Murata BLM21A On-board type emi suppression filters (emifilr) for automotive Datasheet

C50E.pdf
Aug.28,2008
On-Board Type (DC)
EMI Suppression Filters
(EMIFILr) for Automotive
Cat.No.C50E-7
C50E.pdf
Aug.28,2008
C50E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
CONTENTS
1
EMIFILr and "EMIFIL" in this catalog are
the trademarks of Murata Manufacturing Co., Ltd.
2
Product Guide/Effective Frequency Range
1
Chip Ferrite Beads Part Numbering
BLM15A/18A/21A/31A
BLM15B/18B/21B
3
4
12
BLM18P/21P/31P/41P
For GHz Range Noise Suppression BLM18H/18E
Specifications and Test Methods
2
38
Part Numbering
42
Chip EMIFILr Capacitor Type NFM21H Series
43
Chip EMIFILr LC Combined Type for Large Current NFE61H Series
Specifications and Test Methods
3
4
44
47
48
Chip Common Mode Choke Coils
Part Numbering
50
Chip Common Mode Choke Coil DLW31S/43S Series
51
Specifications and Test Methods
4
25
33
Chip EMIFILr
Specifications and Test Methods
3
2
54
Block Type EMIFILr
Block Type EMIFILr SMD Type BNX024H/025H Series
57
Block Type EMIFILr Lead Type BNX012H Series
58
Specifications and Test Methods
60
!Caution/Notice
64
Soldering and Mounting
67
Package
76
Design Kits
78
Outlines of Major Noise Regulation Standards
82
Principles of Noise Suppression by DC EMIFILr
87
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
C50E.pdf
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
Product Guide/Effective Frequency Range
Product Guide
Type
Inductor
Type
Standard
Series
EIA Code
BLM15A
1.0
0.5
0402
BLM18A
1.6
0.8
0603
BLM21A
2.0
1.25
0805
BLM31A
For High
Speed Signals
For High
Current
BLM18B
1.6
BLM21B
2.0
BLM18P
1.6
BLM41P
1.6
NFM21H
T Filter for
High Current
NFE61H
DLW31S
0.8
0603
1.25
0805
0.8
0603
1.25
0805
1.6
1206
1.6
1806
0.8
0603
0.8
0603
0.8
0603
1.25
0805
1.6
2706
1.6
1206
3.2
1812
4.5
BLM18HD
Standard
Type
0402
3.2
1.6
1206
0.5
2.0
BLM18HG
BLM18EG
Chip Common Mode
Choke Coils
1.6
1.0
BLM31P
Capacitor
Type
3.2
BLM15B
BLM21P
For GHz
Range
Noise
Suppression
Dimensions
(mm)
1.6
2.0
6.8
3.2
4.5
DLW43S
Block Type EMIFILr
2
BNX024H/025H
BNX012H
Effective Frequency Range
10kHz 100kHz 1MHz 10MHz100MHz 1GHz 10GHz
C50E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
On-Board Type (DC) EMI Suppression Filters (EMIFILr) for Automotive
Chip Ferrite Beads
1
Part Numbering
Chip Ferrite Beads for Automotive
(Part Number)
BL
M
18
AG
102
q
w
e
r
t
S
H
1 D
y u i o
tImpedance
qProduct ID
Expressed by three figures. The unit is in ohm (Ω). The first and
second figures are significant digits, and the third figure
expresses the number of zeros which follow the two figures.
Product ID
BL
Chip Ferrite Beads
Code
Type
wType
M
yElectrode
Expressed by a letter.
Monolithic Type
Ex.)
eDimensions (LgW)
Code
Dimensions (LgW)
EIA
Code
Electrode
S/T
Sn Plating
W
Ag/Pd
15
1.0g0.5mm
0402
18
1.6g0.8mm
0603
uCategory
21
2.0g1.25mm
0805
Code
Category
31
3.2g1.6mm
1206
H
for Automotive
41
4.5g1.6mm
1806
iNumber of Circuits
rCharacteristics/Applications
Code *1
AG
AJ
Characteristics/Applications
Series
for General Use
BLM15/18/21/31
Number of Circuits
1
1 Circuit
BLM18
BA
BB
Code
for High-speed Signal Lines
BD
PG
for Power Supplies
HG
for GHz Band General Use
EG
for GHz Band General Use
(Low DC Resistance Type)
HD
for GHz Band High-speed Signal Lines
BLM15/18/21
BLM18/21/31/41
BLM18
*1 Frequency characteristics vary with each code.
oPackaging
Code
Packaging
K
Embossed Taping (ø330mm Reel)
L
Embossed Taping (ø180mm Reel)
B
Bulk
J
Paper Taping (ø330mm Reel)
D
Paper Taping (ø180mm Reel)
Series
BLM21 *1/31/41
All Series
BLM15/18/21 *2
*1 BLM21BD222SH1/BLM21BD272SH1 only.
*2 Except BLM21BD222SH1/BLM21BD272SH1
3
C50E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
On-Board Type (DC) EMI Suppression Filters (EMIFILr) for Automotive
1
Chip Ferrite Beads BLM15/18/21/31/41 Series
BLM15A Series
0.25±0.1
■ Features
0.5±0.05
The chip ferrite beads BLM series is designed to
function nearly as a resistor at noise frequencies,
which greatly reduces the possibility of resonance and
leaves signal wave forms undistorted.
BLM series is effective in circuits without stable
ground lines because BLM series does not need a
connection to ground.
The nickel barrier structure of the external
electrodes provides excellent solder heat resistance.
