YEASHIN YSBLC33

DATA SHEET
YSBLC33 Series
SEMICONDUCTOR
Low Capacitance TVS Diode Array
APPLICATIONS
◆ Ethernet - 10/100/1000 Base T
H
SOD-323
◆ Cellular Phones
2
◆ I C Bus Protection
◆ Parallel & Serial Port Protection
◆ Personal Digital Assistant (PDA)
◆ Microcontroller Input Protection
◆ ISDN S/T Interface
◆ WAN/LAN Equipment
IEC COMPATIBILITY
◆ IEC61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
◆ IEC61000-4-4 (EFT) 40A (5/50ηs)
◆ IEC61000-4-5 (Lightning) 12A (8/20µs)
PIN CONFIGURATION
FEATURES
◆ 400 Watts Peak Pulse Power per Line (tp=8/20µs)
◆ Protects One Uidirectional I/O line
◆ Low clamping voltage
◆ Working voltages : 3.3V, 5.0V
◆ Low leakage current
MECHANICAL CHARACTERISTICS
◆ JEDEC SOD-323 Package
◆ Molding Compound Flammability Rating : UL 94V-O
◆ Weight 5.0 Millgrams (Approximate)
◆ Quantity Per Reel : 3,000pcs
◆ Reel Size : 7 inch
◆ Lead Finish : Lead Free
http://www.yeashin.com
1
REV.02 20110725
DEVICE CHARACTERISTICS
YSBLC33 Series
MAXIMUM RATINGS (@ 25℃ Unless Otherwise Specified)
PARAMETER
SYMBOL
VALUE
UNITS
Peak Pulse Power (tp=8/20µs waveform)
PPP
350
Watts
Lead Soldering Temperature
TL
260 (10 sec.)
℃
TJ
-55 ~ 150
℃
TSTG
-55 ~ 150
℃
Operating Temperature Range
Storage Temperature Range
ELECTRICAL CHARACTERISTICS PER LINE (@ 25℃ Unless Otherwise Specified)
PART NUMBER
DEVICE
MARKING
VRWM
VB
(V)
(V)
(max.) (min.)
IT
VC
IR
CT
(µA)
(pF)
(@A)
(max.)
(typ.)
VC
@1A
(mA)
(max.) (max.)
YSBLC33
S3
3.3
4
1
5.15
13.9
8
20
0.4
YSBLC05
S5
5.0
6
1
9.8
18.3
8
5
0.4
http://www.yeashin.com
2
REV.02 20110725
PACKAGE OUTLINE & DIMENSIONS
YSBLC33 Series
* SOLDERING FOOTPRINT
http://www.yeashin.com
3
REV.02 20110725