPR registers.
– Set the TE bit to assign the TDO pin to the alternate function and to send a idle frame as first
transmission.
– Access the SCISR register and write the data to
send in the SCIDR register (this sequence clears
the TDRE bit). Repeat this sequence for each
data to be transmitted.
Clearing the TDRE bit is always performed by the
following software sequence:
1. An access to the SCISR register
2. A write to the SCIDR register
The TDRE bit is set by hardware and it indicates:
– The TDR register is empty.
– The data transfer is beginning.
– The next data can be written in the SCIDR register without overwriting the previous data.
This flag generates an interrupt if the TIE bit is set
and the I bit is cleared in the CCR register.
When a transmission is taking place, a write instruction to the SCIDR register stores the data in
the TDR register and which is copied in the shift
register at the end of the current transmission.
When no transmission is taking place, a write instruction to the SCIDR register places the data directly in the shift register, the data transmission
starts, and the TDRE bit is immediately set.
88/171
When a frame transmission is complete (after the
stop bit or after the break frame) the TC bit is set
and an interrupt is generated if the TCIE is set and
the I bit is cleared in the CCR register.
Clearing the TC bit is performed by the following
software sequence:
1. An access to the SCISR register
2. A write to the SCIDR register
Note: The TDRE and TC bits are cleared by the
same software sequence.
Break Characters
Setting the SBK bit loads the shift register with a
break character. The break frame length depends
on the M bit (see Figure 55).
As long as the SBK bit is set, the SCI send break
frames to the TDO pin. After clearing this bit by
software the SCI insert a logic 1 bit at the end of
the last break frame to guarantee the recognition
of the start bit of the next frame.
Idle Characters
Setting the TE bit drives the SCI to send an idle
frame before the first data frame.
Clearing and then setting the TE bit during a transmission sends an idle frame after the current word.
Note: Resetting and setting the TE bit causes the
data in the TDR register to be lost. Therefore the
best time to toggle the TE bit is when the TDRE bit
is set i.e. before writing the next byte in the SCIDR.
ST72260G, ST72262G, ST72264G
SERIAL COMMUNICATIONS INTERFACE (Cont’d)
11.5.4.3 Receiver
The SCI can receive data words of either 8 or 9
bits. When the M bit is set, word length is 9 bits
and the MSB is stored in the R8 bit in the SCICR1
register.
Character reception
During a SCI reception, data shifts in least significant bit first through the RDI pin. In this mode, the
SCIDR register consists or a buffer (RDR) between the internal bus and the received shift register (see Figure 54).
Procedure
– Select the M bit to define the word length.
– Select the desired baud rate using the SCIBRR
and the SCIERPR registers.
– Set the RE bit, this enables the receiver which
begins searching for a start bit.
When a character is received:
– The RDRF bit is set. It indicates that the content
of the shift register is transferred to the RDR.
– An interrupt is generated if the RIE bit is set and
the I bit is cleared in the CCR register.
– The error flags can be set if a frame error, noise
or an overrun error has been detected during reception.
Clearing the RDRF bit is performed by the following
software sequence done by:
1. An access to the SCISR register
2. A read to the SCIDR register.
The RDRF bit must be cleared before the end of the
reception of the next character to avoid an overrun
error.
Break Character
When a break character is received, the SPI handles it as a framing error.
Idle Character
When a idle frame is detected, there is the same
procedure as a data received character plus an interrupt if the ILIE bit is set and the I bit is cleared in
the CCR register.
Overrun Error
An overrun error occurs when a character is received when RDRF has not been reset. Data can
not be transferred from the shift register to the
RDR register as long as the RDRF bit is not
cleared.
When a overrun error occurs:
– The OR bit is set.
– The RDR content will not be lost.
– The shift register will be overwritten.
– An interrupt is generated if the RIE bit is set and
the I bit is cleared in the CCR register.
The OR bit is reset by an access to the SCISR register followed by a SCIDR register read operation.
Noise Error
Oversampling techniques are used for data recovery by discriminating between valid incoming data
and noise.
When noise is detected in a frame:
– The NF is set at the rising edge of the RDRF bit.
– Data is transferred from the Shift register to the
SCIDR register.
– No interrupt is generated. However this bit rises
at the same time as the RDRF bit which itself
generates an interrupt.
The NF bit is reset by a SCISR register read operation followed by a SCIDR register read operation.
Framing Error
A framing error is detected when:
– The stop bit is not recognized on reception at the
expected time, following either a de-synchronization or excessive noise.
– A break is received.
When the framing error is detected:
– the FE bit is set by hardware
– Data is transferred from the Shift register to the
SCIDR register.
– No interrupt is generated. However this bit rises
at the same time as the RDRF bit which itself
generates an interrupt.
The FE bit is reset by a SCISR register read operation followed by a SCIDR register read operation.
89/171
ST72260G, ST72262G, ST72264G
SERIAL COMMUNICATIONS INTERFACE (Cont’d)
Figure 56. SCI Baud Rate and Extended Prescaler Block Diagram
TRANSMITTER
CLOCK
EXTENDED PRESCALER TRANSMITTER RATE CONTROL
SCIETPR
EXTENDED TRANSMITTER PRESCALER REGISTER
SCIERPR
EXTENDED RECEIVER PRESCALER REGISTER
RECEIVER
CLOCK
EXTENDED PRESCALER RECEIVER RATE CONTROL
EXTENDED PRESCALER
fCPU
TRANSMITTER RATE
CONTROL
/16
/PR
SCIBRR
SCP1 SCP0 SCT2 SCT1 SCT0 SCR2 SCR1SCR0
RECEIVER RATE
CONTROL
CONVENTIONAL BAUD RATE GENERATOR
90/171
ST72260G, ST72262G, ST72264G
SERIAL COMMUNICATIONS INTERFACE (Cont’d)
11.5.4.4 Conventional Baud Rate Generation
with:
The baud rate for the receiver and transmitter (Rx
ETPR = 1,..,255 (see SCIETPR register)
and Tx) are set independently and calculated as
ERPR = 1,.. 255 (see SCIERPR register)
follows:
11.5.4.6 Receiver Muting and Wake-up Feature
fCPU
fCPU
In multiprocessor configurations it is often desiraRx =
Tx =
ble that only the intended message recipient
(16*PR)*RR
(16*PR)*TR
should actively receive the full message contents,
with:
thus reducing redundant SCI service overhead for
all non addressed receivers.
PR = 1, 3, 4 or 13 (see SCP[1:0] bits)
The non addressed devices may be placed in
TR = 1, 2, 4, 8, 16, 32, 64,128
sleep mode by means of the muting function.
(see SCT[2:0] bits)
Setting the RWU bit by software puts the SCI in
RR = 1, 2, 4, 8, 16, 32, 64,128
sleep mode:
(see SCR[2:0] bits)
All the reception status bits can not be set.
All these bits are in the SCIBRR register.
All the receive interrupts are inhibited.
Example: If fCPU is 8 MHz (normal mode) and if
A muted receiver may be awakened by one of the
PR=13 and TR=RR=1, the transmit and receive
following two ways:
baud rates are 38400 baud.
– by Idle Line detection if the WAKE bit is reset,
Note: the baud rate registers MUST NOT be
– by Address Mark detection if the WAKE bit is set.
changed while the transmitter or the receiver is enabled.
Receiver wakes-up by Idle Line detection when
the Receive line has recognised an Idle Frame.
11.5.4.5 Extended Baud Rate Generation
Then the RWU bit is reset by hardware but the
The extended prescaler option gives a very fine
IDLE bit is not set.
tuning on the baud rate, using a 255 value prescalReceiver wakes-up by Address Mark detection
er, whereas the conventional Baud Rate Generawhen it received a “1” as the most significant bit of
tor retains industry standard software compatibilia word, thus indicating that the message is an adty.
dress. The reception of this particular word wakes
The extended baud rate generator block diagram
up the receiver, resets the RWU bit and sets the
is described in the Figure 56.
RDRF bit, which allows the receiver to receive this
word normally and to use it as an address word.
The output clock rate sent to the transmitter or to
the receiver will be the output from the 16 divider
Caution: In Mute mode, do not write to the
divided by a factor ranging from 1 to 255 set in the
SCICR2 register. If the SCI is in Mute mode during
SCIERPR or the SCIETPR register.
the read operation (RWU=1) and a address mark
wake up event occurs (RWU is reset) before the
Note: the extended prescaler is activated by setwrite operation, the RWU bit will be set again by
ting the SCIETPR or SCIERPR register to a value
this write operation. Consequently the address
other than zero. The baud rates are calculated as
byte is lost and the SCI is not woken up from Mute
follows:
mode.
fCPU
fCPU
Rx =
Tx =
16*ERPR*(PR*RR)
16*ETPR*(PR*TR)
91/171
ST72260G, ST72262G, ST72264G
SERIAL COMMUNICATIONS INTERFACE (Cont’d)
11.5.4.7 Parity Control
Parity control (generation of parity bit in trasmission and and parity chencking in reception) can be
enabled by setting the PCE bit in the SCICR1 register. Depending on the frame length defined by
the M bit, the possible SCI frame formats are as
listed in Table 18.
Table 18. Frame Formats
M bit
0
0
1
1
PCE bit
0
1
0
1
SCI frame
| SB | 8 bit data | STB |
| SB | 7-bit data | PB | STB |
| SB | 9-bit data | STB |
| SB | 8-bit data PB | STB |
Legend: SB = Start Bit, STB = Stop Bit,
PB = Parity Bit
Note: In case of wake up by an address mark, the
MSB bit of the data is taken into account and not
the parity bit
Even parity: the parity bit is calculated to obtain
an even number of “1s” inside the frame made of
the 7 or 8 LSB bits (depending on whether M is
equal to 0 or 1) and the parity bit.
Ex: data=00110101; 4 bits set => parity bit will be
0 if even parity is selected (PS bit = 0).
Odd parity: the parity bit is calculated to obtain an
odd number of “1s” inside the frame made of the 7
or 8 LSB bits (depending on whether M is equal to
0 or 1) and the parity bit.
Ex: data=00110101; 4 bits set => parity bit will be
1 if odd parity is selected (PS bit = 1).
Transmission mode: If the PCE bit is set then the
MSB bit of the data written in the data register is
not transmitted but is changed by the parity bit.
Reception mode: If the PCE bit is set then the interface checks if the received data byte has an
even number of “1s” if even parity is selected
92/171
(PS=0) or an odd number of “1s” if odd parity is selected (PS=1). If the parity check fails, the PE flag
is set in the SCISR register and an interrupt is generated if PIE is set in the SCICR1 register.
11.5.5 Low Power Modes
Mode
Description
No effect on SCI.
WAIT
SCI interrupts cause the device to exit
from Wait mode.
SCI registers are frozen.
HALT
In Halt mode, the SCI stops transmitting/receiving until Halt mode is exited.
11.5.6 Interrupts
Interrupt Event
Enable Exit
Event
Control from
Flag
Bit
Wait
Transmit Data Register
TDRE
Empty
Transmission ComTC
plete
Received Data Ready
RDRF
to be Read
Overrun Error Detected OR
Idle Line Detected
IDLE
Parity Error
PE
Exit
from
Halt
TIE
Yes
No
TCIE
Yes
No
Yes
No
Yes
Yes
Yes
No
No
No
RIE
ILIE
PIE
The SCI interrupt events are connected to the
same interrupt vector.
These events generate an interrupt if the corresponding Enable Control Bit is set and the interrupt mask in the CC register is reset (RIM instruction).
ST72260G, ST72262G, ST72264G
SERIAL COMMUNICATIONS INTERFACE (Cont’d)
11.5.7 Register Description
Note: The IDLE bit will not be set again until the
RDRF bit has been set itself (i.e. a new idle line ocSTATUS REGISTER (SCISR)
curs).
Read Only
Reset Value: 1100 0000 (C0h)
Bit 3 = OR Overrun error.
7
0
This bit is set by hardware when the word currently
being received in the shift register is ready to be
TDRE
TC
RDRF IDLE
OR
NF
FE
PE
transferred into the RDR register while RDRF=1.
An interrupt is generated if RIE=1 in the SCICR2
register. It is cleared by a software sequence (an
Bit 7 = TDRE Transmit data register empty.
access to the SCISR register followed by a read to
This bit is set by hardware when the content of the
TDR register has been transferred into the shift
the SCIDR register).
0: No Overrun error
register. An interrupt is generated if the TIE bit=1
1: Overrun error is detected
in the SCICR2 register. It is cleared by a software
sequence (an access to the SCISR register folNote: When this bit is set RDR register content will
lowed by a write to the SCIDR register).
not be lost but the shift register will be overwritten.
0: Data is not transferred to the shift register
1: Data is transferred to the shift register
Bit 2 = NF Noise flag.
Note: Data will not be transferred to the shift regThis bit is set by hardware when noise is detected
ister unless the TDRE bit is cleared.
on a received frame. It is cleared by a software sequence (an access to the SCISR register followed
Bit 6 = TC Transmission complete.
by a read to the SCIDR register).
0: No noise is detected
This bit is set by hardware when transmission of a
1: Noise is detected
frame containing Data, a Preamble or a Break is
complete. An interrupt is generated if TCIE=1 in
Note: This bit does not generate interrupt as it apthe SCICR2 register. It is cleared by a software sepears at the same time as the RDRF bit which itquence (an access to the SCISR register followed
self generates an interrupt.
by a write to the SCIDR register).
0: Transmission is not complete
1: Transmission is complete
Bit 1 = FE Framing error.
This bit is set by hardware when a de-synchronizaNote: TC is not set after the transmission of a Pretion, excessive noise or a break character is deamble or a Break.
tected. It is cleared by a software sequence (an
access to the SCISR register followed by a read to
Bit 5 = RDRF Received data ready flag.
the SCIDR register).
This bit is set by hardware when the content of the
0: No Framing error is detected
RDR register has been transferred to the SCIDR
1: Framing error or break character is detected
register. An interrupt is generated if RIE=1 in the
Note: This bit does not generate interrupt as it apSCICR2 register. It is cleared by a software sepears at the same time as the RDRF bit which itquence (an access to the SCISR register followed
self generates an interrupt. If the word currently
by a read to the SCIDR register).
being transferred causes both frame error and
0: Data is not received
overrun error, it will be transferred and only the OR
1: Received data is ready to be read
bit will be set.
Bit 4 = IDLE Idle line detect.
This bit is set by hardware when a Idle Line is detected. An interrupt is generated if the ILIE=1 in
the SCICR2 register. It is cleared by a software sequence (an access to the SCISR register followed
by a read to the SCIDR register).
0: No Idle Line is detected
1: Idle Line is detected
Bit 0 = PE Parity error.
This bit is set by hardware when a parity error occurs in receiver mode. It is cleared by a software
sequence (a read to the status register followed by
an access to the SCIDR data register). An interrupt is generated if PIE=1 in the SCICR1 register.
0: No parity error
1: Parity error
93/171
ST72260G, ST72262G, ST72264G
SERIAL COMMUNICATIONS INTERFACE (Cont’d)
CONTROL REGISTER 1 (SCICR1)
Bit 3 = WAKE Wake-Up method.
Read/Write
This bit determines the SCI Wake-Up method, it is
Reset Value: x000 0000 (x0h)
set or cleared by software.
0: Idle Line
7
0
1: Address Mark
R8
T8
SCID
M
WAKE
PCE
PS
PIE
Bit 7 = R8 Receive data bit 8.
This bit is used to store the 9th bit of the received
word when M=1.
Bit 6 = T8 Transmit data bit 8.
This bit is used to store the 9th bit of the transmitted word when M=1.
Bit 5 = SCID Disabled for low power consumption
When this bit is set the SCI prescalers and outputs
are stopped and the end of the current byte transfer in order to reduce power consumption.This bit
is set and cleared by software.
0: SCI enabled
1: SCI prescaler and outputs disabled
Bit 4 = M Word length.
This bit determines the word length. It is set or
cleared by software.
0: 1 Start bit, 8 Data bits, 1 Stop bit
1: 1 Start bit, 9 Data bits, 1 Stop bit
Note: The M bit must not be modified during a data
transfer (both transmission and reception).
94/171
Bit 2 = PCE Parity control enable.
This bit selects the hardware parity control (generation and detection). When the parity control is enabled, the computed parity is inserted at the MSB
position (9th bit if M=1; 8th bit if M=0) and parity is
checked on the received data. This bit is set and
cleared by software. Once it is set, PCE is active
after the current byte (in reception and in transmission).
0: Parity control disabled
1: Parity control enabled
Bit 1 = PS Parity selection.
This bit selects the odd or even parity when the
parity generation/detection is enabled (PCE bit
set). It is set and cleared by software. The parity
will be selected after the current byte.
0: Even parity
1: Odd parity
Bit 0 = PIE Parity interrupt enable.
This bit enables the interrupt capability of the hardware parity control when a parity error is detected
(PE bit set). It is set and cleared by software.
0: Parity error interrupt disabled
1: Parity error interrupt enabled.
ST72260G, ST72262G, ST72264G
SERIAL COMMUNICATIONS INTERFACE (Cont’d)
CONTROL REGISTER 2 (SCICR2)
Notes:
Read/Write
– During transmission, a “0” pulse on the TE bit
(“0” followed by “1”) sends a preamble (idle line)
Reset Value: 0000 0000 (00 h)
after the current word.
7
0
– When TE is set there is a 1 bit-time delay before
the transmission starts.
TIE
TCIE
RIE
ILIE
TE
RE
RWU SBK
Caution: The TDO pin is free for general purpose
I/O only when the TE and RE bits are both cleared
(or if TE is never set).
Bit 7 = TIE Transmitter interrupt enable.
This bit is set and cleared by software.
0: Interrupt is inhibited
Bit 2 = RE Receiver enable.
1: An SCI interrupt is generated whenever
This bit enables the receiver. It is set and cleared
TDRE=1 in the SCISR register
by software.
0: Receiver is disabled
Bit 6 = TCIE Transmission complete interrupt ena1: Receiver is enabled and begins searching for a
ble
start bit
This bit is set and cleared by software.
0: Interrupt is inhibited
Bit 1 = RWU Receiver wake-up.
1: An SCI interrupt is generated whenever TC=1 in
This bit determines if the SCI is in mute mode or
the SCISR register
not. It is set and cleared by software and can be
cleared by hardware when a wake-up sequence is
Bit 5 = RIE Receiver interrupt enable.
recognized.
This bit is set and cleared by software.
0: Receiver in Active mode
0: Interrupt is inhibited
1: Receiver in Mute mode
1: An SCI interrupt is generated whenever OR=1
Note: Before selecting Mute mode (setting the
or RDRF=1 in the SCISR register
RWU bit), the SCI must receive some data first,
otherwise it cannot function in Mute mode with
Bit 4 = ILIE Idle line interrupt enable.
wakeup by idle line detection.
This bit is set and cleared by software.
0: Interrupt is inhibited
Bit 0 = SBK Send break.
1: An SCI interrupt is generated whenever IDLE=1
This bit set is used to send break characters. It is
in the SCISR register.
set and cleared by software.
Bit 3 = TE Transmitter enable.
This bit enables the transmitter. It is set and
cleared by software.
0: Transmitter is disabled
1: Transmitter is enabled
0: No break character is transmitted
1: Break characters are transmitted
Note: If the SBK bit is set to “1” and then to “0”, the
transmitter will send a BREAK word at the end of
the current word.
95/171
ST72260G, ST72262G, ST72264G
SERIAL COMMUNICATIONS INTERFACE (Cont’d)
DATA REGISTER (SCIDR)
Read/Write
Reset Value: Undefined
Contains the Received or Transmitted data character, depending on whether it is read from or written to.
7
0
DR7
DR6
DR5
DR4
DR3
DR2
DR1
DR0
The Data register performs a double function (read
and write) since it is composed of two registers,
one for transmission (TDR) and one for reception
(RDR).
The TDR register provides the parallel interface
between the internal bus and the output shift register (see Figure 54).
The RDR register provides the parallel interface
between the input shift register and the internal
bus (see Figure 54).
BAUD RATE REGISTER (SCIBRR)
Read/Write
Reset Value: 0000 0000 (00h)
7
0
SCP1
SCP0
SCT2
SCT1
SCT0
SCR2
SCR1 SCR0
Bits 7:6= SCP[1:0] First SCI Prescaler
These 2 prescaling bits allow several standard
clock division ranges:
PR Prescaling factor
SCP1
SCP0
1
0
0
3
0
1
4
1
0
13
1
1
96/171
Bits 5:3 = SCT[2:0] SCI Transmitter rate divisor
These 3 bits, in conjunction with the SCP1 & SCP0
bits define the total division applied to the bus
clock to yield the transmit rate clock in conventional Baud Rate Generator mode.