BLM_A series generates an impedance from the
relatively low frequencies. Therefore BLM_A series is
effective in noise suppression in a wide frequency
range (30MHz to several hundred MHz).
1.0±0.05
0.5±0.05
(in mm)
Impedance
(at 100MHz/20°C)
(ohm)
Rated Current
(mA)
DC Resistance (max.)
(ohm)
Operating
Temperature Range
(°C)
10 (Typ.)
1000
0.05
-55 to +125
BLM15AG700SH1
70 (Typ.)
500
0.15
-55 to +125
BLM15AG121SH1
120 ±25%
500
0.25
-55 to +125
BLM15AG221SH1
220 ±25%
300
0.35
-55 to +125
BLM15AG601SH1
600 ±25%
300
0.6
-55 to +125
BLM15AG102SH1
1000 ±25%
200
1.0
-55 to +125
Part Number
BLM15AG100SH1
■ Equivalent Circuit
■ Impedance - Frequency (Typical)
1200
BLM15AG102SH1
1000
BLM15AG601SH1
BLM15AG221SH1
Impedance (Ω)
800
(Resistance element becomes dominant
at high frequencies.)
BLM15AG121SH1
600
BLM15AG700SH1
400
BLM15AG100SH1
200
0
1
10
100
Frequency (MHz)
1000 2000
Continued on the following page.
4
C50E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
Continued from the preceding page.
■ Impedance - Frequency Characteristics
BLM15AG100SH1
1
BLM15AG700SH1
120
20
100
Z
15
80
Impedance (Ω)
Impedance (Ω)
Z
R
10
R
60
40
X
5
X
20
0
0
1
10
100
1
1000
10
Frequency (MHz)
100
1000
Frequency (MHz)
BLM15AG121SH1
BLM15AG221SH1
400
200
Z
150
300
Impedance (Ω)
Impedance (Ω)
Z
R
100
R
200
100
50
X
X
0
0
1
10
100
1
1000
10
100
1000
Frequency (MHz)
Frequency (MHz)
BLM15AG601SH1
BLM15AG102SH1
1200
800
Z
Z
900
600
Impedance (Ω)
Impedance (Ω)
R
400
X
R
600
300
200
X
0
0
1
10
100
Frequency (MHz)
1000
1
10
100
1000
Frequency (MHz)
5
C50E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
BLM18A Series
0.4±0.2
■ Features
0.8±0.15
The chip ferrite beads BLM series is designed to
function nearly as a resistor at noise frequencies,
which greatly reduces the possibility of resonance and
leaves signal wave forms undistorted.
BLM series is effective in circuits without stable
ground lines because BLM series does not need a
connection to ground.
The nickel barrier structure of the external
electrodes provides excellent solder heat resistance.
BLM_A series generates an impedance from the
relatively low frequencies. Therefore BLM_A series is
effective in noise suppression in a wide frequency
range (30MHz to several hundred MHz).
1.6±0.15
0.8±0.15
(in mm)
Impedance
(at 100MHz/20°C)
(ohm)
Rated Current
(mA)
DC Resistance (max.)
(ohm)
Operating
Temperature Range
(°C)
BLM18AG121SH1
120 ±25%
500
0.18
-55 to +125
BLM18AG151SH1
150 ±25%
500
0.25
-55 to +125
BLM18AG221SH1
220 ±25%
500
0.25
-55 to +125
BLM18AG331SH1
330 ±25%
500
0.30
-55 to +125
BLM18AG471SH1
470 ±25%
500
0.35
-55 to +125
BLM18AG601SH1
600 ±25%
500
0.38
-55 to +125
BLM18AG102SH1
1000 ±25%
400
0.50
-55 to +125
Part Number
■ Equivalent Circuit
■ Impedance - Frequency (Typical)
BLM18A Series
1200
BLM18AG102SH1
BLM18AG601SH1
Impedance (Ω)
900
(Resistance element becomes dominant
at high frequencies.)
BLM18AG471SH1
BLM18AG331SH1
BLM18AG221SH1
600
BLM18AG151SH1
BLM18AG121SH1
300
0
1
10
100
1000
Frequency (MHz)
■ Impedance - Frequency Characteristics
BLM18AG121SH1
BLM18AG151SH1
200
400
150
300
Impedance (Ω)
Z
Impedance (Ω)
1
R
100
200
Z
R
X
50
100
X
0
1
10
100
Frequency (MHz)
1000
0
1
10
100
1000
Frequency (MHz)
Continued on the following page.
6
C50E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
Continued from the preceding page.
■ Impedance - Frequency Characteristics
BLM18AG221SH1
600
400
450
300
Z
Impedance (Ω)
Impedance (Ω)
1
BLM18AG331SH1
R
200
X
100
Z
R
300
150
X
0
0
1
10
100
1
1000
10
100
1000
Frequency (MHz)
Frequency (MHz)
BLM18AG471SH1
BLM18AG601SH1
800
800
600
600
Z
R
Impedance (Ω)
Impedance (Ω)
Z
R
400
200
0
10
100
X
200
X
1
400
1000
Frequency (MHz)
0
1
10
100
1000
Frequency (MHz)
BLM18AG102SH1
1200
Z
Impedance (Ω)
900
R
600
300
X
0
1
10
100
1000
Frequency (MHz)
7
C50E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
BLM18A Series Conductive Glue Applicable Type
0.4±0.2
■ Features
0.8±0.15
The chip ferrite beads BLM series is designed to
function nearly as a resistor at noise frequencies,
which greatly reduces the possibility of resonance and
leaves signal wave forms undistorted.
