XILINX XCS20

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Spartan and Spartan-XL Families
Field Programmable Gate Arrays
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DS060 (v1.6) September 19, 2001
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Introduction
Product Specification
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The Spartan™ and the Spartan-XL families are a high-volume production FPGA solution that delivers all the key
requirements for ASIC replacement up to 40,000 gates.
These requirements include high performance, on-chip
RAM, core solutions and prices that, in high volume,
approach and in many cases are equivalent to mask programmed ASIC devices.
The Spartan series is the result of more than 14 years of
FPGA design experience and feedback from thousands of
customers. By streamlining the Spartan series feature set,
leveraging advanced process technologies and focusing on
total cost management, the Spartan series delivers the key
features required by ASIC and other high-volume logic
users while avoiding the initial cost, long development
cycles and inherent risk of conventional ASICs. The Spartan and Spartan-XL families in the Spartan series have ten
members, as shown in Table 1.
•
System level features
- Available in both 5V and 3.3V versions
- On-chip SelectRAM™ memory
- Fully PCI compliant
- Full readback capability for program verification
and internal node observability
- Dedicated high-speed carry logic
- Internal 3-state bus capability
- Eight global low-skew clock or signal networks
- IEEE 1149.1-compatible Boundary Scan logic
- Low cost plastic packages available in all densities
- Footprint compatibility in common packages
Fully supported by powerful Xilinx development system
- Foundation Series: Integrated, shrink-wrap
software
- Alliance Series: Dozens of PC and workstation
third party development systems supported
- Fully automatic mapping, placement and routing
Spartan and Spartan-XL Features
Additional Spartan-XL Features
Note: The Spartan series devices described in this data
sheet include the 5V Spartan family and the 3.3V
Spartan-XL family. See the separate data sheet for the 2.5V
Spartan-II family.
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•
•
•
•
•
•
•
•
•
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•
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First ASIC replacement FPGA for high-volume
production with on-chip RAM
Density up to 1862 logic cells or 40,000 system gates
Streamlined feature set based on XC4000 architecture
System performance beyond 80 MHz
Broad set of AllianceCORE™ and LogiCORE™
predefined solutions available
Unlimited reprogrammability
Low cost
3.3V supply for low power with 5V tolerant I/Os
Power down input
Higher performance
Faster carry logic
More flexible high-speed clock network
Latch capability in Configurable Logic Blocks
Input fast capture latch
Optional mux or 2-input function generator on outputs
12 mA or 24 mA output drive
5V and 3.3V PCI compliant
Enhanced Boundary Scan
Express Mode configuration
Chip scale packaging
Table 1: Spartan and Spartan-XL Field Programmable Gate Arrays
Typical
Gate Range
(Logic and RAM)(1)
CLB
Matrix
Total
CLBs
Max.
Total
No. of
Avail. Distributed
Flip-flops User I/O RAM Bits
Device
Cells
Max
System
Gates
XCS05 and XCS05XL
238
5,000
2,000-5,000
10 x 10
100
360
77
3,200
XCS10 and XCS10XL
466
10,000
3,000-10,000
14 x 14
196
616
112
6,272
XCS20 and XCS20XL
950
20,000
7,000-20,000
20 x 20
400
1,120
160
12,800
XCS30 and XCS30XL
1368
30,000
10,000-30,000
24 x 24
576
1,536
192
18,432
XCS40 and XCS40XL
1862
40,000
13,000-40,000
28 x 28
784
2,016
224
25,088
Logic
Notes:
1. Max values of Typical Gate Range include 20-30% of CLBs used as RAM.
© 2001 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.
All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.
DS060 (v1.6) September 19, 2001
Product Specification
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Spartan and Spartan-XL Families Field Programmable Gate Arrays
IOB
IOB
IOB
IOB
IOB
BSCAN
IOB
The devices are customized by loading configuration data
into internal static memory cells. Re-programming is possible an unlimited number of times. The values stored in these
Spartan series FPGAs can be used where hardware must
be adapted to different user applications. FPGAs are ideal
for shortening design and development cycles, and also
offer a cost-effective solution for production rates well
beyond 50,000 systems per month.
IOB
Spartan series FPGAs are implemented with a regular, flexible, programmable architecture of Configurable Logic
Blocks (CLBs), interconnected by a powerful hierarchy of
versatile routing resources (routing channels), and surrounded by a perimeter of programmable Input/Output
Blocks (IOBs), as seen in Figure 1. They have generous
routing resources to accommodate the most complex interconnect patterns.
memory cells determine the logic functions and interconnections implemented in the FPGA. The FPGA can either
actively read its configuration data from an external serial
PROM (Master Serial mode), or the configuration data can
be written into the FPGA from an external device (Slave
Serial mode).
IOB
General Overview
IOB
OSC
IOB
CLB
CLB
CLB
CLB
IOB
IOB
IOB
IOB
CLB
CLB
CLB
CLB
IOB
IOB
Routing Channels
IOB
IOB
CLB
CLB
CLB
CLB
IOB
IOB
IOB
IOB
CLB
CLB
CLB
CLB
IOB
IOB
IOB
IOB
IOB
IOB
IOB
IOB
RDBK
IOB
IOB
START
-UP
VersaRing Routing Channels
DS060_01_081100
Figure 1: Basic FPGA Block Diagram
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DS060 (v1.6) September 19, 2001
Product Specification
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Spartan and Spartan-XL Families Field Programmable Gate Arrays
Spartan series devices achieve high-performance, low-cost
operation through the use of an advanced architecture and
semiconductor technology. Spartan and Spartan-XL
devices provide system clock rates exceeding 80 MHz and
internal performance in excess of 150 MHz. In contrast to
other FPGA devices, the Spartan series offers the most
cost-effective solution while maintaining leading-edge performance. In addition to the conventional benefit of high volume programmable logic solutions, Spartan series FPGAs
also offer on-chip edge-triggered single-port and dual-port
RAM, clock enables on all flip-flops, fast carry logic, and
many other features.
The Spartan/XL families leverage the highly successful
XC4000 architecture with many of that family’s features and
benefits. Technology advancements have been derived
from the XC4000XLA process developments.
Logic Functional Description
The Spartan series uses a standard FPGA structure as
shown in Figure 1, page 2. The FPGA consists of an array
of configurable logic blocks (CLBs) placed in a matrix of
routing channels. The input and output of signals is
achieved through a set of input/output blocks (IOBs) forming
a ring around the CLBs and routing channels.
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•
•
CLBs provide the functional elements for implementing
the user’s logic.
IOBs provide the interface between the package pins
and internal signal lines.
Routing channels provide paths to interconnect the
inputs and outputs of the CLBs and IOBs.
DS060 (v1.6) September 19, 2001
Product Specification
The functionality of each circuit block is customized during
configuration by programming internal static memory cells.
The values stored in these memory cells determine the
logic functions and interconnections implemented in the
FPGA.
Configurable Logic Blocks (CLBs)
The CLBs are used to implement most of the logic in an
FPGA. The principal CLB elements are shown in the simplified block diagram in Figure 2. There are three look-up
tables (LUT) which are used as logic function generators,
two flip-flops and two groups of signal steering multiplexers.
There are also some more advanced features provided by
the CLB which will be covered in the Advanced Features
Description, page 13.
Function Generators
Two 16 x 1 memory look-up tables (F-LUT and G-LUT) are
used to implement 4-input function generators, each offering unrestricted logic implementation of any Boolean function of up to four independent input signals (F1 to F4 or G1
to G4). Using memory look-up tables the propagation delay
is independent of the function implemented.
A third 3-input function generator (H-LUT) can implement
any Boolean function of its three inputs. Two of these inputs
are controlled by programmable multiplexers (see box "A" of
Figure 2). These inputs can come from the F-LUT or G-LUT
outputs or from CLB inputs. The third input always comes
from a CLB input. The CLB can, therefore, implement certain functions of up to nine inputs, like parity checking. The
three LUTs in the CLB can also be combined to do any arbitrarily defined Boolean function of five inputs.
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Spartan and Spartan-XL Families Field Programmable Gate Arrays
B
G-LUT
G4
G4
G2
Logic
G3 Function
of G
G2 G1-G4
G1
G1
G3
SR
Q
D
YQ
CK
EC
H-LUT
Logic
Function
H
H1 of
F-G-H1
F
H1
DIN
F4
F4
F2
Logic
F3 Function
of G
F2 F1-F4
F1
F1
F3
Y
G
SR
SR
A
D
Q
XQ
CK
EC
F-LUT
K
X
Multiplexer Controlled
by Configuration Program
EC
DS060_02_0506 01
Figure 2: Spartan/XL Simplified CLB Logic Diagram (some features not shown)
A CLB can implement any of the following functions:
Flip-Flops
•
Each CLB contains two flip-flops that can be used to register (store) the function generator outputs. The flip-flops and
function generators can also be used independently (see
Figure 2). The CLB input DIN can be used as a direct input
to either of the two flip-flops. H1 can also drive either
flip-flop via the H-LUT with a slight additional delay.
Any function of up to four variables, plus any second
function of up to four unrelated variables, plus any third
function of up to three unrelated variables
Note: When three separate functions are generated, one of
the function outputs must be captured in a flip-flop internal to
the CLB. Only two unregistered function generator outputs
are available from the CLB.
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Any single function of five variables
Any function of four variables together with some
functions of six variables
Some functions of up to nine variables.
Implementing wide functions in a single block reduces both
the number of blocks required and the delay in the signal
path, achieving both increased capacity and speed.
The versatility of the CLB function generators significantly
improves system speed. In addition, the design-software
tools can deal with each function generator independently.
This flexibility improves cell usage.
4
The two flip-flops have common clock (CK), clock enable
(EC) and set/reset (SR) inputs. Internally both flip-flops are
also controlled by a global initialization signal (GSR) which
is described in detail in Global Signals: GSR and GTS,
page 20.
Latches (Spartan-XL only)
The Spartan-XL CLB storage elements can also be configured as latches. The two latches have common clock (K)
and clock enable (EC) inputs. Functionality of the storage
element is described in Table 2.
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Spartan and Spartan-XL Families Field Programmable Gate Arrays
Clock Input
.
Table 2: CLB Storage Element Functionality
Mode
CK
EC
SR
D
Q
Power-Up or
GSR
X
X
X
X
SR
Flip-Flop
Operation
X
X
1
X
SR
1*
0*
D
D
0
X
0*
X
Q
Latch
Operation
(Spartan-XL)
1
1*
0*
X
Q
0
1*
0*
D
D
Both
X
0
0*
X
Q
Each flip-flop can be triggered on either the rising or falling
clock edge. The CLB clock line is shared by both flip-flops.
However, the clock is individually invertible for each flip-flop
(see CK path in Figure 3). Any inverter placed on the clock
line in the design is automatically absorbed into the CLB.
Clock Enable
The clock enable line (EC) is active High. The EC line is
shared by both flip-flops in a CLB. If either one is left disconnected, the clock enable for that flip-flop defaults to the
active state. EC is not invertible within the CLB. The clock
enable is synchronous to the clock and must satisfy the
setup and hold timing specified for the device.
Set/Reset
Legend:
X
Don’t care
Rising edge (clock not inverted).
SR
Set or Reset value. Reset is default.
0*
Input is Low or unconnected (default
value)
1*
Input is High or unconnected (default
value)
The set/reset line (SR) is an asynchronous active High control of the flip-flop. SR can be configured as either set or
reset at each flip-flop. This configuration option determines
the state in which each flip-flop becomes operational after
configuration. It also determines the effect of a GSR pulse
during normal operation, and the effect of a pulse on the SR
line of the CLB. The SR line is shared by both flip-flops. If
SR is not specified for a flip-flop the set/reset for that flip-flop
defaults to the inactive state. SR is not invertible within the
CLB.
CLB Signal Flow Control
SR
In addition to the H-LUT input control multiplexers (shown in
box "A" of Figure 2, page 4) there are signal flow control
multiplexers (shown in box "B" of Figure 2) which select the
signals which drive the flip-flop inputs and the combinatorial
CLB outputs (X and Y).
GND
GSR
Each flip-flop input is driven from a 4:1 multiplexer which
selects among the three LUT outputs and DIN as the data
source.
SD
D
D
Q
Q
Each combinatorial output is driven from a 2:1 multiplexer
which selects between two of the LUT outputs. The X output
can be driven from the F-LUT or H-LUT, the Y output from
G-LUT or H-LUT.
CK
RD
EC
Control Signals
Vcc
Multiplexer Controlled
by Configuration Program
DS060_03_041901
Figure 3: CLB Flip-Flop Functional Block Diagram
DS060 (v1.6) September 19, 2001
Product Specification
There are four signal control multiplexers on the input of the
CLB. These multiplexers allow the internal CLB control signals (H1, DIN, SR, and EC in Figure 2 and Figure 4) to be
driven from any of the four general control inputs (C1-C4 in
Figure 4) into the CLB. Any of these inputs can drive any of
the four internal control signals.
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Spartan and Spartan-XL Families Field Programmable Gate Arrays
DIN
GSR
H1
SD
D
D
Q
Q
C1
CK
C2
SR
RD
C3
EC
Vcc
C4
EC
Multiplexer Controlled
by Configuration Program
Multiplexer Controlled
by Configuration Program
DS060_05_041901
Figure 5: IOB Flip-Flop/Latch Functional Block
Diagram
DS060_04_081100
Figure 4: CLB Control Signal Interface
The four internal control signals are:
IOB Input Signal Path
•
•
The input signal to the IOB can be configured to either go
directly to the routing channels (via I1 and I2 in Figure 6) or
to the input register. The input register can be programmed
as either an edge-triggered flip-flop or a level-sensitive
latch. The functionality of this register is shown in Table 3,
and a simplified block diagram of the register can be seen in
Figure 5.
•
•
EC: Enable Clock
SR: Asynchronous Set/Reset or H function generator
Input 0
DIN: Direct In or H function generator Input 2
H1: H function generator Input 1.
Input/Output Blocks (IOBs)
User-configurable input/output blocks (IOBs) provide the
interface between external package pins and the internal
logic. Each IOB controls one package pin and can be configured for input, output, or bidirectional signals. Figure 6
shows a simplified functional block diagram of the Spartan/XL IOB.
Table 3: Input Register Functionality
Mode
Power-Up or
GSR
CK
EC
D
Q
X
X
X
SR
1*
D
D
0
X
X
Q
1
1*
X
Q
0
1*
D
D
X
0
X
Q
Flip-Flop
Latch
Both
Legend:
X
Don’t care.
Rising edge (clock not inverted).
6
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SR
Set or Reset value. Reset is default.
0*
Input is Low or unconnected (default
value)
1*
Input is High or unconnected (default
value)
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Spartan and Spartan-XL Families Field Programmable Gate Arrays
The register choice is made by placing the appropriate
library symbol. For example, IFD is the basic input flip-flop
(rising edge triggered), and ILD is the basic input latch
(transparent-High). Variations with inverted clocks are also
available. The clock signal inverter is also shown in Figure 5
on the CK line.
The Spartan IOB data input path has a one-tap delay element: either the delay is inserted (default), or it is not. The
Spartan-XL IOB data input path has a two-tap delay element, with choices of a full delay, a partial delay, or no delay.
The added delay guarantees a zero hold time with respect
to clocks routed through the global clock buffers. (See Global Nets and Buffers, page 12 for a description of the global clock buffers in the Spartan/XL families.) For a shorter
input register setup time, with positive hold-time, attach a
NODELAY attribute or property to the flip-flop.The output of
the input register goes to the routing channels (via I1 and I2
in Figure 6). The I1 and I2 signals that exit the IOB can each
carry either the direct or registered input signal.
The 5V Spartan input buffers can be globally configured for
either TTL (1.2V) or CMOS (VCC/2) thresholds, using an
option in the bitstream generation software. The Spartan
output levels are also configurable; the two global adjustments of input threshold and output level are independent.
The inputs of Spartan devices can be driven by the outputs
of any 3.3V device, if the Spartan inputs are in TTL mode.
Input and output thresholds are TTL on all configuration
pins until the configuration has been loaded into the device
and specifies how they are to be used. Spartan-XL inputs
are TTL compatible and 3.3V CMOS compatible.
Supported sources for Spartan/XL device inputs are shown
in Table 4.
Spartan-XL I/Os are fully 5V tolerant even though the VCC is
3.3V. This allows 5V signals to directly connect to the Spartan-XL inputs without damage, as shown in Table 4. In addition, the 3.3V VCC can be applied before or after 5V signals
are applied to the I/Os. This makes the Spartan-XL devices
immune to power supply sequencing problems.
GTS
T
O
D
Q
OUTPUT DRIVER
Programmable Slew Rate
Programmable TTL/CMOS Drive
(Spartan only)
CK
OK
EC
Package
Pad
I1
INPUT BUFFER
I2
Delay
D
IK
CK
EC
EC
Q
Multiplexer Controlled
by Configuration Program
Programmable
Pull-Up/
Pull-Down
Network
DS060_06_041901
Figure 6: Simplified Spartan/XL IOB Block Diagram
DS060 (v1.6) September 19, 2001
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Spartan and Spartan-XL Families Field Programmable Gate Arrays
Table 4: Supported Sources for Spartan/XL Inputs
Spartan
Inputs
5V,
TTL
5V,
CMOS
Any device, VCC = 3.3V,
CMOS outputs
√
Spartan family, V CC = 5V,
TTL outputs
√
Unreliable
Data
Any device, VCC = 5V,
TTL outputs (VOH ≤ 3.7V)
√
Any device, VCC = 5V,
CMOS outputs
√
Source
Spartan-XL
Inputs
3.3V
CMOS
√
√
√
√
√ (default
mode)
Spartan-XL VCC Clamping
Spartan-XL FPGAs have an optional clamping diode connected from each I/O to VCC. When enabled they clamp
ringing transients back to the 3.3V supply rail. This clamping
action is required in 3.3V PCI applications. VCC clamping is
a global option affecting all I/O pins.
Spartan-XL devices are fully 5V TTL I/O compatible if VCC
clamping is not enabled. With VCC clamping enabled, the
Spartan-XL devices will begin to clamp input voltages to
one diode voltage drop above VCC. If enabled, TTL I/O compatibility is maintained but full 5V I/O tolerance is sacrificed.
The user may select either 5V tolerance (default) or 3.3V
PCI compatibility. In both cases negative voltage is clamped
to one diode voltage drop below ground.
Spartan-XL devices are compatible with TTL, LVTTL, PCI
3V, PCI 5V and LVCMOS signalling. The various standards
are illustrated in Table 5.
Table 5: I/O Standards Supported by Spartan-XL FPGAs
Signaling
Standard
VCC
Clamping
Output
Drive
VIH MAX
VIH MIN
VIL MAX
VOH MIN
VOL MAX
TTL
Not allowed
12/24 mA
5.5
2.0
0.8
2.4
0.4
LVTTL
OK
12/24 mA
3.6
2.0
0.8
2.4
0.4
PCI5V
Not allowed
24 mA
5.5
2.0
0.8
2.4
0.4
PCI3V
Required
12 mA
3.6
50% of VCC
30% of VCC
90% of VCC
10% of VCC
LVCMOS 3V
OK
12/24 mA
3.6
50% of VCC
30% of VCC
90% of VCC
10% of VCC
Additional Fast Capture Input Latch (Spartan-XL only)
The Spartan-XL IOB has an additional optional latch on the
input. This latch is clocked by the clock used for the output
flip-flop rather than the input clock. Therefore, two different
clocks can be used to clock the two input storage elements.
This additional latch allows the fast capture of input data,
which is then synchronized to the internal clock by the IOB
flip-flop or latch.
To place the Fast Capture latch in a design, use one of the
special library symbols, ILFFX or ILFLX. ILFFX is a transparent-Low Fast Capture latch followed by an active High
input flip-flop. ILFLX is a transparent Low Fast Capture latch
followed by a transparent High input latch. Any of the clock
inputs can be inverted before driving the library element,
and the inverter is absorbed into the IOB.
Table 6: Output Flip-Flop Functionality
Clock
Clock
Enable
T
D
Q
Power-Up
or GSR
X
X
0*
X
SR
Flip-Flop
X
0
0*
X
Q
1*
0*
D
D
X
X
1
X
Z
0
X
0*
X
Q
Mode
Legend:
X
Don’t care
Rising edge (clock not inverted).
IOB Output Signal Path
SR
Set or Reset value. Reset is default.
Output signals can be optionally inverted within the IOB,
and can pass directly to the output buffer or be stored in an
edge-triggered flip-flop and then to the output buffer. The
functionality of this flip-flop is shown in Table 6.
0*
Input is Low or unconnected (default value)
1*
Input is High or unconnected (default value)
Z
3-state
8
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Spartan and Spartan-XL Families Field Programmable Gate Arrays
Output Multiplexer/2-Input Function Generator
(Spartan-XL only)
The output path in the Spartan-XL IOB contains an additional multiplexer not available in the Spartan IOB. The multiplexer can also be configured as a 2-input function
generator, implementing a pass gate, AND gate, OR gate,
or XOR gate, with 0, 1, or 2 inverted inputs.
When configured as a multiplexer, this feature allows two
output signals to time-share the same output pad, effectively doubling the number of device outputs without requiring a larger, more expensive package. The select input is
the pin used for the output flip-flop clock, OK.
When the multiplexer is configured as a 2-input function
generator, logic can be implemented within the IOB itself.
Combined with a Global buffer, this arrangement allows
very high-speed gating of a single signal. For example, a
wide decoder can be implemented in CLBs, and its output
gated with a Read or Write Strobe driven by a global buffer.
The user can specify that the IOB function generator be
used by placing special library symbols beginning with the
letter "O." For example, a 2-input AND gate in the IOB function generator is called OAND2. Use the symbol input pin
labeled "F" for the signal on the critical path. This signal is
placed on the OK pin — the IOB input with the shortest
delay to the function generator. Two examples are shown in
Figure 7.
F
D0
OMUX2
O
D1
OAND2
S0
DS060_07_081100
Figure 7: AND and MUX Symbols in Spartan-XL IOB
Output Buffer
An active High 3-state signal can be used to place the output buffer in a high-impedance state, implementing 3-state
outputs or bidirectional I/O. Under configuration control, the
output (O) and output 3-state (T) signals can be inverted.
The polarity of these signals is independently configured for
each IOB (see Figure 6, page 7). An output can be configured as open-drain (open-collector) by tying the 3-state pin
(T) to the output signal, and the input pin (I) to Ground.
DS060 (v1.6) September 19, 2001
Product Specification
By default, a 5V Spartan device output buffer pull-up structure is configured as a TTL-like totem-pole. The High driver
is an n-channel pull-up transistor, pulling to a voltage one
transistor threshold below VCC. Alternatively, the outputs
can be globally configured as CMOS drivers, with additional
p-channel pull-up transistors pulling to VCC. This option,
applied using the bitstream generation software, applies to
all outputs on the device. It is not individually programmable.
All Spartan-XL device outputs are configured as CMOS
drivers, therefore driving rail-to-rail. The Spartan-XL outputs
are individually programmable for 12 mA or 24 mA output
drive.
Any 5V Spartan device with its outputs configured in TTL
mode can drive the inputs of any typical 3.3V device. Supported destinations for Spartan/XL device outputs are
shown in Table 7.
Three-State Register (Spartan-XL Only)
Spartan-XL devices incorporate an optional register controlling the three-state enable in the IOBs. The use of the
three-state control register can significantly improve output
enable and disable time.
Output Slew Rate
The slew rate of each output buffer is, by default, reduced,
to minimize power bus transients when switching non-critical signals. For critical signals, attach a FAST attribute or
property to the output buffer or flip-flop.
Spartan/XL devices have a feature called "Soft Start-up,"
designed to reduce ground bounce when all outputs are
turned on simultaneously at the end of configuration.
When the configuration process is finished and the device
starts up, the first activation of the outputs is automatically
slew-rate limited. Immediately following the initial activation
of the I/O, the slew rate of the individual outputs is determined by the individual configuration option for each IOB.
Pull-up and Pull-down Network
Programmable pull-up and pull-down resistors are used for
tying unused pins to VCC or Ground to minimize power consumption and reduce noise sensitivity. The configurable
pull-up resistor is a p-channel transistor that pulls to VCC.
The configurable pull-down resistor is an n-channel transistor that pulls to Ground. The value of these resistors is typically 20 KΩ − 100 KΩ (See "Spartan DC Characteristics
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Spartan and Spartan-XL Families Field Programmable Gate Arrays
Over Operating Conditions" on page 43.). This high value
makes them unsuitable as wired-AND pull-up resistors.
falling-edge or rising-edge triggered flip-flops. The clock
inputs for each IOB are independent.
Table 7: Supported Destinations for Spartan/XL
Outputs
Common Clock Enables
Spartan-XL
Outputs
Spartan
Outputs
3.3V, CMOS
5V,
TTL
5V,
CMOS
Any device,
VCC = 3.3V,
CMOS-threshold
inputs
√
√
Some(1)
Any device,
VCC = 5V,
TTL-threshold inputs
√
Destination
Any device,
VCC = 5V,
CMOS-threshold
inputs
√
Unreliable
Data
√
√
Notes:
1. Only if destination device has 5V tolerant inputs.
After configuration, voltage levels of unused pads, bonded
or unbonded, must be valid logic levels, to reduce noise
sensitivity and avoid excess current. Therefore, by default,
unused pads are configured with the internal pull-up resistor
active. Alternatively, they can be individually configured with
the pull-down resistor, or as a driven output, or to be driven
by an external source. To activate the internal pull-up, attach
the PULLUP library component to the net attached to the
pad. To activate the internal pull-down, attach the PULLDOWN library component to the net attached to the pad.
Set/Reset
As with the CLB registers, the GSR signal can be used to
set or clear the input and output registers, depending on the
value of the INIT attribute or property. The two flip-flops can
be individually configured to set or clear on reset and after
configuration. Other than the global GSR net, no user-controlled set/reset signal is available to the I/O flip-flops
(Figure 5). The choice of set or reset applies to both the initial state of the flip-flop and the response to the GSR pulse.
Independent Clocks
Separate clock signals are provided for the input (IK) and
output (OK) flip-flops. The clock can be independently
inverted for each flip-flop within the IOB, generating either
10
The input and output flip-flops in each IOB have a common
clock enable input (see EC signal in Figure 5), which
through configuration, can be activated individually for the
input or output flip-flop, or both. This clock enable operates
exactly like the EC signal on the Spartan/XL CLB. It cannot
be inverted within the IOB.
Routing Channel Description
All internal routing channels are composed of metal segments with programmable switching points and switching
matrices to implement the desired routing. A structured,
hierarchical matrix of routing channels is provided to
achieve efficient automated routing.
This section describes the routing channels available in
Spartan/XL devices. Figure 8 shows a general block diagram of the CLB routing channels. The implementation software automatically assigns the appropriate resources
based on the density and timing requirements of the design.
The following description of the routing channels is for information only and is simplified with some minor details omitted. For an exact interconnect description the designer
should open a design in the FPGA Editor and review the
actual connections in this tool.
The routing channels will be discussed as follows;
•
•
•
CLB routing channels which run along each row and
column of the CLB array.
IOB routing channels which form a ring (called a
VersaRing) around the outside of the CLB array. It
connects the I/O with the CLB routing channels.
Global routing consists of dedicated networks primarily
designed to distribute clocks throughout the device with
minimum delay and skew. Global routing can also be
used for other high-fanout signals.
CLB Routing Channels
The routing channels around the CLB are derived from
three types of interconnects; single-length, double-length,
and longlines. At the intersection of each vertical and horizontal routing channel is a signal steering matrix called a
Programmable Switch Matrix (PSM). Figure 8 shows the
basic routing channel configuration showing single-length
lines, double-length lines and longlines as well as the CLBs
and PSMs. The CLB to routing channel interface is shown
as well as how the PSMs interface at the channel intersections.
