X28C512, X28C513 ® Data Sheet September 29, 2005 5V, Byte Alterable EEPROM Features The X28C512, X28C513 are 64K x 8 EEPROM, fabricated with Intersil’s proprietary, high performance, floating gate CMOS technology. Like all Intersil programmable nonvolatile memories, the X28C512, X28C513 are 5V only devices. The X28C512, X28C513 feature the JEDEC approved pin out for byte wide memories, compatible with industry standard EPROMS. • Access Time: 90ns The X28C512, X28C513 support a 128-byte page write operation, effectively providing a 39µs/byte write cycle and enabling the entire memory to be written in less than 2.5 seconds. The X28C512, X28C513 also feature DATA Polling and Toggle Bit Polling, system software support schemes used to indicate the early completion of a write cycle. In addition, the X28C512, X28C513 support the software data protection option. FN8106.1 • Simple Byte and Page Write - Single 5V supply • No external high voltages or VPP control circuits - Self-timed • No erase before write • No complex programming algorithms • No overerase problem • Low Power CMOS - Active: 50mA - Standby: 500µA • Software Data Protection - Protects data against system level inadvertent writes • High Speed Page Write Capability • Highly Reliable Direct Write™ Cell - Endurance: 100,000 write cycles - Data retention: 100 years - Early end of write detection - DATA polling - Toggle bit polling • Two PLCC and LCC Pinouts - X28C512 • X28C010 EPROM pin compatible - X28C513 • Compatible with lower density EEPROMs • Pb-Free Plus Anneal Available (RoHS Compliant) 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright Intersil Americas Inc. 2005. All Rights Reserved All other trademarks mentioned are the property of their respective owners. X28C512, X28C513 Block Diagram A7-A15 X Buffers Latches and Decoder A0-A6 Y Buffers Latches and Decoder 512Kbit EEPROM Array I/O Buffers and Latches I/O0-I/O7 CE OE WE Data Inputs/Outputs Control Logic and Timing VCC VSS 2 FN8106.1 September 29, 2005 X28C512, X28C513 Ordering Information PART NUMBER PART MARKING X28C512D ACCESS TIME (ns) TEMP RANGE (°C) - 0 to +70 32 Ld CERDIP -55 to +125 32 Ld CERDIP X28C512DM X28C512J X28C512J PACKAGE 0 to +70 32 Ld PLCC X28C512P 0 to +70 32 Ld PDIP X28C512PI -40 to +85 32 Ld PDIP X28C513EM -55 to +125 32 Ld LCC X28C512D-12 X28C512D-12 X28C512DI-12 X28C512DMB-12 120 0 to +70 32 Ld CERDIP X28C512DI-12 -40 to +85 32 Ld CERDIP X28C512DMB-12 Mil-STD-883 32 Ld CERDIP X28C512E-12 0 to +70 32 Ld LCC X28C512EI-12 -40 to +85 32 Ld LCC X28C512EM-12 -55 to +125 32 Ld LCC X28C512FM-12 -55 to +125 32 Ld Flat Pack X28C512FMB-12 Mil-STD-883 32 Ld Flat Pack X28C512J-12* X28C512J-12 0 to +70 32 Ld PLCC X28C512J-12 Z 0 to +70 32 Ld PLCC (Pb-free) X28C512JI-12 -40 to +85 32 Ld PLCC X28C512JIZ-12 (See Note) X28C512JI-12 Z -40 to +85 32 Ld PLCC (Pb-free) X28C512JM-12 X28C512JM-12 -55 to +125 32 Ld PLCC X28C512KM-12 X28C512JZ-12 (See Note) X28C512JI-12 X28C512KM-12 -55 to +125 36 Ld CPGA X28C512P-12 X28C512P-12 0 to +70 32 Ld PDIP X28C512PI-12 X28C512PI-12 -40 to +85 32 Ld PDIP X28C512RMB-12 Mil-STD-883 32 Ld Flat Pack 32 Ld LCC X28C512RMB-12 X28C513EM-12 X28C513EM-12 -55 to +125 X28C513J-12* X28C513J-12 0 to +70 32 Ld PLCC X28C513JI-12* X28C513JI-12 -40 to +85 32 Ld PLCC X28C513JM-12 X28C513JM-12 -55 to +125 32 Ld PLCC X28C512D-15 X28C512D-15 0 to +70 32 Ld CERDIP X28C512DI-15 X28C512DI-15 -40 to +85 32 Ld CERDIP X28C512DMB-15 Mil-STD-883 32 Ld CERDIP X28C512DMB-15 X28C512E-15 150 0 to +70 32 Ld LCC X28C512EM-15 -55 to +125 32 Ld LCC X28C512EMB-15 Mil-STD-883 32 Ld LCC X28C512FM-15 -55 to +125 32 Ld Flat Pack X28C512FMB-15 Mil-STD-883 32 Ld Flat Pack X28C512J-15* X28C512J-15 0 to +70 32 Ld PLCC X28C512JI-15* X28C512JI-15 -40 to +85 32 Ld PLCC