1 of 3 Creation Date : May 29, 2017 (GMT) Multilayer Ceramic Chip Capacitors C3216X7S1A156M160AC TDK item description C3216X7S1A156MT**** Applications Commercial Grade Feature General General (Up to 50V) Series C3216 [EIA 1206] Status Production Size Length(L) 3.20mm ±0.20mm Width(W) 1.60mm ±0.20mm Thickness(T) 1.60mm ±0.20mm Terminal Width(B) 0.20mm Min. Terminal Spacing(G) 1.00mm Min. 2.10mm to 2.50mm(Flow Soldering) Recommended Land Pattern (PA) 2.00mm to 2.40mm(Reflow Soldering) 1.10mm to 1.30mm(Flow Soldering) Recommended Land Pattern (PB) 1.00mm to 1.20mm(Reflow Soldering) 1.00mm to 1.30mm(Flow Soldering) Recommended Land Pattern (PC) 1.10mm to 1.60mm(Reflow Soldering) Electrical Characteristics Capacitance 15μF ±20% Rated Voltage 10VDC Temperature Characteristic X7S(±22%) Dissipation Factor (Max.) 10% Insulation Resistance (Min.) 6MΩ Other Soldering Method Wave (Flow) Reflow AEC-Q200 No Packing Blister (Plastic)Taping [180mm Reel] Package Quantity 2000pcs ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. 2 of 3 Creation Date : May 29, 2017 (GMT) Multilayer Ceramic Chip Capacitors C3216X7S1A156M160AC Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.) Impedance C3216X7S1A156M160AC ESR C3216X7S1A156M160AC Capacitance C3216X7S1A156M160AC Temperature Characteristic C3216X7S1A156M160AC(No Bias) ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. DC Bias Characteristic C3216X7S1A156M160AC Ripple Temperature Rising C3216X7S1A156M160AC(100kHz) C3216X7S1A156M160AC(500kHz) C3216X7S1A156M160AC(1MHz) Multilayer Ceramic Chip Capacitors C3216X7S1A156M160AC Associated Images Land Pattern (Terminal Connection) ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. 3 of 3 Creation Date : May 29, 2017 (GMT)