TOREX XC9105D093DR

XC9103/XC9104/XC9105 Series
ETR0404_003
Ceramic Capacitor Compatible, Step-up DC/DC Controllers
☆GreenOperation Compatible
■GENERAL DESCRIPTION
The XC9103/XC9104/XC9105 series are PWM, PWM/PFM auto switching /manual switching controlled universal step-up
DC/DC converter controllers.
Output will be stable no matter which load capacitors are used but should a low ESR capacitor be used, RSENSE of about 0.1Ω
will be required and phase compensation will be achieved. This allows the use of ceramic capacitors and enables to obtain lower
output ripple and small PCB design. Tantalum and electrolytic capacitors can also be used, in which case, RSENSE becomes
unnecessary.
With 0.9V internal voltage reference and by using externally connected two resistors, output voltage can be set freely within a
range of 1.5V to 30V. The series is available in 300 kHz and 180 kHz frequencies, the size of the external components can be
reduced. 100 kHz and 500 kHz are also available in custom options.
The XC9103 offers PWM operation. The XC9104 offers PWM/PFM automatic switching operation. The PWM operation is shifted to
the PFM operation automatically at light load so that it maintains high efficiency over a wide range of load currents. The XC9105
offers both PWM and PWM/PFM auto switching operations and it can be selected by external signal.
A current limiter circuit is built-in to the IC (except with the 500 kHz version) and monitors the ripple voltage on the FB pin.
Operation is shut down when the ripple voltage is more than 250mV. The operations of the IC can be returned to normal with
a toggle of the CE pin or by turning the power supply back on.
■APPLICATIONS
●PDAs
●Cellular phones
●Palmtop computers
●Portable audio systems
●Various multi-function power supplies
■TYPICAL APPLICATION CIRCUIT
■FEATURES
Input Voltage Range
: 0.9V ~ 10V
Supply Voltage Range : 1.8V ~ 10V
Output Voltage Range : 1.5V ~ 30V
Set freely with the reference voltage
0.9V(±2.0%) and two resistors
Oscillation Frequency : 100, 180, 300, 500kHz (±15%)
180, 300kHz only for XC9103/04/05B
type (with current limiter)
Output Current
: more than 400mA
(VIN=1.8V, VOUT=3.3V)
Controls
: PWM (XC9103)
PWM/PFM auto-switching (XC9104)
PWM/PFM manual switching
(XC9105)
High Efficiency
: 85% (TYP.)
Stand-by Current
: ISTB=1.0μA (MAX.)
Load Capacitors
: Low ESR capacitors compatible
Current
: Operates when
Limiter Function
ripple voltage=250mV
Also available without current limiter
(100kHz and 500kHz types are
available only without current limiter)
Package
: SOT-25, USP-6B
■ TYPICAL PERFORMANCE
CHARACTERISTICS
1/23
XC9103/XC9104/XC9105 Series
■PIN CONFIGURATION
EXT
GND
CE
VDD
FB
FB 6
1 EXT
NC 5
2 VDD
CE 4
3 GND
The dissipation pad for the USP-6B
package should be solder-plated in
recommended mount pattern and metal
masking so as to enhance mounting
strength and heat release.
If the pad needs to be connected to other
pins, it should be connected to the VDD
(No.2) pin.
