Diodes DMN1019USN-13 12v n-channel enhancement mode mosfet Datasheet

DMN1019USN
12V N-CHANNEL ENHANCEMENT MODE MOSFET
Features
V(BR)DSS
RDS(ON) MAX
12V
10mΩ @ VGS = 4.5V
12mΩ @ VGS = 2.5V
14mΩ @ VGS = 1.8V
18mΩ @ VGS = 1.5V
41mΩ @ VGS = 1.2V
•
ID
TA = +25°C
9.3A
8.5A
7.9A
6.9A
4.6A
This new generation MOSFET has been designed to minimize the onstate resistance (RDS(ON)) and yet maintain superior switching
performance, making it ideal for high efficiency power management
applications.
Applications
Load Switch
•
DC-DC Converters
•
Power Management Functions
ESD Protected Gate
•
Totally Lead-Free & Fully RoHS compliant (Notes 1 & 2)
•
Halogen and Antimony Free. “Green” Device (Note 3)
•
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
Description
•
Low On-Resistance
•
•
Case: SC59
•
Case Material – Molded Plastic. UL Flammability Rating 94V-0
•
Moisture Sensitivity: Level 1 per J-STD-020
•
Terminals: Finish - Matte Tin Solderable per MIL-STD-202,
•
Method 208 e3
Terminal Connections: See Diagram
•
Weight: 0.014 grams (approximate)
SC59
D
D
G
Gate Protection
Diode
S
G
ESD PROTECTED
Top View
Pin Configuration
Top View
S
Equivalent Circuit
Ordering Information (Note 4)
Part Number
DMN1019USN-7
DMN1019USN-13
Notes:
Case
SC59
SC59
Packaging
3,000/Tape & Reel
10,000/Tape & Reel
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
N7
Date Code Key
Year
Code
Month
Code
2013
A
Jan
1
2014
B
Feb
2
DMN1019USN
Document number: DS36999 Rev. 2 - 2
Mar
3
N7 = Product Type Marking Code
YM = Date Code Marking
Y = Year ex: A = 2013
M = Month ex: 9 = September
YM
NEW PRODUCT
Product Summary
2015
C
Apr
4
2016
D
May
5
Jun
6
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2017
E
Jul
7
2018
F
Aug
8
Sep
9
2019
G
Oct
O
2020
H
Nov
N
Dec
D
May 2014
© Diodes Incorporated
DMN1019USN
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
VDSS
VGSS
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (Note 6) VGS = 4.5V
TA = +25°C
TA = +70°C
TA = +25°C
TA = +70°C
Steady
State
t<10s
ID
Units
V
V
A
11
8.8
70
2
ID
Pulsed Drain Current (10µs pulse, duty cycle = 1%)
Maximum Body Diode Forward Current (Note 6)
NEW PRODUCT
Value
12
±8
9.3
7.4
IDM
IS
A
A
A
Thermal Characteristics
Characteristic
Symbol
TA = +25°C
TA = +70°C
Steady state
t<10s
TA = +25°C
TA = +70°C
Steady state
t<10s
Total Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient (Note 5)
Total Power Dissipation (Note 6)
Thermal Resistance, Junction to Ambient (Note 6)
PD
RθJA
PD
RθJA
Thermal Resistance, Junction to Case (Note 6)
Operating and Storage Temperature Range
RθJC
TJ, TSTG
Value
0.68
0.4
160
115
1.2
0.83
96
68
18
-55 to +150
Units
W
°C/W
°C/W
W
°C/W
°C/W
°C/W
°C
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Body Leakage
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
Symbol
Min
Typ
Max
Unit
BVDSS
