TRANSCOM TC1985

TC1985
PRE.1_06/21/2006
Preliminary
29 – 36 GHz 2W PA MMIC
FEATURES
PHOTO ENLARGEMENT
•
Pout: 34 dBm
•
Small Signal Gain: 11 dB
•
Bias Condition: 1300 mA @ 6 V
DESCRIPTION
The TC1985 is a two stages PHEMT high power amplifier MMIC that operates from 29 to 36 GHz. The
amplifier provides a typical 11 dB of gain and delivers 34 dBm of Pout. The MMIC is fabricated using
Transcom’s proprietary matured GaAs PHEMT process. The process features full passivation for
increased performance and reliability. All devices are 100 % DC tested to assure consistent quality. Bond
pads are gold plated for either thermocompression or thermosonic wire bonding. Backside gold plating is
compatible with standard AuSn die-attach.
ELECTRICAL SPECIFICATIONS (Ta = 25 °C)
SYMBOL
FREQ
SSG
Pout
VSWR, IN
VSWR, OUT
VDD
Vg
IDD
IDRF
DESCRIPTION
Frequency Range
Small Signal Gain
Output Power
Input VSWR
Output VSWR
Supply Voltage
Gate Voltage
Current Supply Without RF
Current Supply @ Pout
MIN
29
-0.5
TYP
11
34
2:1
2:1
6
-0.8
1300
1800
MAX
36
-1.5
UNITS
GHz
dB
dBm
Volt
Volt
mA
mA
TRANSCOM, INC., 90 Dasoong 7th Road, Tainan Science- Based Industrial Park, Hsin-She Shiang, Tainan County Taiwan, R.O.C.
Web-Site: www.transcominc.com.tw
Phone: 886-6-5050086
Fax: 886-6-5051602
P1/4
TC1985
PRE.1_06/21/2006
40
26
38
24
36
22
←Pout
34
20
32
18
30
16
28
14
Gain→
26
12
24
10
22
8
20
6
29
30
31
Gain (dB)
Output Power (dBm)
TYPICAL CHARACTERISTICS
Pout VS Freq. & Gain VS Freq.
32
33
34
35
36
Frequency (GHz)
TRANSCOM, INC., 90 Dasoong 7th Road, Tainan Science-Based Industrial Park, Hsin-She Shiang, Tainan County Taiwan, R.O.C.
Web-Site: www.transcominc.com.tw
Phone: 886-6-5050086
Fax: 886-6-5051602
P2/4
TC1985
PRE.1_06/21/2006
MECHANICAL OUTLINE
Units: micrometer (inch)
Thickness: 50.8 (0.002)
Chip Size: ± 50.8 (0.002)
TRANSCOM, INC., 90 Dasoong 7th Road, Tainan Science- Based Industrial Park, Hsin-She Shiang, Tainan County Taiwan, R.O.C.
Web-Site: www.transcominc.com.tw
Phone: 886-6-5050086
Fax: 886-6-5051602
P3/4
TC1985
PRE.1_06/21/2006
ASSEMBLY DIAGRAM
To Vd
10 mil Ag Ribbon
190pF x 4
Note:
1. Using 1mil Au wire.
2. Substrate Material : Al2O3
3. Substrate Thickness : 10 mil
RF IN
RF OUT
190pF x 4
RIB : 130 x 280 x 8 mil
To Vg
10 mil Ag Ribbon
TRANSCOM, INC., 90 Dasoong 7th Road, Tainan Science-Based Industrial Park, Hsin-She Shiang, Tainan County Taiwan, R.O.C.
Web-Site: www.transcominc.com.tw
Phone: 886-6-5050086
Fax: 886-6-5051602
P4/4