X28C512JM-15 X28C512JM-15 -55 to +125 32 Ld PLCC X28C512P-15 X28C512P-15 0 to +70 32 Ld PDIP X28C512PI-15 X28C512PI-15 -40 to +85 32 Ld PDIP X28C513EM-15 -55 to +125 32 Ld LCC X28C513EMB-15 Mil-STD-883 32 Ld LCC 3 FN8106.1 September 29, 2005 X28C512, X28C513 Ordering Information (Continued) PART NUMBER X28C513J-15* PART MARKING ACCESS TIME (ns) TEMP RANGE (°C) X28C513J-15 150 0 to +70 32 Ld PLCC PACKAGE X28C513JI-15 X28C513JI-15 -40 to +85 32 Ld PLCC X28C513JM-15 X28C513JM-15 -55 to +125 32 Ld PLCC X28C512E-20 200 0 to +70 32 Ld LCC X28C512EI-20 -40 to +85 32 Ld LCC X28C512EM-20 -55 to +125 32 Ld LCC X28C512FM-20 -55 to +125 32 Ld Flat Pack X28C512FMB-20 Mil-STD-883 32 Ld Flat Pack -55 to +125 32 Ld PLCC X28C512JM-20 X28C512JM-20 X28C512KI-20 X28C512KI-20 -40 to +85 36 Ld CPGA X28C512KM-20 X28C512KM-20 -55 to +125 36 Ld CPGA X28C513EI-20 -40 to +85 32 Ld LCC X28C513EM-20 -55 to +125 32 Ld LCC X28C513EMB-20 Mil-STD-883 X28C513J-20T1 X28C513J-20 32 Ld LCC 0 to +70 32 Ld PLCC Tape and Reel 0 to +70 32 Ld LCC -40 to +85 32 Ld LCC X28C512EM-25 -55 to +125 32 Ld LCC X28C512FMB-25 Mil-STD-883 32 Ld Flat Pack X28C512E-25 250 X28C512EI-25 X28C512JM-25 X28C512JM-25 -55 to +125 32 Ld PLCC X28C512KM-25 X28C512KM-25 -55 to +125 36 Ld CPGA X28C512KMB-25 X28C512KMB-25 Mil-STD-883 36 Ld CPGA X28C513EM-25 -55 to +125 32 Ld LCC X28C513EMB-25 Mil-STD-883 32 Ld LCC *Add "T1" suffix for tape and reel. NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 4 FN8106.1 September 29, 2005 X28C512, X28C513 Pinouts NC 29 A14 A7 5 28 A13 A6 6 27 A8 A5 7 26 A9 A4 8 25 A11 A3 9 24 OE A2 10 23 A10 A1 11 22 A2 12 A3 11 A4 10 A5 9 A6 8 7 12 21 I/O5 13 20 I/O4 I/O1 14 19 I/O3 I/O2 15 18 I/O2 VSS 16 17 I/O1 A15 A12 5 NC 2 NC 4 NC 3 VCC NC OE A10 25 26 A11 27 A9 28 A8 29 A13 30 NC 36 34 32 NC 1 WE 35 NC 33 A2 A1 A0 I/O0 10 11 (Top View) A14 31 Pin Descriptions 24 23 22 OE A10 CE 12 13 15 16 17 18 19 20 I/O7 21 14 30 32 31 29 1 28 27 26 X28C513 25 A6 54 3 2 A8 A5 A4 A3 A2 6 7 A9 A11 NC OE A1 A0 NC I/O0 10 11 8 9 (Top View) 24 23 22 A10 CE I/O7 12 13 15 16 17 18 19 20 I/O6 21 14 I/O1 I/O2 VSS A0 I/O0 A7 6 CE Bottom View CE 24 I/O6 30 4 I/O 1 VSS I/O 4 I/O 7 16 18 20 23 A8 A9 A11 I/O5 3 A0 14 I/O3 I/O4 I/O5 A15 A12 A1 13 8 9 A14 A13 A15 VCC WE A13 WE A5 A4 A3 I/O 6 22 NC I/O3 I/O4 VCC 31 I/O 5 I/O 3 21 19 6 7 I/O1 I/O2 VSS 32 2 I/O 2 17 30 32 31 29 1 28 27 26 X28C512 25 54 3 2 A7 1 NC I/O0 15 NC A12 PGA NC X28C512 A7 A6 A12 A14 Plastic DIP CERDIP FLAT Pack SOIC (R) A15 NC NC VCC WE PLCC/LCC Pin Names Addresses (A0-A15) The Address inputs select an 8-bit memory location during a read or write operation. SYMBOL DESCRIPTION A0-A15 Address Inputs Chip Enable (CE) I/O0-I/O7 Data Input/Output WE Write Enable CE Chip Enable OE Output Enable VCC +5V VSS Ground NC No Connect The Chip Enable input must be LOW to enable all read/write operations. When CE is HIGH, power consumption is reduced. Output Enable (OE) The Output Enable input controls the data output buffers and is used to initiate read operations. Data In/Data Out (I/O0-I/O7) Data is written to or read from the X28C512, X28C513 through the I/O pins. Write Enable (WE) The Write Enable input controls the writing of data to the X28C512, X28C513. 