X5043, X5045 ® 4K, 512 x 8 Bit Data Sheet September 16, 2005 FN8126.1 CPU Supervisor with 4K SPI EEPROM Features These devices combine four popular functions, Power-on Reset Control, Watchdog Timer, Supply Voltage Supervision, and Block Lock Protect Serial EEPROM Memory in one package. This combination lowers system cost, reduces board space requirements, and increases reliability. • Low VCC Detection and Reset Assertion - Four standard reset threshold voltages 4.63V, 4.38V, 2.93V, 2.63V - Re-program low VCC reset threshold voltage using special programming sequence. - Reset signal valid to VCC = 1V Applying power to the device activates the power-on reset circuit which holds RESET/RESET active for a period of time. This allows the power supply and oscillator to stabilize before the processor executes code. The Watchdog Timer provides an independent protection mechanism for microcontrollers. When the microcontroller fails to restart a timer within a selectable time out interval, the device activates the RESET/RESET signal. The user selects the interval from three preset values. Once selected, the interval does not change, even after cycling the power. The device’s low VCC detection circuitry protects the user’s system from low voltage conditions, resetting the system when VCC falls below the minimum VCC trip point. RESET/RESET is asserted until VCC returns to proper operating level and stabilizes. Four industry standard VTRIP thresholds are available, however, Intersil’s unique circuits allow the threshold to be reprogrammed to meet custom requirements or to fine-tune the threshold for applications requiring higher precision. The memory portion of the device is a CMOS Serial EEPROM array with Intersil’s block lock protection. The array is internally organized as 512 x 8. The device features a Serial Peripheral Interface (SPI) and software protocol allowing operation on a simple four-wire bus. The device utilizes Intersil’s proprietary Direct Write™ cell, providing a minimum endurance of 100,000 cycles and a minimum data retention of 100 years. • Selectable Time Out Watchdog Timer • Long Battery Life with Low Power Consumption - <50µA max standby current, watchdog on - <10µA max standby current, watchdog off • 4Kbits of EEPROM–1M Write Cycle Endurance • Save Critical Data with Block Lock™ Memory - Protect 1/4, 1/2, all or none of EEPROM array • Built-in Inadvertent Write Protection - Write enable latch - Write protect pin • SPI Interface - 3.3MHz Clock Rate • Minimize Programming Time - 16-byte page write mode - 5ms write cycle time (typical) • Available Packages - 8 Ld MSOP, 8 Ld SOIC, 8 Ld PDIP - 14 Ld TSSOP • Pb-Free Plus Anneal Available (RoHS Compliant) Applications • Communications Equipment - Routers, Hubs, Switches - Set Top Boxes • Industrial Systems - Process Control - Intelligent Instrumentation • Computer Systems - Desktop Computers - Network Servers • Battery Powered Equipment 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright Intersil Americas Inc. 2005. All Rights Reserved All other trademarks mentioned are the property of their respective owners. X5043, X5045 Typical Application 2.7-5.0V VCC uC VCC X5043 10K RESET CS SCK SI SO WP RESET SPI VSS VSS Block Diagram + VCC VTRIP POR and Low Voltage Reset Generation Reset & Watchdog Timebase Watchdog Transition Detector CS/WDI SI SO SCK WP RESET (X5043) RESET (X5045) Command Decode & Control Logic Protect Logic 2 Watchdog Timer Reset Status Register EEPROM Array 4Kbits X5043, X5045 STANDARD VTRIP LEVEL SUFFIX 4.63V (+/-2.5%) -4.5A 4.38V (+/-2.5%) -4.5 2.93V (+/-2.5%) -2.7A 2.63V (+/-2.5%) -2.7 See “Ordering Information” on page 3. for more details For Custom Settings, call Intersil. FN8126.1 September 16, 2005 X5043, X5045 Ordering Information PART NUMBER RESET (ACTIVE LOW) PART NUMBER RESET (ACTIVE HIGH) PART MARKING PART MARKING VCC RANGE VTRIP RANGE 4.5-5.5V 4.5-4.75 TEMP RANGE (°C) PACKAGE X5043P-4.5A X5045P-4.5A X5043PZ-4.5A (Note) X5045PZ-4.5A (Note) X5043PI-4.5A X5045PI-4.5A -40 to 85 8 Ld PDIP X5043PIZ-4.5A (Note) X5045PIZ-4.5A (Note) X5045P Z AM -40 to 85 8 Ld PDIP (Pb-free) X5043S8-4.5A X5043S8Z-4.5A (Note) X5043S8I-4.5A* X5043S8IZ-4.5A* (Note) X5043 AL X5045S8-4.5A X5043 Z AL X5045S8Z-4.5A (Note) X5043 AM X5045S8I-4.5A* X5043 Z AM X5045S8IZ-4.5A* (Note) 0 to 70 8 Ld PDIP 0 to 70 8 Ld PDIP (Pb-free) X5045 AL 0 to 70 8 Ld SOIC X5045 Z AL 0 to 70 8 Ld SOIC (Pb-free) X5045 AM -40 to 85 8 Ld SOIC X5045 Z AM -40 to 85 8 Ld SOIC (Pb-free) X5043M8-4.5A AEM X5045M8-4.5A AEV 0 to 70 8 Ld MSOP X5043M8Z-4.5A (Note) DBS X5045M8Z-4.5A (Note) DCA 0 to 70 8 Ld MSOP (Pb-free) X5043M8I-4.5A* AEN X5045M8I-4.5A AEW -40 to 85 8 Ld MSOP X5043M8IZ-4.5A (Note) DBM X5045M8IZ-4.5A (Note) DBX -40 to 85 8 Ld MSOP (Pb-free) X5043V14I-4.5A X5043P X5045V14I-4.5A X5043P X5045P -40 to 85 X5045P 4.25-4.5 0 to 70 14 Ld TSSOP 8 Ld PDIP X5043PZ (Note) X5043P Z X5045PZ (Note) X5045P Z 0 to 70 X5043PI X5043P I X5045PI X5045P I -40 to 85 X5045P Z I -40 to 85 8 Ld PDIP (Pb-free) - 0 to 70 X5043PIZ (Note) X5043P Z I X5043ST1 X5043ST2 X5043S8* X5045PIZ (Note) - X5043 X5045S8* 8 Ld PDIP (Pb-free) 8 Ld PDIP - 0 to 70 8 Ld SOIC Tape and Reel X5045 0 to 70 8 Ld SOIC X5043S8Z* (Note) X5043 Z X5045S8Z* (Note) X5045 Z 0 to 70 X5043S8I* X5043 I X5045S8I* X5045 I -40 to 85 8 Ld SOIC X5045 Z I -40 to 85 8 Ld SOIC (Pb-free) - 0 to 70 8 Ld SOIC 0 to 70 8 Ld SOIC Tape and Reel X5043S8IZ* (Note) X5043 Z I X5043SM* - X5045S8IZ* (Note) - - X5045SMT1 8 Ld SOIC (Pb-free) X5043M8 AEO X5045M8 AEX 0 to 70 8 Ld MSOP X5043M8Z (Note) DBN X5045M8Z (Note) DBY 0 to 70 8 Ld MSOP (Pb-free) X5043M8I AEP X5045M8I AEY -40 to 85 8 Ld MSOP X5043M8IZ (Note) DBJ X5045M8IZ (Note) DBT -40 to 85 8 Ld MSOP (Pb-free) X5043V - X5043V14I X5045V14I 3 0 to 70 14 Ld TSSOP -40 to 85 14 Ld TSSOP FN8126.1 September 16, 2005 X5043, X5045 Ordering Information (Continued) PART NUMBER RESET (ACTIVE LOW) X5043P-2.7A X5043PZ-2.7A (Note) X5043PI-2.7A PART MARKING PART NUMBER RESET (ACTIVE HIGH) X5043P AN X5045P-2.7A X5043P Z AN X5045PZ-2.7A (Note) X5043P AP X5045PI-2.7A X5043PIZ-2.7A (Note) X5043P Z AP X5045PIZ-2.7A (Note) X5043S8-2.7A* X5043S8Z-2.7A* (Note) X5043S8I-2.7A* X5043S8IZ-2.7A* (Note) X5043 AN X5045S8-2.7A X5043 Z AN X5045S8Z-2.7A (Note) X5043 AP X5045S8I-2.7A X5043 Z AP X5045S8IZ-2.7A (Note) PART MARKING VCC RANGE VTRIP RANGE TEMP RANGE (°C) X5045P AN 2.7-5.5V 2.85-3.0 0 to 70 PACKAGE 8 Ld PDIP X5045P Z AN 0 to 70 X5045P AP -40 to 85 8 Ld PDIP (Pb-free) X5045P Z AP -40 to 85 X5045 AN 0 to 70 8 Ld SOIC X5045 Z AN 0 to 70 8 Ld SOIC (Pb-free) 8 Ld PDIP 8 Ld PDIP (Pb-free) X5045 AP -40 to 85 8 Ld SOIC X5045 Z AP -40 to 85 8 Ld SOIC (Pb-free) X5043M8-2.7A* AEQ X5045M8-2.7A AEZ 0 to 70 8 Ld MSOP X5043M8Z-2.7A (Note) DBR X5045M8Z-2.7A (Note) DCA 0 to 70 8 Ld MSOP (Pb-free) X5043M8I-2.7A* AER X5045M8I-2.7A AFA -40 to 85 8 Ld MSOP X5043M8IZ-2.7A* (Note) DBL X5045M8IZ-2.7A (Note) DBW -40 to 85 8 Ld MSOP (Pb-free) -40 to 85 14 Ld TSSOP X5043V14I-2.7A X5043P-2.7 X5043PZ-2.7 (Note) X5043PI-2.7 X5043PIZ-2.7 (Note) X5045V14I-2.7A X5043P F X5045P-2.7 X5043P Z F X5045PZ-2.7 (Note) X5043P G X5045PI-2.7 X5043P Z G X5045PIZ-2.7 (Note) X5045P F X5045P Z F 2.55-2.7 0 to 70 8 Ld PDIP 0 to 70 8 Ld PDIP (Pb-free) X5045P G -40 to 85 8 Ld PDIP X5045P Z G -40 to 85 8 Ld PDIP (pb-free) - - X5045S-2.7* 0 to 70 8 Ld SOIC - - X5045SI-2.7* -40 to 85 8 Ld SOIC X5043 F X5045S8-2.7* X5043S8-2.7* X5043S8Z-2.7* (Note) X5043S8I-2.7* X5043S8IZ-2.7* (Note) X5043 Z F X5043 G X5043 Z G X5045S8Z-2.7* (Note) X5045S8I-2.7* X5045S8IZ-2.7* (Note) 0 to 70 8 Ld SOIC 0 to 70 8 Ld SOIC (Pb-free) X5045 G -40 to 85 8 Ld SOIC X5045 Z G -40 to 85 8 Ld SOIC (Pb-free) AFB 0 to 70 X5043M8-2.7 AES X5043M8Z-2.7 (Note) DBP X5045M8Z-2.7 (Note) DBZ 0 to 70 X5043M8I-2.7* AET X5045M8I-2.7 AFC -40 to 85 8 Ld MSOP X5043M8IZ-2.7* (Note) DBK X5045M8IZ-2.7* (Note) DBU -40 to 85 8 Ld MSOP (Pb-free) X5045V G -40 to 85 14 Ld TSSOP X5043V14I-2.7 X5043V G X5045M8-2.7 X5045 F X5045 Z F X5045V14I-2.7 8 Ld MSOP 8 Ld MSOP (Pb-free) *Add "-T1" suffix for tape and reel. NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 4 FN8126.1 September 16, 2005 X5043, X5045 Pin Configuration cycle has already been initiated, WP going low will have no affect on a write. 