BLM series is effective in circuits without stable
ground lines because BLM series does not need a
connection to ground.
BLM_A series generates an impedance from the
relatively low frequencies. Therefore BLM_A series is
effective in noise suppression in a wide frequency
range (30MHz to several hundred MHz).
BLM18A_WH series is designed for conductive glue
mounting method, not for normal soldering method.
Please contact us for applicable mounting method
for BLM18A_WH series.
1.6±0.15
0.8±0.15
(in mm)
Impedance
(at 100MHz/20°C)
(ohm)
Rated Current
(mA)
DC Resistance (max.)
(ohm)
Operating
Temperature Range
(°C)
BLM18AG471WH1
470 ±25%
200
0.20
-55 to +150
BLM18AG102WH1
1000 ±25%
200
0.70
-55 to +150
Part Number
■ Equivalent Circuit
■ Impedance - Frequency (Typical)
BLM18A Series
1500
1200
Impedance (Ω)
BLM18AG102WH1
(Resistance element becomes dominant
at high frequencies.)
900
BLM18AG471WH1
600
300
0
1
10
100
1000
Frequency (MHz)
■ Impedance - Frequency Characteristics
BLM18AG471WH1
BLM18AG102WH1
1500
600
1200
R
Impedance (Ω)
400
Impedance (Ω)
1
Z
900
Z
600
200
R
X
300
X
0
0
1
10
100
Frequency (MHz)
8
1000
1
10
100
Frequency (MHz)
1000
C50E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
1
BLM21A Series
■ Features
0.5±0.2
0.85±0.2
The chip ferrite beads BLM series is designed to
function nearly as a resistor at noise frequencies,
which greatly reduces the possibility of resonance and
leaves signal wave forms undistorted.
BLM series is effective in circuits without stable
ground lines because BLM series does not need a
connection to ground.
The nickel barrier structure of the external
electrodes provides excellent solder heat resistance.
BLM_A series generates an impedance from the
relatively low frequencies. Therefore BLM_A series is
effective in noise suppression in a wide frequency
range (30MHz to several hundred MHz).
1.25±0.2
2.0±0.2
EIA CODE : 0805
(in mm)
Impedance
(at 100MHz/20°C)
(ohm)
Rated Current
(mA)
DC Resistance (max.)
(ohm)
Operating
Temperature Range
(°C)
BLM21AG121SH1
120 ±25%
200
0.15
-55 to +125
BLM21AG151SH1
150 ±25%
200
0.15
-55 to +125
BLM21AG221SH1
220 ±25%
200
0.20
-55 to +125
BLM21AG331SH1
330 ±25%
200
0.25
-55 to +125
BLM21AG471SH1
470 ±25%
200
0.25
-55 to +125
BLM21AG601SH1
600 ±25%
200
0.30
-55 to +125
BLM21AG102SH1
1000 ±25%
200
0.45
-55 to +125
Part Number
■ Equivalent Circuit
■ Impedance - Frequency (Typical)
BLM21A Series
1200
BLM21AG102SH1
BLM21AG601SH1
900
Impedance (Ω)
BLM21AG471SH1
BLM21AG331SH1
BLM21AG221SH1
600
BLM21AG151SH1
BLM21AG121SH1
(Resistance element becomes dominant
at high frequencies.)
300
0
1
10
100
1000
Frequency (MHz)
■ Impedance - Frequency Characteristics
BLM21AG121SH1
BLM21AG151SH1
200
200
150
150
Z
R
Impedance (Ω)
Impedance (Ω)
Z
R
100
100
X
X
50
50
0
0
1
10
100
Frequency (MHz)
1000
1
10
100
1000
Frequency (MHz)
Continued on the following page.
9
C50E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
Continued from the preceding page.
■ Impedance - Frequency Characteristics
BLM21AG221SH1
BLM21AG331SH1
400
400
300
300
Z
Impedance (Ω)
Impedance (Ω)
R
Z
200
R
100
200
X
100
X
0
0
1
10
100
1000
1
10
Frequency (MHz)
100
1000
Frequency (MHz)
BLM21AG471SH1
BLM21AG601SH1
800
800
600
600
Impedance (Ω)
Impedance (Ω)
Z
Z
400
R
R
400
X
200
200
X
0
0
1
10
100
1000
Frequency (MHz)
BLM21AG102SH1
900
Z
R
600
X
300
0
1
10
100
Frequency (MHz)
10
1
10
100
Frequency (MHz)
1200
Impedance (Ω)
1
1000
1000
C50E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
1
BLM31A Series
0.7±0.3
■ Features
Part Number
BLM31AJ601SH1
1.1±0.2
The chip ferrite beads BLM series is designed to
function nearly as a resistor at noise frequencies,
which greatly reduces the possibility of resonance and
leaves signal wave forms undistorted.
BLM series is effective in circuits without stable
ground lines because BLM series does not need a
connection to ground.
The nickel barrier structure of the external
electrodes provides excellent solder heat resistance.
BLM_A series generates an impedance from the
relatively low frequencies. Therefore BLM_A series is
effective in noise suppression in a wide frequency
range (30MHz to several hundred MHz).
3.2±0.2
1.6±0.2
in mm
Impedance
(at 100MHz/20°C)
(ohm)
Rated Current
(mA)
DC Resistance (max.)
(ohm)
Operating
Temperature Range
(°C)
600 ±25%
200
0.90
-55 to +125
■ Equivalent Circuit
■ Impedance - Frequency Characteristics
800
600
Impedance (Ω)
Z
(Resistance element becomes dominant
at high frequencies.)