5 FN8106.1 September 29, 2005 X28C512, X28C513 Device Operation DATA Polling (I/O7) Read Read operations are initiated by both OE and CE LOW. The read operation is terminated by either CE or OE returning HIGH. This two line control architecture eliminates bus contention in a system environment. The data bus will be in a high impedance state when either OE or CE is HIGH. Write Write operations are initiated when both CE and WE are LOW and OE is HIGH. The X28C512, X28C513 support both a CE and WE controlled write cycle. That is, the address is latched by the falling edge of either CE or WE, whichever occurs last. Similarly, the data is latched internally by the rising edge of either CE or WE, whichever occurs first. A byte write operation, once initiated, will automatically continue to completion, typically within 5ms. Page Write Operation The page write feature of the X28C512, X28C513 allow the entire memory to be written in 2.5 seconds. Page write allows two to one hundred twenty-eight bytes of data to be consecutively written to the X28C512, X28C513, prior to the commencement of the internal programming cycle. The host can fetch data from another device within the system during a page write operation (change the source address), but the page address (A7 through A15) for each subsequent valid write cycle to the part during this operation must be the same as the initial page address. The X28C512, X28C513 feature DATA polling as a method to indicate to the host system that the byte write or page write cycle has completed. DATA Polling allows a simple bit test operation to determine the status of the X28C512, X28C513, eliminating additional interrupt inputs or external hardware. During the internal programming cycle, any attempt to read the last byte written will produce the complement of that data on I/O7 (i.e. write data = 0xxx xxxx, read data = 1xxx xxxx). Once the programming cycle is complete, I/O7 will reflect true data. Toggle Bit (I/O6) The X28C512, X28C513 also provide another method for determining when the internal write cycle is complete. During the internal programming cycle, I/O6 will toggle from HIGH to LOW and LOW to HIGH on subsequent attempts to read the device. When the internal cycle is complete, the toggling will cease, and the device will be accessible for additional read or write operations. The page write mode can be initiated during any write operation. Following the initial byte write cycle, the host can write an additional one to one hundred twenty-seven bytes in the same manner as the first byte was written. Each successive byte load cycle, started by the WE HIGH to LOW transition, must begin within 100µs of the falling edge of the preceding WE. If a subsequent WE HIGH to LOW transition is not detected within 100µs, the internal automatic programming cycle will commence. There is no page write window limitation. Effectively, the page write window is infinitely wide, so long as the host continues to access the device within the byte load cycle time of 100µs. Write Operation Status Bits The X28C512, X28C513 provide the user two write operation status bits. These can be used to optimize a system write cycle time. The status bits are mapped onto the I/O bus as shown in Figure 1. I/O DP TB 5 4 3 2 1 0 Reserved Toggle Bit DATA Polling FIGURE 1. STATUS BIT ASSIGNMENT 6 FN8106.1 September 29, 2005 X28C512, X28C513 DATA Polling I/O7 WE Last Write CE OE VIH VOH HIGH Z I/O7 VOL A0-A15 An An An X28C512, X28C513 Ready An An An An FIGURE 2A. DATA POLLING BUS SEQUENCE DATA Polling can effectively halve the time for writing to the X28C512, X28C513. The timing diagram in Figure 2A illustrates the sequence of events on the bus. The software flow diagram in Figure 2B illustrates one method of implementing the routine. Write Data No Writes Complete? Yes Save Last Data and Address Read Last Address IO7 Compare? No Yes Ready FIGURE 2B. DATA POLLING SOFTWARE FLOW 7 FN8106.1 September 29, 2005 X28C512, X28C513 The Toggle Bit I/O6 Last WE Write CE OE VOH I/O6 * HIGH Z * VOL X28C512, X28C513 Ready * Beginning and ending state of I/O6 will vary. FIGURE 3A. TOGGLE BIT BUS SEQUENCE Hardware Data Protection The X28C512, X28C513 provide three hardware features that protect nonvolatile data from inadvertent writes. Last Write - Noise