8 Ld SOIC/PDIP/MSOP CS/WDI 1 8 SO 2 WP 3 7 X5043, X5045 6 4 5 VSS Reset (RESET, RESET) VCC RESET/RESET SCK SI 14 Ld TSSOP CS 1 14 VCC SO 2 13 RESET/RESET NC 3 NC 4 12 X5043, X5045 11 NC 5 10 NC WP 6 9 SCK 7 8 SI NC VSS NC Pin Descriptions Serial Output (SO) X5043, X5045, RESET/RESET is an active low/HIGH, open drain output which goes active whenever VCC falls below the minimum VCC sense level. It will remain active until VCC rises above the minimum VCC sense level for 200ms. RESET/RESET also goes active if the Watchdog timer is enabled and CS remains either high or low longer than the Watchdog time out period. A falling edge of CS will reset the watchdog timer. Pin Names SYMBOL DESCRIPTION CS/WDI Chip Select Input SO Serial Output SI Serial Input SCK Serial Clock Input WP Write Protect Input VSS Ground VCC Supply Voltage RESET/RESET Reset Output SO is a push/pull serial data output pin. During a read cycle, data is shifted out on this pin. Data is clocked out by the falling edge of the serial clock. Principles of Operation Serial Input (SI) Power-on Reset SI is the serial data input pin. All opcodes, byte addresses, and data to be written to the memory are input on this pin. Data is latched by the rising edge of the serial clock. Serial Clock (SCK) The Serial Clock controls the serial bus timing for data input and output. Opcodes, addresses, or data present on the SI pin is latched on the rising edge of the clock input, while data on the SO pin changes after the falling edge of the clock input. Chip Select (CS/WDI) When CS is high, the X5043, X5045 are deselected and the SO output pin is at high impedance and, unless an internal write operation is underway, the X5043, X5045 will be in the standby power mode. CS low enables the X5043, X5045, placing it in the active power mode. It should be noted that after power-up, a high to low transition on CS is required prior to the start of any operation. Write Protect (WP) When WP is low, nonvolatile writes to the X5043, X5045 are disabled, but the part otherwise functions normally. When WP is held high, all functions, including non volatile writes operate normally. WP going low while CS is still low will interrupt a write to the X5043, X5045. If the internal write 5 Application of power to the X5043, X5045 activate a Poweron Reset Circuit. This circuit pulls the RESET/RESET pin active. RESET/RESET prevents the system microprocessor from starting to operate with insufficient voltage or prior to stabilization of the oscillator. When VCC exceeds the device VTRIP value for 200ms (nominal) the circuit releases RESET/RESET, allowing the processor to begin executing code. Low Voltage Monitoring During operation, the X5043, X5045 monitor the VCC level and asserts RESET/RESET if supply voltage falls below a preset minimum VTRIP. The RESET/RESET signal prevents the microprocessor from operating in a power fail or brownout condition. The RESET/RESET signal remains active until the voltage drops below 1V. It also remains active until VCC returns and exceeds VTRIP for 200ms. Watchdog Timer The Watchdog Timer circuit monitors the microprocessor activity by monitoring the WDI input. The microprocessor must toggle the CS/WDI pin periodically to prevent an active RESET/RESET signal. The CS/WDI pin must be toggled from HIGH to LOW prior to the expiration of the watchdog time out period. The state of two nonvolatile control bits in the Status Register determines the watchdog timer period. The microprocessor can change these watchdog bits. With FN8126.1 September 16, 2005 X5043, X5045 address 03h. CS going HIGH on the write operation initiates the VTRIP programming sequence. Bring WP LOW to complete the operation. no microprocessor action, the watchdog timer control bits remain unchanged, even during total power failure. VCC Threshold Reset Procedure The X5043, X5045 are shipped with a standard VCC threshold (VTRIP) voltage. This value will not change over normal operating and storage conditions. However, in applications where the standard VTRIP is not exactly right, or if higher precision is needed in the VTRIP value, the