ON EMG2DXV5 Dual bias resistor transistor Datasheet

EMG2DXV5, EMG5DXV5
Dual Bias Resistor
Transistors
NPN Silicon Surface Mount Transistors
with Monolithic Bias Resistor Network
This new series of digital transistors is designed to replace a single
device and its external resistor bias network. The BRT (Bias Resistor
Transistor) contains a single transistor with a monolithic bias network
consisting of two resistors; a series base resistor and a base−emitter
resistor. The BRT eliminates these individual components by
integrating them into a single device. The use of a BRT can reduce
both system cost and board space. The device is housed in the
SOT−553 package which is designed for low power surface mount
applications.
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NPN SILICON
BIAS RESISTOR
TRANSISTORS
(5)
(4)
Q1
Q2
Features
•
•
•
•
•
•
•
Simplifies Circuit Design
Reduces Board Space
Reduces Component Count
Moisture Sensitivity Level: 1
Available in 8 mm, 7 inch Tape and Reel
Lead−Free Solder Plating
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
Rating
Symbol
Value
Unit
VCBO
50
Vdc
Collector-Emitter Voltage
VCEO
50
Vdc
IC
100
mAdc
Symbol
Max
Unit
Total Device Dissipation
TA = 25°C
Derate above 25°C
PD
230 (Note 1)
338 (Note 2)
1.8 (Note 1)
2.7 (Note 2)
mW
Thermal Resistance −
Junction-to-Ambient
RqJA
540 (Note 1)
370 (Note 2)
°C/W
Thermal Resistance −
Junction-to-Lead
RqJL
264 (Note 1)
287 (Note 2)
°C/W
Junction and Storage
Temperature Range
TJ, Tstg
−55 to +150
°C
THERMAL CHARACTERISTICS
Characteristic
March, 2013 − Rev. 1
R1
R1
(1)
(2)
(3)
SOT−553
CASE 463B
1
MARKING
DIAGRAM
5
XXM G
G
°C/W
1
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−4 @ Minimum Pad
2. FR−4 @ 1.0 x 1.0 inch Pad
© Semiconductor Components Industries, LLC, 2013
R2
5
Collector-Base Voltage
Collector Current
R2
1
XX = UF (EMG5)
UP (EMG2)
M = Date Code
G = Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
Publication Order Number:
EMG5DXV5/D
EMG2DXV5, EMG5DXV5
DEVICE MARKING AND RESISTOR VALUES
Package
Marking
R1 (K)
R2 (K)
EMG2DXV5
Device
SOT−553
UP
47
47
EMG5DXV5
SOT−553
UF
10
47
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic
Symbol
Min
Typ
Max
Unit
Collector-Base Cutoff Current (VCB = 50 V, IE = 0)
ICBO
−
−
100
nAdc
Collector-Emitter Cutoff Current (VCE = 50 V, IB = 0)
ICEO
−
−
500
nAdc
Emitter-Base Cutoff Current (VEB = 6.0 V, IC = 0)
IEBO
−
−
−
−
0.1
0.2
mAdc
Collector-Base Breakdown Voltage (IC = 10 mA, IE = 0)
V(BR)CBO
50
−
−
Vdc
Collector-Emitter Breakdown Voltage (Note 3)
(IC = 2.0 mA, IB = 0)
V(BR)CEO
50
−
−
Vdc
hFE
80
80
140
140
−
−
VCE(sat)
−
−
0.25
−
−
−
−
0.2
0.2
VOH
4.9
−
−
Vdc
kW
OFF CHARACTERISTICS (Q1 & Q2)
EMG2DXV5
EMG5DXV5
ON CHARACTERISTICS (Q1 & Q2) (Note 3)
DC Current Gain (VCE = 10 V, IC = 5.0 mA)
EMG2DXV5
EMG5DXV5
Collector-Emitter Saturation Voltage (IC = 10 mA, IB = 0.3 mA)
Output Voltage (on)
(VCC = 5.0 V, VB = 3.5 V, RL = 1.0 kW)
(VCC = 5.0 V, VB = 2.5 V, RL = 1.0 kW)
VOL
EMG2DXV5
EMG5DXV5
Output Voltage (off) (VCC = 5.0 V, VB = 0.5 V, RL = 1.0 kW)
Input Resistor
EMG2DXV5
EMG5DXV5
R1
32.9
7.0
47
10
61.1
13
Resistor Ratio
EMG2DXV5
EMG5DXV5
R1/R2
0.8
0.17
1.0
0.21
1.2
0.25
3. Pulse Test: Pulse Width < 300 ms, Duty Cycle < 2.0%
PD, POWER DISSIPATION (mW)
350
300
250
200
150
100
50
0
−50
RqJA = 370°C/W
0
50
100
TA, AMBIENT TEMPERATURE (°C)
Figure 1. Derating Curve
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2