Protection—A WE pulse typically less than 10ns will not initiate a write cycle. - Default VCC Sense—All write functions are inhibited when VCC is 3.6V. - Write Inhibit—Holding either OE LOW, WE HIGH, or CE HIGH will prevent an inadvertent write cycle during power-up and power-down, maintaining data integrity. Write cycle timing specifications must be observed concurrently. Load Accum From Addr N Compare Accum with Addr N Software Data Protection No Compare Ok? Yes X28C512 Ready FIGURE 3B. TOGGLE BIT SOFTWARE FLOW The Toggle Bit can eliminate the chore of saving and fetching the last address and data in order to implement DATA Polling. This can be especially helpful in an array comprised of multiple X28C512, X28C513 memories that are frequently updated. Toggle Bit Polling can also provide a method for status checking in multiprocessor applications. The timing diagram in Figure 3A illustrates the sequence of events on the bus. The software flow diagram in Figure 3B illustrates a method for polling the Toggle Bit. 8 The X28C512, X28C513 offer a software controlled data protection feature. The X28C512, X28C513 are shipped from Intersil with the software data protection NOT ENABLED; that is, the device will be in the standard operating mode. In this mode data should be protected during power-up/-down operations through the use of external circuits. The host would then have open read and write access of the device once VCC was stable. The X28C512, X28C513 can be automatically protected during power-up and power-down without the need for external circuits by employing the software data protection feature. The internal software data protection circuit is enabled after the first write operation utilizing the software algorithm. This circuit is nonvolatile and will remain set for the life of the device unless the reset command is issued. Once the software protection is enabled, the X28C512, X28C513 are also protected from inadvertent and accidental writes in the powered-up state. That is, the software algorithm must be issued prior to writing additional data to the device. Note: The data in the three-byte enable sequence is not written to the memory array. FN8106.1 September 29, 2005 X28C512, X28C513 Software Data Protection VCC (VCC) 0V Data Addr AAA 5555 55 2AAA A0 5555 Writes ok tWC Write Protected CE ≤ tBLC MAX WE Byte or Page Note: All other timings and control pins are per page write timing requirements FIGURE 4A. TIMING SEQUENCE—SOFTWARE DATA PROTECT ENABLE SEQUENCE FOLLOWED BY BYTE OR PAGE WRITE Software Algorithm Selecting the software data protection mode requires the host system to precede data write operations by a series of three write operations to three specific addresses. Refer to Figure 4A and 4B for the sequence. The three byte sequence opens the page write window, enabling the host to write from one to one hundred twenty-eight bytes of data. Once the page load cycle has been completed, the device will automatically be returned to the data protected state. Write Data AA to Address 5555 Write Data 55 to Address 2AAA Regardless of whether the device has previously been protected or not, once the software data protected algorithm is used and data has been written, the X28C512, X28C513 will automatically disable further writes, unless another command is issued to cancel it. If no further commands are issued the X28C512, X28C513 will be write protected during power-down and after any subsequent power-up. The state of A15 while executing the algorithm is don’t care. Write Data 80 to Address 5555 Write Data XX to any Address Note: Once initiated, the sequence of write operations should not be interrupted. Optional Byte/Page Load Operation Write Last Byte to Last Address After tWC