Vicor BCM352T110M300B00 High power density Datasheet

BCM® Bus Converter
BCM352x110y300B00
S
®
US
C
C
NRTL
US
Isolated Fixed Ratio DC-DC Converter
Features & Benefits
Product Ratings
• 352VDC – 11VDC 300W Bus Converter
• High efficiency (>95%) reduces system
power consumption
• High power density (>1022W/in3)
reduces power system footprint by >40%
VIN = 352V (330 – 365V)
POUT = up to 300W
VOUT = 11V (10.3 – 11.4V)
(no load)
K = 1/32
Description
• Contains built-in protection features:
n Undervoltage
n Overvoltage Lockout
n Overcurrent Protection
n Short circuit Protection
n Overtemperature Protection
The VI Chip® bus converter is a high efficiency (>95%) Sine
Amplitude Converter™ (SAC™) operating from a 352 to 365VDC
primary bus to deliver an isolated, ratiometric output voltage from
10.3 to 11.4VDC. The Sine Amplitude Converter offers a low AC
impedance beyond the bandwidth of most downstream regulators;
therefore capacitance normally at the load can be located at the
input to the Sine Amplitude Converter. Since the transformation
ratio of the BCM352x110y300B00 is 1/32, the capacitance value
can be reduced by a factor of 1024x, resulting in savings of board
area, materials and total system cost.
• Provides enable/disable control,
internal temperature monitoring
• Can be paralleled to create multi-kW arrays
The BCM352F110y300B00 is provided in a VI Chip package
compatible with standard pick-and-place and surface mount
assembly processes. The co-molded VI Chip package provides
enhanced thermal management due to a large thermal interface
area and superior thermal conductivity. The high conversion
efficiency of the BCM352x110y300B00 increases overall
system efficiency and lowers operating costs compared to
conventional approaches.
Typical Applications
• High End Computing Systems
• Automated Test Equipment
• High Density Power Supplies
• Communications Systems
Typical Application
PC
TM
enable / disable
switch
F1
VIN
BCM® Bus Converter
Page 1 of 21
L
O
A
D
BCM®
SW1
C1
+IN
+OUT
-IN
-OUT
VOUT
1µF
Rev 1.2
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BCM352x110y300B00
Pin Configuration
4
3
2
1
A
A
+OUT
B
B
C
C
D
D
E
E
-OUT
F
G
H
H
J
J
+OUT
-OUT
+IN
K
K
L
L
M
M
N
N
P
P
R
R
TM
RSV
PC
-IN
T
T
Bottom View
Pin Descriptions
Pin Number
Signal Name
Type
Function
A1-E1, A2-E2
+IN
INPUT POWER
Positive input power terminal
L1-T1, L2-T2
–IN
INPUT POWER
RETURN
Negative input power terminal
H1, H2
TM
OUTPUT
J1, J2
RSV
NC
Temperature monitor, input side referenced signal
No connect
K1, K2
PC
OUTPUT/INPUT
A3-D3, A4-D4,
J3-M3, J4-M4
+OUT
OUTPUT POWER
Positive output power terminal
E3-H3, E4-H4,
N3-T3, N4-T4
–OUT
OUTPUT POWER
RETURN
Negative output power terminal
BCM® Bus Converter
Page 2 of 21
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Enable and disable control, input side referenced signal
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Part Ordering Information
Device
Input Voltage Range
Package Type
Output Voltage x 10
Temperature Grade
BCM
352
x
110
y
BCM = BCM
352 = 330 – 365V
F = Full VIC SMD
Output Power Revision
300
B
300 = 300W
B
T = -40 – 125ºC
zz
00 = standard
110 = 11V
T = Full VIC TH
Version
M = -55 – 125ºC
>00 = Customer
specific version
Standard Models
Part Number
BCM352F110T300B00
BCM352F110M300B00
BCM352T110T300B00
BCM352T110M300B00
VIN
Package Type
VOUT
Temperature
330 – 365V
Full VIC SMD
11V
(10.3 – 11.4V)
-40 – 125ºC
330 – 365V
Full VIC TH
11V
(10.3 – 11.4V)
-40 – 125ºC
-55 – 125ºC
-55 – 125ºC
Power
Version
300W
00 = standard
300W
00 = standard
Absolute Maximum Ratings
The absolute maximum ratings below are stress ratings only. Operation at or beyond these maximum ratings can cause permanent damage to the device.
Parameter
Comments
+IN to –IN
VIN slew rate
Operational
Min
Max
Unit
-1
400
V
-1
1
V/µs
4242
V
-1
16
V
-3
41.0
A
Isolation voltage, input to ouput
+OUT to –OUT
Output current transient
≤ 10ms, ≤ 10% DC
Output current average
-2
28.5
A
PC to –IN
-0.3
20
V
TM to –IN
-0.3
7
V
Operating IC junction temperature
-40
125
ºC
Storage temperature
-40
125
ºC
BCM® Bus Converter
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Electrical Specifications
Specifications apply over all line and load conditions, unless otherwise noted; boldface specifications apply over the temperature range of
-40°C ≤ TCASE ≤ 100°C (T-Grade); all other specifications are at TCASE = 25ºC unless otherwise noted.