150
Vdc
Vdc
EMG2DXV5, EMG5DXV5
10
1000
hFE , DC CURRENT GAIN (NORMALIZED)
VCE(sat) , MAXIMUM COLLECTOR VOLTAGE (VOLTS)
TYPICAL ELECTRICAL CHARACTERISTICS — EMG2DXV5
IC/IB = 10
1
25°C
TA=-25°C
75°C
0.1
VCE = 10 V
TA=75°C
25°C
-25°C
100
0.01
0
10
50
20
40
IC, COLLECTOR CURRENT (mA)
10
IC, COLLECTOR CURRENT (mA)
1
Figure 2. VCE(sat) versus IC
Figure 3. DC Current Gain
1
100
f = 1 MHz
IE = 0 V
TA = 25°C
IC, COLLECTOR CURRENT (mA)
0.4
TA=-25°C
10
1
0.1
0.01
0.2
0
25°C
75°C
0.6
0
VO = 5 V
0.001
50
10
20
30
40
VR, REVERSE BIAS VOLTAGE (VOLTS)
0
Figure 4. Output Capacitance
2
4
6
Vin, INPUT VOLTAGE (VOLTS)
VO = 0.2 V
TA=-25°C
10
25°C
75°C
1
0.1
0
10
8
Figure 5. Output Current versus Input Voltage
100
V in , INPUT VOLTAGE (VOLTS)
Cob , CAPACITANCE (pF)
0.8
100
20
30
40
IC, COLLECTOR CURRENT (mA)
Figure 6. Input Voltage versus Output Current
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3
50
10
EMG2DXV5, EMG5DXV5
300
1
TA=-25°C
IC/IB = 10
TA=75°C
VCE = 10
250
25°C
hFE, DC CURRENT GAIN
VCE(sat) , MAXIMUM COLLECTOR VOLTAGE (VOLTS)
TYPICAL ELECTRICAL CHARACTERISTICS − EMG5DXV5
0.1
75°C
0.01
25°C
200
-25°C
150
100
50
0.001
0
20
40
60
IC, COLLECTOR CURRENT (mA)
0
80
1
2
4
6
Figure 7. VCE(sat) versus IC
100
75°C
3
IC, COLLECTOR CURRENT (mA)
f = 1 MHz
lE = 0 V
TA = 25°C
3.5
2.5
2
1.5
1
0.5
0
2
4
6 8 10 15 20 25 30 35 40
VR, REVERSE BIAS VOLTAGE (VOLTS)
45
25°C
TA=-25°C
10
VO = 5 V
1
50
Figure 9. Output Capacitance
0
2
4
6
Vin, INPUT VOLTAGE (VOLTS)
TA=-25°C
VO= 0.2 V
25°C
75°C
1
0.1
0
10
8
10
Figure 10. Output Current versus Input Voltage
10
V in , INPUT VOLTAGE (VOLTS)
Cob , CAPACITANCE (pF)
90 100
Figure 8. DC Current Gain
4
0
8 10 15 20 40 50 60 70 80
IC, COLLECTOR CURRENT (mA)
20
30
IC, COLLECTOR CURRENT (mA)
40
Figure 11. Input Voltage versus Output Current
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4
50
EMG2DXV5, EMG5DXV5
TYPICAL APPLICATIONS FOR NPN BRTs
+12 V
ISOLATED
LOAD
FROM mP OR
OTHER LOGIC
Figure 12. Level Shifter: Connects 12 or 24 Volt Circuits to Logic
+12 V
VCC
OUT
IN
LOAD
Figure 13. Open Collector Inverter:
Inverts the Input Signal
Figure 14. Inexpensive, Unregulated Current Source
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5
EMG2DXV5, EMG5DXV5
DEVICE ORDERING INFORMATION
Package
Shipping†
EMG2DXV5T1G
SOT−553
(Pb−Free)
4000 / Tape & Reel
EMG2DXV5T5G
SOT−553
(Pb−Free)
8000 / Tape & Reel
EMG5DXV5T1G
SOT−553
(Pb−Free)
4000 / Tape & Reel
EMG5DXV5T5G
SOT−553
(Pb−Free)
8000 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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6
EMG2DXV5, EMG5DXV5
PACKAGE DIMENSIONS
SOT−553
CASE 463B
ISSUE B
D
−X−
5
A
4
1
e
2
E
−Y−
3
b
L
HE
DIM
A
b
c
D
E
e
L
HE
c
5 PL
0.08 (0.003)
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
M
X Y
MILLIMETERS
NOM
MAX
0.55
0.60
0.22
0.27
0.13
0.18
1.60
1.70
1.20
1.30
0.50 BSC
0.10
0.20
0.30
1.50
1.60
1.70
MIN
0.50
0.17
0.08
1.50
1.10
INCHES
NOM
0.022
0.009
0.005
0.063
0.047
0.020 BSC
0.008
0.004
0.059
0.063
MIN
0.020
0.007
0.003
0.059
0.043
MAX
0.024
0.011
0.007
0.067
0.051
0.012
0.067
SOLDERING FOOTPRINT*
0.3
0.0118
0.45
0.0177
1.35
0.0531
1.0
0.0394
0.5
0.5
0.0197 0.0197
SCALE 20:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC
reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
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EMG5DXV5/D
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