X-Ref Target - Figure 0 R Spartan/XL Family One-Time Programmable Configuration PROMs (XC17S00/XL) DS030 (v1.12) June 20, 2008 Product Specification Features • Configuration one-time programmable (OTP) read-only memory designed to store configuration bitstreams for Spartan®, and Spartan-XL FPGAs • Simple interface to the Spartan device requires only one user I/O pin • Programmable reset polarity (active High or active Low) • Low-power CMOS floating-gate process • Available in 5V and 3.3V versions • Available in compact plastic 8-pin DIP, 8-pin VOIC, or 20-pin SOIC packages • Programming support by leading programmer manufacturers • Lead-free (RoHS-compliant) packaging available • Design support using the Xilinx® Alliance and Foundation™ series software packages • Guaranteed 20 year life data retention Introduction The Spartan family of PROMs provides an easy-to-use, cost-effective method for storing Spartan device configuration bitstreams. When the Spartan device is in Master Serial mode, it generates a configuration clock that drives the Spartan FPGA PROM. A short access time after the rising clock edge, data appears on the PROM DATA output pin that is connected to the Spartan device DIN pin. The Spartan device generates the appropriate number of clock pulses to complete the configuration. Once configured, it disables the PROM. When a Spartan device is in Slave Serial mode, the PROM and the Spartan device must both be clocked by an incoming signal. For device programming, either the Xilinx Alliance or the Foundation series development systems compiles the Spartan device design file into a standard HEX format which is then transferred to most commercial PROM programmers. Spartan FPGA Configuration Bits Compatible Spartan PROM XCS05 53,984 XC17S05 XCS05XL 54,544 XC17S05XL XCS10 95,008 XC17S10 XCS10XL 95,752 XC17S10XL XCS20 178,144 XC17S20 XCS20XL 179,160 XC17S20XL XCS30 247,968 XC17S30 XCS30XL 249,168 XC17S30XL XCS40 329,312 XC17S40 XCS40XL 330,696 XC17S40XL XC2S50(1) 559,200 XC17S50XL XC2S100(1) 781,216 XC17S100XL XC2S150(1) 1,040,096 XC17S150XL Notes: 1. For new Spartan-II FPGA designs, it is recommended to use the 17S00A family. © Copyright 1998-2008 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE and other designated brands included herein are trademarks of Xilinx in the United States and other countries. All other trademarks are the property of their respective owners. DS030 (v1.12) June 20, 2008 Product Specification www.xilinx.com 1 R Spartan/XL Family One-Time Programmable Configuration PROMs (XC17S00/XL) Pin Description Pins not listed are in Table 1 are "no connects." Table 1: Spartan PROM Pinouts Pin Name 8-pin PDIP (PD8) and VOIC/TSOP (VO8) 20-pin SOIC (SO20) Pin Description DATA 1 1 Data output, High-Z state when either CE or OE are inactive. During programming, the DATA pin is I/O. Note that OE can be programmed to be either active High or active Low. CLK 2 3 Each rising edge on the CLK input increments the internal address counter, if both CE and OE are active. RESET/OE (OE/RESET) 3 8 When High, this input holds the address counter reset and puts the DATA output in a high-impedance state. The polarity of this input pin is programmable as either RESET/OE or OE/RESET. To avoid confusion, this document describes the pin as RESET/OE, although the opposite polarity is possible on all devices. When RESET is active, the address counter is held at zero, and the DATA output is in a high-impedance state. The polarity of this input is programmable. The default is active High RESET, but the preferred option is active Low RESET, because it can be driven by the FPGAs INIT pin. The polarity of this pin is controlled in the programmer interface. This input pin is easily inverted using the Xilinx HW-130 programmer software. Third-party programmers have different methods to invert this pin. CE 4 10 When High, this pin disables the internal address counter, puts the DATA output in a high-impedance state, and forces the device into low-ICC standby mode. GND 5 11 GND is the ground connection. VCC 7, 8 18, 20 The VCC pins are to be connected to the positive voltage supply. Pinout Diagrams