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Spartan and Spartan-XL Families Field Programmable Gate Arrays
PSM
PSM
PSM
8 Singles
2 Doubles
3 Longs
CLB
CLB
3 Longs
2 Doubles
PSM
PSM
PSM
3 Longs 8 Singles 3 Longs
2 Doubles
2 Doubles
DS060_09_041901
Figure 8: Spartan/XL CLB Routing Channels and Interface Block Diagram
A block diagram of the CLB interface signals is shown in
Figure 9. The input signals to the CLB are distributed evenly
on all four sides providing maximum routing flexibility. In
general, the entire architecture is symmetrical and regular.
It is well suited to established placement and routing algorithms. Inputs, outputs, and function generators can freely
swap positions within a CLB to avoid routing congestion
during the placement and routing operation. The exceptions
are the clock (K) input and CIN/COUT signals. The K input
is routed to dedicated global vertical lines as well as four
single-length lines and is on the left side of the CLB. The
CIN/COUT signals are routed through dedicated interconnects which do not interfere with the general routing structure. The output signals from the CLB are available to drive
both vertical and horizontal channels.
The horizontal and vertical single- and double-length lines
intersect at a box called a programmable switch matrix
(PSM). Each PSM consists of programmable pass transistors used to establish connections between the lines (see
Figure 10).
C4
F4
YQ
Programmable Switch Matrices
G4
CLB Interface
CIN
Y
G3
COUT
G1
C3
CLB
C1
K
F3
F1
X
For example, a single-length signal entering on the right
side of the switch matrix can be routed to a single-length
line on the top, left, or bottom sides, or any combination
thereof, if multiple branches are required. Similarly, a double-length signal can be routed to a double-length line on
any or all of the other three edges of the programmable
switch matrix.
Single-Length Lines
Single-length lines provide the greatest interconnect flexibility and offer fast routing between adjacent blocks. There are
eight vertical and eight horizontal single-length lines associated with each CLB. These lines connect the switching
matrices that are located in every row and column of CLBs.
Single-length lines are connected by way of the programmable switch matrices, as shown in Figure 10. Routing connectivity is shown in Figure 8.
Single-length lines incur a delay whenever they go through
a PSM. Therefore, they are not suitable for routing signals
for long distances. They are normally used to conduct signals within a localized area and to provide the branching for
nets with fanout greater than one.
G2
C2
F2
XQ
Rev 1.1
DS060_08_081100
Figure 9: CLB Interconnect Signals
DS060 (v1.6) September 19, 2001
Product Specification
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Spartan and Spartan-XL Families Field Programmable Gate Arrays
Six Pass Transistors Per
Switch Matrix Interconnect Point
DS060_10_081100
Figure 10: Programmable Switch Matrix
Double-Length Lines
I/O Routing
The double-length lines consist of a grid of metal segments,
each twice as long as the single-length lines: they run past
two CLBs before entering a PSM. Double-length lines are
grouped in pairs with the PSMs staggered, so that each line
goes through a PSM at every other row or column of CLBs
(see Figure 8).
Spartan/XL devices have additional routing around the IOB
ring. This routing is called a VersaRing. The VersaRing facilitates pin-swapping and redesign without affecting board
layout. Included are eight double-length lines, and four longlines.
There are four vertical and four horizontal double-length
lines associated with each CLB. These lines provide faster
signal routing over intermediate distances, while retaining
routing flexibility.
Longlines
Longlines form a grid of metal interconnect segments that
run the entire length or width of the array. Longlines are
intended for high fan-out, time-critical signal nets, or nets
that are distributed over long distances.
Each Spartan/XL device longline has a programmable splitter switch at its center. This switch can separate the line into
two independent routing channels, each running half the
width or height of the array.
Routing connectivity of the longlines is shown in Figure 8.
The longlines also interface to some 3-state buffers which is
described later in 3-State Long Line Drivers, page 19.
12
Global Nets and Buffers
The Spartan/XL devices have dedicated global networks.
These networks are designed to distribute clocks and other
high fanout control signals throughout the devices with minimal skew.
Four vertical longlines in each CLB column are driven exclusively by special global buffers. These longlines are in addition to the vertical longlines used for standard interconnect.
In the 5V Spartan devices, the four global lines can be
driven by either of two types of global buffers; Primary Global buffers (BUFGP) or Secondary Global buffers (BUFGS).
Each of these lines can be accessed by one particular Primary Global buffer, or by any of the Secondary Global buffers, as shown in Figure 11. In the 3V Spartan-XL devices,
the four global lines can be driven by any of the eight Global
Low-Skew Buffers (BUFGLS). The clock pins of every CLB
and IOB can also be sourced from local interconnect.
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Spartan and Spartan-XL Families Field Programmable Gate Arrays
IOB
locals
locals
locals
BUFGS
IOB
locals
IOB
IOB
BUFGP
PGCK1
SGCK4
PGCK4
SGCK1
4
4
BUFGS
BUFGP
4
locals
4
locals
CLB
CLB
IOB
IOB
locals
X4
locals
Any BUFGS
X4
Any BUFGS
X4
One BUFGP
per Global Line
IOB
locals
X4
locals
One BUFGP
per Global Line
CLB
locals
CLB
IOB
locals
BUFGP
BUFGS
SGCK3
IOB
IOB
IOB
PGCK3
locals
locals
locals
BUFGP
locals
PGCK2
SGCK2
BUFGS
IOB
ds060_11_080400
Figure 11: 5V Spartan Family Global Net Distribution
The four Primary Global buffers offer the shortest delay and
negligible skew. Four Secondary Global buffers have
slightly longer delay and slightly more skew due to potentially heavier loading, but offer greater flexibility when used
to drive non-clock CLB inputs. The eight Global Low-Skew
buffers in the Spartan-XL devices combine short delay, negligible skew, and flexibility.
The Primary Global buffers must be driven by the semi-dedicated pads (PGCK1-4). The Secondary Global buffers can
be sourced by either semi-dedicated pads (SGCK1-4) or
internal nets. Each corner of the device has one Primary
buffer and one Secondary buffer. The Spartan-XL family
has eight global low-skew buffers, two in each corner. All
can be sourced by either semi-dedicated pads (GCK1-8) or
internal nets.
Using the library symbol called BUFG results in the software
choosing the appropriate clock buffer, based on the timing
requirements of the design. A global buffer should be specified for all timing-sensitive global signal distribution. To use
a global buffer, place a BUFGP (primary buffer), BUFGS
(secondary buffer), BUFGLS (Spartan-XL global low-skew
buffer), or BUFG (any buffer type) element in a schematic or
in HDL code.
Advanced Features Description
Distributed RAM
Optional modes for each CLB allow the function generators
(F-LUT and G-LUT) to be used as Random Access Memory
(RAM).
Read and write operations are significantly faster for this
on-chip RAM than for off-chip implementations. This speed
advantage is due to the relatively short signal propagation
delays within the FPGA.
Memory Configuration Overview
There are two available memory configuration modes: single-port RAM and dual-port RAM. For both these modes,
write operations are synchronous (edge-triggered), while
read operations are asynchronous. In the single-port mode,
a single CLB can be configured as either a 16 x 1, (16 x 1)
x 2, or 32 x 1 RAM array. In the dual-port mode, a single
CLB can be configured only as one 16 x 1 RAM array. The
different CLB memory configurations are summarized in
Table 8. Any of these possibilities can be individually programmed into a Spartan/XL CLB.
Table 8: CLB Memory Configurations
Mode
DS060 (v1.6) September 19, 2001
Product Specification
16 x 1
(16 x 1) x 2
32 x 1
Single-Port
√
√
√
Dual-Port
√
−
−
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Spartan and Spartan-XL Families Field Programmable Gate Arrays
•
The appropriate choice of RAM configuration mode for a
given design should be based on timing and resource
requirements, desired functionality, and the simplicity of the
design process. Selection criteria include the following:
Whereas the 32 x 1 single-port, the (16 x 1) x 2 single-port,
and the 16 x 1 dual-port configurations each use one entire
CLB, the 16 x 1 single-port configuration uses only one half
of a CLB. Due to its simultaneous read/write capability, the
dual-port RAM can transfer twice as much data as the single-port RAM, which permits only one data operation at any
given time.
CLB memory configuration options are selected by using
the appropriate library symbol in the design entry.
Single-Port Mode
There are three CLB memory configurations for the single-port RAM: 16 x 1, (16 x 1) x 2, and 32 x 1, the functional
organization of which is shown in Figure 12.
The single-port RAM signals and the CLB signals (Figure 2,
page 4) from which they are originally derived are shown in
Table 9.
14
RAM Signal
Function
CLB Signal
D0 or D1
Data In
DIN or H1
A[3:0]
Address
F[4:1] or G[4:1]
A4 (32 x 1 only)
Address
H1
WE
Write Enable
SR
WCLK
Clock
K
SPO
Single Port Out
(Data Out)
FOUT or GOUT
n
A[n-1:0]
WE
D0 or D1
WCLK
n
16 x 1
32 x 1
RAM ARRAY
WRITE
CONTROL
READ
OUT
READ ROW
SELECT
•
Table 9: Single-Port RAM Signals
WRITE ROW
SELECT
•
The 16 x 1 single-port configuration contains a RAM
array with 16 locations, each one-bit wide. One 4-bit
address decoder determines the RAM location for write
and read operations. There is one input for writing data
and one output for reading data, all at the selected
address.
The (16 x 1) x 2 single-port configuration combines two
16 x 1 single-port configurations (each according to the
preceding description). There is one data input, one
data output and one address decoder for each array.
These arrays can be addressed independently.
The 32 x 1 single-port configuration contains a RAM
array with 32 locations, each one-bit wide. There is one
data input, one data output, and one 5-bit address
decoder.
The dual-port mode 16 x 1 configuration contains a
RAM array with 16 locations, each one-bit wide. There
are two 4-bit address decoders, one for each port. One
port consists of an input for writing and an output for
reading, all at a selected address. The other port
consists of one output for reading from an
independently selected address.
INPUT REGISTER
•
SPO
DS060_12_043010
Notes:
1. The (16 x 1) x 2 configuration combines two 16 x 1 single-port
RAMs, each with its own independent address bus and data
input. The same WE and WCLK signals are connected to both
RAMs.
2. n = 4 for the 16 x 1 and (16 x 1) x 2 configurations. n = 5 for the
32 x 1 configuration.
Figure 12: Logic Diagram for the Single-Port RAM
Writing data to the single-port RAM is essentially the same
as writing to a data register. It is an edge-triggered (synchronous) operation performed by applying an address to
the A inputs and data to the D input during the active edge
of WCLK while WE is High.
The timing relationships are shown in Figure 13. The High
logic level on WE enables the input data register for writing.
The active edge of WCLK latches the address, input data,
and WE signals. Then, an internal write pulse is generated
that loads the data into the memory cell.
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inverted with respect to the sense of the flip-flop clock
inputs. Consequently, within the same CLB, data at the
RAMs SPO line can be stored in a flip-flop with either the
same or the inverse clock polarity used to write data to the
RAM.
TWPS
WCLK (K)
TWHS
TWSS
The WE input is active High and cannot be inverted within
the CLB.
WE
TDSS
TDHS
TASS
TAHS
Allowing for settling time, the data on the SPO output
reflects the contents of the RAM location currently
addressed. When the address changes, following the asynchronous delay TILO, the data stored at the new address
location will appear on SPO. If the data at a particular RAM
address is overwritten, after the delay TWOS, the new data
will appear on SPO.
DATA IN
ADDRESS
Dual-Port Mode
TILO
TILO
In dual-port mode, the function generators (F-LUT and
G-LUT) are used to create a 16 x 1 dual-port memory. Of
the two data ports available, one permits read and write
operations at the address specified by A[3:0] while the second provides only for read operations at the address specified independently by DPRA[3:0]. As a result, simultaneous
read/write operations at different addresses (or even at the
same address) are supported.
TWOS
DATA OUT
OLD
NEW
DS060_13_080400
Figure 13: Data Write and Access Timing for RAM
WCLK can be configured as active on either the rising edge
(default) or the falling edge. While the WCLK input to the
RAM accepts the same signal as the clock input to the associated CLB’s flip-flops, the sense of this WCLK input can be
The functional organization of the 16 x 1 dual-port RAM is
shown in Figure 14. The dual-port RAM signals and the
WE
D
4
READ ROW
SELECT
4
INPUT REGISTER
A[3:0]
WRITE ROW
SELECT
4
16 x 1
RAM
WRITE
CONTROL
SPO
READ
OUT
READ ROW
SELECT
WRITE ROW
SELECT
WCLK
16 x 1
RAM
WRITE
CONTROL
READ
OUT
4
DPRA[3:0]
DPO
DS060_14_043001
Figure 14: Logic Diagram for the Dual-Port RAM
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Spartan and Spartan-XL Families Field Programmable Gate Arrays
CLB signals from which they are originally derived are
shown in Table 10.
Table 10: Dual-Port RAM Signals
RAM Signal
Function
CLB Signal
D
Data In
DIN
A[3:0]
Read Address for
Single-Port.
F[4:1]
RAM initialization occurs only during device configuration.
The RAM content is not affected by GSR.
More Information on Using RAM Inside CLBs
Write Address for
Single-Port and
Dual-Port.
DPRA[3:0]
attached to the RAM or ROM symbol, as described in the
schematic library guide. If not defined, all RAM contents are
initialized to zeros, by default.
Read Address for
Dual-Port
G[4:1]
WE
Write Enable
SR
WCLK
Clock
K
SPO
Single Port Out
(addressed by A[3:0])
FOUT
DPO
Dual Port Out
(addressed by
DPRA[3:0])
GOUT
Three application notes are available from Xilinx that discuss synchronous (edge-triggered) RAM: "Xilinx Edge-Triggered and Dual-Port RAM Capability," "Implementing FIFOs
in Xilinx RAM," and "Synchronous and Asynchronous FIFO
Designs." All three application notes apply to both the Spartan and the Spartan-XL families.
Fast Carry Logic
The RAM16X1D primitive used to instantiate the dual-port
RAM consists of an upper and a lower 16 x 1 memory array.
The address port labeled A[3:0] supplies both the read and
write addresses for the lower memory array, which behaves
the same as the 16 x 1 single-port RAM array described
previously. Single Port Out (SPO) serves as the data output
for the lower memory. Therefore, SPO reflects the data at
address A[3:0].
The other address port, labeled DPRA[3:0] for Dual Port
Read Address, supplies the read address for the upper
memory. The write address for this memory, however,
comes from the address A[3:0]. Dual Port Out (DPO) serves
as the data output for the upper memory. Therefore, DPO
reflects the data at address DPRA[3:0].
Each CLB F-LUT and G-LUT contains dedicated arithmetic
logic for the fast generation of carry and borrow signals.
This extra output is passed on to the function generator in
the adjacent CLB. The carry chain is independent of normal
routing resources. (See Figure 15.)
Dedicated fast carry logic greatly increases the efficiency
and performance of adders, subtractors, accumulators,
comparators and counters. It also opens the door to many
new applications involving arithmetic operation, where the
previous generations of FPGAs were not fast enough or too
inefficient. High-speed address offset calculations in microprocessor or graphics systems, and high-speed addition in
digital signal processing are two typical applications.
The two 4-input function generators can be configured as a
2-bit adder with built-in hidden carry that can be expanded
to any length. This dedicated carry circuitry is so fast and
efficient that conventional speed-up methods like carry generate/propagate are meaningless even at the 16-bit level,
and of marginal benefit at the 32-bit level. This fast carry
logic is one of the more significant features of the Spartan
By using A[3:0] for the write address and DPRA[3:0] for the
read address, and reading only the DPO output, a FIFO that
can read and write simultaneously is easily generated. The
simultaneous read/write capability possible with the
dual-port RAM can provide twice the effective data throughput of a single-port RAM alternating read and write operations.
CLB
CLB
CLB
CLB
CLB
CLB
CLB
CLB
CLB
CLB
CLB
CLB
CLB
CLB
CLB
CLB
The timing relationships for the dual-port RAM mode are
shown in Figure 13.
Note that write operations to RAM are synchronous
(edge-triggered); however, data access is asynchronous.
Initializing RAM at FPGA Configuration
Both RAM and ROM implementations in the Spartan/XL
families are initialized during device configuration. The initial
contents are defined via an INIT attribute or property
16
DS060_15_081100
Figure 15: Available Spartan/XL Carry Propagation
Paths
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Spartan and Spartan-XL Families Field Programmable Gate Arrays
and Spartan-XL families, speeding up arithmetic and counting functions.
The carry chain in 5V Spartan devices can run either up or
down. At the top and bottom of the columns where there are
no CLBs above and below, the carry is propagated to the
right. The default is always to propagate up the column, as
shown in the figures. The carry chain in Spartan-XL devices
can only run up the column, providing even higher speed.
Figure 16, page 18 shows a Spartan/XL CLB with dedicated fast carry logic. The carry logic shares operand and
DS060 (v1.6) September 19, 2001
Product Specification
control inputs with the function generators. The carry outputs connect to the function generators, where they are
combined with the operands to form the sums.
Figure 17, page 19 shows the details of the Spartan/XL
carry logic. This diagram shows the contents of the box
labeled "CARRY LOGIC" in Figure 16.
The fast carry logic can be accessed by placing special
library symbols, or by using Xilinx Relationally Placed Macros (RPMs) that already include these symbols.
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CARRY
LOGIC
C OUT
D IN
G
Y
H
G
CARRY
G4
G3
G
D IN
G2
S/R
H
G
F
D
Q
YQ
Q
XQ
G1
EC
C OUT0
H
H1
D IN
S/R
H
G
F
F
CARRY
D
EC
F4
F3
F
F2
H
F1
X
F
K
C IN
S/R
EC
DS060_16_080400
Figure 16: Fast Carry Logic in Spartan/XL CLB
18
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Spartan and Spartan-XL Families Field Programmable Gate Arrays
C OUT
M
G1
M
1
0
I
1
G2
0
G4
G3
C OUT0
M
F2
M
1
0
F1
M
M
0
TO
FUNCTION
GENERATORS
1
0
F4
1
3
1
0
M
F3
M
M
CIN
M
DS060_17_080400
Figure 17: Detail of Spartan/XL Dedicated Carry Logic
3-State Long Line Drivers
Three-State Buffer Example
A pair of 3-state buffers is associated with each CLB in the
array. These 3-state buffers (BUFT) can be used to drive
signals onto the nearest horizontal longlines above and
below the CLB. They can therefore be used to implement
multiplexed or bidirectional buses on the horizontal longlines, saving logic resources.
Figure 18 shows how to use the 3-state buffers to implement a multiplexer. The selection is accomplished by the
buffer 3-state signal.
There is a weak keeper at each end of these two horizontal
longlines. This circuit prevents undefined floating levels.
However, it is overridden by any driver.
Pay particular attention to the polarity of the T pin when
using these buffers in a design. Active High 3-state (T) is
identical to an active Low output enable, as shown in
Table 11.
Table 11: Three-State Buffer Functionality
The buffer enable is an active High 3-state (i.e., an active
Low enable), as shown in Table 11.
IN
T
OUT
X
1
Z
IN
0
IN
Z = (DA • A) + (DB • B) + (DC • C) + (DN • N)
~100 kΩ
DA
A
DB
BUFT
B
DC
BUFT
C
DN
BUFT
N
BUFT
"Weak Keeper"
DS060_18_080400
Figure 18: 3-state Buffers Implement a Multiplexer
DS060 (v1.6) September 19, 2001
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On-Chip Oscillator
Spartan/XL devices include an internal oscillator. This oscillator is used to clock the power-on time-out, for configuration memory clearing, and as the source of CCLK in Master
configuration mode. The oscillator runs at a nominal 8 MHz
frequency that varies with process, VCC, and temperature.
The output frequency falls between 4 MHz and 10 MHz.
connected to GTS. A specific pin location can be assigned
to this input using a LOC attribute or property, just as with
any other user-programmable pad. An inverter can optionally be inserted after the input buffer to invert the sense of
the Global 3-state signal. Alternatively, GTS can be driven
from any internal node.
STARTUP
The oscillator output is optionally available after configuration. Any two of four resynchronized taps of a built-in divider
are also available. These taps are at the fourth, ninth, fourteenth and nineteenth bits of the divider. Therefore, if the
primary oscillator output is running at the nominal 8 MHz,
the user has access to an 8-MHz clock, plus any two of
500 kHz, 16 kHz, 490 Hz and 15 Hz. These frequencies
can vary by as much as -50% or +25%.
These signals can be accessed by placing the OSC4 library
element in a schematic or in HDL code. The oscillator is
automatically disabled after configuration if the OSC4 symbol is not used in the design.
Global Signals: GSR and GTS
Global Set/Reset
A separate Global Set/Reset line, as shown in Figure 3,
page 5 for the CLB and Figure 5, page 6 for the IOB, sets or
clears each flip-flop during power-up, reconfiguration, or
when a dedicated Reset net is driven active. This global net
(GSR) does not compete with other routing resources; it
uses a dedicated distribution network.
Each flip-flop is configured as either globally set or reset in
the same way that the local set/reset (SR) is specified.
Therefore, if a flip-flop is set by SR, it is also set by GSR.
Similarly, if in reset mode, it is reset by both SR and GSR.
GSR can be driven from any user-programmable pin as a
global reset input. To use this global net, place an input pad
and input buffer in the schematic or HDL code, driving the
GSR pin of the STARTUP symbol. (See Figure 19.) A specific pin location can be assigned to this input using a LOC
attribute or property, just as with any other user-programmable pad. An inverter can optionally be inserted after the
input buffer to invert the sense of the GSR signal. Alternatively, GSR can be driven from any internal node.
Global 3-State
A separate Global 3-state line (GTS) as shown in Figure 6,
page 7 forces all FPGA outputs to the high-impedance
state, unless boundary scan is enabled and is executing an
EXTEST instruction. GTS does not compete with other routing resources; it uses a dedicated distribution network.
GTS can be driven from any user-programmable pin as a
global 3-state input. To use this global net, place an input
pad and input buffer in the schematic or HDL code, driving
the GTS pin of the STARTUP symbol. This is similar to what
is shown in Figure 19 for GSR except the IBUF would be
20
PAD
IBUF
GSR
Q2
GTS
Q3
CLK
Q1, Q4
DONEIN
DS060_19_080400
Figure 19: Schematic Symbols for Global Set/Reset
Boundary Scan
The "bed of nails" has been the traditional method of testing
electronic assemblies. This approach has become less
appropriate, due to closer pin spacing and more sophisticated assembly methods like surface-mount technology
and multi-layer boards. The IEEE Boundary Scan Standard
1149.1 was developed to facilitate board-level testing of
electronic assemblies. Design and test engineers can
embed a standard test logic structure in their device to
achieve high fault coverage for I/O and internal logic. This
structure is easily implemented with a four-pin interface on
any boundary scan compatible device. IEEE 1149.1-compatible devices may be serial daisy-chained together, connected in parallel, or a combination of the two.
The Spartan and Spartan-XL families implement IEEE
1149.1-compatible BYPASS, PRELOAD/SAMPLE and
EXTEST boundary scan instructions. When the boundary
scan configuration option is selected, three normal user I/O
pins become dedicated inputs for these functions. Another
user output pin becomes the dedicated boundary scan output. The details of how to enable this circuitry are covered
later in this section.
By exercising these input signals, the user can serially load
commands and data into these devices to control the driving
of their outputs and to examine their inputs. This method is
an improvement over bed-of-nails testing. It avoids the need
to over-drive device outputs, and it reduces the user interface to four pins. An optional fifth pin, a reset for the control
logic, is described in the standard but is not implemented in
the Spartan/XL devices.
The dedicated on-chip logic implementing the IEEE 1149.1
functions includes a 16-state machine, an instruction register and a number of data registers. The functional details
can be found in the IEEE 1149.1 specification and are also
discussed in the Xilinx application note: "Boundary Scan in
FPGA Devices."
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Product Specification
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Spartan and Spartan-XL Families Field Programmable Gate Arrays
Figure 20 is a diagram of the Spartan/XL boundary scan
logic. It includes three bits of Data Register per IOB, the
IEEE 1149.1 Test Access Port controller, and the Instruction
Register with decodes.
The other standard data register is the single flip-flop
BYPASS register. It synchronizes data being passed
through the FPGA to the next downstream boundary scan
device.
Spartan/XL devices can also be configured through the
boundary scan logic. See Configuration Through the
Boundary Scan Pins, page 37.
The FPGA provides two additional data registers that can
be specified using the BSCAN macro. The FPGA provides
two user pins (BSCAN.SEL1 and BSCAN.SEL2) which are
the decodes of two user instructions. For these instructions,
two corresponding pins (BSCAN.TDO1 and BSCAN.TDO2)
allow user scan data to be shifted out on TDO. The data
register clock (BSCAN.DRCK) is available for control of test
logic which the user may wish to implement with CLBs. The
NAND of TCK and RUN-TEST-IDLE is also provided
(BSCAN.IDLE).
Data Registers
The primary data register is the boundary scan register. For
each IOB pin in the FPGA, bonded or not, it includes three
bits for In, Out and 3-state Control. Non-IOB pins have
appropriate partial bit population for In or Out only. PROGRAM, CCLK and DONE are not included in the boundary
scan register. Each EXTEST CAPTURE-DR state captures
all In, Out, and 3-state pins.
The data register also includes the following non-pin bits:
TDO.T, and TDO.O, which are always bits 0 and 1 of the
data register, respectively, and BSCANT.UPD, which is
always the last bit of the data register. These three boundary scan bits are special-purpose Xilinx test signals.
DS060 (v1.6) September 19, 2001
Product Specification
Instruction Set
The Spartan/XL boundary scan instruction set also includes
instructions to configure the device and read back the configuration data. The instruction set is coded as shown in
Table 12.
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Spartan and Spartan-XL Families Field Programmable Gate Arrays
DATA IN
IOB.T
0
1
0
IOB
IOB
IOB
IOB
IOB
sd
D
Q
D
Q
1
LE
IOB
IOB
1
sd
D
Q
D
Q
0
IOB
IOB
IOB
IOB
LE
1
IOB.I
IOB
IOB
IOB
IOB
IOB
IOB
0
1
IOB
BYPASS
REGISTER
0
sd
D
Q
D
Q
LE
1
0
IOB.Q
IOB
IOB.T
TDI
INSTRUCTION REGISTER
M TDO
U
X
0
1
0
sd
D
Q
D
Q
1
LE
1
0
sd
D
Q
D
Q
LE
1
IOB.I
0
DATAOUT
SHIFT/
CLOCK DATA
CAPTURE
REGISTER
UPDATE
EXTEST
DS060_20_080400
Figure 20: Spartan/XL Boundary Scan Logic
22
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Product Specification
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Spartan and Spartan-XL Families Field Programmable Gate Arrays
Table 12: Boundary Scan Instructions
Instruction
Test
I/O Data
I2
I1
I0
Selected
TDO
Source
0
0
0
EXTEST
DR
DR
0
0
1
SAMPLE/
PRELOAD
DR
Pin/Logic
0
1
0
USER 1
BSCAN.
TDO1
User Logic
Source
1
1
USER 2
BSCAN.
TDO2
User Logic
1
0
0
READBACK
Readback
Data
Pin/Logic
Right-edge IOBs (Bottom to Top)
0
1
CONFIGURE
DOUT
Disabled
1
1
0
IDCODE
(Spartan-XL
only)
IDCODE
Register
-
BYPASS
Bypass
Register
-
1
Left-edge IOBs (Top to Bottom)
Bottom-edge IOBs (Left to Right)
1
1
Top-edge IOBs (Right to Left)
MODE.I
0
1
TDO.T
TDO.O
Bit 0 ( TDO end)
Bit 1
Bit 2
(TDI end)
BSCANT.UPD
DS060_21_080400
Figure 21: Boundary Scan Bit Sequence
Bit Sequence
The bit sequence within each IOB is: In, Out, 3-state. The
input-only pins contribute only the In bit to the boundary
scan I/O data register, while the output-only pins contributes
all three bits.
