ZXTP19020DG 20V PNP high gain transistor in SOT223 Summary BVCEO > -20V BVECO > -4V IC(cont) = 8A VCE(sat) < -47mV @ -1A RCE(sat) = 28m⍀ PD = 3.0W Complementary part number ZXTN19020DG Description C Packaged in the SOT223 outline this new low saturation PNP transistor offers extremely low on state losses making it ideal for use in DC-DC circuits and various driving and power management functions. B Features • Higher power dissipation SOT223 package • High gain • High peak current • Low saturation voltages • 4V reverse blocking voltage E Applications • Power disconnect switch • High side drivers • Motor drive E C C B Ordering information Device ZXTP19020DGTA Reel size (inches) Tape width (mm) Quantity per reel 7 12 1000 Pinout - top view Device marking ZXTP19020D Issue 1- February 2008 © Zetex Semiconductors plc 2008 1 www.zetex.com ZXTP19020DG Absolute maximum ratings Parameter Symbol Limit Unit Collector-Base voltage VCBO -25 V Collector-Emitter voltage VCEO -20 V Emitter-Collector voltage (reverse blocking) VECO -4 V Emitter-Base voltage VEBO -7 V Continuous Collector current(c) IC -8 A Base current IB -1 A Peak pulse current ICM -15 A Power dissipation at TA =25°C(a) PD 1.2 W 9.6 mW/°C Linear derating factor PD Power dissipation at TA =25°C(b) Linear derating factor PD Power dissipation at TA =25°C(c) Linear derating factor PD Power dissipation at TA =25°C(d) Linear derating factor 1.6 W 12.8 mW/°C 3.0 W 24 mW/°C 5.3 W 42 mW/°C 10.2 W 81 mW/°C Tj, Tstg -55 to 150 °C Symbol Limit Unit Junction to ambient(a) R⍜JA 104 °C/W Junction to ambient(b) R⍜JA 78 °C/W Junction to ambient(c) R⍜JA 42 °C/W Junction to ambient(d) R⍜JA 23.5 °C/W Junction to case(e) R⍜JC 12.3 °C/W PD Power dissipation at TC =25°C(e) Linear derating factor Operating and storage temperature range Thermal resistance Parameter NOTES: (a) For a device surface mounted on 15mm x 15mm x 0.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions. (b) Mounted on 25mm x 25mm x 0.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions. (c) Mounted on 50mm x 50mm x 0.6mm FR4 PCB with high coverage of single sided 2oz copper, in still air conditions. (d) As (c) above measured at t<5 seconds. (e) Junction to case (collector tab). Typical Issue 1- February 2008 © Zetex Semiconductors plc 2008 2 www.zetex.com ZXTP19020DG Thermal characteristics Issue 1- February 2008 © Zetex Semiconductors plc 2008 3 www.zetex.com ZXTP19020DG Electrical characteristics (at Tamb = 25°C unless otherwise stated) Parameter Collector-Base breakdown voltage Collector-Emitter breakdown voltage Emitter-Collector breakdown voltage (reverse blocking) Emitter-Collector breakdown voltage (reverse blocking) Emitter-Base breakdown voltage Collector-Base cut-off current Symbol BVCBO Min. -25 Typ. -55 BVCEO -20 -50 V IC= -10mA (*) BVECX -4 -8.6 V IE = -100μA, RBC < 1kΩ or 0.25V > VBC > -0.25V BVECO -4 -8.6 V IE = -100μA BVEBO -7 -8.2 V IE = -100μA ICBO <1 50 0.5 nA μA VCB = -25V VCB = -25V, Tamb=100°C Emitter cut-off current IEBO <1 -50 nA VEB = -5.6V Collector-Emitter saturation voltage VCE(sat) -40 -97 -115 -220 -47 -130 -145 -275 mV mV mV mV IC = -1A, IB = -100mA(*) IC = -1A, IB = -10mA(*) IC = -2A, IB = -40mA(*) IC = -8A, IB = -800mA(*) Base-Emitter saturation voltage Base-Emitter turn-on voltage Static forward current transfer ratio VBE(sat) -1050 -1150 mV IC = -8A, IB = -800mA(*) VBE(on) -930 -1000 mV IC = -8A, VCE = -2V(*) 450 290 70 25 900 Transition frequency fT Input capacitance Cibo Output capacitance Cobo 36 Delay time td 23 ns Rise time tr 18.4 ns Storage time ts 266 ns Fall time tf 49.6 ns hFE 300 200 45 Max. 176 Unit V Conditions IC = -100μA IC = -100mA, VCE = -2V(*) IC = -2A, VCE = -2V(*) IC = -8A, VCE = -2V(*) IC = -15A, VCE = -2V(*) MHz IC = -50mA, VCE = -10V f = 