APS11205 High-Temperature Chopper-Stabilized Precision Hall-Effect Switch for 5 V Applications FEATURES AND BENEFITS DESCRIPTION • Optimized for applications with regulated power rails □□ Operation from 2.8 to 5.5 V • AEC-Q100 automotive qualified • Operation up to 175°C junction temperature • Dynamic offset cancellation □□ Resistant to physical stress □□ Superior temperature stability • Unipolar switchpoints • Output short-circuit protection • Solid-state reliability • Industry-standard packages and pinouts The APS11205 Hall-effect sensor IC is an extremely temperature-stable and stress-resistant device, especially suited for operation over extended junction temperature ranges up to 175°C. Superior high-temperature performance is made possible through dynamic offset cancellation, which reduces the residual offset voltage normally caused by device overmolding, temperature dependencies, and thermal stress. PACKAGES: Not to scale The single silicon chip includes: a Hall plate, small signal amplifier, chopper stabilization, Schmitt trigger, and a shortcircuit-protected open-drain output. A south pole of sufficient strength turns the output on. Removal of the magnetic field turns the output off. For applications requiring operation from greater than 5.5 V, or operation directly from a battery, refer to the A1120. Two package styles provide a choice of through-hole or surface mounting. Package type LH is a modified SOT23W, surfacemount package, while UA is a three-lead ultra-mini SIP for through-hole mounting. Both packages are lead (Pb) free and RoHs compliant with 100% matte-tin leadframe plating. 3-pin SOT23W (suffix LH) 3-pin SIP (suffix UA) Functional Block Diagram Amp Sample and Hold Dynamic Offset Cancellation VCC Low-Pass Filter To All Subcircuits VOUT Control Current Limit GND APS11205-DS APS11205 High-Temperature Chopper-Stabilized Precision Hall-Effect Switch for 5 V Applications SELECTION GUIDE Part Number Packing 1 Mounting Branding APS11205LLHALX 13-in. reel, 10000 pieces/reel 3-pin SOT23W surface mount APS11205LLHALT 2 7-in. reel, 3000 pieces/reel 3-pin SOT23W surface mount A23 APS11205LUAA Bulk, 500 pieces/bag 3-pin SIP through hole A24 Switchpoints (Typ.) Ambient, TA BOP BRP 35 G 25 G A23 –40°C to 150°C 1 Contact Allegro 2 Available for additional packing options. through authorized Allegro distributors only. RoHS COMPLIANT ABSOLUTE MAXIMUM RATINGS Characteristic Symbol Notes Rating Units Forward Supply Voltage VCC 6 V Reverse Supply Voltage VRCC –0.3 V Output Off Voltage VOUT 6 V Output Current 3 IOUT 60 mA 165 °C 175 °C –65 to 170 °C Maximum Junction Temperature TJ(max) Storage Temperature short-circuit current limiting device. PINOUT DIAGRAMS AND TERMINAL LIST GND 3 Through For 500 hours Tstg 3 Terminal List Name 1 VOUT VCC 3-pin SOT23W (suffix LH) 2 3 VOUT 2 GND 1 VCC VCC VOUT GND Description Connects power supply to chip Output from circuit Ground Number LH UA 1 1 2 3 3 2 3-pin SIP (suffix UA) Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 2 APS11205 High-Temperature Chopper-Stabilized Precision Hall-Effect Switch for 5 V Applications ELECTRICAL CHARACTERISTICS: Valid over full operating voltage and TA = –40°C to 150°C, unless otherwise noted Characteristics Symbol Test Conditions Min. Typ.1 Max. Unit 2 ELECTRICAL CHARACTERISTICS Forward Supply Voltage VCC Operating, TJ < 175°C 2.8 – 5.5 V Output Leakage Current IOUTOFF VOUT = 5.5 V, B < BRP – – 10 µA VOUT(SAT) Output Saturation Voltage IOUT = 5 mA, B > BOP – 50 500 mV Output Current IOUT Recommended value used during characterization – 5 – mA Output Short-Circuit Current Limit IOM B > BOP 30 – 60 mA tPO VCC > 2.8 V, B < BRP(min) – 10 G, B > BOP(max) + 10 G – – 25 µs Power-On Time 3 Power-On State, Output 3 POS Chopping Frequency fC Output Rise Time 3,4 tr Output Fall Time 3,4 tf Supply Current ICC VCC ≥ VCC(min), t < tPO Low – – 800 – kHz RL = 1 kΩ, CL = 20 pF – 0.2 2 µs RL = 1 kΩ, CL = 20 pF – 0.1 2 µs VCC = 5.5 V – 2 4 mA G MAGNETIC CHARACTERISTICS Operate Point BOP – 35 50 Release Point BRP 5 25 – G Hysteresis BHYS – 10 – G (BOP – BRP) 1 Typical data are are at TA = 25°C and VCC = 5 V, and are for initial design estimations only. G (gauss) = 0.1 mT (millitesla). 