X5043, X5045 threshold may be adjusted. The procedure is described below, and uses the application of a high voltage control signal. Note: This operation also writes 00h to array address 03h. Setting the VTRIP Voltage This procedure is used to set the VTRIP to a higher voltage value. For example, if the current VTRIP is 4.4V and the new VTRIP is 4.6V, this procedure will directly make the change. If the new setting is to be lower than the current setting, then it is necessary to reset the trip point before setting the new value. To set the new VTRIP voltage, apply the desired VTRIP threshold voltage to the VCC pin and tie the WP pin to the programming voltage VP. Then send a WREN command, followed by a write of Data 00h to address 01h. CS going HIGH on the write operation initiates the VTRIP programming sequence. Bring WP LOW to complete the operation. Note: This operation also writes 00h to array address 01h. Resetting the VTRIP Voltage This procedure is used to set the VTRIP to a “native” voltage level. For example, if the current VTRIP is 4.4V and the new VTRIP must be 4.0V, then the VTRIP must be reset. When VTRIP is reset, the new VTRIP is something less than 1.7V. This procedure must be used to set the voltage to a lower value. To reset the VTRIP voltage, apply at least 3V to the VCC pin and tie the WP pin to the programming voltage VP. Then send a WREN command, followed by a write of Data 00h to VP = 15-18V WP CS 0 1 2 3 4 5 6 7 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 SCK 8 Bits SI 06h WREN 02h Write 01h Address 00h Data FIGURE 1. SET VTRIP LEVEL SEQUENCE (VCC = DESIRED VTRIP VALUE.) 6 FN8126.1 September 16, 2005 X5043, X5045 VP = 15-18V WP CS 0 1 2 3 4 5 6 7 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 SCK 8 Bits SI 06h 02h WREN Write 00h 03h Address Data FIGURE 2. RESET VTRIP LEVEL SEQUENCE (VCC > 3V. WP = 15–18V) 4.7K VP Adjust VTRIP Adj. Run 1 2 3 4 8 X5043 X5045 µC RESET 7 6 SCK 5 SI SO CS FIGURE 3. SAMPLE VTRIP RESET CIRCUIT 7 FN8126.1 September 16, 2005 X5043, X5045 SPI Serial Memory Execute Reset VTRIP Sequence The memory portion of the device is a CMOS Serial EEPROM array with Intersil’s block lock protection. The array is internally organized as 512 x 8 bits. The device features a Serial Peripheral Interface (SPI) and software protocol allowing operation on a simple four-wire bus. Set VCC = VCC Applied = Desired VTRIP The device utilizes Intersil’s proprietary Direct Write™ cell, providing a minimum endurance of 1,000,000 cycles and a minimum data retention of 100 years. VTRIP Programming New VCC Applied = Old VCC Applied - Error Execute Set VTRIP Sequence Apply 5V to VCC New VCC Applied = Old VCC Applied - Error Execute Reset VTRIP Sequence Decrement VCC (VCC = VCC–10mV) NO RESET pin goes active? Measured VTRIP -Desired VTRIP The device contains an 8-bit instruction register that controls the operation of the device. The instruction code is written to the device via the SI input. There are two write operations that requires only the instruction byte. There are two read operations that use the instruction byte to initiate the output of data. The remainder of the operations require an instruction byte, an 8-bit address, then data bytes. All instruction, address and data bits are clocked by the SCK input. All instructions (Table 1), addresses and data are transferred MSB first. Clock and Data Timing YES Error ≤ -Emax The device is designed to interface directly with the synchronous Serial Peripheral Interface (SPI) of many popular microcontroller families. Error ≥ Emax -Emax < Error < Emax Data input on the SI line is latched on the first rising edge of SCK after CS goes LOW. Data is output on the SO line by the falling edge of SCK. SCK is static, allowing the user to stop the clock and then start it again to resume operations where left off. CS must be LOW during the entire operation. DONE Emax = Maximum Desired Error FIGURE 4. VTRIP PROGRAMMING SEQUENCE TABLE 1. INSTRUCTION SET INSTRUCTION NAME INSTRUCTION FORMAT* WREN 0000 0110 Set the Write Enable Latch (Enable Write Operations) WRDI 0000 0100 Reset the Write Enable Latch (Disable Write Operations) RSDR 0000 0101 Read Status Register WRSR 0000 0001 Write Status Register (Watchdog and Block Lock) READ 0000 A8011 Read Data from Memory Array Beginning at Selected Address WRITE 0000 A8010 Write Data to Memory Array Beginning at Selected Address (1 to 16 bytes) Note: OPERATION *Instructions are shown MSB in leftmost position. Instructions are transferred MSB first. 