(TOP VIEW)
■PIN ASSIGNMENT
PIN NUMBER
SOT-25
USP-6B
PIN NAME
FUNCTION
1
6
FB
Output Resistor Connection
2
2
VDD
Supply Voltage
3
4
4
CE
Chip Enable
CE (/PWM)
Serves as both PWM/PFM switching pin and CE pin for XC9105
3
GND
Ground
5
1
EXT
External Transistor Connection
-
5
NC
No Connection
■ PRODUCT CLASSIFICATION
●Ordering Information
XC9103①②③④⑤⑥: PWM Control
XC9104①②③④⑤⑥: PWM/PFM Automatic Switching Control
XC9105①②③④⑤⑥: PWM/PFM Manual Switching Control
DESIGNATOR
DESCRIPTION
①
Type of DC/DC Controller
② ③
Output Voltage
④
2/23
Oscillation Frequency
⑤
Package
⑥
Device Orientation
SYMBOL
B
D
09
DESCRIPTION
3
: With current limiter (180kHz, 300kHz only)
: Without current limiter
: FB voltage (e.g. FB Voltage=0.9V→②=0, ③=9)
: 300kHz
1
: 100kHz
2
: 180kHz
5
M
: 500kHz
: SOT-25 (SOT-23-5)
D
: USP-6B
R
: Embossed tape, standard feed
L
: Embossed tape, reverse feed
XC9103/XC9104/XC9105
Series
■ BLOCK DIAGRAM
■ ABSOLUTE MAXIMUM RATINGS
Ta=25℃
PARAMETER
SYMBOL
RATINGS
UNITS
VDD pin Voltage
VDD
-0.3 ~ 12.0
V
FB pin Voltage
FB
-0.3 ~ 12.0
V
CE pin Voltage
VCE
-0.3 ~ 12.0
V
EXT pin Voltage
VEXT
-0.3 ~ VDD + 0.3
V
IEXT/
±100
mA
EXT pin Current
Power Dissipation
SOT-25
USP-6B
Pd
150
100
mW
Operating Temperature Range
Topr
-40 ~ +85
℃
Storage Temperature Range
Tstg
-40 ~ +125
℃
3/23
XC9103/XC9104/XC9105 Series
■ELECTRICAL CHARACTERISTICS
XC9103B092MR, XC9104B092MR, XC9105B092MR
XC9103D092MR, XC9104D092MR, XC9105D092MR
PARAMETER
SYMBOL
Output Voltage
VOUT
CONDITIONS
VIN=VOUTSETx0.6, VDD=3.3V
IOUT=10mA, Using 2SD1628
MIN.
(FOSC=180kHz)
TYP.
MAX.
Ta=25℃
UNITS
CIRCUIT
①
②
3.234
3.300
3.366
V
1.5
-
30.0
V
Output Voltage Range
VOUTSET
FB Control Voltage
Supply Voltage Range
VFB
0.882
0.900
0.918
V
VDD
1.8
-
10.0
V
-
-
0.9
V
③
-
-
0.8
V
④
-
-
0.7
V
③
153
75
20
45
17
180
81
28
64
24
1.0
207
87
36
μA
μA
μA
kHz
%
%
④
④
⑤
④
④
①
170
250
330
mV
⑥
5.0
0.65
VDD-0.2
-
85
10.0
-
20.0
0.20
VDD-1.0
①
①
⑤
⑤
①
①
-
24
36
%
ms
V
V
V
V
Ω
-
16
24
Ω
④
-
-
0.1
- 0.1
0.1
- 0.1
μA
μA
μA
μA
⑤
⑤
⑤
⑤
(*1)
Operation Start Voltage
Oscillation Start Voltage
(*1)
VST1
VST2
Operation Hold Voltage
VHLD
Supply Current 1
Supply Current 2
Stand-by Current
Oscillation Frequency
Maximum Duty Cycle
PFM Duty Rate
IDD1
IDD2
ISTB
FOSC
MAXDTY
PFMDTY
Overcurrent
Sense Voltage (*3)
VLMT
Efficiency
Soft-Start Time
CE “High” Voltage (*2)
CE “Low” Voltage (*2)
PWM “High” Voltage (*2)
PWM “Low” Voltage (*2)
EXT “High”
On Resistance
EXT “Low”
On Resistance
CE “High Current
CE “Low” Current
FB “High” Current
FB “Low” Current
EFFI
TSS
VCEH
VCEL
VPWMH
VPWML
REXTH
REXTL
ICEH
ICEL
IFBH
IFBL
Recommended circuit using 2SD1628,
IOUT=1.0mA
No external components, CE connected
to VDD, Voltage applied, FB=0V
Recommended circuit using 2SD1628,
IOUT=1.0mA
Same as VST2, VDD=3.3V
Same as IDD1, FB=1.2V
Same as IDD1, CE=0V
Same as IDD1
Same as IDD1
No load
(XC9104B/D, 9105B/D)
Step input to FB (Pulse width: 2.0μS
or more), EXT=Low level voltage
(XC9103B, 9104B, 9105B)
Recommended circuit using XP161A1355
Same as IDD1
Same as IDD1
IOUT=1.0mA
(XC9105B/D)
IOUT=1.0mA
(XC9105B/D)
Same as IDD1, VEXT=VOUT-0.4V
Same as IDD1, VEXT=0.4V
Same as IDD2, CE=VDD
Same as IDD2, CE=0V
Same as IDD2, CE=VDD
Same as IDD2, CE=0V
④
④
Test Conditions: Unless otherwise stated, CL: ceramic, recommended MOSFET should be connected.