R
400
X
200
0
1
10
100
1000
Frequency (MHz)
11
C50E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
BLM15B Series
0.25±0.1
■ Features
The chip ferrite beads BLM series is designed to
function nearly as a resistor at noise frequencies,
which greatly reduces the possibility of resonance and
leaves signal wave forms undistorted.
BLM series is effective in circuits without stable
ground lines because BLM series does not need a
connection to ground.
The nickel barrier structure of the external
electrodes provides excellent solder heat resistance.
BLM_B series can minimize attenuation of the signal
waveform due to its sharp impedance characteristics.
Various impedances are available to match signal
frequency.
0.5±0.05
1
1.0±0.05
0.5±0.05
(in mm)
Impedance
(at 100MHz/20°C)
(ohm)
Rated Current
(mA)
DC Resistance (max.)
(ohm)
Operating
Temperature Range
(°C)
BLM15BB050SH1
5 ±25%
500
0.08
-55 to +125
BLM15BB100SH1
10 ±25%
300
0.10
-55 to +125
BLM15BB220SH1
22 ±25%
300
0.20
-55 to +125
BLM15BB470SH1
47 ±25%
300
0.35
-55 to +125
BLM15BB750SH1
75 ±25%
300
0.40
-55 to +125
BLM15BB121SH1
120 ±25%
300
0.55
-55 to +125
BLM15BB221SH1
220 ±25%
200
0.80
-55 to +125
BLM15BD471SH1
470 ±25%
200
0.60
-55 to +125
BLM15BD601SH1
600 ±25%
200
0.65
-55 to +125
BLM15BD102SH1
1000 ±25%
200
0.90
-55 to +125
BLM15BD182SH1
1800 ±25%
200
1.40
-55 to +125
Part Number
■ Equivalent Circuit
(Resistance element becomes dominant
at high frequencies.)
12
C50E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
■ Impedance - Frequency (Typical)
BLM15BB Series
1
BLM15BD Series
2500
800
700
BLM15BB221SH1
2000
BLM15BD182SH1
500
Impedance (Ω)
Impedance (Ω)
600
BLM15BB121SH1
400
BLM15BB750SH1
BLM15BB470SH1
300
1500
BLM15BD102SH1
1000
BLM15BD601SH1
BLM15BB220SH1
BLM15BD471SH1
BLM15BB100SH1
200
500
BLM15BB050SH1
100
0
0
1
10
100
Frequency (MHz)
1000 2000
1
10
100
1000 2000
Frequency (MHz)
■ Impedance - Frequency Characteristics
BLM15BB100SH1
60
25
50
20
40
Impedance (Ω)
Impedance (Ω)
BLM15BB050SH1
30
15
Z
10
Z
20
X
5
30
X
10
R
R
0
0
1
10
100
Frequency (MHz)
1000 2000
1
100
Frequency (MHz)
300
100
250
80
200
60
Z
150
Z
100
40
X
20
X
50
R
0
R
0
1
10
100
Frequency (MHz)
1000 2000
1
BLM15BB750SH1
10
1000 2000
100
Frequency (MHz)
BLM15BB121SH1
400
600
300
450
Impedance (Ω)
Impedance (Ω)
1000 2000
BLM15BB470SH1
120
Impedance (Ω)
Impedance (Ω)
BLM15BB220SH1
10
200
Z
Z
300
X
X
100
150
R
R
0
0
1
10
100
Frequency (MHz)
1000 2000
1
10
100
Frequency (MHz)
1000 2000
Continued on the following page.
13
C50E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
Continued from the preceding page.
■ Impedance - Frequency Characteristics
BLM15BB221SH1
BLM15BD471SH1
800
1000
600
750
Impedance (Ω)
Impedance (Ω)
Z
Z
400
X
R
500
X
250
200
R
0
0
1
10
100
Frequency (MHz)
1000 2000
1
10
BLM15BD601SH1
1000 2000
BLM15BD102SH1
1600
Z
Z
900
1200
Impedance (Ω)
Impedance (Ω)
100
Frequency (MHz)
1200
R
600
R
800
X
X
300
400
0
1
10
100
1000 2000
Frequency (MHz)
BLM15BD182SH1
Z
2000
R
1500
1000
X
500
0
1
14
10
100
Frequency (MHz)
0
1
10
100
Frequency (MHz)
2500
Impedance (Ω)
1
1000 2000
1000 2000
C50E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
1
BLM18B Series
0.4±0.2
■ Features
0.8±0.15
The chip ferrite beads BLM series is designed to
function nearly as a resistor at noise frequencies,
which greatly reduces the possibility of resonance and
leaves signal wave forms undistorted.
BLM series is effective in circuits without stable
ground lines because BLM series does not need a
connection to ground.
The nickel barrier structure of the external
electrodes provides excellent solder heat resistance.
BLM_B series can minimize attenuation of the signal
waveform due to its sharp impedance characteristics.
Various impedances are available to match signal
frequency.
1.6±0.15
0.8±0.15
(in mm)
Impedance
(at 100MHz/20°C)
(ohm)
Rated Current
(mA)
DC Resistance (max.)