­Attribute
Symbol
Conditions / Notes
Min
Typ
Max
Unit
330
365
V
330
365
V
360
432
mW
440
500
ms
6.4
7.7
Powertrain
Input voltage range, continuous
Input voltage range, transient
VIN_DC
VIN_TRANS
Quiescent power
PQ
VIN to VOUT time
TON1
Full current or power supported, 50ms max,
10% duty cycle max
Disabled, PC Low
VIN = 352V, PC floating
380
VIN = 352V, TCASE = 25ºC
No load power dissipation
PNL
3
VIN = 352V
VIN = 330V to 365V, TCASE = 25ºC
11
VIN = 330V to 365V
15
Inrush current peak
IINR_P
Worse case of: VIN = 365V, COUT = 1200μF,
RLOAD = 1.6Ω
DC input current
IIN_DC
At POUT = 300W
Transformation ratio
K
15
1.7
K = VOUT / VIN, at no load
W
3.5
A
0.9
A
1/32
V/V
Output power (average)
POUT_AVG
IOUT_AVG ≤ 28.5A
300
W
Output power (peak)
POUT_PK
10ms max, POUT_AVG ≤ 300W
450
W
Output current (average)
IOUT_AVG
POUT_AVG ≤ 300W
28.5
A
Output current (peak)
IOUT_PK
10ms max, IOUT_AVG ≤ 28.5A
41.0
A
VIN = 352V, IOUT = 28.5A; TCASE = 25°C
94.5
VIN = 330V to 365V, IOUT = 28.5A; TCASE = 25°C
94.0
95.5
Efficiency (ambient)
hAMB
VIN = 352V, IOUT = 14.25A; TCASE = 25°C
94.0
94.4
Efficiency (hot)
hHOT
VIN = 352V, IOUT = 28.5A; TCASE = 100°C
94.0
95.2
Efficiency (over load range)
h20%
5.70A < IOUT < 28.5A
90.0
ROUT_COLD
IOUT = 28.5A, TCASE = -40°C
2.5
5.0
7.0
ROUT_AMB
IOUT = 28.5A, TCASE = 25°C
5.4
7.7
10.7
ROUT_HOT
IOUT = 28.5A, TCASE = 100°C
7.0
10.0
13.0
1.85
1.95
2.05
MHz
400
mV
Output resistance
%
%
%
mΩ
Switching frequency
FSW
Output voltage ripple
VOUT_PP
COUT = 0F, IOUT = 28.5A, VIN = 352V,
20MHz BW
200
Output inductance (parasitic)
LOUT_PAR
Frequency up to 30MHz, Simulated J-lead model
500
pH
Output capacitance (internal)
COUT_INT
Effective value at 11VOUT
31.0
µF
Output capacitance (external)
COUT_EXT
See chart for output capacitance vs. startup load limits
BCM® Bus Converter
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0
1200
µF
BCM352x110y300B00
Electrical Specifications (Cont.)
Specifications apply over all line and load conditions, unless otherwise noted; boldface specifications apply over the temperature range of
-40°C ≤ TCASE ≤ 100°C (T-Grade); all other specifications are at TCASE = 25ºC unless otherwise noted.
­Attribute
Symbol
Conditions / Notes
Min
Typ
Max
Unit
Protection
Input overvoltage lockout threshold
VIN_OVLO+
390
V
Input overvoltage recovery threshold
VIN_OVLO-
Input overvoltage lockout hysteresis
VIN_OVLO_HYST
4
V
Overvoltage lockout response time
TOVLO
47
µs
366
V
TAUTO_RESTART
380
440
500
ms
Input undervoltage lockout
threshold
VIN_UVLO-
275
293
315
V
Input undervoltage recovery
threshold
VIN_UVLO+
285
307
325
V
Input undervoltage lockout
hysteresis
VIN_UVLO_HYST
14
V
TUVLO
47
µs
Fault recovery time
Undervoltage lockout response time
Output overcurrent trip threshold
IOCP
Output overcurrent response time
constant
TOCP
Short circuit protection trip threshold
ISCP
Short circuit protection response time
TSCP
Thermal shutdown threshold
BCM® Bus Converter
Page 5 of 21
30
Effective internal RC filter
40
4.4
45
125
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A
ms
A
1
TJ_OTP
50
µs
°C
BCM352x110y300B00
500
45
450
41
400
36
350
32
300
27
250
23
200
18
150
14
100
9
50
5
0
Output Current (A)
Output Power (W)
Electrical Specifications (Cont.)