VOUT=3.3V, VIN=2.0V, IOUT=170mA
NOTE:
*1 Although the IC starts step-up operations from a VDD of 0.8V, the output voltage and oscillation frequency are stabilized at VDD>1.8V.
Therefore, a VDD of more than 1.8V is recommended when VDD is supplied from VIN or other power sources.
*2 With the XC9105 series, the CE pin also serves as a PWM/PFM switching pin. In operation, PWM control is selected when the voltage
at the CE pin is more than VDD -0.2V. On the other hand, PWM/PFM automatic switching control at a duty = 25% is selected when
the voltage at the CE pin is less than VDD -1.0V and more than VCEH.
*3 The overcurrent limit circuit of this IC is designed to monitor the ripple voltage so please select your external components carefully to
prevent VLMT being reached under low temperature conditions as well as normal operating conditions. Following current limiter
circuit operations, which in turn causes the IC's operations to stop, the operations of the IC can be returned to normal with a toggle of
the CE pin or by turning the power supply back on.
4/23
XC9103/XC9104/XC9105
Series
■ELECTRICAL CHARACTERISTICS (Continued)
XC9103B093MR, XC9104B093MR, XC9105B093MR
XC9103D093MR, XC9104D093MR, XC9105D093MR
PARAMETER
SYMBOL
Output Voltage
VOUT
CONDITIONS
VIN=VOUTSETx0.6, VDD=3.3V
IOUT=10mA, Using 2SD1628
MIN.
(FOSC=300 kHz)
TYP.
MAX.
Ta=25℃
UNITS
CIRCUIT
①
②
3.234
3.300
3.366
V
1.5
-
30.0
V
Output Voltage Range
VOUTSET
FB Control Voltage
Supply Voltage Range
VFB
0.882
0.900
0.918
V
VDD
1.8
-
10.0
V
-
-
0.9
V
③
-
-
0.8
V
④
-
-
0.7
V
③
255
75
24
62
16
300
81
32
88
22
1.0
345
87
40
μA
μA
μA
kHz
%
%
④
④
⑤
④
④
①
220
300
380
mV
⑥
5.0
0.65
VDD-0.2
-
85
10.0
-
20.0
0.20
VDD-1.0
①
①
⑤
⑤
①
①
-
24
36
%
ms
V
V
V
V
Ω
-
16
24
Ω
④
-
-
0.1
- 0.1
0.1
- 0.1
μA
μA
μA
μA
⑤
⑤
⑤
⑤
(*1)
Operation Start Voltage
Oscillation Start Voltage
(*1)
VST1
VST2
Operation Hold Voltage
VHLD
Supply Current 1
Supply Current 2
Stand-by Current
Oscillation Frequency
Maximum Duty Cycle
PFM Duty Rate
IDD1
IDD2
ISTB
FOSC
MAXDTY
PFMDTY
Overcurrent
Sense Voltage (*3)
VLMT
Efficiency
Soft-Start Time
CE “High” Voltage (*2)
CE “Low” Voltage (*2)
PWM “High” Voltage (*2)
PWM “Low” Voltage (*2)
EXT “High”
On Resistance
EXT “Low”
On Resistance
CE “High Current
CE “Low” Current
FB “High” Current
FB “Low” Current
EFFI
TSS
VCEH
VCEL
VPWMH
VPWML
REXTH
REXTL
ICEH
ICEL
IFBH
IFBL
Recommended circuit using 2SD1628,
IOUT=1.0mA
No external components, CE connected
to VDD, Voltage applied, FB=0V
Recommended circuit using 2SD1628,
IOUT=1.0mA
Same as VST2, VDD=3.3V
Same as IDD1, FB=1.2V
Same as IDD1, CE=0V
Same as IDD1
Same as IDD1
No load
(XC9104B/D, 9105B/D)
Step input to FB (Pulse width: 2.0μS
or more), EXT=Low level voltage
(XC9103B, 9104B, 9105B)
Recommended circuit using XP161A1355
Same as IDD1
Same as IDD1
IOUT=1.0mA
(XC9105B/D)
IOUT=1.0mA
(XC9105B/D)
Same as IDD1, VEXT=VOUT-0.4V
Same as IDD1, VEXT=0.4V
Same as IDD2, CE=VDD
Same as IDD2, CE=0V
Same as IDD2, CE=VDD
Same as IDD2, CE=0V
④
④
Test Conditions: Unless otherwise stated, CL: ceramic, recommended MOSFET should be connected.