DATA(D0) NC CLK NC NC NC NC OE/RESET NC CE 1 2 3 4 5 6 7 8 9 10 SO20 Top View 20 19 18 17 16 15 14 13 12 11 VCC NC VCC NC NC NC NC NC NC GND DATA(D0) CLK OE/RESET CE 1 8 VCC 2 PD8/PDG8 7 VCC SOG8 VO8/VOG8 3 6 Top View 4 5 NC GND DS030_05_060508 DS030_04_110102 DS030 (v1.12) June 20, 2008 Product Specification www.xilinx.com 2 R Spartan/XL Family One-Time Programmable Configuration PROMs (XC17S00/XL) Controlling PROMs Connecting the Spartan device with the PROM: • The DATA output of the PROM drives the DIN input of the lead Spartan device. • The Master Spartan device CCLK output drives the CLK input of the PROM. • The RESET/OE input of the PROM is driven by the INIT output of the Spartan device. This connection assures that the PROM address counter is reset before the start of any (re)configuration, even when a reconfiguration is initiated by a VCC glitch. Other methods—such as driving RESET/OE from LDC or system reset—assume that the PROM internal poweron-reset is always in step with the FPGAs internal power-on-reset, which is not a safe assumption. • The CE input of the PROM is driven by the DONE output of the Spartan device, provided that DONE is not permanently grounded. Otherwise, LDC can be used to drive CE, but must then be unconditionally High during user operation. CE can also be permanently tied Low, but this keeps the DATA output active and causes an unnecessary supply current of 10 mA maximum. FPGA Master Serial Mode Summary The I/O and logic functions of the Configurable Logic Block (CLB) and their associated interconnections are established by a configuration program. The program is loaded either automatically upon power up, or on command, depending on the state of the Spartan device MODE pin. In Master Serial mode, the Spartan device automatically loads the configuration program from an external memory. The Spartan FPGA PROM has been designed for compatibility with the Master Serial mode. Upon power-up or reconfiguration, the Spartan device enters the Master Serial mode when the MODE pin is Low. Data is read from the PROM sequentially on a single data line. Synchronization is provided by the rising edge of the temporary signal CCLK, which is generated during configuration. Master Serial mode provides a simple configuration interface (Figure 1, page 4). Only a serial data line and two control lines are required to configure the Spartan device. Data from the PROM is read sequentially, accessed via the internal address and bit counters which are incremented on every valid rising edge of CCLK. DS030 (v1.12) June 20, 2008 Product Specification If the user-programmable, dual-function DIN pin on the Spartan device is used only for configuration, it must still be held at a defined level during normal operation. The Spartan family takes care of this automatically with an onchip default pull-up resistor. Programming the FPGA With Counters Unchanged Upon Completion When multiple-configurations for a single Spartan device are stored in a PROM, the OE pin should be tied Low. Upon power-up, the internal address counters are reset and configuration begins with the first program stored in memory. Since the OE pin is held Low, the address counters are left unchanged after configuration is complete. Therefore, to reprogram the FPGA with another program, the DONE line is pulled Low and configuration begins at the last value of the address counters. This method fails if a user applies RESET during the Spartan device configuration process. The Spartan device aborts the configuration and then restarts a new configuration, as intended, but the PROM does not reset its address counter, since it never saw a High level on its OE input. The new configuration, therefore, reads the remaining data in the PROM and interprets it as preamble, length count etc. Since the Spartan device is the Master, it issues the necessary number of CCLK pulses, up to 16 million (224) and DONE goes High. However, the Spartan device configuration will be completely wrong, with potential contentions inside the Spartan device and on its output pins. This method must, therefore, never be used when there is any chance of