3 Guaranteed by device design and characterization. 4 C = oscilloscope probe capacitance. L 21 Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 3 High-Temperature Chopper-Stabilized Precision Hall-Effect Switch for 5 V Applications APS11205 THERMAL CHARACTERISTICS: May require derating at maximum conditions; see application information Characteristic Symbol RθJA Package Thermal Resistance Value Units Package LH, 1-layer PCB with copper limited to solder pads Test Conditions 228 °C/W Package LH, 2-layer PCB with 0.463 in.2 of copper area each side connected by thermal vias 110 °C/W Package UA, 1-layer PCB with copper limited to solder pads 165 °C/W Power Derating Curve TJ(max) = 175°C; ICC = ICC(max), IOUT = 0 mA (Output Off) 6 Maximum Allowable VCC (V) VCC(max) 5 Package LH, 2-layer PCB (RθJA = 110 °C/W) (Right) Package UA, 1-layer PCB (RθJA = 165 °C/W) (Center) Package LH, 1-layer PCB (RθJA = 228 °C/W) (Left) 4 3 2 VCC(min) 25 45 65 85 105 125 145 165 185 TJ(max) Temperature (°C) Power Dissipation, PD (mW) Package Power Dissipation versus Ambient Temperature 1900 1800 1700 1600 1500 1400 1300 1200 1100 1000 900 800 700 600 500 400 300 200 100 0 Package LH, 2-layer PCB (RθJA = 110°C/W) Package UA, 1-layer PCB (RθJA = 165°C/W) Package LH, 1-layer PCB (RθJA = 228°C/W) 20 40 60 80 100 120 140 160 180 Temperature (°C) Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 4 High-Temperature Chopper-Stabilized Precision Hall-Effect Switch for 5 V Applications APS11205 CHARACTERISTIC PERFORMANCE DATA Average Supply Current versus Ambient Temperature Average Supply Current versus Supply Voltage 4.0 4.0 3.5 3.5 TA (°C) 2.5 -40 2.0 25 1.5 3.0 ICC (mA) ICC (mA) 3.0 150 1.0 2.8 2.0 5 1.5 5.5 1.0 0.5 0.5 0.0 2.5 3 3.5 4 4.5 VCC (V) 5 5.5 0.0 6 -60 Average Low Output Voltage versus Supply Voltage for IOUT = 5 mA 0 20 40 60 TA (°C) 80 100 120 140 160 450 400 TA (°C) 300 -40 250 25 200 150 150 VOUT(SAT) (mV) 400 350 100 VCC (V) 350 300 2.8 250 200 5 150 5.5 100 50 50 0 2.5 3 3.5 4 4.5 VCC (V) 5 5.5 0 6 -60 -40 -20 0 20 40 60 TA (°C) 80 100 120 140 160 Average Operate Point versus Ambient Temperature Average Operate Point versus Supply Voltage 50 50 45 45 40 40 TA (°C) -40 30 25 25 20 15 35 BOP (G) 35 BOP (G) -20 500 450 150 VCC (V) 30 2.8 25 20 5 15 5.5 10 10 5 5 0 0 2.5 3 3.5 4 4.5 VCC (V) 5 5.5 -60 6 -40 -20 0 20 40 60 TA (°C) 80 100 120 140 160 Average Release Point versus Ambient Temperature Average Release Point versus Supply Voltage 50 50 45 45 40 40 TA (°C) -40 30 25 25 20 15 150 10 35 BRP (G) 35 BRP (G) -40 Average Low Output Voltage versus Ambient Temperature for IOUT = 5 mA 500 VOUT(SAT) (mV) VCC (V) 2.5 VCC (V) 30 2.8 25 20 5 15 5.5 10 5 5 0 0 2.5 3 3.5 4 4.5 VCC (V) 5 5.5 Average Switchpoint Hysteresis versus Supply Voltage 6 -60 -40 -20 0 20 40 60 80 100 120 140 160 Allegro MicroSystems, LLC TA (°C) Cutoff 115 Northeast Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com Average Switchpoint Hysteresis versus Ambient Temperature 5 Average Operate Point versus Ambient Temperature Average Operate Point versus Supply Voltage 50 50 45 45 High-Temperature Chopper-Stabilized Precision Hall-Effect Switch for 5 V Applications 40 -40 30 25 25 20 15 35 BOP (G) APS11205 35 BOP (G) 40 TA (°C) 150 VCC (V) 30 2.8 25 20 5 15 5.5 10 10 5 5 0 0 2.5 3 3.5 4 4.5 5 5.5 -60 6 0 20 40 60 80 100 120 140 160 50 45 45 40 40 TA (°C) -40 30 25 25 20 15 35 BRP (G) 35 BRP (G) -20 Average Release Point versus Ambient Temperature Average Release Point versus Supply Voltage 50 150 VCC (V) 30 2.8 