(ohm)
Operating
Temperature Range
(°C)
BLM18BA050SH1
5 ±25%
500
0.20
-55 to +125
BLM18BB050SH1
5 ±25%
700
0.05
-55 to +125
BLM18BA100SH1
10 ±25%
500
0.25
-55 to +125
BLM18BB100SH1
10 ±25%
700
0.10
-55 to +125
BLM18BA220SH1
22 ±25%
500
0.35
-55 to +125
BLM18BB220SH1
22 ±25%
600
0.20
-55 to +125
BLM18BA470SH1
47 ±25%
300
0.55
-55 to +125
BLM18BB470SH1
47 ±25%
550
0.25
-55 to +125
BLM18BD470SH1
47 ±25%
500
0.30
-55 to +125
BLM18BB600SH1
60 ±25%
550
0.25
-55 to +125
BLM18BA750SH1
75 ±25%
300
0.70
-55 to +125
BLM18BB750SH1
75 ±25%
500
0.30
-55 to +125
BLM18BA121SH1
120 ±25%
200
0.90
-55 to +125
BLM18BB121SH1
120 ±25%
500
0.30
-55 to +125
BLM18BD121SH1
120 ±25%
200
0.40
-55 to +125
BLM18BB141SH1
140 ±25%
450
0.35
-55 to +125
BLM18BB151SH1
150 ±25%
450
0.37
-55 to +125
BLM18BD151SH1
150 ±25%
200
0.40
-55 to +125
BLM18BB221SH1
220 ±25%
450
0.45
-55 to +125
BLM18BD221SH1
220 ±25%
200
0.45
-55 to +125
BLM18BB331SH1
330 ±25%
400
0.58
-55 to +125
BLM18BD331SH1
330 ±25%
200
0.50
-55 to +125
BLM18BD421SH1
420 ±25%
200
0.55
-55 to +125
BLM18BB471SH1
470 ±25%
300
0.85
-55 to +125
BLM18BD471SH1
470 ±25%
200
0.55
-55 to +125
BLM18BD601SH1
600 ±25%
200
0.65
-55 to +125
BLM18BD102SH1
1000 ±25%
100
0.85
-55 to +125
BLM18BD152SH1
1500 ±25%
50
1.20
-55 to +125
BLM18BD182SH1
1800 ±25%
50
1.50
-55 to +125
BLM18BD222SH1
2200 ±25%
50
1.50
-55 to +125
BLM18BD252SH1
2500 ±25%
50
1.50
-55 to +125
Part Number
15
C50E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
■ Equivalent Circuit
(Resistance element becomes dominant
at high frequencies.)
■ Impedance - Frequency (Typical)
BLM18BA Series
600
10000
450
7500
300
Impedance (Ω)
Impedance (Ω)
BLM18BA Series
BLM18BA220SH1
5000
BLM18BA121SH1
BLM18BA100SH1
150
BLM18BA750SH1
2500
BLM18BA050SH1
BLM18BA470SH1
0
0
1
10
1000
100
2000
1
10
100
1000
2000
Frequency (MHz)
Frequency (MHz)
BLM18BB Series
BLM18BB Series
2000
250
BLM18BB471SH1
200
1500
Impedance (Ω)
Impedance (Ω)
BLM18BB331SH1
150
BLM18BB470SH1
BLM18BB220SH1
100
BLM18BB221SH1
BLM18BB151SH1
1000
BLM18BB141SH1
BLM18BB121SH1
BLM18BB100SH1
BLM18BB750SH1
BLM18BB050SH1
500
50
BLM18BB600SH1
0
0
1
10
100
1000 2000
BLM18BD Series
2800
BLM18BD252SH1
BLM18BD222SH1
BLM18BD182SH1
2100
BLM18BD152SH1
BLM18BD221SH1
BLM18BD102SH1
BLM18BD151SH1
BLM18BD601SH1
BLM18BD121SH1
1400
BLM18BD471SH1
BLM18BD421SH1
BLM18BD331SH1
700
BLM18BD470SH1
0
1
10
100
Frequency (MHz)
16
1
10
100
Frequency (MHz)
Frequency (MHz)
Impedance (Ω)
1
1000 2000
1000 2000
C50E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
■ Impedance - Frequency Characteristics
BLM18BA050SH1
1
BLM18BB050SH1
30
100
Z
Impedance (Ω)
Impedance (Ω)
75
R
50
X
20
Z
R
10
25
X
0
0
1
10
100
1000
1
2000
10
100
1000
2000
1000
2000
Frequency (MHz)
Frequency (MHz)
BLM18BA100SH1
BLM18BB100SH1
50
200
Z
40
R
Impedance (Ω)
Impedance (Ω)
150
100
X
30
Z
R
20
X
50
10
0
1
10
100
1000
0
2000
1
10
Frequency (MHz)
BLM18BA220SH1
BLM18BB220SH1
100
600
75
450
Z
Impedance (Ω)
Impedance (Ω)
100
Frequency (MHz)
300
Z
R
50
X
R
25
150
X
0
1
10
1000
100
0
2000
1
10
100
1000
2000
Frequency (MHz)
Frequency (MHz)
BLM18BA470SH1
BLM18BB470SH1
1600
250
200
Impedance (Ω)
Impedance (Ω)
1200
800
Z
150
R
100
X
Z
400
50
X
R
0
1
10
100
Frequency (MHz)
1000
2000
0
1
10
100
1000
2000
Frequency (MHz)
Continued on the following page.
17
C50E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
Continued from the preceding page.
