Twin Diode Module TDM300 A D Dim. Inches E Min. B F Baseplate A=Common Anode G Baseplate Common Cathode K H H C Baseplate D=Doubler L J M A B C D E F G H J K L M Max. --1.240 --3.99 BSC 1.98 BSC 0.320 --0.630 0.680 0.610 --0.182 4.600 1.260 .925 0.340 ----0.780 0.640 .100 0.192 Millimeters Min. --31.49 --101.34 BSC 50.29 BSC 8.13 --16.00 17.27 15.49 --4.62 Max. Notes 116.84 32.00 23.49 8.64 ----19.81 16.26 2.54 4.88 Dia. 5/16-18 Notes: Baseplate: Nickel plated copper. Working Peak Microsemi Repetitive Peak Reverse Voltage Catalog Number Reverse Voltage 200V TDM30002* 200V 400V TDM30004* 400V 600V TDM30006* 600V 800V TDM30008* 800V TDM30010* 1000V 1000V TDM30012* 1200V 1200V TDM30014* 1400V 1400V TDM30016* 1600V 1600V *Add Suffix A for Common Anode, D for Doubler Compact Package Glass Passivated Die 2 x 300 Amp Current Rating Simplifies Circuit Assembly Non-Isolated Baseplate VRRM 200-1600 Volts ROHS Compliant Electrical Characteristics Average forward current per pkg Average forward current per leg Maximum surge current per leg Max I2 t for fusing Max peak forward voltage per leg Max peak reverse current per leg Max peak reverse current per leg I F(AV) 600 Amps I F(AV) 300 Amps I FSM 5500 Amps I 2 t 125990 A2 s VFM 1.1 Volts I RM 10 mA I RM 75 uA T C = 130°C, half sine, R 0JC = 0.08°C/W T C = 130°C, half sine, R 0JC = 0.15°C/W 8.3 ms, half sine,T J = 175°C I FM = 300A:T J = 25°C* VRRM,T J = 150°C VRRM,T J = 25°C* *Pulse test: Pulse width 8.33 msec, Duty cycle <1% Thermal and Mechanical Characteristics Storage temp range Operating junction temp range Max thermal resistance per leg Typical thermal resistance per leg (greased) Terminal Torque Mounting Base Torque (outside holes) Mounting Base Torque (center hole) center hole must be torqued first Weight T STG TJ R OJC R OCS -55°C to 175°C -55°C to 175°C 0.15°C/W Junction to case 0.04°C/W Case to sink 60-75 inch pounds 30-40 inch pounds 8-10 inch pounds 9.3 ounces (263.7 grams) typical www.microsemi.com January, 2010 - Rev. 3 TDM300 Figure 1 Typical Forward Characteristics - Per Leg Maximum Allowable Case Temperature - C Figure 3 Forward Current Derating - Per Leg 10000 8000 6000 4000 2000 1000 800 600 175 165 155 145 135 125 115 0 25 C 200 100 80 60 40 20 10 .5 .7 .9 1.1 1.3 1.5 1.7 400 500 150 100 50 0 Junction to Case 75 C .01 25 C Reverse Voltage - Volts 1400 1800 Thermal Impedance - C/Watts .1 1000 100 200 300 400 500 10 100 Figure 5 Transient Thermal Impedance - Per Leg 150 C 600 60 200 Average Forward Current - Amperes 175 C 200 DC 120 250 0 100 0 180 300 1.9 Figure 2 Typical Reverse Characteristics - Per Leg Typical Reverse Current - mA 300 350 Instantaneous Forward Voltage - Volts .001 200 Figure 4 Maximum Forward Power Dissipation - Per Leg Maximum Power Dissipation - Watts Instantaneous Forward Current - Amperes 175 C 1 100 DC 180 Average Forward Current - Amperes 400 10 120 60 105 .21 .18 .15 .12 .09 .06 .03 0 .001 .01 .1 1 Time in Seconds www.microsemi.com January, 2010 - Rev. 3