0
9.9
10.0 10.2 10.4 10.5 10.7 10.9 11.1 11.2 11.4
11.6
Output Voltage (V)
P (ave)
P (pk), < 10ms
I (ave)
I (pk), < 10ms
Figure 1 — Safe operating area
Output Capacitance (%)
110
100
90
80
70
60
50
40
30
20
10
0
0
10
20
30
40
50
60
70
80
90
Load Current (%)
Figure 2 — Start up load current vs. output capacitance
BCM® Bus Converter
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BCM352x110y300B00
Signal Characteristics
Specifications apply over all line and load conditions, unless otherwise noted; boldface specifications apply over the temperature range of
-40°C ≤ TCASE ≤ 100°C (T-Grade); all other specifications are at TCASE = 25ºC unless otherwise noted.
Primary Control: PC
• The PC pin enables and disables the BCM. When held low, the BCM is disabled.
• In an array of BCM modules, PC pins should be interconnected to synchronize start up and permit start up into full load conditions.
• PC pin outputs 5V during normal operation. PC pin internal bias level drops to 2.5V during fault mode, provided VIN remains
in the valid range.
SIGNAL TYPE
STATE
Regular
Operation
ANALOG
OUTPUT
Standby
Transition
DIGITAL
INPUT /
OUTPUT
ATTRIBUTE
SYMBOL
CONDITIONS / NOTES
MIN
TYP
MAX
UNIT
VPC
4.7
5.0
5.3
V
PC available current
IPC_OP
2.0
3.5
5.0
mA
PC source (current)
IPC_EN
50
100
PC resistance (internal)
RPC_INT
50
150
PC capacitance (internal)
CPC_INT
PC voltage
Internal pull down resistor
µA
400
kΩ
4700
pF
Start Up
PC load resistance
RPC_S
Start Up
PC time to start
TON1
380
440
500
ms
2.0
2.5
3.0
V
1.95
V
Regular
Operation
PC enable threshold
VPC_EN
PC disable threshold
VPC_DIS
Standby
PC disable duration
TPC_DIS_T
Transition
PC threshold hysteresis
VPC_HYSTER
PC enable to VOUT time
TON2
PC disable to standby time
TPC_DIS
PC fault response time
TFR_PC
To permit regular operation
Minimum time before attempting
re-enable
60
kΩ
1
s
50
VIN = 352V for at least TON1 ms
50
From fault to PC = 2V
mV
100
150
µs
4
10
µs
100
µs
Temperature Monitor: TM
• The TM pin monitors the internal temperature of the controller IC within an accuracy of ±5°C.
• Can be used as a “Power Good” flag to verify that the BCM module is operating.
• Is used to drive the internal comparator for Overtemperature Shutdown.
SIGNAL TYPE
STATE
ATTRIBUTE
TM voltage range
TM voltage reference
ANALOG
OUTPUT
DIGITAL
INPUT /
OUTPUT
Regular
Operation
Transition
Standby
SYMBOL
CONDITIONS / NOTES
TM available current
ITM
TM gain
ATM
TM voltage ripple
VTM_PP
TM capacitance (external)
CTM_EXT
TM fault response time
TFR_TM
TM voltage
VTM_DIS
TM pull down (internal)
RTM_INT
TJ controller = 27°C
3.00
UNIT
4.04
V
3.05
V
100
CTM = 0pF, VIN = 352V, IOUT = 28.5A
120
From fault to TM = 1.5V
200
mV
50
pF
10
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25
40
µA
mV/°C
µs
0
Internal pull down resistor
Reserved for factory use. No connection should be made to this pin.
Rev 1.2
08/2016
2.95
MAX
10
Reserved: RSV
BCM® Bus Converter
Page 7 of 21
TYP
2.12
VTM
VTM_AMB
MIN
V
50
kΩ
BCM® Bus Converter
Page 8 of 21
NL
5V
2.5 V
5V
3V
PC
VUVLO+
VUVLO–
Rev 1.2
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1
A
E: TON2
F: TOCP
G: TPC–DIS
H: TSCP**
B
D
1: Controller start
2: Controller turn off
3: PC release
C
*Min value switching off
**From detection of error to power train shut down
A: TON1
B: TOVLO*
C: TAUTO_RESTART
D:TUVLO
0.4 V
3 V @ 27°C
TM
LL • K
VOUT
C
500mS
before retrial
3V
VIN
VOVLO+
VOVLO–
2
F
4: PC pulled low
5: PC released on output SC
6: SC removed
IOCP
ISSP
IOUT
E
3
G
4
Notes:
H
5
– Timing and signal amplitudes are not to scale
– Error pulse width is load dependent
6
BCM352x110y300B00
Timing Diagram
BCM352x110y300B00
Application Characteristics
The following values, typical of an application environment, are collected at TCASE = 25ºC unless otherwise noted. See associated figures for general trend data.