The first two bits in the I/O data register are TDO.T and
TDO.O, which can be used for the capture of internal signals. The final bit is BSCANT.UPD, which can be used to
drive an internal net. These locations are primarily used by
Xilinx for internal testing.
From a cavity-up view of the chip (as shown in the FPGA
Editor), starting in the upper right chip corner, the boundary
scan data-register bits are ordered as shown in Figure 21.
The device-specific pinout tables for the Spartan/XL devices
include the boundary scan locations for each IOB pin.
BSDL (Boundary Scan Description Language) files for
Spartan/XL devices are available on the Xilinx website in
the File Download area. Note that the 5V Spartan devices
and 3V Spartan-XL devices have different BSDL files.
Including Boundary Scan in a Design
If boundary scan is only to be used during configuration, no
special schematic elements need be included in the schematic or HDL code. In this case, the special boundary scan
pins TDI, TMS, TCK and TDO can be used for user functions after configuration.
To indicate that boundary scan remain enabled after configuration, place the BSCAN library symbol and connect the
TDI, TMS, TCK and TDO pad symbols to the appropriate
pins, as shown in Figure 22.
Optional
To User
Logic
IBUF
BSCAN
TDI
TDI
TMS
TMS
DRCK
TCK
TCK
IDLE
TDO1
SEL1
TDO2
SEL2
From
User Logic
TDO
TDO
To User
Logic
DS060_22_080400
Figure 22: Boundary Scan Schematic Example
DS060 (v1.6) September 19, 2001
Product Specification
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Spartan and Spartan-XL Families Field Programmable Gate Arrays
Even if the boundary scan symbol is used in a schematic,
the input pins TMS, TCK, and TDI can still be used as inputs
to be routed to internal logic. Care must be taken not to
force the chip into an undesired boundary scan state by
inadvertently applying boundary scan input patterns to
these pins. The simplest way to prevent this is to keep TMS
High, and then apply whatever signal is desired to TDI and
TCK.
Avoiding Inadvertent Boundary Scan
If TMS or TCK is used as user I/O, care must be taken to
ensure that at least one of these pins is held constant during
configuration. In some applications, a situation may occur
where TMS or TCK is driven during configuration. This may
cause the device to go into boundary scan mode and disrupt the configuration process.
To prevent activation of boundary scan during configuration,
do either of the following:
•
•
TMS: Tie High to put the Test Access Port controller
in a benign RESET state.
TCK: Tie High or Low—do not toggle this clock input.
For more information regarding boundary scan, refer to the
Xilinx Application Note, "Boundary Scan in FPGA Devices. "
Boundary Scan Enhancements (Spartan-XL Only)
Spartan-XL devices have improved boundary scan functionality and performance in the following areas:
IDCODE: The IDCODE register is supported. By using the
IDCODE, the device connected to the JTAG port can be
determined. The use of the IDCODE enables selective configuration dependent on the FPGA found.
The IDCODE register has the following binary format:
vvvv:ffff:fffa:aaaa:aaaa:cccc:cccc:ccc1
where
c = the company code (49h for Xilinx)
a = the array dimension in CLBs (ranges from 0Ah for
XCS05XL to 1Ch for XCS40XL)
f = the family code (02h for Spartan-XL family)
v = the die version number (currently 0h)
Table 13: IDCODEs Assigned to Spartan-XL FPGAs
24
FPGA
IDCODE
XCS05XL
0040A093h
XCS10XL
0040E093h
XCS20XL
00414093h
XCS30XL
00418093h
XCS40XL
0041C093h
Configuration State: The configuration state is available to
JTAG controllers.
Configuration Disable: The JTAG port can be prevented
from configuring the FPGA.
TCK Startup: TCK can now be used to clock the start-up
block in addition to other user clocks.
CCLK Holdoff: Changed the requirement for Boundary
Scan Configure or EXTEST to be issued prior to the release
of INIT pin and CCLK cycling.
Reissue Configure: The Boundary Scan Configure can be
reissued to recover from an unfinished attempt to configure
the device.
Bypass FF: Bypass FF and IOB is modified to provide
DRCLOCK only during BYPASS for the bypass flip-flop, and
during EXTEST or SAMPLE/PRELOAD for the IOB register.
Power-Down (Spartan-XL Only)
All Spartan/XL devices use a combination of efficient segmented routing and advanced process technology to provide low power consumption under all conditions. The 3.3V
Spartan-XL family adds a dedicated active Low power-down
pin (PWRDWN) to reduce supply current to 100 µA typical.
The PWRDWN pin takes advantage of one of the unused
No Connect locations on the 5V Spartan device. The user
must de-select the "5V Tolerant I/Os" option in the Configuration Options to achieve the specified Power Down current.
The PWRDWN pin has a default internal pull-up resistor,
allowing it to be left unconnected if unused.
VCC must continue to be supplied during Power-down, and
configuration data is maintained. When the PWRDWN pin is
pulled Low, the input and output buffers are disabled. The
inputs are internally forced to a logic Low level, including the
MODE pins, DONE, CCLK, and TDO, and all internal
pull-up resistors are turned off. The PROGRAM pin is not
affected by Power Down. The GSR net is asserted during
Power Down, initializing all the flip-flops to their start-up
state.
PWRDWN has a minimum pulse width of 50 ns (Figure 23).
On entering the Power-down state, the inputs will be disabled and the flip-flops set/reset, and then the outputs are
disabled about 10 ns later. The user may prefer to assert the
GTS or GSR signals before PWRDWN to affect the order of
events. When the PWRDWN signal is returned High, the
inputs will be enabled first, followed immediately by the
release of the GSR signal initializing the flip-flops. About 10
ns later, the outputs will be enabled. Allow 50 ns after the
release of PWRDWN before using the device.
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Product Specification
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Spartan and Spartan-XL Families Field Programmable Gate Arrays
TPWDW
PWRDWN
50 ns
50 ns
Power Down Mode
Outputs
Description
Power Down Time
Power Down Pulse Width
Symbol
Min
TPWD
50 ns
TPWDW
50 ns
DS060_23_041901
Figure 23: PWRDWN Pulse Timing
Power-down retains the configuration, but loses all data
stored in the device flip-flops. All inputs are interpreted as
Low, but the internal combinatorial logic is fully functional.
Make sure that the combination of all inputs Low and all
flip-flops set or reset in your design will not generate internal
oscillations, or create permanent bus contention by activating internal bus drivers with conflicting data onto the same
long line.
During configuration, the PWRDWN pin must be High. If the
Power Down state is entered before or during configuration,
the device will restart configuration once the PWRDWN signal is removed. Note that the configuration pins are affected
by Power Down and may not reflect their normal function. If
there is an external pull-up resistor on the DONE pin, it will
be High during Power Down even if the device is not yet
configured. Similarly, if PWRDWN is asserted before configuration is completed, the INIT pin will not indicate status
information.
Note that the PWRDWN pin is not part of the Boundary
Scan chain. Therefore, the Spartan-XL family has a separate set of BSDL files than the 5V Spartan family. Boundary
scan logic is not usable during Power Down.
Configuration and Test
Configuration is the process of loading design-specific programming data into one or more FPGAs to define the functional operation of the internal blocks and their
interconnections. This is somewhat like loading the command registers of a programmable peripheral chip.
Spartan/XL devices use several hundred bits of configuration data per CLB and its associated interconnects. Each
DS060 (v1.6) September 19, 2001
Product Specification
configuration bit defines the state of a static memory cell
that controls either a function look-up table bit, a multiplexer
input, or an interconnect pass transistor. The Xilinx development system translates the design into a netlist file. It automatically partitions, places and routes the logic and
generates the configuration data in PROM format.
Configuration Mode Control
5V Spartan devices have two configuration modes.
•
•
MODE = 1 sets Slave Serial mode
MODE = 0 sets Master Serial mode
3V Spartan-XL devices have three configuration modes.
•
•
•
M1/M0 = 11 sets Slave Serial mode
M1/M0 = 10 sets Master Serial mode
M1/M0 = 0X sets Express mode
In addition to these modes, the device can be configured
through the Boundary Scan logic (See "Configuration
Through the Boundary Scan Pins" on page 37.).
The Mode pins are sampled prior to starting configuration to
determine the configuration mode. After configuration,
these pin are unused. The Mode pins have a weak pull-up
resistor turned on during configuration. With the Mode pins
High, Slave Serial mode is selected, which is the most popular configuration mode. Therefore, for the most common
configuration mode, the Mode pins can be left unconnected.
If the Master Serial mode is desired, the MODE/M0 pin
should be connected directly to GND, or through a
pull-down resistor of 1 KΩ or less.
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Spartan and Spartan-XL Families Field Programmable Gate Arrays
During configuration, some of the I/O pins are used temporarily for the configuration process. All pins used during configuration are shown in Table 14 and Table 15.
Table 14: Pin Functions During Configuration
(Spartan family only)
Configuration Mode (MODE Pin)
Table 15: Pin Functions During Configuration
(Spartan-XL family only)
CONFIGURATION MODE <M1:M0>
Slave
Serial
[1:1]
Master
Serial
[1:0]
Express
[0:X]
User
Operation
M1 (High) (I)
M1 (High) (I)
M1(Low) (I)
M1
M0 (High) (I)
M0 (Low) (I)
M0 (I)
M0
Slave Serial
(High)
Master Serial
(Low)
User
Operation
MODE (I)
MODE (I)
MODE
HDC (High)
HDC (High)
HDC (High)
I/O
HDC (High)
HDC (High)
I/O
LDC (Low)
LDC (Low)
LDC (Low)
I/O
LDC (Low)
LDC (Low)
I/O
INIT
INIT
INIT
I/O
INIT
INIT
I/O
DONE
DONE
DONE
DONE
DONE
DONE
DONE
PROGRAM (I)
PROGRAM
PROGRAM
(I)
PROGRAM
(I)
PROGRAM
PROGRAM (I)
PROGRAM
(I)
CCLK (I)
CCLK (O)
CCLK (I)
CCLK (I)
CCLK (O)
CCLK (I)
CCLK (I)
DIN (I)
DIN (I)
I/O
DATA 7 (I)
I/O
DOUT
DOUT
SGCK4-I/O
DATA 6 (I)
I/O
TDI
TDI
TDI-I/O
DATA 5 (I)
I/O
TCK
TCK
TCK-I/O
DATA 4 (I)
I/O
TMS
TMS
TMS-I/O
DATA 3 (I)
I/O
TDO
TDO
TDO-(O)
DATA 2 (I)
I/O
DATA 1 (I)
I/O
ALL OTHERS
Notes:
1. A shaded table cell represents the internal pull-up used
before and during configuration.
2. (I) represents an input; (O) represents an output.
3. INIT is an open-drain output during configuration.
DIN (I)
DIN (I)
DATA 0 (I)
I/O
DOUT
DOUT
DOUT
GCK6-I/O
TDI
TDI
TDI
TDI-I/O
TCK
TCK
TCK
TCK-I/O
TMS
TMS
TMS
TMS-I/O
TDO
TDO
TDO
TDO-(O)
CS1
I/O
ALL
OTHERS
Notes:
1. A shaded table cell represents the internal pull-up used
before and during configuration.
2. (I) represents an input; (O) represents an output.
3. INIT is an open-drain output during configuration.
26
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Product Specification
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Spartan and Spartan-XL Families Field Programmable Gate Arrays
Master Serial Mode
The Master serial mode uses an internal oscillator to generate a Configuration Clock (CCLK) for driving potential slave
devices and the Xilinx serial-configuration PROM
(SPROM). The CCLK speed is selectable as either 1 MHz
(default) or 8 MHz. Configuration always starts at the default
slow frequency, then can switch to the higher frequency during the first frame. Frequency tolerance is –50% to +25%.
In Master Serial mode, the CCLK output of the device drives
a Xilinx SPROM that feeds the FPGA DIN input. Each rising
edge of the CCLK output increments the Serial PROM internal address counter. The next data bit is put on the SPROM
data output, connected to the FPGA DIN pin. The FPGA
accepts this data on the subsequent rising CCLK edge.
When used in a daisy-chain configuration the Master Serial
FPGA is placed as the first device in the chain and is
referred to as the lead FPGA. The lead FPGA presents the
preamble data, and all data that overflows the lead device,
on its DOUT pin. There is an internal pipeline delay of 1.5
CCLK periods, which means that DOUT changes on the
falling CCLK edge, and the next FPGA in the daisy chain
accepts data on the subsequent rising CCLK edge. See the
timing diagram in Figure 24.
In the bitstream generation software, the user can specify
Fast Configuration Rate, which, starting several bits into the
first frame, increases the CCLK frequency by a factor of
eight. For actual timing values please refer to the specification section. Be sure that the serial PROM and slaves are
fast enough to support this data rate. Devices such as
XC3000A and XC3100A do not support the Fast Configuration Rate option.
The SPROM CE input can be driven from either LDC or
DONE. Using LDC avoids potential contention on the DIN
pin, if this pin is configured as user I/O, but LDC is then
restricted to be a permanently High user output after configuration. Using DONE can also avoid contention on DIN, provided the Early DONE option is invoked.
Figure 25 shows a full master/slave system. The leftmost
device is in Master Serial mode, all other devices in the
chain are in Slave Serial mode.
CCLK
(Output)
TCKDS
TDSCK
Serial Data In
Serial DOUT
(Output)
n
n–3
n+1
n–2
n+2
n–1
n
DS060_24_080400
Symbol
CCLK
Description
Min
Units
TDSCK
DIN setup
20
ns
TCKDS
DIN hold
0
ns
Notes:
1. At power-up, V CC must rise from 2.0V to VCC min in less than 25 ms, otherwise
delay configuration by pulling PROGRAM Low until VCC is valid.
2. Master Serial mode timing is based on testing in slave mode.
Figure 24: Master Serial Mode Programming Switching Characteristics
Slave Serial Mode
In Slave Serial mode, the FPGA receives serial configuration data on the rising edge of CCLK and, after loading its
configuration, passes additional data out, resynchronized
on the next falling edge of CCLK.
In this mode, an external signal drives the CCLK input of the
FPGA (most often from a Master Serial device). The serial
configuration bitstream must be available at the DIN input of
the lead FPGA a short setup time before each rising CCLK
edge.
DS060 (v1.6) September 19, 2001
Product Specification
The lead FPGA then presents the preamble data—and all
data that overflows the lead device—on its DOUT pin. There
is an internal delay of 0.5 CCLK periods, which means that
DOUT changes on the falling CCLK edge, and the next
FPGA in the daisy chain accepts data on the subsequent
rising CCLK edge.
Figure 25 shows a full master/slave system. A Spartan/XL
device in Slave Serial mode should be connected as shown
in the third device from the left.
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Spartan and Spartan-XL Families Field Programmable Gate Arrays
and is captured by each FPGA when it recognizes the 0010
preamble. Following the length-count data, each FPGA outputs a High on DOUT until it has received its required number of data frames.
Slave Serial is the default mode if the Mode pins are left
unconnected, as they have weak pull-up resistors during
configuration.
Multiple slave devices with identical configurations can be
wired with parallel DIN inputs. In this way, multiple devices
can be configured simultaneously.
After an FPGA has received its configuration data, it passes
on any additional frame start bits and configuration data on
DOUT. When the total number of configuration clocks
applied after memory initialization equals the value of the
24-bit length count, the FPGAs begin the start-up sequence
and become operational together. FPGA I/O are normally
released two CCLK cycles after the last configuration bit is
received.
Serial Daisy Chain
Multiple devices with different configurations can be connected together in a "daisy chain," and a single combined
bitstream used to configure the chain of slave devices.
To configure a daisy chain of devices, wire the CCLK pins of
all devices in parallel, as shown in Figure 25. Connect the
DOUT of each device to the DIN of the next. The lead or
master FPGA and following slaves each passes resynchronized configuration data coming from a single source. The
header data, including the length count, is passed through
The daisy-chained bitstream is not simply a concatenation
of the individual bitstreams. The PROM File Formatter must
be used to combine the bitstreams for a daisy-chained configuration.
Note:
M2, M1, M0 can be shorted
to VCC if not used as I/O
VCC
3.3K
MODE
N/C
DOUT
Spartan
Master
Serial
CCLK
DIN
PROGRAM
DONE
LDC
INIT
M0 M1
M2
MODE
DIN
DOUT
CCLK
VCC
3.3K
Xilinx SPROM
CLK
DATA
+5V
3.3K
3.3K
DOUT
DIN
CCLK
Spartan
Slave
FPGA
Slave
VPP
CEO
CE
RESET/OE
PROGRAM
DONE
INIT
RESET
D/P
INIT
(Low Reset Option Used)
PROGRAM
DS060_25_061301
Figure 25: Master/Slave Serial Mode Circuit Diagram
28
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Spartan and Spartan-XL Families Field Programmable Gate Arrays
DIN
Bit n
TDCC
Bit n + 1
TCCL
TCCD
CCLK
TCCH
DOUT
(Output)
TCCO
Bit n – 1
Bit n
DS060_26_080400
Symbol
Description
Min
Max
Units
TDCC
DIN setup
20
-
ns
TCCD
DIN hold
0
-
ns
DIN to DOUT
-
30
ns
High time
40
-
ns
TCCL
Low time
40
-
ns
FCC
Frequency
-
10
MHz
TCCO
TCCH
CCLK
Notes:
1. Configuration must be delayed until the INIT pins of all daisy-chained FPGAs are
High.
Figure 26: Slave Serial Mode Programming Switching Characteristics
Express Mode (Spartan-XL only)
Express mode is similar to Slave Serial mode, except that
data is processed one byte per CCLK cycle instead of one
bit per CCLK cycle. An external source is used to drive
CCLK, while byte-wide data is loaded directly into the configuration data shift registers (Figure 27). A CCLK frequency of 1 MHz is equivalent to a 8 MHz serial rate,
because eight bits of configuration data are loaded per
CCLK cycle. Express mode does not support CRC error
checking, but does support constant-field error checking. A
length count is not used in Express mode.
Express mode must be specified as an option to the development system. The Express mode bitstream is not compatible with the other configuration modes (see Table 16,
page 32.) Express mode is selected by a <0X> on the Mode
pins (M1, M0).
The first byte of parallel configuration data must be available
at the D inputs of the FPGA a short setup time before the
second rising CCLK edge. Subsequent data bytes are
clocked in on each consecutive rising CCLK edge
(Figure 28).
Pseudo Daisy Chain
Multiple devices with different configurations can be configured in a pseudo daisy chain provided that all of the devices
DS060 (v1.6) September 19, 2001
Product Specification
are in Express mode. A single combined bitstream is used
to configure the chain of Express mode devices. CCLK pins
are tied together and D0-D7 pins are tied together for all
devices along the chain. A status signal is passed from
DOUT to CS1 of successive devices along the chain. Frame
data is accepted only when CS1 is High and the device’s
configuration memory is not already full. The lead device in
the chain has its CS1 input tied High (or floating, since there
is an internal pull-up). The status pin DOUT is pulled Low
after the header is received by all devices, and remains Low
until the device’s configuration memory is full. DOUT is then
pulled High to signal the next device in the chain to accept
the configuration data on the D0-D7 bus.
The DONE pins of all devices in the chain should be tied
together, with one or more active internal pull-ups. If a large
number of devices are included in the chain, deactivate
some of the internal pull-ups, since the Low-driving DONE
pin of the last device in the chain must sink the current from
all pull-ups in the chain. The DONE pull-up is activated by
default. It can be deactivated using a development system
option.
The requirement that all DONE pins in a daisy chain be
wired together applies only to Express mode, and only if all
devices in the chain are to become active simultaneously.
All Spartan-XL devices in Express mode are synchronized
to the DONE pin. User I/Os for each device become active
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Spartan and Spartan-XL Families Field Programmable Gate Arrays
DONE pin of a device is left unconnected, the device
becomes active as soon as that device has been configured. Because only Spartan-XL, XC4000XLA/XV, and
XC5200 devices support Express mode, only these devices
can be used to form an Express mode daisy chain.
after the DONE pin for that device goes High. (The exact
timing is determined by development system options.)
Since the DONE pin is open-drain and does not drive a High
value, tying the DONE pins of all devices together prevents
all devices in the chain from going High until the last device
in the chain has completed its configuration cycle. If the
V CC
8
M0
M1
CS1
DATA BUS
8
CS1
DOUT
8
D0-D7
VCC
M0
INIT
PROGRAM
INIT
DOUT
To Additional
Optional
Daisy-Chained
Devices
D0-D7
Optional
Daisy-Chained
Spartan-XL
Spartan-XL
3.3K
PROGRAM
M1
PROGRAM
INIT
DONE
CCLK
DONE
CCLK
To Additional
Optional
Daisy-Chained
Devices
CCLK
DS060_27_080400
Figure 27: Express Mode Circuit Diagram
30
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DS060 (v1.6) September 19, 2001
Product Specification
R
Spartan and Spartan-XL Families Field Programmable Gate Arrays
CCLK
TIC
INIT
TCD
TDC
BYTE
0
D0-D7
BYTE
1
BYTE
6
DOUT
Header Received
FPGA Filled
DS060_28_080400
Symbol
Description
Min
Max
Units
TIC
INIT (High) setup time
5
-
µs
TDC
D0-D7 setup time
20
-
ns
D0-D7 hold time
0
-
ns
TCCH
CCLK High time
45
-
ns
TCCL
CCLK Low time
45
-
ns
FCC
CCLK Frequency
-
10
MHz
TCD
CCLK
Notes:
1. If not driven by the preceding DOUT, CS1 must remain High until the
device is fully configured.
Figure 28: Express Mode Programming Switching Characteristics
Setting CCLK Frequency
In Master mode, CCLK can be generated in either of two
frequencies. In the default slow mode, the frequency ranges
from 0.5 MHz to 1.25 MHz for Spartan/XL devices. In fast
CCLK mode, the frequency ranges from 4 MHz to 10 MHz
for Spartan/XL devices. The frequency is changed to fast by
an option when running the bitstream generation software.
Data Stream Format
The data stream ("bitstream") format is identical for both
serial configuration modes, but different for the Spartan-XL
Express mode. In Express mode, the device becomes
active when DONE goes High, therefore no length count is
required. Additionally, CRC error checking is not supported
in Express mode. The data stream format is shown in
DS060 (v1.6) September 19, 2001
Product Specification
Table 16. Bit-serial data is read from left to right. Express
mode data is shown with D0 at the left and D7 at the right.
The configuration data stream begins with a string of eight
ones, a preamble code, followed by a 24-bit length count
and a separator field of ones (or 24 fill bits, in Spartan-XL
Express mode). This header is followed by the actual configuration data in frames. The length and number of frames
depends on the device type (see Table 17). Each frame
begins with a start field and ends with an error check. In
serial modes, a postamble code is required to signal the end
of data for a single device. In all cases, additional start-up
bytes of data are required to provide four clocks for the startup sequence at the end of configuration. Long daisy chains
require additional startup bytes to shift the last data through
the chain. All start-up bytes are "don’t cares".
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Spartan and Spartan-XL Families Field Programmable Gate Arrays
Table 16: Spartan/XL Data Stream Formats
Serial Modes
(D0...)
Express Mode
(D0-D7)
(Spartan-XL only)
11111111b
FFFFh
0010b
11110010b
COUNT[23:0]
COUNT[23:0](1)
1111b
-
-
11010010b
0b
11111110b(2)
Data Frame
DATA[n–1:0]
DATA[n–1:0]
CRC or Constant
Field Check
xxxx (CRC)
or 0110b
11010010b
-
FFD2FFFFFFh
01111111b
-
FFh
FFFFFFFFFFFFFFh
Data Type
Fill Byte
Preamble Code
Length Count
Fill Bits
Field Check
Code
Start Field
Extend Write
Cycle
Postamble
Start-Up Bytes(3)
Legend:
Unshaded
Once per bitstream
Light
Once per data frame
Dark
Once per device
A selection of CRC or non-CRC error checking is allowed by
the bitstream generation software. The Spartan-XL Express
mode only supports non-CRC error checking. The
non-CRC error checking tests for a designated
end-of-frame field for each frame. For CRC error checking,
the software calculates a running CRC and inserts a unique
four-bit partial check at the end of each frame. The 11-bit
CRC check of the last frame of an FPGA includes the last
seven data bits.
Detection of an error results in the suspension of data loading before DONE goes High, and the pulling down of the
INIT pin. In Master serial mode, CCLK continues to operate
externally. The user must detect INIT and initialize a new
configuration by pulsing the PROGRAM pin Low or cycling
VCC.
Cyclic Redundancy Check (CRC) for Configuration and Readback
The Cyclic Redundancy Check is a method of error detection in data transmission applications. Generally, the transmitting system performs a calculation on the serial
bitstream. The result of this calculation is tagged onto the
data stream as additional check bits. The receiving system
performs an identical calculation on the bitstream and compares the result with the received checksum.
Each data frame of the configuration bitstream has four
error bits at the end, as shown in Table 16. If a frame data
error is detected during the loading of the FPGA, the configuration process with a potentially corrupted bitstream is terminated. The FPGA pulls the INIT pin Low and goes into a
Wait state.
Notes:
1. Not used by configuration logic.
2. 11111111b for XCS40XL only.
3. Development system may add more start-up bytes.
32
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DS060 (v1.6) September 19, 2001
Product Specification
R
Spartan and Spartan-XL Families Field Programmable Gate Arrays
Table 17: Spartan/XL Program Data
Device
XCS05
XCS10
XCS20
XCS30
XCS40
Max System
Gates
5,000
10,000
20,000
30,000
40,000
CLBs
(Row x Col.)
100
(10 x 10)
196
(14 x 14)
400
(20 x 20)
576
(24 x 24)
784
(28 x 28)
80
112
160
192
224
IOBs
Part Number
XCS05 XCS05XL XCS10 XCS10XL XCS20 XCS20XL XCS30 XCS30XL XCS40 XCS40XL
Supply Voltage
5V
3.3V
5V
3.3V
5V
3.3V
5V
3.3V
5V
3.3V
Bits per Frame
126
127
166
167
226
227
266
267
306
307
Frames
428
429
572
573
788
789
932
933
1,076
1,077
Program Data
53,936
54,491
94,960
95,699
178,096
179,111
247,920
249,119
329,264
330,647
PROM Size
(bits)
53,984
54,544
95,008
95,752
178,144
179,160
247,968
249,168
329,312
330,696
Serial PROM
17S05
17S05XL
17S10
17S10XL
17S20
17S20XL
17S30
17S30XL
17S40
17S40XL
Express Mode
PROM Size
(bits)
-
79,072
-
128,488
-
221,056
-
298,696
-
387,856
Notes:
1. Bits per Frame = (10 x number of rows) + 7 for the top + 13 for the bottom + 1 + 1 start bit + 4 error check bits (+1 for Spartan-XL
device)
Number of Frames = (36 x number of columns) + 26 for the left edge + 41 for the right edge + 1 (+ 1 for Spartan-XL device)
Program Data = (Bits per Frame x Number of Frames) + 8 postamble bits
PROM Size = Program Data + 40 (header) + 8, rounded up to the nearest byte
2. The user can add more "1" bits as leading dummy bits in the header, or, if CRC = off, as trailing dummy bits at the end of any frame,
following the four error check bits. However, the Length Count value must be adjusted for all such extra "one" bits, even for extra
leading ones at the beginning of the header.
3. Express mode adds 57 (XCS05XL, XCS10XL), or 53 (XCS20XL, XCS30XL, XCS40XL) bits per frame, + additional start-up bits.