NOTE:
*1 Although the IC starts step-up operations from a VDD of 0.8V, the output voltage and oscillation frequency are stabilized at VDD>1.8V.
Therefore, a VDD of more than 1.8V is recommended when VDD is supplied from VIN or other power sources.
*2 With the XC9105 series, the CE pin also serves as a PWM/PFM switching pin. In operation, PWM control is selected when the voltage
at the CE pin is more than VDD -0.2V. On the other hand, PWM/PFM automatic switching control at a duty = 25% is selected when
the voltage at the CE pin is less than VDD -1.0V and more than VCEH.
*3 The overcurrent limit circuit of this IC is designed to monitor the ripple voltage so please select your external components carefully to
prevent VLMT being reached under low temperature conditions as well as normal operating conditions. Following current limiter
circuit operations, which in turn causes the IC's operations to stop, the operations of the IC can be returned to normal with a toggle of
the CE pin or by turning the power supply back on.
5/23
XC9103/XC9104/XC9105 Series
■ TYPICAL APPLICATION CIRCUIT
When obtaining VDD from a source other than VOUT,
please insert a capacitor CIN between the VDD pin and the
GND pin in order to provide stable operations.
Please place CL and CIN as close as to the VOUT and VDD
pins respectively and also close to the GND pin.
Strengthen the wiring sufficiently. RSENSE should be
removed and shorted when the CL capacitor except for
ceramic or low ESR capacitor is used.
Insert RB and CB when using a bipolar
NPN Transistor.
■NOTES ON USE
SCE
SPWM
CONDITIONS
ON
−
Chip Disable
OFF
ON
Duty=25%, PWM/PFM automatic switching
OFF
OFF
PWM
By using external signals, the control of the XC9105 series can be
alternated between PWM control and PWM/PFM automatic switching
control. By inputting a voltage of more than VDD -0.2V to the CE/PWM
pin, PWM control can be selected. On the other hand, PWM/PFM
automatic switching control can be selected by inputting a voltage of less
than VDD -1.0V.
With the XC9105, by connecting resistors of the same value (RM1, RM2) as
shown in the diagram to the left, it is possible to obtain chip disable with
SCE ON and, SPWM ON or OFF, PWM/PFM auto switching at Duty=25%
with SCE OFF & SPWM ON, & PFM control with both switches OFF.
Note:
When operating at VDD -1.8V and below (stepping-up from VIN=0.9V), it is
necessary to pull-up to VDD in order to allow the CE/PWM pin reach the
VCEH voltage level. Please make sure that the IC is in PWM control
(SPWM=OFF) when operations start. If SPWM is ON, there are times when
chip enable might not operate.
* Please select your external components carefully.
6/23
XC9103/XC9104/XC9105
Series
■ OPERATIONAL EXPLANATION
The XC9103/04/05 series are step-up DC/DC converter controller ICs with built-in high speed, low ON resistance drivers.
<Error Amp.>
Error amplifier is designed to monitor the output voltage, comparing the feedback voltage (FB) with the reference voltage
Vref. In response to feedback of a voltage lower than the reference voltage Vref, the output voltage of the error amp.
decreases.
<OSC Generator>
This circuit generates the internal reference clock.