Re-Enters Data Protected State FIGURE 4B. WRITE SEQUENCE FOR SOFTWARE DATA PROTECTION 9 FN8106.1 September 29, 2005 X28C512, X28C513 Resetting Software Data Protection VCC Data Addr AAA 5555 55 2AAA 80 5555 AA 5555 55 2AAA 20 5555 ≥ tWC Standard Operating Mode CE WE Note: All other timings and control pins are per page write timing requirements FIGURE 5A. Reset Software Data Protection Timing Sequence System Considerations Write Data AA to Address 5555 Write Data 55 to Address 2AAA Write Data A0 to Address 5555 Write Data AA to Address 5555 Write Data 55 to Address 2AAA Write Data 20 to Address 5555 FIGURE 5B. SOFTWARE SEQUENCE TO DEACTIVATE SOFTWARE DATA PROTECTION In the event the user wants to deactivate the software data protection feature for testing or reprogramming in an EEPROM programmer, the following six step algorithm will reset the internal protection circuit. After tWC, the X28C512, X28C513 will be in standard operating mode. Because the X28C512, X28C513 are frequently used in large memory arrays it is provided with a two line control architecture for both read and write operations. Proper usage can provide the lowest possible power dissipation and eliminate the possibility of contention where multiple I/O pins share the same bus. To gain the most benefit it is recommended that CE be decoded from the address bus and be used as the primary device selection input. Both OE and WE would then be common among all devices in the array. For a read operation this assures that all deselected devices are in their standby mode and that only the selected device(s) is/are outputting data on the bus. Because the X28C512, X28C513 have two power modes, (standby and active), proper decoupling of the memory array is of prime concern. Enabling CE will cause transient current spikes. The magnitude of these spikes is dependent on the output capacitive loading of the I/Os. Therefore, the larger the array sharing a common bus, the larger the transient spikes. The voltage peaks associated with the current transients can be suppressed by the proper selection and placement of decoupling capacitors. As a minimum, it is recommended that a 0.1µF high frequency ceramic capacitor be used between VCC and VSS at each device. Depending on the size of the array, the value of the capacitor may have to be larger. In addition, it is recommended that a 4.7µF electrolytic bulk capacitor be placed between VCC and VSS for each 8 devices employed in the array. This bulk capacitor is employed to overcome the voltage droop caused by the inductive effects of the PC board traces. Note: Once initiated, the sequence of write operations should not be interrupted. 10 FN8106.1 September 29, 2005 X28C512, X28C513 Active Supply Current vs Ambient Temperature ICC (RD) by Temperature Over Frequency 70 14 5.0 VCC VCC = 5V 60 12 -55°C +25°C +125°C 50 ICC (mA) ICC (mA) 13 11 10 30 9 8 -55 40 20 +35 -10 +80 +125 Ambient Temperature (°C) 10 0 Standby Supply Current vs Ambient Temperature 0.24 3 6 9 12 15 Frequency (MHz) VCC = 5V 0.22 ISB (mA) 0.2 0.18 0.16 0.14 0.12 0.1 -55 -10 +35 +80 +125 Ambient Temperature (°C) 11 FN8106.1 September 29, 2005 X28C512, X28C513 Absolute Maximum Ratings Recommended Operating Conditions Temperature under bias X28C512, X28C513 . . . . . . . . . . . . . . . . . . . . . . . .-10°C to +85°C X28C512I/513I . . . . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +135°C X28C512M/513M . . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +135°C Storage temperature . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C Voltage on any pin with respect to VSS . . . . . . . . . . . . . . -1V to +7V D.C. output current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5mA Lead temperature (soldering, 10 seconds) . . . . . . . . . . . . . . . 