TR dividing factor
SCT2
SCT1
SCT0
1
0
0
0
2
0
0
1
4
0
1
0
8
0
1
1
16
1
0
0
32
1
0
1
64
1
1
0
128
1
1
1
Bits 2:0 = SCR[2:0] SCI Receiver rate divisor.
These 3 bits, in conjunction with the SCP[1:0] bits
define the total division applied to the bus clock to
yield the receive rate clock in conventional Baud
Rate Generator mode.
RR Dividing factor
SCR2
SCR1
SCR0
1
0
0
0
2
0
0
1
4
0
1
0
8
0
1
1
16
1
0
0
32
1
0
1
64
1
1
0
128
1
1
1
ST72260G, ST72262G, ST72264G
SERIAL COMMUNICATIONS INTERFACE (Cont’d)
EXTENDED RECEIVE PRESCALER DIVISION
REGISTER (SCIERPR)
Read/Write
Reset Value: 0000 0000 (00 h)
Allows setting of the Extended Prescaler rate division factor for the receive circuit.
7
0
EXTENDED TRANSMIT PRESCALER DIVISION
REGISTER (SCIETPR)
Read/Write
Reset Value:0000 0000 (00h)
Allows setting of the External Prescaler rate division factor for the transmit circuit.
7
ERPR ERPR ERPR ERPR ERPR ERPR ERPR ERPR
7
6
5
4
3
2
1
0
ETPR
7
Bits 7:0 = ERPR[7:0] 8-bit Extended Receive
Prescaler Register.
The extended Baud Rate Generator is activated
when a value different from 00h is stored in this
register. Therefore the clock frequency issued
from the 16 divider (see Figure 56) is divided by
the binary factor set in the SCIERPR register (in
the range 1 to 255).
The extended baud rate generator is not used after a reset.
0
ETPR
6
ETPR
5
ETPR
4
ETPR
3
ETPR
2
ETPR ETPR
1
0
Bits 7:0 = ETPR[7:0] 8-bit Extended Transmit
Prescaler Register.
The extended Baud Rate Generator is activated
when a value different from 00h is stored in this
register. Therefore the clock frequency issued
from the 16 divider (see Figure 56) is divided by
the binary factor set in the SCIETPR register (in
the range 1 to 255).
The extended baud rate generator is not used after a reset.
Table 19. Baudrate Selection
Conditions
Symbol
Parameter
fCPU
Accuracy
vs. Standard
~0.16%
fTx
fRx
Communication frequency
8MHz
~0.79%
Prescaler
Conventional Mode
TR (or RR)=128, PR=13
TR (or RR)= 32, PR=13
TR (or RR)= 16, PR=13
TR (or RR)= 8, PR=13
TR (or RR)= 4, PR=13
TR (or RR)= 16, PR= 3
TR (or RR)= 2, PR=13
TR (or RR)= 1, PR=13
Extended Mode
ETPR (or ERPR) = 35,
TR (or RR)= 1, PR=1
Standard
Baud
Rate
~300.48
300
1200 ~1201.92
2400 ~2403.84
4800 ~4807.69
9600 ~9615.38
10400 ~10416.67
19200 ~19230.77
38400 ~38461.54
Unit
Hz
14400 ~14285.71
97/171
ST72260G, ST72262G, ST72264G
SERIAL COMMUNICATIONS INTERFACE (Cont’d)
Table 20. SCI Register Map and Reset Values
Address
(Hex.)
Register
Name
7
6
5
4
3
2
1
0
50
SCISR
Reset Value
TDRE
1
TC
1
RDRF
0
IDLE
0
OR
0
NF
0
FE
0
PE
0
51
SCIDR
Reset Value
DR7
x
DR6
x
DR5
x
DR4
x
DR3
x
DR2
x
DR1
x
DR0
x
52
SCIBRR
Reset Value
SCP1
0
SCP0
0
SCT2
0
SCT1
0
SCT0
0
SCR2
0
SCR1
0
SCR0
0
53
SCICR1
Reset Value
R8
x
T8
0
SCID
0
M
0
WAKE
0
PCE
0
PS
0
PIE
0
54
SCICR2
Reset Value
TIE
0
TCIE
0
RIE
0
ILIE
0
TE
0
RE
0
RWU
0
SBK
0
55
SCIERPR
Reset Value
ERPR7
0
ERPR6
0
ERPR5
0
ERPR4
0
ERPR3
0
ERPR2
0
ERPR1
0
ERPR0
0
56
SCIETPR
Reset Value
ETPR7
0
ETPR6
0
ETPR5
0
ETPR4
0
ETPR3
0
ETPR2
0
ETPR1
0
ETPR0
0
98/171
ST72260G, ST72262G, ST72264G
11.6 I2C BUS INTERFACE (I2C)
11.6.1 Introduction
The I2C Bus Interface serves as an interface between the microcontroller and the serial I2C bus. It
provides both multimaster and slave functions,
and controls all I2C bus-specific sequencing, protocol, arbitration and timing. It supports fast I2C
mode (400kHz).
11.6.2 Main Features
2
■ Parallel-bus/I C protocol converter
■ Multi-master capability
■ 7-bit/10-bit Addressing
■ Transmitter/Receiver flag
■ End-of-byte transmission flag
■ Transfer problem detection
I2C Master Features:
■ Clock generation
2
■ I C bus busy flag
■ Arbitration Lost Flag
■ End of byte transmission flag
■ Transmitter/Receiver Flag
■ Start bit detection flag
■ Start and Stop generation
I2C Slave Features:
■ Stop bit detection
2
■ I C bus busy flag
■ Detection of misplaced start or stop condition
2
■ Programmable I C Address detection
■ Transfer problem detection
■ End-of-byte transmission flag
■ Transmitter/Receiver flag
11.6.3 General Description
In addition to receiving and transmitting data, this
interface converts it from serial to parallel format
and vice versa, using either an interrupt or polled
handshake. The interrupts are enabled or disabled
by software. The interface is connected to the I2C
bus by a data pin (SDAI) and by a clock pin (SCLI).
It can be connected both with a standard I2C bus
and a Fast I2C bus. This selection is made by software.
Mode Selection
The interface can operate in the four following
modes:
– Slave transmitter/receiver
– Master transmitter/receiver
By default, it operates in slave mode.
The interface automatically switches from slave to
master after it generates a START condition and
from master to slave in case of arbitration loss or a
STOP generation, allowing then Multi-Master capability.
Communication Flow
In Master mode, it initiates a data transfer and
generates the clock signal. A serial data transfer
always begins with a start condition and ends with
a stop condition. Both start and stop conditions are
generated in master mode by software.
In Slave mode, the interface is capable of recognising its own address (7 or 10-bit), and the General Call address. The General Call address detection may be enabled or disabled by software.
Data and addresses are transferred as 8-bit bytes,
MSB first. The first byte(s) following the start condition contain the address (one in 7-bit mode, two
in 10-bit mode). The address is always transmitted
in Master mode.
A 9th clock pulse follows the 8 clock cycles of a
byte transfer, during which the receiver must send
an acknowledge bit to the transmitter. Refer to Figure 57.
Figure 57. I2C BUS Protocol
SDA
ACK
MSB
SCL
1
START
CONDITION
2
8
9
STOP
CONDITION
VR02119B
99/171
ST72260G, ST72262G, ST72264G
I2C BUS INTERFACE (Cont’d)
Acknowledge may be enabled and disabled by
software.
The I2C interface address and/or general call address can be selected by software.
The speed of the I2C interface may be selected
between Standard (0-100KHz) and Fast I2C (100400KHz).
SDA/SCL Line Control
Transmitter mode: the interface holds the clock
line low before transmission to wait for the microcontroller to write the byte in the Data Register.
Receiver mode: the interface holds the clock line
low after reception to wait for the microcontroller to
read the byte in the Data Register.
The SCL frequency (Fscl) is controlled by a programmable clock divider which depends on the
I2C bus mode.
When the I2C cell is enabled, the SDA and SCL
ports must be configured as floating inputs. In this
case, the value of the external pull-up resistor
used depends on the application.
When the I2C cell is disabled, the SDA and SCL
ports revert to being standard I/O port pins.
Figure 58. I2C Interface Block Diagram
DATA REGISTER (DR)
SDA or SDAI
DATA CONTROL
DATA SHIFT REGISTER
COMPARATOR
OWN ADDRESS REGISTER 1 (OAR1)
OWN ADDRESS REGISTER 2 (OAR2)
SCL or SCLI
CLOCK CONTROL
CLOCK CONTROL REGISTER (CCR)
CONTROL REGISTER (CR)
STATUS REGISTER 1 (SR1)
CONTROL LOGIC
STATUS REGISTER 2 (SR2)
INTERRUPT
100/171
ST72260G, ST72262G, ST72264G
I2C BUS INTERFACE (Cont’d)
11.6.4 Functional Description
Refer to the CR, SR1 and SR2 registers in Section
11.6.7. for the bit definitions.
By default the I2C interface operates in Slave
mode (M/SL bit is cleared) except when it initiates
a transmit or receive sequence.
First the interface frequency must be configured
using the FRi bits in the OAR2 register.
11.6.4.1 Slave Mode
As soon as a start condition is detected, the
address is received from the SDA line and sent to
the shift register; then it is compared with the
address of the interface or the General Call
address (if selected by software).
Note: In 10-bit addressing mode, the comparision
includes the header sequence (11110xx0) and the
two most significant bits of the address.
Header matched (10-bit mode only): the interface
generates an acknowledge pulse if the ACK bit is
set.
Address not matched: the interface ignores it
and waits for another Start condition.
Address matched: the interface generates in sequence:
– Acknowledge pulse if the ACK bit is set.
– EVF and ADSL bits are set with an interrupt if the
ITE bit is set.
Then the interface waits for a read of the SR1 register, holding the SCL line low (see Figure 59
Transfer sequencing EV1).
Next, in 7-bit mode read the DR register to determine from the least significant bit (Data Direction
Bit) if the slave must enter Receiver or Transmitter
mode.
In 10-bit mode, after receiving the address sequence the slave is always in receive mode. It will
enter transmit mode on receiving a repeated Start
condition followed by the header sequence with
matching address bits and the least significant bit
set (11110xx1) .
Slave Receiver
Following the address reception and after SR1
register has been read, the slave receives bytes
from the SDA line into the DR register via the internal shift register. After each byte the interface generates in sequence:
– Acknowledge pulse if the ACK bit is set
– EVF and BTF bits are set with an interrupt if the
ITE bit is set.
Then the interface waits for a read of the SR1 register followed by a read of the DR register, holding
the SCL line low (see Figure 59 Transfer sequencing EV2).
Slave Transmitter
Following the address reception and after SR1
register has been read, the slave sends bytes from
the DR register to the SDA line via the internal shift
register.
The slave waits for a read of the SR1 register followed by a write in the DR register, holding the
SCL line low (see Figure 59 Transfer sequencing
EV3).
When the acknowledge pulse is received:
– The EVF and BTF bits are set by hardware with
an interrupt if the ITE bit is set.
Closing slave communication
After the last data byte is transferred a Stop Condition is generated by the master. The interface
detects this condition and sets:
– EVF and STOPF bits with an interrupt if the ITE
bit is set.
Then the interface waits for a read of the SR2 register (see Figure 59 Transfer sequencing EV4).
Error Cases
– BERR: Detection of a Stop or a Start condition
during a byte transfer. In this case, the EVF and
the BERR bits are set with an interrupt if the ITE
bit is set.
If it is a Stop then the interface discards the data,
released the lines and waits for another Start
condition.
If it is a Start then the interface discards the data
and waits for the next slave address on the bus.
– AF: Detection of a non-acknowledge bit. In this
case, the EVF and AF bits are set with an interrupt if the ITE bit is set.
Note: In both cases, SCL line is not held low; however, SDA line can remain low due to possible «0»
bits transmitted last. It is then necessary to release
both lines by software.
101/171
ST72260G, ST72262G, ST72264G
I2C BUS INTERFACE (Cont’d)
How to release the SDA / SCL lines
Set and subsequently clear the STOP bit while
BTF is set. The SDA/SCL lines are released after
the transfer of the current byte.
11.6.4.2 Master Mode
To switch from default Slave mode to Master
mode a Start condition generation is needed.
Start condition
Setting the START bit while the BUSY bit is
cleared causes the interface to switch to Master
mode (M/SL bit set) and generates a Start condition.
Once the Start condition is sent:
– The EVF and SB bits are set by hardware with
an interrupt if the ITE bit is set.
Then the master waits for a read of the SR1 register followed by a write in the DR register with the
Slave address, holding the SCL line low (see
Figure 59 Transfer sequencing EV5).
Slave address transmission
Then the slave address is sent to the SDA line via
the internal shift register.
In 7-bit addressing mode, one address byte is
sent.
In 10-bit addressing mode, sending the first byte
including the header sequence causes the following event:
– The EVF bit is set by hardware with interrupt
generation if the ITE bit is set.
Then the master waits for a read of the SR1 register followed by a write in the DR register, holding
the SCL line low (see Figure 59 Transfer sequencing EV9).
Then the second address byte is sent by the interface.
102/171
After completion of this transfer (and acknowledge
from the slave if the ACK bit is set):
– The EVF bit is set by hardware with interrupt
generation if the ITE bit is set.
Then the master waits for a read of the SR1 register followed by a write in the CR register (for example set PE bit), holding the SCL line low (see Figure 59 Transfer sequencing EV6).
Next the master must enter Receiver or Transmitter mode.
Note: In 10-bit addressing mode, to switch the
master to Receiver mode, software must generate
a repeated Start condition and resend the header
sequence with the least significant bit set
(11110xx1).
Master Receiver
Following the address transmission and after SR1
and CR registers have been accessed, the master
receives bytes from the SDA line into the DR register via the internal shift register. After each byte
the interface generates in sequence:
– Acknowledge pulse if if the ACK bit is set
– EVF and BTF bits are set by hardware with an interrupt if the ITE bit is set.
Then the interface waits for a read of the SR1 register followed by a read of the DR register, holding
the SCL line low (see Figure 59 Transfer sequencing EV7).
To close the communication: before reading the
last byte from the DR register, set the STOP bit to
generate the Stop condition. The interface goes
automatically back to slave mode (M/SL bit
cleared).
Note: In order to generate the non-acknowledge
pulse after the last received data byte, the ACK bit
must be cleared just before reading the second
last data byte.
ST72260G, ST72262G, ST72264G
I2C BUS INTERFACE (Cont’d)
Master Transmitter
Following the address transmission and after SR1
register has been read, the master sends bytes
from the DR register to the SDA line via the internal shift register.
The master waits for a read of the SR1 register followed by a write in the DR register, holding the
SCL line low (see Figure 59 Transfer sequencing
EV8).
When the acknowledge bit is received, the
interface sets:
– EVF and BTF bits with an interrupt if the ITE bit
is set.
To close the communication: after writing the last
byte to the DR register, set the STOP bit to generate the Stop condition. The interface goes automatically back to slave mode (M/SL bit cleared).
BERR bits are set by hardware with an interrupt
if ITE is set.
– AF: Detection of a non-acknowledge bit. In this
case, the EVF and AF bits are set by hardware
with an interrupt if the ITE bit is set. To resume,
set the START or STOP bit.
– ARLO: Detection of an arbitration lost condition.
In this case the ARLO bit is set by hardware (with
an interrupt if the ITE bit is set and the interface
goes automatically back to slave mode (the M/SL
bit is cleared).
Note: In all these cases, the SCL line is not held
low; however, the SDA line can remain low due to
possible «0» bits transmitted last. It is then necessary to release both lines by software.
Error Cases
– BERR: Detection of a Stop or a Start condition
during a byte transfer. In this case, the EVF and
103/171
ST72260G, ST72262G, ST72264G
I2C BUS INTERFACE (Cont’d)
Figure 59. Transfer Sequencing
7-bit Slave receiver:
S Address
A
Data1
A
Data2
EV1
A
EV2
EV2
.....
DataN
A
P
EV2
EV4
7-bit Slave transmitter:
S Address
A
Data1
A
Data2
EV1 EV3
A
EV3
EV3
.....
DataN
NA
P
EV3-1
EV4
7-bit Master receiver:
S
Address
A
EV5
Data1
A
Data2
EV6
A
EV7
EV7
DataN
.....
NA
P
EV7
7-bit Master transmitter:
S
Address
A
EV5
Data1
A
EV6 EV8
Data2
A
EV8
EV8
DataN
.....
A
P
EV8
10-bit Slave receiver:
S Header
A
Address
A
Data1
A
EV1
.....
EV2
DataN
A
P
EV2
EV4
10-bit Slave transmitter:
Sr Header
A
Data1
A
EV1 EV3
.... DataN
EV3 .
A
P
EV3-1
EV4
10-bit Master transmitter
S
Header
EV5
A
Address
EV9
A
Data1
A
EV6 EV8
EV8
DataN
.....
A
P
EV8
10-bit Master receiver:
Sr
Header
EV5
A
Data1
EV6
A
EV7
.....
DataN
A
P
EV7
Legend: S=Start, Sr = Repeated Start, P=Stop, A=Acknowledge, NA=Non-acknowledge,
EVx=Event (with interrupt if ITE=1)
EV1: EVF=1, ADSL=1, cleared by reading SR1 register.
EV2: EVF=1, BTF=1, cleared by reading SR1 register followed by reading DR register.
EV3: EVF=1, BTF=1, cleared by reading SR1 register followed by writing DR register.
EV3-1: EVF=1, AF=1, BTF=1; AF is cleared by reading SR1 register. BTF is cleared by releasing the
lines (STOP=1, STOP=0) or by writing DR register (DR=FFh). Note: If lines are released by
STOP=1, STOP=0, the subsequent EV4 is not seen.
EV4: EVF=1, STOPF=1, cleared by reading SR2 register.
EV5: EVF=1, SB=1, cleared by reading SR1 register followed by writing DR register.
EV6: EVF=1, cleared by reading SR1 register followed by writing CR register (for example PE=1).
EV7: EVF=1, BTF=1, cleared by reading SR1 register followed by reading DR register.
EV8: EVF=1, BTF=1, cleared by reading SR1 register followed by writing DR register.
EV9: EVF=1, ADD10=1, cleared by reading SR1 register followed by writing DR register.
104/171
ST72260G, ST72262G, ST72264G
I2C BUS INTERFACE (Cont’d)
11.6.5 Low Power Modes
Mode
WAIT
HALT
Description
No effect on I2C interface.
I2C interrupts cause the device to exit from WAIT mode.
I2C registers are frozen.
In HALT mode, the I2C interface is inactive and does not acknowledge data on the bus. The I2C interface
resumes operation when the MCU is woken up by an interrupt with “exit from HALT mode” capability.
11.6.6 Interrupts
Figure 60. Event Flags and Interrupt Generation
ADD10
BTF
ADSL
SB
AF
STOPF
ARLO
BERR
ITE
INTERRUPT
EVF
*
* EVF can also be set by EV6 or an error from the SR2 register.
Interrupt Event
10-bit Address Sent Event (Master mode)
End of Byte Transfer Event
Address Matched Event (Slave mode)
Start Bit Generation Event (Master mode)
Acknowledge Failure Event
Stop Detection Event (Slave mode)
Arbitration Lost Event (Multimaster configuration)
Bus Error Event
Event
Flag
Enable
Control
Bit
ADD10
BTF
ADSEL
SB
AF
STOPF
ARLO
BERR
ITE
Exit
from
Wait
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Exit
from
Halt
No
No
No
No
No
No
No
No
Note: The I2C interrupt events are connected to
the same interrupt vector (see Interrupts chapter).
They generate an interrupt if the corresponding
Enable Control Bit is set and the I-bit in the CC register is reset (RIM instruction).
105/171
ST72260G, ST72262G, ST72264G
I2C BUS INTERFACE (Cont’d)
11.6.7 Register Description
I2C CONTROL REGISTER (CR)
Read / Write
Reset Value: 0000 0000 (00h)
– In slave mode:
0: No start generation
1: Start generation when the bus is free
7
0
0
0
PE
ENGC START
ACK
STOP
ITE
Bit 2 = ACK Acknowledge enable.
This bit is set and cleared by software. It is also
cleared by hardware when the interface is disabled (PE=0).
0: No acknowledge returned
1: Acknowledge returned after an address byte or
a data byte is received
Bit 7:6 = Reserved. Forced to 0 by hardware.
Bit 5 = PE Peripheral enable.
This bit is set and cleared by software.