<Ramp Wave Generator>
The ramp wave generator generates a saw-tooth waveform based on outputs from the OSC Generator.
<PWM Comparator>
The PWM comparator compares outputs from the error amp. and saw-tooth waveform. When the voltage from the Error
Amp's output is low, the external switch will be set to ON.
<PWM/PFM Controller>
This circuit generates PFM pulses.
The PWM/PFM automatic switching mode switches between PWM and PFM automatically depending on the load. The
PWM/PFM automatic switching mode is selected when the voltage of the CE pin is less than VDD - 1.0V, and the control
switches between PWM and PFM automatically depending on the load. PWM/PFM control turns into PFM control when
threshold voltage becomes lower than voltage of error amps. PWM control mode is selected when the voltage of the CE
pin is more than VDD - 0.2V. Noise is easily reduced with PWM control since the switching frequency is fixed. The series is
suitable for noise sensitive portable audio equipment as PWM control can suppress noise during operation and PWM/PFM
switching control can reduce consumption current during light load in stand-by.
<Vref 1 with Soft Start>
The reference voltage, Vref (FB pin voltage)=0.9V, is adjusted and fixed by laser trimming (for output voltage settings,
please refer to the notes on next page). To protect against inrush current, when the power is switched on, and also to
protect against voltage overshoot, soft-start time is set internally to 10ms. It should be noted, however, that this circuit
does not protect the load capacitor (CL) from inrush current. With the Vref voltage limited and depending upon the input to
the error amps, the operation maintains a balance between the two inputs of the error amps and controls the EXT pin's ON
time so that it doesn't increase more than is necessary.
<Enable Function>
This function controls the operation and shutdown of the IC. When the voltage of the CE pin is 0.2V or less, the mode will
be disable, the channel's operations will stop and the EXT1 pin will be kept at a low level (the external N-type MOSFET will
be OFF). When the IC is in a state of disable, current consumption will be no more than 1.0μA.
When the CE pin's voltage is 0.65V or more, the mode will be enabled and operations will recommence.
7/23
XC9103/XC9104/XC9105 Series
■ OPERATIONAL EXPLANATION (Continued)
< Output Voltage Setting>
Output voltage can be set by adding external split resistors. Output voltage is determined by the following equation, based
on the values of RFB1 and RFB2. The sum of RFB1 and RFB2 should normally be 2 MΩor less.
VOUT = 0.9 x (RFB1 + RFB2) / RFB2
The value of CFB1, speed-up capacitor for phase compensation, should result in fzfb = 1/(2π×CFB×RFB1) equal to 5 to
30kHz. Adjustments are required depending on the application, value of inductance (L), and value of load capacity (CL).
fzfb = 30kHz (L=10μH)
fzfb = 20kHz (L=22μH)
fzfb = 10kHz (L=47μH)
[ Example of Equation ]
RFB1 : 120kΩ
RFB2 : 45kΩ
CFB : 47pF
(fzfb = 30kHz, L = 10μH)
68pF
(fzfb = 20kHz, L = 22μH)
130pF (fzfb = 10kHz, L = 47μH)
< The use of ceramic capacitor CL >
The circuit of the XC9103/04/05 series is organized by a specialized circuit, which reenacts negative feedback of both
voltage and current. Also by insertion of approximately 100mΩ of a low and inexpensive sense resistor as current sense,
a high degree of stability is possible even using a ceramic capacitor, a condition which used to be difficult to achieve.
Compared to a tantalum condenser, because the series can be operated in a very small capacity, it is suited to use of the
ceramic capacitor, which is cheap and small.
< External Components >
Tr
SD
L, CL
L
CL
RSENSE
CL
L
CL
RSENSE
CL
L
CL
RSENSE
CFB
8/23
:*When a MOSFET is used:
XP161A1355PR (N-ch Power MOSFET, TOREX)
Note*: As the breakdown voltage of XP161A1355 is 8V, take care
with the power supply voltage.
With output voltages over 6V, use the XP161A1265 with a
breakdown voltage of 12V.
VST1: XP161A1355PR =1.2V (MAX.)
XP161A1265PR = 1.5V (MAX.)
