TLV803M, TLV803R TLV803S, TLV803Z TLV863M SBVS157B – APRIL 2011 – REVISED AUGUST 2011 www.ti.com 3-Pin Voltage Supervisors with Active-Low, Open-Drain Reset Check for Samples: TLV803M, TLV803R, TLV803S, TLV803Z, TLV863M FEATURES DESCRIPTION • • • The TLV803 family of supervisory circuits provides circuit initialization and timing supervision, primarily for DSPs and processor-based systems. 1 2 • • • • 3-Pin SOT23 Package Supply Current: 9 µA (Typical) Precision Supply Voltage Monitor: 2.5 V, 3 V, 3.3 V, 5 V Power-On Reset Generator with Fixed Delay Time of 200 ms Pin-for-Pin Compatible with MAX803 Temperature Range: –40°C to +125°C Open-Drain, RESET Output The TLV803 and TLV863 are functionally equivalent. The TLV863 provides an alternate pinout of the TLV803. APPLICATIONS • • • • • • • • DSPs, Microcontrollers, and Microprocessors Wireless Communication Systems Portable/Battery-Powered Equipment Programmable Controls Intelligent Instruments Industrial Equipment Notebook and Desktop Computers Automotive Systems DEVICE FAMILY COMPARISON DEVICE FUNCTION TLV803 Open-Drain, RESET Output TLV809 Push-Pull, RESET Output TLV810 Push-Pull, RESET Output During power-on, RESET asserts when the supply voltage (VDD) becomes greater than 1.1 V. Thereafter, the supervisory circuit monitors VDD and keeps RESET active as long as VDD remains below the threshold voltage VIT. An internal timer delays the return of the output to the inactive state (high) to ensure proper system reset. The delay time (td(typ) = 200 ms) starts after VDD has risen above the threshold voltage, VIT. When the supply voltage drops below the VIT threshold voltage, the output becomes active (low) again. All the devices in this family have a fixed sense-threshold voltage (VIT) set by an internal voltage divider. The product spectrum is designed for supply voltages of 2.5 V, 3 V, 3.3 V, and 5 V. The circuits are available in a 3-pin SOT-23 package. The TLV803 devices are characterized for operation over a temperature range of –40°C to +125°C. TYPICAL APPLICATION 3.3-V LDO 3.3 V GND TLV803 TLV863 DBZ Package (Top View) DBZ Package (Top View) 1 RESET 5V OUT IN GND 1 VDD VDD DSP/FPGA/ASIC TLV803S 3 VDD 3 GND RESET RESET 2 VDD 2 RESET GND GND 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2011, Texas Instruments Incorporated TLV803M, TLV803R TLV803S, TLV803Z TLV863M SBVS157B – APRIL 2011 – REVISED AUGUST 2011 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE/ORDERING INFORMATION (1) PRODUCT THRESHOLD VOLTAGE PACKAGELEAD PACKAGE DESIGNATOR SPECIFIED OPERATING TEMPERATURE PACKAGE MARKING TLV803Z 2.25 V SOT23-3 DBZ –40°C TO +125°C VORQ TLV803R TLV803S TLV803M TLV863M (1) 2.64 V SOT23-3 2.93 V SOT23-3 4.38 V SOT23-3 4.38 V SOT23-3 –40°C TO +125°C DBZ –40°C TO +125°C DBZ –40°C TO +125°C DBZ –40°C TO +125°C DBZ VOSQ VOTQ VOUQ VTWM ORDERING INFORMATION TRANSPORT MEDIA, QUANTITY TLV803ZDBZR Tape and Reel, 3000 TLV803ZDBZT Tape and Reel, 250 TLV803RDBZR Tape and Reel, 3000 TLV803RDBZT Tape and Reel, 250 TLV803SDBZR Tape and Reel, 3000 TLV803SDBZT Tape and Reel, 250 TLV803MDBZR Tape and Reel, 3000 TLV803MDBZT Tape and Reel, 250 TLV863MDBZR Tape and Reel, 3000 TLV863MDBZT Tape and Reel, 250 For the most current package and ordering information, see the Package Option Addendum at the end of this data sheet, or visit the device product folder at www.ti.com. ABSOLUTE MAXIMUM RATINGS (1) Over operating free-air temperature range (unless otherwise noted) . VALUE Voltage VDD (2) All other pins (2) MIN MAX 0 7 –0.3 7 V 5 mA Maximum low output current, IOL Current Temperature (2) V –5 mA Input clamp current, IIK (VI < 0 or VI > VDD) ±20 mA Output clamp current, IOK (VO < 0 or VO > VDD) ±20 mA Maximum high output current, IOH Operating free-air