25 20 5 15 5.5 10 10 5 5 0 0 2.5 3 3.5 4 4.5 VCC (V) 5 5.5 -60 6 Average Switchpoint Hysteresis versus Supply Voltage -40 -20 0 20 40 60 TA (°C) 80 100 120 140 160 Average Switchpoint Hysteresis versus Ambient Temperature 30 30 25 TA (°C) 20 -40 15 25 10 150 BHYS (G) 25 BHYS (G) -40 TA (°C) VCC (V) CHARACTERISTIC PERFORMANCE DATA (continued) VCC (V) 20 2.8 15 5 5.5 10 5 5 0 0 2.5 3 3.5 4 4.5 VCC (V) 5 5.5 6 -60 -40 -20 0 20 40 60 TA (°C) 80 100 120 140 160 Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 6 High-Temperature Chopper-Stabilized Precision Hall-Effect Switch for 5 V Applications APS11205 FUNCTIONAL DESCRIPTION Switch to Low Switch to High OPERATION The output of the APS11205 switches low (turns on) when a south-polarity magnetic field perpendicular to the Hall element exceeds the operate point threshold, BOP (see Figure 1). After turn-on, the output transistor is capable of continuously sinking up to 30 mA. When the magnetic field is reduced below the release point, BRP, the device output goes high (turns off). POWER-ON BEHAVIOR Device power-on occurs once tPO has elapsed. During the time prior to tPO, and after VCC ≥ VCC(min), the output state is VOUT(SAT). After tPO has elapsed, the output will correspond with the applied magnetic field for B > BOP or B < BRP. See Figure 2 for an example. Powering-on the device in the hysteresis range (less than BOP and higher than BRP) will give an output state of VOUT(OFF). The correct state is attained after the first excursion beyond BOP or BRP . Key POS B > BOP B < BRP, BRP < B < BOP V BRP BOP 0 B+ (south) VOUT VOUT(OFF) 0 VOUT (SAT) Output State Undefined for VCC< VCC (min) POS t BHYS V On the horizontal axis, the B+ direction indicates increasing south polarity magnetic field strength. The difference in the magnetic operate and release points is the hysteresis, BHYS , of the device. This built-in hysteresis allows clean switching of the output even in the presence of external mechanical vibration and electrical noise. VCC Figure 1: Device Switching Behavior VCC (min) 0 t PO t Figure 2: Power-On Sequence and Timing Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 7 APS11205 High-Temperature Chopper-Stabilized Precision Hall-Effect Switch for 5 V Applications Applications It is strongly recommended that an external bypass capacitor be connected (in close proximity to the Hall element) between the supply and ground of the device to guarantee correct performance under harsh environmental conditions and to reduce noise from internal circuitry. As is shown in Figure 3, a 0.1 µF capacitor is typical. Extensive applications information for Hall-effect devices is available in: VS VCC APS11205 VOUT CBYP 0.1 µF RL Output GND • Hall-Effect IC Applications Guide, AN27701, • Hall-Effect Devices: Guidelines for Designing Subassemblies Using Hall-Effect Devices AN27703.1 • Soldering Methods for Allegro’s Products – SMD and Through-Hole, AN26009 Figure 3: Typical Application Circuit All are provided on the Allegro website: www.allegromicro.com Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 8 APS11205 High-Temperature Chopper-Stabilized Precision Hall-Effect Switch for 5 V Applications CHOPPER STABILIZATION A limiting factor for switchpoint accuracy when using Hall-effect technology is the small-signal voltage developed across the Hall plate. This voltage is proportionally small relative to the offset that can be produced at the output of the Hall sensor. This makes it difficult to process the signal and maintain an accurate, reliable output over the specified temperature and voltage range. Chopper stabilization is a proven approach used to minimize Hall offset. The Allegro technique, dynamic quadrature offset cancellation, removes key sources of the output drift induced by temperature and package stress. This offset reduction technique is based on a