IDSS
IGSS
12
—
—
—
—
—
—
1
±2
V
µA
µA
VGS = 0V, ID = 250µA
VDS =12V, VGS = 0V
VGS = ±8V, VDS = 0V
VGS(th)
RDS(ON)
0.53
7
8
10
14
28
28
0.8
0.8
10
12
14
18
41
—
1.2
V
Static Drain-Source On-Resistance
0.35
—
—
—
—
—
—
—
VDS = VGS, ID = 250µA
VGS = 4.5V, ID = 9.7A
VGS = 2.5V, ID = 9A
VGS = 1.8V, ID = 8.1A
VGS = 1.5V, ID = 4.5A
VGS = 1.2V, ID = 2.4A
VDS = 4V, ID = 9.7A
VGS = 0V, IS = 10A
—
—
—
—
—
—
—
—
—
—
—
—
2426
396
375
1.1
50.6
27.3
3.4
5.2
7.6
22.2
57.6
16.8
—
—
—
—
—
—
—
—
—
—
—
—
Forward Transfer Admittance
Diode Forward Voltage
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
Total Gate Charge (VGS = 8V)
Total Gate Charge (VGS = 4.5V)
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-Off Delay Time
Turn-On Rise Time
Turn-Off Fall Time
Notes:
IYfsI
VSD
Ciss
Coss
Crss
Rg
Qg
Qg
Qgs
Qgd
tD(ON)
tD(OFF)
tr
tf
mΩ
S
V
Test Condition
pF
pF
pF
Ω
VDS = 0V, VGS = 0V, f = 1MHz
nC
VDS = 4V, ID = 10A
ns
ns
ns
ns
VDD = 4V, VGEN = 5V, ID = 10A,
RG = 1Ω, RL = 0.4Ω
VDS = 10V, VGS = 0V,
f = 1MHz
5. Device mounted on FR-4 PCB with minimum recommended pad layout, single sided. The power dissipation PD is based on t<10s RθJA.
6. Device mounted on 1” x 1” FR-4 PCB with high coverage 2 oz. Copper, single sided. The power dissipation PD is based on t<10s RθJA.
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to production testing.
DMN1019USN
Document number: DS36999 Rev. 2 - 2
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May 2014
© Diodes Incorporated
DMN1019USN
20.0
20
VGS = 8.0V
VDS = 5.0V
18
VGS = 3.0V
16
VGS =1.2V
ID, DRAIN CURRENT (A)
ID, DRAIN CURRENT (A)
VGS = 2.0V
VGS = 1.5V
12.0
8.0
4.0
14
12
10
8
T A = 150°C
6
T A = 125°C
0
1
2
3
4
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 1 Typical Output Characteristics
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
0.016
0.015
0.014
VGS = 1.5V
0.013
0.012
0.011
0.01
VGS = 2.5V
0.009
VGS = 4.5V
0.008
0.007
0.006
2
4
6
8
10 12 14 16 18
ID, DRAIN-SOURCE CURRENT (A)
Figure 3 Typical On-Resistance vs.
Drain Current and Gate Voltage
TA = -55°C
0
0.2
5
0.4
0.6
0.8
1
1.2
1.4
VGS, GATE-SOURCE VOLTAGE (V)
Figure 2 Typical Transfer Characteristics
1.6
0.03
ID = 9.7A
0.025
ID = 8.1A
0.02
ID = 4.5A
0.015
0.01
0.005
20
0
0
1
2
3
4
5
6
7
VGS, GATE-SOURCE VOLTAGE (V)
Figure 4 Typical Transfer Characteristics
8
1.6
0.015
VGS = 4.5V
0.014
VGS = 2.5V
ID = 9A
RDS(ON), DRAIN-SOURCE
ON-RESISTANCE (NORMALIZED)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
0.0
TA = 85°C
TA = 25°C
4
VGS = 1.0V
2
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
NEW PRODUCT
16.0
TA = 150°C
0.013
T A = 125°C
0.012
T A = 85°C
0.011
0.01
TA = 25°C
0.009
0.008
T A = -55°C
0.007
1.4
VGS = 4.5V
ID = 9.7A
1.2
VGS = 1.5V
ID = 4.5A
1
0.8
0.006
0.005
0
2
4
6
8 10 12 14 16 18
ID, DRAIN CURRENT (A)
Figure 5 Typical On-Resistance vs.