97.0
Full Load Efficiency (%)
Power Dissipation (W)
14
13
12
11
10
9
8
7
6
5
96.5
96.0
95.5
95.0
94.5
94.0
4
330
334
338
342
346
349
353
357
361
365
-40
-20
0
25ºC
100ºC
VIN:
98
35
94
30
Power Dissipation (W)
Efficiency (%)
60
80
100
330 V
352 V
365 V
Figure 4 — Full load efficiency vs. temperature; Vin
Figure 3 — No load power dissipation vs. Vin
90
86
82
78
74
70
25
20
15
10
5
0
0.0
2.8
5.6
8.4
11.2 14.0 16.8 19.6 22.4 25.2 28.0
0.0
2.8
5.6
8.4
Load Current (A)
VIN:
330V
352V
11.2 14.0 16.8 19.6 22.4 25.2 28.0
Load Current (A)
VIN:
365V
Figure 5 — Efficiency at TCASE = -40°C
330V
352V
365V
Figure 6 — Power dissipation at TCASE = -40°C
98
35
94
30
Power Dissipation (W)
Efficiency (%)
40
Case Temperature (ºC)
Input Voltage (V)
-40ºC
20
90
86
82
78
74
70
25
20
15
10
5
0
0.0
2.8
5.6
8.4
11.2 14.0 16.8 19.6 22.4 25.2 28.0
0.0
2.8
5.6
Load Current (A)
VIN:
330V
352V
11.2 14.0 16.8 19.6 22.4 25.2 28.0
Load Current (A)
VIN:
365V
Figure 7 — Efficiency at TCASE = 25°C
BCM® Bus Converter
Page 9 of 21
8.4
330V
352V
Figure 8 — Power dissipation at TCASE = 25°C
Rev 1.2
08/2016
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365V
BCM352x110y300B00
98
35
94
30
Power Dissipation (W)
Efficiency (%)
Application Characteristics (Cont.)
90
86
82
78
74
70
25
20
15
10
5
0
0.0
2.8
5.6
8.4
11.2 14.0 16.8 19.6 22.4 25.2 28.0
0.0
2.8
5.6
Load Current (A)
VIN:
330V
11.2 14.0 16.8 19.6 22.4 25.2 28.0
Load Current (A)
352V
VIN:
365V
Figure 9 — Efficiency at TCASE = 100°C
330V
352V
365V
Figure 10 — Power dissipation at TCASE = 100°C
240
14
220
13
Ripple (mVPK-PK)
12
ROUT (mΩ)
8.4
11
10
9
8
200
180
160
140
120
100
80
60
7
40
6
-40
-20
0
20
40
60
80
100
0.0
5.0
28.5A
VIN:
Figure 11 — ROUT vs. temperature; nominal input
BCM® Bus Converter
Page 10 of 21
Rev 1.2
08/2016
15.0
20.0
25.0
30.0
Load Current (A)
Case Temperature (°C)
IOUT:
10.0
330V
365V
352V
Figure 12 — Vripple vs. Iout: No external Cout, board mounted
module, scope setting : 20MHz analog BW
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Application Characteristics (Cont.)
Figure 13 — Full load ripple, 2.2µF Cin: No external Cout, Board
mounted module, scope setting : 20MHz analog BW
Figure 14 — Start up from application of PC;
Vin pre-applied Cout = 1200µF
Figure 15 — 0A – 28.5A transient response: Cin = 2.2µF,
Iin measured prior to Cin , no external Cout
Figure 16 — 28.5A – 0A transient response: Cin = 2.2µF,
Iin measured prior to Cin, no external Cout
BCM® Bus Converter
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General Characteristics
Specifications apply over all line and load conditions, unless otherwise noted; boldface specifications apply over the temperature range of
-40°C ≤ TCASE ≤ 100°C (T-Grade); All other specifications are at TCASE = 25ºC unless otherwise noted.