50MHz 400 pF VEB = -0.5V, f = 1MHz(*) 45 pF VCB = -10V, f = 1MHz(*) IC = -1A, VCC = -10V, IB1 = -IB2 = -50mA NOTES: (*) Measured under pulsed conditions. Pulse width ≤ 300µs; duty cycle ≤ 2%. Issue 1- February 2008 © Zetex Semiconductors plc 2008 4 www.zetex.com Typical characteristics Issue 1- February 2008 © Zetex Semiconductors plc 2008 5 www.zetex.com ZXTP19020DG Package outline - SOT223 Dim. Millimeters Inches Dim. Millimeters Inches Min. Max. Min. Max. Min. Max. Min. Max. A - 1.80 - 0.071 D 6.30 6.70 0.248 0.264 A1 0.02 0.10 0.0008 0.004 e 2.30 BSC 0.0905 BSC A2 1.55 1.65 0.0610 0.0649 e1 4.60 BSC 0.181 BSC b 0.66 0.84 0.026 0.033 E 6.70 7.30 0.264 0.287 b2 2.90 3.10 0.114 0.122 E1 3.30 3.70 0.130 0.146 C 0.23 0.33 0.009 0.013 L 0.90 - 0.355 - Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches Issue 1- February 2008 © Zetex Semiconductors plc 2008 6 www.zetex.com ZXTP19020DG Intentionally left blank Issue 1- February 2008 © Zetex Semiconductors plc 2008 7 www.zetex.com ZXTP19020DG Definitions Product change Zetex Semiconductors reserves the right to alter, without notice, specifications, design, price or conditions of supply of any product or service. Customers are solely responsible for obtaining the latest relevant information before placing orders. Applications disclaimer The circuits in this design/application note are offered as design ideas. It is the responsibility of the user to ensure that the circuit is fit for the user’s application and meets with the user’s requirements. No representation or warranty is given and no liability whatsoever is assumed by Zetex with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Zetex does not assume any legal responsibility or will not be held legally liable (whether in contract, tort (including negligence), breach of statutory duty, restriction or otherwise) for any damages, loss of profit, business, contract, opportunity or consequential loss in the use of these circuit applications, under any circumstances. Life support Zetex products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Zetex Semiconductors plc. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Reproduction The product specifications contained in this publication are issued to provide outline information only which (unless agreed by the company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. Terms and Conditions All products are sold subjects to Zetex’ terms and conditions of sale, and this disclaimer (save in the event of a conflict between the two when the terms of the contract shall prevail) according to region, supplied at the time of order acknowledgement. For the latest information on technology, delivery terms and conditions and prices, please contact your nearest Zetex sales office. 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Samples may be available “Active” Product status recommended for new designs “Last time buy (LTB)” Device will be discontinued and last time buy period and delivery is in effect “Not recommended for new designs” Device is still in production to support existing designs and production “Obsolete” Production has been discontinued Datasheet status key: “Draft version” This term denotes a very early datasheet version and contains highly provisional information, which may change in any manner without notice. “Provisional version” This term denotes a pre-release datasheet. It provides a clear indication of anticipated performance. However, changes to the test conditions and specifications may occur, at any time and without notice. “Issue” This term denotes an issued datasheet containing finalized specifications. However, changes to specifications may occur, at any time and without notice. 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