During Readback, 11 bits of the 16-bit checksum are added
to the end of the Readback data stream. The checksum is
computed using the CRC-16 CCITT polynomial, as shown
in Figure 29. The checksum consists of the 11 most significant bits of the 16-bit code. A change in the checksum indicates a change in the Readback bitstream. A comparison to
a previous checksum is meaningful only if the readback
DS060 (v1.6) September 19, 2001
Product Specification
data is independent of the current device state. CLB outputs
should not be included (Readback Capture option not
used), and if RAM is present, the RAM content must be
unchanged.
Statistically, one error out of 2048 might go undetected.
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Spartan and Spartan-XL Families Field Programmable Gate Arrays
X2
X15
X16
2
0 1
3
4
5
6
7
8
9 10 11 12 13 14
15
SERIAL DATA IN
Polynomial: X16 + X15 + X2 + 1
1
1
1
1
0 15 14 13 12 11 10 9
START BIT
1
LAST DATA FRAME
8
7
6
5
CRC – CHECKSUM
Readback Data Stream
DS060_29_080400
Figure 29: Circuit for Generating CRC-16
Configuration Sequence
There are four major steps in the Spartan/XL power-up configuration sequence.
•
•
•
•
Configuration Memory Clear
Initialization
Configuration
Start-up
At the end of each complete pass through the frame
addressing, the power-on time-out delay circuitry and the
level of the PROGRAM pin are tested. If neither is asserted,
the logic initiates one additional clearing of the configuration
frames and then tests the INIT input.
The full process is illustrated in Figure 30.
Configuration Memory Clear
When power is first applied or is reapplied to an FPGA, an
internal circuit forces initialization of the configuration logic.
When VCC reaches an operational level, and the circuit
passes the write and read test of a sample pair of configuration bits, a time delay is started. This time delay is nominally 16 ms. The delay is four times as long when in Master
Serial Mode to allow ample time for all slaves to reach a stable VCC. When all INIT pins are tied together, as recommended, the longest delay takes precedence. Therefore,
devices with different time delays can easily be mixed and
matched in a daisy chain.
This delay is applied only on power-up. It is not applied
when reconfiguring an FPGA by pulsing the PROGRAM pin
34
Low. During this time delay, or as long as the PROGRAM
input is asserted, the configuration logic is held in a Configuration Memory Clear state. The configuration-memory
frames are consecutively initialized, using the internal oscillator.
Initialization
During initialization and configuration, user pins HDC, LDC,
INIT and DONE provide status outputs for the system interface. The outputs LDC, INIT and DONE are held Low and
HDC is held High starting at the initial application of power.
The open drain INIT pin is released after the final initialization pass through the frame addresses. There is a deliberate delay before a Master-mode device recognizes an
inactive INIT. Two internal clocks after the INIT pin is recognized as High, the device samples the MODE pin to determine the configuration mode. The appropriate interface
lines become active and the configuration preamble and
data can be loaded.
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Product Specification
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Spartan and Spartan-XL Families Field Programmable Gate Arrays
Configuration
VCC
Valid
Boundary Scan
Instructions
Available:
The 0010 preamble code indicates that the following 24 bits
represent the length count for serial modes. The length
count is the total number of configuration clocks needed to
load the complete configuration data. (Four additional configuration clocks are required to complete the configuration
process, as discussed below.) After the preamble and the
length count have been passed through to any device in the
daisy chain, its DOUT is held High to prevent frame start
bits from reaching any daisy-chained devices. In Spartan-XL Express mode, the length count bits are ignored,
and DOUT is held Low, to disable the next device in the
pseudo daisy chain.
No
Yes
Test MODE, Generate
One Time-Out Pulse
of 16 or 64 ms
PROGRAM
= Low
Yes
Keep Clearing
Configuration
Memory
EXTEST*
SAMPLE/PRELOAD Completely Clear
BYPASS
Configuration Memory ~1.3 µs per Frame
CONFIGURE*
Once More
(* if PROGRAM = High)
INIT
High? if
Master
Yes
A specific configuration bit, early in the first frame of a master device, controls the configuration-clock rate and can
increase it by a factor of eight. Therefore, if a fast configuration clock is selected by the bitstream, the slower clock rate
is used until this configuration bit is detected.
No
Master Delays Before
Sampling Mode Line
Master CCLK
Goes Active
Load One
Configuration
Data Frame
Frame
Error
Yes
Pull INIT Low
and Stop
No
SAMPLE/PRELOAD
BYPASS
Configuration
memory
Full
Yes
LDC Output = L, HDC Output = H
Sample
Mode Line
No
No
Yes
Start-Up
Sequence
F
I/O Active
Operational
EXTEST
SAMPLE PRELOAD
BYPASS
USER 1
USER 2
CONFIGURE
READBACK
If Boundary Scan
is Selected
DS060_30_080400
Figure 30: Power-up Configuration Sequence
DS060 (v1.6) September 19, 2001
Product Specification
Delaying Configuration After Power-Up
There are two methods of delaying configuration after
power-up: put a logic Low on the PROGRAM input, or pull
the bidirectional INIT pin Low, using an open-collector
(open-drain) driver. (See Figure 30.)
A Low on the PROGRAM input is the more radical
approach, and is recommended when the power-supply rise
time is excessive or poorly defined. As long as PROGRAM
is Low, the FPGA keeps clearing its configuration memory.
When PROGRAM goes High, the configuration memory is
cleared one more time, followed by the beginning of configuration, provided the INIT input is not externally held Low.
Note that a Low on the PROGRAM input automatically
forces a Low on the INIT output. The Spartan/XL PROGRAM pin has a permanent weak pull-up. Avoid holding
PROGRAM Low for more than 500 µs.
Pass
Configuration
Data to DOUT
CCLK
Count Equals
Length
Count
Each frame has a start field followed by the frame-configuration data bits and a frame error field. If a frame data error
is detected, the FPGA halts loading, and signals the error by
pulling the open-drain INIT pin Low. After all configuration
frames have been loaded into an FPGA using a serial
mode, DOUT again follows the input data so that the
remaining data is passed on to the next device. In
Spartan-XL Express mode, when the first device is fully programmed, DOUT goes High to enable the next device in the
chain.
Using an open-collector or open-drain driver to hold INIT
Low before the beginning of configuration causes the FPGA
to wait after completing the configuration memory clear
operation. When INIT is no longer held Low externally, the
device determines its configuration mode by capturing the
state of the Mode pins, and is ready to start the configuration process. A master device waits up to an additional
300 µs to make sure that any slaves in the optional daisy
chain have seen that INIT is High.
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Spartan and Spartan-XL Families Field Programmable Gate Arrays
For more details on Configuration, refer to the Xilinx Application Note "FPGA Configuration Guidelines" (XAPP090).
Start-Up
Start-up is the transition from the configuration process to
the intended user operation. This transition involves a
change from one clock source to another, and a change
from interfacing parallel or serial configuration data where
most outputs are 3-stated, to normal operation with I/O pins
active in the user system. Start-up must make sure that the
user logic ‘wakes up’ gracefully, that the outputs become
active without causing contention with the configuration signals, and that the internal flip-flops are released from the
Global Set/Reset (GSR) at the right time.
Start-Up Initiation
Two conditions have to be met in order for the start-up
sequence to begin:
•
•
The chip's internal memory must be full, and
The configuration length count must be met, exactly.
In all configuration modes except Express mode, Spartan/XL devices read the expected length count from the bitstream and store it in an internal register. The length count
varies according to the number of devices and the composition of the daisy chain. Each device also counts the number
of CCLKs during configuration.
In Express mode, there is no length count. The start-up
sequence for each device begins when the device has
received its quota of configuration data. Wiring the DONE
pins of several devices together delays start-up of all
devices until all are fully configured.
Start-Up Events
The device can be programmed to control three start-up
events.
•
•
•
The release of the open-drain DONE output
The termination of the Global Three-State and the
change of configuration-related pins to the user
function, activating all IOBs.
The termination of the Global Set/Reset initialization of
all CLB and IOB storage elements.
Figure 31 describes start-up timing in detail. The three
events — DONE going High, the internal GSR being
de-activated, and the user I/O going active — can all occur
in any arbitrary sequence. This relative timing is selected by
36
R
options in the bitstream generation software. Heavy lines in
Figure 31 show the default timing. The thin lines indicate all
other possible timing options. The start-up logic must be
clocked until the "F" (Finished) state is reached.
The default option, and the most practical one, is for DONE
to go High first, disconnecting the configuration data source
and avoiding any contention when the I/Os become active
one clock later. GSR is then released another clock period
later to make sure that user operation starts from stable
internal conditions. This is the most common sequence,
shown with heavy lines in Figure 31, but the designer can
modify it to meet particular requirements.
Start-Up Clock
Normally, the start-up sequence is controlled by the internal
device oscillator (CCLK), which is asynchronous to the system clock. As a configuration option, they can be triggered
by an on-chip user net called UCLK. This user net can be
accessed by placing the STARTUP library symbol, and the
start-up modes are known as UCLK_NOSYNC or
UCLK_SYNC. This allows the device to wake up in synchronism with the user system.
DONE Pin
Note that DONE is an open-drain output and does not go
High unless an internal pull-up is activated or an external
pull-up is attached. The internal pull-up is activated as the
default by the bitstream generation software.
The DONE pin can also be wire-ANDed with DONE pins of
other FPGAs or with other external signals, and can then be
used as input to the start-up control logic. This is called
“Start-up Timing Synchronous to Done In” and is selected
by either CCLK_SYNC or UCLK_SYNC. When DONE is not
used as an input, the operation is called “Start-up Timing
Not Synchronous to DONE In,” and is selected by either
CCLK_NOSYNC or UCLK_NOSYNC. Express mode configuration always uses either CCLK_SYNC or UCLK_SYNC
timing, while the other configuration modes can use any of
the four timing sequences.
When the UCLK_SYNC option is enabled, the user can
externally hold the open-drain DONE output Low, and thus
stall all further progress in the start-up sequence until
DONE is released and has gone High. This option can be
used to force synchronization of several FPGAs to a common user clock, or to guarantee that all devices are successfully configured before any I/Os go active.
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Spartan and Spartan-XL Families Field Programmable Gate Arrays
Length Count Match
CCLK Period
CCLK
F
DONE
C1
C2
C3
C4
I/O
CCLK_NOSYNC
C2
C3
C4
C2
C3
C4
GSR Active
DONE IN
F = Finished, no more
configuration clocks needed
Daisy-chain lead device
must have latest F
Heavy lines describe
default timing
F
DONE
C1, C2 or C3
I/O
CCLK_SYNC
Di
Di+1
GSR Active
Di
Di+1
F
DONE
C1
U2
U3
U4
U2
U3
U4
U2
U3
U4
I/O
UCLK_NOSYNC
GSR Active
DONE IN
F
DONE
C1
U2
I/O
UCLK_SYNC
Di
Di+1
Di+2
Di+1
Di+2
GSR Active
Di
Synchronization
Uncertainty
UCLK Period
DS060_39_082801
Figure 31: Start-up Timing
Configuration Through the Boundary Scan
Pins
•
•
Spartan/XL devices can be configured through the boundary scan pins. The basic procedure is as follows:
•
•
•
Power up the FPGA with INIT held Low (or drive the
PROGRAM pin Low for more than 300 ns followed by a
High while holding INIT Low). Holding INIT Low allows
enough time to issue the CONFIG command to the
FPGA. The pin can be used as I/O after configuration if
a resistor is used to hold INIT Low.
Issue the CONFIG command to the TMS input.
DS060 (v1.6) September 19, 2001
Product Specification
Wait for INIT to go High.
Sequence the boundary scan Test Access Port to the
SHIFT-DR state.
Toggle TCK to clock data into TDI pin.
The user must account for all TCK clock cycles after INIT
goes High, as all of these cycles affect the Length Count
compare.
For more detailed information, refer to the Xilinx application
note, "Boundary Scan in FPGA Devices." This application
note applies to Spartan and Spartan-XL devices.
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Spartan and Spartan-XL Families Field Programmable Gate Arrays
Readback
The user can read back the content of configuration memory and the level of certain internal nodes without interfering
with the normal operation of the device.
Readback not only reports the downloaded configuration
bits, but can also include the present state of the device,
represented by the content of all flip-flops and latches in
CLBs and IOBs, as well as the content of function generators used as RAMs.
Although readback can be performed while the device is
operating, for best results and to freeze a known capture
state, it is recommended that the clock inputs be stopped
until readback is complete.
Readback of Spartan-XL Express mode bitstreams results
in data that does not resemble the original bitstream,
because the bitstream format differs from other modes.
Spartan/XL Readback does not use any dedicated pins, but
uses four internal nets (RDBK.TRIG, RDBK.DATA,
RDBK.RIP and RDBK.CLK) that can be routed to any IOB.
To access the internal Readback signals, instantiate the
READBACK library symbol and attach the appropriate pad
symbols, as shown in Figure 32.
After Readback has been initiated by a Low-to-High transition on RDBK.TRIG, the RDBK.RIP (Read In Progress) output goes High on the next rising edge of RDBK.CLK.
Subsequent rising edges of this clock shift out Readback
data on the RDBK.DATA net.
of the first frame. The first two data bits of the first frame are
always High.
Each frame ends with four error check bits. They are read
back as High. The last seven bits of the last frame are also
read back as High. An additional Start bit (Low) and an
11-bit Cyclic Redundancy Check (CRC) signature follow,
before RDBK.RIP returns Low.
Readback Options
Readback options are: Readback Capture, Readback
Abort, and Clock Select. They are set with the bitstream
generation software.
Readback Capture
When the Readback Capture option is selected, the data
stream includes sampled values of CLB and IOB signals.
The rising edge of RDBK.TRIG latches the inverted values
of the four CLB outputs, the IOB output flip-flops and the
input signals I1 and I2. Note that while the bits describing
configuration (interconnect, function generators, and RAM
content) are not inverted, the CLB and IOB output signals
are inverted. RDBK.TRIG is located in the lower-left corner
of the device.
When the Readback Capture option is not selected, the values of the capture bits reflect the configuration data originally written to those memory locations. If the RAM
capability of the CLBs is used, RAM data are available in
Readback, since they directly overwrite the F and G function-table configuration of the CLB.
Readback data does not include the preamble, but starts
with five dummy bits (all High) followed by the Start bit (Low)
If Unconnected,
Default is CCLK
DATA
CLK
READ_TRIGGER
TRIG
READBACK
RIP
READ_DATA
OBUF
IBUF
DS060_31_080400
Figure 32: Readback Schematic Example
38
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Product Specification
R
Spartan and Spartan-XL Families Field Programmable Gate Arrays
Readback Abort
When the Readback Abort option is selected, a High-to-Low
transition on RDBK.TRIG terminates the Readback operation and prepares the logic to accept another trigger.
After an aborted Readback, additional clocks (up to one
Readback clock per configuration frame) may be required to
re-initialize the control logic. The status of Readback is indicated by the output control net RDBK.RIP. RDBK.RIP is
High whenever a readback is in progress.
Clock Select
CCLK is the default clock. However, the user can insert
another clock on RDBK.CLK. Readback control and data
are clocked on rising edges of RDBK.CLK. If Readback
must be inhibited for security reasons, the Readback control
nets are simply not connected. RDBK.CLK is located in the
lower right chip corner.
Violating the Maximum High and Low Time
Specification for the Readback Clock
The Readback clock has a maximum High and Low time
specification. In some cases, this specification cannot be
DS060 (v1.6) September 19, 2001
Product Specification
met. For example, if a processor is controlling Readback, an
interrupt may force it to stop in the middle of a readback.
This necessitates stopping the clock, and thus violating the
specification.
The specification is mandatory only on clocking data at the
end of a frame prior to the next start bit. The transfer mechanism will load the data to a shift register during the last six
clock cycles of the frame, prior to the start bit of the following
frame. This loading process is dynamic, and is the source of
the maximum High and Low time requirements.
Therefore, the specification only applies to the six clock
cycles prior to and including any start bit, including the
clocks before the first start bit in the Readback data stream.
At other times, the frame data is already in the register and
the register is not dynamic. Thus, it can be shifted out just
like a regular shift register.
The user must precisely calculate the location of the Readback data relative to the frame. The system must keep track
of the position within a data frame, and disable interrupts
before frame boundaries. Frame lengths and data formats
are listed in Table 16 and Table 17.
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Spartan and Spartan-XL Families Field Programmable Gate Arrays
Readback Switching Charateristics Guidelines
The following guidelines reflect worst-case values over the
recommended operating conditions.
Finished
Internal Net
rdbk.TRIG
TRCRT
TRTRC
TRCRT
TRTRC
rdclk.I
TRCL
TRCH
rdbk.RIP
TRCRR
rdbk.DATA
DUMMY
DUMMY
VALID
VALID
TRCRD
DS060_32_080400
Figure 33: Spartan and Spartan-XL Readback Timing Diagram
Spartan and Spartan-XL Readback Switching Characteristics
Symbol
Min
Max
Units
rdbk.TRIG setup to initiate and abort Readback
200
-
ns
rdbk.TRIG hold to initiate and abort Readback
50
-
ns
rdbk.DATA delay
-
250
ns
TRCRR
rdbk.RIP delay
-
250
ns
TRCH
High time
250
500
ns
TRCL
Low time
250
500
ns
TRTRC
Description
rdbk.TRIG
TRCRT
TRCRD
rdclk.I
Notes:
1. Timing parameters apply to all speed grades.
2. If rdbk.TRIG is High prior to Finished, Finished will trigger the first Readback.
40
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Product Specification
R
Spartan and Spartan-XL Families Field Programmable Gate Arrays
Configuration Switching Characteristics
VCC
RE-PROGRAM
TPOR
>300 ns
PROGRAM
TPI
INIT
TICCK
TCCLK
CCLK Output or Input
<300 ns
Mode Pins
(Required)
DONE Response
<300 ns
I/O
DS060_33_080400
Master Mode
Symbol
Min
Max
Units
Power-on reset
40
130
ms
Program Latency
30
200
µs per CLB column
TICCK
CCLK (output) delay
40
250
µs
TCCLK
CCLK (output) period, slow
640
2000
ns
TCCLK
CCLK (output) period, fast
100
250
ns
Description
Min
Max
Units
TPOR
TPI
Description
Slave Mode
Symbol
TPOR
Power-on reset
10
33
ms
TPI
Program latency
30
200
µs per CLB column
TICCK
CCLK (input) delay (required)
4
-
µs
TCCLK
CCLK (input) period (required)
80
-
ns
DS060 (v1.6) September 19, 2001
Product Specification
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Spartan and Spartan-XL Families Field Programmable Gate Arrays
Spartan Detailed Specifications
Definition of Terms
In the following tables, some specifications may be designated as Advance or Preliminary. These terms are defined as
follows:
Advance: Initial estimates based on simulation and/or extrapolation from other speed grades, devices, or families. Values
are subject to change. Use as estimates, not for production.
Preliminary: Based on preliminary characterization. Further changes are not expected.
Unmarked: Specifications not identified as either Advance or Preliminary are to be considered Final.
Notwithstanding the definition of the above terms, all specifications are subject to change without notice.
Except for pin-to-pin input and output parameters, the AC parameter delay specifications included in this document are
derived from measuring internal test patterns. All specifications are representative of worst-case supply voltage and junction
temperature conditions. The parameters included are common to popular designs and typical applications.
Spartan Absolute Maximum Ratings(1)
Symbol
Description
VCC
Supply voltage relative to GND
VIN
Input voltage relative to GND(2,3)
output(2,3)
VTS
Voltage applied to 3-state
TSTG
Storage temperature (ambient)
TJ
Junction temperature
Plastic packages
Value
Units
–0.5 to +7.0
V
–0.5 to VCC +0.5
V
–0.5 to VCC +0.5
V
–65 to +150
°C
+125
°C
Notes:
1. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or any other conditions beyond those listed under Operating Conditions
is not implied. Exposure to Absolute Maximum Ratings conditions for extended periods of time may affect device reliability.
2. Maximum DC overshoot (above VCC) or undershoot (below GND) must be limited to either 0.5V or 10 mA, whichever is easier to
achieve.
3. Maximum AC (during transitions) conditions are as follows; the device pins may undershoot to –2.0V or overshoot to +7.0V, provided
this overshoot or undershoot lasts no more than 11 ns with a forcing current no greater than 100 mA.
4. For soldering guidelines, see the Package Infomation on the Xilinx website.
Spartan Recommended Operating Conditions
Symbol
VCC
Description
Supply voltage relative to GND, TJ = 0°C to +85°C
Supply voltage relative to GND, TJ = –40°C to
VIH
High-level input voltage(2)
VIL
Low-level input
voltage(2)
TIN
Input signal transition time
+100°C(1)
Min
Max
Units
Commercial
4.75
5.25
V
Industrial
4.5
5.5
V
TTL inputs
2.0
VCC
V
CMOS inputs
70%
100%
VCC
TTL inputs
0
0.8
V
CMOS inputs
0
20%
VCC
-
250
ns
Notes:
1. At junction temperatures above those listed as Recommended Operating Conditions, all delay parameters increase by 0.35% per °C.
2. Input and output measurement thresholds are: 1.5V for TTL and 2.5V for CMOS.
42
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Product Specification
R
Spartan and Spartan-XL Families Field Programmable Gate Arrays
Spartan DC Characteristics Over Operating Conditions
Symbol
VOH
VOL
Description
Min
High-level output voltage @ IOH = –4.0 mA, VCC min
TTL outputs
High-level output voltage @ IOH = –1.0 mA, VCC min
CMOS outputs
Low-level output voltage @ IOL = 12.0 mA, VCC min(1)
2.4
-
V
-
V
TTL outputs
-
0.4
V
CMOS outputs
-
0.4
V
VDR
Data retention supply voltage (below which configuration data may be lost)
Quiescent FPGA supply current(2)
3.0
-
V
Commercial
-
3.0
mA
Industrial
-
6.0
mA
–10
+10
µA
Input or output leakage current
CIN
Input capacitance (sample tested)
IRPU
Pad pull-up (when selected) @ VIN = 0V (sample tested)
Pad pull-down (when selected) @ VIN = 5V (sample tested)
IRPD
Units
VCC – 0.5
ICCO
IL
Max
-
10
pF
0.02
0.25
mA
0.02
-
mA
Notes:
1. With 50% of the outputs simultaneously sinking 12 mA, up to a maximum of 64 pins.
2. With no output current loads, no active input pull-up resistors, all package pins at VCC or GND, and the FPGA configured with a Tie
option.
Spartan Global Buffer Switching Characteristic Guidelines
Testing of the switching parameters is modeled after testing
methods specified by MIL-M-38510/605. All devices are
100% functionally tested. Internal timing parameters are
derived from measuring internal test patterns. Listed below
are representative values where one global clock input
drives one vertical clock line in each accessible column, and
where all accessible IOB and CLB flip-flops are clocked by
the global clock net.
When fewer vertical clock lines are connected, the clock distribution is faster; when multiple clock lines per column are
driven from the same global clock, the delay is longer. For
more specific, more precise, and worst-case guaranteed
data, reflecting the actual routing structure, use the values
provided by the static timing analyzer (TRCE in the Xilinx
Development System) and back-annotated to the simulation
netlist. These path delays, provided as a guideline, have
been extracted from the static timing analyzer report. All
timing parameters assume worst-case operating conditions
(supply voltage and junction temperature).
Speed Grade
Symbol
TPG
TSG
Description
From pad through Primary buffer, to any clock K
From pad through Secondary buffer, to any clock K
DS060 (v1.6) September 19, 2001
Product Specification
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-4
-3
Device
Max
Max
Units
XCS05
2.0
4.0
ns
XCS10
2.4
4.3
ns
XCS20
2.8
5.4
ns
XCS30
3.2
5.8
ns
XCS40
3.5
6.4
ns
XCS05
2.5
4.4
ns
XCS10
2.9
4.7
ns
XCS20
3.3
5.8
ns
XCS30
3.6
6.2
ns
XCS40
3.9
6.7
ns
43
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Spartan and Spartan-XL Families Field Programmable Gate Arrays
Spartan CLB Switching Characteristic Guidelines
Testing of switching parameters is modeled after testing
methods specified by MIL-M-38510/605. All devices are
100% functionally tested. Internal timing parameters are
derived from measuring internal test patterns. Listed below
are representative values. For more specific, more precise,
and worst-case guaranteed data, use the values reported
by the static timing analyzer (TRCE in the Xilinx Development System) and back-annotated to the simulation netlist.
All timing parameters assume worst-case operating conditions (supply voltage and junction temperature). Values
apply to all Spartan devices and expressed in nanoseconds
unless otherwise noted.
Speed Grade
-4
Description
Symbol
Clocks
-3
Min
Max
Min
Max
Units
TCH
Clock High time
3.0
-
4.0
-
ns
TCL
Clock Low time
3.0
-
4.0
-
ns
-
1.2
-
1.6
ns
Combinatorial Delays
TILO
F/G inputs to X/Y outputs
TIHO
F/G inputs via H to X/Y outputs
THH1O C inputs via H1 via H to X/Y outputs
CLB Fast Carry Logic
-
2.0
-
2.7
ns
-
1.7
-
2.2
ns
TOPCY
Operand inputs (F1, F2, G1, G4) to COUT
-
1.7
-
2.1
ns
TASCY
Add/Subtract input (F3) to COUT
-
2.8
-
3.7
ns
TINCY
Initialization inputs (F1, F3) to COUT
-
1.2
-
1.4
ns
TSUM
CIN through function generators to X/Y outputs
-
2.0
-
2.6
ns
-
0.5
-
0.6
ns
-
2.1
-
2.8
ns
CIN to C OUT, bypass function generators
TBYP
Sequential Delays
TCKO
Clock K to Flip-Flop outputs Q
Setup Time before Clock K
TICK
F/G inputs
1.8
-
2.4
-
ns
TIHCK
F/G inputs via H
2.9
-
3.9
-
ns
C inputs via H1 through H
2.3
-
3.3
-
ns
TDICK
C inputs via DIN
1.3
-
2.0
-
ns
TECCK
C inputs via EC
THH1CK
2.0
-
2.6
-
ns
C inputs via S/R, going Low (inactive)
TRCK
Hold Time after Clock K
2.5
-
4.0
-
ns
All Hold times, all devices
0.0
-
0.0
-
ns
3.0
-
4.0
-
ns
-
3.0
-
4.0
ns
11.5
-
13.5
-
ns
Set/Reset Direct
TRPW
Width (High)
TRIO
Delay from C inputs via S/R, going High to Q
Global Set/Reset
44
TMRW
Minimum GSR pulse width
TMRQ
Delay from GSR input to any Q
FTOG
Toggle Frequency (MHz)
(for export control purposes)
See page 50 for TRRI values per device.
-
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166
-
125
MHz
DS060 (v1.6) September 19, 2001
Product Specification
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Spartan and Spartan-XL Families Field Programmable Gate Arrays
Spartan CLB RAM Synchronous (Edge-Triggered) Write Operation Guidelines
by the static timing analyzer (TRCE in the Xilinx Development System) and back-annotated to the simulation netlist.
All timing parameters assume worst-case operating conditions (supply voltage and junction temperature). Values
apply to all Spartan devices and are expressed in nanoseconds unless otherwise noted.