■ Impedance - Frequency Characteristics
BLM18BD470SH1
BLM18BB600SH1
300
200
240
Impedance (Ω)
150
Impedance (Ω)
Z
100
R
180
Z
R
120
50
X
60
X
0
1
10
100
0
1000 2000
1
Frequency (MHz)
10
100
1000
2000
1000
2000
Frequency (MHz)
BLM18BA750SH1
BLM18BB750SH1
400
6000
300
4500
Impedance (Ω)
Impedance (Ω)
Z
3000
R
200
X
100
1500
Z
R
X
0
0
1
10
1000
100
1
2000
10
100
Frequency (MHz)
Frequency (MHz)
BLM18BA121SH1
BLM18BB121SH1
10000
500
400
7500
Impedance (Ω)
Impedance (Ω)
Z
5000
300
X
200
2500
Z
R
100
R
X
0
1
10
1000
100
0
2000
1
10
Frequency (MHz)
100
1000
2000
Frequency (MHz)
BLM18BD121SH1
BLM18BB141SH1
400
600
300
450
Z
Impedance (Ω)
Impedance (Ω)
1
Z
200
R
100
0
10
100
Frequency (MHz)
X
150
X
1
R
300
1000
2000
0
1
10
100
1000
2000
Frequency (MHz)
Continued on the following page.
18
C50E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
Continued from the preceding page.
■ Impedance - Frequency Characteristics
BLM18BB151SH1
1
BLM18BD151SH1
400
600
Z
Z
300
R
Impedance (Ω)
Impedance (Ω)
450
300
X
150
R
200
X
100
0
0
1
10
100
1000
1
2000
10
Frequency (MHz)
100
1000
2000
1000
2000
1000
2000
1000
2000
Frequency (MHz)
BLM18BB221SH1
BLM18BD221SH1
1000
500
800
400
Z
Z
Impedance (Ω)
Impedance (Ω)
R
600
400
R
300
200
X
X
200
100
0
1
10
100
1000
0
2000
1
10
Frequency (MHz)
100
Frequency (MHz)
BLM18BB331SH1
BLM18BD331SH1
1500
900
900
Z
Impedance (Ω)
Impedance (Ω)
1200
R
X
600
600
Z
R
300
X
300
0
1
10
100
1000
0
2000
1
10
Frequency (MHz)
100
Frequency (MHz)
BLM18BD421SH1
BLM18BB471SH1
2000
1000
1600
Z
750
Impedance (Ω)
Impedance (Ω)
Z
R
500
1200
R
800
X
X
250
400
0
0
1
10
100
Frequency (MHz)
1000 2000
1
10
100
Frequency (MHz)
Continued on the following page.
19
C50E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
Continued from the preceding page.
■ Impedance - Frequency Characteristics
BLM18BD471SH1
BLM18BD601SH1
1200
1200
900
900
Z
Impedance (Ω)
Impedance (Ω)
Z
R
600
R
600
X
X
300
300
0
0
1
10
100
1
1000 2000
10
BLM18BD102SH1
1000 2000
BLM18BD152SH1
2500
2000
1600
2000
Z
Z
R
Impedance (Ω)
Impedance (Ω)
100
Frequency (MHz)
Frequency (MHz)
1200
800
X
1500
R
1000
X
500
400
0
0
1
10
100
1
1000 2000
10
BLM18BD182SH1
1000 2000
BLM18BD222SH1
2500
2500
2000
Impedance (Ω)
2000
Impedance (Ω)
100
Frequency (MHz)
Frequency (MHz)
Z
1500
R
1000
Z
R
1500
1000
X
X
500
500
0
0
1
10
100
1000 2000
BLM18BD252SH1
3000
2500
Z
2000
R
1500
X
1000
500
0
1
10
100
Frequency (MHz)
20
1
10
100
Frequency (MHz)
Frequency (MHz)
Impedance (Ω)
1
1000 2000
1000 2000
C50E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
1
BLM21B Series
■ Features
0.5±0.2 *2
0.85±0.2 *1
The chip ferrite beads BLM series is designed to
function nearly as a resistor at noise frequencies,
which greatly reduces the possibility of resonance and
leaves signal wave forms undistorted.
BLM series is effective in circuits without stable
ground lines because BLM series does not need a
connection to ground.
The nickel barrier structure of the external
electrodes provides excellent solder heat resistance.
BLM_B series can minimize attenuation of the signal
waveform due to its sharp impedance characteristics.
Various impedances are available to match signal
frequency.
2.0±0.2
1.25±0.2
*1 BLM21BD222SH1 / 21BD272SH1
:1.25±0.2
*2 BLM21BD272SH1: 0.3±0.2
EIA CODE : 0805
(in mm)
Impedance
(at 100MHz/20°C)
(ohm)
Rated Current
(mA)
DC Resistance (max.)
(ohm)
Operating
Temperature Range
(°C)
BLM21BB050SH1
5 ±25%
500
0.07
-55 to +125
BLM21BB600SH1
60 ±25%
200
0.20
-55 to +125
BLM21BB750SH1
75 ±25%
200
0.25
-55 to +125
BLM21BB121SH1
120 ±25%
200
0.25
-55 to +125
BLM21BD121SH1
120 ±25%
200
0.25
-55 to +125
BLM21BB151SH1
150 ±25%
200
0.25
-55 to +125
BLM21BD151SH1
150 ±25%
200
0.25
-55 to +125
BLM21BB201SH1
200 ±25%
200
0.35
-55 to +125
BLM21BB221SH1
220 ±25%
200
0.35
-55 to +125
BLM21BD221SH1
220 ±25%
200
0.25
-55 to +125
BLM21BB331SH1
330 ±25%
200
0.40
-55 to +125
BLM21BD331SH1
330 ±25%
200
0.30
-55 to +125
BLM21BD421SH1
420 ±25%
200
0.30
-55 to +125
BLM21BB471SH1
470 ±25%
200
0.45
-55 to +125
BLM21BD471SH1
470 ±25%
200
0.35
-55 to +125
BLM21BD601SH1
600 ±25%
200
0.35
-55 to +125
BLM21BD751SH1
750 ±25%
200
0.40
-55 to +125
BLM21BD102SH1
1000 ±25%
200
0.40
-55 to +125
BLM21BD152SH1
1500 ±25%
200
0.45
-55 to +125
BLM21BD182SH1
1800 ±25%
200
0.50
-55 to +125
BLM21BD222TH1
2200 ±25%
200
0.60
-55 to +125
BLM21BD222SH1
2250 (Typ.)
