SLVS067L − MARCH 1992 − REVISED APRIL 2005 D Fixed 1.8-V, 2.5-V, and 3.3-V Outputs D ±1% Maximum Output Voltage Tolerance at TJ = 25°C D 500-mV Maximum Dropout Voltage at 500 mA (3.3-V Option) D ±2% Output Voltage Variation Across Load D D D and Temperature Internal Overcurrent Limiting Internal Thermal-Overload Protection Internal Overvoltage Protection PW (TSSOP) PACKAGE (TOP VIEW) HEAT SINK GND INPUT HEAT SINK 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 KTP (PowerFLEXE/TO-252*) PACKAGE (TOP VIEW) OUTPUT HEAT SINK GND GND INPUT GND OUTPUT *Complies with JEDEC TO-252, variation AC HEAT SINK HEAT SINK − These terminals have an internal resistive connection to ground and should be grounded or electrically isolated. KCS (TO-220) PACKAGE (TOP VIEW) KC (TO-220) PACKAGE (TOP VIEW) GND OUTPUT GND INPUT GND OUTPUT GND INPUT description/ordering information ORDERING INFORMATION TJ VO (NOM) 1.8 V 0°C 0 C to 125 125°C C TOP-SIDE MARKING PowerFLEX/TO-252* (KTP) Reel of 3000 TLV2217-18KTPR 2217−18 TO-220 (KCS) Tube of 50 TLV2217-18KCS TLV2217−18 TO-220 (KC) Tube of 50 TLV2217-25KC TLV2217−25 PowerFLEX/TO-252* (KTP) Reel of 3000 TLV2217-25KTPR 2217−25 Tube of 70 TLV2217-25PW Reel of 2000 TLV2217-25PWR PowerFLEX/TO-252* (KTP) Reel of 3000 TLV2217-33KTPR 2217−33 TO-220 (KC) Tube of 50 TLV2217-33KC TLV2217−33 TSSOP (PW) Reel of 2000 TLV2217-33PWR 2217−33 2.5 V TSSOP (PW) 3.3 V ORDERABLE PART NUMBER PACKAGE† 2217−25 *Complies to TO-252, variation AC. † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerFLEX is a trademark of Texas Instruments. Copyright 2005, Texas Instruments Incorporated ! "#$ ! %#&'" ($) (#"! " !%$""! %$ *$ $! $+! !#$! !(( ,-) (#" %"$!!. ($! $"$!!'- "'#($ $!. '' %$$!) POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SLVS067L − MARCH 1992 − REVISED APRIL 2005 description/ordering information (continued) The TLV2217 family of low-dropout regulators offers a variety of fixed-voltage options that offer a maximum continuous input voltage of 16 V, making them more versatile than CMOS regulators. Utilizing a pnp pass element, these regulators are capable of sourcing 500 mA of current, with a specified maximum dropout of 500 mV (3.3-V and 2.5-V options), making these regulators ideal for low-voltage applications. Additionally, the TLV2217 regulators offer very tight output accuracy of ±2% across operating load and temperature ranges. Other convenient features the regulators provide are internal overcurrent limiting, thermal-overload protection, and overvoltage protection. The TLV2217 family of regulators is available in fixed voltages of 1.8 V, 2.5 V, and 3.3 V. absolute maximum ratings over operating virtual junction temperature range (unless otherwise noted)† Continuous input voltage, VI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 V Operating virtual junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. package thermal data (see Note 1) PowerFLEX/TO-252 (KTP) High K, JESD 51-5 θJP‡ 1.4°C/W TO-220 (KC/KCS) High K, JESD 51-5 3°C/W PACKAGE BOARD θJC 19°C/W θJA 28°C/W 17°C/W 19°C/W TSSOP (PW) High K, JESD 51-7 32°C/W 83°C/W ‡ For packages with exposed thermal pads, such as QFN, PowerPAD, and PowerFLEX, θJP is defined as the thermal resistance between the die junction and the bottom of the exposed pad. NOTE 1: Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability. recommended operating conditions VI IO Input voltage Output current TJ Operating virtual junction temperature range § Minimum VI is equal to 3.0 V or VO(max) + 0.6 V, whichever is greater. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MIN MAX 3.0 12 UNIT V 0 500 mA 0 125 °C SLVS067L − MARCH 1992 − REVISED APRIL 2005 electrical characteristics at VI = 4.5 V, IO = 500 mA, TJ = 25°C (unless otherwise noted) TLV2217-33 TEST CONDITIONS† PARAMETER Output voltage IO = 20 mA to 500 mA, VI = 3.8 V to 5.5 V TJ = 25°C TJ = 0°C to 125°C Input voltage regulation VI = 3.8 V to 5.5 V f = 120 Hz, Vripple = 1 VPP VI = 4.5 V Ripple rejection Output voltage regulation Output noise voltage MIN TYP MAX 3.267 3.30 3.333 3.234 5 Dropout voltage Bias current IO = 0 IO = 500 mA V 15 mV 30 mV −62 IO = 20 mA to 500 mA f = 10 Hz to 100 kHz IO = 250 mA IO = 500 mA 3.366 UNIT dB 5 µV 500 400 500 2 5 19 49 mV mA † Pulse-testing techniques are used to maintain the virtual junction temperature as close to the ambient temperature as possible. Thermal effects must be taken into account separately. All characteristics are measured with a 0.1-µF capacitor across the input and a 22-µF tantalum capacitor, with equivalent series resistance of 1.5 Ω, on the output. electrical characteristics at VI = 3.3 V, IO = 500 mA, TJ = 25°C (unless otherwise noted) Output voltage IO = 20 mA to 500 mA, Input voltage regulation VI = 3.0 V to 5.5 V f = 120 Hz, Ripple rejection Output voltage regulation Output noise voltage TLV2217-25 TEST CONDITIONS† PARAMETER VI = 3.0 V to 5.5 V TJ = 25°C TJ = 0°C to 125°C IO = 250 mA IO = 500 mA Bias current IO = 0 IO = 500 mA TYP MAX 2.475 2.5 2.525 2.45 2.55 4 Vripple = 1 VPP, VI = 4.5 V IO = 20 mA to 500 mA f = 10 Hz to 100 kHz Dropout voltage MIN V 12 mV 23 mV −62 4 UNIT dB µV 500 400 500 2 5 19 49 mV mA † Pulse-testing techniques are used to maintain the virtual junction temperature as close to the ambient temperature as possible. Thermal effects must be taken into account separately. All characteristics are measured with a 0.1-µF capacitor across the input and a 22-µF tantalum capacitor, with equivalent series resistance of 1.5 Ω, on the output. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 SLVS067L − MARCH 1992 − REVISED APRIL 2005 electrical characteristics at VI = 3.3 V, IO = 500 mA, TJ = 25°C (unless otherwise noted) TLV2217-18 TEST CONDITIONS† PARAMETER Output voltage IO = 20 mA to 500 mA, VI = 3.0 V to 5.5 V TJ = 25°C TJ = 0°C to 125°C Input voltage regulation VI = 3.0 V to 5.5 V f = 120 Hz, Vripple = 1 VPP, VI = 4.5 V Ripple rejection Output voltage regulation Output noise voltage Dropout voltage Bias current IO = 0 IO = 500 mA TYP MAX 1.782 1.8 1.818 1.764 1.836 3 IO = 20 mA to 500 mA f = 10 Hz to 100 kHz IO = 250 mA IO = 500 mA MIN V 9 mV 17 mV −62 3 UNIT dB 500 ‡ µV ‡ mV 2 5 19 49 mA † Pulse-testing techniques are used to maintain the virtual junction temperature as close to the ambient temperature as possible. Thermal effects must be taken into account separately. All characteristics are measured with a 0.1-µF capacitor across the input and a 22-µF tantalum capacitor, with equivalent series resistance of 1.5 Ω, on the output. ‡ Dropout voltage is limited by the input voltage range, with minimum VI = 3.0 V. 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SLVS067L − MARCH 1992 − REVISED APRIL 2005 COMPENSATION-CAPACITOR SELECTION INFORMATION The TLV2217 is a low-dropout regulator. This means that the capacitance loading is important to the performance of the regulator because it is a vital part of the control loop. The capacitor value and the equivalent series resistance (ESR) both affect the control loop and must be defined for the load range and the temperature range. Figures 1 and 2 can be used to establish the capacitance value and ESR range for the best regulator performance. TLV2217 ESR OF OUTPUT CAPACITOR vs LOAD CURRENT ÇÇÇ ÇÇÇ CL = 22 µF CI = 0.1 µF TJ = 25°C 2.8 2.6 2.4 Not Recommended Potential Instability 2.2 2 1.8 1.6 1.4 1.2 1 0.8 0.6 0.4 0.2 0 0.03 0.3 0.4 400 µF 0.02 200 µF 0.015 Minimum ESR Boundary 0.2 Region of Best Stability 0.025 ÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇ 0.1 Not Recommended Potential Instability Recommended Minimum ESR 1000 µF 0.035 Maximum ESR Boundary 0 ÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇ 0.04 CL ESR − Equivalent Series Resistance − Ω 3 TLV2217 STABILITY vs ESR 100 mF 0.01 0.005 0 0.5 22 µF 10 µF 0 0.5 1 1.5 Load Voltage 2.5 3 3.5 4 4.5 5 1/ESR IL − Load Current − A Applied Load Current 2 Figure 2 ∆IL ∆VL ∆VL = ESR × ∆IL Figure 1 typical application schematic TLV2217-33 INPUT OUTPUT VO = 3.3 V GND 3.8 V 0.1 µF 22 µF Figure 3 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 PACKAGE OPTION ADDENDUM www.ti.com 19-Dec-2006 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TLV2217-18KCS ACTIVE TO-220 KCS 3 50 Pb-Free (RoHS) CU SN N / A for Pkg Type TLV2217-18KCSE3 ACTIVE TO-220 KCS 3 50 Pb-Free (RoHS) CU SN N / A for Pkg Type TLV2217-18KTPR NRND PFM KTP 2 3000 TBD CU SN Level-1-220C-UNLIM TLV2217-18KTPRG3 OBSOLETE PFM KTP 2 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM TLV2217-18KVURG3 ACTIVE PFM KVU 3 2500 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR TLV2217-25KC NRND TO-220 KC 3 50 Pb-Free (RoHS) CU SN N / A for Pkg Type TLV2217-25KCE3 NRND TO-220 KC 3 50 Pb-Free (RoHS) CU SN N / A for Pkg Type TLV2217-25KCSE3 ACTIVE TO-220 KCS 3 50 Pb-Free (RoHS) CU SN N / A for Pkg Type TLV2217-25KTPR NRND PFM KTP 2 3000 TBD CU SN Level-1-220C-UNLIM TLV2217-25KTPRG3 NRND PFM KTP 2 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM TLV2217-25KVURG3 ACTIVE PFM KVU 3 2500 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR TLV2217-25PW ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPD Level-1-260C-UNLIM TLV2217-25PWE4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPD Level-1-260C-UNLIM TLV2217-25PWR ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPD Level-1-260C-UNLIM TLV2217-25PWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPD Level-1-260C-UNLIM TLV2217-33KC NRND TO-220 KC 3 50 Pb-Free (RoHS) CU SN N / A for Pkg Type TLV2217-33KCE3 NRND TO-220 KC 3 50 Pb-Free (RoHS) CU SN N / A for Pkg Type TLV2217-33KCSE3 ACTIVE TO-220 KCS 3 50 Pb-Free (RoHS) CU SN N / A for Pkg Type TBD Lead/Ball Finish MSL Peak Temp (3) TLV2217-33KTPR NRND PFM KTP 2 3000 CU SN Level-1-220C-UNLIM TLV2217-33KTPRG3 NRND PFM KTP 2 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM TLV2217-33KVURG3 ACTIVE PFM KVU 3 2500 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR TLV2217-33PWR ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPD Level-1-260C-UNLIM TLV2217-33PWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPD Level-1-260C-UNLIM TLV2217-33PWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPD Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 19-Dec-2006 a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 MECHANICAL DATA MPSF001F – JANUARY 1996 – REVISED JANUARY 2002 KTP (R-PSFM-G2) PowerFLEX PLASTIC FLANGE-MOUNT PACKAGE 0.080 (2,03) 0.070 (1,78) 0.243 (6,17) 0.233 (5,91) 0.228 (5,79) 0.218 (5,54) 0.050 (1,27) 0.040 (1,02) 0.010 (0,25) NOM 0.130 (3,30) NOM 0.215 (5,46) NOM 0.247 (6,27) 0.237 (6,02) Thermal Tab (See Note C) 0.287 (7,29) 0.277 (7,03) 0.381 (9,68) 0.371 (9,42) 0.100 (2,54) 0.090 (2,29) 0.032 (0,81) MAX Seating Plane 0.090 (2,29) 0.180 (4,57) 0.004 (0,10) 0.005 (0,13) 0.001 (0,02) 0.031 (0,79) 0.025 (0,63) 0.010 (0,25) M 0.010 (0,25) NOM Gage Plane 0.047 (1,19) 0.037 (0,94) 0.010 (0,25) 2°–ā6° 4073388/M 01/02 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. The center lead is in electrical contact with the thermal tab. Dimensions do not include mold protrusions, not to exceed 0.006 (0,15). Falls within JEDEC TO-252 variation AC. PowerFLEX is a trademark of Texas Instruments. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. 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