Testing of switching parameters is modeled after testing
methods specified by MIL-M-38510/605. All devices are
100% functionally tested. Internal timing parameters are
derived from measuring internal test patterns. Listed below
are representative values. For more specific, more precise,
and worst-case guaranteed data, use the values reported
Speed Grade
-4
TWCS
Min
Max
Min
Max
Units
Address write cycle time (clock K period)
16x2
8.0
-
11.6
-
ns
32x1
8.0
-
11.6
-
ns
Clock K pulse width (active edge)
16x2
4.0
-
5.8
-
ns
32x1
4.0
-
5.8
-
ns
Address setup time before clock K
16x2
1.5
-
2.0
-
ns
32x1
1.5
-
2.0
-
ns
Address hold time after clock K
16x2
0.0
-
0.0
-
ns
32x1
0.0
-
0.0
-
ns
DIN setup time before clock K
16x2
1.5
-
2.7
-
ns
32x1
1.5
-
1.7
-
ns
DIN hold time after clock K
16x2
0.0
-
0.0
-
ns
32x1
0.0
-
0.0
-
ns
WE setup time before clock K
16x2
1.5
-
1.6
-
ns
32x1
1.5
-
1.6
-
ns
WE hold time after clock K
16x2
0.0
-
0.0
-
ns
32x1
0.0
-
0.0
-
ns
16x2
-
6.5
-
7.9
ns
32x1
-
7.0
-
9.3
ns
Address read cycle time
16x2
2.6
-
2.6
-
ns
32x1
3.8
-
3.8
-
ns
Data valid after address change (no Write
Enable)
16x2
-
1.2
-
1.6
ns
32x1
-
2.0
-
2.7
ns
Address setup time before clock K
16x2
1.8
-
2.4
-
ns
32x1
2.9
-
3.9
-
ns
Single Port RAM
TWCTS
TWPS
TWPTS
TASS
TASTS
TAHS
TAHTS
TDSS
TDSTS
TDHS
TDHTS
TWSS
TWSTS
TWHS
TWHTS
TWOS
-3
Size (1)
Symbol
Write Operation
Data valid after clock K
TWOTS
Read Operation
TRC
TRCT
TILO
TIHO
TICK
TIHCK
Notes:
1. Timing for 16 x 1 RAM option is identical to 16 x 2 RAM timing.
DS060 (v1.6) September 19, 2001
Product Specification
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Spartan and Spartan-XL Families Field Programmable Gate Arrays
Spartan CLB RAM Synchronous (Edge-Triggered) Write Operation Guidelines (continued)
Testing of switching parameters is modeled after testing
methods specified by MIL-M-38510/605. All devices are
100% functionally tested. Internal timing parameters are
derived from measuring internal test patterns. Listed below
are representative values. For more specific, more precise,
and worst-case guaranteed data, use the values reported
by the static timing analyzer (TRCE in the Xilinx Development System) and back-annotated to the simulation netlist.
All timing parameters assume worst-case operating conditions (supply voltage and junction temperature). Values
apply to all Spartan devices and are expressed in nanoseconds unless otherwise noted.
Dual-Port RAM Synchronous (Edge-Triggered) Write Operation Characteristics
-4
Symbol
Dual Port RAM
-3
Size(1)
Min
Max
Min
Max
Units
Write Operation
TWCDS
Address write cycle time (clock K period)
16x1
8.0
-
11.6
-
ns
TWPDS
Clock K pulse width (active edge)
16x1
4.0
-
5.8
-
ns
TASDS
Address setup time before clock K
16x1
1.5
-
2.1
-
ns
TAHDS
Address hold time after clock K
16x1
0
-
0
-
ns
TDSDS
DIN setup time before clock K
16x1
1.5
-
1.6
-
ns
TDHDS
DIN hold time after clock K
16x1
0
-
0
-
ns
TWSDS
WE setup time before clock K
16x1
1.5
-
1.6
-
ns
TWHDS
WE hold time after clock K
16x1
0
-
0
-
ns
TWODS
Data valid after clock K
16x1
-
6.5
-
7.0
ns
Notes:
1. Read Operation timing for 16 x 1 dual-port RAM option is identical to 16 x 2 single-port RAM timing
Spartan CLB RAM Synchronous (Edge-Triggered) Write Timing
Single Port
Dual Port
TWPS
TWPDS
WCLK (K)
WCLK (K)
TWHS
TWSS
WE
WE
TDHS
TDSS
DATA IN
TDSDS
TDHDS
TASDS
TAHDS
DATA IN
TAHS
TASS
ADDRESS
ADDRESS
TILO
DATA OUT
TWHDS
TWSDS
TILO
TILO
TWOS
OLD
NEW
DATA OUT
TILO
TWODS
OLD
NEW
DS060_34_011300
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Spartan and Spartan-XL Families Field Programmable Gate Arrays
Spartan Pin-to-Pin Output Parameter Guidelines
Testing of switching parameters is modeled after testing
methods specified by MIL-M-38510/605. All devices are
100% functionally tested. Pin-to-pin timing parameters are
derived from measuring external and internal test patterns
and are guaranteed over worst-case operating conditions
(supply voltage and junction temperature). Listed below are
representative values for typical pin locations and normal
clock loading. For more specific, more precise, and
worst-case guaranteed data, reflecting the actual routing
structure, use the values provided by the static timing analyzer (TRCE in the Xilinx Development System) and
back-annotated to the simulation netlist. These path delays,
provided as a guideline, have been extracted from the static
timing analyzer report.
Spartan Output Flip-Flop, Clock-to-Out
Speed Grade
Symbol
Description
-4
-3
Device
Max
Max
XCS05
5.3
8.7
ns
XCS10
5.7
9.1
ns
XCS20
6.1
9.3
ns
XCS30
6.5
9.4
ns
XCS40
6.8
10.2
ns
XCS05
9.0
11.5
ns
XCS10
9.4
12.0
ns
XCS20
9.8
12.2
ns
XCS30
10.2
12.8
ns
XCS40
10.5
12.8
ns
XCS05
5.8
9.2
ns
XCS10
6.2
9.6
ns
XCS20
6.6
9.8
ns
XCS30
7.0
9.9
ns
XCS40
7.3
10.7
ns
XCS05
9.5
12.0
ns
XCS10
9.9
12.5
ns
XCS20
10.3
12.7
ns
XCS30
10.7
13.2
ns
XCS40
11.0
14.3
ns
Units
Global Primary Clock to TTL Output using OFF
TICKOF
TICKO
Fast
Slew-rate limited
Global Secondary Clock to TTL Output using OFF
TICKSOF
TICKSO
Fast
Slew-rate limited
Delay Adder for CMOS Outputs Option
TCMOSOF
Fast
All devices
0.8
1.0
ns
TCMOSO
Slew-rate limited
All devices
1.5
2.0
ns
Notes:
1. Listed above are representative values where one global clock input drives one vertical clock line in each accessible column,and
where all accessible IOB and CLB flip-flops are clocked by the global clock net.
2. Output timing is measured at ~50% V CC threshold with 50 pF external capacitive load. For different loads, see Figure 33.
3. OFF = Output Flip-Flop
DS060 (v1.6) September 19, 2001
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Spartan and Spartan-XL Families Field Programmable Gate Arrays
Capacitive Load Factor
3
2
Delta Delay (ns)
Figure 33 shows the relationship between I/O output delay
and load capacitance. It allows a user to adjust the specified
output delay if the load capacitance is different than 50 pF.
For example, if the actual load capacitance is 120 pF, add
2.5 ns to the specified delay. If the load capacitance is 20
pF, subtract 0.8 ns from the specified output delay.
Figure 33 is usable over the specified operating conditions
of voltage and temperature and is independent of the output
slew rate control.
1
0
-1
-2
0
20
40
60
80
100
120
140
Capacitance (pF)
DS060_35_080400
Figure 34: Delay Factor at Various Capacitive Loads
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Product Specification
R
Spartan and Spartan-XL Families Field Programmable Gate Arrays
Spartan Pin-to-Pin Input Parameter Guidelines
Testing of switching parameters is modeled after testing
methods specified by MIL-M-38510/605. All devices are
100% functionally tested. Pin-to-pin timing parameters are
derived from measuring external and internal test patterns
and are guaranteed over worst-case operating conditions
(supply voltage and junction temperature). Listed below are
representative values for typical pin locations and normal
clock loading.
Spartan Primary and Secondary Setup and Hold
Speed Grade
Symbol
Description
-4
-3
Device
Min
Min
Units
XCS05
1.2 / 1.7
1.8 / 2.5
ns
XCS10
1.0 / 2.3
1.5 / 3.4
ns
XCS20
0.8 / 2.7
1.2 / 4.0
ns
XCS30
0.6 / 3.0
0.9 / 4.5
ns
Input Setup/Hold Times Using Primary Clock and IFF
TPSUF/TPHF
TPSU/TPH
No Delay
With Delay
XCS40
0.4 / 3.5
0.6 / 5.2
ns
XCS05
4.3 / 0.0
6.0 / 0.0
ns
XCS10
4.3 / 0.0
6.0 / 0.0
ns
XCS20
4.3 / 0.0
6.0 / 0.0
ns
XCS30
4.3 / 0.0
6.0 / 0.0
ns
XCS40
5.3 / 0.0
6.8 / 0.0
ns
XCS05
0.9 / 2.2
1.5 / 3.0
ns
XCS10
0.7 / 2.8
1.2 / 3.9
ns
XCS20
0.5 / 3.2
0.9 / 4.5
ns
XCS30
0.3 / 3.5
0.6 / 5.0
ns
Input Setup/Hold Times Using Secondary Clock and IFF
TSSUF/TSHF
TSSU/TSH
No Delay
With Delay
XCS40
0.1 / 4.0
0.3 / 5.7
ns
XCS05
4.0 / 0.0
5.7 / 0.0
ns
XCS10
4.0 / 0.0
5.7 / 0.0
ns
XCS20
4.0 / 0.5
5.7 / 0.5
ns
XCS30
4.0 / 0.5
5.7 / 0.5
ns
XCS40
5.0 / 0.0
6.5 / 0.0
ns
Notes:
1. Setup time is measured with the fastest route and the lightest load. Hold time is measured using the furthest distance and a
reference load of one clock pin per IOB/CLB.
2. IFF = Input Flip-flop or Latch
DS060 (v1.6) September 19, 2001
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Spartan and Spartan-XL Families Field Programmable Gate Arrays
Spartan IOB Input Switching Characteristic Guidelines
Testing of switching parameters is modeled after testing
methods specified by MIL-M-38510/605. All devices are
100% functionally tested. Internal timing parameters are
derived from measuring internal test patterns. Listed below
are representative values. For more specific, more precise,
and worst-case guaranteed data, use the values reported
by the static timing analyzer (TRCE in the Xilinx Development System) and back-annotated to the simulation netlist.
These path delays, provided as a guideline, have been
extracted from the static timing analyzer report. All timing
parameters assume worst-case operating conditions (supply voltage and junction temperature).
Speed Grade
-4
Symbol
Description
Setup Times - TTL
-3
Device
Min
Max
Min
Max
Units
Inputs(1)
TECIK
Clock Enable (EC) to Clock (IK), no delay
All devices
1.6
-
2.1
-
ns
TPICK
Pad to Clock (IK), no delay
All devices
1.5
-
2.0
-
ns
Clock Enable (EC) to Clock (IK), no delay
All devices
0.0
-
0.9
-
ns
All Other Hold Times
All devices
0.0
-
0.0
-
ns
Hold Times
TIKEC
Propagation Delays - TTL
Inputs(1)
TPID
Pad to I1, I2
All devices
-
1.5
-
2.0
ns
TPLI
Pad to I1, I2 via transparent input latch, no delay
All devices
-
2.8
-
3.6
ns
TIKRI
Clock (IK) to I1, I2 (flip-flop)
All devices
-
2.7
-
2.8
ns
TIKLI
Clock (IK) to I1, I2 (latch enable, active Low)
All devices
-
3.2
-
3.9
ns
TECIKD = TECIK + TDelay
TPICKD = TPICK + TDelay
XCS05
3.6
-
4.0
-
ns
XCS10
3.7
-
4.1
-
ns
TPDLI = TPLI + TDelay
XCS20
3.8
-
4.2
-
ns
XCS30
4.5
-
5.0
-
ns
XCS40
5.5
-
5.5
-
ns
All devices
11.5
-
13.5
-
ns
XCS05
-
9.0
-
11.3
ns
XCS10
-
9.5
-
11.9
ns
XCS20
-
10.0
-
12.5
ns
XCS30
-
10.5
-
13.1
ns
XCS40
-
11.0
-
13.8
ns
Delay Adder for Input with Delay Option
TDelay
Global Set/Reset
TMRW
TRRI
Minimum GSR pulse width
Delay from GSR input to any Q
Notes:
1. Delay adder for CMOS Inputs option: for -3 speed grade, add 0.4 ns; for -4 speed grade, add 0.2 ns.
2. Input pad setup and hold times are specified with respect to the internal clock (IK). For setup and hold times with respect to the clock
input, see the pin-to-pin parameters in the Pin-to-Pin Input Parameters table.
3. Voltage levels of unused pads, bonded or unbonded, must be valid logic levels. Each can be configured with the internal pull-up
(default) or pull-down resistor, or configured as a driven output, or can be driven from an external source.
50
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DS060 (v1.6) September 19, 2001
Product Specification
R
Spartan and Spartan-XL Families Field Programmable Gate Arrays
Spartan IOB Output Switching Characteristic Guidelines
Testing of switching parameters is modeled after testing
methods specified by MIL-M-38510/605. All devices are
100% functionally tested. Internal timing parameters are
derived from measuring internal test patterns. Listed below
are representative values. For more specific, more precise,
and worst-case guaranteed data, use the values reported
by the static timing analyzer (TRCE in the Xilinx Develop-
ment System) and back-annotated to the simulation netlist.
These path delays, provided as a guideline, have been
extracted from the static timing analyzer report. All timing
parameters assume worst-case operating conditions (supply voltage and junction temperature). Values are
expressed in nanoseconds unless otherwise noted.
Speed Grade
-4
Symbol
Description
-3
Device
Min
Max
Min
Max
Units
Clocks
TCH
Clock High
All devices
3.0
-
4.0
-
ns
TCL
Clock Low
All devices
3.0
-
4.0
-
ns
Propagation Delays - TTL Outputs(1,2)
TOKPOF
Clock (OK) to Pad, fast
All devices
-
3.3
-
4.5
ns
TOKPOS
Clock (OK to Pad, slew-rate limited
All devices
-
6.9
-
7.0
ns
TOPF
Output (O) to Pad, fast
All devices
-
3.6
-
4.8
ns
TOPS
Output (O) to Pad, slew-rate limited
All devices
-
7.2
-
7.3
ns
TTSHZ
3-state to Pad High-Z (slew-rate independent)
All devices
-
3.0
-
3.8
ns
TTSONF
3-state to Pad active and valid, fast
All devices
-
6.0
-
7.3
ns
TTSONS
3-state to Pad active and valid, slew-rate limited
All devices
-
9.6
-
9.8
ns
Setup and Hold Times
TOOK
Output (O) to clock (OK) setup time
All devices
2.5
-
3.8
-
ns
TOKO
Output (O) to clock (OK) hold time
All devices
0.0
-
0.0
-
ns
TECOK
Clock Enable (EC) to clock (OK) setup time
All devices
2.0
-
2.7
-
ns
TOKEC
Clock Enable (EC) to clock (OK) hold time
All devices
0.0
-
0.5
-
ns
All devices
11.5
XCS05
-
12.0
-
15.0
ns
XCS10
-
12.5
-
15.7
ns
XCS20
-
13.0
-
16.2
ns
XCS30
-
13.5
-
16.9
ns
XCS40
-
14.0
-
17.5
ns
Global Set/Reset
TMRW
Minimum GSR pulse width
TRPO
Delay from GSR input to any Pad
13.5
ns
Notes:
1. Delay adder for CMOS Outputs option (with fast slew rate option): for -3 speed grade, add 1.0 ns; for -4 speed grade, add 0.8 ns.
2. Delay adder for CMOS Outputs option (with slow slew rate option): for -3 speed grade, add 2.0 ns; for -4 speed grade, add 1.5 ns.
3. Output timing is measured at ~50% VCC threshold, with 50 pF external capacitive loads including test fixture. Slew-rate limited output
rise/fall times are approximately two times longer than fast output rise/fall times.
4. Voltage levels of unused pads, bonded or unbonded, must be valid logic levels. Each can be configured with the internal pull-up
(default) or pull-down resistor, or configured as a driven output, or can be driven from an external source.
DS060 (v1.6) September 19, 2001
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51
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Spartan and Spartan-XL Families Field Programmable Gate Arrays
Spartan-XL Detailed Specifications
Definition of Terms
In the following tables, some specifications may be designated as Advance or Preliminary. These terms are defined as
follows:
Advance: Initial estimates based on simulation and/or extrapolation from other speed grades, devices, or device families.
Values are subject to change. Use as estimates, not for production.
Preliminary: Based on preliminary characterization. Further changes are not expected.
Unmarked: Specifications not identified as either Advance or Preliminary are to be considered Final.
Notwithstanding the definition of the above terms, all specifications are subject to change without notice.
Except for pin-to-pin input and output parameters, the AC parameter delay specifications included in this document are
derived from measuring internal test patterns. All specifications are representative of worst-case supply voltage and junction
temperature conditions. The parameters included are common to popular designs and typical applications.
Spartan-XL Absolute Maximum Ratings(1)
Symbol
VCC
VIN
Description
Supply voltage relative to GND
Input voltage relative to GND
5V Tolerant I/O
Checked (2, 3)
Not 5V Tolerant I/Os(4, 5)
VTS
Voltage applied to 3-state output
Not 5V Tolerant
TSTG
TJ
–0.5 to 4.0
V
–0.5 to 5.5
V
V
–0.5 to 5.5
V
–0.5 to VCC + 0.5
V
–65 to +150
°C
+125
°C
Storage temperature (ambient)
Junction temperature
Units
–0.5 to VCC + 0.5
5V Tolerant I/O Checked (2, 3)
I/Os(4, 5)
Value
Plastic packages
Notes:
1. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or any other conditions beyond those listed under Operating Conditions
is not implied. Exposure to Absolute Maximum Ratings conditions for extended periods of time may affect device reliability.
2. With 5V Tolerant I/Os selected, the Maximum DC overshoot must be limited to either +5.5V or 10 mA and undershoot (below GND)
must be limited to either 0.5V or 10 mA, whichever is easier to achieve.
3. With 5V Tolerant I/Os selected, the Maximum AC (during transitions) conditions are as follows; the device pins may undershoot to
–2.0V or overshoot to + 7.0V, provided this overshoot or undershoot lasts no more than 11 ns with a forcing current no greater than
100 mA.
4. Without 5V Tolerant I/Os selected, the Maximum DC overshoot or undershoot must be limited to either 0.5V or 10 mA, whichever is
easier to achieve.
5. Without 5V Tolerant I/Os selected, the Maximum AC conditions are as follows; the device pins may undershoot to –2.0V or overshoot
to VCC + 2.0V, provided this overshoot or undershoot lasts no more than 11 ns with a forcing current no greater than 100 mA.
6. For soldering guidelines, see the Package Infomation on the Xilinx website.
Spartan-XL Recommended Operating Conditions
Symbol
VCC
Description
Min
Max
Units
Supply voltage relative to GND, TJ = 0°C to +85°C
Commercial
3.0
3.6
V
Supply voltage relative to GND, TJ = –40°C to +100°C (1)
Industrial
3.0
3.6
V
50% of VCC
5.5
V
0
30% of VCC
V
-
250
ns
VIH
High-level input voltage(2)
VIL
Low-level input
voltage(2)
TIN
Input signal transition time
Notes:
1. At junction temperatures above those listed as Operating Conditions, all delay parameters increase by 0.35% per °C.
2. Input and output measurement threshold is ~50% of VCC.
52
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Spartan and Spartan-XL Families Field Programmable Gate Arrays
Spartan-XL DC Characteristics Over Operating Conditions
Symbol
VOH
VOL
VDR
ICCO
ICCPD
IL
Description
Min
Typ.
Max
Units
2.4
-
-
V
90% VCC
-
-
V
Low-level output voltage @ IOL = 12.0 mA, VCC min
Low-level output voltage @ IOL = 24.0 mA, VCC min (LVTTL)(2)
-
-
0.4
V
-
-
0.4
V
Low-level output voltage @ IOL = 1500 µA, (LVCMOS)
Data retention supply voltage (below which configuration data
may be lost)
-
-
V
2.5
-
10% VCC
-
Commercial
-
0.1
2.5
mA
Industrial
-
0.1
5
mA
Commercial
-
0.1
2.5
mA
Industrial
-
0.1
5
mA
–10
-
10
µA
-
-
10
pF
High-level output voltage @ IOH = –4.0 mA, VCC min (LVTTL)
High-level output voltage @ IOH = –500 µA, (LVCMOS)
(LVTTL)(1)
Quiescent FPGA supply current(3,4)
Power Down FPGA supply current(3,5)
Input or output leakage current
V
CIN
Input capacitance (sample tested)
IRPU
Pad pull-up (when selected) @ VIN = 0V (sample tested)
0.02
-
0.25
mA
IRPD
Pad pull-down (when selected) @ VIN = 3.3V (sample tested)
0.02
-
-
mA
Notes:
1. With up to 64 pins simultaneously sinking 12 mA (default mode).
2. With up to 64 pins simultaneously sinking 24 mA (with 24 mA option selected).
3. With 5V tolerance not selected, no internal oscillators, and the FPGA configured with the Tie option.
4. With no output current loads, no active input resistors, and all package pins at VCC or GND.
5. With PWRDWN active.
Supply Current Requirements During Power-On
Spartan-XL FPGAs require that a minimum supply current
ICCPO be provided to the VCC lines for a successful power
on. If more current is available, the FPGA can consume
more than ICCPO min., though this cannot adversely affect
reliability.
Symbol
I CCPO
TCCPO
A maximum limit for ICCPO is not specified. Be careful when
using foldback/crowbar supplies and fuses. It is possible to
control the magnitude of ICCPO by limiting the supply current
available to the FPGA. A current limit below the trip level will
avoid inadvertently activating over-current protection circuits.
Description
Total VCC supply current required during power-on
VCC ramp
time(2,3)
Min
Max
Units
100
-
mA
-
50
ms
Notes:
1. The ICCPO requirement applies for a brief time (commonly only a few milliseconds) when VCC ramps from 0 to 3.3V.
2. The ramp time is measured from GND to V CC max on a fully loaded board.
3. VCC must not dip in the negative direction during power on.
DS060 (v1.6) September 19, 2001
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Spartan and Spartan-XL Families Field Programmable Gate Arrays
Spartan-XL Global Buffer Switching Characteristic Guidelines
Testing of the switching parameters is modeled after testing
methods specified by MIL-M-38510/605. All devices are
100% functionally tested. Internal timing parameters are
derived from measuring internal test patterns. Listed below
are representative values where one global clock input
drives one vertical clock line in each accessible column, and
where all accessible IOB and CLB flip-flops are clocked by
the global clock net.
When fewer vertical clock lines are connected, the clock distribution is faster; when multiple clock lines per column are
driven from the same global clock, the delay is longer. For
more specific, more precise, and worst-case guaranteed
data, reflecting the actual routing structure, use the values
provided by the static timing analyzer (TRCE in the Xilinx
Development System) and back-annotated to the simulation
netlist. These path delays, provided as a guideline, have
been extracted from the static timing analyzer report. All
timing parameters assume worst-case operating conditions
(supply voltage and junction temperature).
Speed Grade
Symbol
TGLS
54
Description
From pad through buffer, to any clock K
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1-800-255-7778
-5
-4
Device
Max
Max
Units
XCS05XL
1.4
1.5
ns
XCS10XL
1.7
1.8
ns
XCS20XL
2.0
2.1
ns
XCS30XL
2.3
2.5
ns
XCS40XL
2.6
2.8
ns
DS060 (v1.6) September 19, 2001
Product Specification
R
Spartan and Spartan-XL Families Field Programmable Gate Arrays
Spartan-XL CLB Switching Characteristic Guidelines
Testing of switching parameters is modeled after testing
methods specified by MIL-M-38510/605. All devices are
100% functionally tested. Internal timing parameters are
derived from measuring internal test patterns. Listed below
are representative values. For more specific, more precise,
and worst-case guaranteed data, use the values reported
by the static timing analyzer (TRCE in the Xilinx Development System) and back-annotated to the simulation netlist.
All timing parameters assume worst-case operating conditions (supply voltage and junction temperature). Values
apply to all Spartan-XL devices and expressed in nanoseconds unless otherwise noted.
Speed Grade
-5
Symbol
Description
-4
Min
Max
Min
Max
Units
Clocks
TCH
Clock High time
2.0
-
2.3
-
ns
TCL
Clock Low time
2.0
-
2.3
-
ns
Combinatorial Delays
TILO
F/G inputs to X/Y outputs
-
1.0
-
1.1
ns
TIHO
F/G inputs via H to X/Y outputs
-
1.7
-
2.0
ns
TITO
F/G inputs via transparent latch to Q outputs
-
1.5
-
1.8
ns
C inputs via H1 via H to X/Y outputs
-
1.5
-
1.8
ns
-
1.2
-
1.4
ns
THH1O
Sequential Delays
TCKO
Clock K to Flip-Flop or latch outputs Q
Setup Time before Clock K
TICK
F/G inputs
0.6
-
0.7
-
ns
TIHCK
F/G inputs via H
1.3
-
1.6
-
ns
0.0
-
0.0
-
ns
2.5
-
2.8
-
ns
-
2.3
-
2.7
ns
-
11.5
-
ns
Hold Time after Clock K
All Hold times, all devices
Set/Reset Direct
TRPW
Width (High)
TRIO
Delay from C inputs via S/R, going High to Q
Global Set/Reset
TMRW
Minimum GSR Pulse Width
10.5
TMRQ
Delay from GSR input to any Q
See page 60 for TRRI values per device.
FTOG
Toggle Frequency (MHz)
(for export control purposes)
DS060 (v1.6) September 19, 2001
Product Specification
-
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250
-
217
MHz
55
R
Spartan and Spartan-XL Families Field Programmable Gate Arrays
Spartan-XL CLB RAM Synchronous (Edge-Triggered) Write Operation Guidelines
by the static timing analyzer (TRCE in the Xilinx Development System) and back-annotated to the simulation netlist.
All timing parameters assume worst-case operating conditions (supply voltage and junction temperature). Values
apply to all Spartan-XL devices and are expressed in nanoseconds unless otherwise noted.
Testing of switching parameters is modeled after testing
methods specified by MIL-M-38510/605. All devices are
100% functionally tested. Internal timing parameters are
derived from measuring internal test patterns. Listed below
are representative values. For more specific, more precise,
and worst-case guaranteed data, use the values reported
Speed Grade
-5
TWCS
Min
Max
Min
Max
Units
16x2
7.7
-
8.4
-
ns
32x1
7.7
-
8.4
-
ns
16x2
3.1
-
3.6
-
ns
32x1
3.1
-
3.6
-
ns
16x2
1.3
-
1.5
-
ns
32x1
1.5
-
1.7
-
ns
16x2
1.5
-
1.7
-
ns
32x1
1.8
-
2.1
-
ns
WE setup time before clock K
16x2
1.4
-
1.6
-
ns
32x1
1.3
-
1.5
-
ns
All hold times after clock K
16x2
0.0
-
0.0
-
ns
Data valid after clock K
32x1
-
4.5
-
5.3
ns
16x2
-
5.4
-
6.3
ns
16x2
2.6
-
3.1
-
ns
32x1
3.8
-
5.5
-
ns
Single Port RAM
Address write cycle time (clock K period)
TWCTS
TWPS
Clock K pulse width (active edge)
TWPTS
TASS
Address setup time before clock K
TASTS
TDSS
DIN setup time before clock K
TDSTS
TWSS
TWSTS
TWOS
-4
Size(1)
Symbol
Write Operation
TWOTS
Read Operation
TRC
Address read cycle time
TRCT
TILO
TIHO
TICK
Data Valid after address change (no Write
Enable)
16x2
-
1.0
-
1.1
ns
32x1
-
1.7
-
2.0
ns
Address setup time before clock K
16x2
0.6
-
0.7
-
ns
32x1
1.3
-
1.6
-
ns
TIHCK
Notes:
1. Timing for 16 x 1 RAM option is identical to 16 x 2 RAM timing.
56
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Product Specification
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Spartan and Spartan-XL Families Field Programmable Gate Arrays
Spartan-XL CLB RAM Synchronous (Edge-Triggered) Write Operation Guidelines (cont.)