:MA2Q737 (Schottky type, MATSUSHITA)
:When Using Ceramic Type
:22μH (CDRH5D28, SUMIDA, FOSC = 100, 180kHz)
10μH (CDRH5D18, SUMIDA, FOSC = 300, 500kHz)
:10V 10μF (Ceramic Type, LMK325BJ106ML, TAIYO YUDEN)
Use the formula below when step-up ratio and output current is
large.
CL = (CL standard value) x (IOUT(mA) / 300mA x VOUT / VIN)
:100mΩ (FOSC = 180, 300, 500kHz)
50mΩ (FOSC = 100kHz)
:Tantalum Type
:22μH (CDRH5D28, SUMIDA, FOSC = 300kHz)
47μH (CDRH5D28, SUMIDA, FOSC = 100, 180kHz)
Except when IOUT(mA) / 100mA x VOUT / VIN > 2 → 22μH
10μH (CDRH5D18, SUMIDA, FOSC = 500kHz)
:16V, 47μF (Tantalum Type 16MCE476MD2, NICHICHEMI)
Use the formula below when step-up ratio and output current is
large.
CL = (CL standard value) x (IOUT(mA) / 300mA x VOUT / VIN)
:Not required, but short out the wire.
:AL Electrolytic Type
:22μH (CDRH5D28 SUMIDA, FOSC = 300kHz)
47μH (CDRH5D28 SUMIDA, FOSC = 100, 180kHz)
Except when IOUT(mA) / 100mA x VOUT / VIN > 2 → 22μH
:16V, 100μF (AL Electrolytic Type) + 10V, 2.2μF (Ceramic Type)
Strengthen appropriately when step-up ratio and output current is
large.
:Not required, but short out the wire.
:Set up so that fzfb = 100kHz.
*When a NPN Tr. Is used:
2SD1628 (SANYO)
RB : 500Ω(Adjust with Tr's HSE or load)
CB : 2200pF (Ceramic type set so that RB and
pole is less than 70% of FOSC)
CB<1 / (2πx RB x FOSC x 0.7)
XC9103/XC9104/XC9105
Series
■ TEST CIRCUITS
Circuit ①
Circuit ②
Circuit ③
Circuit ④
Circuit ⑤
Circuit ⑥
Pulse voltage is applied at the FB pin
using the test circuit ①
9/23
XC9103/XC9104/XC9105 Series
■TYPICAL PERFORMANCE CHARACTERISTICS
(1) Output Voltage vs. Output Current
10/23
XC9103/XC9104/XC9105
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(1) Output Voltage vs. Output Current (Continued)
11/23
XC9103/XC9104/XC9105 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(2) Efficiency vs. Output Current (Continued)
12/23
XC9103/XC9104/XC9105
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(2) Efficiency vs. Output Current (Continued)
13/23
XC9103/XC9104/XC9105 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(3) Load Transient Response
14/23
Time (1.0 ms/div)
Time (2.0 ms/div)
Time (1.0 ms/div)
Time (2.0 ms/div)
Time (1.0 ms/div)
Time (1.0 ms/div)
XC9103/XC9104/XC9105
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(3) Load Transient Response (Continued)
Time (1.0 ms/div)
Time (10.0 ms/div)
Time (1.0 ms/div)
Time (4.0 ms/div)
Time (10.0 ms/div)
Time (4.0 ms/div)
15/23
XC9103/XC9104/XC9105 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(4) Output Voltage vs. Power Supply Voltage
(5) Supply Current 1 vs. Power Supply Voltage
(6) Supply Current 2 vs. Power Supply Voltage
(7) Stand-By Current vs. Power Supply Voltage
(8) Oscillation Frequency vs. Power Supply Voltage
(9) Maximum Duty Ratio vs. Power Supply Voltage
16/23
XC9103/XC9104/XC9105
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(10) PFM Duty Ratio vs. Power Supply Voltage
(11) Overcurrent Sense Voltage vs. Power Supply Voltage
(12) Soft Start Time vs. Power Supply Voltage
(13) CE "H" "L" Voltage vs. Power Supply Voltage
(14) PWM "H" "L" Voltage vs. Power Supply Voltage
(15) EXT "H" On Resistance vs. Power Supply Voltage
17/23
XC9103/XC9104/XC9105 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(16) EXT "L" On Resistance vs. Power Supply Voltage
(17) Operation Start Voltage vs. Ambient Temperature