300°C Temperature Range Commercial . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to +70°C Industrial. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C Military . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-55°C to +125°C Supply Voltage Limits . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5V ±10% CAUTION: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only; functional operation of the device (at these or any other conditions above those listed in the operational sections of this specification) is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. DC Electrical Specifications SYMBOL Over recommended operating conditions, unless otherwise specified. PARAMETER TEST CONDITIONS MIN MAX UNIT ICC VCC current (active) (TTL inputs) CE = OE = VIL, WE = VIH, All I/O’s = open, address inputs = 0.4V/2.4V Levels @ f = 5MHz 50 mA ISB1 VCC current (standby) (TTL inputs) CE = VIH, OE = VIL, All I/O’s = open, other inputs = VIH 3 mA ISB2 VCC current (standby) (CMOS inputs) CE = VCC - 0.3V, OE = VIL, All I/O’s = Open, Other Inputs = VIH 500 µA ILI Input leakage current VIN = VSS to VCC 10 µA ILO Output leakage current VOUT = VSS to VCC, CE = VIH 10 µA VlL (Note 1) Input LOW voltage -1 0.8 V VIH (Note 1) Input HIGH voltage 2 VCC + 1 V VOL Output LOW voltage IOL = 2.1mA 0.4 V VOH Output HIGH voltage IOH = -400µA 2.4 V NOTE: 1. VIL min. and VIH max. are for reference only and are not tested. Power-Up Timing SYMBOL PARAMETER MAX UNIT tPUR (Note 2) Power-up to read operation 100 µs tPUW (Note 2) Power-up to write operation 5 ms Capacitance TA = +25°C, f = 1MHz, VCC = 5V SYMBOL PARAMETER TEST CONDITIONS MAX UNIT CI/O (Note 2) Input/output capacitance VI/O = 0V 10 pF CIN (Note 2) Input capacitance VIN = 0V 10 pF Endurance and Data Retention PARAMETER MIN MAX UNIT Endurance 10,000 Cycles per byte Endurance 100,000 Cycles per page Data retention 100 Years NOTE: 2. This parameter is periodically sampled and not 100% tested. 12 FN8106.1 September 29, 2005 X28C512, X28C513 Equivalent A.C. Load Circuit A.C. Conditions of Test Input pulse levels 0V to 3V Input rise and fall times 10ns Input and output timing levels 1.5V 5V 1.92kΩ Mode Selection Output CE OE WE MODE I/O POWER L L H Read DOUT Active L H L Write DIN Active H X X Standby and write inhibit High Z Standby — — — — X L X Write inhibit X X H Write inhibit 13 1.37KΩ 100pF Symbol Table WAVEFORM INPUTS OUTPUTS Must be steady Will be steady May change from LOW to HIGH Will change from LOW to HIGH May change from HIGH to LOW Will change from HIGH to LOW Don’t Care: Changes Allowed Changing: State Not Known N/A Center Line is High Impedance FN8106.1 September 29, 2005 X28C512, X28C513 AC Electrical Specifications SYMBOL Over the recommended operating conditions, unless otherwise specified. PARAMETER X28C512-90 X28C512-12 X28C512-15 X28C512-20 X28C512-25 X28C513-90 X28C513-12 X28C513-15 X28C513-20 X28C513-25 MIN MIN MIN MIN MIN MAX MAX MAX MAX MAX UNIT READ CYCLE LIMITS tRC Read cycle time tCE Chip enable access time 90 120 150 200 250 ns tAA Address access time 90 120 150 200 250 ns tOE Output enable access time 40 50 50 50 50 ns 90 120 150 200 250 ns tLZ (Note 3) CE LOW to active output 0 0 0 0 0 ns tOLZ (Note 3) OE LOW to active output 0 0 0 0 0 ns tHZ (Note 3) CE HIGH to high Z output 40 50 50 50 50 ns tOHZ (Note 3) OE HIGH to high Z output 40 50 50 50 50 ns tOH Output hold from address change 0 0 0 0 0 ns Read Cycle tRC Address tCE CE tOE OE VIH WE tOLZ tOHZ tLZ tOH tHZ HIGH Z Data I/O Data Valid Data Valid tAA NOTE: 3. tLZ min., tHZ, tOLZ min., and tOHZ are periodically sampled and not 100% tested. tHZ max. and tOHZ max. are measured, with CL = 5pF from the point when CE or OE return HIGH (whichever occurs first) to the time when the outputs are no longer driven. 