external reset during configuration. Standby Mode The PROM enters a low-power standby mode whenever CE is asserted High. The output remains in a high-impedance state regardless of the state of the OE input. Programming the Spartan Family PROMs The devices can be programmed on programmers supplied by Xilinx or qualified third-party vendors. The user must ensure that the appropriate programming algorithm and the latest version of the programmer software are used. The wrong choice can permanently damage the device. www.xilinx.com 3 R Spartan/XL Family One-Time Programmable Configuration PROMs (XC17S00/XL) X-Ref Target - Figure 1 Spartan Master Serial 3.3V VCC MODE 4.7K VCC DIN CCLK CLK DONE CE INIT VCC DATA Spartan PROM OE/RESET (Low Resets the Address Pointer) CCLK (Output) DIN DOUT (Output) DS030_01_101001 Figure 1: Master Serial Mode Note: The one-time-programmable Spartan PROM supports automatic loading of configuration programs. An early DONE inhibits the PROM data output one CCLK cycle before the Spartan FPGA I/Os become active. DS030 (v1.12) June 20, 2008 Product Specification www.xilinx.com 4 R Spartan/XL Family One-Time Programmable Configuration PROMs (XC17S00/XL) X-Ref Target - Figure 2 VCC RESET/ OE or OE/ RESET GND CE Address Counter CLK EPROM Cell Matrix TC Output OE DATA DS030_02_011300 Figure 2: Simplified Block Diagram (Does not Show Programming Circuit) Caution! Always tie the two VCC pins together in the application. Table 2: Truth Table for XC17S00 Control Inputs Control Inputs RESET(1) CE Inactive Low Active Low Inactive Active High High Internal Address(2) Outputs DATA ICC If address < TC: increment If address > TC: don’t change Active High-Z Active Reduced Held reset High-Z Active Not changing High-Z(3) Standby Held reset High-Z(3) Standby Notes: 1. 2. 3. The XC17S00 RESET input has programmable polarity. TC = Terminal Count = highest address value. TC + 1 = address 0. Pull DATA pin to GND or VCC to meet ICCS standby current. DS030 (v1.12) June 20, 2008 Product Specification www.xilinx.com 5 R Spartan/XL Family One-Time Programmable Configuration PROMs (XC17S00/XL) XC17S05, XC17S10, XC17S20, XC17S30, XC17S40 Absolute Maximum Ratings(1) Symbol Description Value Units –0.5 to +7.0 V VCC Supply voltage relative to GND VIN Input voltage relative to GND –0.5 to VCC +0.5 V VTS Voltage applied to High-Z output –0.5 to VCC +0.5 V TSTG Storage temperature (ambient) –65 to +150 °C +125 °C TJ Junction temperature Notes: 1. Stresses beyond those listed under Absolute Maximum Ratings can cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those listed under Operating Conditions is not implied. Exposure to Absolute Maximum Ratings conditions for extended periods of time can affect device reliability. Operating Conditions(1) Symbol VCC Description Commercial Industrial Conditions Min Max Units Supply voltage relative to GND (TA = 0°C to +70°C) 4.75 5.25 V Supply voltage relative to GND (TA = –40°C to +85°C) 4.50 5.50 V Min Max Units Notes: 1. During normal read operation both VCC pins must be connected together. DC Characteristics Over Operating Condition Symbol Description VIH High-level input voltage 2.0 VCC V VIL Low-level input voltage 0 0.8 V VOH High-level output voltage (IOH = –4 mA) 3.86 – V VOL Low-level output voltage (IOL = +4 mA) – 0.32 V VOH High-level output voltage (IOH = –4 mA) 3.76 – V VOL Low-level output voltage (IOL = +4 mA) – 0.37 V ICCA Supply current, active mode (at maximum frequency) 10 mA – 20 mA XC17S05, XC17S10, XC17S20, XC17S30 – 50(1) μA XC17S40 – 100(1) μA –10 10 μA Input Capacitance (VIN = GND, f = 1.0 MHz) – 10 pF Output Capacitance (VIN = GND, f = 1.0 MHz) – 10 pF ICCS IL CIN COUT Commercial Industrial XC17S05, XC17S10, XC17S20, XC17S30 XC17S40 Supply current, standby mode Input or output leakage current Notes: 1. ICCS standby current is specified for DATA pin that is pulled to VCC or GND. DS030 (v1.12) June 20, 2008 Product Specification www.xilinx.com 6 R Spartan/XL Family One-Time Programmable Configuration PROMs (XC17S00/XL) XC17S05XL, XC17S10XL, XC17S20XL, XC17S30XL, XC17S40XL, XC17S50XL, XC17S100XL, XC17S150XL Absolute Maximum Ratings(1) Symbol