temperature range, TA –40 +125 °C Storage temperature range, Tstg –65 +150 °C +260 °C Soldering temperature (1) UNIT Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values are with respect to GND. For reliable operation the device should not be operated at 7 V for more than t = 1000h continuously THERMAL INFORMATION TLV803/TLV863 THERMAL METRIC (1) DBZ UNITS 3 PINS θJA Junction-to-ambient thermal resistance 286.9 θJCtop Junction-to-case (top) thermal resistance 105.6 θJB Junction-to-board thermal resistance 124.4 ψJT Junction-to-top characterization parameter 25.8 ψJB Junction-to-board characterization parameter 107.9 θJCbot Junction-to-case (bottom) thermal resistance — (1) 2 °C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Copyright © 2011, Texas Instruments Incorporated TLV803M, TLV803R TLV803S, TLV803Z TLV863M SBVS157B – APRIL 2011 – REVISED AUGUST 2011 www.ti.com RECOMMENDED OPERATING CONDITIONS At specified temperature range (unless otherwise noted). MIN MAX UNIT VDD Supply voltage 1.1 6 V TA Operating free-air temperature range –40 +125 °C ELECTRICAL CHARACTERISTICS Over recommended operating free-air temperature range (unless otherwise noted). PARAMETER VOL TEST CONDITIONS Low-level output voltage Power-up reset voltage (1) MIN Negative-going input threshold voltage (2) 0.2 VDD = 3.3 V, IOL = 2 mA 0.4 VDD = 6 V, IOL = 4 mA 0.4 IOL = 50 µA, VOL < 0.2 V TA = – 40°C to 125°C TLV803M TLV863M 2.25 2.30 2.58 2.64 2.70 2.87 2.93 2.99 4.28 4.38 4.48 35 TA = +25°C, IOL = 50 µA TLV803S Supply current IOH Output leakage current (1) (2) mV 40 TLV803M TLV863M IDD V 30 TLV803R Hysteresis V V 2.20 TLV803Z Vhys UNIT 1.1 TLV803R TLV803S MAX VDD = 2 V to 6 V, IOL = 500 µA TLV803Z VIT– TYP 60 VDD = 2 V, output unconnected 9 15 VDD = 6 V, output unconnected 20 30 VDD = 6 V µA 100 nA The lowest supply voltage at which RESET becomes valid. tr, VDD ≤ 66.7 V/ms. To ensure best stability of the threshold voltage, a bypass capacitor (0.1-µF ceramic) should be placed near the supply terminals. SWITCHING CHARACTERISTICS At TA = +25°C, unless otherwise noted. PARAMETER TEST CONDITIONS tw Pulse duration at VDD VDD = 1.08 VIT– to 0.92 VIT– td Delay time VDD ≥ VIT– + 0.2 V; see Timing Diagram MIN TYP MAX UNIT 280 ms µs 1 120 200 TIMING DIAGRAM VDD VIT- 1.1 V t RESET 1 0 td td t For VDD < 1.1 V Undefined Behavior of RESET Output Copyright © 2011, Texas Instruments Incorporated 3 TLV803M, TLV803R TLV803S, TLV803Z TLV863M SBVS157B – APRIL 2011 – REVISED AUGUST 2011 www.ti.com FUNCTIONAL BLOCK DIAGRAM TLV803 TLV863 R1 _ VDD + R2 Reset Logic + Timer RESET GND Reference Voltage of 1.137 V 4 Oscillator Copyright © 2011, Texas Instruments Incorporated TLV803M, TLV803R TLV803S, TLV803Z TLV863M SBVS157B – APRIL 2011 – REVISED AUGUST 2011 www.ti.com TYPICAL CHARACTERISTICS At TA = +25°C, VIT– = 4.38 V, and VDD = 5.0 V, unless otherwise noted. LOW-LEVEL OUTPUT VOLTAGE vs LOW-LEVEL OUTPUT CURRENT SUPPLY CURRENT vs SUPPLY VOLTAGE 1.2 25 +125°C +85°C +25°C 0°C -40°C 1 20 IDD (mA) VOL (V) 0.8 +125°C +85°C +25°C 0°C -40°C 0.6 15 10 0.4 5 0.2 VDD = 2.5 V 0 0 0 1 2 3 4 5 0 1 2 3 VDD (V) IOL (mA) Figure 2. NORMALIZED TO +25°C NEGATIVE-GOING INPUT THRESHOLD VOLTAGE vs TEMPERATURE MINIMUM PULSE DURATION AT VDD vs OVERDRIVE VOLTAGE 6 Minimum Pulse Duration at VDD (ms) 1.6 1 0.999 0.998 0.997 0.996 0.995 0.994 1.4 1.2 1 0.8 0.6 +125°C +85°C +25°C 0°C -40°C 0.4 0.2 0 -40 -25 -10 5 20 35 50 65 Temperature (°C) 80 95 110 125 0 0.5 1 1.5 (VIT-) - VDD (V) 2 2.5 Figure 3. Figure 4. DELAY TIME vs TEMPERATURE POWER-UP LOW-LEVEL OUTPUT VOLTAGE vs SUPPLY VOLTAGE 0.8 220 RESET Pulled Up to VDD with 22.1-kW Resistor TLV803M 0.7 TLV803Z 210 +125°C +85°C +25°C 0°C -40°C 0.6 200 0.5 VOL (V) td (ms) 5 Figure 1. 