ETC XC17S200XLPD8C

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DS030 (v1.5) April 4, 2000
Spartan Family of PROMs
0
5*
Product Specification
Introduction
Spartan PROM Features
The Spartan™ family of PROMs provide an easy-to-use,
cost-effective method for storing Spartan device configuration bitstreams.
•
When the Spartan device is in Master Serial mode, it generates a configuration clock that drives the Spartan PROM.
A short access time after the rising clock edge, data
appears on the PROM DATA output pin that is connected to
the Spartan device DIN pin. The Spartan device generates
the appropriate number of clock pulses to complete the
configuration. Once configured, it disables the PROM.
When a Spartan device is in Slave Serial mode, the PROM
and the Spartan device must both be clocked by an incoming signal.
•
•
•
•
•
•
•
Configuration one-time programmable (OTP) read-only
memory designed to store configuration bitstreams for
Spartan, Spartan-XL, and Spartan-II FPGA devices
Simple interface to the Spartan device requires only
one user I/O pin
Programmable reset polarity (active High or active Low)
Low-power CMOS floating gate process
Available in 5V and 3.3V versions
Available in compact plastic 8-pin DIP, 8-pin VOIC, or
20-pin SOIC (XC17S40 only) packages.
Programming support by leading programmer
manufacturers.
Design support using the Xilinx Alliance and
Foundation series software packages.
For device programming, either the Xilinx Alliance or the
Foundation series development systems compiles the
Spartan device design file into a standard HEX format
which is then transferred to most commercial PROM programmers.
Spartan FPGA
Configuration Bits
Compatible Spartan PROM
XCS05
53,984
XC17S05
XCS05XL
54,544
XC17S05XL
XCS10
95,008
XC17S10
XCS10XL
95,752
XC17S10XL
XC2S15
197,728
XC17S15XL
XCS20
178,144
XC17S20
XCS20XL
179,160
XC17S20XL
XCS30
247,968
XC17S30
XCS30XL
249,168
XC17S30XL
XC2S30
336,768
XC17S30XL
XCS40
329,312
XC17S40
XCS40XL
330,696
XC17S40XL
XC2S50
559,232
XC17S50XL
XC2S100
781,248
XC17S100XL
XC2S150
1,040,128
XC17S150XL
XC2S200
1,335,872
XC17S200XL
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Spartan Family of PROMs
Pin Description
Table 1: Spartan PROM Pinouts
Pin Name
8-pin
PDIP & VOIC
20-pin
SOIC
DATA
1
1
Data output, 3-stated when either CE or OE are inactive. During programming, the DATA pin is I/O. Note that OE can be programmed to
be either active High or active Low.
CLK
2
3
Each rising edge on the CLK input increments the internal address
counter, if both CE and OE are active.
Pin Description
When High, this input holds the address counter reset and 3-states
the DATA output. The polarity of this input pin is programmable as either RESET/OE or OE/RESET. To avoid confusion, this document
describes the pin as RESET/OE, although the opposite polarity is
possible on all devices. When RESET is active, the address counter
is held at zero, and the DATA output is 3-stated. The polarity of this
input is programmable. The default is active High RESET, but the
preferred option is active Low RESET, because it can be driven by
the FPGAs INIT pin.
The polarity of this pin is controlled in the programmer interface. This
input pin is easily inverted using the Xilinx HW-130 programmer software. Third-party programmers have different methods to invert this
pin.
RESET/OE
(OE/RESET)
3
8
CE
4
10
When High, this pin disables the internal address counter, 3-states
the DATA output, and forces the device into low-ICC standby mode.
GND
5
11
GND is the ground connection.
VCC
7, 8
18, 20
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The VCC pins are to be connected to the positive voltage supply.
DS030 (v1.5) April 4, 2000
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Spartan Family of PROMs
Controlling PROMs
Connecting the Spartan device with the PROM:
•
•
•
•
The DATA output of the PROM drives the DIN input of
the lead Spartan device.
The Master Spartan device CCLK output drives the
CLK input of the PROM.
The RESET/OE input of the PROM is driven by the INIT
output of the Spartan device. This connection assures
that the PROM address counter is reset before the start
of any (re)configuration, even when a reconfiguration is
initiated by a VCC glitch. Other methods – such as
driving RESET/OE from LDC or system reset – assume
that the PROM internal power-on-reset is always in step
with the FPGA’s internal power-on-reset, which may not
be a safe assumption.