Drain Current and Temperature
DMN1019USN
Document number: DS36999 Rev. 2 - 2
20
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0.6
-50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
Figure 6 On-Resistance Variation with Temperature
May 2014
© Diodes Incorporated
VGS = 1.5V
ID = 4.5A
0.018
VGS(th), GATE THRESHOLD VOLTAGE (V)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
0.8
0.02
0.016
0.014
VGS = 2.5V
ID = 9A
0.012
0.01
VGS = 4.5V
ID = 9.7A
0.008
0.006
0.6
0.4
ID = 1mA
ID = 250µA
0.2
0.004
-50
0
-50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
Figure 7 On-Resistance Variation with Temperature
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
Figure 8 Gate Threshold Variation vs. Ambient Temperature
10000
20
18
CT, JUNCTION CAPACITANCE (pF)
f = 1MHz
IS, SOURCE CURRENT (A)
16
14
12
TA = 150°C
10
TA = 125°C
8
TA = 25°C
6
TA = 85°C
4
T A = -55°C
C iss
1000
Crss
Coss
2
0
0
100
0.2
0.4
0.6
0.8
1
1.2
VSD, SOURCE-DRAIN VOLTAGE (V)
Figure 9 Diode Forward Voltage vs. Current
8
100
6
10
ID, DRAIN CURRENT (A)
VGS GATE THRESHOLD VOLTAGE (V)
NEW PRODUCT
DMN1019USN
VDS = 4V
ID = 10A
4
2
0
0
5
10 15 20 25 30 35 40 45
Qg, TOTAL GATE CHARGE (nC)
Figure 11 Gate Charge
DMN1019USN
Document number: DS36999 Rev. 2 - 2
50
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0
2
4
6
8
10
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 10 Typical Junction Capacitance
12
RDS(on)
Limited
DC
PW = 10s
PW = 1s
1
PW = 100ms
PW = 10ms
PW = 1ms
0.1
PW = 100µs
T J(max) = 150°C
T A = 25°C
VGS = 10V
Single Pulse
DUT on 1 * MRP Board
0.01
0.01
0.1
1
10
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 12 SOA, Safe Operation Area
100
May 2014
© Diodes Incorporated
DMN1019USN
r(t), TRANSIENT THERMAL RESISTANCE
NEW PRODUCT
1
D = 0.9
D = 0.7
D = 0.5
D = 0.3
0.1
D = 0.1
D = 0.05
D = 0.02
0.01
D = 0.01
D = 0.005
RθJA(t) = r(t) * RθJA
RθJA = 60°C/W
Duty Cycle, D = t1/ t2
D = Single Pulse
0.001
0.0001
0.001
0.01
0.1
1
10
t1, PULSE DURATION TIME (sec)
Figure 13 Transient Thermal Resistance
100
1000
Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
A
SC59
Min
Max
Typ
0.35
0.50
0.38
B
1.50
1.70
1.60
C
2.70
3.00
2.80
D
0.95
G
1.90
H
2.90
3.10
3.00
J
0.013 0.10
0.05
K
1.00
1.30
1.10
L
0.35
0.55
0.40
M
0.10
0.20
0.15
N
0.70
0.80
0.75
0°
8°
α
All Dimensions in mm
Dim
A
B C
G
H
K
M
N
J
L
D
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
Y
Z
C
X
DMN1019USN
Document number: DS36999 Rev. 2 - 2
Dimensions Value (in mm)
Z
3.4
X
0.8
Y
1.0
2.4
C
1.35
E
E
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DMN1019USN
IMPORTANT NOTICE
NEW PRODUCT
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
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Copyright © 2014, Diodes Incorporated
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DMN1019USN
Document number: DS36999 Rev. 2 - 2
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