Ordering number : ENA2017B LV5694P Bi-CMOS IC System Power Supply IC for Automotive Infotainment Multiple Output Linear Voltage Regulator http://onsemi.com Overview The LV5694P is a multiple output linear regulator IC, which allows reduction of quiescent current. The LV5694P is specifically designed to address automotive infotainment systems power supply requirements. The LV5694P integrates 5 linear regulator outputs, 2 high side power switches, over current protection, overvoltage protection and thermal shutdown circuitry. Function • Low consumption current: 50µA (typ, only VDD output is in operation) • 5 systems of regulator output VDD for microcontroller: output voltage: 5.0V/3.3V (always ON), maximum output current: 300mA For SWD5V: output voltage: 5V, maximum output current: 500mA HZIP15J For CD: output voltage: 7.6V/8.1V, maximum output current: 2000mA For illumination: output voltage: 9.0V, maximum output current: 500mA For audio: output voltage: 8.45V, maximum output current: 800mA • 2 lines of high side switch with interlock VCC AMP: Maximum output current: 500mA, voltage difference between input and output: 0.5V ANT: Maximum output current: 350mA, voltage difference between input and output: 0.5V • Overcurrent protector • Overvoltage protector: Typ 36V (All outputs are turned off) • Overheat protector: Typ 175°C • PchLDMOS is used in power output block (Warning) The protector functions only improve the IC’s tolerance and they do not guarantee the safety of the IC if used under the conditions out of safety range or ratings. Use of the IC such as use under over current protection range or thermal shutdown state may degrade the IC’s reliability and eventually damage the IC. ORDERING INFORMATION See detailed ordering and shipping information on page 14 of this data sheet. Semiconductor Components Industries, LLC, 2014 March, 2014 32014NK/71112SY/30712SY 20120203-S00001 No.A2017-1/14 LV5694P Specifications Absolute Maximum Ratings at Ta = 25°C Parameter Symbol Power supply voltage VCC max Power dissipation Pd max Conditions Ratings Unit Ta ≤ 25°C IC unit At using Al heat sink At infinity heat sink Peak voltage VCC peak Junction temperature Tj max Operating temperature Storage temperature 36 V 1.5 W 5.6 W 32.5 W Regarding Bias wave, refer to below the pulse. 50 V 150 °C Topr -40 to +85 °C Tstg -55 to +150 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. Recommended Operating Conditions at Ta = 25°C Parameter Conditions Power supply voltage rating 1 VDD output, SWD output Power supply voltage rating 2 ILM output Power supply voltage rating 3 Power supply voltage rating 4 Ratings Unit 7 to 16 V 10.8 to 16 V Audio output, CD output 10 to 16 V ANT output, AMP output 7.5 to 16 V * VCC1 should be as follows: VCC1>VCC-0.7V Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. Electrical Characteristics at Ta = 25°C, VCC = VCC1=14.4V (*2) Parameter Symbol VCC1 input voltage VCC1 Current drain ICC Conditions Ratings min typ Unit max VCC-0.7V 16 V 50 100 μA - - 0.3 V VDD no load, CTRL1/2/3 = ⎡L/L/L⎦ CTRL1/2/3 Input Low input voltage VIL1 Middle1 input voltage VIM1 0.9 1.18 1.45 V Middle2 input voltage VIM2 1.85 2.10 2.4 V High input voltage VIH1 2.95 3.29 5.5 V Input impedance RIH1 280 400 520 kΩ Input voltage ≤ 3.3V IKCD/IKVDD Input Low input voltage VIL2 