ZXSBMR16PT8 MR16: Schottky bridge rectifier plus freewheel diode Summary Schottky Bridge and Freewheel diode for use in MR16 LED Drive Internal Ambient Temperature = 90°C MAX* VR =13.2VRMS; IF = 0.4AAVG; IR = 10µA *within MR16 circuit enclosure Description This low leakage Schottky bridge and freewheel diode have been specifically designed for the MR16 LED driver solution alongside ZXLD1350E5 as described in Design Note DN86. SM8 Key benefits • DC OUT C GND A Compact surface mount solution and reduced component count in MR16 LED drive circuit AC IN Features • Optimized bridge and freewheel diode for use in MR16 LED diode circuitry • Low VF and low reverse leakage current Ordering information Device ZXSBMR16PT8TA N/C Reel size (inches) Tape width (mm) Quantity per reel 7 12 1000 AC IN GND DC OUT GND AC IN A C Device marking ZXSB MR16P Issue 1 - January 2008 © Zetex Semiconductors plc 2008 Pinout - top view 1 www.zetex.com ZXSBMR16PT8 Application Schematic from DN86 ZXLD1350E5 ZXSBMR16PT8 Absolute maximum ratings Parameter Symbol Value Unit Maximum repetitive reverse voltage VRRM 40 V Maximum RMS bridge input voltage VRMS 13.2 V Average rectified forward current(a)(b) IF(AV) 0.4 A Peak repetitive forward current IFPK 3.5 A Non repetitive forward current t=≤100µs t=≤10ms IFSM 13 3.5 A A PD 1 W Tstg -55 to +150 °C Junction temperature forward dissipation only Tj 150 °C Junction temperature reverse dissipation(a)(b)(c) Tj 125 °C Tamb 90 °C Symbol Limit Unit R⍜JA 125 °C/W Bridge Package Power dissipation at Tamb=25°C(a) Storage temperature range MR16 LED internal ambient temperature(d) Thermal characteristics Parameter Junction to ambient(a) NOTES: (a) For a bridge mounted on1.6mm FR4 PCB with minimum copper pads and track dimensions in still air. (b) Supply 12V RMS with capacitive bridge load. (c) Maximum bridge operating junction temperature must be reduced with increased reverse bias voltage to maintain unconditional thermal stability. (d) Refer to Design Note DN86 Issue 1 - January 2008 © Zetex Semiconductors plc 2008 2 www.zetex.com ZXSBMR16PT8 Electrical characteristics per diode (at Tamb = 25°C unless otherwise stated) Schottky diode characteristics Parameter Symbol Reverse breakdown voltage V(BR)R Forward voltage VF Min. Typ. Max. 40 Unit V 305 355 405 485 570 640 360 410 470 550 660 750 415 10 Conditions IR=200µA mV mV mV mV mV mV IF=50mA (*) IF=100mA(*) IF=250mA(*) IF=500mA(*) IF=750mA(*) IF=1A(*) mV IF=500mA(*),Ta = 100°C µA µA VR=30V VR=30V,Ta = 85°C Reverse current IR 6 370 Diode capacitance CD 16 pF f=1MHz,VR=30V Reverse recovery time Reverse recovery charge trr Qrr 3 210 ns pC Switched from IF = 500mA to VR = 5.5V Measured @ IR 50mA. di/dt = 500mA/ns. Rsource = 6Ω;Rload = 10Ω NOTES: (*) Measured under pulsed conditions. Pulse width = 300µs; duty cycle ≤2%. Issue 1 - January 2008 © Zetex Semiconductors plc 2008 3 www.zetex.com ZXSBMR16PT8 Typical characteristics single diode Issue 1 - January 2008 © Zetex Semiconductors plc 2008 4 www.zetex.com ZXSBMR16PT8 Package outline - SM8 DIM Millimeters Inches DIM Millimeters Inches Min. Max. Typ. Min. Max. Typ. Min. Max. Typ. Min. Max. Typ. A - 1.7 - - 0.067 - e1 - - 4.59 - - 0.1807 A1 0.02 0.1 - 0.0008 0.004 - e2 - - 1.53 - - 0.0602 b - - 0.7 - - 0.0275 He 6.7 7.3 - 0.264 0.287 - c 0.24 0.32 - 0.009 0.013 - Lp 0.9 - - 0.035 - - D 6.3 6.7 - 0.248 0.264 - ␣ - 15° - - 15° - E 3.3 3.7 - 0.130 0.145 -  - - 10° - - 10° Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches Issue 1 - January 2008 © Zetex Semiconductors plc 2008 5 www.zetex.com ZXSBMR16PT8 Definitions Product change Zetex Semiconductors reserves the right to alter, without notice, specifications, design, price or conditions of supply of any product or service. Customers are solely responsible for obtaining the latest relevant information before placing orders. Applications disclaimer The circuits in this design/application note are offered as design ideas. It is the responsibility of the user to ensure that the circuit is fit for the user’s application and meets with the user’s requirements. No representation or warranty is given and no liability whatsoever is assumed by Zetex with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Zetex does not assume any legal responsibility or will not be held legally liable (whether in contract, tort (including negligence), breach of statutory duty, restriction or otherwise) for any damages, loss of profit, business, contract, opportunity or consequential loss in the use of these circuit applications, under any circumstances. Life support Zetex products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Zetex Semiconductors plc. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Reproduction The product specifications contained in this publication are issued to provide outline information only which (unless agreed by the company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. Terms and Conditions All products are sold subjects to Zetex’ terms and conditions of sale, and this disclaimer (save in the event of a conflict between the two when the terms of the contract shall prevail) according to region, supplied at the time of order acknowledgement. For the latest information on technology, delivery terms and conditions and prices, please contact your nearest Zetex sales office. Quality of product Zetex is an ISO 9001 and TS16949 certified semiconductor manufacturer. To ensure quality of service and products we strongly advise the purchase of parts directly from Zetex Semiconductors or one of our regionally authorized distributors. For a complete listing of authorized distributors please visit: www.zetex.com/salesnetwork Zetex Semiconductors does not warrant or accept any liability whatsoever in respect of any parts purchased through unauthorized sales channels. ESD (Electrostatic discharge) Semiconductor devices are susceptible to damage by ESD. Suitable precautions should be taken when handling and transporting devices. The possible damage to devices depends on the circumstances of the handling and transporting, and the nature of the device. The extent of damage can vary from immediate functional or parametric malfunction to degradation of function or performance in use over time. Devices suspected of being affected should be replaced. 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Samples may be available “Active” Product status recommended for new designs “Last time buy (LTB)” Device will be discontinued and last time buy period and delivery is in effect “Not recommended for new designs” Device is still in production to support existing designs and production “Obsolete” Production has been discontinued Datasheet status key: “Draft version” This term denotes a very early datasheet version and contains highly provisional information, which may change in any manner without notice. “Provisional version” This term denotes a pre-release datasheet. It provides a clear indication of anticipated performance. However, changes to the test conditions and specifications may occur, at any time and without notice. “Issue” This term denotes an issued datasheet containing finalized specifications. However, changes to specifications may occur, at any time and without notice. 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