Testing of switching parameters is modeled after testing
methods specified by MIL-M-38510/605. All devices are
100% functionally tested. Internal timing parameters are
derived from measuring internal test patterns. Listed below
are representative values. For more specific, more precise,
and worst-case guaranteed data, use the values reported
by the static timing analyzer (TRCE in the Xilinx Development System) and back-annotated to the simulation netlist.
All timing parameters assume worst-case operating conditions (supply voltage and junction temperature). Values
apply to all Spartan-XL devices and are expressed in nanoseconds unless otherwise noted.
-5
Symbol
Dual Port RAM
-4
Size
Min
Max
Min
Max
Units
Write Operation(1)
TWCDS
Address write cycle time (clock K period)
16x1
7.7
-
8.4
-
ns
TWPDS
Clock K pulse width (active edge)
16x1
3.1
-
3.6
-
ns
TASDS
Address setup time before clock K
16x1
1.3
-
1.5
-
ns
TDSDS
DIN setup time before clock K
16x1
1.7
-
2.0
-
ns
TWSDS
WE setup time before clock K
16x1
1.4
-
1.6
-
ns
All hold times after clock K
16x1
0
-
0
-
ns
Data valid after clock K
16x1
-
5.2
-
6.1
ns
TWODS
Notes:
1. Read Operation timing for 16 x 1 dual-port RAM option is identical to 16 x 2 single-port RAM timing
Spartan-XL CLB RAM Synchronous (Edge-Triggered) Write Timing
Single Port
Dual Port
TWPS
TWPDS
WCLK (K)
WCLK (K)
TWHS
TWSS
TWHDS
TWSDS
WE
WE
TDHS
TDSS
DATA IN
TDSDS
TDHDS
TASDS
TAHDS
DATA IN
TAHS
TASS
ADDRESS
ADDRESS
TILO
DATA OUT
TILO
TILO
TWOS
OLD
NEW
DATA OUT
TILO
TWODS
OLD
NEW
DS060_34_011300
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57
R
Spartan and Spartan-XL Families Field Programmable Gate Arrays
Spartan-XL Pin-to-Pin Output Parameter Guidelines
Testing of switching parameters is modeled after testing
methods specified by MIL-M-38510/605. All devices are
100% functionally tested. Pin-to-pin timing parameters are
derived from measuring external and internal test patterns
and are guaranteed over worst-case operating conditions
(supply voltage and junction temperature). Listed below are
representative values for typical pin locations and normal
clock loading.
Spartan-XL Output Flip-Flop, Clock-to-Out
Speed Grade
Symbol
Description
-5
-4
Device
Max
Max
Units
XCS05XL
4.6
5.2
ns
XCS10XL
4.9
5.5
ns
XCS20XL
5.2
5.8
ns
XCS30XL
5.5
6.2
ns
XCS40XL
5.8
6.5
ns
All Devices
1.5
1.7
ns
Global Clock to Output using OFF
TICKOF
Fast
Slew Rate Adjustment
TSLOW
For Output SLOW option add
Notes:
1. Output delays are representative values where one global clock input drives one vertical clock line in each accessible column,and
where all accessible IOB and CLB flip-flops are clocked by the global clock net.
2. Output timing is measured at ~50% V CC threshold with 50 pF external capacitive load.
3. OFF = Output Flip Flop
58
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Product Specification
R
Spartan and Spartan-XL Families Field Programmable Gate Arrays
Spartan-XL Pin-to-Pin Input Parameter Guidelines
Testing of switching parameters is modeled after testing
methods specified by MIL-M-38510/605. All devices are
100% functionally tested. Pin-to-pin timing parameters are
derived from measuring external and internal test patterns
and are guaranteed over worst-case operating conditions
(supply voltage and junction temperature). Listed below are
representative values for typical pin locations and normal
clock loading.
Spartan-XL Setup and Hold
Speed Grade
Symbol
-5
-4
Device
Max
Max
XCS05XL
1.1/2.0
1.6/2.6
ns
XCS10XL
1.0/2.2
1.5/2.8
ns
XCS20XL
0.9/2.4
1.4/3.0
ns
XCS30XL
0.8/2.6
1.3/3.2
ns
Description
Units
Input Setup/Hold Times Using Global Clock and IFF
TSUF/THF
TSU/TH
No Delay
Full Delay
XCS40XL
0.7/2.8
1.2/3.4
ns
XCS05XL
3.9/0.0
5.1/0.0
ns
XCS10XL
4.1/0.0
5.3/0.0
ns
XCS20XL
4.3/0.0
5.5/0.0
ns
XCS30XL
4.5/0.0
5.7/0.0
ns
XCS40XL
4.7/0.0
5.9/0.0
ns
Notes:
1. IFF = Input Flip-Flop or Latch
2. Setup time is measured with the fastest route and the lightest load. Hold time is measured using the furthest distance and a
reference load of one clock pin per IOB/CLB.
Capacitive Load Factor
3
2
Delta Delay (ns)
Figure 35 shows the relationship between I/O output delay
and load capacitance. It allows a user to adjust the specified
output delay if the load capacitance is different than 50 pF.
For example, if the actual load capacitance is 120 pF, add
2.5 ns to the specified delay. If the load capacitance is 20
pF, subtract 0.8 ns from the specified output delay.
Figure 35 is usable over the specified operating conditions
of voltage and temperature and is independent of the output
slew rate control.
1
0
-1
-2
0
20
40
60
80
100
120
140
Capacitance (pF)
DS060_35_080400
Figure 35: Delay Factor at Various Capacitive Loads
DS060 (v1.6) September 19, 2001
Product Specification
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Spartan and Spartan-XL Families Field Programmable Gate Arrays
Spartan-XL IOB Input Switching Characteristic Guidelines
Testing of switching parameters is modeled after testing
methods specified by MIL-M-38510/605. All devices are
100% functionally tested. Internal timing parameters are
derived from measuring internal test patterns. Listed below
are representative values. For more specific, more precise,
and worst-case guaranteed data, use the values reported
by the static timing analyzer (TRCE in the Xilinx Development System) and back-annotated to the simulation netlist.
These path delays, provided as a guideline, have been
extracted from the static timing analyzer report. All timing
parameters assume worst-case operating conditions (supply voltage and junction temperature).
Speed Grade
-5
Symbol
Description
-4
Device
Min
Max
Min
Max
Units
Setup Times
TECIK
Clock Enable (EC) to Clock (IK)
All devices
0.0
-
0.0
-
ns
TPICK
Pad to Clock (IK), no delay
All devices
1.0
-
1.2
-
ns
TPOCK
Pad to Fast Capture Latch Enable (OK), no delay
All devices
0.7
-
0.8
-
ns
All Hold Times
All devices
0.0
-
0.0
-
ns
Hold Times
Propagation Delays
TPID
Pad to I1, I2
All devices
-
0.9
-
1.1
ns
TPLI
Pad to I1, I2 via transparent input latch, no delay
All devices
-
2.1
-
2.5
ns
TIKRI
Clock (IK) to I1, I2 (flip-flop)
All devices
-
1.0
-
1.1
ns
TIKLI
Clock (IK) to I1, I2 (latch enable, active Low)
All devices
-
1.1
-
1.2
ns
XCS05XL
4.0
-
4.7
-
ns
XCS10XL
4.8
-
5.6
-
ns
XCS20XL
5.0
-
5.9
-
ns
XCS30XL
5.5
-
6.5
-
ns
XCS40XL
6.5
-
7.6
-
ns
Delay Adder for Input with Full Delay Option
TDelay
TPICKD = TPICK + TDelay
TPDLI = TPLI + TDelay
Global Set/Reset
TMRW
Minimum GSR pulse width
All devices
10.5
-
11.5
-
ns
TRRI
Delay from GSR input to any Q
XCS05XL
-
9.0
-
10.5
ns
XCS10XL
-
9.5
-
11.0
ns
XCS20XL
-
10.0
-
11.5
ns
XCS30XL
-
11.0
-
12.5
ns
XCS40XL
-
12.0
-
13.5
ns
Notes:
1. Input pad setup and hold times are specified with respect to the internal clock (IK). For setup and hold times with respect to the clock
input, see the pin-to-pin parameters in the Pin-to-Pin Input Parameters table.
2. Voltage levels of unused pads, bonded or unbonded, must be valid logic levels. Each can be configured with the internal pull-up
(default) or pull-down resistor, or configured as a driven output, or can be driven from an external source.
60
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DS060 (v1.6) September 19, 2001
Product Specification
R
Spartan and Spartan-XL Families Field Programmable Gate Arrays
Spartan-XL IOB Output Switching Characteristic Guidelines
Testing of switching parameters is modeled after testing
methods specified by MIL-M-38510/605. All devices are
100% functionally tested. Internal timing parameters are
derived from measuring internal test patterns. Listed below
are representative values. For more specific, more precise,
and worst-case guaranteed data, use the values reported
by the static timing analyzer (TRCE in the Xilinx Develop-
ment System) and back-annotated to the simulation netlist.
These path delays, provided as a guideline, have been
extracted from the static timing analyzer report. All timing
parameters assume worst-case operating conditions (supply voltage and junction temperature). Values are
expressed in nanoseconds unless otherwise noted.
Speed Grade
-5
Symbol
Propagation Delays
Description
-4
Device
Min
Max
Min
Max
Units
All devices
-
3.2
-
3.7
ns
TOKPOF
Clock (OK) to Pad, fast
TOPF
Output (O) to Pad, fast
All devices
-
2.5
-
2.9
ns
TTSHZ
3-state to Pad High-Z (slew-rate independent)
All devices
-
2.8
-
3.3
ns
3-state to Pad active and valid, fast
All devices
-
2.6
-
3.0
ns
TOFPF
Output (O) to Pad via Output Mux, fast
All devices
-
3.7
-
4.4
ns
TOKFPF
Select (OK) to Pad via Output Mux, fast
All devices
-
3.3
-
3.9
ns
All devices
-
1.5
-
1.7
ns
TTSONF
For Output SLOW option add
TSLOW
Setup and Hold Times
TOOK
Output (O) to clock (OK) setup time
All devices
0.5
-
0.5
-
ns
TOKO
Output (O) to clock (OK) hold time
All devices
0.0
-
0.0
-
ns
TECOK
Clock Enable (EC) to clock (OK) setup time
All devices
0.0
-
0.0
-
ns
All devices
0.1
-
0.2
-
ns
Clock Enable (EC) to clock (OK) hold time
TOKEC
Global Set/Reset
TMRW
Minimum GSR pulse width
All devices
10.5
-
11.5
-
ns
TRPO
Delay from GSR input to any Pad
XCS05XL
-
11.9
-
14.0
ns
XCS10XL
-
12.4
-
14.5
ns
XCS20XL
-
12.9
-
15.0
ns
XCS30XL
-
13.9
-
16.0
ns
XCS40XL
-
14.9
-
17.0
ns
Notes:
1. Output timing is measured at ~50% VCC threshold, with 50 pF external capacitive loads including test fixture. Slew-rate limited output
rise/fall times are approximately two times longer than fast output rise/fall times.
2. Voltage levels of unused pads, bonded or unbonded, must be valid logic levels. Each can be configured with the internal pull-up
(default) or pull-down resistor, or configured as a driven output, or can be driven from an external source.
DS060 (v1.6) September 19, 2001
Product Specification
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Spartan and Spartan-XL Families Field Programmable Gate Arrays
Pin Descriptions
There are three types of pins in the Spartan/XL devices:
•
•
•
Permanently dedicated pins
User I/O pins that can have special functions
Unrestricted user-programmable I/O pins.
Before and during configuration, all outputs not used for the
configuration process are 3-stated with the I/O pull-up resistor network activated. After configuration, if an IOB is
unused it is configured as an input with the I/O pull-up resistor network remaining activated.
Any user I/O can be configured to drive the Global
Set/Reset net GSR or the global three-state net GTS. See
Global Signals: GSR and GTS, page 20 for more information.
Device pins for Spartan/XL devices are described in
Table 18.
Table 18: Pin Descriptions
Pin Name
I/O
During
Config.
I/O After
Config.
Pin Description
Permanently Dedicated Pins
VCC
X
X
Eight or more (depending on package) connections to the nominal +5V supply
voltage (+3.3V for Spartan-XL devices). All must be connected, and each must be
decoupled with a 0.01 –0.1 µF capacitor to Ground.
GND
X
X
Eight or more (depending on package type) connections to Ground. All must be
connected.
CCLK
I or O
I
During configuration, Configuration Clock (CCLK) is an output in Master mode and
is an input in Slave mode. After configuration, CCLK has a weak pull-up resistor
and can be selected as the Readback Clock. There is no CCLK High or Low time
restriction on Spartan/XL devices, except during Readback. See Violating the
Maximum High and Low Time Specification for the Readback Clock, page 39
for an explanation of this exception.
DONE
I/O
O
DONE is a bidirectional signal with an optional internal pull-up resistor. As an
open-drain output, it indicates the completion of the configuration process. As an
input, a Low level on DONE can be configured to delay the global logic initialization
and the enabling of outputs.
The optional pull-up resistor is selected as an option in the program that creates
the configuration bitstream. The resistor is included by default.
PROGRAM
I
I
PROGRAM is an active Low input that forces the FPGA to clear its configuration
memory. It is used to initiate a configuration cycle. When PROGRAM goes High,
the FPGA finishes the current clear cycle and executes another complete clear
cycle, before it goes into a WAIT state and releases INIT.
The PROGRAM pin has a permanent weak pull-up, so it need not be externally
pulled up to VCC.
MODE
(Spartan)
M0, M1
(Spartan-XL)
62
I
X
The Mode input(s) are sampled after INIT goes High to determine the
configuration mode to be used.
During configuration, these pins have a weak pull-up resistor. For the most popular
configuration mode, Slave Serial, the mode pins can be left unconnected. For
Master Serial mode, connect the Mode/M0 pin directly to system ground.
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R
Spartan and Spartan-XL Families Field Programmable Gate Arrays
Table 18: Pin Descriptions (Continued)
Pin Name
I/O
During
Config.
I/O After
Config.
PWRDWN
I
I
Pin Description
PWRDWN is an active Low input that forces the FPGA into the Power Down state
and reduces power consumption. When PWRDWN is Low, the FPGA disables all
I/O and initializes all flip-flops. All inputs are interpreted as Low independent of
their actual level. VCC must be maintained, and the configuration data is
maintained. PWRDWN halts configuration if asserted before or during
configuration, and re-starts configuration when removed. When PWRDWN returns
High, the FPGA becomes operational by first enabling the inputs and flip-flops and
then enabling the outputs. PWRDWN has a default internal pull-up resistor.
User I/O Pins That Can Have Special Functions
TDO
O
O
If boundary scan is used, this pin is the Test Data Output. If boundary scan is not
used, this pin is a 3-state output without a register, after configuration is
completed.
To use this pin, place the library component TDO instead of the usual pad symbol.
An output buffer must still be used.
TDI, TCK,
TMS
I
I/O
or I
(JTAG)
If boundary scan is used, these pins are Test Data In, Test Clock, and Test Mode
Select inputs respectively. They come directly from the pads, bypassing the IOBs.
These pins can also be used as inputs to the CLB logic after configuration is
completed.
If the BSCAN symbol is not placed in the design, all boundary scan functions are
inhibited once configuration is completed, and these pins become
user-programmable I/O. In this case, they must be called out by special library
elements. To use these pins, place the library components TDI, TCK, and TMS
instead of the usual pad symbols. Input or output buffers must still be used.
HDC
O
I/O
High During Configuration (HDC) is driven High until the I/O go active. It is
available as a control output indicating that configuration is not yet completed.
After configuration, HDC is a user-programmable I/O pin.
LDC
O
I/O
Low During Configuration (LDC) is driven Low until the I/O go active. It is available
as a control output indicating that configuration is not yet completed. After
configuration, LDC is a user-programmable I/O pin.
INIT
I/O
I/O
Before and during configuration, INIT is a bidirectional signal. A 1 kΩ to 10 kΩ
external pull-up resistor is recommended.
As an active Low open-drain output, INIT is held Low during the power stabilization
and internal clearing of the configuration memory. As an active Low input, it can
be used to hold the FPGA in the internal WAIT state before the start of
configuration. Master mode devices stay in a WAIT state an additional 30 to
300 µs after INIT has gone High.
During configuration, a Low on this output indicates that a configuration data error
has occurred. After the I/O go active, INIT is a user-programmable I/O pin.
PGCK1 PGCK4
(Spartan)
Weak
Pull-up
I or I/O
Four Primary Global inputs each drive a dedicated internal global net with short
delay and minimal skew. If not used to drive a global buffer, any of these pins is a
user-programmable I/O.
The PGCK1-PGCK4 pins drive the four Primary Global Buffers. Any input pad
symbol connected directly to the input of a BUFGP symbol is automatically placed
on one of these pins.
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Spartan and Spartan-XL Families Field Programmable Gate Arrays
Table 18: Pin Descriptions (Continued)
Pin Name
SGCK1 SGCK4
(Spartan)
I/O
During
Config.
I/O After
Config.
Pin Description
Weak
Pull-up
(except
SGCK4
is DOUT)
I or I/O
Weak
Pull-up
(except
GCK6 is
DOUT)
I or I/O
CS1
(Spartan-XL)
I
I/O
During Express configuration, CS1 is used as a serial-enable signal for
daisy-chaining.
D0-D7
(Spartan-XL)
I
I/O
During Express configuration, these eight input pins receive configuration data.
After configuration, they are user-programmable I/O pins.
DIN
I
I/O
During Slave Serial or Master Serial configuration, DIN is the serial configuration
data input receiving data on the rising edge of CCLK. After configuration, DIN is a
user-programmable I/O pin.
DOUT
O
I/O
During Slave Serial or Master Serial configuration, DOUT is the serial
configuration data output that can drive the DIN of daisy-chained slave FPGAs.
DOUT data changes on the falling edge of CCLK, one-and-a-half CCLK periods
after it was received at the DIN input.
GCK1 GCK8
(Spartan-XL)
Four Secondary Global inputs each drive a dedicated internal global net with short
delay and minimal skew. These internal global nets can also be driven from
internal logic. If not used to drive a global net, any of these pins is a
user-programmable I/O pin.
The SGCK1-SGCK4 pins provide the shortest path to the four Secondary Global
Buffers. Any input pad symbol connected directly to the input of a BUFGS symbol
is automatically placed on one of these pins.
Eight Global inputs each drive a dedicated internal global net with short delay and
minimal skew. These internal global nets can also be driven from internal logic. If
not used to drive a global net, any of these pins is a user-programmable I/O pin.
The GCK1-GCK8 pins provide the shortest path to the eight Global Low-Skew
Buffers. Any input pad symbol connected directly to the input of a BUFGLS symbol
is automatically placed on one of these pins.
In Spartan-XL Express mode, DOUT is the status output that can drive the CS1 of
daisy-chained FPGAs, to enable and disable downstream devices.
After configuration, DOUT is a user-programmable I/O pin.
Unrestricted User-Programmable I/O Pins
I/O
64
Weak
Pull-up
I/O
These pins can be configured to be input and/or output after configuration is
completed. Before configuration is completed, these pins have an internal
high-value pull-up resistor network that defines the logic level as High.
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Product Specification
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Spartan and Spartan-XL Families Field Programmable Gate Arrays
Device-Specific Pinout Tables
Device-specific tables include all packages for each Spartan and Spartan-XL device. They follow the pad locations
around the die, and include boundary scan register locations.
XCS05 and XCS05XL Device Pinouts
XCS05/XL
Pad Name
VCC
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O, SGCK1(1), GCK8(2)
VCC
GND
I/O, PGCK1(1), GCK1(2)
I/O
I/O, TDI
I/O, TCK
I/O, TMS
I/O
I/O
I/O
I/O
GND
VCC
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O, SGCK2(1), GCK2(2)
Not Connected(1), M1(2)
GND
MODE(1), M0 (2)
VCC
Not Connected(1),
PWRDWN(2)
I/O, PGCK2(1), GCK3 (2)
DS060 (v1.6) September 19, 2001
Product Specification
PC84
P2
P3
P4
P5
P6
P7
P8
P9
P10
P11
P12
P13
P14
P15
P16
P17
P18
P19
P20
P21
P22
P23
P24
P25
P26
P27
P28
P29
P30
P31
P32
P33
P34
VQ100
P89
P90
P91
P92
P93
P94
P95
P96
P97
P98
P99
P100
P1
P2
P3
P4
P5
P6
P7
P8
P9
P10
P11
P12
P13
P14
P15
P16
P17
P18
P19
P20
P21
P22
P23
P24
P25
P26
Bndry
Scan
32
35
38
41
44
47
50
53
56
59
62
65
68
71
74
77
83
86
89
92
95
98
104
107
110
113
116
119
122
125
126(1)
P35
P27
127(3)
XCS05 and XCS05XL Device Pinouts
XCS05/XL
Pad Name
I/O (HDC)
I/O
I/O (LDC)
I/O
I/O
I/O
I/O
I/O
I/O (INIT)
VCC
GND
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O, SGCK3(1), GCK4(2)
GND
DONE
VCC
PROGRAM
I/O (D7(2))
I/O, PGCK3(1), GCK5(2)
I/O (D6(2))
I/O
I/O (D5(2))
I/O
I/O
I/O
I/O (D4(2))
I/O
VCC
GND
I/O (D3(2))
I/O
I/O
I/O (D2(2))
I/O
I/O (D1(2))
I/O
I/O (D0(2), DIN)
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PC84
P36
P37
P38
P39
P40
P41
P42
P43
P44
P45
P46
P47
P48
P49
P50
P51
P52
P53
P54
P55
P56
P57
P58
P59
P60
P61
P62
P63
P64
P65
P66
P67
P68
P69
P70
P71
VQ100
P28
P29
P30
P31
P32
P33
P34
P35
P36
P37
P38
P39
P40
P41
P42
P43
P44
P45
P46
P47
P48
P49
P50
P51
P52
P53
P54
P55
P56
P57
P58
P59
P60
P61
P62
P63
P64
P65
P66
P67
P68
P69
P70
P71
P72
Bndry
Scan
130(3)
133(3)
136(3)
139(3)
142(3)
145(3)
148(3)
151(3)
154(3)
157(3)
160(3)
163(3)
166(3)
169(3)
172(3)
175(3)
178(3)
181(3)
184(3)
187(3)
190(3)
193(3)
196(3)
199(3)
202(3)
205(3)
208(3)
211(3)
214(3)
217(3)
220(3)
223(3)
229(3)
232(3)
235(3)
238(3)
241(3)
65
R
Spartan and Spartan-XL Families Field Programmable Gate Arrays
XCS05 and XCS05XL Device Pinouts
XCS05/XL
Pad Name
I/O, SGCK4(1), GCK6(2)
(DOUT)
CCLK
VCC
O, TDO
GND
I/O
I/O, PGCK4(1), GCK7(2)
I/O (CS1(2))
I/O
I/O
I/O
I/O
I/O
I/O
I/O
GND
XCS10 and XCS10XL Device Pinouts
PC84
P72
VQ100
P73
Bndry
Scan
244(3)
P73
P74
P75
P76
P77
P78
P79
P80
P81
P82
P83
P84
P1
P74
P75
P76
P77
P78
P79
P80
P81
P82
P83
P84
P85
P86
P87
P88
0
2
5
8
11
14
17
20
23
26
29
-
Notes:
1. 5V Spartan only
2. 3V Spartan-XL only
3. The “PWRDWN” on the XCS05XL is not part of the Boundary
Scan chain. For the XCS05XL, subtract 1 from all Boundary
Scan numbers from GCK3 on (127 and higher).
XCS10 and XCS10XL Device Pinouts
XCS10/XL
Pad Name
VCC
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
GND
I/O
I/O
I/O
I/O
I/O
I/O,
SGCK1(1)
GCK8(2)
VCC
GND
66
PC84 VQ100 CS144(2) TQ144
P2
P89
D7
P128
P3
P90
A6
P129
P4
P91
B6
P130
P92
C6
P131
P93
D6
P132
P5
P94
A5
P133
P6
P95
B5
P134
C5
P135
D5
P136
A4
P137
P7
P96
B4
P138
P8
P97
C4
P139
A3
P140
B3
P141
P9
P98
C3
P142
P10
P99
A2
P143
Bndry
Scan
44
47
50
53
56
59
62
65
68
71
74
77
80
83
XCS10/XL
Pad Name
I/O,
PGCK1(1)
GCK1(2)
I/O
I/O
I/O
I/O, TDI
I/O, TCK
GND
I/O
I/O
I/O, TMS
I/O
I/O
I/O
I/O
I/O
GND
VCC
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
GND
I/O
I/O
I/O
I/O
I/O
I/O,
SGCK2(1)
GCK2(2)
Not
Connected(1)
M1(2)
GND
MODE(1),
M0(2)
VCC
Not
Connected(1)
PC84 VQ100 CS144(2) TQ144
P13
P2
B1
P2
Bndry
Scan
86
P14
P15
P16
P17
P18
P19
P20
P21
P22
P23
P24
P25
P26
P27
P28
P29
P3
P4
P5
P6
P7
P8
P9
P10
P11
P12
P13
P14
P15
P16
P17
P18
P19
P20
P21
C2
C1
D4
D3
D2
D1
E4
E3
E2
E1
F4
F3
F2
F1
G2
G1
G3
G4
H1
H2
H3
H4
J1
J2
J3
J4
K1
K2
K3
L1
L2
P3
P4
P5
P6
P7
P8
P9
P10
P11
P12
P13
P14
P15
P16
P17
P18
P19
P20
P21
P22
P23
P24
P25
P26
P27
P28
P29
P30
P31
P32
P33
89
92
95
98
101
104
107
110
113
116
119
122
125
128
131
134
137
140
143
146
149
152
155
158
161
164
167
P30
P22
L3
P34
170
P31
P32
P23
P24
M1
M2
P35
P36
173
P33
P34
P25
P26
N1
N2
P37
P38
174 (1)
PWRDWN(2)
P11
P12
P100
P1
B2
A1
P144
P1
-
www.xilinx.com
1-800-255-7778
DS060 (v1.6) September 19, 2001
Product Specification
R
Spartan and Spartan-XL Families Field Programmable Gate Arrays
XCS10 and XCS10XL Device Pinouts
XCS10/XL
Pad Name
I/O,
PGCK2(1)
GCK3(2)
I/O (HDC)
I/O
I/O
I/O
I/O (LDC)
GND
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O (INIT)
VCC
GND
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
GND
I/O
I/O
I/O
I/O
I/O
I/O,
SGCK3(1)
GCK4(2)
GND
DONE
VCC
PROGRAM
I/O (D7(2))
I/O,
PGCK3(1)
GCK5(2)
I/O
I/O
I/O (D6(2))
I/O
XCS10 and XCS10XL Device Pinouts
Bndry
PC84 VQ100 CS144(2) TQ144 Scan
P35
P27
M3
P39
175(3)
P36
P37
P38
P39
P40
P41
P42
P43
P44
P45
P46
P47
P48
P49
P50
P51
P28
P29
P30
P31
P32
P33
P34
P35
P36
P37
P38
P39
P40
P41
P42
P43
P44
P45
P46
P47
P48
N3
K4
L4
M4
N4
K5
L5
M5
N5
K6
L6
M6
N6
M7
N7
L7
K7
N8
M8
L8
K8
N9
M9
L9
K9
N10
M10
L10
N11
M11
L11
P40
P41
P42
P43
P44
P45
P46
P47
P48
P49
P50
P51
P52
P53
P54
P55
P56
P57
P58
P59
P60
P61
P62
P63
P64
P65
P66
P67
P68
P69
P70
178 (3)
181 (3)
184 (3)
187 (3)
190 (3)
193 (3)
196 (3)
199 (3)
202 (3)
205 (3)
208 (3)
211 (3)
214 (3)
217 (3)
220 (3)
223 (3)
226 (3)
229 (3)
232 (3)
235 (3)
238 (3)
241 (3)
244 (3)
247 (3)
250 (3)
253 (3)
256 (3)
P52
P53
P54
P55
P56
P57
P49
P50
P51
P52
P53
P54
N12
M12
N13
M13
L12
L13
P71
P72
P73
P74
P75
P76
259 (3)
262 (3)
P58
-
P55
P56
K10
K11
K12
K13
P77
P78
P79
P80
265 (3)
268 (3)
271 (3)
274 (3)
DS060 (v1.6) September 19, 2001
Product Specification
XCS10/XL
Pad Name
GND
I/O
I/O
I/O (D5(2))
I/O
I/O
I/O
I/O (D4(2))
I/O
VCC
GND
I/O (D3(2))
I/O
I/O
I/O
I/O (D2(2))
I/O
I/O
I/O
GND
I/O (D1(2))
I/O
I/O
I/O
I/O (D0(2),
DIN)
I/O,
SGCK4(1)
GCK6(2)
(DOUT)
CCLK
VCC
O, TDO
GND
I/O
I/O,
PGCK4(1)
GCK7(2)
I/O
I/O
I/O (CS1(2))
I/O
GND
I/O
I/O
I/O
I/O
I/O
www.xilinx.com
1-800-255-7778
Bndry
PC84 VQ100 CS144(2) TQ144 Scan
J10
P81
J11
P82 277 (3)
J12
P83 280 (3)
P59
P57
J13
P84 283 (3)
P60
P58
H10
P85 286 (3)
P59
H11
P86 289 (3)
P60
H12
P87 292 (3)
P61
P61
H13
P88 295 (3)
P62
P62
G12
P89 298 (3)
P63
P63
G13
P90
P64
P64
G11
P91
P65
P65
G10
P92 301 (3)
P66
P66
F13
P93 304 (3)
P67
F12
P94 307 (3)
F11
P95 310 (3)
P67
P68
F10
P96 313 (3)
P68
P69
E13
P97 316 (3)
E12
P98 319 (3)
E11
P99 322 (3)
E10
P100
P69
P70
D13
P101 325 (3)
P70
P71
D12
P102 328 (3)
D11
P103 331 (3)
C13
P104 334 (3)
P71
P72
C12
P105 337 (3)
P72
P73
C11
P106
340 (3)
P73
P74
P75
P76
P77
P78
P74
P75
P76
P77
P78
P79
B13
B12
A13
A12
B11
A11
P107
P108
P109
P110
P111
P112
0
2
5
P79
P80
P81
P82
-
P80
P81
P82
P83
P84
D10
C10
B10
A10
C9
B9
A9
D8
C8
B8
P113
P114
P115
P116
P118
P119
P120
P121
P122
P123
8
11
14
17
20
23
26
29
32
67
R
Spartan and Spartan-XL Families Field Programmable Gate Arrays
XCS10 and XCS10XL Device Pinouts
XCS10/XL
Pad Name
I/O
I/O
I/O
GND
PC84 VQ100 CS144(2) TQ144
P85
A8
P124
P83
P86
B7
P125
P84
P87
A7
P126
P1
P88
C7
P127
Additional XCS10/XL Package Pins
Bndry
Scan
35
38
41
-
TQ144
Not Connected Pins
P117
-
-
-
-
-
-
-
5/5/97
Notes:
1.