14 FN8106.1 September 29, 2005 X28C512, X28C513 Write Cycle Limits SYMBOL tWC (Note 4) PARAMETER MIN Write cycle time MAX UNIT 10 ms tAS Address setup time 0 ns tAH Address hold time 50 ns tCS Write setup time 0 ns tCH Write hold time 0 ns tCW CE pulse width 100 ns tOES OE HIGH setup time 10 ns tOEH OE HIGH hold time 10 ns tWP WE pulse width 100 ns WE High recovery 100 ns tWPH tDV Data valid 1 tDS Data setup 50 ns tDH Data hold 0 ns tDW Delay to next write 10 µs tBLC Byte load cycle 0.2 100 µs µs WE Controlled Write Cycle tWC Address tAS tAH tCS tCH CE OE tOES tOEH tWP WE tDV Data In Data Valid tDH tDS HIGH Z Data Out NOTE: 4. tWC is the minimum cycle time to be allowed from the system perspective unless polling techniques are used. It is the maximum time the device requires to complete the internal write operation. 15 FN8106.1 September 29, 2005 X28C512, X28C513 CE Controlled Write Cycle tWC Address tAS tAH tCW CE tWPH tOES OE tOEH tCS tCH WE tDV Data Valid Data In tDS tDH HIGH Z Data Out Page Write Cycle OE (Note 5) CE tWP tBLC WE tWPH Address* (Note 6) Last Byte I/O Byte 0 Byte 1 Byte 2 Byte n Byte n+1 Byte n+2 tWC *For each successive write within the page write operation, A7-A15 should be the same or writes to an unknown address could occur. NOTES: 5. Between successive byte writes within a page write operation, OE can be strobed LOW: e.g. this can be done with CE and WE HIGH to fetch data from another memory device within the system for the next write; or with WE HIGH and CE LOW effectively performing a polling operation. 6. The timings shown above are unique to page write operations. Individual byte load operations within the page write must conform to either the CE or WE controlled write cycle timing. 16 FN8106.1 September 29, 2005 X28C512, X28C513 DATA Polling Timing Diagram (Note 7) Address An An An CE WE tOEH tOES OE tDW DIN = X I/O7 DOUT = X DOUT = X tWC Toggle Bit Timing Diagram CE WE tOES tOEH OE tDW HIGH Z I/O6 * * tWC *Starting and ending state will vary, depending upon actual tWC. NOTE: 7. Polling operations are by definition read cycles and are therefore subject to read cycle timings. 17 FN8106.1 September 29, 2005 X28C512, X28C513 Packaging Information 32-Lead Hermetic Dual In-Line Package Type D 1.690 (42.95) Max. 0.610 (15.49) 0.500 (12.70) Pin 1 0.005 (0.13) Min. 0.100 (2.54) Max. Seating Plane 0.232 (5.90) Max. 0.060 (1.52) 0.015 (0.38) 0.150 (3.81) Min. 0.200 (5.08) 0.125 (3.18) 0.110 (2.79) 0.090 (2.29) Typ. 0.100 (2.54) 0.065 (1.65) 0.033 (0.84) Typ. 0.055 (1.40) 0.023 (0.58) 0.014 (0.36) Typ. 0.018 (0.46) 0.620 (15.75) 0.590 (14.99) Typ. 0.614 (15.60) 0.015 (0.38) 0.008 (0.20) 0° 15° NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS) 18 FN8106.1 September 29, 2005 X28C512, X28C513 Packaging Information 32-Pad Ceramic Leadless Chip Carrier Package Type E 0.300 (7.62) BSC 0.150 (3.81) BSC 0.015 (0.38) 0.020 (0.51) x 45° Ref. 0.003 (0.08) 0.095 (2.41) Pin 1 0.075 (1.91) 0.022 (0.56) 0.006 (0.15) DIA. 0.055 (1.39) 0.200 (5.08) BSC 0.045 (1.14) 0.015 (0.38) Min. 0.028 (0.71) 0.022 (0.56) 0.050 (1.27) BSC TYP. (4) PLCS. 0.040 (1.02) x 45° Ref. Typ. (3) Plcs. (32) Plcs. 0.088 (2.24) 0.458 (11.63) 0.442 (11.22) 0.120 (3.05) 0.458 (11.63) 0.050 (1.27) 0.060 (1.52) -- 0.560 (14.22) 0.558 (14.17) 0.540 (13.71) -- 0.400 (10.16) BSC Pin 1 Index Corner NOTE: 1. ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS) 2. TOLERANCE: ±1% NLT ±0.005 (0.127) 19 FN8106.1 September 29, 2005 X28C512, X28C513 Packaging Information 32-Lead Ceramic Flat Pack Type F 1.228 (31.19) 1.000 (25.40) Pin 1 Index 1 0.019 (0.48) 0.015 (0.38) 32 0.050 (1.27) BSC 0.830 (21.08) Max. 0.045 (1.14) Max. 0.005 (0.13) Min. 0.440 (11.18) 0.430 (10.93) 0.007 (0.18) 0.004 (0.10) 0.120 (3.05) 0.090 (2.29) 0.370 (9.40) 0.270 (6.86) 0.347 (8.82) 0.330 (8.38) 0.026 (0.66) Min. 0.030 (0.76) Min. NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS) 20 FN8106.1 September 29, 2005 X28C512, X28C513 Packaging Information 32-Lead Plastic Leaded Chip Carrier Package Type J 0.030" Typical 32 Places 0.050" Typical 0.420 (10.67) 0.050" Typical 0.510" Typical 0.400" 0.050 (1.27) Typ. 0.300" Ref. 0.410" FOOTPRINT 0.021 (0.53) 0.045 (1.14) x 45° 0.013 (0.33) Typ. 0.017 (0.43) Seating Plane ±0.004 Lead CO - Planarity — 0.015 (0.38) 0.495 (12.57) 0.485 (12.32) Typ. 0.490 (12.45) 0.095 (2.41) 0.060 (1.52) 0.140 (3.56) 0.100 (2.45) Typ. 0.136 (3.45) 0.453 (11.51) 0.447 (11.35) Typ. 0.450 (11.43) 0.300 (7.62) Ref. 0.048 (1.22) 0.042 (1.07) Pin 1 0.595 (15.11) 0.585 (14.86) Typ. 0.590 (14.99) 0.553 (14.05) 0.547 (13.89) Typ. 0.550 (13.97) 0.400 (10.16)Ref. 3° Typ. NOTES: 1. ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS) 2. DIMENSIONS WITH NO TOLERANCE FOR REFERENCE ONLY 21 FN8106.1 September 29, 2005 X28C512, X28C513 Packaging Information 32-Lead Plastic Dual In-Line Package Type P 1.665 (42.29) 1.644 (41.76) 0.557 (14.15) 0.510 (12.95) Pin 1 Index Pin 1 0.085 (2.16) 0.040 (1.02) 1.500 (38.10) Ref. 0.160 (4.06) 0.140 (3.56) Seating Plane 0.030 (0.76) 0.015 (0.38) 0.160 (4.06) 0.125 (3.17) 0.110 (2.79) 0.090 (2.29) 0.070 (17.78) 0.030 (7.62) 0.022 (0.56) 0.014 (0.36) 0.625 (15.88) 0.590 (14.99) Typ. 0.010 (0.25) 0° 15° NOTES: 1. ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS) 2. PACKAGE DIMENSIONS EXCLUDE MOLDING FLASH 22 FN8106.1 September 29, 2005 X28C512, X28C513 Packaging Information 32-Lead Ceramic Small Outline Gull Wing Package Type R 0.060 Nom. See Detail “A” For Lead Information 0.020 Min. 0.165 Typ. 0.340 ±0.007 0.015 R Typ. 0.015 R Typ. 0.035 Typ. 0.035 Min. Detail “A” 0.050" Typical 0.019 0.015 0.050" Typical 0.830 Max. 0.750 ±0.005 0.050 0.560" Typical FOOTPRINT 0.030" Typical 32 Places 0.440 Max. 0.560 Nom. NOTES: 1. ALL DIMENSIONS IN INCHES 2. FORMED LEAD SHALL BE PLANAR WITH RESPECT TO ONE ANOTHER WITHIN 0.004 INCHES 23 FN8106.1 September 29, 2005 X28C512, X28C513 Packaging Information 36-Lead Ceramic Pin Grid Array Package Type K 15 17 19 21 22 A 0.008 (0.20) 13 14 12 11 16 18 20 23 24 25 26 0.050 (1.27) A 10 9 27 28 8 7 29 30 NOTE: Leads 5, 14, 23, & 32 Typ. 0.100 (2.54) All Leads 6 Typ. 0.180 (.010) (4.57 ± .25) 4 Corners 5 2 36 34 32 4 3 1 35 33 31 Typ. 0.180 (.010) (4.57 ± .25) 4 Corners 0.120 (3.05) 0.100 (2.54) 0.072 (1.83) 0.062 (1.57) Pin 1 Index 0.770 (19.56) 0.750 (19.05) SQ A 0.020 (0.51) 0.016 (0.41) A 0.185 (4.70) 0.175 (4.45) NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS) 24 FN8106.1 September 29, 2005 X28C512, X28C513 Packaging Information 40-Lead Thin Small Outline Package (TSOP) Type T 0.493 (12.522) 0.483 (12.268) 0.045 (1.143) 0.035 (0.889) Pin #1 Ident O 0.040 (1.016) 0.005 (0.127) Dp. O 0.030 (0.762) X 0.003 (0.076) Dp. (0.038) 0.965 0.048 (1.219) 1 0.0197 (0.500) 0.396 (10.058) 0.392 (9.957) 0.007 (0.178) 15° Typ. A 0.0025 (0.065) Seating Plane 0.557 (14.148) 0.547 (13.894) Seating Plane 0.010 (0.254) 0.006 (0.152) 0.040 (1.016) Detail A 0.032 (0.813) Typ. 0.006 (0.152) Typ. 4° Typ. 0.017 (0.432) 0.017 (0.432) 0.020 (0.508) Typ. 14.80 ± 0.05 (0.583 ± 0.002) 0.30 ± 0.05 Solder Pads FOOTPRINT (0.012 ± 0.002) Typical 40 Places 0.17 (0.007) 0.03 (0.001) 1.30 ± 0.05 (0.051 ± 0.002) 15 Eq. Spc.@ 0.50 ± 0.04 0.0197 0.016 = 9.50 ± 0.06 (0.374 ± 0.0024) Overall Tol. Non-Cumulative 0.50 ± 0.04 (0.0197 ± 0.0016) NOTE: ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (INCHES IN PARENTHESES). All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 25 FN8106.1 September 29, 2005