Description Value Units –0.5 to +4.0 V VCC Supply voltage relative to GND VIN Input voltage with respect to GND –0.5 to VCC +0.5 V VTS Voltage applied to High-Z output –0.5 to VCC +0.5 V TSTG Storage temperature (ambient) –65 to +150 °C Notes: 1. Stresses beyond those listed under Absolute Maximum Ratings can cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those listed under Operating Conditions is not implied. Exposure to Absolute Maximum Ratings conditions for extended periods of time can affect device reliability. Operating Conditions(1) Symbol VCC Description Commercial Industrial Min Max Units Supply voltage relative to GND (TA = 0°C to +70°C) 3.0 3.6 V Supply voltage relative to GND (TA = –40°C to +85°C) 3.0 3.6 V Min Max Units Notes: 1. During normal read operation both VCC pins must be connected together. DC Characteristics Over Operating Condition Symbol Description VIH High-level input voltage 2.0 VCC V VIL Low-level input voltage 0 0.8 V VOH High-level output voltage (IOH = –3 mA) 2.4 – V VOL Low-level output voltage (IOL = +3 mA) – 0.4 V ICCA Supply current, active mode (at maximum frequency) – 5 mA ICCS Supply current, standby mode – 50(1) μA IL Input or output leakage current –10 10 μA Input Capacitance (VIN = GND, f = 1.0 MHz) – 10 pF Output Capacitance (VIN = GND, f = 1.0 MHz) – 10 pF CIN COUT Notes: 1. ICCS standby current is specified for DATA pin that is pulled to VCC or GND. DS030 (v1.12) June 20, 2008 Product Specification www.xilinx.com 7 R Spartan/XL Family One-Time Programmable Configuration PROMs (XC17S00/XL) AC Characteristics over Operating Condition(1) CE TSCE TSCE THCE RESET/OE TLC THC THOE TCYC CLK TOE TCE TCAC TDF TOH DATA TOH DS0306_03_011300 Symbol Description Min Max Units TOE RESET/OE to Data Delay – 45 ns TCE CE to Data Delay – 60 ns TCAC CLK to Data Delay – 80 ns 0 – ns – 50 ns TOH TDF TCYC Data Hold From CE, RESET/OE, or CE or RESET/OE to Data Float CLK(2) Delay(2,3) 100 – ns CLK Low Time(2) 50 – ns THC CLK High Time(2) 50 – ns TSCE CE Setup Time to CLK (to guarantee proper counting) 25 – ns THCE CE Hold Time to CLK (to guarantee proper counting) 0 – ns THOE RESET/OE Hold Time (guarantees counters are reset) 25 – ns TLC Clock Periods Notes: 1. 2. 3. 4. AC test load = 50 pF. Guaranteed by design, not tested. Float delays are measured with 5 pF AC loads. Transition is measured at ±200 mV from steady state active levels. All AC parameters are measured with VIL = 0.0V and VIH = 3.0V. DS030 (v1.12) June 20, 2008 Product Specification www.xilinx.com 8 R Spartan/XL Family One-Time Programmable Configuration PROMs (XC17S00/XL) Ordering Information XC17S20XL VO8 C Device Number Operating Range/Processing XC17S05 XC17S05XL XC17S10 XC17S10XL XC17S20 XC17S20XL XC17S30 XC17S30XL XC17S40 XC17S40XL XC17S50XL XC17S100XL XC17S150XL C = Commercial (TA = 0°C to +70°C) I = Industrial (TA = –40°C to +85°C) Package Type(1) PD8/PDG08 = 8-pin Plastic DIP VO8/VOG8 = 8-pin Plastic Small-Outline Thin Package SOG8 = 8-pin Plastic Small-Outline Package SO20 = 20-pin Plastic Small-Outline Package Notes: 1. G in the package-type codes designates Lead-free packaging. Spartan 5V Valid Ordering Combinations (XC17S00) XC17S05PD8C XC17S10PD8C XC17S20PD8C XC17S30PD8C XC17S40PD8C XC17S05VO8C XC17S10VO8C XC17S20VO8C XC17S30VO8C XC17S40SO20C XC17S05PD8I XC17S10VOG8C XC17S20PD8I XC17S30PD8I XC17S40PD8I XC17S05VO8I XC17S10PD8I XC17S20VO8I XC17S30VO8I XC17S40SO20I XC17S10VO8I XC17S30SOG8I Spartan 3.3V Valid Ordering Combinations (XC17S00XL) XC17S05XLPD8C XC17S100XLPD8C XC17S20XLPD8C XC17S40XLPD8C XC17S05XLVO8C XC17S100XLSO20C XC17S20XLVO8C XC17S40XLPDG8C XC17S05XLPD8I XC17S100XLPD8I XC17S20XLVOG8C XC17S40XLSO20C XC17S05XLVO8I XC17S100XLSO20I XC17S20XLPD8I XC17S40XLPD8I XC17S10XLPD8C XC17S150XLPD8C XC17S20XLVO8I XC17S40XLSO20I XC17S10XLPDG8C XC17S150XLSO20C XC17S30XLPD8C XC17S50XLPD8C XC17S10XLVO8C XC17S150XLPD8I XC17S30XLPDG8C XC17S50XLSO20C XC17S10XLVOG8C XC17S150XLSO20I XC17S30XLVO8C XC17S50XLPD8I XC17S10XLPD8I XC17S30XLVOG8C XC17S50XLSO20I XC17S10XLVO8I XC17S30XLPD8I XC17S10XLVOG8I XC17S30XLVO8I XC17S30XLVOG8I DS030 (v1.12) June 20, 2008 Product Specification www.xilinx.com 9 R Spartan/XL Family One-Time Programmable Configuration PROMs (XC17S00/XL) Marking Information Due to the small size of the PROM package, the complete ordering part number cannot be marked on the package. The XC prefix is deleted and the package code is simplified. Device marking is as follows. 