signal modulation-demodulation process. Figure 4: Model of Chopper Stabilization Circuit (Dynamic Offset Cancellation) illustrates how it is implemented. The undesired offset signal is separated from the magnetically induced signal in the frequency domain through modulation. The subsequent demodulation acts as a modulation process for the offset causing the magnetically induced signal to recover its original spectrum at baseband while the DC offset becomes a high-frequency signal. Then, using a low-pass filter, the signal passes while the modulated DC offset is suppressed. Allegro’s innovative chopper stabilization technique uses a high-frequency clock. The high-frequency operation allows a greater sampling rate that produces higher accuracy, reduced jitter, and faster signal processing. Additionally, filtering is more effective and results in a lower noise analog signal at the sensor output. Devices such as the A11205 that uses this approach have an extremely stable quiescent Hall output voltage, are immune to thermal stress, and have precise recoverability after temperature cycling. This technique is made possible through the use of a BiCMOS process which allows the use of low-offset and low-noise amplifiers in combination with high-density logic and sample-and-hold circuits Hall Element Amp Sample and Hold Clock/Logic Low-Pass Filter Figure 4: Model of Chopper Stabilization Circuit (Dynamic Offset Cancellation) Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 9 APS11205 High-Temperature Chopper-Stabilized Precision Hall-Effect Switch for 5 V Applications POWER DERATING The device must be operated below the maximum junction temperature of the device, TJ(max). Under certain combinations of peak conditions, reliable operation may require derating supplied power or improving the heat dissipation properties of the application. This section presents a procedure for correlating factors affecting operating TJ. (Thermal data is also available on the Allegro MicroSystems website.) The Package Thermal Resistance, RθJA, is a figure of merit summarizing the ability of the application and the device to dissipate heat from the junction (die), through all paths to the ambient air. Its primary component is the Effective Thermal Conductivity, K, of the printed circuit board, including adjacent devices and traces. Radiation from the die through the device case, RθJC, is relatively small component of RθJA. Ambient air temperature, TA, and air motion are significant external factors, damped by overmolding. The resulting power dissipation capability directly reflects upon the ability of the device to withstand extreme operating conditions. The junction temperature mission profile specified in the Absolute Maximum Ratings table designates a total operating life capability based on qualification for the most extreme conditions, where TJ may reach 175°C. The silicon IC is heated internally when current is flowing into the VCC terminal. When the output is on, current sinking into the VOUT terminal generates additional heat. This may increase the junction temperature, TJ, above the surrounding ambient temperature. The APS11205 is permitted to operate up to TJ = 175°C. As mentioned above, an operating device will increase TJ according to equations 1, 2, and 3 below. This allows an estimation of the maximum ambient operating temperature. PD = VIN × IIN ΔT = PD × RθJA TJ = TA + ΔT For example, given common conditions such as: TA= 25°C, VCC = 5 V, ICC = 2.5 mA, VOUT = 185 mV, IOUT = 2 mA (output on), and RθJA = 165°C/W, then: PD = (VCC × ICC) + (VOUT × IOUT) = (5 V × 2.5 mA) + (185 mV × 2 mA) = 12.5 mW + 0.4 mW = 12.9 mW ΔT = PD × RθJA = 12.9 mW × 165°C/W = 2.1°C TJ = TA + ΔT = 25°C + 2.1°C = 27.1°C A worst-case estimate, PD(max), represents the maximum allowable power level (VCC(max), ICC(max)), without exceeding TJ(max), at a