Customer Specific Product Data Sheet VTB4-1000-20M000 CMOS TCXO Pin Information Table 1. Pin Function Pin Symbol 1 7 8 14 Function NC GND Output No Connect Case Ground CMOS Output waveform Power Supply Voltage (3.3 V ± 5%) V DD Performance Characteristics Table 2. Electrical Performance Parameter Symbol Minimum Typical Maximum Units f0 - 20.000 - MHz Supply Voltage V DD 3.14 3.3 3.47 V Operating Temperature Range TOP 0 +70 °C Storage Temperature Tstor -40 +85 °C Supply Current IDD 20 mA Output Voltage Levels (from V DD) High Low V OH V OL Output Current Levels High IOH Nominal Output Frequency 1 2.2 V 0.40 mA Low -4.0 IOL Output Rise/Fall Time 2 +4.0 tR/tF 3 Output Duty Cycle or Symmetry Stability over operating temperature/initial tolerance/ 15 years aging/ power supply and load variation 5 ns D 40 60 % deltaf/f O -4.6 +4.6 ppm Jitter, 10Hz to 20MHz, RMS 2 5 pS Jitter, 12kHz to 20MHz, RMS 0.5 1 pS Phase Noise dBc/Hz 10 Hz -70 100 Hz -100 1kHz -125 10kHz -135 100kHz -140 Start Up Time 10 Tsu 1. A 0.1 µF low frequency ceramic bypass capacitor in parallel with a 0.01 µF high frequency ceramic capacitor is recommended. 2. Figure 1 defines these parameters. Figure 2 illustrates the operating conditions. 3. Duty cycle is defined as (on time/period) per Figure 1. 4. Measured using a Wavecrest DTS2075 or equivalent. Vectron International •267 Lowell Rd, Hudson, NH 03051 • Tel: 1-88-VECTRON-1• http://www.vectron.com 1/3 mS VTB4-1000 tR ID D tF 4 VO H 50% V DD + - . 1µF . 0 1µF V OL 1 2 3 1 5pF On Time Period Figure 1. Output Waveform Figure 2. Output Test Conditions (25±5°C) Recommended Reflow Profile: This oscillator contains a quartz crystal which is susceptible to damage if handled roughly or dropped. Transportation and handling should be carefully performed. ESD precautions should be taken. When stored, units should be kept in conductive containers and only handled at properly grounded workstations by operators using proper ESD procedures. We recommend hand placing and hand soldering units into a PCB. The soldering tip and temperature should be appropriate for 60/40 type solder. Once installed and inspected a non-aqueous board wash is recommended. If cleaning is required then a manual brush cleaning with an appropriate solvent is recommended. Care should be given to prevent mechanical shock to the unit. If not hand placed then we recommend the following solder profile: Figure 4 IR Reflow Diagram VTB4-1000 13.7 +/- 0.3 mm 5.0 mm max 11.5+/-0.3 mm 1.73+/-0.2 mm 1.73 +/-0.2 mm 20.3 +/- 0.3 mm Figure 4. Outline Diagram Figure 5. Suggested Pad Layout VTB4-1000 Ordering Information: VTB4-1000-20M000 Table 4. Revision Control Revision History A Date 02/03/04 2/10/04 By FBoudreau FBoudreau B 8/13/04 FBoudreau Description Initial Change stability spec, +/-4.6 ppm min, to -4.6 min and +4.6 max. Delete references to tristate. Correct package drawing dimensions , add suggested pad layout, correct test circuit diagram USA: Vectron International • 267 Lowell Road, Hudson, NH 03051 • Tel: 1-88-VECTRON-1 • Fax: 1-888-FAX-VECTRON Vectron International reserves the right to make changes to the product(s) and/or information contained herein without notice. No liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any such product(s) or information.