0: Peripheral disabled
1: Master/Slave capability
Notes:
– When PE=0, all the bits of the CR register and
the SR register except the Stop bit are reset. All
outputs are released while PE=0
– When PE=1, the corresponding I/O pins are selected by hardware as alternate functions.
– To enable the I2C interface, write the CR register
TWICE with PE=1 as the first write only activates
the interface (only PE is set).
Bit 4 = ENGC Enable General Call.
This bit is set and cleared by software. It is also
cleared by hardware when the interface is disabled (PE=0). The 00h General Call address is acknowledged (01h ignored).
0: General Call disabled
1: General Call enabled
Note: In accordance with the I2C standard, when
GCAL addressing is enabled, an I2C slave can
only receive data. It will not transmit data to the
master.
Bit 3 = START Generation of a Start condition.
This bit is set and cleared by software. It is also
cleared by hardware when the interface is disabled (PE=0) or when the Start condition is sent
(with interrupt generation if ITE=1).
– In master mode:
0: No start generation
1: Repeated start generation
106/171
Bit 1 = STOP Generation of a Stop condition.
This bit is set and cleared by software. It is also
cleared by hardware in master mode. Note: This
bit is not cleared when the interface is disabled
(PE=0).
– In master mode:
0: No stop generation
1: Stop generation after the current byte transfer
or after the current Start condition is sent. The
STOP bit is cleared by hardware when the Stop
condition is sent.
– In slave mode:
0: No stop generation
1: Release the SCL and SDA lines after the current byte transfer (BTF=1). In this mode the
STOP bit has to be cleared by software.
Bit 0 = ITE Interrupt enable.
This bit is set and cleared by software and cleared
by hardware when the interface is disabled
(PE=0).
0: Interrupts disabled
1: Interrupts enabled
Refer to Figure 60 for the relationship between the
events and the interrupt.
SCL is held low when the ADD10, SB, BTF or
ADSL flags or an EV6 event (See Figure 59) is detected.
ST72260G, ST72262G, ST72264G
I2C BUS INTERFACE (Cont’d)
I2C STATUS REGISTER 1 (SR1)
Read Only
Reset Value: 0000 0000 (00h)
arbitration (ARLO=1) or when the interface is disabled (PE=0).
0: Data byte received (if BTF=1)
1: Data byte transmitted
7
EVF
0
ADD10
TRA
BUSY
BTF
ADSL
M/SL
SB
Bit 7 = EVF Event flag.
This bit is set by hardware as soon as an event occurs. It is cleared by software reading SR2 register
in case of error event or as described in Figure 59.
It is also cleared by hardware when the interface is
disabled (PE=0).
0: No event
1: One of the following events has occurred:
– BTF=1 (Byte received or transmitted)
– ADSL=1 (Address matched in Slave mode
while ACK=1)
– SB=1 (Start condition generated in Master
mode)
– AF=1 (No acknowledge received after byte
transmission)
– STOPF=1 (Stop condition detected in Slave
mode)
– ARLO=1 (Arbitration lost in Master mode)
– BERR=1 (Bus error, misplaced Start or Stop
condition detected)
– ADD10=1 (Master has sent header byte)
– Address byte successfully transmitted in Master mode.
Bit 6 = ADD10 10-bit addressing in Master mode .
This bit is set by hardware when the master has
sent the first byte in 10-bit address mode. It is
cleared by software reading SR2 register followed
by a write in the DR register of the second address
byte. It is also cleared by hardware when the peripheral is disabled (PE=0).
0: No ADD10 event occurred.
1: Master has sent first address byte (header)
Bit 4 = BUSY Bus busy.
This bit is set by hardware on detection of a Start
condition and cleared by hardware on detection of
a Stop condition. It indicates a communication in
progress on the bus. This information is still updated when the interface is disabled (PE=0).
0: No communication on the bus
1: Communication ongoing on the bus
Bit 3 = BTF Byte transfer finished.
This bit is set by hardware as soon as a byte is correctly received or transmitted with interrupt generation if ITE=1. It is cleared by software reading
SR1 register followed by a read or write of DR register. It is also cleared by hardware when the interface is disabled (PE=0).
– Following a byte transmission, this bit is set after
reception of the acknowledge clock pulse. In
case an address byte is sent, this bit is set only
after the EV6 event (See Figure 59). BTF is
cleared by reading SR1 register followed by writing the next byte in DR register.
– Following a byte reception, this bit is set after
transmission of the acknowledge clock pulse if
ACK=1. BTF is cleared by reading SR1 register
followed by reading the byte from DR register.
The SCL line is held low while BTF=1.
0: Byte transfer not done
1: Byte transfer succeeded
Bit 2 = ADSL Address matched (Slave mode).
This bit is set by hardware as soon as the received
slave address matched with the OAR register content or a general call is recognized. An interrupt is
generated if ITE=1. It is cleared by software reading SR1 register or by hardware when the interface is disabled (PE=0).
The SCL line is held low while ADSL=1.
0: Address mismatched or not received
1: Received address matched
Bit 5 = TRA Transmitter/Receiver.
When BTF is set, TRA=1 if a data byte has been
transmitted. It is cleared automatically when BTF
is cleared. It is also cleared by hardware after detection of Stop condition (STOPF=1), loss of bus
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ST72260G, ST72262G, ST72264G
I2C BUS INTERFACE (Cont’d)
Bit 1 = M/SL Master/Slave.
This bit is set by hardware as soon as the interface
is in Master mode (writing START=1). It is cleared
by hardware after detecting a Stop condition on
the bus or a loss of arbitration (ARLO=1). It is also
cleared when the interface is disabled (PE=0).
0: Slave mode
1: Master mode
Bit 0 = SB Start bit (Master mode).
This bit is set by hardware as soon as the Start
condition is generated (following a write
START=1). An interrupt is generated if ITE=1. It is
cleared by software reading SR1 register followed
by writing the address byte in DR register. It is also
cleared by hardware when the interface is disabled (PE=0).
0: No Start condition
1: Start condition generated
I2C STATUS REGISTER 2 (SR2)
Read Only
Reset Value: 0000 0000 (00h)
7
0
Bit 1 = BERR Bus error.
This bit is set by hardware when the interface detects a misplaced Start or Stop condition. An interrupt is generated if ITE=1. It is cleared by software
reading SR2 register or by hardware when the interface is disabled (PE=0).
The SCL line is not held low while BERR=1.
0: No misplaced Start or Stop condition
1: Misplaced Start or Stop condition
0
0
0
AF
STOPF ARLO BERR GCAL
Bit 7:5 = Reserved. Forced to 0 by hardware.
Bit 4 = AF Acknowledge failure.
This bit is set by hardware when no acknowledge
is returned. An interrupt is generated if ITE=1. It is
cleared by software reading SR2 register or by
hardware when the interface is disabled (PE=0).
The SCL line is not held low while AF=1.
0: No acknowledge failure
1: Acknowledge failure
Bit 3 = STOPF Stop detection (Slave mode).
This bit is set by hardware when a Stop condition
is detected on the bus after an acknowledge (if
ACK=1). An interrupt is generated if ITE=1. It is
cleared by software reading SR2 register or by
hardware when the interface is disabled (PE=0).
The SCL line is not held low while STOPF=1.
0: No Stop condition detected
1: Stop condition detected
108/171
Bit 2 = ARLO Arbitration lost.
This bit is set by hardware when the interface loses the arbitration of the bus to another master. An
interrupt is generated if ITE=1. It is cleared by software reading SR2 register or by hardware when
the interface is disabled (PE=0).
After an ARLO event the interface switches back
automatically to Slave mode (M/SL=0).
The SCL line is not held low while ARLO=1.
0: No arbitration lost detected
1: Arbitration lost detected
Bit 0 = GCAL General Call (Slave mode).
This bit is set by hardware when a general call address is detected on the bus while ENGC=1. It is
cleared by hardware detecting a Stop condition
(STOPF=1) or when the interface is disabled
(PE=0).
0: No general call address detected on bus
1: general call address detected on bus
ST72260G, ST72262G, ST72264G
I2C BUS INTERFACE (Cont’d)
I2C CLOCK CONTROL REGISTER (CCR)
Read / Write
Reset Value: 0000 0000 (00h)
7
0
I2C DATA REGISTER (DR)
Read / Write
Reset Value: 0000 0000 (00h)
7
FM/SM
CC6
CC5
CC4
CC3
CC2
CC1
0
CC0
D7
Bit 7 = FM/SM Fast/Standard I2C mode.
This bit is set and cleared by software. It is not
cleared when the interface is disabled (PE=0).
0: Standard I2C mode
1: Fast I2C mode
Bit 6:0 = CC[6:0] 7-bit clock divider.
These bits select the speed of the bus (FSCL) depending on the I2C mode. They are not cleared
when the interface is disabled (PE=0).
– Standard mode (FM/SM=0): FSCL <= 100kHz
FSCL = FCPU/(2x([CC6..CC0]+2))
– Fast mode (FM/SM=1): FSCL > 100kHz
FSCL = FCPU/(3x([CC6..CC0]+2))
Note: The programmed FSCL assumes no load on
SCL and SDA lines.
D6
D5
D4
D3
D2
D1
D0
Bit 7:0 = D[7:0] 8-bit Data Register.
These bits contain the byte to be received or transmitted on the bus.
– Transmitter mode: Byte transmission start automatically when the software writes in the DR register.
– Receiver mode: the first data byte is received automatically in the DR register using the least significant bit of the address.
Then, the following data bytes are received one
by one after reading the DR register.
109/171
ST72260G, ST72262G, ST72264G
I2C BUS INTERFACE (Cont’d)
I2C OWN ADDRESS REGISTER (OAR1)
Read / Write
Reset Value: 0000 0000 (00h)
7
ADD7 ADD6
ADD5
ADD4
ADD3
ADD2
ADD1
I2C OWN ADDRESS REGISTER (OAR2)
Read / Write
Reset Value: 0100 0000 (40h)
0
7
ADD0
FR1
7-bit Addressing Mode
Bit 7:1 = ADD[7:1] Interface address.
These bits define the I2C bus address of the interface. They are not cleared when the interface is
disabled (PE=0).
0
FR0
0
0
0
ADD9
ADD8
0
Bit 7:6 = FR[1:0] Frequency bits.
These bits are set by software only when the interface is disabled (PE=0). To configure the interface
to I2C specifed delays select the value corresponding to the microcontroller frequency FCPU.
fCPU
< 6 MHz
6 to 8 MHz
FR1
0
0
FR0
0
1
Bit 0 = ADD0 Address direction bit.
This bit is don’t care, the interface acknowledges
either 0 or 1. It is not cleared when the interface is
disabled (PE=0).
Note: Address 01h is always ignored.
Bit 5:3 = Reserved
10-bit Addressing Mode
Bit 7:0 = ADD[7:0] Interface address.
These are the least significant bits of the I2C bus
address of the interface. They are not cleared
when the interface is disabled (PE=0).
Bit 2:1 = ADD[9:8] Interface address.
These are the most significant bits of the I2C bus
address of the interface (10-bit mode only). They
are not cleared when the interface is disabled
(PE=0).
Bit 0 = Reserved.
110/171
ST72260G, ST72262G, ST72264G
I²C BUS INTERFACE (Cont’d)
Table 21. I2C Register Map and Reset Values
Address
(Hex.)
Register
Label
7
6
5
4
3
2
1
0
0028h
I2CCR
Reset Value
0
0
PE
0
ENGC
0
START
0
ACK
0
STOP
0
ITE
0
0029h
I2CSR1
Reset Value
EVF
0
ADD10
0
TRA
0
BUSY
0
BTF
0
ADSL
0
M/SL
0
SB
0
002Ah
I2CSR2
Reset Value
0
0
0
AF
0
STOPF
0
ARLO
0
BERR
0
GCAL
0
02Bh
I2CCCR
Reset Value
FM/SM
0
CC6
0
CC5
0
CC4
0
CC3
0
CC2
0
CC1
0
CC0
0
02Ch
I2COAR1
Reset Value
ADD7
0
ADD6
0
ADD5
0
ADD4
0
ADD3
0
ADD2
0
ADD1
0
ADD0
0
002Dh
I2COAR2
Reset Value
FR1
0
FR0
1
0
0
0
ADD9
0
ADD8
0
0
002Eh
I2CDR
Reset Value
MSB
0
0
0
0
0
0
0
LSB
0
111/171
ST72260G, ST72262G, ST72264G
11.7 10-BIT A/D CONVERTER (ADC)
11.7.1 Introduction
The on-chip Analog to Digital Converter (ADC) peripheral is a 10-bit, successive approximation converter with internal sample and hold circuitry. This
peripheral has 6 multiplexed analog input channels (refer to device pin out description) that allow
the peripheral to convert the analog voltage levels
from 6 different sources.
The result of the conversion is stored in a 10-bit
Data Register. The A/D converter is controlled
through a Control/Status Register.
Data register (DR) which contains the results
Conversion complete status flag
■ On/off bit (to reduce consumption)
The block diagram is shown in Figure 61.
■
■
11.7.3 Functional Description
11.7.3.1 Analog Power Supply
VDDA and VSSA are the high and low level reference voltage pins. In some devices (refer to device
pin out description) they are internally connected
to the VDD and VSS pins.
Conversion accuracy may therefore be impacted
by voltage drops and noise in the event of heavily
loaded or badly decoupled power supply lines.
11.7.2 Main Features
■ 10-bit conversion
■ 6 channels with multiplexed input
■ Linear successive approximation
Figure 61. ADC Block Diagram
fCPU
fADC
fCPU, fCPU/2, fCPU/4
EOC SPEEDADON SLOW
0
CH2
CH1
CH0
ADCCSR
3
AIN0
AIN1
ANALOG TO DIGITAL
ANALOG
MUX
CONVERTER
AINx
ADCDRH
D9
D8
ADCDRL
112/171
D7
0
D6
0
D5
0
D4
0
D3
0
D2
0
D1
D0
ST72260G, ST72262G, ST72264G
10-BIT A/D CONVERTER (ADC) (Cont’d)
11.7.3.2 Digital A/D Conversion Result
The conversion is monotonic, meaning that the result never decreases if the analog input does not
and never increases if the analog input does not.
If the input voltage (VAIN) is greater than VDDA
(high-level voltage reference) then the conversion
result is FFh in the ADCDRH register and 03h in
the ADCDRL register (without overflow indication).
If the input voltage (VAIN) is lower than VSSA (lowlevel voltage reference) then the conversion result
in the ADCDRH and ADCDRL registers is 00 00h.
The A/D converter is linear and the digital result of
the conversion is stored in the ADCDRH and ADCDRL registers. The accuracy of the conversion is
described in the Electrical Characteristics Section.
RAIN is the maximum recommended impedance
for an analog input signal. If the impedance is too
high, this will result in a loss of accuracy due to
leakage and sampling not being completed in the
alloted time.
11.7.3.3 A/D Conversion
The analog input ports must be configured as input, no pull-up, no interrupt. Refer to the «I/O
ports» chapter. Using these pins as analog inputs
does not affect the ability of the port to be read as
a logic input.
In the ADCCSR register:
– Select the CH[2:0] bits to assign the analog
channel to convert.
ADC Conversion mode
In the ADCCSR register:
- Set the SPEED or the SLOW bits
– Set the ADON bit to enable the A/D converter
and to start the conversion. From this time on,
the ADC performs a continuous conversion of
the selected channel.
When a conversion is complete:
– The EOC bit is set by hardware.
– The result is in the ADCDR registers.
A read to the ADCDRH or a write to any bit of the
ADCCSR resets the EOC bit.
To read the 10 bits, perform the following steps:
1. Poll EOC bit
2. Read ADCDRL. This locks the ADCDRH until it
is read.
3. Read ADCDRH. This clears EOC automatically.
To read only 8 bits, perform the following steps:
1. Poll EOC bit
2. Read ADCDRH. This clears EOC automatically.
11.7.4 Low Power Modes
Note: The A/D converter may be disabled by resetting the ADON bit. This feature allows reduced
power consumption when no conversion is needed and between single shot conversions.
Mode
WAIT
HALT
Description
No effect on A/D Converter
A/D Converter disabled.
After wakeup from Halt mode, the A/D
Converter requires a stabilisation time
tSTAB (see Electrical Characteristics)
before accurate conversions can be
performed.
11.7.5 Interrupts
None.
113/171
ST72260G, ST72262G, ST72264G
10-BIT A/D CONVERTER (ADC) (Cont’d)
11.7.6 Register Description
Bit 2:0 = CH[2:0] Channel Selection
These bits are set and cleared by software. They
select the analog input to convert.
CONTROL/STATUS REGISTER (ADCCSR)
Read /Write (Except bit 7 read only)
Reset Value: 0000 0000 (00h)
7
EOC SPEED ADON SLOW
0
CH2
CH1
CH2
CH1
CH0
AIN0
AIN1
AIN2
AIN3
AIN4
AIN5
0
0
0
0
1
1
0
0
1
1
0
0
0
1
0
1
0
1
CH0
Bit 7 = EOC End of Conversion
This bit is set by hardware. It is cleared by software reading the ADCDRH register or writing to
any bit of the ADCCSR register.
0: Conversion is not complete
1: Conversion complete
Bit 6 = SPEED A/D clock selection
This bit is set and cleared by software.
D9
fADC Frequency
SLOW
SPEED
fCPU (See Note 2)
0
1
0
1
1
1
0
0
fCPU/2
fCPU/4
DATA REGISTER (ADCDRH)
Read Only
Reset Value: 0000 0000 (00h)
7
Table 22. A/D Clock Selection (See Note 1)
1)
The SPEED and SLOW bits must be updated before
setting the ADON bit.
2)
Channel Pin
0
Use this setting only if fCPU ≤ 4 MHz
Bit 5 = ADON A/D Converter on
This bit is set and cleared by software.
0: Disable ADC and stop conversion
1: Enable ADC and start conversion
0
D8
D7
D6
D5
D4
D3
D2
Bit 7:0 = D[9:2] MSB of Analog Converted Value
DATA REGISTER (ADCDRL)
Read Only
Reset Value: 0000 0000 (00h)
7
0
0
0
0
0
0
0
D1
D0
Bit 7:2 = Reserved. Forced by hardware to 0.
Bit 1:0 = D[1:0] LSB of Analog Converted Value
Bit 4 = SLOW A/D Clock Selection
This bit is set and cleared by software. It works together with the SPEED bit. Refer to Table 22.
114/171
ST72260G, ST72262G, ST72264G
10-BIT A/D CONVERTER (ADC) (Cont’d)
Table 23. ADC Register Map and Reset Values
Address
Register
Label
7
6
5
4
3
2
1
0
006Fh
ADCDRL
Reset Value
0
0
0
0
0
0
D1
0
D0
0
0070h
ADCDRH
Reset Value
D9
0
D8
0
D7
0
D6
0
D5
0
D4
0
D3
0
D2
0
0071h
ADCCSR
Reset Value
EOC
0
SPEED
0
ADON
0
SLOW
0
0
CH2
0
CH1
0
CH0
0
(Hex.)
115/171
ST72260G, ST72262G, ST72264G
12 INSTRUCTION SET
12.1 CPU ADDRESSING MODES
The CPU features 17 different addressing modes
which can be classified in 7 main groups:
Addressing Mode
Example
Inherent
nop
Immediate
ld A,#$55
Direct
ld A,$55
Indexed
ld A,($55,X)
Indirect
ld A,([$55],X)
Relative
jrne loop
Bit operation
bset
byte,#5
The CPU Instruction set is designed to minimize
the number of bytes required per instruction: To do
so, most of the addressing modes may be subdivided in two sub-modes called long and short:
– Long addressing mode is more powerful because it can use the full 64 Kbyte address space,
however it uses more bytes and more CPU cycles.
– Short addressing mode is less powerful because
it can generally only access page zero (0000h 00FFh range), but the instruction size is more
compact, and faster. All memory to memory instructions use short addressing modes only
(CLR, CPL, NEG, BSET, BRES, BTJT, BTJF,
INC, DEC, RLC, RRC, SLL, SRL, SRA, SWAP)
The ST7 Assembler optimizes the use of long and
short addressing modes.
Table 24. CPU Addressing Mode Overview
Mode
Syntax
Destination
Pointer
Address
(Hex.)
Pointer Size
(Hex.)