The CE input of the PROM is driven by the DONE
output of the Spartan device, provided that DONE is not
permanently grounded. Otherwise, LDC can be used to
drive CE, but must then be unconditionally High during
user operation. CE can also be permanently tied Low,
but this keeps the DATA output active and causes an
unnecessary supply current of 10 mA maximum.
FPGA Master Serial Mode Summary
The I/O and logic functions of the Configurable Logic Block
(CLB) and their associated interconnections are established by a configuration program. The program is loaded
either automatically upon power up, or on command,
depending on the state of the Spartan device MODE pin. In
Master Serial mode, the Spartan device automatically
loads the configuration program from an external memory.
The Spartan PROM has been designed for compatibility
with the Master Serial mode.
Programming the FPGA With Counters
Unchanged Upon Completion
When multiple-configurations for a single Spartan device
are stored in a PROM, the OE pin should be tied Low. Upon
power-up, the internal address counters are reset and configuration begins with the first program stored in memory.
Since the OE pin is held Low, the address counters are left
unchanged after configuration is complete. Therefore, to
reprogram the FPGA with another program, the DONE line
is pulled Low and configuration begins at the last value of
the address counters.
This method fails if a user applies RESET during the Spartan device configuration process. The Spartan device
aborts the configuration and then restarts a new configuration, as intended, but the PROM does not reset its address
counter, since it never saw a High level on its OE input. The
new configuration, therefore, reads the remaining data in
the PROM and interprets it as preamble, length count etc.
Since the Spartan device is the Master, it issues the necessary number of CCLK pulses, up to 16 million (224) and
DONE goes High. However, the Spartan device configuration will be completely wrong, with potential contentions
inside the Spartan device and on its output pins. This
method must, therefore, never be used when there is any
chance of external reset during configuration.
Upon power-up or reconfiguration, the Spartan device
enters the Master Serial mode when the MODE pin is Low.
Data is read from the PROM sequentially on a single data
line. Synchronization is provided by the rising edge of the
temporary signal CCLK, which is generated during configuration.
Master Serial mode provides a simple configuration interface. Only a serial data line and two control lines are
required to configure the Spartan device. Data from the
PROM is read sequentially, accessed via the internal
address and bit counters which are incremented on every
valid rising edge of CCLK.
If the user-programmable, dual-function DIN pin on the
Spartan device is used only for configuration, it must still be
held at a defined level during normal operation. The Spartan family takes care of this automatically with an on-chip
default pull-up resistor.
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Spartan Family of PROMs
Spartan
Master Serial
3.3V
VCC
MODE
4.7K
VCC
DIN
DATA
CCLK
CLK
DONE
CE
INIT
VPP
Spartan
PROM
OE/RESET
(Low Resets the Address Pointer)
CCLK
(Output)
DIN
DOUT
(Output)
DS030_01_040400
Figure 1: Master Serial Mode. The one-time-programmable Spartan PROM supports automatic loading of configuration
programs. An early DONE inhibits the PROM data output one CCLK cycle before the Spartan FPGA I/Os become active.
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Spartan Family of PROMs
Standby Mode
Programming the Spartan Family
PROMs
The PROM enters a low-power standby mode whenever
CE is asserted High. The output remains in a high impedance state regardless of the state of the OE input.
VCC
RESET/
OE
or
OE/
RESET
The devices can be programmed on programmers supplied
by Xilinx or qualified third-party vendors. The user must
ensure that the appropriate programming algorithm and the
latest version of the programmer software are used. The
wrong choice can permanently damage the device.
GND
CE
Address Counter
CLK
TC
EPROM
Cell
Matrix
Output
OE
DATA
DS030_02_011300
Figure 2: Simplified Block Diagram (does not show programming circuit)
Important: Always tie the two VCC pins together in your application.
Table 2: Truth Table for XC17S00 Control Inputs
Control Inputs
Outputs
Internal Address
RESET
CE
DATA
Icc
Inactive
Low
If address < TC: increment
If address > TC: don’t change
Active
3-state
Active
Reduced
Active
Low
Held reset
3-state
Active
Inactive
High
Not changing
3-state
Standby
Active
High
Held reset
3-state
Standby
Notes: 1. The XC17S00 RESET input has programmable polarity
2. TC = Terminal Count = highest address value. TC+1 = address 0.
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Spartan Family of PROMs
XC17S05, XC17S10, XC17S20, XC17S30, XC17S40
Absolute Maximum Ratings
Symbol
Description
Value
Units
–0.5 to +7.0
V
VCC
Supply voltage relative to GND
VIN
Input voltage relative to GND
–0.5 to VCC +0.5
V
VTS
Voltage applied to 3-state output
–0.5 to VCC +0.5
V
TSTG
Storage temperature (ambient)
–65 to +150
°C
TSOL
Maximum soldering temperature (10 s @ 1/16 in.)