Attribute
Symbol
Conditions / Notes
Min
Typ
Max
Unit
Mechanical
Length
L
32.25 / [1.270] 32.50 / [1.280] 32.75 / [1.289] mm / [in]
Width
W
21.75 / [0.856] 22.00 / [0.866] 22.25 / [0.876] mm / [in]
Height
H
Volume
Vol
Weight
W
6.48 / [0.255]
No heat sink
Lead Finish
6.73 / [0.265] 6.98 / [0.275]
mm / [in]
4.81 / [0.294]
cm3/ [in3]
14.5 / [0.512]
g / [oz]
Nickel
0.51
2.03
Palladium
0.02
0.15
Gold
0.003
0.051
BCM352F110T300B00 (T-Grade)
-40
125
BCM352F110M300B00 (M-Grade)
-55
125
µm
Thermal
Operating temperature
TJ
Thermal resistance
fJC
Isothermal heatsink and
isothermal internal PCB
Thermal capacity
°C
1
°C/W
9
Ws/°C
Assembly
Peak compressive force
applied to case (Z-axis)
Storage
Temperature
Supported by J-lead only
TST
lbs
lbs/ in2
BCM352F110T300B00 (T-Grade)
-40
125
°C
BCM352F110M300B00 (M-Grade)
-55
125
°C
ESDHBM
Human Body Model,
“JEDEC JESD 22-A114C.01”Class 1C
2000
ESDCDM
Charge Device Model,
“JEDEC JESD 22-C101-D”
500
ESD Withstand
6
5.41
V
Soldering
Peak temperature during reflow
MSL 4 (Datecode 1528 and later)
245
°C
Peak time above 217°C
60
90
s
Peak heating rate during reflow
1.5
3
°C/s
Peak cooling rate post reflow
1.5
6
°C/s
500
VDC
Safety
Working voltage (IN – OUT)
VIN_OUT
Isolation voltage (hipot)
VHIPOT
Isolation capacitance
CIN_OUT
Unpowered unit
500
Isolation resistance
RIN_OUT
At 500VDC
10
MTBF
4242
VDC
660
MIL-HDBK-217Plus Parts Count - 25°C
Ground Benign, Stationary, Indoors /
Computer Profile
3.15
MHrs
Telcordia Issue 2 - Method I Case III;
25°C Ground Benign, Controlled
6.64
MHrs
cURus
CE Marked for Low Voltage Directive and ROHS recast directive, as applicable.
BCM® Bus Converter
Page 12 of 21
pF
MΩ
cTUVus
Agency approvals / standards
800
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BCM352x110y300B00
­Using the Control Signals PC, TM
Primary Control (PC) pin can be used to accomplish the
following functions:
n Logic enable and disable for module: Once TON1 time has
been satisfied, a PC voltage greater than VPC_EN will cause
the module to start. Bringing PC lower than VPC_DIS will
cause the module to enter standby.
n Auxiliary voltage source: Once enabled in regular
operational conditions (no fault), each BCM module
PC provides a regulated 5V, 3.5mA voltage source.
n Synchronized start up: In an array of parallel modules, PC pins should be connected to synchronize start up across
units. This permits the maximum load and capacitance
to scale by the number of paralleled modules.
n Output disable: PC pin can be actively pulled down in order
to disable the module. Pull down impedance shall be lower
than 60Ω.
n Fault detection flag: The PC 5V voltage source is internally
turned off as soon as a fault is detected.
n Note that PC can not sink significant current during a fault condition. The PC pin of a faulted module will not cause interconnected PC pins of other modules to be disabled.
Temperature Monitor (TM) pin provides a voltage proportional
to the absolute temperature of the converter control IC.
It can be used to accomplish the following functions:
n Monitor the control IC temperature: The temperature in
Kelvin is equal to the voltage on the TM pin scaled
by 100. (i.e. 3.0V = 300K = 27ºC). If a heat sink is applied,
TM can be used to protect the system thermally.
n Fault detection flag: The TM voltage source is internally
turned off as soon as a fault is detected. For system
monitoring purposes microcontroller interface faults are
detected on falling edges of TM signal.
BCM® Bus Converter
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Sine Amplitude Converter™ Point of Load Conversion
108nH
+
VinIN
V
Rout
7.7mΩ
ROUT
out
IIOUT
Lin = 5.7nH
RRcCin
IN
9.2mΩ
CIN
C
IN
0.0625µF
IIQQ
20.0mA
+
+
–
–
K
+
RRC
cout
OUT
480mΩ
V•I
1/32 • Iout
Lout = 500pH
570µΩ
1/32 • Vin
CCOUT
out
VVOUT
out
31.0µF
–
–
Figure 17 — VI Chip® module AC model
The Sine Amplitude Converter (SAC™) uses a high frequency
resonant tank to move energy from input to output. The resonant
LC tank, operated at high frequency, is amplitude modulated as
a function of input voltage and output current. A small amount
of capacitance embedded in the input and output stages of the
module is sufficient for full functionality and is key to achieving
power density.
The BCM352x110y300B00 SAC can be simplified into the
preceeding model.
ROUT represents the impedance of the SAC, and is a function of the
RDSON of the input and output MOSFETs and the winding resistance
of the power transformer. IQ represents the quiescent current of
the SAC control, gate drive circuitry, and core losses.
The use of DC voltage transformation provides additional
interesting attributes. Assuming that ROUT = 0Ω and IQ = 0A, Eq. (3)
now becomes Eq. (1) and is essentially load independent, resistor R
is now placed in series with VIN.