Length
(Bytes)
Inherent
nop
+0
Immediate
ld A,#$55
+1
Short
Direct
ld A,$10
00..FF
+1
Long
Direct
ld A,$1000
0000..FFFF
+2
No Offset
Direct
Indexed
ld A,(X)
00..FF
+0
Short
Direct
Indexed
ld A,($10,X)
00..1FE
+1
Long
Direct
Indexed
ld A,($1000,X)
0000..FFFF
+2
Short
Indirect
ld A,[$10]
00..FF
00..FF
byte
+2
Long
Indirect
ld A,[$10.w]
0000..FFFF
00..FF
word
+2
Short
Indirect
Indexed
ld A,([$10],X)
00..1FE
00..FF
byte
+2
Long
Indirect
Indexed
ld A,([$10.w],X)
0000..FFFF
00..FF
word
+2
Relative
Direct
jrne loop
PC+/-127
Relative
Indirect
jrne [$10]
PC+/-127
Bit
Direct
bset $10,#7
00..FF
Bit
Indirect
bset [$10],#7
00..FF
Bit
Direct
Relative
btjt $10,#7,skip
00..FF
Bit
Indirect
Relative
btjt [$10],#7,skip
00..FF
116/171
+1
00..FF
byte
+2
+1
00..FF
byte
+2
+2
00..FF
byte
+3
ST72260G, ST72262G, ST72264G
INSTRUCTION SET OVERVIEW (Cont’d)
12.1.1 Inherent
All Inherent instructions consist of a single byte.
The opcode fully specifies all the required information for the CPU to process the operation.
Inherent Instruction
Function
NOP
No operation
TRAP
S/W Interrupt
WFI
Wait For Interrupt (Low Power Mode)
HALT
Halt Oscillator (Lowest Power
Mode)
RET
Sub-routine Return
IRET
Interrupt Sub-routine Return
SIM
Set Interrupt Mask (level 3)
RIM
Reset Interrupt Mask (level 0)
SCF
Set Carry Flag
RCF
Reset Carry Flag
RSP
Reset Stack Pointer
LD
Load
CLR
Clear
PUSH/POP
Push/Pop to/from the stack
INC/DEC
Increment/Decrement
TNZ
Test Negative or Zero
CPL, NEG
1 or 2 Complement
MUL
Byte Multiplication
SLL, SRL, SRA, RLC,
RRC
Shift and Rotate Operations
SWAP
Swap Nibbles
12.1.2 Immediate
Immediate instructions have two bytes, the first
byte contains the opcode, the second byte contains the operand value.
Immediate Instruction
Function
LD
Load
CP
Compare
BCP
Bit Compare
AND, OR, XOR
Logical Operations
ADC, ADD, SUB, SBC
Arithmetic Operations
12.1.3 Direct
In Direct instructions, the operands are referenced
by their memory address.
The direct addressing mode consists of two submodes:
Direct (short)
The address is a byte, thus requires only one byte
after the opcode, but only allows 00 - FF addressing space.
Direct (long)
The address is a word, thus allowing 64 Kbyte addressing space, but requires 2 bytes after the opcode.
12.1.4 Indexed (No Offset, Short, Long)
In this mode, the operand is referenced by its
memory address, which is defined by the unsigned
addition of an index register (X or Y) with an offset.
The indirect addressing mode consists of three
sub-modes:
Indexed (No Offset)
There is no offset, (no extra byte after the opcode),
and allows 00 - FF addressing space.
Indexed (Short)
The offset is a byte, thus requires only one byte after the opcode and allows 00 - 1FE addressing
space.
Indexed (long)
The offset is a word, thus allowing 64 Kbyte addressing space and requires 2 bytes after the opcode.
12.1.5 Indirect (Short, Long)
The required data byte to do the operation is found
by its memory address, located in memory (pointer).
The pointer address follows the opcode. The indirect addressing mode consists of two sub-modes:
Indirect (short)
The pointer address is a byte, the pointer size is a
byte, thus allowing 00 - FF addressing space, and
requires 1 byte after the opcode.
Indirect (long)
The pointer address is a byte, the pointer size is a
word, thus allowing 64 Kbyte addressing space,
and requires 1 byte after the opcode.
117/171
ST72260G, ST72262G, ST72264G
INSTRUCTION SET OVERVIEW (Cont’d)
12.1.6 Indirect Indexed (Short, Long)
This is a combination of indirect and short indexed
addressing modes. The operand is referenced by
its memory address, which is defined by the unsigned addition of an index register value (X or Y)
with a pointer value located in memory. The pointer address follows the opcode.
The indirect indexed addressing mode consists of
two sub-modes:
Indirect Indexed (Short)
The pointer address is a byte, the pointer size is a
byte, thus allowing 00 - 1FE addressing space,
and requires 1 byte after the opcode.
Indirect Indexed (Long)
The pointer address is a byte, the pointer size is a
word, thus allowing 64 Kbyte addressing space,
and requires 1 byte after the opcode.
Table 25. Instructions Supporting Direct,
Indexed, Indirect and Indirect Indexed
Addressing Modes
Long and Short
Instructions
Function
LD
Load
CP
Compare
AND, OR, XOR
Logical Operations
ADC, ADD, SUB, SBC
Arithmetic Additions/Substractions operations
BCP
Bit Compare
Short Instructions
Only
CLR
Function
Clear
INC, DEC
Increment/Decrement
TNZ
Test Negative or Zero
CPL, NEG
1 or 2 Complement
BSET, BRES
Bit Operations
BTJT, BTJF
Bit Test and Jump Operations
SLL, SRL, SRA, RLC,
RRC
Shift and Rotate Operations
SWAP
Swap Nibbles
CALL, JP
Call or Jump subroutine
118/171
12.1.7 Relative mode (Direct, Indirect)
This addressing mode is used to modify the PC
register value, by adding an 8-bit signed offset to
it.
Available Relative
Direct/Indirect
Instructions
Function
JRxx
Conditional Jump
CALLR
Call Relative
The relative addressing mode consists of two submodes:
Relative (Direct)
The offset is following the opcode.
Relative (Indirect)
The offset is defined in memory, which address
follows the opcode.
ST72260G, ST72262G, ST72264G
INSTRUCTION SET OVERVIEW (Cont’d)
12.2 INSTRUCTION GROUPS
The ST7 family devices use an Instruction Set
consisting of 63 instructions. The instructions may
Load and Transfer
LD
CLR
Stack operation
PUSH
POP
be subdivided into 13 main groups as illustrated in
the following table:
RSP
Increment/Decrement
INC
DEC
Compare and Tests
CP
TNZ
BCP
Logical operations
AND
OR
XOR
CPL
NEG
Bit Operation
BSET
BRES
Conditional Bit Test and Branch
BTJT
BTJF
Arithmetic operations
ADC
ADD
SUB
SBC
MUL
Shift and Rotates
SLL
SRL
SRA
RLC
RRC
SWAP
SLA
Unconditional Jump or Call
JRA
JRT
JRF
JP
CALL
CALLR
NOP
Conditional Branch
JRxx
Interruption management
TRAP
WFI
HALT
IRET
Condition Code Flag modification
SIM
RIM
SCF
RCF
Using a pre-byte
The instructions are described with one to four opcodes.
In order to extend the number of available opcodes for an 8-bit CPU (256 opcodes), three different prebyte opcodes are defined. These prebytes
modify the meaning of the instruction they precede.
The whole instruction becomes:
PC-2
End of previous instruction
PC-1
Prebyte
PC
opcode
PC+1
Additional word (0 to 2) according
to the number of bytes required to compute the effective address
RET
These prebytes enable instruction in Y as well as
indirect addressing modes to be implemented.
They precede the opcode of the instruction in X or
the instruction using direct addressing mode. The
prebytes are:
PDY 90
Replace an X based instruction
using immediate, direct, indexed, or inherent addressing mode by a Y one.
PIX 92
Replace an instruction using direct, direct bit, or direct relative addressing mode
to an instruction using the corresponding indirect
addressing mode.
It also changes an instruction using X indexed addressing mode to an instruction using indirect X indexed addressing mode.
PIY 91
Replace an instruction using X indirect indexed addressing mode by a Y one.
119/171
ST72260G, ST72262G, ST72264G
INSTRUCTION SET OVERVIEW (Cont’d)
Mnemo
Description
Function/Example
Dst
Src
I1
H
I0
N
Z
C
ADC
Add with Carry
A=A+M+C
A
M
H
N
Z
C
ADD
Addition
A=A+M
A
M
H
N
Z
C
AND
Logical And
A=A.M
A
M
N
Z
BCP
Bit compare A, Memory
tst (A . M)
A
M
N
Z
BRES
Bit Reset
bres Byte, #3
M
BSET
Bit Set
bset Byte, #3
M
BTJF
Jump if bit is false (0)
btjf Byte, #3, Jmp1
M
C
BTJT
Jump if bit is true (1)
btjt Byte, #3, Jmp1
M
C
CALL
Call subroutine
CALLR
Call subroutine relative
CLR
Clear
CP
Arithmetic Compare
tst(Reg - M)
reg
CPL
One Complement
A = FFH-A
DEC
Decrement
dec Y
HALT
Halt
IRET
Interrupt routine return
Pop CC, A, X, PC
INC
Increment
inc X
JP
Absolute Jump
jp [TBL.w]
JRA
Jump relative always
JRT
Jump relative
JRF
Never jump
jrf *
JRIH
Jump if Port B INT pin = 1
(no Port B Interrupts)
JRIL
Jump if Port B INT pin = 0
(Port B interrupt)
JRH
Jump if H = 1
H=1?
JRNH
Jump if H = 0
H=0?
JRM
Jump if I1:0 = 11
I1:0 = 11 ?
JRNM
Jump if I1:0 <> 11
I1:0 <> 11 ?
JRMI
Jump if N = 1 (minus)
N=1?
JRPL
Jump if N = 0 (plus)
N=0?
JREQ
Jump if Z = 1 (equal)
Z=1?
JRNE
Jump if Z = 0 (not equal)
Z=0?
JRC
Jump if C = 1
C=1?
JRNC
Jump if C = 0
C=0?
JRULT
Jump if C = 1
Unsigned <
JRUGE
Jump if C = 0
Jmp if unsigned >=
JRUGT
Jump if (C + Z = 0)
Unsigned >
120/171
reg, M
0
1
N
Z
C
reg, M
N
Z
1
reg, M
N
Z
N
Z
N
Z
M
1
I1
reg, M
0
H
I0
C
ST72260G, ST72262G, ST72264G
INSTRUCTION SET OVERVIEW (Cont’d)
Mnemo
Description
Function/Example
Dst
Src
JRULE
Jump if (C + Z = 1)
Unsigned <=
LD
Load
MUL
I1
H
I0
N
Z
N
Z
dst <= src
reg, M
M, reg
Multiply
X,A = X * A
A, X, Y
X, Y, A
NEG
Negate (2's compl)
neg $10
reg, M
NOP
No Operation
OR
OR operation
A=A+M
A
M
POP
Pop from the Stack
pop reg
reg
M
pop CC
CC
M
PUSH
Push onto the Stack
push Y
M
reg, CC
RCF
Reset carry flag
C=0
RET
Subroutine Return
RIM
Enable Interrupts
I1:0 = 10 (level 0)
RLC
Rotate left true C
C <= A <= C
reg, M
N
Z
C
RRC
Rotate right true C
C => A => C
reg, M
N
Z
C
RSP
Reset Stack Pointer
S = Max allowed
SBC
Substract with Carry
A=A-M-C
N
Z
C
SCF
Set carry flag
C=1
SIM
Disable Interrupts
I1:0 = 11 (level 3)
0
I1
H
C
0
I0
N
Z
N
Z
N
Z
C
C
0
1
A
0
M
1
1
1
SLA
Shift left Arithmetic
C <= A <= 0
reg, M
N
Z
C
SLL
Shift left Logic
C <= A <= 0
reg, M
N
Z
C
SRL
Shift right Logic
0 => A => C
reg, M
0
Z
C
SRA
Shift right Arithmetic
A7 => A => C
reg, M
N
Z
C
SUB
Substraction
A=A-M
A
N
Z
C
SWAP
SWAP nibbles
A7-A4 <=> A3-A0
reg, M
N
Z
TNZ
Test for Neg & Zero
tnz lbl1
N
Z
TRAP
S/W trap
S/W interrupt
WFI
Wait for Interrupt
XOR
Exclusive OR
N
Z
A = A XOR M
A
M
M
1
1
1
0
121/171
ST72260G, ST72262G, ST72264G
13 ELECTRICAL CHARACTERISTICS
13.1 PARAMETER CONDITIONS
Unless otherwise specified, all voltages are referred to VSS.
13.1.1 Minimum and Maximum values
Unless otherwise specified the minimum and maximum values are guaranteed in the worst conditions of ambient temperature, supply voltage and
frequencies by tests in production on 100% of the
devices with an ambient temperature at TA=25°C
and TA=TAmax (given by the selected temperature
range).
Data based on characterization results, design
simulation and/or technology characteristics are
indicated in the table footnotes and are not tested
in production. Based on characterization, the minimum and maximum values refer to sample tests
and represent the mean value plus or minus three
times the standard deviation (mean±3Σ).
13.1.2 Typical values
Unless otherwise specified, typical data are based
on TA=25°C, VDD=5V (for the 3V≤VDD≤5.5V voltage range) and VDD=2.7V (for the 2.4V≤VDD≤3V
voltage range). They are given only as design
guidelines and are not tested.
Typical ADC accuracy values are determined by
characterization of a batch of samples from a
standard diffusion lot over the full temperature
range, where 95% of the devices have an error
less than or equal to the value indicated
(mean±2Σ).
13.1.3 Typical curves
Unless otherwise specified, all typical curves are
given only as design guidelines and are not tested.
13.1.4 Loading capacitor
The loading conditions used for pin parameter
measurement are shown in Figure 62.
Figure 62. Pin loading conditions
ST7 PIN
CL
122/171
13.1.5 Pin input voltage
The input voltage measurement on a pin of the device is described in Figure 63.
Figure 63. Pin input voltage
ST7 PIN
VIN
ST72260G, ST72262G, ST72264G
13.2 ABSOLUTE MAXIMUM RATINGS
Stresses above those listed as “absolute maximum ratings” may cause permanent damage to
the device. This is a stress rating only and functional operation of the device under these condi13.2.1 Voltage Characteristics
Symbol
VDD - VSS
tions is not implied. Exposure to maximum rating
conditions for extended periods may affect device
reliability.
Ratings
Maximum value
Supply voltage
6.5
Input voltage on any pin 1) & 2)
VIN
VSS-0.3 to VDD+0.3
VESD(HBM)
Electrostatic discharge voltage (Human Body Model)
VESD(MM)
Electrostatic discharge voltage (Machine Model)
Unit
V
see Section 13.7.3 on page 137
13.2.2 Current Characteristics
Symbol
IVDD
IVSS
IIO
IINJ(PIN) 2) & 4)
Ratings
Total current into VDD power lines (source)
100
Total current out of VSS ground lines (sink)
3)
150
Output current sunk by any standard I/O and control pin
25
Output current sunk by any high sink I/O pin
50
Output current source by any I/Os and control pin
- 25
Injected current on ICCSEL pin
±5
Injected current on RESET pin
±5
Injected current on OSC1 and OSC2 pins
Injected current on any other pin
ΣIINJ(PIN)
2)
Maximum value
3)
mA
±5
5) & 6)
Total injected current (sum of all I/O and control pins)
Unit
±5
5)
± 20
13.2.3 Thermal Characteristics
Symbol
TSTG
TJ
Ratings
Storage temperature range
Value
Unit
-65 to +150
°C
Maximum junction temperature (see Section Figure 111. "Low Profile Fine Pitch Ball Grid Array
Package" on page 155)
Notes:
1. Directly connecting the RESET and I/O pins to VDD or VSS could damage the device if an unintentional internal reset
is generated or an unexpected change of the I/O configuration occurs (for example, due to a corrupted program counter).
To guarantee safe operation, this connection has to be done through a pull-up or pull-down resistor (typical: 4.7kΩ for
RESET, 10kΩ for I/Os). Unused I/O pins must be tied in the same way to VDD or VSS according to their reset configuration.
2. When the current limitation is not possible, the VIN absolute maximum rating must be respected, otherwise refer to
IINJ(PIN) specification. A positive injection is induced by VIN>VDD while a negative injection is induced by VIN<VSS.
3. All power (VDD) and ground (VSS) lines must always be connected to the external supply.
4. Negative injection disturbs the analog performance of the device. See note in “10-BIT ADC CHARACTERISTICS” on
page 152. For best reliability, it is recommended to avoid negative injection of more than 1.6mA.
5. When several inputs are submitted to a current injection, the maximum ΣIINJ(PIN) is the absolute sum of the positive
and negative injected currents (instantaneous values). These results are based on characterisation with ΣIINJ(PIN) maximum current injection on four I/O port pins of the device.
6. True open drain I/O port pins do not accept positive injection.
123/171
ST72260G, ST72262G, ST72264G
13.3 OPERATING CONDITIONS
13.3.1 General Operating Conditions
TA = -40 to +85°C unless otherwise specified.
Symbol
VDD
fOSC
Parameter
Conditions
Supply voltage
Min
Max
fOSC = 8 MHz. max., TA = 0 to 70°C
2.4
5.5
fOSC = 8 MHz. max.
2.7
5.5
fOSC = 16 MHz. max.
3.3
5.5
0
16
0
8
VDD≥3.3V
External clock frequency on OSC1
VDD≥2.4V, TA = 0 to +70°C
pin
VDD≥2.7V, TA = -40 to +85°C
Unit
V
MHz
Figure 64. fOSC Maximum Operating Frequency Versus VDD Supply Voltage
FUNCTIONALITY
GUARANTEED
IN THIS AREA
(UNLESS OTHERWISE
STATED IN THE
TABLES OF
PARAMETRIC DATA)
fOSC [MHz]
16
FUNCTIONALITY
NOT GUARANTEED
IN THIS AREA
8
FUNCTIONALITY
GUARANTEED
IN THIS AREA
AT TA 0 to 70°C
4
1
0
SUPPLY VOLTAGE [V]
2.0
124/171
2.4 2.7
3.3
3.5
4.0
4.5
5.0
5.5
ST72260G, ST72262G, ST72264G
OPERATING CONDITIONS (Cont’d)
13.3.2 Low Voltage Detector (LVD) Thresholds
TA = -40 to +85°C unless otherwise specified
Symbol
Parameter
Conditions
Min
Typ
Max
4.0 1)
3.55 1)
2.95 1)
4.2
3.75
3.15
4.5
4.0
3.35
VIT+(LVD)
Reset release threshold
(VDD rise)
High Threshold
Med. Threshold
Low Threshold
VIT-(LVD)
Reset generation threshold
(VDD fall)
High Threshold
Med. Threshold
Low Threshold
3.75
3.3
2.75
4.0
3.55
3.0
4.251)
3.751)
3.151)
Vhys(LVD)
LVD voltage threshold hysteresis
VIT+(LVD)-VIT-(LVD)
150
200
250
VDD rise time rate 1)2)
tg(VDD)
Filtered glitch delay on VDD 1)
V
mV
µs/V
20
VtPOR
Unit
100
Not detected by the LVD
40
ms/V
ns
Notes:
1. Data based on characterization results, not tested in production.
2. When VtPOR is faster than 100 µs/V, the Reset signal is released after a delay of max. 42µs after VDD crosses the
VIT+(LVD) threshold.
Figure 65. LVD Startup Behaviour
5V
LVD RESET
VIT+
VD
1.5V
D
Window
0.8V
t
Note: When the LVD is enabled, the MCU reaches its authorized operating voltage from a reset state.
However, in some devices, the reset state is released when VDD is approximately between 0.8V and 1.5V.
As a consequence, depending on the ramp-up speed, the I/Os may toggle when VDD is within this window.
This may be an issue especially for applications where the MCU drives power components.
Because Flash write access is impossible within this window, the Flash memory contents will not be corrupted.
125/171
ST72260G, ST72262G, ST72264G
OPERATING CONDITIONS (Cont’d)
13.3.3 Auxiliary Voltage Detector (AVD) Thresholds
TA = -40 to +85°C unless otherwise specified
Symbol
Parameter
Conditions
Min
Typ
Max
4.4 1)
3.91)
3.4 1)
4.6
4.2
3.6
4.9
4.4
3.8
4.15
3.75
3.1
4.4
3.95
3.4
4.651)
4.21)
3.61)
VIT+(AVD)
1⇒0 AVDF flag toggle threshold
(VDD rise)
VD level = Low in option byte
VD level = Med. in option byte
VD level = High in option byte
VIT-(AVD)
0⇒1 AVDF flag toggle threshold
(VDD fall)
VD level = Low in option byte
VD level = Med. in option byte
VD level = High in option byte
Vhys(AVD)
AVD voltage threshold hysteresis
VIT+(AVD)-VIT-(AVD)
250
∆VIT-
Voltage drop between AVD flag set
VIT-(AVD)-VIT-(LVD)
and LVD reset activated
450
1. Data based on characterization results, not tested in production.
126/171
Unit
V
mV
ST72260G, ST72262G, ST72264G
13.4 SUPPLY CURRENT CHARACTERISTICS
The following current consumption specified for the ST7 functional operating modes over temperature
range does not take into account the clock source current consumption. To get the total device consumption, the two current values must be added (except for HALT mode for which the clock is stopped).