1.001 Normalized VIT- (V) 4 190 0.4 0.3 180 0.2 170 0.1 0 160 -40 -25 -10 5 20 35 50 65 Temperature (°C) Figure 5. Copyright © 2011, Texas Instruments Incorporated 80 95 110 125 0 0.25 0.5 0.75 VDD (V) 1 1.25 1.5 Figure 6. 5 TLV803M, TLV803R TLV803S, TLV803Z TLV863M SBVS157B – APRIL 2011 – REVISED AUGUST 2011 www.ti.com APPLICATION INFORMATION VDD TRANSIENT REJECTION The TLV803 has built-in rejection of fast transients on the VDD pin. The rejection of transients depends on both the duration and the amplitude of the transient. The amplitude of the transient is measured from the bottom of the transient to the negative threshold voltage of the TLV803, as shown in Figure 7. VDD VITTransient Amplitude tw Duration Figure 7. Voltage Transient Measurement The TLV803 does not respond to transients that are fast duration/low amplitude or long duration/small amplitude. Figure 4 shows the relationship between the transient amplitude and duration needed to trigger a reset. Any combination of duration and amplitude above the curve generates a reset signal. RESET DURING POWER UP/DOWN The TLV803 output is valid when VDD is greater than 1.1 V. When VDD is less than 1.1 V, the output transistor turns off and becomes high impedance. The voltage on the RESET pin rises to the voltage level connected to the pull-up resistor. Figure 8 shows a typical waveform for power-up, assuming the RESET pin has a pull-up resistor connected to the VDD pin. VIT- + VHYS VDD 1.1 V td RESET Valid Output Figure 8. Power-Up Response 6 Copyright © 2011, Texas Instruments Incorporated TLV803M, TLV803R TLV803S, TLV803Z TLV863M SBVS157B – APRIL 2011 – REVISED AUGUST 2011 www.ti.com MONITORING MULTIPLE SUPPLIES Because the TLV803 has an open-drain output, multiple TLV803 outputs can be directly tied together to form a logical OR-ing function for the RESET line. Only one pull-up resistor is required for this configuration. Figure 9 shows two TLV803s connected together to provide monitoring of a 3.3-V power rail and a 5.0-V power rail. A reset is generated if either power rail falls below the threshold voltage of its corresponding TLV803. 5.0 V 3.3 V 0.1 mF VDD 100 kW VIO VCORE Microprocessor TLV803M RESET RST GND 3.3 V 0.1 mF VDD TLV803S RESET GND Figure 9. Multiple Voltage Rail Monitoring BIDIRECTIONAL RESET PINS Some microcontrollers have bidirectional reset pins that act as both inputs and outputs. In a situation where the TLV803 is pulling the RESET line low while the microcontroller is trying the force the RESET line high, a series resistor should be placed between the output of the TLV803 and the RESET pin of the microcontroller to protect against excessive current flow. Figure 10 shows the connection of the TLV803 to a microcontroller using a series resistor to drive a bidirectional RESET line. 3.3 V VCC VDD TLV803S 100 kW RESET Microprocessor 47 kW RST GND Figure 10. Connection to Bidirectional Reset Pin Copyright © 2011, Texas Instruments Incorporated 7 TLV803M, TLV803R TLV803S, TLV803Z TLV863M SBVS157B – APRIL 2011 – REVISED AUGUST 2011 www.ti.com OUTPUT LEVEL SHIFTING The RESET output of the TLV803 can be pulled to a maximum voltage of 6 V and can be pulled higher in voltage than VDD. It is useful to provide level shifting of the output for cases where the monitored voltage is less than the useful logic levels of the load. Figure 11 shows the TLV803Z used to monitor a 2.5-V power rail, with a logic RESET input to a microprocessor that is connected to 5.0 V and has 5.0-V logic levels. 