ZXTP2029F 100V, SOT23, PNP medium power transistor Summary V(BR)CEV > -130V, V(BR)CEO > -100V IC(cont) = -3A RCE(sat) = 45m⍀ typical VCE(sat) < -80mV @ -1A PD = 1.2W Complementary part number ZXTN2020F Description C Advanced process capability and package design have been used to maximize the power handling and performance of this small outline transistor. The compact size and ratings of this device make it ideally suited to applications where space is at a premium. B Features • Higher power dissipation SOT23 package • High peak current • Low saturation voltage • 130V forward blocking voltage E E Applications • MOSFET and IGBT gate driving • Motor drive • DC-DC converters • High side switches C B Pinout - top view Ordering information Device Reel size (inches) Tape width Quantity per reel 7 8mm 3,000 ZXTP2029FTA Device marking 953 Issue 3 - May 2007 © Zetex Semiconductors plc 2007 1 www.zetex.com ZXTP2029F Absolute maximum ratings Parameter Symbol Limit Unit Collector-base voltage VCBO -130 V Collector-emitter voltage V(BR)CEV -130 V Collector-emitter voltage VCEO -100 V Emitter-base voltage VEBO -7.0 V Peak pulse current ICM -5 A Continuous collector current(a) IC -3 A Base current IB -1 A Power dissipation @ TA=25oC(a) Linear derating factor PD 1.0 W mW/oC Power dissipation @ TA=25oC(b) Linear derating factor PD Power dissipation @ TA=25oC(c) Linear derating factor PD Operating and storage temperature Tj:Tstg 8.0 1.2 W mW/oC 9.6 1.56 12.5 W mW/oC -55 to +150 oC Thermal resistance Parameter Symbol Unit 125 C/W RθJA 104 o C/W RθJA 80 o C/W RθJA Junction to ambient (b) Junction to ambient (c) Junction to ambient Value o (a) NOTES: (a) Mounted on 18mm x 18mm x 1.6mm FR4 PCB with a very high coverage of 2 oz weight copper in still air conditions. (b) Mounted on 30mm x 30mm x 1.6mm FR4 PCB with a very high coverage of 2 oz weight copper in still air conditions. (c) As (b) above measured at t<5secs. Issue 3 - May 2007 © Zetex Semiconductors plc 2007 2 www.zetex.com ZXTP2029F Characteristics Issue 3 - May 2007 © Zetex Semiconductors plc 2007 3 www.zetex.com ZXTP2029F Electrical characteristics (at Tamb = 25°C unless otherwise stated) Parameter Symbol Min. Typ. Collector-base breakdown voltage V(BR)CBO -130 Collector-emitter breakdown voltage V(BR)CEV Collector-emitter breakdown voltage Unit Conditions -160 V IC=-100μA -130 -160 V IC =−1μA, 1V> VBE>-0.3V V(BR)CEO -100 -120 V IC=-10mA (a) Emitter-base breakdown voltage V(BR)EBO -7.0 -8.3 V IE=-100μA Collector-emitter cut-off current ICEV -20 nA VCE=-100V, VBE = 1V Collector-base cut-off current ICBO -20 nA VCB=-100V Emitter-base cut-off current IEBO -10 nA VEB=-6V Static forward current transfer ratio HFE Collector-emitter saturation voltage 100 220 100 200 40 75 VCE(sat) Max. IC=-10mA, VCE=-2V(a) IC=-1A, VCE=-2V(a) 300 Ic=-3A, VCE=-2V -20 -30 mV IC=-100mA, IB=-10mA(a) -60 -80 mV IC=-1A, IB=-100mA(a) -135 -180 mV IC=-3A, IB=-300mA(a) -180 -250 mV IC=-4A, IB=-400mA(a) Base-emitter saturation voltage VBE(sat) -0.90 -1.00 V IC=-3A, IB=-300mA(a) Base-emitter turn-on voltage VBE(on) -0.81 -0.90 V IC=-3A, VCE=-2V(a) Transition frequency fT 150 MHz Output capacitance Cobo 39 pF VCB=-10V, f=1MHz Delay timetime t(d) 21 ns Rise time t(r) 12 ns VCC=-10V, IC=-1A, IB1=IB2=-100mA Storage time t(stg) 410 ns Fall time t(f) 35 ns Ic=-100mA, VCE=-10V, f=50MHz NOTES: (a) Measured under pulsed conditions. Pulse width=300S. Duty cycle ⱕ2%. Issue 3 - May 2007 © Zetex Semiconductors plc 2007 4 www.zetex.com ZXTP2029F Typical characteristics Issue 3 - May 2007 © Zetex Semiconductors plc 2007 5 www.zetex.com ZXTP2029F Intentionally left blank Issue 3 - May 2007 © Zetex Semiconductors plc 2007 6 www.zetex.com ZXTP2029F Package outline - SOT23 E e e1 b 3 leads L1 D E1 A A1 Dim. L c Millimeters Inches Dim. Millimeters Min. Max. Min. Max. A - 1.12 - 0.044 e1 A1 0.01 0.10 0.0004 0.004 E 2.10 2.64 0.083 0.104 b 0.30 0.50 0.012 0.020 E1 1.20 1.40 0.047 0.055 c 0.085 0.20 0.003 0.008 L 0.25 0.60 0.0098 0.0236 D 2.80 3.04 0.110 0.120 L1 0.45 0.62 0.018 0.024 - - - - - e 0.95 NOM Min. 0.037 NOM Max. Inches 1.90 NOM Min. Max. 0.075 NOM Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches Issue 3 - May 2007 © Zetex Semiconductors plc 2007 7 www.zetex.com ZXTP2029F Definitions Product change Zetex Semiconductors reserves the right to alter, without notice, specifications, design, price or conditions of supply of any product or service. Customers are solely responsible for obtaining the latest relevant information before placing orders. Applications disclaimer The circuits in this design/application note are offered as