Symbol
Parameter
∆IDD(∆Ta)
Conditions
Supply current variation vs. temperature
Constant VDD and fCPU
Max
Unit
10
%
Unit
13.4.1 RUN, SLOW, WAIT and SLOW WAIT Modes
TA = -40 to +85°C unless otherwise specified
Symbol
IDD
Parameter
Supply current in RUN mode 2)
(see Figure 66)
Typ
Max
VDD=5.5V,fOSC=16MHz, fCPU=8MHz
VDD=2.7V, fOSC=8MHz, fCPU=4MHz
Conditions
7.2
3.5
111)
4)
5.25
Supply current in SLOW mode 3)
(see Figure 67)
VDD=5.5V, fOSC=16MHz, fCPU=500kHz
VDD=2.7V, fOSC=8MHz, fCPU=250MHz
0.7
0.38
1.21)
0.64)
Supply current in WAIT mode 2)
(see Figure 68)
VDD=5.5V,fOSC=16MHz, fCPU=8MHz
VDD=2.7V, fOSC=8MHz, fCPU=4MHz
3.6
1.8
5.551)
34)
0.45
0.25
11)
0.54)
Supply current in SLOW WAIT mode 3) VDD=5.5V, fOSC=16MHz, fCPU=500kHz
VDD=2.7V, fOSC=8MHz, fCPU=250MHz
(see Figure 69)
Figure 66. Typical IDD in RUN at TA=25°C
Figure 68. Typical IDD in WAIT at TA=25°C
Fosc=16MHz
8
Fosc=8MHz
7
Fosc=4MHz
6
Fosc=2MHz
Idd(mA)
Idd (mA)
10
9
5
4
3
2
1
0
2.5
3
3.5
4
4.5
5
5.5
6
6.5
Fosc=16MHz
4.5
4
3.5
3
2.5
2
1.5
1
0.5
0
Fosc=8MHz
Fosc=4MHz
Fosc=2MHz
2.5
3
3.5
4
4.5
Figure 67. Typical IDD in SLOW at TA=25°C
6
6.5
Fosc=16MHz
Fosc=8MHz
0.5
Fosc=4MHz
Fosc=4MHz
Fosc=2MHz
0.4
0.5
Idd(mA)
Idd(mA)
0.6
Fosc=8MHz
0.6
5.5
Figure 69. Typ. IDD in SLOW-WAIT at TA=25°C
Fosc=16MHz
0.7
5
Vdd(V)
Vdd (V)
0.8
mA
0.4
0.3
Fosc=2MHz
0.3
0.2
0.2
0.1
0.1
0
0
2.5
3
3.5
4
4.5
Vdd(V)
5
5.5
6
6.5
2.5
3
3.5
4
4.5
5
5.5
6
6.5
Vdd(V)
Notes:
1. Data based on characterization results, tested in production at VDD max. and fCPU max.
2. Program executed from RAM, CPU running with memory access, all I/O pins in input mode with a static value at VDD
or VSS (no load), all peripherals in reset state; clock input (OSC1) driven by external square wave, CSS and LVD disabled.
3. All I/O pins in input mode with a static value at VDD or VSS (no load), all peripherals in reset state; clock input (OSC1)
driven by external square wave, CSS and LVD disabled.
4. Data based on characterization results, not tested in production.
127/171
ST72260G, ST72262G, ST72264G
SUPPLY CURRENT CHARACTERISTICS (Cont’d)
13.4.2 HALT and ACTIVE-HALT Modes
Symbol
Parameter
Conditions
Supply current in HALT mode 1)
VDD=5.5V
-40°C≤TA≤+85°C
VDD=2.7V
-40°C≤TA≤+85°C
Typ
Supply current in ACTIVE-HALT mode
13.4.3 Supply and Clock Managers
The previous current consumption specified for
the ST7 functional operating modes over temperature range does not take into account the clock
Symbol
Unit
10
6
IDD
2)
Max
500
No max.
guaranteed
µA
source current consumption. To get the total device consumption, the two current values must be
added (except for HALT mode).
Parameter
Conditions
IDD(RCINT) Supply current of internal RC oscillator
Typ
Max
Unit
900
see Section
13.5.3 on page
131
IDD(RES)
Supply current of resonator oscillator 3) & 4)
IDD(PLL)
PLL supply current
IDD(CSS)
Clock security system supply current
VDD=5V
220
IDD(LVD)
LVD supply current
HALT mode
100
VDD=5V
µA
100
Notes:
1. All I/O pins in output mode with a static value at VSS (no load), CSS and LVD disabled. Data based on characterization
results, tested in production at VDD max. and fCPU max.
2. Data based on characterisation results, not tested in production. All I/O pins in output mode with a static value at VSS
(no load); clock input (OSC1) driven by external square wave, LVD disabled. To obtain the total current consumption of
the device, add the clock source consumption (Section 13.5.3 and Section 13.5.4).
3. Data based on characterization results done with the external components specified in Section 13.5.3 and Section
13.5.4, not tested in production.
4. As the oscillator is based on a current source, the consumption does not depend on the voltage.
128/171
ST72260G, ST72262G, ST72264G
SUPPLY CURRENT CHARACTERISTICS (Cont’d)
13.4.4 On-chip peripherals
Symbol
IDD(TIM)
IDD(SPI)
Parameter
16-bit Timer supply current 1)
SPI supply current 2)
IDD(SCI)
SCI supply current 3)
IDD(I2C)
I2C supply current 4)
IDD(ADC)
ADC supply current when converting 5)
Conditions
Typ
fCPU=4MHz
VDD=3.0V
TBD
fCPU=8MHz
fCPU=4MHz
VDD=5.0V
VDD=3.0V
60
TBD
fCPU=8MHz
VDD=5.0V
200
fCPU=4MHz
VDD=3.0V
TBD
fCPU=8MHz
fCPU=4MHz
VDD=5.0V
400
VDD=3.0V
TBD
fCPU=8MHz
VDD=5.0V
500
VDD=3.0V
TBD
VDD=5.0V
500
fADC=4MHz
Unit
µA
Notes:
1. Data based on a differential IDD measurement between reset configuration (timer counter running at fCPU/2) and timer
counter stopped (only TIMD bit set). Data valid for one timer.
2. Data based on a differential IDD measurement between reset configuration (SPI disabled) and a permanent SPI master
communication at maximum speed (data sent equal to FFh).This measurement includes the pad toggling consumption.
3. Data based on a differential IDD measurement between SCI running at maximum speed configuration (500 kbaud, continuous transmission of AA +RE enabled and SCI off. This measurement includes the pad toggling consumption.
4. Data based on a differential IDD measurement between reset configuration (I2C disabled) and a permanent I2C master
communication at 300kHz (data sent equal to AAh). This measurement includes the pad toggling consumption
(4.7kOhm external pull-up on clock and data lines).
5. Data based on a differential IDD measurement between reset configuration (ADC off) and continuous A/D conversion
(fADC=4MHz).
129/171
ST72260G, ST72262G, ST72264G
13.5 CLOCK AND TIMING CHARACTERISTICS
Subject to general operating conditions for VDD, fOSC, and TA.
13.5.1 General Timings
Symbol
tc(INST)
tv(IT)
Parameter
Conditions
Instruction cycle time
Interrupt reaction time
tv(IT) = ∆tc(INST) + 10
fCPU=8MHz
2)
fCPU=8MHz
Min
Typ 1)
Max
Unit
2
3
12
tCPU
250
375
1500
ns
10
22
tCPU
1.25
2.75
µs
13.5.2 External Clock Source
Symbol
Parameter
Conditions
Min
Typ
Max
VOSC1H
OSC1 input pin high level voltage
0.7xVDD
VDD
VOSC1L
OSC1 input pin low level voltage
VSS
0.3xVDD
tw(OSC1H)
tw(OSC1L)
tr(OSC1)
tf(OSC1)
IL
OSC1 high or low time 3)
see Figure 70
Unit
V
15
ns
OSC1 rise or fall time 3)
15
VSS≤VIN≤VDD
OSCx Input leakage current
±1
µA
Figure 70. Typical Application with an External Clock Source
90%
VOSC1H
10%
VOSC1L
tr(OSC1)
tf(OSC1)
OSC2
tw(OSC1H)
tw(OSC1L)
Not connected internally
fOSC
EXTERNAL
CLOCK SOURCE
OSC1
IL
ST72XXX
Notes:
1. Data based on typical application software.
2. Time measured between interrupt event and interrupt vector fetch. ∆tc(INST) is the number of tCPU cycles needed to finish
the current instruction execution.
3. Data based on design simulation and/or technology characteristics, not tested in production.
130/171
ST72260G, ST72262G, ST72264G
CLOCK AND TIMING CHARACTERISTICS (Cont’d)
13.5.3 Crystal and Ceramic Resonator Oscillators
The ST7 internal clock can be supplied with four
different Crystal/Ceramic resonator oscillators. All
the information given in this paragraph are based
on characterization results with specified typical
external components. In the application, the resonator and the load capacitors have to be placed as
Symbol
Parameter
fOSC
Oscillator Frequency 1)
RF
Feedback resistor
CL1
CL2
Recommended load capacitance versus equivalent serial resistance of the
crystal or ceramic resonator (RS)
Symbol
i2
close as possible to the oscillator pins in order to
minimize output distortion and start-up stabilization time. Refer to the crystal/ceramic resonator
manufacturer for more details (frequency, package, accuracy...).
Conditions
Min
Max
Unit
VLP : Very Low power oscillator
LP: Low power oscillator
MP: Medium power oscillator
MS: Medium speed oscillator
HS: High speed oscillator
0.032
1
>2
>4
>8
0.1
2
4
8
16
MHz
VLP oscillator
LP oscillator
MP oscillator
MS oscillator
HS oscillator
RS=200Ω
RS=200Ω
RS=200Ω
RS=100Ω
Parameter
Conditions
VLP oscillator
LP oscillator
MP oscillator
MS oscillator
HS oscillator
VDD=5V
VIN=VSS
OSC2 driving current
20
40
kΩ
60
38
32
10
10
100
100
47
47
30
pF
Typ
Max
Unit
2.5
80
160
310
610
5
150
250
460
900
µA
Figure 71. Typical Application with a Crystal or Ceramic Resonator
WHEN RESONATOR WITH
INTEGRATED CAPACITORS
i2
fOSC
CL1
OSC1
RESONATOR
CL2
RD
RF
OSC2
ST72XXX
Notes:
1. The oscillator selection can be optimized in terms of supply current using an high quality resonator with small RS value.
Refer to crystal/ceramic resonator manufacturer for more details.
131/171
ST72260G, ST72262G, ST72264G
CLOCK AND TIMING CHARACTERISTICS (Cont’d)
Typical Crystal or Ceramic Resonators
MURATA Ceramic
Oscil.
Reference2)
Type3)
CSBFB1M00J58-R0
SMD
CSBLA1M00J58-B0 LEAD
CSTCC2M00G56-R0 SMD
CSTCR4M00G55-R0 SMD
CSTLS4M00G56-B0 LEAD
CSTCE8M00G52-R0 SMD
CSTLS8M00G53-B0 LEAD
CSTCE12M0G52-R0 SMD
CSTLA12M0T55-B0 LEAD
CSTCE16M0V53-R0 SMD
CSALS16M0X55-B0 LEAD
Freq.
(MHz)
1
2
4
8
12
16
Characteristic
CL1 CL2
1)
RD
[pF] [pF] [ohm]
∆fOSC=[±0.5%tolerance,±0.3%∆Ta,±0.3%aging,0.01%correl]
100 100 3.3k
∆fOSC=[±0.5%tolerance,±0.3%∆Ta,±0.3%aging,0.01%correl]
100 100 3.3k
∆fOSC=[±0.5%tolerance,±0.3%∆Ta,±0.3%aging,-0.19%correl]
∆fOSC=[±0.5%tolerance,±0.2%∆Ta,±0.1%aging,-0.24%correl]
(47) (47)
(39) (39)
0
∆fOSC=[±0.5%tolerance,±0.2%∆Ta,±0.2%aging,0.1%correl]
(47) (47)
0
∆fOSC=[±0.5%tolerance,±0.2%∆Ta,±0.1%aging,-0.16%correl]
∆fOSC=[±0.5%tolerance,±0.2%∆Ta,±0.2%aging,0.13%correl]
(10) (10)
0
(15) (15)
0
0
∆fOSC=[±0.5%tolerance,±0.2%∆Ta,±0.1%aging,-0.18%correl]
(10) (10)
0
∆fOSC=[±0.5%tolerance,±0.3%∆Ta,±0.3%aging,0.29%correl]
∆fOSC=[±0.5%tolerance,±0.3%∆Ta,±0.3%aging,-0.08%correl]
(30) (30)
(15) (15)
0
0
∆fOSC=[±0.5%tolerance,±0.2%∆Ta,±0.2%aging,0.11%correl]
10
10
470
Notes:
1. Resonator characteristics given by the crystal/ceramic resonator manufacturer.
2. CSTxx types have built-in loading capacitors (values shown in parentheses)
3. SMD = [-R0: Plastic tape package (∅ =180mm), -B0: Bulk]
LEAD = [-A0: Flat pack package (Radial taping Ho= 18mm), -B0: Bulk]
For more information, please consult the Murata report (02gc_5959_ST72F264G2.zip) on www.murata.com or http//
:mcu.st.com
132/171
ST72260G, ST72262G, ST72264G
CLOCK CHARACTERISTICS (Cont’d)
13.5.4 RC Oscillators
The ST7 internal clock can be supplied with an internal RC oscillator.
Symbol
fOSC (RCINT)
Parameter
Conditions
Internal RC oscillator frequency
See Figure 73
TA=25°C, VDD=5V
Min
Typ
Max
Unit
2
3.5
6
MHz
Figure 72. Typical Application with RC oscillator
ST72XXX
VDD
INTERNAL RC
Current copy
CIN
RIN
VREF
+
-
Voltage generator
fOSC
CEX discharge
Figure 73. Typical fOSC(RCINT) vs VDD
4.5
4
3.5
F(MHz)
3
2.5
2
T=25C
1.5
T=130C
1
T=-45C
0.5
0
2.35
5
5.5
Vdd(V)
133/171
ST72260G, ST72262G, ST72264G
CLOCK CHARACTERISTICS (Cont’d)
13.5.5 Clock Security System (CSS)
TA = -40 to +85°C unless otherwise specified
Symbol
Parameter
Conditions
Min
Typ
Safe Oscillator Frequency 1)
fSFOSC
Max
3
Unit
MHz
Note:
1. Data based on characterisation results.
13.5.6 PLL Characteristics
Symbol
Parameter
VDD(PLL)
PLL Operating Range
fOSC
PLL input frequency range
∆ fCPU/fCPU
Instantaneous PLL jitter 1)
Conditions
Min
Typ
Max
TA 0 to 70°C
3.5
5.5
TA -40 to +85°C
4.5
5.5
2
Unit
V
4
MHz
fOSC = 4 MHz.
1.0
2.5
%
fOSC = 2 MHz.
2.5
4.0
%
Note:
1. Data characterized but not tested.
Figure 74. PLL Jitter vs. Signal frequency1
0.8
+/-Jitter (%)
0.7
0.6
PLL ON
0.5
PLL OFF
0.4
0.3
0.2
0.1
0
2000
The user must take the PLL jitter into account in
the application (for example in serial communication or sampling of high frequency signals). The
PLL jitter is a periodic effect, which is integrated
over several CPU cycles. Therefore the longer the
period of the application signal, the less it will be
impacted by the PLL jitter.
Figure 74 shows the PLL jitter integrated on application signals in the range 125kHz to 2MHz. At frequencies of less than 125KHz, the jitter is negligible.
1000
500
250
125
Application Signal Frequency (KHz)
Note 1: Measurement conditions: fCPU = 4MHz, TA= 25°C
134/171
ST72260G, ST72262G, ST72264G
13.6 MEMORY CHARACTERISTICS
13.6.1 RAM and Hardware Registers
Symbol
VRM
Parameter
Data retention mode
Conditions
1)
HALT mode (or RESET)
Min
Typ
Max
1.6
Unit
V
13.6.2 XFlash Program Memory
Symbol
VDD
tprog
Parameter
Conditions
Operating voltage for Flash write/
erase
Programming time for 1~32 bytes
Min
Typ
Max
Unit
5.5
V
5
10
ms
0.24
0.48
2.4
2)
TA=−40 to +85°C
Programming time for 1.5kBytes
TA=+25°C
tRET
Data retention 4)
TA=+55°C3)
20
years
NRW
Write erase cycles
TA=+25°C
Read / Write / Erase
modes
fCPU = 8MHz, VDD = 5.5V
No Read/No Write Mode
Power down mode / HALT
10
kcycles
IDD
Supply current
0
2.63)
mA
100
0.15)
µA
µA
Notes:
1. Minimum VDD supply voltage without losing data stored in RAM (in HALT mode or under RESET) or in hardware registers (only in HALT mode). Guaranteed by construction, not tested in production.
2. Up to 32 bytes can be programmed at a time.
3. The data retention time increases when the TA decreases.
4. Data based on reliability test results and monitored in production.
5. Data based on characterization results, not tested in production.
135/171
ST72260G, ST72262G, ST72264G
13.7 EMC CHARACTERISTICS
Susceptibility tests are performed on a sample basis during product characterization.
13.7.1 Functional EMS
(Electro Magnetic Susceptibility)
Based on a simple running application on the
product (toggling 2 LEDs through I/O ports), the
product is stressed by two electro magnetic events
until a failure occurs (indicated by the LEDs).
The level classification is described in application
note AN1637.
ESD: Electro-Static Discharge (positive and
negative) is applied on all pins of the device until
a functional disturbance occurs. This test
conforms with the IEC 1000-4-2 standard.
■ FTB: A Burst of Fast Transient voltage (positive
and negative) is applied to VDD and VSS through
a 100pF capacitor, until a functional disturbance
occurs. This test conforms with the IEC 1000-44 standard.
A device reset allows normal operations to be resumed.
■
Symbol
Parameter
Conditions
Neg 1)
Pos 1)
VFESD
Voltage limits to be applied on any I/O pin
to induce a functional disturbance
VDD=5V, TA=+25°C, fOSC=8MHz
conforms to IEC 1000-4-2
TBD
TBD
VFFTB
Fast transient voltage burst limits to be apVDD=5V, TA=+25°C, fOSC=8MHz
plied through 100pF on VDD and VDD pins
conforms to IEC 1000-4-4
to induce a functional disturbance
TBD
TBD
Unit
kV
13.7.2 Electro Magnetic Interference (EMI)
Based on a simple application running on the product (toggling 2 LEDs through the I/O ports), the product
is monitored in terms of emission. This emission test is in line with the norm SAE J 1752/3 which specifies
the board and the loading of each pin.
Symbol
SEMI
Parameter
Peak level
Conditions
Max vs. [fOSC/fCPU]
Unit
8/4MHz
16/8MHz
0.1MHz to 30MHz
10
13
30MHz to 130MHz
VDD=5V, TA=+25°C,
conforming to SAE J 1752/3 130MHz to 1GHz
SAE EMI Level
13
24
dBµV
16
2.5
31
4
-
Notes:
1. Data based on characterization results, not tested in production.
136/171
Monitored
Frequency Band
ST72260G, ST72262G, ST72264G
EMC CHARACTERISTICS (Cont’d)
13.7.3 Absolute Electrical Sensitivity
Based on three different tests (ESD, LU and DLU)
using specific measurement methods, the product
is stressed in order to determine its performance in
terms of electrical sensitivity. For more details, refer to the AN1181 ST7 application note.
13.7.3.1 Electro-Static Discharge (ESD)
Electro-Static Discharges (a positive then a negative pulse separated by 1 second) are applied to
the pins of each sample according to each pin
combination. The sample size depends of the
number of supply pins of the device (3 parts*(n+1)
supply pin). Two models are usually simulated:
Human Body Model and Machine Model. This test
conforms to the JESD22-A114A/A115A standard.
See Figure 75 and the following test sequences.
Machine Model Test Sequence
– CL is loaded through S1 by the HV pulse generator.