At no load:
R
VOUT = VIN • K
(1)
VVin
in
+
–
SAC™
SAC
K=
= 1/32
1/32
K
Vout
V
out
K represents the “turns ratio” of the SAC.
Rearranging Eq (1):
VOUT
(2)
K=
VIN
Figure 18 — K = 1/32 Sine Amplitude Converter
with series input resistor
The relationship between VIN and VOUT becomes:
In the presence of load, VOUT is represented by:
VOUT = VIN • K – IOUT • ROUT
(3)
(5)
Substituting the simplified version of Eq. (4)
(IQ is assumed = 0A) into Eq. (5) yields:
and IOUT is represented by:
IIN – IQ
IOUT =
K
BCM® Bus Converter
Page 14 of 21
VOUT = (VIN – IIN • R) • K
(4)
Rev 1.2
08/2016
VOUT = VIN • K – IOUT • R • K2
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This is similar in form to Eq. (3), where ROUT is used to represent
the characteristic impedance of the SAC™. However, in this case a
real R on the input side of the SAC is effectively scaled by K 2 with
respect to the output.
Assuming that R = 1Ω, the effective R as seen from the secondary
side is 1.0mΩ, with K = 1/32.
A similar exercise should be performed with the additon of a
capacitor or shunt impedance at the input to the SAC. A switch in
series with VIN is added to the circuit. This is depicted in Figure 19.
S
VVin
in
+
–
C
SAC™
SAC
K = 1/32
K = 1/32
VVout
out
Low impedance is a key requirement for powering a highcurrent, low-voltage load efficiently. A switching regulation stage
should have minimal impedance while simultaneously providing
appropriate filtering for any switched current. The use of a SAC
between the regulation stage and the point of load provides a
dual benefit of scaling down series impedance leading back to
the source and scaling up shunt capacitance or energy storage
as a function of its K factor squared. However, the benefits are
not useful if the series impedance of the SAC is too high. The
impedance of the SAC must be low, i.e. well beyond the crossover
frequency of the system.
A solution for keeping the impedance of the SAC low involves
switching at a high frequency. This enables small magnetic
components because magnetizing currents remain low. Small
magnetics mean small path lengths for turns. Use of low loss core
material at high frequencies also reduces core losses.
The two main terms of power loss in the BCM module are:
n No load power dissipation (PNL): defined as the power
used to power up the module with an enabled powertrain
at no load.
Figure 19 — Sine Amplitude Converter™ with input capacitor
A change in VIN with the switch closed would result in a change in
capacitor current according to the following equation:
n Resistive loss (PR
): refers to the power loss across OUT
the BCM module modeled as pure resistive impedance.
PDISSIPATED = PNL + PROUT
(10)
Therefore,
IC(t) = C
dVIN
(7)
dt
Assume that with the capacitor charged to VIN, the switch is
opened and the capacitor is discharged through the idealized SAC.
In this case,
IC = IOUT • K
(8)
substituting Eq. (1) and (8) into Eq. (7) reveals:
POUT = PIN – PDISSIPATED = PIN – PNL – PROUT
The above relations can be combined to calculate the overall
module efficiency:
POUT
PIN – PNL – PROUT
h =
=
P P
IN
IN
= VIN • IIN – PNL – (IOUT)2 • ROUT
VIN • IIN
IOUT = C • dVOUT
K2 dt
(9)
=
1
–
(PNL + (IOUT)2 • ROUT)
VIN • IIN
The equation in terms of the output has yielded a K 2 scaling
factor for C, specified in the denominator of the equation.
A K factor less than unity results in an effectively larger
capacitance on the output when expressed in terms of the
input. With a K = 1/32 as shown in Figure 19, C = 1µF would
appear as C = 1024µF when viewed from the output.
BCM® Bus Converter
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Input and Output Filter Design
A major advantage of SAC™ systems versus conventional PWM
converters is that the transformers do not require large
functional filters. The resonant LC tank, operated at extreme high
frequency, is amplitude modulated as a function of input voltage
and output current and efficiently transfers charge through the
isolation transformer. A small amount of capacitance embedded
in the input and output stages of the module is sufficient for full
functionality and is key to achieve power density.
This paradigm shift requires system design to carefully evaluate
external filters in order to:
1. Guarantee low source impedance:
Within this frequency range, capacitance at the input appears as
effective capacitance on the output per the relationship
defined in Eq. 13.
COUT = CIN
K2
This enables a reduction in the size and number of capacitors used
in a typical system.
Thermal Considerations
To take full advantage of the BCM module’s dynamic
response, the impedance presented to its input terminals
must be low from DC to approximately 5MHz. The
connection of the bus converter module to its power
source should be implemented with minimal distribution
inductance. If the interconnect inductance exceeds
100nH, the input should be bypassed with a RC damper
to retain low source impedance and stable operation. With an interconnect inductance of 200nH, the RC damper
may be as high as 1µF in series with 0.3Ω. A single
electrolytic or equivalent low-Q capacitor may be used in
place of the series RC bypass.