High input voltage VIH2 IKCD IKVDD VCC-0.7V VCC1-0.7V - 0.7 V - - V V VDD output (5V/3.3V) Output voltage VO11 IO1 = 200mA, IKVDD=VCC1 4.75 5.0 5.25 VO12 IO1 = 200mA, IKVDD=GND 3.16 3.3 3.45 Output current IO1 VO11 ≥ 4.70V, VO12 ≥ 3.10V 300 Line regulation ΔVOLN1 7.5V < VCC1 < 16V, IO1 = 200mA Load regulation ΔVOLD1 Dropout voltage 1 VDROP1 Dropout voltage 2 VDROP1’ IO1 = 100mA (VDD output 5V) Ripple rejection RREJ1 f = 120Hz, IO1 = 200mA 30 40 Short circuit current IS1 VO11, VO12 = 0 50 150 V mA 30 70 mV 1mA < IO1 < 200mA 70 150 mV IO1 = 200mA (VDD output 5V) 0.8 1.6 V 0.4 0.8 V 340 mA dB Continued on next page. No.A2017-2/14 LV5694P Continued from preceding page. Parameter Symbol Conditions Ratings min typ Unit max AUDIO (8.45V) Output ; CTRL2 = ⎡M1 or H⎦ Output voltage VO3 IO3 = 650mA 8.16 8.45 8.7 V Output current IO3 VO3 ≥ 8.0V 800 Line regulation ΔVOLN3 10V < VCC < 16V, IO3 = 650mA 30 90 mV Load regulation ΔVOLD3 1mA < IO3 < 650mA 100 200 mV Dropout voltage 1 Dropout voltage 2 VDROP3 IO3 = 650mA 0.7 1.2 V VDROP3’ IO3 = 200mA 0.2 0.35 Ripple rejection RREJ3 f = 120Hz, IO3 = 650mA Short circuit current IS3 VO3 = 0 mA 40 50 120 250 550 9.0 9.3 V dB mA ILM (9V) Output ; CTRL1 = ⎡M1 or H⎦ Output voltage VO4 IO4 = 350mA 8.7 Output current IO4 VO4 ≥ 8.6V 500 Line regulation ΔVOLN4 10.8V < VCC < 16V, IO4 = 350mA 40 100 mV Load regulation ΔVOLD4 1mA < IO4 < 350mA 70 150 mV Dropout voltage 1 VDROP4 IO4 = 350mA 1.0 1.5 V 0.3 0.6 Dropout voltage 2 VDROP4’ IO4 = 200mA Ripple rejection RREJ4 f = 120Hz, IO4 = 350mA Short circuit current IS4 VO4 = 0 Output voltage VO5 IO5 = 500mA Output current IO5 VO5 ≥ VCC-1.0V 500 Short circuit current IS5 VO5 = 0 120 Output voltage VO6 IO6 = 500mA Output current IO6 VO6 ≥ VCC-1.0V 350 Short circuit current IS6 VO6 = 0 Output voltage VO7 Output current Line regulation Load regulation V mA 40 50 100 200 400 VCC-0.5 VCC-1.0 V dB mA AMP_HS-SW; CTRL3 = ⎡M2 or H⎦ V mA 250 500 mA VCC-0.5 VCC-1.0 100 200 450 mA IO7 = 350mA 4.75 5.0 5.25 V IO7 VO7 ≥ 4.7V 500 ΔVOLN7 10V < VCC < 16V, IO7 = 350mA 30 70 mV ΔVOLD7 1mA < IO7 < 350mA 70 150 mV 0.8 1.6 ANT_HS-SW; CTRL3 = ⎡M1 or H⎦ V mA SWD5V; CTRL2 = ⎡M2 or H⎦ Dropout voltage VDROP7 IO7 = 350mA Ripple rejection RREJ7 f = 120Hz, IO7 = 350mA Short circuit current IS7 VO7 = 0 mA 40 50 100 200 V dB 450 mA CD(7.6/8.1V output); CTRL1 = ⎡M2 or H⎦ Output voltage VO81 IO8 = 1300mA, IKCD=GND 7.2 7.6 8.0 V VO82 IO8 = 1300mA, IKCD=VCC 7.7 8.1 8.5 V Output current IO8 VO81 ≥ 7.1V, VO82 ≥ 7.5V 2000 Line regulation ΔVOLN8 10.5V < VCC < 16V, IO8 = 1300mA 40 100 mV Load regulation ΔVOLD8 10mA < IO8 < 1300mA 70 200 mV Dropout voltage 1 VDROP8 IO8 = 1300mA 1.3 1.5 V Dropout voltage 2 VDROP8’ IO8 = 350mA 0.35 0.7 Ripple rejection RREJ8 f = 120Hz, IO8 = 1300mA Short circuit current IS8 VO81 = 0, VO82 = 0 mA 40 50 300 550 V dB 1000 mA Over voltage detection Over voltage detection voltage VOVP VCC, All output stop 34 36 38 V *2: The entire specification has been defined based on the tests performed under the conditions where Tj and Ta (=25°C) are almost equal. There tests were performed with pulse load to minimize the increase of junction temperature (Tj). Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. No.A2017-3/14 LV5694P Package Dimensions unit : mm HZIP15J CASE 945AC ISSUE A GENERIC MARKING DIAGRAM* XXXXXXXXXX YMDDD SOLDERING FOOTPRINT* Through Hole Area (Unit: mm) Package name HZIP15J 2.54 1.2 2.54 (1.91) XXXXX = Specific Device Code Y = Year M = Month DDD = Additional Traceability Data 2.54 2.54 NOTE: The measurements are not to guarantee but for reference only. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. No.A2017-4/14 LV5694P • Allowable power dissipation derating curve Pd max -- Ta Allowable power dissipation, Pd max -- W 8 Aluminum heat sink mounting conditions tightening torque : 39N⋅cm, using silicone grease 7 Aluminum heat sink (50 × 50 × 1.5mm3) when using 6 5.6 5 4 3 2 Independent IC 1.5 1 0 0 20 40 60 80 100 120 140 150 160 Ambient temperature, Ta -- °C • Waveform applied during surge test 50V 90% 10% 16V 5msec 100msec No.A2017-5/14 LV5694P CTRL Pin Output Truth Table (each output is controllable by 4-value input) INAMP INANT CTRL3 AMP ANT L L L OFF OFF L H M1 OFF ON H L M2 ON OFF H H H ON ON CTRL2 SWD5V AUDIO CTRL1 Microcontroller INAMP CD ILM L OFF OFF L OFF OFF M1 OFF ON M1 OFF ON M2 ON OFF M2 ON OFF H ON ON H ON ON INANT CTRL3 (Warning) Usage of CTRL pin When CTRL pin transits between L and M2, since it passes M1, ILM/AUDIO/ANT is turned on for a moment. Likewise, when CTRL pin transits between H and M1, since it passes M2, ILM/AUDIO/ANT is turned off for a moment. To avoid operation failure by the above factors, please refer to (1) and (2) as shown below for precaution. • Do not connect parasitic capacitor to CTRL as much as possible. • If use of capacitor for CTRL is required, keep the resistance value as low as possible. (Recommendation level: 2.2kΩ / 3.9kΩ) • Make sure that the output load capacitor has enough marjin against the voltage fluctuation due to instantaneous ON/OFF. (1) The time until a reaction occurs in output after shifting from CTRL ON to OFF (typ) OFF → ON time 27°C CTRL1 → ILM 0.95μs CTRL2 → AUDIO 1.33μs CTRL3 → ANT 2.86μs Due to quality fluctuation of the ICs in manufacturing process, the above-mentioned time can be shortened by 10 to 20%. (2) The time until output starts to react after shifting from CTRL ON→OFF control (typ): All output: 200ns to 300ns No.A2017-6/14 LV5694P z Block Diagram VCC AMP out AMP-SW(VCC -0.5V) 500mA Start up Over Voltage Protection Vref ANT out ANT-SW(VCC -0.5V) 350mA + ILM output (9V) 500mA + CTRL1 CTRL2 800mA OUTPUT Control + CTRL3 SWD output (5V) 500mA Thermal + CD output (7.6/8.1V) 2000mA Shut Down GND AUDIO output (8.45V) VCC1(VDD supply input) VCC + VDD output (3.3/5V) 300mA IKVDD:VDD(3.3/5.0V)change pin IKVDD=VCC1:5.0V IKVDD=GND:3.3V IKCD:CD(7.6/8.1V)change pin IKCD=VCC:8.1V IKCD=GND:7.6V No.A2017-7/14 LV5694P Pin Function Pin No. 1 Pin name ILM Description ILM output pin ON when CTRL1 = M1, H Equivalent Circuit VCC 15 9V/0.5A 1 2 GND 3 CD 2 GND 15 VCC GND pin CD output pin ON when CTRL1 = M2, H 8.1V/2A (IKCD=VCC) 7.6V/2A (IKCD=GND) 3 2 4 CTRL1 CTRL1/2/3 input pin 6 CTRL2 Four value input 8 CTRL3 GND 15 VCC 4 6 8 2 5 AUDIO AUDIO output pin ON when CTRL2 = M1, H 15 GND VCC 8.45V/0.8A 5 7 SWD SWD output pin ON when CTRL2 = M2, H 2 GND 15 VCC 5V/0.5A 7 2 GND Continued on next page. No.A2017-8/14 LV5694P Continued from preceding page. Pin No. 9 Pin name ANT Description Equivalent Circuit ANT output pin VCC 15 ON when CTRL3 = M1, H VCC-0.5V/350mA 9 2 10 IKCD CD voltage control input