selected RθJA. For example, given the conditions RθJA = 228°C/W, TJ(max) = 175°C, VCC(max) = 5.5 V, ICC(max) = 4 mA, VOUT = 500 mV, and IOUT = 5 mA (output on), the maximum allowable operating ambient temperature can be determined. The power dissipation required for the output is shown below: PD(VOUT) = VOUT × IOUT = 500 mV × 5 mA = 2.5 mW The power dissipation required for the IC supply is shown below: PD(VCC) = VCC × ICC = 5.5 V × 4 mA = 22 mW Next, by inverting using equation 2: ΔT = PD × RθJA = [PD(VOUT) + PD(VCC)] × 228°C/W = (2.5 mW + 22 mW) × 228°C/W = 24.5 mW × 228°C/W = 5.6°C Finally, by inverting equation 3 with respect to voltage: TA(est) = TJ(max) – ΔT = 175°C – 5.6°C = 169.4°C (1) In the above case there is only sufficient power dissipation capability to operate up to TA(est). This particular result indicates that, (2) at TJ(max), the application and device can only dissipate adequate amounts of heat at ambient temperatures ≤ TA(est). (3) Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 10 High-Temperature Chopper-Stabilized Precision Hall-Effect Switch for 5 V Applications APS11205 Package LH, 3-Pin (SOT-23W) +0.12 2.98 –0.08 1.49 D 4°±4° 3 A +0.020 0.180–0.053 0.96 D +0.10 2.90 –0.20 +0.19 1.91 –0.06 2.40 0.70 D 0.25 MIN 1.00 2 1 0.55 REF 0.25 BSC 0.95 Seating Plane Gauge Plane 8X 10° REF B PCB Layout Reference View C Standard Branding Reference View Branded Face 1.00 ±0.13 0.95 BSC A23 +0.10 0.05 –0.05 0.40 ±0.10 1 For Reference Only; not for tooling use (reference dwg. 802840) Dimensions in millimeters Dimensions exclusive of mold flash, gate burrs, and dambar protrusions Exact case and lead configuration at supplier discretion within limits shown A Active Area Depth, 0.28 mm REF B Reference land pattern layout All pads a minimum of 0.20 mm from all adjacent pads; adjust as necessary to meet application process requirements and PCB layout tolerances C Branding scale and appearance at supplier discretion D Hall element, not to scale Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 11 High-Temperature Chopper-Stabilized Precision Hall-Effect Switch for 5 V Applications APS11205 Package UA, 3-Pin SIP +0.08 4.09 –0.05 45° B E C 2.04 1.52 ±0.05 +0.08 3.02 –0.05 1.44 E 10° Mold Ejector Pin Indent E Branded Face A 1.02 MAX 45° 0.79 REF A24 1 1 2 D Standard Branding Reference View 3 +0.03 0.41 –0.06 14.99 ±0.25 +0.05 0.43 –0.07 For Reference Only; not for tooling use (reference DWG-9065) Dimensions in millimeters Dimensions exclusive of mold flash, gate burrs, and dambar protrusions Exact case and lead configuration at supplier discretion within limits shown A Dambar removal protrusion (6X) B Gate and tie bar burr area C Active Area Depth, 0.50 mm REF D Branding scale and appearance at supplier discretion E Hall element (not to scale) 1.27 NOM Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 12 High-Temperature Chopper-Stabilized Precision Hall-Effect Switch for 5 V Applications APS11205 Revision History Number Date Description – July 29, 2016 Initial release Copyright ©2016, Allegro MicroSystems, LLC Allegro MicroSystems, LLC reserves the right to make, from time to time, such departures from the detail specifications as may be required to permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the information being relied upon is current. Allegro’s products are not to be used in any devices or systems, including but not limited to life support devices or systems, in which a failure of Allegro’s product can reasonably be expected to cause bodily harm. The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, LLC assumes no responsibility for its use; nor for any infringement of patents or other rights of third parties which may result from its use. For the latest version of this document, visit our website: www.allegromicro.com Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 13