8 FN8126.1 September 16, 2005 X5043, X5045 Write Enable Latch The device contains a Write Enable Latch. This latch must be SET before a Write Operation is initiated. The WREN instruction will set the latch and the WRDI instruction will reset the latch (Figure 5). This latch is automatically reset upon a power-up condition and after the completion of a valid byte, page, or status register write cycle. The latch is also reset if WP is brought LOW. When issuing a WREN, WRDI or RDSR commands, it is not necessary to send a byte address or data. 1 2 3 4 5 6 7 ARRAY ADDRESSES PROTECTED BL1 BL0 X5043, X5045 0 0 None 0 1 $180–$1FF 1 0 $100–$1FF 1 1 $000–$1FF STATUS REGISTER BITS SCK SI SO STATUS REG BITS The Watchdog Timer bits, WD0 and WD1, select the Watchdog Time-out Period. These nonvolatile bits are programmed with the WRSR instruction. CS 0 the array that is block lock protected can be read but not written. It will remain protected until the BL bits are altered to disable block lock protection of that portion of memory. High Impedance FIGURE 5. WRITE ENABLE/DISABLE LATCH SEQUENCE (WREN/WRDI INSTRUCTION) Status Register The Status Register contains four nonvolatile control bits and two volatile status bits. The control bits set the operation of the watchdog timer and the memory block lock protection. The Status Register is formatted as shown in “Status Register”. Status Register: (Default = 30H) 7 6 5 4 3 2 1 0 0 0 WD1 WD0 BL1 BL0 WEL WIP The Write-In-Progress (WIP) bit is a volatile, read only bit and indicates whether the device is busy with an internal nonvolatile write operation. The WIP bit is read using the RDSR instruction. When set to a “1”, a nonvolatile write operation is in progress. When set to a “0”, no write is in progress. WD1 WD0 WATCHDOG TIME OUT (TYPICAL) 0 0 1.4 seconds 0 1 600 milliseconds 1 0 200 milliseconds 1 1 disabled (factory default) Read Status Register To read the Status Register, pull CS low to select the device, then send the 8-bit RDSR instruction. Then the contents of the Status Register are shifted out on the SO line, clocked by CLK. Refer to the Read Status Register Sequence (Figure 6). The Status Register may be read at any time, even during a Write Cycle. Write Status Register Prior to any attempt to write data into the status register, the “Write Enable” Latch (WEL) must be set by issuing the WREN instruction (Figure 5). First pull CS LOW, then clock the WREN instruction into the device and pull CS HIGH. Then bring CS LOW again and enter the WRSR instruction followed by 8 bits of data. These 8 bits of data correspond to the contents of the status register. The operation ends with CS going HIGH. If CS does not go HIGH between WREN and WRSR, the WRSR instruction is ignored. The Write Enable Latch (WEL) bit indicates the status of the “write enable” latch. When WEL = 1, the latch is set and when WEL = 0 the latch is reset. The WEL bit is a volatile, read only bit. The WREN instruction sets the WEL bit and the WRDS instruction resets the WEL bit. The block lock bits, BL0 and BL1, set the level of block lock protection. These nonvolatile bits are programmed using the WRSR instruction and allow the user to protect one quarter, one half, all or none of the EEPROM array. Any portion of 9 FN8126.1 September 16, 2005 X5043, X5045 TABLE 2. DEVICE PROTECT MATRIX MEMORY BLOCK STATUS REGISTER WREN CMD (WEL) DEVICE PIN (WP) PROTECTED AREA UNPROTECTED AREA (BL0, BL1, WD0, WD1) 0 x Protected Protected Protected x 0 Protected Protected Protected 1 1 Protected Writable Writable CS 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 7 6 SCK Instruction SI Data Out High Impedance SO 5 4 3 2 1 0 MSB FIGURE 