2. Further reduce input and/or output voltage ripple without sacrificing dynamic response:
Given the wide bandwidth of the module, the source
response is generally the limiting factor in the overall
system response. Anomalies in the response of the source
will appear at the output of the module multiplied by its
K factor. This is illustrated in Figures 15 and 16.
VI Chip® products are multi-chip modules whose temperature
distribution varies greatly for each part number as well as with the
input / output conditions, thermal management and environmental
conditions. Maintaining the top of the BCM352x110y300B00 case
to less than 100ºC will keep all junctions within the VI Chip module
below 125ºC for most applications.
The percent of total heat dissipated through the top surface
versus through the J-lead is entirely dependent on the particular
mechanical and thermal environment. The heat dissipated through
the top surface is typically 60%. The heat dissipated through the
J-lead onto the PCB surface is typically 40%. Use 100% top surface
dissipation when designing for a conservative cooling solution.
It is not recommended to use a VI Chip module for an extended
period of time at full load without proper heat sinking.
3. Protect the module from overvoltage transients imposed
by the system that would exceed maximum ratings and
cause failures:
The module input/output voltage ranges shall not be
exceeded. An internal overvoltage lockout function
prevents operation outside of the normal operating input
range. Even during this condition, the powertrain is
exposed to the applied voltage and power MOSFETs must
withstand it. A criterion for protection is the maximum
amount of energy that the input or output switches can
tolerate if avalanched.
Total load capacitance at the output of the BCM module shall not
exceed the specified maximum. Owing to the wide bandwidth
and low output impedance of the module, low-frequency bypass
capacitance and significant energy storage may be more densely
and efficiently provided by adding capacitance at the input of
the module. At frequencies <500kHz the module appears as an
impedance of ROUT between the source and load.
BCM® Bus Converter
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Current Sharing
Fuse Selection
The performance of the SAC™ topology is based on efficient
transfer of energy through a transformer without the need of
closed loop control. For this reason, the transfer characteristic
can be approximated by an ideal transformer with a positive
temperature coefficient series resistance.
In order to provide flexibility in configuring power systems
VI Chip® modules are not internally fused. Input line fusing
of VI Chip products is recommended at system level to provide
thermal protection in case of catastrophic failure.
This type of characteristic is close to the impedance characteristic
of a DC power distribution system both in dynamic (AC) behavior
and for steady state (DC) operation.
When multiple BCM modules of a given part number are
connected in an array they will inherently share the load current
according to the equivalent impedance divider that the system
implements from the power source to the point of load.
Some general recommendations to achieve matched array
impedances include:
n Dedicate common copper planes within the PCB
The fuse shall be selected by closely matching system
requirements with the following characteristics:
n Current rating (usually greater than maximum current
of BCM module)
n Maximum voltage rating (usually greater than the maximum
possible input voltage)
n Ambient temperature
n Nominal melting I2t
n Recommend fuse: ≤ 2.5A Bussmann PC–Tron Fuse or ≤ 3.15A
SOC type 36CFA Fuse.
to deliver and return the current to the modules.
n Provide as symmetric a PCB layout as possible among modules
Reverse Operation
n Apply same input / output filters (if present) to each unit.
BCM modules are capable of reverse power operation. Once the
unit is started, energy will be transferred from secondary back to
the primary whenever the secondary voltage exceeds VIN • K. The
module will continue operation in this fashion for as long as no
faults occur.
For further details see AN:016 Using BCM Bus Converters
in High Power Arrays.
VIN
ZIN_EQ1
BCM®1
ZOUT_EQ1
R0_1
ZIN_EQ2
BCM®2
The BCM352x110y300B00 has not been qualified for continuous
operation in a reverse power condition. Furthermore fault
protections which help protect the module in forward operation
will not fully protect the module in reverse operation.
VOUT
ZOUT_EQ2
R0_2
+ DC
Load
ZIN_EQn
BCM®n
Transient operation in reverse is expected in cases where there is
significant energy storage on the output and transient voltages
appear on the input. Transient reverse power operation of less than
10ms, 10% duty cycle is permitted and has been qualified to cover
these cases.
