Metal Element Current Sense Resistor ULR Series • • • • • • Robust metal strip able to withstand high temperature and high current. Low TCR and Inductance Resistance Range from 0.5 mΩ to 20 mΩ Power ratings from 1W to 3W in 1206, 2010 and 2512 chip size Designed for current sense circuits in power electronic systems Higher wattage devices feature PCB clearance gap to maximize thermal performance Electrical Data IRC Type Coating1 Power rating at 80°C (Watts) Standard Resistance Values (mΩ)2 TCR Tolerance Dielectric (±ppm/°C) (±%) Withstanding Voltage (Volts) 1206 Chip Size ULRG1 Green 1 1, 2, 3, 5, 7, 10 50 1, 5 100 1.5 1, 2, 3, 5, 7, 10 50 1, 5 100 1, 5 200 2010 Chip Size ULRG15 Green 2512 Chip Size ULRG1 1 11 - 20 50 ULRG2 2 7 - 10 50 2.5 4-6 50 0.5 - 0.75 100 1-3 50 ULRG25 Green ULRG3 3 2.5 - 3 150 ULRB1 1 4-5 100 6-7 75 2 0.5 - 2 50 Black ULRB2 Notes: 1.Black coating = wave or IR reflow soldering; Green coating = IR reflow solder. Wave reflow - solder mask must match the W and D dimensions on page 2 of data sheet. 2Non-standard resistance values available (contact factory). For resistance values above 20 mΩ, please refer to our LRC / LRF series. 3 Package sizes 2010 and 1206 with the green coating are uncoated on the top surface and unmarked for resistance value. Environmental Data Test Short Term Overload (5x rated power for 5 seconds) ∆R/R ≤ ± 0.5% + 0.5 mΩ (black); ∆R/R ≤ ± 1% (green) Load at rated power (1000 hours cyclic load @ 70°C) ∆R/R ≤ ± 1% + 0.5 mΩ (black); ∆R/R ≤ ± 1% (green) Temperatature Cycling (-55°C to +150°C; 1000 cycles) ∆R/R ≤ ± 0.5% + 0.5 mΩ (black); ∆R/R ≤ ± 1% (green) Dry Heat (+170°C, no load; 1000 hours) ∆R/R ≤ ± 1% + 0.5 mΩ (black); ∆R/R ≤ ± 1% (green) Resistance to Solder Heat (260°C for 10 seconds) ∆R/R ≤ ± 0.5% + 0.5 mΩ (black); ∆R/R ≤ ± 1% (green) Solderability (235°C for 2 seconds) Minimum 95% coverage Resistance to Solvents No deterioration of protective coating or marking Operating Temperature -55°C to 170°C General Note IRC reserves the right to make changes in product specification without notice or liability. All information is subject to IRC’s own data and is considered accurate at time of going to print. Wire and Film Technologies Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com A Subsidiary of TT electronics plc ULR Issue July 2009 Sheet 1 of 6 Physical Data D L T W Coating Resistance Value (mΩ) 1206 Chip Size Green 2010 Chip Size Green 2512 Chip Size Green L W T D 3.2 ± 0.25 1.6 ± 0.10 0.6 ± 0.2 0.98 ± 0.38 5.08 ± 0.25 2.54 ± 0.15 0.6 ± 0.2 1.67 ± 0.63 (1 Watt) 1 - 10 (1.5 Watt) 1 - 10 (1 Watt, 2 Watt, 2.5 Watt, and 3 Watt) 0.5 2.68 ± 0.25 0.75 2.48 ± 0.25 1 - 1.5 1.43 ± 0.25 2-3 4 6.35 ± 0.25 3.0 ± 0.2 1.18 ± 0.25 0.6 ± 0.2 2.18 ± 0.25 5-6 1.93 ± 0.25 7 1.43 ± 0.25 8 - 20 Black 1.18 ± 0.25 1 0.5 1.4 ± 0.2 0.75 1.0 ± 0.2 1 1 0.8 ± 0.2 1 1.5 0.65 ± 0.2 1 2 6.35 ± 0.25 2.5 3.18 ± 0.25 0.5 ± 0.2 1 0.85 ± 0.2 1.43 ± 0.38 1 3 0.7 ± 0.2 1 4 0.6 ± 0.2 1 5-7 0.5 ± 0.2 1 Note: 1 Dimensions are for reference only Wire and Film Technologies Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com ULR Issue July 2009 Sheet 2 of 6 Electrical Connections 4-wire pad layout 2512 2-wire pad layout a 2512 4-wire measurement