200
0.60
-55 to +125
BLM21BD272SH1
2700 ±25%
200
0.80
-55 to +125
Part Number
■ Equivalent Circuit
(Resistance element becomes dominant
at high frequencies.)
21
C50E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
■ Impedance - Frequency (Typical)
BLM21BB Series
BLM21BD Series
3200
2000
BLM21BD272SH1
BLM21BD222SH1
BLM21BD222TH1
BLM21BD182SH1
1600
2400
BLM21BD152SH1
BLM21BD102SH1
BLM21BD751SH1
BLM21BD601SH1
BLM21BB201SH1
BLM21BB221SH1
BLM21BB750SH1
BLM21BB151SH1
800
BLM21BB121SH1
Impedance (Ω)
Impedance (Ω)
BLM21BB471SH1
BLM21BB331SH1
1200
1600
BLM21BD471SH1
BLM21BD421SH1
BLM21BD331SH1
BLM21BD221SH1
BLM21BB600SH1
800
BLM21BD151SH1
BLM21BD121SH1
BLM21BB050SH1
400
0
0
1
10
100
1
1000 2000
10
100
1000 2000
Frequency (MHz)
Frequency (MHz)
■ Impedance - Frequency Characteristics
BLM21BB050SH1
BLM21BB600SH1
400
30
300
Z
20
X
R
Impedance (Ω)
Impedance (Ω)
Z
R
200
10
X
100
0
0
1
10
100
1000 2000
1
10
Frequency (MHz)
BLM21BB750SH1
1000 2000
BLM21BB121SH1
500
400
400
Z
Z
Impedance (Ω)
Impedance (Ω)
100
Frequency (MHz)
500
300
R
200
X
100
300
R
200
X
100
0
1
10
100
0
1000 2000
1
10
Frequency (MHz)
100
1000 2000
Frequency (MHz)
BLM21BD121SH1
BLM21BB151SH1
300
800
240
600
Z
Z
180
Impedance (Ω)
Impedance (Ω)
1
R
120
R
400
X
X
200
60
0
1
10
100
Frequency (MHz)
1000 2000
0
1
10
100
1000 2000
Frequency (MHz)
Continued on the following page.
22
C50E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
Continued from the preceding page.
■ Impedance - Frequency Characteristics
BLM21BD151SH1
1
BLM21BB201SH1
300
800
Z
Z
240
600
Impedance (Ω)
Impedance (Ω)
R
180
120
X
R
400
X
200
60
0
1
10
100
0
1000 2000
1
10
Frequency (MHz)
100
1000 2000
Frequency (MHz)
BLM21BB221SH1
BLM21BD221SH1
500
1000
800
400
Z
Z
Impedance (Ω)
Impedance (Ω)
R
600
400
X
R
300
200
X
100
200
0
0
1
10
100
1
1000 2000
10
BLM21BB331SH1
1000 2000
BLM21BD331SH1
800
1200
Z
600
Impedance (Ω)
900
Impedance (Ω)
100
Frequency (MHz)
Frequency (MHz)
R
600
X
Z
R
400
X
200
300
0
0
1
10
100
1
1000 2000
10
100
1000 2000
Frequency (MHz)
Frequency (MHz)
BLM21BD421SH1
BLM21BB471SH1
2000
1000
Z
800
1500
Impedance (Ω)
Impedance (Ω)
Z
600
R
400
R
1000
X
X
500
200
0
0
1
10
100
Frequency (MHz)
1000 2000
1
10
100
1000 2000
Frequency (MHz)
Continued on the following page.
23
C50E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
Continued from the preceding page.
■ Impedance - Frequency Characteristics
BLM21BD471SH1
BLM21BD601SH1
1200
1200
900
Impedance (Ω)
Impedance (Ω)
Z
900
Z
R
600
R
600
X
X
300
300
0
1
10
100
0
1000 2000
1
10
Frequency (MHz)
100
BLM21BD751SH1
BLM21BD102SH1
1800
1500
1200
Z
900
Impedance (Ω)
Z
Impedance (Ω)
1000 2000
Frequency (MHz)
1500
R
600
X
1200
R
900
X
600
300
300
0
1
10
100
0
1000 2000
1
10
100
Frequency (MHz)
BLM21BD152SH1
BLM21BD182SH1
2500
Z
2000
2000
Z
Impedance (Ω)
Impedance (Ω)
1000 2000
Frequency (MHz)
2500
R
1500
1000
R
1500
1000
X
X
500
500
0
0
1
10
100
1
1000 2000
10
100
1000 2000
Frequency (MHz)
Frequency (MHz)
BLM21BD222TH1
BLM21BD222SH1
3000
2400
Z
2400
1800
Z
Impedance (Ω)
R
Impedance (Ω)
1
1200
R
1800
X
1200
X
600
600
0
0
1
10
100
Frequency (MHz)
1000 2000
1
10
100
1000 2000
Frequency (MHz)
Continued on the following page.
24
C50E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
Continued from the preceding page.