2.
3.
5V Spartan only
3V Spartan-XL only
The “PWRDWN” on the XCS10XL is not part of the Boundary
Scan chain. For the XCS10XL, subtract 1 from all Boundary
Scan numbers from GCK3 on (175 and higher).
CS144
Not Connected Pins
D9
-
-
-
4/28/99
XCS20 and XCS20XL Device Pinouts
XCS20 and XCS20XL Device Pinouts
XCS20/XL
Pad Name
VQ100
CS144(2)
TQ144
PQ208
Bndry
Scan
VCC
P89
D7
P128
P183
-
I/O
P90
A6
P129
P184
62
I/O
P91
B6
P130
P185
65
I/O
P92
C6
P131
P186
68
I/O
P93
D6
P132
P187
71
I/O
-
-
-
P188
74
I/O
-
-
-
P189
77
I/O
P94
A5
P133
P190
80
I/O
P95
B5
P134
P191
83
VCC (2)
-
-
-
P192
-
I/O
-
C5
P135
P193
86
I/O
-
D5
P136
P194
89
GND
-
A4
P137
P195
-
I/O
-
-
-
P196
92
I/O
-
-
-
P197
95
XCS20/XL
Pad Name
VQ100
CS144(2)
TQ144
PQ208
Bndry
Scan
I/O,
PGCK1(1),
GCK1(2)
P2
B1
P2
P2
122
I/O
P3
C2
P3
P3
125
I/O
-
C1
P4
P4
128
I/O
-
D4
P5
P5
131
I/O, TDI
P4
D3
P6
P6
134
I/O, TCK
P5
D2
P7
P7
137
I/O
-
-
-
P8
140
I/O
-
-
-
P9
143
I/O
-
-
-
P10
146
I/O
-
-
-
P11
149
GND
-
D1
P8
P13
-
I/O
-
E4
P9
P14
152
I/O
-
E3
P10
P15
155
I/O, TMS
P6
E2
P11
P16
158
I/O
P7
E1
P12
P17
161
I/O
-
-
-
P198
98
I/O
-
-
-
P199
101
I/O
P96
B4
P138
P200
104
I/O
P97
C4
P139
P201
107
I/O
-
A3
P140
P204
110
I/O
-
B3
P141
P205
113
I/O
P98
C3
P142
P206
116
I/O,
SGCK1(1),
GCK8(2)
P99
A2
P143
P207
119
VCC
P12
G1
P18
P26
-
VCC
P100
B2
P144
P208
-
I/O
P13
G3
P19
P27
182
GND
P1
A1
P1
P1
-
I/O
P14
G4
P20
P28
185
I/O
P15
H1
P21
P29
188
I/O
-
H2
P22
P30
191
68
VCC(2)
-
-
-
P18
-
I/O
-
-
-
P19
164
I/O
-
-
-
P20
167
I/O
-
F4
P13
P21
170
I/O
P8
F3
P14
P22
173
I/O
P9
F2
P15
P23
176
I/O
P10
F1
P16
P24
179
GND
P11
G2
P17
P25
-
www.xilinx.com
1-800-255-7778
DS060 (v1.6) September 19, 2001
Product Specification
R
Spartan and Spartan-XL Families Field Programmable Gate Arrays
XCS20 and XCS20XL Device Pinouts
XCS20/XL
Pad Name
XCS20 and XCS20XL Device Pinouts
XCS20/XL
Pad Name
VQ100
CS144(2)
TQ144
PQ208
Bndry
Scan
I/O
-
-
-
P31
194
VCC(2)
-
-
-
P71
-
I/O
-
-
-
P32
197
I/O
-
-
-
P72
289 (3)
VCC (2)
-
-
-
P33
-
I/O
-
-
-
P73
292 (3)
I/O
P16
H3
P23
P34
200
I/O
P33
L6
P50
P74
295 (3)
I/O
P17
H4
P24
P35
203
I/O
P34
M6
P51
P75
298 (3)
I/O
-
J1
P25
P36
206
I/O
P35
N6
P52
P76
301 (3)
I/O
-
J2
P26
P37
209
I/O (INIT)
P36
M7
P53
P77
304 (3)
GND
-
J3
P27
P38
-
VCC
P37
N7
P54
P78
-
I/O
-
-
-
P40
212
GND
P38
L7
P55
P79
-
I/O
-
-
-
P41
215
I/O
P39
K7
P56
P80
307 (3)
I/O
-
-
-
P42
218
I/O
P40
N8
P57
P81
310 (3)
I/O
-
-
-
P43
221
I/O
P41
M8
P58
P82
313 (3)
I/O
P18
J4
P28
P44
224
I/O
P42
L8
P59
P83
316 (3)
I/O
P19
K1
P29
P45
227
I/O
-
-
-
P84
319 (3)
I/O
-
K2
P30
P46
230
I/O
-
-
-
P85
322 (3)
-
-
-
P86
-
VQ100
CS144(2)
TQ144
PQ208
Bndry
Scan
I/O
-
K3
P31
P47
233
VCC(2)
I/O
P20
L1
P32
P48
236
I/O
P43
K8
P60
P87
325 (3)
I/O,
SGCK2(1),
GCK2(2)
P21
L2
P33
P49
239
I/O
P44
N9
P61
P88
328 (3)
I/O
-
M9
P62
P89
331 (3)
Not
Connected(1)
M1(2)
P22
I/O
-
L9
P63
P90
334 (3)
GND
-
K9
P64
P91
-
I/O
-
-
-
P93
337 (3)
GND
P23
M1
P35
P51
-
I/O
-
-
-
P94
340 (3)
MODE(1),
M0(2)
P24
M2
P36
P52
245
I/O
-
-
-
P95
343 (3)
I/O
-
-
-
P96
346 (3)
VCC
P25
N1
P37
P53
-
I/O
P45
N10
P65
P97
349 (3)
Not
Connected(1)
P26
N2
P38
P54
246 (1)
I/O
P46
M10
P66
P98
352 (3)
I/O
-
L10
P67
P99
355 (3)
L3
P34
P50
242
PWRDWN(2)
I/O
-
N11
P68
P100
358 (3)
247 (3)
I/O
P47
M11
P69
P101
361 (3)
P48
L11
P70
P102
364 (3)
P56
250 (3)
I/O,
SGCK3(1),
GCK4(2)
P41
P57
253 (3)
GND
P49
N12
P71
P103
-
L4
P42
P58
256 (3)
DONE
P50
M12
P72
P104
-
P29
M4
P43
P59
259 (3)
VCC
P51
N13
P73
P105
-
P30
N4
P44
P60
262 (3)
PROGRAM
P52
M13
P74
P106
-
I/O
-
-
-
P61
265 (3)
I/O (D7(2))
P53
L12
P75
P107
367 (3)
I/O
-
-
-
P62
268 (3)
I/O,
PGCK3(1),
GCK5(2)
P54
L13
P76
P108
370 (3)
(3)
-
K10
P77
P109
373 (3)
-
K11
P78
P110
376 (3)
P55
K12
P79
P112
379 (3)
I/O,
PGCK2(1),
GCK3(2)
P27
M3
P39
I/O (HDC)
P28
N3
P40
I/O
-
K4
I/O
-
I/O
I/O (LDC)
P55
I/O
-
-
-
P63
271
I/O
-
-
-
P64
274 (3)
GND
-
K5
P45
P66
-
I/O
I/O
-
L5
P46
P67
277 (3)
I/O
(D6(2))
I/O
-
M5
P47
P68
280 (3)
I/O
I/O
P31
N5
P48
P69
283 (3)
I/O
P56
K13
P80
P113
382 (3)
I/O
P32
K6
P49
P70
286 (3)
I/O
-
-
-
P114
385 (3)
DS060 (v1.6) September 19, 2001
Product Specification
www.xilinx.com
1-800-255-7778
69
R
Spartan and Spartan-XL Families Field Programmable Gate Arrays
XCS20 and XCS20XL Device Pinouts
XCS20/XL
Pad Name
XCS20 and XCS20XL Device Pinouts
XCS20/XL
Pad Name
VQ100
CS144(2)
TQ144
PQ208
Bndry
Scan
I/O
-
-
-
P115
388 (3)
VCC
P75
B12
P108
P156
-
I/O
-
-
-
P116
391 (3)
O, TDO
P76
A13
P109
P157
0
I/O
-
-
-
P117
394 (3)
GND
P77
A12
P110
P158
-
GND
-
J10
P81
P118
-
I/O
P78
B11
P111
P159
2
I/O
-
J11
P82
P119
397 (3)
A11
P112
P160
5
-
J12
P83
P120
400 (3)
I/O,
PGCK4(1),
GCK7(2)
P79
I/O
I/O
-
D10
P113
P161
8
I/O
-
C10
P114
P162
11
VCC (2)
-
-
-
P121
-
I/O (D5(2))
P57
J13
P84
P122
403 (3)
I/O
P58
H10
P85
P123
406 (3)
I/O
-
-
-
P124
409 (3)
I/O
-
-
-
P125
412 (3)
I/O
P59
H11
P86
P126
415 (3)
I/O
P60
H12
P87
P127
418 (3)
I/O (D4(2))
P61
H13
P88
P128
421 (3)
I/O
P62
G12
P89
P129
424 (3)
VCC
P63
G13
P90
P130
-
GND
P64
G11
P91
P131
-
I/O (D3(2))
P65
G10
P92
P132
427 (3)
I/O
P66
F13
P93
P133
430 (3)
I/O
P67
F12
P94
P134
433 (3)
I/O
-
F11
P95
P135
436 (3)
I/O
-
-
-
P136
439 (3)
I/O
-
-
-
P137
442 (3)
I/O (D2(2))
P68
F10
P96
P138
445 (3)
I/O
P69
E13
P97
P139
448 (3)
VCC (2)
-
-
-
P140
-
I/O
-
E12
P98
P141
451 (3)
I/O
-
E11
P99
P142
454 (3)
GND
-
E10
P100
P143
-
I/O
-
-
-
P145
457 (3)
I/O
-
-
-
P146
460 (3)
I/O
-
-
-
P147
463 (3)
I/O
-
-
-
P148
466 (3)
I/O (D1(2))
P70
D13
P101
P149
469 (3)
I/O
P71
D12
P102
P150
472 (3)
I/O
-
D11
P103
P151
475 (3)
I/O
-
C13
P104
P152
478 (3)
I/O
(D0(2), DIN)
P72
C12
P105
P153
481 (3)
I/O,
SGCK4(1),
GCK6(2)
(DOUT)
P73
C11
P106
P154
484 (3)
CCLK
P74
B13
P107
P155
-
70
VQ100
CS144(2)
TQ144
PQ208
Bndry
Scan
I/O (CS1(2))
P80
B10
P115
P163
14
I/O
P81
A10
P116
P164
17
I/O
-
D9
P117
P166
20
I/O
-
-
-
P167
23
I/O
-
-
-
P168
26
I/O
-
-
-
P169
29
GND
-
C9
P118
P170
-
I/O
-
B9
P119
P171
32
I/O
-
A9
P120
P172
35
VCC(2)
-
-
-
P173
-
I/O
P82
D8
P121
P174
38
I/O
P83
C8
P122
P175
41
I/O
-
-
-
P176
44
I/O
-
-
-
P177
47
I/O
P84
B8
P123
P178
50
I/O
P85
A8
P124
P179
53
I/O
P86
B7
P125
P180
56
I/O
P87
A7
P126
P181
59
GND
P88
C7
P127
P182
-
2/8/00
Additional XCS20/XL Package Pins
P12
P86 (1)
P165
P18 (1)
P92
P173(1)
PQ208
Not Connected Pins
P33 (1)
P39
P111
P121(1)
P192(1)
P202
P65
P140(1)
P203
P71 (1)
P144
-
9/16/98
Notes:
1. 5V Spartan only
2. 3V Spartan-XL only
3. The “PWRDWN” on the XCS20XL is not part of the
Boundary Scan chain. For the XCS20XL, subtract 1 from all
Boundary Scan numbers from GCK3 on (247 and higher).
www.xilinx.com
1-800-255-7778
DS060 (v1.6) September 19, 2001
Product Specification
R
Spartan and Spartan-XL Families Field Programmable Gate Arrays
XCS30 and XCS30XL Device Pinouts
I/O,
XCS30/XL
Pad Name
VQ100
TQ144
PQ208
PQ240
BG256
CS280(2)
Bndry
Scan
VCC
P89
P128
P183
P212
VCC (4)
VCC (4)
-
I/O
P90
P129
P184
P213
C10
D10
74
I/O
P91
P130
P185
P214
D10
E10
77
I/O
P92
P131
P186
P215
A9
A9
80
I/O
P93
P132
P187
P216
B9
B9
83
I/O
-
-
P188
P217
C9
C9
86
I/O
-
-
P189
P218
D9
D9
89
I/O
P94
P133
P190
P220
A8
A8
92
I/O
P95
P134
P191
P221
B8
B8
95
VCC
-
-
P192
P222
VCC (4)
VCC (4)
-
I/O
-
-
-
P223
A6
B7
98
I/O
-
-
-
P224
C7
C7
101
I/O
-
P135
P193
P225
B6
D7
104
I/O
-
P136
P194
P226
A5
A6
107
GND
-
P137
P195
P227
GND (4)
GND (4)
-
I/O
-
-
P196
P228
C6
B6
110
I/O
-
-
P197
P229
B5
C6
113
I/O
-
-
P198
P230
A4
D6
116
I/O
-
-
P199
P231
C5
E6
119
I/O
P96
P138
P200
P232
B4
A5
122
I/O
P97
P139
P201
P233
A3
C5
125
I/O
-
-
P202
P234
D5
B4
128
I/O
-
-
P203
P235
C4
C4
131
I/O
-
P140
P204
P236
B3
A3
134
I/O
-
P141
P205
P237
B2
A2
137
I/O
P98
P142
P206
P238
A2
B3
140
P99
P143
P207
P239
C3
B2
143
P100
P144
P208
P240
VCC (4)
VCC (4)
-
GND (4)
-
SGCK1(1), GCK8(2)
VCC
GND
P1
P1
P1
P1
GND (4)
I/O, PGCK1(1), GCK1(2)
P2
P2
P2
P2
B1
C3
146
I/O
P3
P3
P3
P3
C2
C2
149
I/O
-
P4
P4
P4
D2
B1
152
I/O
-
P5
P5
P5
D3
C1
155
I/O, TDI
P4
P6
P6
P6
E4
D4
158
I/O, TCK
P5
P7
P7
P7
C1
D3
161
I/O
-
-
P8
P8
D1
E2
164
I/O
-
-
P9
P9
E3
E4
167
I/O
-
-
P10
P10
E2
E1
170
I/O
-
-
P11
P11
E1
F5
173
I/O
-
-
P12
P12
F3
F3
176
I/O
-
-
-
P13
F2
F2
179
GND
-
P8
P13
P14
GND (4)
GND (4)
-
I/O
-
P9
P14
P15
G3
F4
182
I/O
-
P10
P15
P16
G2
F1
185
DS060 (v1.6) September 19, 2001
Product Specification
www.xilinx.com
1-800-255-7778
71
R
Spartan and Spartan-XL Families Field Programmable Gate Arrays
XCS30 and XCS30XL Device Pinouts (Continued)
XCS30/XL
Pad Name
VQ100
TQ144
PQ208
PQ240
BG256
CS280(2)
Bndry
Scan
I/O, TMS
P6
P11
P16
P17
G1
G3
188
I/O
P7
P12
P17
P18
H3
G2
191
VCC
-
-
P18
P19
VCC (4)
VCC (4)
-
I/O
-
-
-
P20
H2
G4
194
I/O
-
-
-
P21
H1
H1
197
I/O
-
-
P19
P23
J2
H4
200
I/O
-
-
P20
P24
J1
J1
203
I/O
-
P13
P21
P25
K2
J2
206
I/O
P8
P14
P22
P26
K3
J3
209
I/O
P9
P15
P23
P27
K1
J4
212
I/O
P10
P16
P24
P28
L1
K1
215
GND
P11
P17
P25
P29
GND (4)
GND (4)
-
VCC (4)
-
VCC
P12
P18
P26
P30
VCC (4)
I/O
P13
P19
P27
P31
L2
K3
218
I/O
P14
P20
P28
P32
L3
K4
221
I/O
P15
P21
P29
P33
L4
K5
224
I/O
-
P22
P30
P34
M1
L1
227
I/O
-
-
P31
P35
M2
L2
230
I/O
-
-
P32
P36
M3
L3
233
I/O
-
-
-
P38
N1
M2
236
I/O
-
-
-
P39
N2
M3
239
VCC
-
-
P33
P40
VCC (4)
VCC (4)
-
I/O
P16
P23
P34
P41
P1
N1
242
I/O
P17
P24
P35
P42
P2
N2
245
I/O
-
P25
P36
P43
R1
N3
248
I/O
-
P26
P37
P44
P3
N4
251
GND (4)
-
GND
-
P27
P38
P45
GND (4)
I/O
-
-
-
P46
T1
P1
254
I/O
-
-
P39
P47
R3
P2
257
I/O
-
-
P40
P48
T2
P3
260
I/O
-
-
P41
P49
U1
P4
263
I/O
-
-
P42
P50
T3
P5
266
I/O
-
-
P43
P51
U2
R1
269
I/O
P18
P28
P44
P52
V1
T1
272
I/O
P19
P29
P45
P53
T4
T2
275
I/O
-
P30
P46
P54
U3
T3
278
I/O
-
P31
P47
P55
V2
U1
281
I/O
P20
P32
P48
P56
W1
V1
284
GCK2(2)
P21
P33
P49
P57
V3
U2
287
Not Connected(1), M1(2)
P22
P34
P50
P58
W2
V2
290
GND (4)
293
I/O,
SGCK2(1),
GND
P23
P35
P51
P59
GND (4)
MODE(1), M0(2)
P24
P36
P52
P60
Y1
W1
VCC
P25
P37
P53
P61
VCC (4)
VCC (4)
-
P26
P38
P54
P62
W3
V3
294 (1)
Not Connected
(1),
PWRDWN(2)
72
www.xilinx.com
1-800-255-7778
DS060 (v1.6) September 19, 2001
Product Specification
R
Spartan and Spartan-XL Families Field Programmable Gate Arrays
XCS30 and XCS30XL Device Pinouts (Continued)
XCS30/XL
Pad Name
VQ100
TQ144
PQ208
PQ240
BG256
CS280(2)
Bndry
Scan
I/O, PGCK2(1), GCK3(2)
P27
P39
P55
P63
Y2
W2
295 (3)
I/O (HDC)
P28
P40
P56
P64
W4
W3
298 (3)
I/O
-
P41
P57
P65
V4
T4
301 (3)
I/O
-
P42
P58
P66
U5
U4
304 (3)
I/O
P29
P43
P59
P67
Y3
V4
307 (3)
I/O (LDC)
P30
P44
P60
P68
Y4
W4
310 (3)
I/O
-
-
P61
P69
V5
T5
313 (3)
I/O
-
-
P62
P70
W5
W5
316 (3)
I/O
-
-
P63
P71
Y5
R6
319 (3)
I/O
-
-
P64
P72
V6
U6
322 (3)
I/O
-
-
P65
P73
W6
V6
325 (3)
I/O
-
-
-
P74
Y6
T6
328 (3)
GND
-
P45
P66
P75
GND (4)
GND (4)
-
I/O
-
P46
P67
P76
W7
W6
331 (3)
I/O
-
P47
P68
P77
Y7
U7
334 (3)
I/O
P31
P48
P69
P78
V8
V7
337 (3)
I/O
P32
P49
P70
P79
W8
W7
340 (3)
VCC (4)
-
VCC
-
-
P71
P80
VCC (4)
I/O
-
-
P72
P81
Y8
W8
343 (3)
I/O
-
-
P73
P82
U9
U8
346 (3)
I/O
-
-
-
P84
Y9
W9
349 (3)
I/O
-
-
-
P85
W10
V9
352 (3)
I/O
P33
P50
P74
P86
V10
U9
355 (3)
I/O
P34
P51
P75
P87
Y10
T9
358 (3)
I/O
P35
P52
P76
P88
Y11
W10
361 (3)
I/O (INIT)
P36
P53
P77
P89
W11
V10
364 (3)
VCC
P37
P54
P78
P90
VCC (4)
VCC (4)
-
GND (4)
-
GND
P38
P55
P79
P91
GND (4)
I/O
P39
P56
P80
P92
V11
T10
367 (3)
I/O
P40
P57
P81
P93
U11
R10
370 (3)
I/O
P41
P58
P82
P94
Y12
W11
373 (3)
I/O
P42
P59
P83
P95
W12
V11
376 (3)
I/O
-
-
P84
P96
V12
U11
379 (3)
I/O
-
-
P85
P97
U12
T11
382 (3)
I/O
-
-
-
P99
V13
U12
385 (3)
I/O
-
-
-
P100
Y14
T12
388 (3)
VCC
-
-
P86
P101
VCC (4)
VCC (4)
-
I/O
P43
P60
P87
P102
Y15
V13
391 (3)
I/O
P44
P61
P88
P103
V14
U13
394 (3)
I/O
-
P62
P89
P104
W15
T13
397 (3)
I/O
-
P63
P90
P105
Y16
W14
400 (3)
GND (4)
-
GND
-
P64
P91
P106
GND (4)
I/O
-
-
-
P107
V15
V14
403 (3)
I/O
-
-
P92
P108
W16
U14
406 (3)
I/O
-
-
P93
P109
Y17
T14
409 (3)
DS060 (v1.6) September 19, 2001
Product Specification
www.xilinx.com
1-800-255-7778
73
R
Spartan and Spartan-XL Families Field Programmable Gate Arrays
XCS30 and XCS30XL Device Pinouts (Continued)
XCS30/XL
Pad Name
VQ100
TQ144
PQ208
PQ240
BG256
CS280(2)
Bndry
Scan
I/O
-
-
P94
P110
V16
R14
412 (3)
I/O
-
-
P95
P111
W17
W15
415 (3)
I/O
-
-
P96
P112
Y18
U15
418 (3)
I/O
P45
P65
P97
P113
U16
V16
421 (3)
I/O
P46
P66
P98
P114
V17
U16
424 (3)
I/O
-
P67
P99
P115
W18
W17
427 (3)
I/O
-
P68
P100
P116
Y19
W18
430 (3)
I/O
P47
P69
P101
P117
V18
V17
433 (3)
I/O, SGCK3(1), GCK4(2)
P48
P70
P102
P118
W19
V18
436 (3)
P119
GND (4)
GND (4)
-
GND
P49
P71
P103
DONE
P50
P72
P104
P120
Y20
W19
-
VCC
P51
P73
P105
P121
VCC (4)
VCC (4)
-
PROGRAM
P52
P74
P106
P122
V19
U18
-
I/O (D7(2))
P53
P75
P107
P123
U19
V19
439 (3)
I/O, PGCK3(1), GCK5(2)
P54
P76
P108
P124
U18
U19
442 (3)
I/O
-
P77
P109
P125
T17
T16
445 (3)
I/O
-
P78
P110
P126
V20
T17
448 (3)
I/O
-
-
-
P127
U20
T18
451 (3)
I/O
I/O
-
-
P111
P128
T18
T19
454 (3)
(D6(2))
P55
P79
P112
P129
T19
R16
457 (3)
I/O
P56
P80
P113
P130
T20
R19
460 (3)
I/O
-
-
P114
P131
R18
P15
463 (3)
I/O
-
-
P115
P132
R19
P17
466 (3)
I/O
-
-
P116
P133
R20
P18
469 (3)
I/O
-
-
P117
P134
P18
P16
472 (3)
GND (4)
-
GND
-
P81
P118
P135
GND (4)
I/O
-
-
-
P136
P20
P19
475 (3)
I/O
-
-
-
P137
N18
N17
478 (3)
I/O
-
P82
P119
P138
N19
N18
481 (3)
I/O
-
P83
P120
P139
N20
N19
484 (3)
VCC
I/O
I/O
-
-
P121
P140
VCC (4)
VCC (4)
-
(D5(2))
P57
P84
P122
P141
M17
M19
487 (3)
I/O
P58
P85
P123
P142
M18
M17
490 (3)
I/O
-
-
P124
P144
M20
L19
493 (3)
I/O
-
-
P125
P145
L19
L18
496 (3)
I/O
P59
P86
P126
P146
L18
L17
499 (3)
I/O
P60
P87
P127
P147
L20
L16
502 (3)
(D4(2))
P61
P88
P128
P148
K20
K19
505 (3)
I/O
P62
P89
P129
P149
K19
K18
508 (3)
P150
VCC (4)
VCC (4)
-
GND (4)
-
VCC
74
P63
P90
P130
GND
P64
P91
P131
P151
GND (4)
I/O (D3(2))
P65
P92
P132
P152
K18
K16
511 (3)
I/O
P66
P93
P133
P153
K17
K15
514 (3)
I/O
P67
P94
P134
P154
J20
J19
517 (3)
I/O
-
P95
P135
P155
J19
J18
520 (3)
www.xilinx.com
1-800-255-7778
DS060 (v1.6) September 19, 2001
Product Specification
R
Spartan and Spartan-XL Families Field Programmable Gate Arrays
XCS30 and XCS30XL Device Pinouts (Continued)
XCS30/XL
Pad Name
VQ100
TQ144
PQ208
PQ240
BG256
CS280(2)
Bndry
Scan
I/O
-
-
P136
P156
J18
J17
523 (3)
I/O
-
-
P137
P157
J17
J16
526 (3)
I/O (D2(2))
P68
P96
P138
P159
H19
H17
529 (3)
I/O
P69
P97
P139
P160
H18
H16
532 (3)
VCC
-
-
P140
P161
VCC (4)
VCC (4)
-
I/O
-
P98
P141
P162
G19
G18
535 (3)
I/O
-
P99
P142
P163
F20
G17
538 (3)
I/O
-
-
-
P164
G18
G16
541 (3)
I/O
-
-
-
P165
F19
F19
544 (3)
GND (4)
-
GND
-
P100
P143
P166
GND (4)
I/O
-
-
-
P167
F18
F18
547 (3)
I/O
-
-
P144
P168
E19
F17
550 (3)
I/O
-
-
P145
P169
D20
F16
553 (3)
I/O
-
-
P146
P170
E18
F15
556 (3)
I/O
-
-
P147
P171
D19
E19
559 (3)
I/O
-
-
P148
P172
C20
E17
562 (3)
I/O (D1(2))
P70
P101
P149
P173
E17
E16
565 (3)
I/O
P71
P102
P150
P174
D18
D19
568 (3)
I/O
-
P103
P151
P175
C19
C19
571 (3)
I/O
-
P104
P152
P176
B20
B19
574 (3)
I/O (D0(2), DIN)
P72
P105
P153
P177
C18
C18
577 (3)
I/O, SGCK4(1), GCK6(2)
P73
P106
P154
P178
B19
B18
580 (3)
P74
P107
P155
P179
A20
A19
-
VCC (4)
0
(DOUT)
CCLK
VCC
P75
P108
P156
P180
VCC (4)
O, TDO
P76
P109
P157
P181
A19
B17
GND
P77
P110
P158
P182
GND (4)
GND (4)
-
I/O
P78
P111
P159
P183
B18
A18
2
I/O, PGCK4(1), GCK7(2)
P79
P112
P160
P184
B17
A17
5
I/O
-
P113
P161
P185
C17
D16
8
I/O
-
P114
P162
P186
D16
C16
11
I/O (CS1)(2)
P80
P115
P163
P187
A18
B16
14
I/O
P81
P116
P164
P188
A17
A16
17
I/O
-
-
P165
P189
C16
D15
20
I/O
-
-
-
P190
B16
A15
23
I/O
-
P117
P166
P191
A16
E14
26
I/O
-
-
P167
P192
C15
C14
29
I/O
-
-
P168
P193
B15
B14
32
I/O
-
-
P169
P194
A15
D14
35
GND
-
P118
P170
P196
GND (4)
GND (4)
-
I/O
-
P119
P171
P197
B14
A14
38
I/O
-
P120
P172
P198
A14
C13
41
I/O
-
-
-
P199
C13
B13
44
I/O
-
-
-
P200
B13
A13
47
VCC
-
-
P173
P201
VCC (4)
VCC (4)
-
I/O
P82
P121
P174
P202
C12
B12
50
DS060 (v1.6) September 19, 2001
Product Specification
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75
R
Spartan and Spartan-XL Families Field Programmable Gate Arrays
XCS30 and XCS30XL Device Pinouts (Continued)
XCS30/XL
Pad Name
VQ100
TQ144
I/O
P83
P122
P175
I/O
-
-
P176
PQ208
Bndry
Scan
BG256
CS280(2)
P203
B12
D12
53
P205
A12
A11
56
PQ240
I/O
-
-
P177
P206
B11
B11
59
I/O
P84
P123
P178
P207
C11
C11
62
I/O
P85
P124
P179
P208
A11
D11
65
I/O
P86
P125
P180
P209
A10
A10
68
I/O
P87
P126
P181
P210
B10
B10
71
GND
P88
P127
P182
P211
GND (4)
GND (4)
-
2/8/00
Notes:
1. 5V Spartan only
2. 3V Spartan-XL only
3. The “PWRDWN” on the XCS30XL is not part of the Boundary Scan chain. For the XCS30XL, subtract 1 from all Boundary Scan
numbers from GCK3 on (295 and higher).