6. READ STATUS REGISTER SEQUENCE CS 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 7 6 SCK Data Byte Instruction SI 5 4 3 2 1 0 High Impedance SO FIGURE 7. WRITE STATUS REGISTER SEQUENCE 10 FN8126.1 September 16, 2005 X5043, X5045 Read Memory Array For the write operation (byte or page write) to be completed, CS must be brought HIGH after bit 0 of the last complete data byte to be written is clocked in. If it is brought HIGH at any other time, the write operation will not be completed (Figure 9). When reading from the EEPROM memory array, CS is first pulled low to select the device. The 8-bit READ instruction is transmitted to the device, followed by the 8-bit address. Bit 3 of the READ instruction selects the upper or lower half of the device. After the READ opcode and address are sent, the data stored in the memory at the selected address is shifted out on the SO line. The data stored in memory at the next address can be read sequentially by continuing to provide clock pulses. The address is automatically incremented to the next higher address after each byte of data is shifted out. When the highest address is reached, the address counter rolls over to address 000h allowing the read cycle to be continued indefinitely. The read operation is terminated by taking CS high. Refer to the Read EEPROM Array Sequence (Figure 8). While the write is in progress following a status register or memory array write sequence, the Status Register may be read to check the WIP bit. WIP is HIGH while the nonvolatile write is in progress. Write Memory Array Prior to any attempt to write data into the memory array, the “Write Enable” Latch (WEL) must be set by issuing the WREN instruction (Figure 5). First pull CS LOW, then clock the WREN instruction into the device and pull CS HIGH. Then bring CS LOW again and enter the WRITE instruction followed by the 8-bit address and then the data to be written. Bit 3 of the WRITE instruction contains address bit A8, which selects the upper or lower half of the array. If CS does not go HIGH between WREN and WRITE, the WRITE instruction is ignored. The WRITE operation requires at least 16 clocks. CS must go low and remain low for the duration of the operation. The host may continue to write up to 16 bytes of data. The only restriction is that the 16 bytes must reside within the same page. A page address begins with address [x xxxx 0000] and ends with [x xxxx 1111]. If the byte address reaches the last byte on the page and the clock continues, the counter will roll back to the first address of the page and overwrite any data that has been previously written. CS 0 1 2 3 4 5 6 7 8 9 7 6 10 12 13 14 15 16 17 18 19 20 21 22 SCK Instruction 8 Bit Address 8 SI 5 3 2 1 0 9th Bit of Address High Impedance SO Data Out 7 6 5 4 3 2 1 0 MSB FIGURE 8. READ EEPROM ARRAY SEQUENCE 11 FN8126.1 September 16, 2005 X5043, X5045 CS 0 1 2 3 4 5 6 7 8 9 10 7 6 8 Bit Address 5 3 2 12 13 14 15 16 17 18 19 20 21 22 23 SCK Instruction 8 SI 1 0 7 6 5 Data Byte 1 4 3 2 1 0 9th Bit of Address CS 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 SCK SI 7 6 Data Byte 2 5 4 3 2 1 0 7 6 Data Byte 3 5 4 3 2 1 0 6 5 Data Byte N 4 3 2 1 0 FIGURE 9. WRITE MEMORY SEQUENCE Operational Notes The device powers-up in the following state: 1. The device is in the low power standby state. 2. A HIGH to LOW transition on CS is required to enter an active state and receive an instruction. 3. SO pin is high impedance. 4. The Write Enable Latch is reset. 5. The Flag Bit is reset. 6. Reset Signal is active for tPURST. Data Protection The following circuitry has been included to prevent inadvertent writes: • A WREN instruction must be issued to set the Write Enable Latch. • CS must come HIGH at the proper clock count in order to start a nonvolatile write cycle. • Block Protect bits provide additional level of write protection for the memory array. • The WP pin LOW blocks nonvolatile write operations. 12 FN8126.1 September 16, 2005 X5043, X5045 Absolute Maximum Ratings Recommended Operating Conditions Temperature under bias . . . . . . . . . . . . . . . . . . . . . .