design ideas. It is the responsibility of the user to ensure that the circuit is fit for the user’s application and meets with the user’s requirements. No representation or warranty is given and no liability whatsoever is assumed by Zetex with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Zetex does not assume any legal responsibility or will not be held legally liable (whether in contract, tort (including negligence), breach of statutory duty, restriction or otherwise) for any damages, loss of profit, business, contract, opportunity or consequential loss in the use of these circuit applications, under any circumstances. Life support Zetex products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Zetex Semiconductors plc. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Reproduction The product specifications contained in this publication are issued to provide outline information only which (unless agreed by the company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. Terms and Conditions All products are sold subjects to Zetex’ terms and conditions of sale, and this disclaimer (save in the event of a conflict between the two when the terms of the contract shall prevail) according to region, supplied at the time of order acknowledgement. For the latest information on technology, delivery terms and conditions and prices, please contact your nearest Zetex sales office. Quality of product Zetex is an ISO 9001 and TS16949 certified semiconductor manufacturer. To ensure quality of service and products we strongly advise the purchase of parts directly from Zetex Semiconductors or one of our regionally authorized distributors. For a complete listing of authorized distributors please visit: www.zetex.com/salesnetwork Zetex Semiconductors does not warrant or accept any liability whatsoever in respect of any parts purchased through unauthorized sales channels. ESD (Electrostatic discharge) Semiconductor devices are susceptible to damage by ESD. Suitable precautions should be taken when handling and transporting devices. The possible damage to devices depends on the circumstances of the handling and transporting, and the nature of the device. The extent of damage can vary from immediate functional or parametric malfunction to degradation of function or performance in use over time. Devices suspected of being affected should be replaced. Green compliance Zetex Semiconductors is committed to environmental excellence in all aspects of its operations which includes meeting or exceeding regulatory requirements with respect to the use of hazardous substances. Numerous successful programs have been implemented to reduce the use of hazardous substances and/or emissions. All Zetex components are compliant with the RoHS directive, and through this it is supporting its customers in their compliance with WEEE and ELV directives. Product status key: “Preview” Future device intended for production at some point. Samples may be available “Active” Product status recommended for new designs “Last time buy (LTB)” Device will be discontinued and last time buy period and delivery is in effect “Not recommended for new designs” Device is still in production to support existing designs and production “Obsolete” Production has been discontinued Datasheet status key: “Draft version” This term denotes a very early datasheet version and contains highly provisional information, which may change in any manner without notice. “Provisional version” This term denotes a pre-release datasheet. It provides a clear indication of anticipated performance. However, changes to the test conditions and specifications may occur, at any time and without notice. “Issue” This term denotes an issued datasheet containing finalized specifications. However, changes to specifications may occur, at any time and without notice. Zetex sales offices Europe Americas Asia Pacific Corporate Headquarters Zetex GmbH Kustermann-park Balanstraße 59 D-81541 München Germany Telefon: (49) 89 45 49 49 0 Fax: (49) 89 45 49 49 49 [email protected] Zetex Inc 700 Veterans Memorial Highway Hauppauge, NY 11788 USA Zetex (Asia Ltd) 3701-04 Metroplaza Tower 1 Hing Fong Road, Kwai Fong Hong Kong Zetex Semiconductors plc Zetex Technology Park, Chadderton Oldham, OL9 9LL United Kingdom Telephone: (1) 631 360 2222 Fax: (1) 631 360 8222 [email protected] Telephone: (852) 26100 611 Fax: (852) 24250 494 [email protected] Telephone: (44) 161 622 4444 Fax: (44) 161 622 4446 [email protected] © 2007 Published by Zetex Semiconductors plc Issue 3 - May 2007 © Zetex Semiconductors plc 2007 8 www.zetex.com