(18) Operation Hold Voltage vs. Ambient Temperature
(19) Oscillation Start Voltage vs. Ambient Temperature
(20) Supply Current 1 vs. Power Supply Voltage
18/23
(21) Supply Current 2 vs. Power Supply Voltage
XC9103/XC9104/XC9105
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(22) Oscillation Frequency vs. Power Supply Voltage
(23) Maximum Duty Cycle vs. Power Supply Voltage
(24) PFM Duty Ratio vs. Power Supply Voltage
19/23
XC9103/XC9104/XC9105 Series
■ PACKAGING INFORMATION
●SOT-25
●USP-6B
20/23
XC9103/XC9104/XC9105
Series
■PACKAGING INFORMATION (Continued)
●USP-6B Recommended Pattern Layout
●USP-6B Recommended Metal Mask Design
21/23
XC9103/XC9104/XC9105 Series
■MARKING RULE
●SOT-25
①Represents product series
MARK
SOT-25
(TOP VIEW)
PRODUCT SERIES
3
XC9103x09xMx
4
XC9104x09xMx
5
XC9105x09xMx
②Represents current limit function
MARK
FUNCTIONS
B
With current limit function
D
Without current limit function
PRODUCT SERIES
XC9103/9104/9105B09xMx
XC9103/9104/9105D09xMx
③Represents oscillation frequency
MARK
OSCILLATION FREQUENCY
1
100
2
180
3
300
5
500
PRODUCT SERIES
XC9103/9104/9105x091Mx
XC9103/9104/9105x092Mx
XC9103/9104/9105x093Mx
XC9103/9104/9105x095Mx
④Represents production lot number
0 to 9 and A to Z, reversed character of 0 to 9 and A to Z repeated.
(G, I, J, O, Q, W excepted)
●USP-6B
①Represents product series
MARK
6
Y
9
USP-6B
(TOP VIEW)
②Represents current limit function
MARK
FUNCTIONS
B
With current limit function
D
Without current limit function
PRODUCT SERIES
XC9103x09xDx
XC9104x09xDx
XC9105x09xDx
PRODUCT SERIES
XC9103/9104/9105B09xDx
XC9103/9104/9105D09xDx
③④Represents FB voltage value
MARK
FB VOLTAGE
③
④
0
9
09
XC9103/9104/9105x09xDx
⑤Represents oscillation frequency
MARK
OSCILLATION FREQUENCY
1
100
2
180
3
300
5
500
PRODUCT SERIES
XC9103/9104/9105x091Dx
XC9103/9104/9105x092Dx
XC9103/9104/9105x093Dx
XC9103/9104/9105x095Dx
PRODUCT SERIES
⑥Represents production lot number
0 to 9 and A to Z repeated. (G, I, J, O, Q, W excepted)
Note: No character inversion used.
22/23
XC9103/XC9104/XC9105
Series
1. The products and product specifications contained herein are subject to change without
notice to improve performance characteristics.
Consult us, or our representatives
before use, to confirm that the information in this catalog is up to date.
2. We assume no responsibility for any infringement of patents, patent rights, or other
rights arising from the use of any information and circuitry in this catalog.
3. Please ensure suitable shipping controls (including fail-safe designs and aging
protection) are in force for equipment employing products listed in this catalog.
4. The products in this catalog are not developed, designed, or approved for use with such
equipment whose failure of malfunction can be reasonably expected to directly
endanger the life of, or cause significant injury to, the user.
(e.g. Atomic energy; aerospace; transport; combustion and associated safety
equipment thereof.)
5. Please use the products listed in this catalog within the specified ranges.
Should you wish to use the products under conditions exceeding the specifications,
please consult us or our representatives.
6. We assume no responsibility for damage or loss due to abnormal use.
7. All rights reserved. No part of this catalog may be copied or reproduced without the
prior permission of Torex Semiconductor Ltd.
23/23