-65°C to +135°C Storage temperature . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C Voltage on any pin with respect to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -1.0V to +7V D.C. output current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5mA Lead temperature (soldering, 10 seconds) . . . . . . . . . . . . . . . 300°C Temperature: Commercial. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to +70°C Industrial . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C Supply Voltage: -2.7, -2.7A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.7V to 5.5V Blank, -4.5A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.5V to 5.5V CAUTION: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only; functional operation of the device (at these or any other conditions above those listed in the operational sections of this specification) is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. DC Electrical Specifications (Over the recommended operating conditions unless otherwise specified.) LIMITS SYMBOL PARAMETER TEST CONDITIONS/COMMENTS MIN TYP(2) MAX UNIT ICC1 VCC Write Current (Active) SCK = 3.3MHz(3); SO, RESET, RESET = Open 3 mA ICC2 VCC Read Current (Active) SCK = 3.3MHz(3); SI = VSS, RESET, RESET = Open 2 mA ISB1 VCC Standby Current WDT = OFF CS = VCC, SCK, SI = VSS, VCC = 5.5V 10 µA ISB2 VCC Standby Current WDT = ON CS = VCC, SCK, SI = VSS, VCC = 5.5V 50 µA ILI Input Leakage Current SCK, SI, WP = VSS to VCC 0.1 10 µA ILO 0.1 10 µA Output Leakage Current SO, RESET, RESET = VSS to VCC (1) Input LOW Voltage SCK, SI, WP, CS -0.5 VCC x 0.3 V (1) Input HIGH Voltage SCK, SI, WP, CS VCC x 0.7 VCC + 0.5 V VOL Output LOW Voltage (SO) IOL = 2mA @ VCC = 2.7V IOL = 0.5mA @ VCC = 1.8V 0.4 V VOH1 Output HIGH Voltage (SO) VCC > 3.3V, IOH = –1.0mA VCC - 0.8 V VOH2 Output HIGH Voltage (SO) 2V < VCC ≤ 3.3V, IOH = –0.4mA VCC - 0.4 V VOH3 Output HIGH Voltage (SO) VCC ≤ 2V, IOH = –0.25mA VCC - 0.2 V VOLRS Output LOW Voltage (RESET, RESET) IOL = 1mA VIL VIH Capacitance COUT CIN (2) V TA = +25°C, f = 1MHz, VCC = 5V SYMBOL (2) 0.4 TEST Output Capacitance (SO, RESET, RESET) Input Capacitance (SCK, SI, CS, WP) CONDITIONS MAX UNIT VOUT = 0V 8 pF VIN = 0V 6 pF NOTES: 1. VIL min. and VIH max. are for reference only and are not tested. 2. This parameter is periodically sampled and not 100% tested. 3. SCK frequency measured from VCC x 0.1/VCC x 0.9 13 FN8126.1 September 16, 2005 X5043, X5045 Equivalent A.C. Load Circuit at 5V VCC 5V A.C. Test Conditions 5V 4.6kΩ 1.64kΩ Output Input pulse levels VCC x 0.1 to VCC x 0.9 Input rise and fall times 10ns Input and output timing level VCC x 0.5 RESET/RESET 1.64kΩ 30pF 30pF AC Electrical Specifications (Over recommended operating conditions, unless otherwise specified) 2.7V–5.5V SYMBOL PARAMETER MIN MAX UNIT 0 3.3 MHz DATA INPUT TIMING fSCK Clock Frequency tCYC Cycle Time 300 ns tLEAD CS Lead Time 150 ns tLAG CS Lag Time 150 ns tWH Clock HIGH Time 130 ns tWL Clock LOW Time 130 ns tSU Data Setup Time 30 ns tH Data Hold Time 30 ns tRI(4) Input Rise Time 2 µs tFI(4) Input Fall Time 2 µs tCS CS Deselect Time tWC(5) Write Cycle Time 100 ns 10 ms MIN MAX UNIT 0 3.3 MHz Data Output Timing 2.7–5.5V SYMBOL PARAMETER fSCK Clock Frequency tDIS Output Disable Time 150 ns Output Valid from Clock Low 120 ns tV tHO 0 ns Output Rise Time 50 ns (4) Output Fall Time 50 ns tRO tFO Output Hold Time (4) NOTES: 4. This parameter is periodically sampled and not 100% tested. 5. tWC is the time from the rising edge of CS after a valid write sequence has been sent to the end of the self-timed internal nonvolatile write cycle. 