+260
°C
Note:
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those listed under
Operating Conditions is not implied. Exposure to Absolute Maximum Ratings conditions for extended periods of time may
affect device reliability.
Operating Conditions
Symbol
VCC
Note:
Description
Min
Max
Units
Commercial
Supply voltage relative to GND (TA = 0°C to +70°C)
4.75
5.25
V
Industrial
Supply voltage relative to GND (TA = –40°C to +85°C)
4.50
5.50
V
During normal read operation both VCC pins must be connected together.
DC Characteristics Over Operating Condition
Symbol
Description
Min
Max
Units
VIH
High-level input voltage
2.0
VCC
V
VIL
Low-level input voltage
0
0.8
V
VOH
High-level output voltage (IOH = –4 mA)
VOL
Low-level output voltage (IOL = +4 mA)
VOH
High-level output voltage (IOH = –4 mA)
VOL
Low-level output voltage (IOL = +4 mA)
0.37
V
ICCA
Supply current, active mode (at maximum frequency)
10.0
mA
ICCS
Supply current, standby mode
XC17S05, XC17S10,
XC17S20, XC17S30
50.0
µA
XC17S40
100.0
µA
10.0
µA
Commercial
3.86
V
0.32
Industrial
3.76
V
V
IL
Input or output leakage current
CIN
Input Capacitance (VIN = GND, f = 1.0 MHz)
10.0
pF
COUT
Output Capacitance (VIN = GND, f = 1.0 MHz)
10.0
pF
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–10.0
DS030 (v1.5) April 4, 2000
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Spartan Family of PROMs
XC17S05XL, XC17S10XL, XC17S15XL, XC17S20XL, XC17S30XL,
XC17S40XL, XC17S50XL, XC17S100XL, XC17S150XL, XC17S200XL
Absolute Maximum Ratings
Symbol
Description
Value
Units
–0.5 to +4.0
V
VCC
Supply voltage relative to GND
VIN
Input voltage with respect to GND
–0.5 to VCC +0.5
V
VTS
Voltage applied to 3-state output
–0.5 to VCC +0.5
V
TSTG
Storage temperature (ambient)
–65 to +150
°C
TSOL
Maximum soldering temperature (10 s @ 1/16 in.)
+260
°C
Note: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or any other conditions beyond those listed under Operating
Conditions is not implied. Exposure to Absolute Maximum Ratings conditions for extended periods of time may affect device
reliability.
Operating Conditions
Symbol
VCC
Note:
Description
Min
Max
Units
Commercial
Supply voltage relative to GND (TA = 0°C to +70°C)
3.0
3.6
V
Industrial
Supply voltage relative to GND (TA = –40°C to +85°C)
3.0
3.6
V
During normal read operation both VCC pins must be connected together.
DC Characteristics Over Operating Condition
Symbol
Description
Min
Max
Units
VIH
High-level input voltage
2.0
VCC
V
VIL
Low-level input voltage
0
0.8
V
VOH
High-level output voltage (IOH = –3 mA)
VOL
Low-level output voltage (IOL = +3 mA)
0.4
V
ICCA
Supply current, active mode (at maximum frequency)
5.0
mA
ICCS
Supply current, standby mode
50.0
µA
IL
Input or output leakage current
10.0
µA
CIN
Input Capacitance (VIN = GND, f = 1.0 MHz)
10.0
pF
COUT
Output Capacitance (VIN = GND, f = 1.0 MHz)
10.0
pF
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2.4
–10.0
V
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Spartan Family of PROMs
AC Characteristics Over Operating Condition
CE
TSCE
TSCE
THCE
RESET/OE
THC
TLC
THOE
TCYC
CLK
TOE
TCE
TCAC
TDF
TOH
DATA
TOH
DS0306_03_011300
Symbol
Description
Min
Max
Units
TOE
RESET/OE to Data Delay
45
ns
TCE
CE to Data Delay
60
ns
TCAC
CLK to Data Delay
80
ns
(2)
TOH
Data Hold From CE, RESET/OE, or CLK
TDF
CE or RESET/OE to Data Float Delay
(2,3)
TCYC
Clock Periods
(2)
0
ns
50
ns
100
ns
50
ns
TLC
CLK Low Time
THC
CLK High Time (2)
50
ns
TSCE
CE Setup Time to CLK (to guarantee proper counting)
25
ns
THCE
CE Hold Time to CLK (to guarantee proper counting)
0
ns
THOE
RESET/OE Hold Time (guarantees counters are reset)