– S1 switches position from generator to ST7.
– A discharge from CL to the ST7 occurs.
– S2 must be closed 10 to 100ms after the pulse
delivery period to ensure the ST7 is not left in
charge state. S2 must be opened at least 10ms
prior to the delivery of the next pulse.
– R (machine resistance), in series with S2, ensures a slow discharge of the ST7.
Human Body Model Test Sequence
– C L is loaded through S1 by the HV pulse generator.
– S1 switches position from generator to R.
– A discharge from CL through R (body resistance)
to the ST7 occurs.
– S2 must be closed 10 to 100ms after the pulse
delivery period to ensure the ST7 is not left in
charge state. S2 must be opened at least 10ms
prior to the delivery of the next pulse.
Absolute Maximum Ratings
Symbol
Ratings
Maximum value 1) Unit
Conditions
VESD(HBM)
Electro-static discharge voltage
(Human Body Model)
TA=+25°C
2000
VESD(MM)
Electro-static discharge voltage
(Machine Model)
TA=+25°C
200
V
Figure 75. Typical Equivalent ESD Circuits
S1
CL=100pF
ST7
S2
HIGH VOLTAGE
PULSE
GENERATOR
R=10k~10MΩ
HIGH VOLTAGE
PULSE
GENERATOR
S1
R=1500Ω
ST7
CL=200pF
HUMAN BODY MODEL
S2
MACHINE MODEL
Notes:
1. Data based on characterization results, not tested in production.
137/171
ST72260G, ST72262G, ST72264G
EMC CHARACTERISTICS (Cont’d)
13.7.3.2 Static and Dynamic Latch-Up
■ LU: 3 complementary static tests are required
on 10 parts to assess the latch-up performance.
A supply overvoltage (applied to each power
supply pin) and a current injection (applied to
each input, output and configurable I/O pin) are
performed on each sample. This test conforms
to the EIA/JESD 78 IC latch-up standard. For
more details, refer to the AN1181 ST7
application note.
■ DLU: Electro-Static Discharges (one positive
then one negative test) are applied to each pin
of 3 samples when the micro is running to
assess the latch-up performance in dynamic
mode. Power supplies are set to the typical
values, the oscillator is connected as near as
possible to the pins of the micro and the
component is put in reset mode. This test
conforms to the IEC1000-4-2 and SAEJ1752/3
standards and is described in Figure 76. For
more details, refer to the AN1181 ST7
application note.
13.7.3.3 Designing hardened software to avoid
noise problems
EMC characterization and optimization are performed at component level with a typical application environment and simplified MCU software. It
should be noted that good EMC performance is
highly dependent on the user application and the
software in particular.
Therefore it is recommended that the user applies
EMC software optimization and prequalification
tests in relation with the EMC level requested for
his application.
Software recommendations:
The software flowchart must include the management of runaway conditions such as:
– Corrupted program counter
– Unexpected reset
– Critical Data corruption (control registers...)
Prequalification trials:
Most of the common failures (unexpected reset
and program counter corruption) can be reproduced by manually forcing a low state on the RESET pin or the Oscillator pins for 1 second.
To complete these trials, ESD stress can be applied directly on the device, over the range of
specification values. When unexpected behaviour
is detected, the software can be hardened to prevent unrecoverable errors occurring (see application note AN1015).
Electrical Sensitivities
Symbol
LU
DLU
Parameter
Class 1)
Conditions
Static latch-up class
TA=+25°C
TA=+85°C
A
A
Dynamic latch-up class
VDD=5.5V, fOSC=4MHz, TA=+25°C
A
Figure 76. Simplified Diagram of the ESD Generator for DLU
RCH=50MΩ
CS=150pF
ESD
GENERATOR 2)
RD=330Ω
DISCHARGE TIP
VDD
VSS
HV RELAY
ST7
DISCHARGE
RETURN CONNECTION
Notes:
1. Class description: A Class is an STMicroelectronics internal specification. All its limits are higher than the JEDEC specifications, that means when a device belongs to Class A it exceeds the JEDEC standard. B Class strictly covers all the
JEDEC criteria (international standard).
2. Schaffner NSG435 with a pointed test finger.
138/171
ST72260G, ST72262G, ST72264G
EMC CHARACTERISTICS (Cont’d)
13.7.4 ESD Pin Protection Strategy
To protect an integrated circuit against ElectroStatic Discharge the stress must be controlled to
prevent degradation or destruction of the circuit elements. The stress generally affects the circuit elements which are connected to the pads but can
also affect the internal devices when the supply
pads receive the stress. The elements to be protected must not receive excessive current, voltage
or heating within their structure.
An ESD network combines the different input and
output ESD protections. This network works, by allowing safe discharge paths for the pins subjected
to ESD stress. Two critical ESD stress cases are
presented in Figure 77 and Figure 78 for standard
pins and in Figure 79 and Figure 80 for true open
drain pins.
Standard Pin Protection
To protect the output structure the following elements are added:
– A diode to VDD (3a) and a diode from VSS (3b)
– A protection device between VDD and VSS (4)
To protect the input structure the following elements are added:
– A resistor in series with the pad (1)
– A diode to VDD (2a) and a diode from VSS (2b)
– A protection device between VDD and VSS (4)
Figure 77. Positive Stress on a Standard Pad vs. VSS
VDD
VDD
(2a)
(3a)
(1)
OUT
(4)
IN
Main path
(2b)
(3b)
Path to avoid
VSS
VSS
Figure 78. Negative Stress on a Standard Pad vs. VDD
VDD
VDD
(2a)
(3a)
(1)
OUT
(4)
IN
Main path
(3b)
VSS
(2b)
VSS
139/171
ST72260G, ST72262G, ST72264G
EMC CHARACTERISTICS (Cont’d)
True Open Drain Pin Protection
The centralized protection (4) is not involved in the
discharge of the ESD stresses applied to true
open drain pads due to the fact that a P-Buffer and
diode to VDD are not implemented. An additional
local protection between the pad and VSS (5a &
5b) is implemented to completely absorb the positive ESD discharge.
Multisupply Configuration
When several types of ground (VSS, VSSA, ...) and
power supply (VDD, VAREF, ...) are available for
any reason (better noise immunity...), the structure
shown in Figure 81 is implemented to protect the
device against ESD.
Figure 79. Positive Stress on a True Open Drain Pad vs. VSS
VDD
VDD
Main path
(1)
Path to avoid
OUT
(5a)
(4)
IN
(3b)
(5b)
(2b)
VSS
VSS
Figure 80. Negative Stress on a True Open Drain Pad vs. VDD
VDD
VDD
Main path
(1)
OUT
(3b)
(4)
IN
(3b)
(2b)
(3b)
VSS
VSS
Figure 81. Multisupply Configuration
VDD
VAREF
VAREF
VSS
BACK TO BACK DIODE
BETWEEN GROUNDS
VSSA
140/171
VSSA
ST72260G, ST72262G, ST72264G
13.8 I/O PORT PIN CHARACTERISTICS
13.8.1 General Characteristics
TA = -40 to +85°C unless otherwise specified
Symbol
Parameter
Conditions
VIL
Input low level
VIH
Input high level voltage1)
Vhys
Schmitt trigger voltage hysteresis 1)
IINJ(PIN)2)
ΣIINJ(PIN)2)
Typ
Max
0.3xVDD
0.7xVDD
400
Total injected current (sum of all I/O VDD=5V
and control pins)
V
mV
±25
IL
Input leakage current
VSS≤VIN≤VDD
Static current consumption
Floating input mode3)
RPU
Weak pull-up equivalent resistor 4)
VIN=VSS
CIO
I/O pin capacitance
±1
200
VDD=5V
50
1)
VDD=3V
170
85
250
190
2301)
5
Output high to low level fall time
Unit
±4
Injected Current on an I/O pin
IS
tf(IO)out
Min
voltage1)
1)
tr(IO)out
CL=50pF
Output low to high level rise time 1) Between 10% and 90%
tw(IT)in
External interrupt pulse time5)
25
25
1
mA
µA
kΩ
pF
ns
tCPU
Notes:
1. Data based on characterization results, not tested in production.
2. When the current limitation is not possible, the VIN maximum must be respected, otherwise refer to IINJ(PIN) specification. A positive injection is induced by VIN>VDD while a negative injection is induced by VIN<VSS. Refer to Section 13.2.2
on page 123 for more details.
3. Configuration not recommended, all unused pins must be kept at a fixed voltage: using the output mode of the I/O for
example or an external pull-up or pull-down resistor (see Figure 82). Data based on design simulation and/or technology
characteristics, not tested in production.
4. The RPU pull-up equivalent resistor is based on a resistive transistor (corresponding IPU current characteristics described in Figure 83).
5. To generate an external interrupt, a minimum pulse width has to be applied on an I/O port pin configured as an external
interrupt source.
Figure 82. Two typical Applications with unused I/O Pin
VDD
10kΩ
ST7XXX
10kΩ
UNUSED I/O PORT
UNUSED I/O PORT
ST7XXX
141/171
ST72260G, ST72262G, ST72264G
I/O PORT PIN CHARACTERISTICS (Cont’d)
Figure 83. Typical IPU vs. VDD with VIN=VSS
Ipu(uA) at Vin=Vss
120
100
80
60
40
20
0
T=25C
T=-45C
T=90C
2 2.5 3 3.5 4 4.5 5 5.5 6
Vdd(V)
Figure 84. Typical VIL
2.5
Vil(V)
2
1.5
1
T=25C
T=-45C
0.5
0
2
3
4
5
6
Vdd(V)
Figure 85. Typical VIH
Vih(V)
4
3
T=25C
T=-45C
2
1
2
3
4
Vdd(V)
142/171
5
6
ST72260G, ST72262G, ST72264G
I/O PORT PIN CHARACTERISTICS (Cont’d)
13.8.2 Output Driving Current
TA = -40 to +85°C unless otherwise specified
VOH 2)
VOL
1)3)
VOL
Output low level voltage for a high sink I/O pin
when 4 pins are sunk at same time
1)3)
VOH 2)3)
VDD=5V
Output low level voltage for a standard I/O pin
when 8 pins are sunk at same time
Output high level voltage for an I/O pin
when 4 pins are sourced at same time
Output low level voltage for a standard I/O pin
when 8 pins are sunk at same time
Output low level voltage for a high sink I/O pin
when 4 pins are sunk at same time
VOH 2)3)
Conditions
Output high level voltage for an I/O pin
when 4 pins are sourced at same time
VDD=3.3V
VOL 1)
Parameter
Output low level voltage for a standard I/O pin
when 8 pins are sunk at same time
Output low level voltage for a high sink I/O pin
when 4 pins are sunk at same time
Output high level voltage for an I/O pin
when 4 pins are sourced at same time
VDD=2.7V
Symbol
Min
Max
IIO=+5mA
1.2
IIO=+2mA
0.5
IIO=+20mA,
1.3
IIO=+8mA
0.75
IIO=-5mA,
VDD-1.6
IIO=-2mA
VDD-0.8
IIO=+2mA
0.6
IIO=+8mA
0.6
IIO=-2mA
V
TA≤85°C VDD-0.8
IIO=+2mA
0.7
IIO=+8mA
0.7
IIO=-2mA
Unit
VDD-0.9
Notes:
1. The IIO current sunk must always respect the absolute maximum rating specified in Section 13.2.2 and the sum of IIO
(I/O ports and control pins) must not exceed IVSS.
2. The IIO current sourced must always respect the absolute maximum rating specified in Section 13.2.2 and the sum of
IIO (I/O ports and control pins) must not exceed IVDD. True open drain I/O pins does not have VOH.
3. Not tested in production, based on characterization results.
143/171
ST72260G, ST72262G, ST72264G
I/O PORT PIN CHARACTERISTICS (Cont’d)
Figure 89. Typ. VOL at VDD=2.7V (standard)
Figure 86. Typ. VOL at VDD=2.4V (standard)
0.6
0.5
0.5
T=90C
0.4
T=90C
T=-45C
0.4
0.4
T=-45C
Vol (V)
Vol (V)
T=25C
0.5
T=25C
0.3
0.2
0.3
0.3
0.2
0.2
0.1
0.1
0.1
0.0
0.0
0
1
2
0
1
Iio (mA)
Figure 90. Typ. VOL at VDD=2.4V (high-sink)
0.8
1.8
1.6
1.4
1.2
1
0.8
0.6
0.4
0.2
0
0.7
T=25C
T=25C
0.6
T=90C
T=90C
0.5
T=-45C
Vol(V)
Vol(V) at Vdd= 5V
Figure 87. Typ. VOL at VDD=5V (standard)
T=-45C
0.4
0.3
0.2
0.1
0
0
1
2
3
4
5
6
7
8
9
0
10
2
Figure 88. Typ. VOL at VDD=3V (high-sink)
6
8
10
Figure 91. Typ. VOL at VDD=5V (high-sink)
0.8
1
0.8
T=25C
0.7
T=90C
0.6
Vol(V) at Vdd=5V
0.9
T=-45C
0.5
0.4
0.3
0.2
0.7
T=25C
0.6
T=90C
0.5
T=-45C
0.4
0.3
0.2
0.1
0.1
0
0
0
2
4
6
8
Iol(mA)
144/171
4
Iol(mA)
Iio(mA)
Vol(V)
2
Iio(mA)
10
12
14
16
0 1 2 3 4 5 6 7 8 9 10 11 1213 14 15 16 1718 19 20
Iio(mA)
ST72260G, ST72262G, ST72264G
I/O PORT PIN CHARACTERISTICS (Cont’d)
Figure 95. Typ. VOH at VDD=3V
Figure 92. Typ. VOH at VDD=2.7V
3
3.5
2.5
3
2.5
T=25C
Voh(V)
Voh(V)
2
1.5
T=90C
1
T=25C
2
1.5
T=90C
1
T=-45C
0.5
T=-45C
0.5
0
0
0
0.5
1
1.5
0
2
1
2
Iio(mA)
Iio(mA)
Figure 96. Typ. VOH at VDD=5V
Figure 93. Typ. VOH at VDD=4V
4.5
4
6
3.5
3
5
T=25C
2.5
2
Voh(V)
Voh(V)
3
T=90C
1.5
1
T=-45C
4
T=25C
3
T=90C
2
T=-45C
1
0.5
0
0
0
1
2
3
4
5
0
1
2
3
4
5
Iio(mA)
Iio(mA)
Figure 94. Typ. VOH at VDD=2.4V
3
2.5
Voh(V)
2
T=25C
1.5
T=90C
1
T=-45C
0.5
0
0
0.5
1
1.5
2
Iio(mA)
Notes:
1. The IIO current sunk must always respect the absolute maximum rating specified in Section 13.2.2 and the sum of IIO
(I/O ports and control pins) must not exceed IVSS.
2. The IIO current sourced must always respect the absolute maximum rating specified in Section 13.2.2 and the sum of
IIO (I/O ports and control pins) must not exceed IVDD. True open drain I/O pins does not have VOH.
145/171
ST72260G, ST72262G, ST72264G
I/O PORT PIN CHARACTERISTICS (Cont’d)
Figure 97. Typical VOL vs. VDD on standard I/O port (Ports B and C)
T=25C
T=25C
0.9
T=90C
0.5
T=90C
0.8
T=-45C
VOL(V) at Iio= 5mA
VOL(V) at Iio= 2mA
1.0
0.6
T=-45C
0.4
0.3
0.2
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.1
0.0
2.5
3
3.5
4
5
5.5
0.0
6
3.5
4
Vdd (V)
5
5.5
6
Vdd (V)
Figure 98. Typical VOL vs. VDD on high sink I/O port (Port A)
0.6
1.2
T=25C
T=25C
T=90C
T=90C
0.5
1.0
T=-45C
VOL(V) at Iio= 20mA
VOL(V) at Iio= 8mA
T=-45C
0.4
0.3
0.2
0.6
0.4
0.2
0.1
0.0
0.0
2.4
3
3.5
4
Vdd (V)
146/171
0.8
5
5.5
6
3
3.5
4
5
Vdd (V)
5.5
6
ST72260G, ST72262G, ST72264G
13.9 CONTROL PIN CHARACTERISTICS
13.9.1 Asynchronous RESET Pin
TA = -40 to +85°C unless otherwise specified
Symbol
Parameter
Conditions
VIL
Input low level voltage
VIH
Input high level voltage
Vhys
Schmitt trigger voltage hysteresis1)
RON
Pull-up equivalent resistor
Unit
V
2.5
VDD=5V
V
IIO=+5mA
0.68
0.95
IIO=+2mA
0.28
0.45
40
80
VDD=5V
20
VDD=3V
tw(RSTL)out Generated reset pulse duration
85
Internal reset sources
External reset pulse hold time 4)
Filtered glitch duration
Max
0.16xVDD
Output low level voltage 2)
tg(RSTL)in
Typ
0.85xVDD
VOL
th(RSTL)in
Min
30
kΩ
µs
µs
20
5)
V
200
ns
Figure 99. Typical Application with RESET pin 6)7)8)
Recommended
if LVD is disabled
VDD
USER
EXTERNAL
RESET
CIRCUIT 5)
VDD
ST72XXX
VDD
0.01µF
4.7kΩ
RON
INTERNAL
RESET
Filter
0.01µF
PULSE
GENERATOR
WATCHDOG
LVD RESET
Required if LVD is disabled
Notes:
1. Data based on characterization results, not tested in production.
2. The IIO current sunk must always respect the absolute maximum rating specified in Section 13.2.2 and the sum of IIO
(I/O ports and control pins) must not exceed IVSS.
3. To guarantee the reset of the device, a minimum pulse has to be applied to the RESET pin. All short pulses applied on
RESET pin with a duration below th(RSTL)in can be ignored.
4. The reset network protects the device against parasitic resets.
5. The output of the external reset circuit must have an open-drain output to drive the ST7 reset pad. Otherwise the device
can be damaged when the ST7 generates an internal reset (LVD or watchdog).
6. Whatever the reset source is (internal or external), the user must ensure that the level on the RESET pin can go below
the VIL max. level specified in Section 13.9.1 . Otherwise the reset will not be taken into account internally.
7. Because the reset circuit is designed to allow the internal RESET to be output in the RESET pin, the user must ensure
that the current sunk on the RESET pin (by an external pull-up for example) is less than the absolute maximum value
specified for IINJ(RESET) in Section 13.2.2 on page 123.
147/171
ST72260G, ST72262G, ST72264G
CONTROL PIN CHARACTERISTICS (Cont’d)
Figure 100. Typical IPU on RESET pin
Ipu(uA) at Vin=Vss
250
T=25C
T=90C
200
T=-45C
150
100
50
0
2.4
3
4
5
5.5
6
Vdd (V)
13.10 TIMER PERIPHERAL CHARACTERISTICS
Subject to general operating conditions for VDD,
fOSC, and TA unless otherwise specified.
Refer to I/O port characteristics for more details on
the input/output alternate function characteristics
(output compare, input capture, external clock,
PWM output...).
13.10.1 16-Bit Timer
TA = -40 to +85°C unless otherwise specified
Symbol
Parameter
Conditions
tw(ICAP)in Input capture pulse time
tres(PWM) PWM resolution time
fCPU=8MHz
Min
Typ
Max
Unit
1
tCPU
2
tCPU
250
ns
fEXT
Timer external clock frequency
0
fCPU/4
MHz
fPWM
PWM repetition rate
0
fCPU/4
MHz
16
bit
ResPWM
148/171
PWM resolution
ST72260G, ST72262G, ST72264G
13.11 COMMUNICATION INTERFACE CHARACTERISTICS
13.11.1 SPI - Serial Peripheral Interface
Subject to general operating conditions for V DD,
fOSC, and TA unless otherwise specified.
Symbol
Refer to I/O port characteristics for more details on
the input/output alternate function characteristics
(SS, SCK, MOSI, MISO).