4. Pads labeled GND (4) or VCC(4) are internally bonded to Ground or VCC planes within the package.
Additional XCS30/XL Package Pins
CS280
PQ240
VCC Pins
GND Pins
P22
P37
P83
P98
P143
P158
P204
P219
-
-
-
-
Not Connected Pins
P195
-
-
-
-
-
A1
A7
B5
B15
C10
C17
D13
E3
E18
G1
G19
K2
K17
M4
N16
R3
R18
T7
U3
U10
U17
V5
V15
W13
GND Pins
2/12/98
BG256
VCC Pins
C14
D6
D7
D11
D14
D15
E20
F1
F4
F17
G4
G17
K4
L17
P4
P17
P19
R2
R4
R17
U6
U7
U10
U14
U15
V7
W20
-
-
-
GND Pins
A1
B7
D4
D8
D13
D17
G20
H4
H17
N3
N4
N17
U4
U8
U13
U17
W14
-
Not Connected Pins
A7
A13
C8
D12
H20
J3
J4
M4
M19
V9
W9
W13
Y13
-
-
-
-
-
E5
E7
E8
E9
E11
E12
E13
G5
G15
H5
H15
J5
J15
L5
L15
M5
M15
N5
N15
R7
R8
R9
R11
R12
R13
-
-
-
-
-
Not Connected Pins
A4
A12
C8
C12
C15
D1
D2
D5
D8
D17
D18
E15
H2
H3
H18
H19
L4
M1
M16
M18
R2
R4
R5
R15
R17
T8
T15
U5
V8
V12
W12
W16
-
-
-
-
5/19/99
6/4/97
76
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DS060 (v1.6) September 19, 2001
Product Specification
R
Spartan and Spartan-XL Families Field Programmable Gate Arrays
XCS40 and XCS40XL Device Pinouts
XCS40 and XCS40XL Device Pinouts
XCS40/XL
Pad Name
VCC
PQ208
PQ240
BG256
CS280(2)
P183
P212
VCC(4)
VCC(4)
XCS40/XL
Pad Name
Bndry
Scan
-
I/O
PQ240
BG256
CS280(2)
Bndry
Scan
P9
P9
E3
E4
197
P10
P10
E2
E1
200
PQ208
I/O
P184
P213
C10
D10
86
I/O
I/O
P185
P214
D10
E10
89
I/O
P11
P11
E1
F5
203
P12
P12
F3
F3
206
I/O
P186
P215
A9
A9
92
I/O
I/O
P187
P216
B9
B9
95
I/O
-
P13
F2
F2
209
P13
P14
GND(4)
GND(4)
-
I/O
P188
P217
C9
C9
98
GND
I/O
P189
P218
D9
D9
101
I/O
P14
P15
G3
F4
212
P15
P16
G2
F1
215
I/O
P190
P220
A8
A8
104
I/O
I/O
P191
P221
B8
B8
107
I/O, TMS
P16
P17
G1
G3
218
110
I/O
P17
P18
H3
G2
221
VCC(4)
-
I/O
I/O
VCC
I/O
-
-
C8
C8
-
A7
D8
P192
P222
VCC(4)
VCC(4)
-
P223
A6
B7
P18
P19
VCC(4)
-
I/O
-
P20
H2
G4
224
116
I/O
-
P21
H1
H1
227
-
-
J4
H3
230
113
VCC
I/O
-
P224
C7
C7
119
I/O
I/O
P193
P225
B6
D7
122
I/O
-
-
J3
H2
233
P19
P23
J2
H4
236
I/O
GND
P194
P195
P226
A5
A6
125
I/O
P227
GND (4)
GND(4)
-
I/O
P20
P24
J1
J1
239
P21
P25
K2
J2
242
I/O
P196
P228
C6
B6
128
I/O
I/O
P197
P229
B5
C6
131
I/O
P22
P26
K3
J3
245
P23
P27
K1
J4
248
I/O
P198
P230
A4
D6
134
I/O
I/O
P199
P231
C5
E6
137
I/O
P24
P28
L1
K1
251
140
GND
P25
P29
GND(4)
GND(4)
-
VCC(4)
-
I/O
I/O
P200
P201
P232
P233
B4
A3
A5
C5
143
VCC
P26
P30
VCC(4)
P27
P31
L2
K3
254
I/O
-
-
-
D5
146
I/O
I/O
-
-
-
A4
149
I/O
P28
P32
L3
K4
257
P29
P33
L4
K5
260
I/O
P202
P234
D5
B4
152
I/O
I/O
P203
P235
C4
C4
155
I/O
P30
P34
M1
L1
263
P31
P35
M2
L2
266
I/O
P204
P236
B3
A3
158
I/O
I/O
P205
P237
B2
A2
161
I/O
P32
P36
M3
L3
269
-
-
M4
L4
272
I/O
P206
P238
A2
B3
164
I/O
I/O,
SGCK1(1),
GCK8(2)
P207
P239
C3
B2
167
I/O
-
-
-
M1
275
I/O
-
P38
N1
M2
278
-
P39
N2
M3
281
VCC
P208
P240
VCC(4)
VCC(4)
-
VCC
P33
P40
VCC(4)
VCC(4)
-
GND
P1
P1
GND (4)
GND(4)
-
I/O
P34
P41
P1
N1
284
I/O,
PGCK1(1),
GCK1(2)
P2
P2
B1
C3
170
I/O
P35
P42
P2
N2
287
I/O
P36
P43
R1
N3
290
I/O
P37
P44
P3
N4
293
GND(4)
-
P1
296
I/O
I/O
I/O
P3
P4
P3
P4
C2
D2
C2
B1
173
176
GND
P38
P45
GND(4)
-
P46
T1
I/O
P5
P5
D3
C1
179
I/O
I/O, TDI
P6
P6
E4
D4
182
I/O
P39
P47
R3
P2
299
P40
P48
T2
P3
302
I/O, TCK
I/O
P7
P7
C1
D3
185
I/O
-
-
-
D2
188
I/O
P41
P49
U1
P4
305
P42
P50
T3
P5
308
P43
P51
U2
R1
311
I/O
-
-
-
D1
191
I/O
I/O
P8
P8
D1
E2
194
I/O
DS060 (v1.6) September 19, 2001
Product Specification
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1-800-255-7778
77
R
Spartan and Spartan-XL Families Field Programmable Gate Arrays
XCS40 and XCS40XL Device Pinouts
XCS40/XL
Pad Name
XCS40 and XCS40XL Device Pinouts
PQ208
PQ240
BG256
CS280(2)
Bndry
Scan
I/O
-
-
-
R2
314
I/O
-
-
-
R4
I/O
P44
P52
V1
I/O
P45
P53
I/O
P46
P54
XCS40/XL
Pad Name
PQ208
PQ240
BG256
CS280(2)
Bndry
Scan
I/O
-
P85
W10
V9
412 (3)
317
I/O
P74
P86
V10
U9
415 (3)
T1
320
I/O
P75
P87
Y10
T9
418 (3)
T4
T2
323
I/O
P76
P88
Y11
W10
421 (3)
U3
T3
326
I/O (INIT)
P77
P89
W11
V10
424 (3)
VCC(4)
VCC(4)
I/O
P47
P55
V2
U1
329
VCC
P78
P90
VCC(4)
I/O
P48
P56
W1
V1
332
GND
P79
P91
GND(4)
GND(4)
-
I/O,
SGCK2(1),
GCK2 (2)
P49
P57
V3
U2
335
I/O
P80
P92
V11
T10
427 (3)
I/O
P81
P93
U11
R10
430 (3)
Not
Connected(1)
M1(2)
P50
I/O
P82
P94
Y12
W11
433 (3)
I/O
P83
P95
W12
V11
436 (3)
I/O
P84
P96
V12
U11
439 (3)
GND
P51
P59
GND (4)
GND(4)
-
I/O
P85
P97
U12
T11
442 (3)
MODE(1),
M0(2)
P52
P60
Y1
W1
341
I/O
-
-
Y13
W12
445 (3)
I/O
-
-
W13
V12
448 (3)
VCC(4)
-
I/O
-
P99
V13
U12
451 (3)
V3
342(1)
I/O
-
P100
Y14
T12
454 (3)
VCC(4)
-
P58
W2
V2
VCC
P53
P61
VCC(4)
Not
Connected(1)
PWRDWN(2)
P54
P62
W3
I/O,
PGCK2(1),
GCK3(2)
P55
I/O (HDC)
P56
P64
W4
W3
I/O
P57
P65
V4
I/O
P58
P66
I/O
P59
I/O (LDC)
338
VCC
P86
P101
VCC(4)
I/O
P87
P102
Y15
V13
457 (3)
I/O
P88
P103
V14
U13
460 (3)
I/O
P89
P104
W15
T13
463 (3)
346 (3)
I/O
P90
P105
Y16
W14
466 (3)
T4
349 (3)
GND
P91
P106
GND(4)
GND(4)
-
U5
U4
352 (3)
I/O
-
P107
V15
V14
469 (3)
P67
Y3
V4
355 (3)
I/O
P92
P108
W16
U14
472 (3)
P60
P68
Y4
W4
358 (3)
I/O
P93
P109
Y17
T14
475 (3)
I/O
-
-
-
R5
361 (3)
I/O
P94
P110
V16
R14
478 (3)
I/O
-
-
-
U5
364 (3)
I/O
P95
P111
W17
W15
481 (3)
I/O
P61
P69
V5
T5
367 (3)
I/O
P96
P112
Y18
U15
484 (3)
I/O
P62
P70
W5
W5
370 (3)
I/O
-
-
-
T15
487 (3)
I/O
P63
P71
Y5
R6
373 (3)
I/O
-
-
-
W16
490 (3)
I/O
P64
P72
V6
U6
376 (3)
I/O
P97
P113
U16
V16
493 (3)
I/O
P65
P73
W6
V6
379 (3)
I/O
P98
P114
V17
U16
496 (3)
I/O
-
P74
Y6
T6
382 (3)
I/O
P99
P115
W18
W17
499 (3)
GND
P66
P75
GND (4)
GND(4)
-
I/O
P100
P116
Y19
W18
502 (3)
I/O
P67
P76
W7
W6
385 (3)
I/O
P101
P117
V18
V17
505 (3)
I/O
P68
P77
Y7
U7
388 (3)
P102
P118
W19
V18
508 (3)
I/O
P69
P78
V8
V7
391 (3)
I/O
P70
P79
W8
W7
394 (3)
I/O,
SGCK3(1),
GCK4(2)
VCC
P71
P80
VCC(4)
VCC(4)
-
GND
P103
P119
GND(4)
GND(4)
-
I/O
P72
P81
Y8
W8
397 (3)
DONE
P104
P120
Y20
W19
-
I/O
P73
P82
U9
U8
400 (3)
VCC(4)
-
I/O
-
-
V9
V8
403 (3)
I/O
-
-
W9
T8
406 (3)
I/O
-
P84
Y9
W9
409 (3)
78
P63
Y2
W2
343 (3)
VCC
P105
P121
VCC(4)
PROGRAM
P106
P122
V19
U18
-
P107
P123
U19
V19
511 (3)
I/O
(D7(2))
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1-800-255-7778
DS060 (v1.6) September 19, 2001
Product Specification
R
Spartan and Spartan-XL Families Field Programmable Gate Arrays
XCS40 and XCS40XL Device Pinouts
XCS40/XL
Pad Name
XCS40 and XCS40XL Device Pinouts
PQ208
PQ240
BG256
CS280(2)
Bndry
Scan
I/O,
PGCK3(1),
GCK5(2)
P108
P124
U18
U19
514 (3)
I/O
P109
P125
T17
T16
517 (3)
I/O
P110
P126
V20
T17
520 (3)
I/O
-
P127
U20
T18
523 (3)
I/O
P111
P128
T18
T19
526 (3)
I/O
-
-
-
R15
529 (3)
I/O
-
-
-
R17
523 (3)
I/O (D6(2))
P112
P129
T19
R16
535 (3)
I/O
P113
P130
T20
R19
538 (3)
I/O
P114
P131
R18
P15
541 (3)
I/O
P115
P132
R19
P17
544 (3)
I/O
P116
P133
R20
P18
547 (3)
I/O
P117
P134
P18
P16
550 (3)
GND
P118
P135
GND (4)
GND(4)
-
I/O
-
P136
P20
P19
553 (3)
I/O
-
P137
N18
N17
556 (3)
I/O
P119
P138
N19
N18
559 (3)
I/O
P120
P139
N20
N19
562 (3)
P121
P140
VCC(4)
VCC(4)
-
P122
P141
M17
M19
565 (3)
I/O
P123
P142
M18
M17
568 (3)
I/O
-
-
-
M18
571 (3)
I/O
-
-
M19
M16
574 (3)
I/O
P124
P144
M20
L19
577 (3)
I/O
P125
P145
L19
L18
580 (3)
I/O
P126
P146
L18
L17
I/O
P127
P147
L20
I/O (D4(2))
P128
P148
I/O
P129
VCC
I/O
(D5(2))
XCS40/XL
Pad Name
PQ208
PQ240
BG256
CS280(2)
Bndry
Scan
I/O
-
P164
G18
G16
631 (3)
I/O
-
P165
F19
F19
634 (3)
P143
P166
GND(4)
GND(4)
-
I/O
-
P167
F18
F18
637 (3)
I/O
P144
P168
E19
F17
640 (3)
I/O
P145
P169
D20
F16
643 (3)
I/O
P146
P170
E18
F15
646 (3)
I/O
P147
P171
D19
E19
649 (3)
P148
P172
C20
E17
652 (3)
P149
P173
E17
E16
655 (3)
I/O
P150
P174
D18
D19
658 (3)
I/O
-
-
-
D18
661 (3)
I/O
-
-
-
D17
664 (3)
I/O
P151
P175
C19
C19
667 (3)
GND
I/O
I/O
(D1(2))
P152
P176
B20
B19
670 (3)
(D0(2),
I/O
DIN)
P153
P177
C18
C18
673 (3)
I/O,
SGCK4(1),
GCK6(2)
(DOUT)
P154
P178
B19
B18
676 (3)
CCLK
P155
P179
A20
A19
-
VCC(4)
0
I/O
VCC
P156
P180
VCC(4)
O, TDO
P157
P181
A19
B17
GND
P158
P182
GND(4)
GND(4)
-
I/O
P159
P183
B18
A18
2
P160
P184
B17
A17
5
583 (3)
I/O,
PGCK4(1),
GCK7(2)
L16
586 (3)
I/O
P161
P185
C17
D16
8
K20
K19
589 (3)
I/O
P162
P186
D16
C16
11
P149
K19
K18
592 (3)
I/O (CS1(2))
P163
P187
A18
B16
14
VCC(4)
-
I/O
P164
P188
A17
A16
17
VCC
P130
P150
VCC(4)
GND
P131
P151
GND (4)
GND(4)
-
I/O
-
-
-
E15
20
I/O (D3(2))
P132
P152
K18
K16
595 (3)
I/O
-
-
-
C15
23
I/O
P133
P153
K17
K15
598 (3)
I/O
P165
P189
C16
D15
26
I/O
P134
P154
J20
J19
601 (3)
I/O
-
P190
B16
A15
29
I/O
P135
P155
J19
J18
604 (3)
I/O
P166
P191
A16
E14
32
I/O
P136
P156
J18
J17
607 (3)
I/O
P167
P192
C15
C14
35
I/O
P137
P157
J17
J16
610 (3)
I/O
P168
P193
B15
B14
38
I/O
-
-
H20
H19
613 (3)
I/O
P169
P194
A15
D14
41
I/O
-
-
-
H18
616 (3)
GND
P170
P196
GND(4)
GND(4)
-
I/O (D2(2))
P138
P159
H19
H17
619 (3)
I/O
P171
P197
B14
A14
44
I/O
P139
P160
H18
H16
622 (3)
I/O
P172
P198
A14
C13
47
VCC
P140
P161
VCC(4)
VCC(4)
-
I/O
-
P199
C13
B13
50
I/O
P141
P162
G19
G18
625 (3)
I/O
-
P200
B13
A13
53
I/O
P142
P163
F20
G17
628 (3)
VCC
P173
P201
VCC(4)
VCC(4)
-
DS060 (v1.6) September 19, 2001
Product Specification
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1-800-255-7778
79
R
Spartan and Spartan-XL Families Field Programmable Gate Arrays
XCS40 and XCS40XL Device Pinouts
XCS40/XL
Pad Name
Additional XCS40/XL Package Pins
CS280(2)
Bndry
Scan
A13
A12
56
D12
C12
59
C12
B12
62
P203
B12
D12
65
P176
P205
A12
A11
68
P177
P206
B11
B11
71
P178
P207
C11
C11
74
PQ208
PQ240
I/O
-
-
I/O
-
-
I/O
P174
P202
I/O
P175
I/O
I/O
I/O
BG256
I/O
P179
P208
A11
D11
77
I/O
P180
P209
A10
A10
80
I/O
P181
P210
B10
B10
83
GND
P182
P211
GND (4)
GND(4)
-
2/8/00
Notes:
1. 5V Spartan only
2. 3V Spartan-XL only
3. The “PWRDWN” on the XCS40XL is not part of the Boundary
Scan chain. For the XCS40XL, subtract 1 from all Boundary
Scan numbers from GCK3 on (343 and higher).
4. Pads labeled GND (4) or VCC(4) are internally bonded to
Ground or VCC planes within the package.
PQ240
GND Pins
P22
P37
P83
P98
P143
P158
P204
P219
-
-
-
-
-
-
Not Connected Pins
P195
-
-
-
2/12/98
BG256
VCC Pins
C14
D6
D7
D11
D14
D15
E20
F1
F4
F17
G4
G17
K4
L17
P4
P17
P19
R2
R4
R17
U6
U7
U10
U14
U15
V7
W20
-
-
-
GND Pins
A1
B7
D4
D8
D13
D17
G20
H4
H17
N3
N4
N17
U4
U8
U13
U17
W14
-
6/17/97
CS280
VCC Pins
A1
A7
B5
B15
C10
C17
D13
E3
E18
G1
G19
K2
K17
M4
N16
R3
R18
T7
U3
U10
U17
V5
V15
W13
GND Pins
E5
E7
E8
E9
E11
E12
E13
G5
G15
H5
H15
J5
J15
L5
L15
M5
M15
N5
N15
R7
R8
R9
R11
R12
R13
-
-
-
-
-
5/19/99
80
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DS060 (v1.6) September 19, 2001
Product Specification
R
Spartan and Spartan-XL Families Field Programmable Gate Arrays
Product Availability
Table 19 shows the packages and speed grades for Spartan/XL devices. Table 20 shows the number of user I/Os available
for each device/package combination.
Table 19: Component Availability Chart for Spartan/XL FPGAs
Device
XCS05
XCS10
XCS20
XCS30
XCS40
XCS05XL
XCS10XL
XCS20XL
XCS30XL
XCS40XL
Pins
84
100
144
144
208
240
256
280
Type
Plastic
PLCC
Plastic
VQFP
Chip
Scale
Plastic
TQFP
Plastic
PQFP
Plastic
PQFP
Plastic
BGA
Chip
Scale
Code
PC84
VQ100
CS144
TQ144
PQ208
PQ240
BG256
CS280
-3
C
C, I
-
-
-
-
-
-
-4
C
C
-
-
-
-
-
-
-3
C
C, I
-
C
-
-
-
-
-4
C
C
-
C
-
-
-
-
-3
-
C
-
C, I
C, I
-
-
-
-4
-
C
-
C
C
-
-
-
-3
-
C
-
C, I
C, I
C
C
-
-4
-
C
-
C
C
C
C
-
-3
-
-
-
-
C, I
C
C
-
-4
-
-
-
-
C
C
C
-
-4
C
C, I
-
-
-
-
-
-
-5
C
C
-
-
-
-
-
-
-4
C
C, I
C
C
-
-
-
-
-5
C
C
C
C
-
-
-
-
-4
-
C, I
C
C, I
C, I
-
-
-
-5
-
C
C
C
C
-
-
-
-4
-
C
-
C, I
C, I
C
C
C
-5
-
C
-
C
C
C
C
C
-4
-
-
-
-
C, I
C
C
C
-5
-
-
-
-
C
C
C
C
8/15/00
Notes:
1. C = Commercial TJ = 0° to +85°C
2. I = Industrial TJ = –40°C to +100°C
Table 20: User I/O Chart for Spartan/XL FPGAs
Package Type
Device
Max
I/O
PC84
VQ100
CS144
TQ144
PQ208
PQ240
BG256
CS280
XCS05
80
61
77
-
-
-
-
-
-
XCS10
112
61
77
-
112
-
-
-
-
XCS20
160
-
77
-
113
160
-
-
-
XCS30
192
-
77
-
113
169
192
192
-
XCS40
224
-
-
-
-
169
192
205
-
XCS05XL
80
61
77
-
-
-
-
-
-
XCS10XL
112
61
77
112
112
-
-
-
-
XCS20XL
160
-
77
113
113
160
-
-
-
XCS30XL
192
-
77
-
113
169
192
192
192
XCS40XL
224
-
-
-
-
169
192
205
224
5/19/99
DS060 (v1.6) September 19, 2001
Product Specification
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1-800-255-7778
81
R
Spartan and Spartan-XL Families Field Programmable Gate Arrays
Ordering Information
Example:
XCS20XL-4 PQ208C
Device Type
Temperature Range
C = Commercial (TJ = 0 to +85oC)
I = Industrial (TJ = –40oC to +100oC)
Speed Grade
-3
-4
-5
Number of Pins
Package Type
BG = Ball Grid Array
VQ = Very Thin Quad Flat Pack
PC = Plastic Lead Chip Carrier
TQ = Thin Quad Flat Pack
PQ = Plastic Quad Flat Pack
CS = Chip Scale
Revision History
The following table shows the revision history for this document.
82
Date
Version
Description
11/20/98
1.3
Added Spartan-XL specs and Power Down
01/06/99
1.4
All Spartan-XL -4 specs designated Preliminary with no changes
03/02/00
1.5
Added CS package, updated Spartan-XL specs to Final
09/19/01
1.6
Reformatted, updated power specs, clarified configuration information. Removed TSOL
soldering information from Absolute Maximum Ratings table. Changed Figure 26: Slave
Serial Mode Characteristics: TCCH, TCCL from 45 to 40 ns. Changed Master Mode
Configuration Switching Characteristics: TCCLK min. from 80 to 100 ns. Added Total Dist.
RAM Bits to Table 1; added Start-Up, page 36 characteristics.
www.xilinx.com
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DS060 (v1.6) September 19, 2001
Product Specification