ZOUT_EQn
R0_n
Figure 20 — BCM module array
BCM® Bus Converter
Page 17 of 21
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J-Lead Package Mechanical Drawing
mm
(inch)
NOTES:
mm
1. DIMENSIONS ARE inch .
2. UNLESS OTHERWISE SPECIFIED, TOLERANCES ARE:
.X / [.XX] = +/-0.25 / [.01]; .XX / [.XXX] = +/-0.13 / [.005]
3. NOTES:
PRODUCT MARKING ON
mmTOP SURFACE
1. DIMENSIONS ARE inch .
DXF
and PDF files
are available
on vicorpower.com
2. UNLESS
OTHERWISE
SPECIFIED,
TOLERANCES ARE:
.X / [.XX] = +/-0.25 / [.01]; .XX / [.XXX] = +/-0.13 / [.005]
3. PRODUCT MARKING ON TOP SURFACE
DXF and PDF files are available on vicorpower.com
J-Lead Package Recommended Land Pattern
NOTES:
mm
1. DIMENSIONS ARE inch .
2. UNLESS OTHERWISE SPECIFIED, TOLERANCES ARE:
.X / [.XX] = +/-0.25 / [.01]; .XX / [.XXX] = +/-0.13 / [.005]
3. NOTES:
PRODUCT MARKING ON
mmTOP SURFACE
1. DIMENSIONS ARE inch .
DXF
and PDF files
are available
on vicorpower.com
2. UNLESS
OTHERWISE
SPECIFIED,
TOLERANCES ARE:
.X / [.XX] = +/-0.25 / [.01]; .XX / [.XXX] = +/-0.13 / [.005]
3. PRODUCT MARKING ON TOP SURFACE
DXF and PDF files are available on vicorpower.com
BCM® Bus Converter
Page 18 of 21
Rev 1.2
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Through Hole Package Mechanical Drawing
mm
(inch)
TOP VIEW ( COMPONENT SIDE )
TOP VIEW ( COMPONENT SIDE )
NOTES:
NOTES:1. DIMENSIONS ARE (mm).
inch
(mm)
2. UNLESS
OTHERWISE
SPECIFIED TOLERANCES ARE:
1. DIMENSIONS
ARE
inch .
X.X [X.XX] = ±0.25 [0.01]; X.XX [X.XXX] = ±0.13 [0.005]
2. UNLESS OTHERWISE SPECIFIED TOLERANCES ARE:
3. RoHS
COMPLIANT
PER[X.XXX]
CST-0001
LATEST
REVISION
X.X [X.XX]
= ±0.25
[0.01]; X.XX
= ±0.13
[0.005]
3. RoHSDXF
COMPLIANT
PERare
CST-0001
REVISION
and PDF files
availableLATEST
on vicorpower.com
DXF and PDF files are available on vicorpower.com
Through Hole Package Recommended Land Pattern
NOTES:
NOTES:1. DIMENSIONS ARE (mm).
inch
(mm)
2. UNLESS
OTHERWISE
SPECIFIED TOLERANCES ARE:
1. DIMENSIONS
ARE
inch .
X.X [X.XX] = ±0.25 [0.01]; X.XX [X.XXX] = ±0.13 [0.005]
2. UNLESS OTHERWISE SPECIFIED TOLERANCES ARE:
3. RoHS
COMPLIANT
PER[X.XXX]
CST-0001
LATEST
REVISION
X.X [X.XX]
= ±0.25
[0.01]; X.XX
= ±0.13
[0.005]
RECOMMENDED HOLE PATTERN
( COMPONENT
SHOWN )
RECOMMENDED
HOLESIDE
PATTERN
( COMPONENT SIDE SHOWN )
3. RoHSDXF
COMPLIANT
PERare
CST-0001
REVISION
and PDF files
availableLATEST
on vicorpower.com
DXF and PDF files are available on vicorpower.com
BCM® Bus Converter
Page 19 of 21
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BOTTOM VIEW
BOTTOM VIEW
BCM352x110y300B00
Recommended Heat Sink Push Pin Location
(NO GROUNDING CLIPS)
(WITH GROUNDING CLIPS)
Notes:
1. Maintain 3.50 (0.138) Dia. keep-out zone
free of copper, all PCB layers.
2. (A) Minimum recommended pitch is 39.50 (1.555).
This provides 7.00 (0.275) component
edge-to-edge spacing, and 0.50 (0.020)
clearance between Vicor heat sinks.
(B) Minimum recommended pitch is 41.00 (1.614).
This provides 8.50 (0.334) component
edge-to-edge spacing, and 2.00 (0.079)
clearance between Vicor heat sinks.
BCM® Bus Converter
Page 20 of 21
3. VI Chip® module land pattern shown for reference
only; actual land pattern may differ.
Dimensions from edges of land pattern
to push–pin holes will be the same for
all full-size VI Chip® products.
5. Unless otherwise specified:
Dimensions are mm (inches)
tolerances are:
x.x (x.xx) = ±0.3 (0.01)
x.xx (x.xxx) = ±0.13 (0.005)
4. RoHS compliant per CST–0001 latest revision.
6. Plated through holes for grounding clips (33855)
shown for reference, heat sink orientation and
device pitch will dictate final grounding solution.
Rev 1.2
08/2016
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representations or warranties with respect to the accuracy or completeness of the contents of this publication. Vicor reserves the right to make
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BCM® Bus Converter
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