points a 2512 5.4 1.2 L 1.0 1.5 3.45 0.5 Probe dia. L unit: mm unit: mm 4-wire pad layout 2010 unit: mm 2-wire pad layout a L unit: mm 1.2 2.9 1206 2-wire pad layout a 0.5 Probe dia. unit: mm unit: mm 4-wire pad layout 1206 4-wire measurement points a 0.7 unit: mm 1.9 2512 - Black 2512 - Green Resistance (m-ohm) All 1.25 0.5 Probe dia. unit: mm unit: mm Package 1206 2.6 L L 2010 4.32 L 0.5 4-wire measurement points a 1.05 0.8 2010 Package Resistance (m-ohm) a L a L 1.85 2.9 1 2.04 1.2 0.5 2.78 0.9 2 1.74 1.8 0.75 2.58 1.3 3 1.24 2.8 1 - 1.5 1.53 3.4 4-5 2.04 1.2 2-3 1.28 3.9 6-8 1.74 1.8 4 2.28 1.9 9 - 10 1.49 2.3 2010 5-6 2.03 2.4 1 1.3 0.8 7 1.53 3.4 2-3 0.8 1.8 8 - 20 1.28 3.9 4-6 1.3 0.8 7-9 1.1 1.2 10 0.8 1.8 1206 Note: 1 Green parts require the use of “D” dimensions on page 2 for parts being assembled in a wave reflow processes. Wire and Film Technologies Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com ULR Issue July 2009 Sheet 3 of 6 Construction Black Type Green Type A low TCR resistance alloy plate with plated connection bands is protectively coated and numerically marked with the resistance value, as described in Product Marking. This version has standard plated connection and is suitable for wave or IR reflow soldering processes. A low TCR alloy plate is grooved to set the final resistance. The lower faces are solder plated for connections, and the top surface is protectively coated and numerically marked with the resistance value, as described in Product Marking. This part is suitable for wave and IR reflow soldering processes. Wave reflow requires the solder mask to be dimensioned according to page 2 using the W and D dimensions of the part. Power Derating Curve Rated Power (%) Note: The power derating curve is a guidance based on a conservative design model. The ULR is a solid metal alloy construction that can withstand significantly greater operating temperatures than the conservative model permits. The protective coating will operate up to 260°C and the alloy can withstand in exess of 350°C. Therefore, the system thermal design will be a more significant design parameter due to the heat limitations of the solder joint. 100 50 0 0 170 85 Ambient Temperature (°C) Plastic Tape Specification Top Tape ψD 0 E A F B T P1 Resistor P2 P0 W ψD direction of unreeling 1 1.4Min. Emboss Tape Size Resistance (mΩ) 0.5 - 7 2512 0.5 - 20 A 3.4±0.1 B 6.73±0.1 6.75±0.1 W E F P0 P1 P2 Φ D0 12±0.1 1.75±0.1 5.5±0.05 4±0.1 4±0.1 2±0.05 T 1.5+0.1, -0 0.81±0.1 1.5+0.1, -0 0.80±0.1 2010 1 - 10 2.85±0.1 5.55±0.1 12±0.1 1.75±0.1 5.5±0.05 4±0.1 4±0.1 2±0.05 1.55±0.05 0.85±0.1 1206 1 - 10 1.9±0.1 3.6±0.1 8±0.2 1.75±0.1 3.5±0.05 4±0.1 4±0.1 2±0.05 1.55±0.05 0.87±0.1 Note: 1. 2. 3. 4. 5. The cumulative tolerance of 10 sprocket hole pitch is ± 0.2 mm. Carrier camber shall not be more than 1 mm per 100 mm through a length of 250 mm. A & B measured 0.3 mm from the bottom of the packet. T measured at a point on the inside bottom of the packet to the top surface of the carrier. Pocket position relative to sprocket hole is measured as the true position of the pocket and not the pocket hole. Wire and Film Technologies Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com ULR Issue July 2009 Sheet 4 of 6 IRC Solder Reflow Recommendations Sn-Pb Eutectic and Pb-Free Reflow Profiles tP TP Ramp-up Critical Zone TL to TP TL tL Temperature Tsmax Tsmin ts Preheat 25 Ramp-down t 25°C to Peak Time * Based on Industry Standards and IPC recommendations Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly 3°C / second max. 3°C / second max. Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (Tsmin to Tsmax) (ts) 100°C 150°C 60 -120 seconds 150°C 200°C 60 -180 seconds Time maintained above - Temperature (TL) - Time (tL) 183°C 60 - 150 seconds 217°C 60 - 150 seconds Peak Temperature (TP) See Table 1 See Table 2 10 - 30 seconds 20 - 40 seconds 6°C / second max. 6°C / second max. 6 minutes max. 8 minutes max. Average Ramp-up rate (Tsmax to Tp) Time within 5°C of actual Peak Temperature (tp)2 Ramp-down Rate Time 25°C to Peak Temperature Note 1: All temperatures refer to topside of the package, measured on the package body surface. Note 2: Time within 5 °C of actual peak temperature (tp) specified for the reflow profiles is a “supplier” minimum and a “user” maximum. Note 1: Package volume excludes external terminals (balls, bumps, lands, leads) and/or non-integral heat sinks. Tabel 1: SnPb Eutectic Process Package Peak Reflow Temperatures Package Thickness Volume mm3 < 350 Volume mm3 ≥ 350 < 2.5 mm 240 +0/-5°C 225 +0/-5°C ≥ 2.5 mm 225 +0/-5°C 225 +0/-5°C Tabel 2: Pb-free Process Package Peak Reflow Temperatures Package Thickness Volume mm3 < 350 Volume mm3 350 - 2000 Volume mm3 > 2000 < 1.6 mm 260°C * 260°C * 260°C * 1.6 mm - 2.5 mm 260°C * 250°C * 245°C * ≥ 2.5 mm 250°C * 245°C * 245°C * Note 2: The maximum component temperature reached during reflow depends on package thickness and volume. The use of convection reflow processess reduces the thermal gradients between packages. However, thermal gradients due to differences in thermal mass of SMD packages may still exist. Note 3: Components intended for use in “leadfree” assembly process shall be evaluated using the “lead-free” peak temperature and profiles defined in Table 1, 2 and reflow profile whether or not lead-free. * Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature at the rated MSL level. Wire and Film Technologies Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com ULR Issue July 2009 Sheet 5 of 6 Packaging Quantity Series Emboss Plastic Tape 2512 2010 1206 2,000 2,000 2,000 Ordering Data Specify type, resistance, tolerance, ROHS compliance and packaging. Example: Metal Element Current Sense Resistor, 1-watt, 10 mΩ resistor. Sample Part No. ULR G 1 2512 R010 F LF SLT IRC Type Coating Color Code G = Green, B = Black Power Rating (see specs table) Package Size Resistance Value (EIA 4-digit code) Example: 0.010 = R010 Tolerance (EIA format) F = 1% J = 5% RoHS - Compliance LF = RoHS compliant Construction Packaging SLT = Standard Lead Tape Product Marking Part resistance is indicated by using two marking notation syles: • 4-digit: R002 = 2 mΩ; R designates the decimal location in ohms. • 3-digit: 1M5 = 1.5 mΩ; M designates the decimal location in milliohm. Wire and Film Technologies Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com ULR Issue July 2009 Sheet 6 of 6