17S20L V C Device Number Operating Range/Processing 17S05 17S05L 17S10 17S10L 17S20 17S20L 17S30 17S30L 17S40 17S40L 17S50L 17S100L 17S150L C = Commercial (TA = 0°C to +70°C) I = Industrial (TA = –40°C to +85°C) Package Mark O = 8-pin Plastic Small-Outline Package, Lead-Free P = 8-pin Plastic DIP H = 8-pin Plastic DIP, Lead-Free V = 8-pin Plastic Small-Outline Thin Package G = 8-pin Plastic Small-Outline Thin Package, Lead-Free S = 20-pin Plastic Small-Outline Package Note: When marking the device number on the XL parts, an L is used in place of an XL. Revision History The following table shows the revision history for this document. Date Revision Revision 07/14/98 1.1 Cosmetic edits for pages 1, 2, and 4. 09/08/98 1.2 Clarified the SPARTAN FPGA and PROM interface by removing references to CEO pin. Removed the ESD notation in Absolute Maximum table since it is now included in Xilinx’s Reliability Monitor Report. 01/20/00 1.3 Added additional Spartan-XL parts, changed SPROM to PROM. 02/18/00 1.4 Changed device ordering numbers, added 4.7K resistor to OE/RESET in Figure 1. 04/04/00 1.5 Added XC17S200XL PROM for Spartan XC2S200. 08/06/00 1.6 Updated format. 04/07/01 1.7 Added to features: “Guaranteed 20 year life data retention.” 10/10/01 1.8 Added a note to Table 1. Changed VPP to VCC on Figure 1. 11/04/02 1.9 Updated Table 1, page 2. Updated the template. Added "Pinout Diagrams," page 2. 11/18/02 1.10 Modified document title. DS030 (v1.12) June 20, 2008 Product Specification www.xilinx.com 10 R Spartan/XL Family One-Time Programmable Configuration PROMs (XC17S00/XL) 07/09/07 1.11 • Updated document format. • Left diagram under "Pinout Diagrams," page 2 updated to reflect new Lead-free packaging. • Under "XC17S05, XC17S10, XC17S20, XC17S30, XC17S40," ♦ Deleted parameter TSOL, Maximum Soldering Temperature, under "Absolute Maximum Ratings(1)," page 6. Refer to UG112, Xilinx Device Package User Guide, for package soldering guidelines. ♦ Added note to "DC Characteristics Over Operating Condition," page 6 and corrected XC17S40 ICCA value. • Under "XC17S05XL, XC17S10XL, XC17S20XL, XC17S30XL, XC17S40XL, XC17S50XL, XC17S100XL, XC17S150XL", added note to "DC Characteristics Over Operating Condition," page 7. • Added Lead-free (RoHS-compliant) packages PDG8 and VOG8 to "Ordering Information," page 9. • Added new part numbers to and deleted XC17S200XL from "Spartan 3.3V Valid Ordering Combinations (XC17S00XL)," page 9. • Added new Lead-free package types G and H to "Marking Information," page 10. 06/20/08 1.12 • • • • • • • Updated document template. Updated copyright statement. Added "Notice of Disclaimer," page 11. Added junction temperature to "Absolute Maximum Ratings(1)," page 6. Added support for XC17S30SOG8I. Added new Lead-free package type O to "Marking Information," page 10. Updated "Pinout Diagrams," page 2, "Ordering Information," page 9, and "Spartan 5V Valid Ordering Combinations (XC17S00)," page 9. Notice of Disclaimer THE XILINX HARDWARE FPGA AND CPLD DEVICES REFERRED TO HEREIN (“PRODUCTS”) ARE SUBJECT TO THE TERMS AND CONDITIONS OF THE XILINX LIMITED WARRANTY WHICH CAN BE VIEWED AT http://www.xilinx.com/warranty.htm. THIS LIMITED WARRANTY DOES NOT EXTEND TO ANY USE OF PRODUCTS IN AN APPLICATION OR ENVIRONMENT THAT IS NOT WITHIN THE SPECIFICATIONS STATED IN THE XILINX DATA SHEET. ALL SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE. PRODUCTS ARE NOT DESIGNED OR INTENDED TO BE FAIL-SAFE OR FOR USE IN ANY APPLICATION REQUIRING FAIL-SAFE PERFORMANCE, SUCH AS LIFE-SUPPORT OR SAFETY DEVICES OR SYSTEMS, OR ANY OTHER APPLICATION THAT INVOKES THE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL APPLICATIONS”). USE OF PRODUCTS IN CRITICAL APPLICATIONS IS AT THE SOLE RISK OF CUSTOMER, SUBJECT TO APPLICABLE LAWS AND REGULATIONS. DS030 (v1.12) June 20, 2008 Product Specification www.xilinx.com 11