pin GND VCC 15 10 2 11 AMP AMP output pin ON when CTRL2 = M2, H GND VCC 15 VCC-0.5V/500mA 11 2 12 IKVDD VDD voltage control input pin VCC1/GND GND 15 5V VCC 12 2 13 VDD VDD output pin 5.0V/0.3A (IKVDD = VCC1) GND VCC 15 3.3V/0.3A (IKVDD = GND) 13 2 14 VCC1 VDD power supply pin 15 VCC Power supply pin GND VCC 15 2 14 VCC1 GND No.A2017-9/14 LV5694P Timing Chart 36V VCC (15PIN) 36V VCC1 (14PIN) 5.8V VDD output (5V) (13PIN) H CTRL1 input (4PIN) M2 L M1 H CTRL2 input (6PIN) M2 M1 L H CTRL3 input (8PIN) M2 L M1 ILM output (1PIN) CD output (3PIN) AUDIO output (5PIN) SWD output (7PIN) ANT output (9PIN) AMP output (11PIN) *The above values are obtained when typ. No.A2017-10/14 LV5694P C4 + C3 C2 + C1 ILM CD CTRL2 C6 + C5 C8 + C7 AUDIO CTRL3 D2 VCC1 14 13 C10 + R1 C11 C12 + D4 15 D6 C16 + R2 VDD D5 D3 SWD ANT VCC 12 11 VDD 10 9 C9 + CTRL1 IKVDD IKCD CTRL3 8 7 AMP 6 5 ANT 4 3 SWD CTRL2 AUDIO 2 1 CD ILM GND CTRL1 Applied circuit example AMP C14 + C15 C13 D1 VCC Peripheral parts list Name of part Description Recommended value C2, C4, C6, C8, C12 Output stabilization capacitor 10μF or more* C1, C3, C5, C7, C11 Output stabilization capacitor 0.22μF or more* Remarks Electrolytic capacitor Ceramic capacitor C14, C16 Power supply bypass capacitor 100μF or more These capacitors must be placed near C13, C15 Oscillation prevention capacitor 0.22μF or more the VCC and GND pins. C9, C10 AMP/ANT output stabilization capacitor 2.2μF or more R1, R2 Resistance for protection D1 10 to 100kΩ Diode for prevention of backflow Meeting the specifications of the rush electric current in a true use state D2, D3, D4, D5 Diode for internal element protection SB1003M3 D6 Diode for internal element protection SB1003M3 When a minus number surge is applied * : Make sure that the capacitors of the output pins are 10μF or higher and meets the condition of ESR is 0.001 to 10Ω (ceramic capacitor alone can be used.), in which voltage/ temperature fluctuation and unit differences are taken into consideration. Moreover, RF characteristics of electrolytic capacitor should be sufficient. No.A2017-11/14 LV5694P Caution for implementing LV5694P to a system board The package of LV5694P is HZIP15J which has some metal exposures other than connection pins and heatsink as shown in the diagram below. The electrical potentials of (2) and (3) are the same as those of pin 15 and pin 1, respectively. (2) (=pin 15) is the VCC pin and (3) (=pin 1) is the ILM (regulator) output pin. When you implement the IC to the set board, make sure that the bolts and the heatsink are out of touch from (2) and (3). If the metal exposures touch the bolts which has the same electrical potential with GND, GND short occurs in ILM output and VCC. The exposures of (1) are connected to heatsink which has the same electrical potential with substrate of the IC chip (GND). Therefore, (1) and GND electrical potential of the set board can connect each other. • HZIP15J outline Heat-sink 1 Same potential 2 15PIN Same potential 1PIN 3 Same potential Heat-sink side Heat-sink 1 Same potential 1 Heat-sink Same potential :Metal exposure Heat-sink side :Metal exposure <Side view of HZIP15J> <Top view of HZIP15J> • Frame diagram (LV5694P) *In the system power supply other than LV5694P, pin assignment may differ. Metal exposure 1 Metal exposure 3 Metal