Parameter
Conditions
Master
fSCK
1/tc(SCK)
fCPU=8MHz
SPI clock frequency
Slave
fCPU=8MHz
Min
Max
fCPU/128
0.0625
fCPU/4
2
0
fCPU/2
4
tr(SCK)
tf(SCK)
SPI clock rise and fall time
tsu(SS)
th(SS)
SS setup time
SS hold time
Slave
Slave
120
120
SCK high and low time
Master
Slave
100
90
Data input setup time
Master
Slave
100
100
Data input hold time
Master
Slave
100
100
0
tw(SCKH)
tw(SCKL)
tsu(MI)
tsu(SI)
th(MI)
th(SI)
ta(SO)
Data output access time
Slave
Data output disable time
Slave
Data output valid time
Data output hold time
tv(MO)
th(MO)
Data output valid time
Data output hold time
MHz
see I/O port pin description
tdis(SO)
tv(SO)
th(SO)
Unit
ns
120
240
120
Slave (after enable edge)
0
Master (before capture edge)
0.25
0.25
tCPU
Figure 101. SPI Slave Timing Diagram with CPHA=0 3)
SS INPUT
SCK INPUT
tsu(SS)
tc(SCK)
th(SS)
CPHA=0
CPOL=0
CPHA=0
CPOL=1
ta(SO)
MISO OUTPUT
tw(SCKH)
tw(SCKL)
MSB OUT
see note 2
tsu(SI)
MOSI INPUT
tv(SO)
th(SO)
BIT6 OUT
tdis(SO)
tr(SCK)
tf(SCK)
LSB OUT
see
note 2
th(SI)
MSB IN
BIT1 IN
LSB IN
Notes:
1. Data based on design simulation and/or characterisation results, not tested in production.
2. When no communication is on-going the data output line of the SPI (MOSI in master mode, MISO in slave mode) has
its alternate function capability released. In this case, the pin status depends on the I/O port configuration.
3. Measurement points are done at CMOS levels: 0.3xVDD and 0.7xVDD.
149/171
ST72260G, ST72262G, ST72264G
COMMUNICATION INTERFACE CHARACTERISTICS (Cont’d)
Figure 102. SPI Slave Timing Diagram with CPHA=11)
SS INPUT
SCK INPUT
tsu(SS)
tc(SCK)
th(SS)
CPHA=0
CPOL=0
CPHA=0
CPOL=1
tw(SCKH)
tw(SCKL)
ta(SO)
MISO OUTPUT
see
note 2
tv(SO)
th(SO)
MSB OUT
HZ
tsu(SI)
BIT6 OUT
LSB OUT
see
note 2
th(SI)
MSB IN
MOSI INPUT
tdis(SO)
tr(SCK)
tf(SCK)
Figure 103. SPI Master Timing Diagram
BIT1 IN
LSB IN
1)
SS INPUT
tc(SCK)
SCK INPUT
CPHA=0
CPOL=0
CPHA=0
CPOL=1
CPHA=1
CPOL=0
CPHA=1
CPOL=1
tw(SCKH)
tw(SCKL)
tsu(MI)
MISO INPUT
MOSI OUTPUT see note 2
th(MI)
MSB IN
tv(MO)
tr(SCK)
tf(SCK)
BIT6 IN
LSB IN
th(MO)
MSB OUT
BIT6 OUT
LSB OUT
see note 2
Notes:
1. Measurement points are done at CMOS levels: 0.3xVDD and 0.7xVDD.
2. When no communication is on-going the data output line of the SPI (MOSI in master mode, MISO in slave mode) has
its alternate function capability released. In this case, the pin status depends of the I/O port configuration.
150/171
ST72260G, ST72262G, ST72264G
COMMUNICATION INTERFACE CHARACTERISTICS (Cont’d)
13.11.2 I2C - Inter IC Control Interface
Subject to general operating conditions for VDD,
fOSC, and TA unless otherwise specified.
Symbol
Refer to I/O port characteristics for more details on
the input/output alternate function characteristics
(SDAI and SCLI). The ST7 I2C interface meets the
requirements of the Standard I2C communication
protocol described in the following table.
Standard mode I2C
Parameter
Min 1)
Fast mode I2C
Max 1)
Min 1)
Max 1)
tw(SCLL)
SCL clock low time
4.7
1.3
tw(SCLH)
SCL clock high time
4.0
0.6
tsu(SDA)
SDA setup time
250
100
3)
0 2)
900 3)
µs
th(SDA)
SDA data hold time
tr(SDA)
tr(SCL)
SDA and SCL rise time
1000
20+0.1Cb
300
tf(SDA)
tf(SCL)
SDA and SCL fall time
300
20+0.1Cb
300
th(STA)
START condition hold time
4.0
0.6
tsu(STA)
Repeated START condition setup time
4.7
0.6
tsu(STO)
STOP condition setup time
4.0
0.6
0
tw(STO:STA) STOP to START condition time (bus free)
Cb
4.7
Capacitive load for each bus line
Unit
ns
µs
ns
1.3
ms
400
400
pF
Figure 104. Typical Application with I2C Bus and Timing Diagram 4)
VDD
4.7kΩ
VDD
4.7kΩ
2
I C BUS
100Ω
SDAI
100Ω
SCLI
ST72XXX
REPEATED START
START
tsu(STA)
tw(STO:STA)
START
SDA
tr(SDA)
tf(SDA)
tsu(SDA)
STOP
th(SDA)
SCL
th(STA)
tw(SCKH)
tw(SCKL)
tr(SCK)
tf(SCK)
tsu(STO)
Notes:
1. Data based on standard I2C protocol requirement, not tested in production.
2. The device must internally provide a hold time of at least 300ns for the SDA signal in order to bridge the undefined
region of the falling edge of SCL.
3. The maximum hold time of the START condition has only to be met if the interface does not stretch the low period of
SCL signal.
4. Measurement points are done at CMOS levels: 0.3xVDD and 0.7xVDD.
151/171
ST72260G, ST72262G, ST72264G
13.12 10-BIT ADC CHARACTERISTICS
TA = -40°C to 85°C, unless otherwise specified
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
fADC
ADC clock frequency
0.41)
4
MHz
VAIN
Conversion voltage range
VSS
VDD
V
CADC
Internal sample and hold capacitor
fADC=4MHz
tCONV
Conversion time
RAIN
External input impedance
CAIN
External capacitor on analog input
fAIN
Variation frequency of analog input
signal
6
pF
28
µs
112
Figure 105. RAIN max. vs f ADC with CAIN=0pF3)
kΩ
pF
Hz
Figure 106. Recommended CAIN/RAIN values4)
1000
45
40
Cain 10 nF
4 MHz
35
2 MHz
30
1 MHz
25
Cain 22 nF
100
Max. R AIN (Kohm)
Max. R AIN (Kohm)
1/fADC
see
Figure
105 and
Figure
1062)3)4)
20
15
10
Cain 47 nF
10
1
5
0
0.1
0
10
30
0.01
70
0.1
CPARASITIC (pF)
1
10
f AIN(KHz)
Figure 107. Analog Input equivalent circuit
VDD
ST72XXX
VT
0.6V
RAIN
2kΩ(max)
AINx
VAIN
CAIN
VT
0.6V
IL
±1µA
10-Bit A/D
Conversion
CADC
6pF
Notes:
1. Data based on design simulation.
2. Any added external serial resistor will downgrade the ADC accuracy (especially for resistance greater than 10kΩ). Data
based on characterization results, not tested in production.
3. CPARASITIC represents the capacitance of the PCB (dependent on soldering and PCB layout quality) plus the pad capacitance (3pF). A high CPARASITIC value will downgrade conversion accuracy. To remedy this, fADC should be reduced.
4. This graph shows that depending on the input signal variation (fAIN), CAIN can be increased for stabilization time and
decreased to allow the use of a larger serial resistor (RAIN). It is valid for all fADC frequencies ≤ 4MHz.
152/171
ST72260G, ST72262G, ST72264G
ADC CHARACTERISTICS (Cont’d)
Analog signals paths should run over the analog
ground plane and be as short as possible. Isolate
analog signals from digital signals that may
switch while the analog inputs are being sampled
by the A/D converter. Do not toggle digital outputs on the same I/O port as the A/D input being
converted.
13.12.0.1 General PCB Design Guidelines
To obtain best results, some general design and
layout rules should be followed when designing
the application PCB to shield the noise-sensitive,
analog physical interface from noise-generating
CMOS logic signals.
– Properly place components and route the signal
traces on the PCB to shield the analog inputs.
ADC Accuracy with fCPU=8 MHz, fADC=4 MHz RAIN< 10kΩ, VDD= 4.5V to 5.5V
Symbol
Parameter
|ET|
Total unadjusted
Conditions
Typ2)
error 1)
Offset
EG
Gain Error 1)
|ED|
Differential linearity error
|EL|
Integral linearity error 1)
Unit
4
error 1)
EO
Max
1)
1
-2.5/+2.5
1
-1.5/+3
1.5
3
3
5
LSB
Figure 108. ADC Accuracy Characteristics
Digital Result ADCDR
EG
1023
1022
1LSB
1021
IDEAL
V
–V
DD
SS
= --------------------------------
1024
(2)
ET
(3)
7
(1)
6
5
EO
4
(1) Example of an actual transfer curve
(2) The ideal transfer curve
(3) End point correlation line
EL
3
ED
2
ET=Total Unadjusted Error: maximum deviation
between the actual and the ideal transfer curves.
EO=Offset Error: deviation between the first actual
transition and the first ideal one.
EG=Gain Error: deviation between the last ideal
transition and the last actual one.
ED=Differential Linearity Error: maximum deviation
between actual steps and the ideal one.
EL=Integral Linearity Error: maximum deviation
between any actual transition and the end point
correlation line.
1 LSBIDEAL
1
Vin (LSBIDEAL)
0
1
VSS
2
3
4
5
6
7
1021 1022 1023 1024
VDD
Notes:
1. ADC Accuracy vs. Negative Injection Current: Injecting negative current on any of the analog input pins significantly
reduces the accuracy of the conversion being performed on another analog input.
For IINJ-=0.8mA, the typical leakage induced inside the die is 1.6µA and the effect on the ADC accuracy is a loss of 4 LSB
for each 10KΩ increase of the external analog source impedance. It is recommended to add a Schottky diode (pin to
ground) to analog pins which may potentially inject negative current. Any positive injection current within the limits specified for IINJ(PIN) and ΣIINJ(PIN) in Section 13.8 does not affect the ADC accuracy.
2. Refer to “Typical values” on page 122 for more information on typical ADC accuracy values.
153/171
ST72260G, ST72262G, ST72264G
14 PACKAGE CHARACTERISTICS
14.1 PACKAGE MECHANICAL DATA
Figure 109. 32-Pin Plastic Dual In-Line Package, Shrink 400-mil Width
Dim.
E
A1
L
E1
eA
eB
C
b
b2
e
D
inches
Typ
A
3.56
3.76 5.08 0.140 0.148 0.200
A1
0.51
0.020
A2
3.05
3.56 4.57 0.120 0.140 0.180
b
0.36
0.46 0.58 0.014 0.018 0.023
b1
0.76
1.02 1.40 0.030 0.040 0.055
C
0.20
0.25 0.36 0.008 0.010 0.014
D
27.43
E
9.91 10.41 11.05 0.390 0.410 0.435
E1
7.62
eC
A2 A
mm
Min
Max
Min
Typ
Max
28.45 1.080 1.100 1.120
8.89 9.40 0.300 0.350 0.370
e
1.78
0.070
eA
10.16
0.400
eB
12.70
0.500
eC
1.40
0.055
L
2.54
3.05 3.81 0.100 0.120 0.150
Number of Pins
32
N
Figure 110. 28-Pin Plastic Small Outline Package, 300-mil Width
Dim.
D
mm
Min
Typ
inches
Max
Min
Typ
A1
A
C
a
B
e
A
2.35
2.65 0.093
0.104
A1
0.10
0.30 0.004
0.012
B
0.33
0.51 0.013
0.020
C
0.23
0.32 0.009
0.013
D
17.70
18.10 0.697
0.713
E
7.40
E H
7.60 0.291
1.27
e
0.299
0.050
H
10.00
10.65 0.394
0.419
h
0.25
0.75 0.010
0.030
α
0°
L
0.40
8°
0°
1.27 0.016
Number of Pins
N
154/171
Max
h x 45×
L
28
8°
0.050
ST72260G, ST72262G, ST72264G
Figure 111. Low Profile Fine Pitch Ball Grid Array Package
Dim
mm
Min
inches
Typ
Max Min
1.210
1.700 0.048
A1 0.270
0.011
A
A2
1.120
Typ
Max
0.067
0.044
b
0.450 0.500 0.550 0.018 0.020 0.022
D
5.750 6.000 6.150 0.226 0.236 0.242
D1
E
E1
4.000
0.157
5.750 6.000 6.150 0.226 0.236 0.242
4.000
0.157
e
0.720 0.800 0.880 0.028 0.031 0.035
f
0.850 1.000 1.150 0.033 0.039 0.045
0.120
ddd
0.005
14.2 THERMAL CHARACTERISTICS
Symbol
Ratings
Value
RthJA
Package thermal resistance (junction to ambient)
SDIP32
SO28
LFBGA 6x6 (on multilayer PCB)
LFBGA 6x6 (on single-layer PCB)
60
75
56
72
Power dissipation 1)
500
mW
150
°C
PD
TJmax
Maximum junction temperature
2)
Unit
°C/W
Notes:
1. The power dissipation is obtained from the formula PD=PINT+PPORT where PINT is the chip internal power (IDDxVDD)
and PPORT is the port power dissipation determined by the user.
2. The average chip-junction temperature can be obtained from the formula TJ = TA + PD x RthJA.
155/171
ST72260G, ST72262G, ST72264G
14.3 SOLDERING AND GLUEABILITY INFORMATION
Recommended soldering information given only
as design guidelines in Figure 112 and Figure 113.
Recommended glue for SMD plastic packages
dedicated to molding compound with silicone:
■ Heraeus: PD945, PD955
■ Loctite: 3615, 3298
Figure 112. Recommended Wave Soldering Profile (with 37% Sn and 63% Pb)
250
150
SOLDERING
PHASE
80°C
Temp. [°C]
100
50
COOLING PHASE
(ROOM TEMPERATURE)
5 sec
200
PREHEATING
PHASE
Time [sec]
0
20
40
60
80
100
120
140
160
Figure 113. Recommended Reflow Soldering Oven Profile (MID JEDEC)
250
Tmax=235+/-5°C
for 25 sec
200
150
90 sec at 125°C
150 sec above 183°C
Temp. [°C]
100
50
ramp down natural
2°C/sec max
ramp up
2°C/sec for 50sec
Time [sec]
0
100
156/171
200
300
400
ST72260G, ST72262G, ST72264G
15 DEVICE CONFIGURATION AND ORDERING INFORMATION
Each device is available for production in user programmable versions (FLASH) as well as in factory
coded versions (ROM/FASTROM).
ST7226x devices are ROM versions. ST72P26x
devices are Factory Advanced Service Technique
ROM (FASTROM) versions: they are factory-programmed XFlash devices.
ST72F26x XFlash devices are shipped to customers with a default program memory content (FFh).
The option bytes are programmed to enable the internal RC oscillator. The ROM/FASTROM factory
coded parts contain the code supplied by the customer. This implies that FLASH devices have to be
configured by the customer using the Option Bytes
while the ROM/FASTROM devices are factoryconfigured.
0: Hardware (watchdog always enabled)
1: Software (watchdog to be enabled by software)
OPT 5:4 = VD[1:0] Voltage detection selection
These option bits enable the voltage detection
block (LVD and AVD) with a selected threshold ot
the LVD and AVD.
Configuration
LVD Off
VD1
VD0
1
1
Lowest Voltage Threshold (∼3.05V)
1
0
Medium Voltage Threshold (∼3.6V)
0
1
Highest Voltage Threshold (∼4.1V)
0
0
OPT 3:2 = SEC[1:0] Sector 0 size definition
These option bits indicate the size of sector 0 according to the following table.
15.1 OPTION BYTES
The two option bytes allow the hardware configuration of the microcontroller to be selected.
The option bytes have no address in the memory
map and can be accessed only in programming
mode (for example using a standard ST7 programming tool). The default content of the FLASH is
fixed to FFh.
In masked ROM devices, the option bytes are
fixed in hardware by the ROM code (see option
list).
Sector 0 Size
SEC1
SEC0
0.5k
0
0
1k
0
1
2
1
0
4k
1
1
OPT 1 = FMP_R Read-out protection
This option indicates if the program memory is protected against piracy See “Memory Protection” on
page 16.. The read-out protection blocks access
to the program memory in any mode except user
mode and IAP mode. Erasing the option bytes
when the FMP_R option is selected will cause the
whole memory to be erased first, and the device
can be reprogrammed. Refer to Section 4.5 and
the ST7 Flash Programming Reference Manual for
more details.
0: Read-out protection off
1: Read-out protection on
USER OPTION BYTE 0
OPT 7 = WDG HALT Watchdog reset on HALT
This option bit determines if a RESET is generated
when entering HALT mode while the Watchdog is
active.
0: No Reset generation when entering Halt mode
1: Reset generation when entering Halt mode
OPT 6 = WDG SW Hardware or software watchdog
This option bit selects the watchdog type.
USER OPTION BYTE 0
USER OPTION BYTE 1
7
0
7
0
OSC OSC
OSC
OSC
OSC
1
1
1
PLL
SEC SEC FMP FMP
WDG WDG
VD1 VD0
EXTIT CSS TYPE TYPE RNGE RNGE RNGE
HALT SW
1
0
R
W
OFF
1
0
2
1
0
Default
Value
1
1
1
1
1
1
0
0
1
1
1
0
1
157/171
ST72260G, ST72262G, ST72264G
DEVICE CONFIGURATION (Cont’d)
OPT 0 = FMP_W FLASH write protection
This option indicates if the FLASH program memory is write protected.
Warning: When this option is selected, the program memory (and the option bit itself) can never
be erased or programmed again.
0: Write protection off
1: Write protection on
USER OPTION BYTE 1
OPT 7 = EXTIT Port C External Interrupt Configuration.
This option bit allows the Port C external interrupt
mapping to be configured as ei0 or ei1.
Table 26. External Interrupt Configuration
ei0
ei1
Clock Source
OSCTYPE1 OSCTYPE0
Resonator Oscillator
0
0
Reserved
0
1
Internal RC Oscillator
1
0
External Source
1
1
OPT 3:1 = OSCRNGE[2:0] Oscillator Range selection
These option bits select the oscillator range.
EXTIT
option
bit
Typ. Freq. Range
OSC
RNGE2
OSC
RNGE1
OSC
RNGE0
VLP 32~100kHz
1
x
x
LP
1~2MHz
0
0
0
MP
2~4MHz
0
0
1
MS
4~8MHz
0
1
0
HS
8~16MHz
0
1
1
PA[7:0] Ports
PB[7:0] Ports
PC[5:0] Ports
1
PA[7:0] Ports
PC[5:0] Ports
PB[7:0] Ports
0
OPT 6 = CSS Clock Security System on/off
This option bit enables or disables the clock security system (CSS) which include the clock filter and
the backup safe oscillator.
0: CSS enabled
1: CSS disabled
Caution: The Clock Security System is not guaranteed. The features described in Section 6.4.3 on
page 26 are subject to revision.
158/171
OPT 5:4 = OSCTYPE[1:0] Oscillator Type selection
These option bits select the Oscillator Type.
OPT 0 = PLL PLL selection
This option bit selects the PLL which allows multiplication by two of the oscillator frequency. The
PLL must not be used with the internal RC oscillator. It is guaranteed only with a fOSC input frequency between 2 and 4MHz.
0: PLL x2 enabled
1: PLL x2 disabled
CAUTION: the PLL can be enabled only if the
“OSC RANGE” (OPT3:1) bits are configured to
“MP - 2~4MHz”. Otherwise, the device functionality is not guaranteed.
ST72260G, ST72262G, ST72264G
15.2 DEVICE ORDERING INFORMATION AND TRANSFER OF CUSTOMER CODE
Customer code is made up of the ROM/FASTROM contents and the list of the selected options
(if any). The ROM/FASTROM contents are to be
sent on diskette, or by electronic means, with the
S19 hexadecimal file generated by the development tool. All unused bytes must be set to FFh.
The selected options are communicated to
STMicroelectronics using the correctly completed
OPTION LIST appended.
Refer to application note AN1635 for information
on the counter listing returned by ST after code
has been transferred.
The STMicroelectronics Sales Organization will be
pleased to provide detailed information on contractual points.