25
ns
Notes: 1. AC test load = 50 pF
2. Guaranteed by design, not tested.
3. Float delays are measured with 5 pF AC loads. Transition is measured at ±200 mV from steady state active levels.
4. All AC parameters are measured with V IL = 0.0V and VIH = 3.0V.
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DS030 (v1.5) April 4, 2000
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Spartan Family of PROMs
Ordering Information
XC17S20XL VO8
C
Device Number
XC17S05
XC17S05XL
XC17S10
XC17S10XL
XC17S15XL
XC17S20
XC17S20XL
XC17S30
XC17S30XL
XC17S40
XC17S40XL
XC17S50XL
XC17S100XL
XC17S150XL
XC17S200XL
Operating Range/Processing
C = Commercial (TA = 0°C to +70°C)
I = Industrial (TA = –40°C to +85°C)
Package Type
PD8 = 8-pin Plastic DIP
VO8 = 8-pin Plastic Small-Outline Thin Package
SO20 = 20-pin Plastic Small-Outline Package
Valid Ordering Combinations
Spartan 5V
Spartan 5V
Spartan 3.3V
Spartan 3.3V
Spartan3.3V
XC17S05PD8C
XC17S20PD8C
XC17S05XLPD8C
XC17S20XLPD8C
XC17S50XLPD8C
XC17S05VO8C
XC17S20VO8C
XC17S05XLVO8C
XC17S20XLVO8C
XC17S50XLSO20C
XC17S05PD8I
XC17S20PD8I
XC17S05XLPD8I
XC17S20XLPD8I
XC17S50XLPD8I
XC17S05VO8I
XC17S20VO8I
XC17S05XLVO8I
XC17S20XLVO8I
XC17S50XLSO20I
XC17S10PD8C
XC17S30PD8C
XC17S10XLPD8C
XC17S30XLPD8C
XC17S100XLPD8C
XC17S10VO8C
XC17S30VO8C
XC17S10XLVO8C
XC17S30XLVO8C
XC17S100XLSO20C
XC17S10PD8I
XC17S30PD8I
XC17S10XLPD8I
XC17S30XLPD8I
XC17S100XLPD8I
XC17S10VO8I
XC17S30VO8I
XC17S10XLVO8I
XC17S30XLVO8I
XC17S100XLSO20I
XC17S40PD8C
XC17S15XLPD8C
XC17S40XLPD8C
XC17S150XLPD8C
XC17S40SO20C
XC17S15XLVO8C
XC17S40XLSO20C
XC17S150XLSO20C
XC17S40PD8I
XC17S15XLPD8I
XC17S40XLVO8C*
XC17S150XLPD8I
XC17S40SO20I
XC17S15XLVO8I
XC17S40XLPD8I
XC17S150XLSO20I
XC17S40XLSO20I
XC17S40XLVO8I*
XC17S200XLPD8C
XC17S200XLSO20C
XC17S200XLPD8I
XC17S200XLSO20I
* In development
DS030 (v1.5) April 4, 2000
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Spartan Family of PROMs
Marking Information
Due to the small size of the PROM package, the complete ordering part number cannot be marked on the package. The XC
prefix is deleted and the package code is simplified. Device marking is as follows.
17S20L V C
Device Number
XC17S05
XC17S05L
XC17S10
XC17S10L
XC17S15L
XC17S20
XC17S20L
XC17S30
XC17S30L
XC17S40
XC17S40L
XC17S50L
XC17S100L
XC17S150L
XC17S200L
Package Type
P
V
S
Operating Range/Processing
C = Commercial (TA = 0°C to +70°C)
I = Industrial (TA = –40°C to +85°C)
= 8-pin Plastic DIP
= 8-pin Plastic Small-Outline Thin Package
= 20-pin Plastic Small-Outline Package
Note: When marking the device number on the XL parts, an L is used in place of an XL.
Revision Control
Date
Revision
Revision
7/14/98
1.1
Cosmetic edits for pages 1, 2, 3 & 4.
9/8/98
1.2
Clarified the SPARTAN FPGA and PROM interface by removing references to CEO pin. Removed the ESD notation in Absolute Maximum table since it is now included in Xilinx’s Reliability
Monitor Report.
01/20/00
1.3
Added additional Spartan-XL parts, changed SPROM to PROM.
02/18/00
1.4
Changed device ordering numbers, added 4.7K resistor to OE/RESET in Figure 1.
04/04/00
1.5
Added XC17S200XL PROM for Spartan XC2S200.
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DS030 (v1.5) April 4, 2000