exposure 2 Metal exposure 1 LV5694 Metal exposure 1 Metal exposure 1 1PIN 15PIN No.A0000-12/14 LV5694P HZIP15J Heat sink attachment Heat sinks are used to lower the semiconductor device junction temperature by leading the head generated by the device to the outer environment and dissipating that heat. a. Unless otherwise specified, for power ICs with tabs and power ICs with attached heat sinks, solder must not be applied to the heat sink or tabs. b. Heat sink attachment · Use flat-head screws to attach heat sinks. · Use also washer to protect the package. · Use tightening torques in the ranges 39-59Ncm(4-6kgcm) . · If tapping screws are used, do not use screws with a diameter larger than the holes in the semiconductor device itself. · Do not make gap, dust, or other contaminants to get between the semiconductor device and the tab or heat sink. · Take care a position of via hole . · Do not allow dirt, dust, or other contaminants to get between the semiconductor device and the tab or heat sink. · Verify that there are no press burrs or screw-hole burrs on the heat sink. · Warping in heat sinks and printed circuit boards must be no more than 0.05 mm between screw holes, for either concave or convex warping. · Twisting must be limited to under 0.05 mm. · Heat sink and semiconductor device are mounted in parallel. Take care of electric or compressed air drivers · The speed of these torque wrenches should never exceed 700 rpm, and should typically be about 400 rpm. Binding head machine screw Countersunk head mashine screw Heat sink gap Via hole c. Silicone grease · Spread the silicone grease evenly when mounting heat sinks. · Our company recommends YG-6260 (Momentive Performance Materials Japan LLC) d. Mount · First mount the heat sink on the semiconductor device, and then mount that assembly on the printed circuit board. · When attaching a heat sink after mounting a semiconductor device into the printed circuit board, when tightening up a heat sink with the screw, the mechanical stress which is impossible to the semiconductor device and the pin doesn't hang. e. When mounting the semiconductor device to the heat sink using jigs, etc., · Take care not to allow the device to ride onto the jig or positioning dowel. · Design the jig so that no unreasonable mechanical stress is not applied to the semiconductor device. f. Heat sink screw holes · Be sure that chamfering and shear drop of heat sinks must not be larger than the diameter of screw head used. · When using nuts, do not make the heat sink hole diameters larger than the diameter of the head of the screws used. A hole diameter about 15% larger than the diameter of the screw is desirable. · When tap screws are used, be sure that the diameter of the holes in the heat sink are not too small. A diameter about 15% smaller than the diameter of the screw is desirable. g. There is a method to mount the semiconductor device to the heat sink by using a spring band. But this method is not recommended because of possible displacement due to fluctuation of the spring force with time or vibration. No.A0000-13/14 LV5694P ORDERING INFORMATION Device LV5694P-E Package HZIP15J (Pb-Free) Shipping (Qty / Packing) 20 / Fan-Fold ON Semiconductor and the ON logo are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PS No.A2017-14/14