14 FN8126.1 September 16, 2005 X5043, X5045 Serial Output Timing CS tCYC tWH tLAG SCK tV MSB Out SO SI tHO tWL tDIS MSB–1 Out LSB Out ADDR LSB IN Serial Input Timing tCS CS tLEAD tLAG SCK tSU tH MSB In SI tRI tFI LSB In High Impedance SO Symbol Table WAVEFORM INPUTS OUTPUTS Must be steady Will be steady May change from LOW to HIGH Will change from LOW to HIGH May change from HIGH to LOW Will change from HIGH to LOW Don’t Care: Changes Allowed Changing: State Not Known N/A Center Line is High Impedance 15 FN8126.1 September 16, 2005 X5043, X5045 Power-Up and Power-Down Timing VCC VTRIP VTRIP tPURST 0 Volts tPURST tF tR tRPD RESET (X5043) RESET (X5045) RESET Output Timing SYMBOL PARAMETER MIN TYP MAX UNIT VTRIP Reset Trip Point Voltage, (-4.5A) Reset Trip Point Voltage, (Blank) Reset Trip Point Voltage, (-2.7A) Reset Trip Point Voltage, (-2.7) 4.5 4.25 2.85 2.55 4.62 4.38 2.92 2.62 4.75 4.5 3.0 2.7 V tPURST Power-up Reset Time Out 100 200 400 ms 500 ns tRPD tF (6) VCC Detect to Reset/Output (6) VCC Fall Time 10 µs (6) VCC Rise Time 0.1 ns Reset Valid VCC 1 V tR VRVALID NOTE: 6. This parameter is periodically sampled and not 100% tested. CS/WDI vs. RESET/RESET Timing CS/WDI tCST RESET (5043) tWDO tRST tWDO tRST RESET (5045) RESET/RESET Output Timing SYMBOL MIN TYP MAX UNIT Watchdog Time Out Period, WD1 = 1, WD0 = 1 (default) WD1 = 1, WD0 = 0 WD1 = 0, WD0 = 1 WD1 = 0, WD0 = 0 100 450 1 OFF 200 600 1.4 300 800 2 ms ms sec tCST CS Pulse Width to Reset the Watchdog 400 tRST Reset Time Out 100 tWDO PARAMETER 16 ns 200 400 ms FN8126.1 September 16, 2005 X5043, X5045 VTRIP Programming Timing Diagram VCC (VTRIP) VTRIP tTSU tTHD VP WP tVPS tVPH tPCS CS tVPO tRP SCK SI 06h 02h 01h or 03h VTRIP Programming Parameters PARAMETER DESCRIPTION MIN MAX UNIT tVPS VTRIP Program Enable Voltage Setup time 1 µs tVPH VTRIP Program Enable Voltage Hold time 1 µs tPCS VTRIP Programming CS inactive time 1 µs tTSU VTRIP Setup time 1 µs tTHD VTRIP Hold (stable) time 10 ms tWC VTRIP Write Cycle Time tVPO VTRIP Program Enable Voltage Off time (Between successive adjustments) 0 µs tRP VTRIP Program Recovery Period (Between successive adjustments) 10 ms VP Programming Voltage 15 18 V VTRIP Programmed Voltage Range 1.7 4.75 V VTRIP Program variation after programming (0-75°C). (Programmed at 25°C.) -25 +25 mV VTRAN Vtv 10 ms VTRIP programming parameters are periodically sampled and are not 100% tested. 17 FN8126.1 September 16, 2005 X5043, X5045 Packaging Information 8-Lead Miniature Small Outline Gull Wing Package Type M 0.118 ± 0.002 (3.00 ± 0.05) 0.012 + 0.006 / -0.002 (0.30 + 0.15 / -0.05) 0.0256 (0.65) Typ. R 0.014 (0.36) 0.118 ± 0.002 (3.00 ± 0.05) 0.030 (0.76) 0.0216 (0.55) 0.036 (0.91) 0.032 (0.81) 0.040 ± 0.002 (1.02 ± 0.05) 7° Typ. 0.008 (0.20) 0.004 (0.10) 0.0256" Typical 0.150 (3.81) Ref. 0.193 (4.90) Ref. 0.007 (0.18) 0.005 (0.13) 0.025" Typical 0.220" FOOTPRINT 0.020" Typical 8 Places NOTE: 1. ALL DIMENSIONS IN INCHES AND (MILLIMETERS) 18 FN8126.1 September 16, 2005 X5043, X5045 Packaging Information 8-Lead Plastic Dual In-Line Package Type P 0.430 (10.92) 0.360 (9.14) 0.260 (6.60) 0.240 (6.10) Pin 1 Index Pin 1 0.300 (7.62) Ref. Half Shoulder Width On All End Pins Optional 0.145 (3.68) 0.128 (3.25) Seating Plane 0.025 (0.64) 0.015 (0.38) 0.065 (1.65) 0.045 (1.14) 0.150 (3.81) 0.125 (3.18) 0.110 (2.79) 0.090 (2.29) .073 (1.84) Max. Typ. 0.010 (0.25) 0.060 (1.52) 0.020 (0.51) 0.020 (0.51) 0.016 (0.41) 0.325 (8.25) 0.300 (7.62) 0° 15° NOTE: 1. ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS) 2. PACKAGE DIMENSIONS EXCLUDE MOLDING FLASH 19 FN8126.1 September 16, 2005 X5043, X5045 Packaging Information 8-Lead Plastic Small Outline Gull Wing Package Type S 0.150 (3.80) 0.228 (5.80) 0.158 (4.00) 0.244 (6.20) Pin 1 Index Pin 1 0.014 (0.35) 0.019 (0.49) 0.188 (4.78) 0.197 (5.00) (4X) 7° 0.053 (1.35) 0.069 (1.75) 0.004 (0.19) 0.010 (0.25) 0.050 (1.27) 0.010 (0.25) X 45° 0.020 (0.50) 0.050"Typical 0.050" Typical 0° - 8° 0.0075 (0.19) 0.010 (0.25) 0.250" 0.016 (0.410) 0.037 (0.937) FOOTPRINT 0.030" Typical 8 Places NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS) 20 FN8126.1 September 16, 2005 X5043, X5045 Packaging Information 14-Lead Plastic, TSSOP, Package Type V .025 (.65) BSC .169 (4.3) .252 (6.4) BSC .177 (4.5) .193 (4.9) .200 (5.1) .047 (1.20) .0075 (.19) .0118 (.30) .002 (.05) .006 (.15) .010 (.25) Gage Plane 0° - 8° Seating Plane .019 (.50) .029 (.75) Detail A (20X) .031 (.80) .041 (1.05) See Detail “A” NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS) All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 21 FN8126.1 September 16, 2005