Table 27. Supported Part Numbers
Part Number
Program Memory
(Bytes)
RAM
(Bytes)
Temp. Range
ST72F264G1B6
ST72F264G1M6
ST72F262G1B6
SDIP32
4K FLASH
SO28
256
-40°C +85°C
ST72F262G1M6
ST72F264G2B6
SDIP32
SO28
SDIP32
ST72F264G2M6
ST72F264G2H1
Package
SO28
8K FLASH
256
0°C +70°C
LFBGA
ST72F262G2B6
SDIP32
ST72F262G2M6
SO28
ST72F262G1B6
ST72F262G1M6
ST72F260G1B6
-40°C +85°C
4K FLASH
256
SO28
SDIP32
ST72F260G1M6
SO28
ST72P264G2B6/xxx
-40°C +85°C
ST72P264G2M6/xxx
ST72P264G2H1/xxx
SDIP32
8K FASTROM
256
0°C +70°C
SDIP32
SO28
LFBGA
ST72P262G2B6/xxx
SDIP32
ST72P262G2M6/xxx
SO28
ST72P262G1B6/xxx
ST72P262G1M6/xxx
ST72P260G1B6/xxx
-40°C +85°C
4K FASTROM
256
SO28
ST72264G2B6/xxx
ST72262G2B6/xxx
SDIP32
8K ROM
ST72260G1M6/xxx
SDIP32
-40°C +85°C
ST72262G1B6/xxx
ST72260G1B6/xxx
SO28
256
ST72262G2M6/xxx
ST72262G1M6/xxx
SO28
SDIP32
ST72P260G1M6/xxx
ST72264G2M6/xxx
SDIP32
4K ROM
256
SO28
SDIP32
SO28
SDIP32
SO28
159/171
ST72260G, ST72262G, ST72264G
TRANSFER OF CUSTOMER CODE (Cont’d)
ST72264 ROM/FASTROM MICROCONTROLLER OPTION LIST
Customer
Address
................................................................................
................................................................................
................................................................................
Contact
................................................................................
Phone No
................................................................................
Reference /ROM or FAST ROM Code*
ROM or FASTROM code is assigned by STMicroelectronics.
Code must be sent in .S19 format. .Hex extension cannot be processed.
Package/Memory:
SO28:
DIP32:
LFBGA6x6
Die Form:
Conditioning:
SO package:
Die form:
[ ] 8K (G2M)
[ ] 8K (G2B)
[ ] 8K (G2H)
[ ] 8K (as G2)
[ ] 4K (G1M)
[ ] 4K (G1B)
[ ] 4K (as G1)
[ ] Tape & Reel
[ ] Tape & Reel
[ ] Tube
[ ] Inked wafer
[ ] Sawn wafer on sticky foil
Special Marking
[ ] No
[ ] Yes “ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _” ( DIP32 15 ch, S028 13 ch, LFBGA6x6 7 ch max.)”
Authorized characters are letters, digits ‘.’, ‘-’, ‘/’ and spaces only.
Temperature Range:
Packaged form:
[ ] 0°C to + 70°C
[ ] - 10°C to + 85°C (except LFBGA)
[ ] - 40°C to + 85°C (except LFBGA)
Die form:
Watchdog Selection:
Watchdog Reset on Halt:
LVD Reset
Tested at 25°C only
[ ] Software Activation
[ ] Reset
[ ] Disabled
Sector 0 Size:
Readout Protection:
External Interrupt:
[ ] 0.5K
[ ] 1K
[ ] 2K
[ ] 4K
[ ] Disabled
[ ] Enabled
[ ] Port C mapped to ei0 interrupt vector
[ ] Port C mapped to ei1 interrupt vector
[ ] Disabled
[ ] Enabled
[ ] Resonator:
[ ] VLP: Very Low power resonator (32 to 100 kHz)
[ ] LP: Low power resonator (1 to 2 MHz)
[ ] MP: Medium power resonator (2 to 4 MHz)
[ ] MS: Medium speed resonator (4 to 8 MHz)
[ ] HS: High speed resonator (8 to 16 MHz)
1
[ ] Internal RC Network :
[ ] External Clock
[ ] Disabled
[ ] Enabled
Clock Security System:
Clock Source Selection:
1
PLL :
Comments :
[ ] Hardware Activation
[ ] No Reset
[ ] Enabled:
[ ] Highest threshold
[ ] Medium threshold
[ ] Lowest threshold
................................................................................
Supply Operating Range in the application: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Notes:
................................................................................
Signature:
................................................................................
1Use
of the PLL with the internal RC oscillator is not supported.
Important note: Not all configurations are available. See Table 27 on page 159 for the list of supported part numbers.
160/171
ST72260G, ST72262G, ST72264G
15.3 DEVELOPMENT TOOLS
STMicroelectronics offers a range of hardware
and software development tools for the ST7 microcontroller family. Full details of tools available for
the ST7 from third party manufacturers can be obtain from the STMicroelectronics Internet site:
➟ http//www.stmcu.com.
Third Party Tools
Tools from these manufacturers include C compliers, emulators and gang programmers.
ST Emulators
The emulator is delivered with everything (probes,
TEB, adapters etc.) needed to start emulating the
devices. To configure the emulator to emulate different ST7 subfamily devices, the active probe for
the ST7 EMU3 can be changed and the ST7EMU3
probe is designed for easy interchange of TEBs
(Target Emulation Board). See Table 28 for more
details.
15.3.1
Socket
and
Emulator
Adapter
Information
For information on the type of socket that is supplied with the emulator, refer to the suggested list
of sockets in Table 29 and Table 30.
Note: Before designing the board layout, it is recommended to check the overall dimensions of the
socket as they may be greater than the dimensions of the device.
For footprint and other mechanical information
about these sockets and adapters, refer to the
manufacturer’s datasheet.
Table 28. STMicroelectronics Development Tools
Supported Products
ST72F264,ST72F262,
ST72F260
Evaluation Board
ST7 Emulator
Active Probe & TEB
ST7 Programming
Board
ST7FOPTIONSEVAL
ST7MDT10-EMU3
ST7MDT10-TEB1
ST7MDT10-EPB2
Notes:
1. BGA adapter not available for ST7MDT10-EMU3.
2. ST7MDT10-EPB has no BGA socket, it can program BGA devices via ICC only.
161/171
ST72260G, ST72262G, ST72264G
15.3.2 PACKAGE/SOCKET FOOTPRINT PROPOSAL
Table 29. Suggested List of SDIP32 Socket Types
Package / Probe
SDIP32
EMU PROBE
Adaptor / Socket Reference
TEXTOOL
232-1291-00
Same
Footprint
X
Socket Type
Textool
Table 30. Suggested List of SO28 Socket Types
Package / Probe
Adaptor / Socket Reference
SO28
YAMAICHI
EMU PROBE
Adapter from SO28 to SDIP32 footprint (delivered with emulator)
IC51-0282-334-1
Table 31. Suggested LFBGA Socket Type
Package
LFBGA 6 X6
162/171
Same
Footprint
Socket Reference
ENPLAS OTB-36(144)-0.8-04
Socket Type
Clamshell
X
SMD to SDIP
ST72260G, ST72262G, ST72264G
15.4 ST7 APPLICATION NOTES
IDENTIFICATION
DESCRIPTION
EXAMPLE DRIVERS
AN 969
SCI COMMUNICATION BETWEEN ST7 AND PC
AN 970
SPI COMMUNICATION BETWEEN ST7 AND EEPROM
AN 971
I²C COMMUNICATING BETWEEN ST7 AND M24CXX EEPROM
AN 972
ST7 SOFTWARE SPI MASTER COMMUNICATION
AN 973
SCI SOFTWARE COMMUNICATION WITH A PC USING ST72251 16-BIT TIMER
AN 974
REAL TIME CLOCK WITH ST7 TIMER OUTPUT COMPARE
AN 976
DRIVING A BUZZER THROUGH ST7 TIMER PWM FUNCTION
AN 979
DRIVING AN ANALOG KEYBOARD WITH THE ST7 ADC
AN 980
ST7 KEYPAD DECODING TECHNIQUES, IMPLEMENTING WAKE-UP ON KEYSTROKE
AN1017
USING THE ST7 UNIVERSAL SERIAL BUS MICROCONTROLLER
AN1041
USING ST7 PWM SIGNAL TO GENERATE ANALOG OUTPUT (SINUSOID)
AN1042
ST7 ROUTINE FOR I²C SLAVE MODE MANAGEMENT
AN1044
MULTIPLE INTERRUPT SOURCES MANAGEMENT FOR ST7 MCUS
AN1045
ST7 S/W IMPLEMENTATION OF I²C BUS MASTER
AN1046
UART EMULATION SOFTWARE
AN1047
MANAGING RECEPTION ERRORS WITH THE ST7 SCI PERIPHERALS
AN1048
ST7 SOFTWARE LCD DRIVER
AN1078
PWM DUTY CYCLE SWITCH IMPLEMENTING TRUE 0% & 100% DUTY CYCLE
AN1082
DESCRIPTION OF THE ST72141 MOTOR CONTROL PERIPHERAL REGISTERS
AN1083
ST72141 BLDC MOTOR CONTROL SOFTWARE AND FLOWCHART EXAMPLE
AN1105
ST7 PCAN PERIPHERAL DRIVER
AN1129
PERMANENT MAGNET DC MOTOR DRIVE.
AN INTRODUCTION TO SENSORLESS BRUSHLESS DC MOTOR DRIVE APPLICATIONS
AN1130
WITH THE ST72141
AN1148
USING THE ST7263 FOR DESIGNING A USB MOUSE
AN1149
HANDLING SUSPEND MODE ON A USB MOUSE
AN1180
USING THE ST7263 KIT TO IMPLEMENT A USB GAME PAD
AN1276
BLDC MOTOR START ROUTINE FOR THE ST72141 MICROCONTROLLER
AN1321
USING THE ST72141 MOTOR CONTROL MCU IN SENSOR MODE
AN1325
USING THE ST7 USB LOW-SPEED FIRMWARE V4.X
AN1445
USING THE ST7 SPI TO EMULATE A 16-BIT SLAVE
AN1475
DEVELOPING AN ST7265X MASS STORAGE APPLICATION
AN1504
STARTING A PWM SIGNAL DIRECTLY AT HIGH LEVEL USING THE ST7 16-BIT TIMER
PRODUCT EVALUATION
AN 910
PERFORMANCE BENCHMARKING
AN 990
ST7 BENEFITS VERSUS INDUSTRY STANDARD
AN1077
OVERVIEW OF ENHANCED CAN CONTROLLERS FOR ST7 AND ST9 MCUS
AN1086
U435 CAN-DO SOLUTIONS FOR CAR MULTIPLEXING
AN1150
BENCHMARK ST72 VS PC16
AN1151
PERFORMANCE COMPARISON BETWEEN ST72254 & PC16F876
AN1278
LIN (LOCAL INTERCONNECT NETWORK) SOLUTIONS
PRODUCT MIGRATION
AN1131
MIGRATING APPLICATIONS FROM ST72511/311/214/124 TO ST72521/321/324
AN1322
MIGRATING AN APPLICATION FROM ST7263 REV.B TO ST7263B
AN1365
GUIDELINES FOR MIGRATING ST72C254 APPLICATION TO ST72F264
PRODUCT OPTIMIZATION
163/171
ST72260G, ST72262G, ST72264G
IDENTIFICATION
AN 982
AN1014
AN1015
AN1040
AN1070
AN1324
AN1477
AN1502
AN1529
DESCRIPTION
USING ST7 WITH CERAMIC RESONATOR
HOW TO MINIMIZE THE ST7 POWER CONSUMPTION
SOFTWARE TECHNIQUES FOR IMPROVING MICROCONTROLLER EMC PERFORMANCE
MONITORING THE VBUS SIGNAL FOR USB SELF-POWERED DEVICES
ST7 CHECKSUM SELF-CHECKING CAPABILITY
CALIBRATING THE RC OSCILLATOR OF THE ST7FLITE0 MCU USING THE MAINS
EMULATED DATA EEPROM WITH XFLASH MEMORY
EMULATED DATA EEPROM WITH ST7 HDFLASH MEMORY
EXTENDING THE CURRENT & VOLTAGE CAPABILITY ON THE ST7265 VDDF SUPPLY
ACCURATE TIMEBASE FOR LOW-COST ST7 APPLICATIONS WITH INTERNAL RC OSCILAN1530
LATOR
PROGRAMMING AND TOOLS
AN 978
KEY FEATURES OF THE STVD7 ST7 VISUAL DEBUG PACKAGE
AN 983
KEY FEATURES OF THE COSMIC ST7 C-COMPILER PACKAGE
AN 985
EXECUTING CODE IN ST7 RAM
AN 986
USING THE INDIRECT ADDRESSING MODE WITH ST7
AN 987
ST7 SERIAL TEST CONTROLLER PROGRAMMING
AN 988
STARTING WITH ST7 ASSEMBLY TOOL CHAIN
AN 989
GETTING STARTED WITH THE ST7 HIWARE C TOOLCHAIN
AN1039
ST7 MATH UTILITY ROUTINES
AN1064
WRITING OPTIMIZED HIWARE C LANGUAGE FOR ST7
AN1071
HALF DUPLEX USB-TO-SERIAL BRIDGE USING THE ST72611 USB MICROCONTROLLER
AN1106
TRANSLATING ASSEMBLY CODE FROM HC05 TO ST7
PROGRAMMING ST7 FLASH MICROCONTROLLERS IN REMOTE ISP MODE (IN-SITU PROAN1179
GRAMMING)
AN1446
USING THE ST72521 EMULATOR TO DEBUG A ST72324 TARGET APPLICATION
AN1478
PORTING AN ST7 PANTA PROJECT TO CODEWARRIOR IDE
AN1527
DEVELOPING A USB SMARTCARD READER WITH ST7SCR
AN1575
ON-BOARD PROGRAMMING METHODS FOR XFLASH AND HDFLASH ST7 MCUS
164/171
1
ST72260G, ST72262G, ST72264G
16 SUMMARY OF CHANGES
Description of the changes between the current release of the specification and the previous one.
Rev.
Main changes
Date
Added LFBGA package on page 1 and throughout document
Added RTC timer on page 1.
Removed External RC oscillator option on page 1 and throughout document
Added “can be reprogrammed” to “Memory Protection” on page 16 and “OPTION BYTES” on
page 157.
Added “freerunning” to description of counter in “WATCHDOG TIMER (WDG)” on page 48
Changed reset value of SCIBRR register in “Hardware Register Map” on page 11
1.6
Changed SLOW and SPEED bit table in ADC “Register Description” on page 114
April-03
Removed references to Temp. range -40 to +125°C and -40 to +105°C in“OPERATING CONDITIONS” on page 124 and throughout section.
Changed Vtpor values in “Low Voltage Detector (LVD) Thresholds” on page 125
Changed EMS and EMI values in “EMC CHARACTERISTICS” on page 136
Changed option list and added mention of FASTROM to “DEVICE CONFIGURATION AND ORDERING INFORMATION” on page 157
Added “ERRATA SHEET” on page 166
Modified description of internal RC oscillator in Section 6.2 on page 21.
Added Caution about disconnecting OSC pins in Section 6.2 on page 21
1.7
Added note on GCAL to I2C Section 11.6 on page 99.
Aug-03
Added note on ADC data register in Table 2 on page 11
Updated Errata sheet
165/171
ERRATA SHEET
ST72264 LIMITATIONS AND CORRECTIONS
17 SILICON IDENTIFICATION
This document refers to ST72F264 devices and subsets (ST72F260, ST72F262).
They are identifiable:
■
On the device package, by the last letter of the Trace code marked on the device package
■
On the box, by the last 3 digits of the Internal Sales Type printed on the box label.
Table 32. Device Identification
Trace Code marked on device
Flash Devices:
“xxxxxxxxxZ”
Internal Sales Type on box label
72F264xxxx$U2
72F264xxxx$A2
18 REFERENCE SPECIFICATION
Limitations in this document are with reference to the ST72264 Datasheet Revision 1.7 (August 2003).
19 SILICON LIMITATIONS
This section lists the known limitations of the devices referenced in Table 32.
19.1 EXECUTION OF BTJX INSTRUCTION
When testing the address $FF with the "BTJT" or "BTJF" instructions, the CPU may perform
an incorrect operation when the relative jump is negative and performs an address page
change.
To avoid this issue, including when using a C compiler, it is recommended to never use address $00FF as a variable (using the linker parameter for example).
19.2 I/O PORT B AND C CONFIGURATION
When using an external quartz crystal or ceramic resonator, the fOSC2 clock may be disturbed
because the device goes into reserved mode controlled by Port B and C.
This happens with either one of the following configurations:
Rev. 2.3
August 2003
166/171
1
ERRATA SHEET
– PB1=0, PC2=1, PB3=0 while CSS and PLL options are both disabled and PC4 is toggling
– PB1=0, PC2=1, PB3=0, PC4=1 while CSS or PLL options are enabled
This is detailed in the following table:
CSS
PLL
PB1
PC2
PB3
x
x
0
1
0
x
ON
ON
x
0
1
0
PC4
Clock Disturbance
Max. 2 clock cycles lost at each rising or
Toggling
falling edge of PC4
1
Max. 1 clock cycle lost out of every 16
As a consequence, for cycle-accurate operations, these configurations are prohibited in either
input or output mode.
Workaround:
To avoid this occurring, it is recommended to connect one of these pins to GND (PC2 or PC4)
or VDD (PB1 or PB3).
19.3 16-BIT TIMER PWM MODE
In PWM mode, the first PWM pulse is missed after writing the value FFFCh in the OC12R register.
19.4 SPI MULTIMASTER MODE
Multi master mode is not supported.
19.5 MINIMUM OPERATING VOLTAGE
The minimum VDD voltage is 2.7V.
19.6 CSS FUNCTION
The Clock Security System is not guaranteed. The features described in Section 6.4.3 are
subject to revision.
19.7 INTERNAL AND EXTERNAL RC OSCILLATOR WITH LVD
If the LVD is disabled, the internal or external RC oscillator clock source cannot be used.
In ICP mode, new flash devices must be programmed with an external clock connected to the
OSC1 pin or using a crystal or ceramic resonator. In the STVP7 programming tool software,
select the “OPTIONS DISABLED” mode.
19.8 EXTERNAL CLOCK WITH PLL
The PLL option is not supported for use with external clock source.
167/171
1
ERRATA SHEET
19.9 HALT MODE POWER CONSUMPTION WITH ADC ON
If the A/D converter is being used when Halt mode is entered, the power consumption in Halt
Mode may exceed the maximum specified in the datasheet.
Workaround
Switch off the ADC by software (ADON=0) before executing a HALT instruction.
19.10 ACTIVE HALT WAKE-UP BY EXTERNAL INTERRUPT
External interrupts are not able to wake-up the MCU from Active Halt mode. The MCU can
only exit from Active Halt mode by means of an MCC/RTC interrupt or a reset.
Workaround
Use WAIT mode if external interrupt capability is required in low power mode.
19.11 A/D CONVERTER ACCURACY FOR FIRST CONVERSION
When the ADC is enabled after being powered down (for example when waking up from
HALT, ACTIVE-HALT or setting the ADON bit in the ADCCSR register), the first conversion
(8-bit or 10-bit) accuracy does not meet the accuracy specified in the data sheet.
Workaround
In order to have the accuracy specified in the datasheet, the first conversion after a ADC
switch-on has to be ignored.
19.12 NEGATIVE INJECTION IMPACT ON ADC ACCURACY
Injecting a negative current on an analog input pins significantly reduces the accuracy of the
AD Converter. Whenever necessary, the negative injection should be prevented by the addition of a Schottky diode between the concerned I/Os and ground.
Injecting a negative current on digital input pins degrades ADC accuracy especially if performed on a pin close to ADC channel in use.
19.13 ADC CONVERSION SPURIOUS RESULTS
Spurious conversions occur with a rate lower than 50 per million. Such conversions happen
when the measured voltage is just between 2 consecutive digital values.
Workaround
A software filter should be implemented to remove erratic conversion results whenever they
may cause unwanted consequences.
168/171
1
ERRATA SHEET
19.14 FUNCTIONAL EMS
Functional EMS (Electro Magnetic Susceptibility) levels do not reach the ST standards.
Special care should be taken when designing the PCB layout and firmware (refer to application notes AN898, AN901 and AN1015) in sensitive applications (that use switches for instance). For more information refer to application note AN1637.
20 DEVICE MARKING
Figure 114. Revision Marking on Box Label and Device Marking
TYPE xxxx
Internalxxx$xx
Trace Code
LAST 2 DIGITS AFTER $
IN INTERNAL SALES TYPE
ON BOX LABEL
INDICATE SILICON REV.
LAST LETTER OF TRACE CODE
ON DEVICE INDICATES
SILICON REV.
169/171
ERRATA SHEET
21 ERRATA SHEET REVISION HISTORY
Revision
Main Changes
Date
Modified Section 19.5 "MINIMUM OPERATING VOLTAGE" on page 167
2.3
Added “16-BIT TIMER PWM MODE” on page 167
05/06/03
Added “FUNCTIONAL EMS” on page 169
2.4
170/171
Removed External RC Oscillator section
Added “CSS Function not guaranteed” section
08/07/03
ERRATA SHEET
Notes:
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
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