2.5 V 5.0 V 0.1 mF VDD TLV803Z RESET 10 kW Microprocessor RST GND Figure 11. Output Voltage Level Shifting 8 Copyright © 2011, Texas Instruments Incorporated TLV803M, TLV803R TLV803S, TLV803Z TLV863M SBVS157B – APRIL 2011 – REVISED AUGUST 2011 www.ti.com REVISION HISTORY NOTE: Page numbers for previous revisions may differ from page numbers in this version. Changes from Revision A (June 2011) to Revision B Page • Added TLV863 pinout to front page ...................................................................................................................................... 1 • Added new paragraph regarding TLV863 to Description section ......................................................................................... 1 • Added TLV863M to Package/Ordering Information .............................................................................................................. 2 • Added TLV863 to Thermal Information ................................................................................................................................. 2 • Added TLV863M to Negative-Going Input Threshold Voltage parameter ............................................................................ 3 • Added TLV863M to Hysteresis parameter ............................................................................................................................ 3 • Added TLV863 to Functional Block Diagram ........................................................................................................................ 4 Copyright © 2011, Texas Instruments Incorporated 9 PACKAGE OPTION ADDENDUM www.ti.com 7-Oct-2011 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp TLV803MDBZR ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV803MDBZT ACTIVE SOT-23 DBZ 3 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV803RDBZR ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV803RDBZT ACTIVE SOT-23 DBZ 3 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV803SDBZR ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV803SDBZT ACTIVE SOT-23 DBZ 3 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV803ZDBZR ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV803ZDBZT ACTIVE SOT-23 DBZ 3 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV863MDBZR ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV863MDBZT ACTIVE SOT-23 DBZ 3 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (3) Samples (Requires Login) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 7-Oct-2011 Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 6-Oct-2011 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) TLV803MDBZR SOT-23 DBZ 3 3000 179.0 8.4 TLV803MDBZT SOT-23 DBZ 3 250 179.0 TLV803RDBZR SOT-23 DBZ 3 3000 179.0 TLV803RDBZT SOT-23 DBZ 3 250 TLV803SDBZR SOT-23 DBZ 3 W Pin1 (mm) Quadrant 3.15 2.95 1.22 4.0 8.0 Q3 8.4 3.15 2.95 1.22 4.0 8.0 Q3 8.4 3.15 2.95 1.22 4.0 8.0 Q3 179.0 8.4 3.15 2.95 1.22 4.0 8.0 Q3 3000 179.0 8.4 3.15 2.95 1.22 4.0 8.0 Q3 TLV803SDBZT SOT-23 DBZ 3 250 179.0 8.4 3.15 2.95 1.22 4.0 8.0 Q3 TLV803ZDBZR SOT-23 DBZ 3 3000 179.0 8.4 3.15 2.95 1.22 4.0 8.0 Q3 TLV803ZDBZT SOT-23 DBZ 3 250 179.0 8.4 3.15 2.95 1.22 4.0 8.0 Q3 TLV863MDBZR SOT-23 DBZ 3 3000 179.0 8.4 3.15 2.95 1.22 4.0 8.0 Q3 TLV863MDBZT SOT-23 DBZ 3 250 179.0 8.4 3.15 2.95 1.22 4.0 8.0 Q3 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 6-Oct-2011 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TLV803MDBZR SOT-23 DBZ 3 3000 203.0 203.0 35.0 TLV803MDBZT SOT-23 DBZ 3 250 203.0 203.0 35.0 TLV803RDBZR SOT-23 DBZ 3 3000 203.0 203.0 35.0 TLV803RDBZT SOT-23 DBZ 3 250 203.0 203.0 35.0 TLV803SDBZR SOT-23 DBZ 3 3000 203.0 203.0 35.0 TLV803SDBZT SOT-23 DBZ 3 250 203.0 203.0 35.0 TLV803ZDBZR SOT-23 DBZ 3 3000 203.0 203.0 35.0 TLV803ZDBZT SOT-23 DBZ 3 250 203.0 203.0 35.0 TLV863MDBZR SOT-23 DBZ 3 3000 203.0 203.0 35.0 TLV863MDBZT SOT-23 DBZ 3 250 203.0 203.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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