■ Impedance - Frequency Characteristics
1
BLM21BD272SH1
3500
3000
Impedance (Ω)
2500
Z
2000
R
1500
X
1000
500
0
1
10
100
1000 2000
Frequency (MHz)
BLM18P Series
0.4±0.2
■ Features
0.8±0.15
The chip ferrite beads BLM series is designed to
function nearly as a resistor at noise frequencies,
which greatly reduces the possibility of resonance and
leaves signal wave forms undistorted.
BLM series is effective in circuits without stable
ground lines because BLM series does not need a
connection to ground.
The nickel barrier structure of the external
electrodes provides excellent solder heat resistance.
BLM_P series can be used in high current circuits due
to its low DC resistance.
1.6±0.15
0.8±0.15
(in mm)
Impedance
(at 100MHz/20°C)
(ohm)
Rated Current
(mA)
DC Resistance (max.)
(ohm)
Operating
Temperature Range
(°C)
BLM18PG300SH1
30 (Typ.)
BLM18PG330SH1
33 ±25%
1000
0.05
-55 to +125
3000
0.025
BLM18PG600SH1
-55 to +125
60 (Typ.)
500
0.10
-55 to +125
BLM18PG121SH1
120 ±25%
2000
0.05
-55 to +125
BLM18PG181SH1
180 ±25%
1500
0.09
-55 to +125
BLM18PG221SH1
220 ±25%
1400
0.10
-55 to +125
BLM18PG331SH1
330 ±25%
1200
0.15
-55 to +125
BLM18PG471SH1
470 ±25%
1000
0.20
-55 to +125
Part Number
For the items of rated current higher than 1200mA, derating is required.
Please refer to p.32, "Derating of Rated Current".
■ Equivalent Circuit
■ Impedance - Frequency (Typical)
BLM18P Series
600
BLM18PG471SH1
BLM18PG331SH1
BLM18PG221SH1
450
Impedance (Ω)
BLM18PG181SH1
(Resistance element becomes dominant
at high frequencies.)
BLM18PG121SH1
BLM18PG600SH1
300
BLM18PG330SH1
BLM18PG300SH1
150
0
1
10
100
1000
Frequency (MHz)
25
C50E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
■ Impedance - Frequency Characteristics
BLM18PG300SH1
BLM18PG330SH1
50
60
40
45
Z
Impedance (Ω)
Impedance (Ω)
Z
30
R
20
X
30
R
15
X
10
0
0
1
10
100
1000
1
10
100
1000
Frequency (MHz)
Frequency (MHz)
BLM18PG600SH1
BLM18PG121SH1
100
200
80
150
Z
Impedance (Ω)
Impedance (Ω)
Z
60
R
40
R
100
X
50
20
X
0
0
1
10
100
1000
1
10
100
1000
Frequency (MHz)
Frequency (MHz)
BLM18PG181SH1
BLM18PG221SH1
400
280
210
300
Impedance (Ω)
Impedance (Ω)
Z
R
140
70
Z
R
200
100
X
X
0
1
10
100
0
1000
1
10
Frequency (MHz)
100
1000
Frequency (MHz)
BLM18PG331SH1
BLM18PG471SH1
600
800
450
600
Impedance (Ω)
Z
Impedance (Ω)
1
Z
300
R
150
R
400
200
X
0
1
10
100
Frequency (MHz)
26
X
1000
0
1
10
100
Frequency (MHz)
1000
C50E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
1
BLM21P Series
■ Features
0.5±0.2
0.85±0.2
The chip ferrite beads BLM series is designed to
function nearly as a resistor at noise frequencies,
which greatly reduces the possibility of resonance and
leaves signal wave forms undistorted.
BLM series is effective in circuits without stable
ground lines because BLM series does not need a
connection to ground.
The nickel barrier structure of the external
electrodes provides excellent solder heat resistance.
BLM_P series can be used in high current circuits due
to its low DC resistance.
1.25±0.2
2.0±0.2
EIA CODE : 0805
(in mm)
Impedance
(at 100MHz/20°C)
(ohm)
Rated Current
(mA)
DC Resistance (max.)
(ohm)
Operating
Temperature Range
(°C)
BLM21PG220SH1
22 ±25%
BLM21PG300SH1
30 (Typ.)
6000
0.01
-55 to +125
3000
0.015
BLM21PG600SH1
-55 to +125
60 ±25%
3000
0.025
-55 to +125
BLM21PG221SH1
220 ±25%
2000
0.050
-55 to +125
BLM21PG331SH1
330 ±25%
1500
0.09
-55 to +125
Part Number
For the items of rated current higher than 1500mA, derating is required.
Please refer to p.32, "Derating of Rated Current".
■ Equivalent Circuit
■ Impedance - Frequency (Typical)
600
BLM21PG331SH1
Impedance (Ω)
450
(Resistance element becomes dominant
at high frequencies.)
BLM21PG221SH1
BLM21PG600SH1
300
BLM21PG300SH1
BLM21PG220SH1
150
0
1
10
100
1000
Frequency (MHz)
■ Impedance - Frequency Characteristics
BLM21PG220SH1
BLM21PG300SH1
40
60
30
45
Impedance (Ω)
Impedance (Ω)
Z
R
20
Z
30
R
X
10
X
15
0
1
10
100
Frequency (MHz)
1000
0
1
10
100
1000
Frequency (MHz)
Continued on the following page.
27
C50E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
Continued from the preceding page.
■ Impedance - Frequency Characteristics
BLM21PG221SH1
120
400
90
300
Impedance (Ω)
Impedance (Ω)
BLM21PG600SH1
Z
60
R
Z
200
R
100
30
X
X
0
0
1
10
100
1000
BLM21PG331SH1
600
450
Z
R
300
150
X
0
1
10
100
Frequency (MHz)
28
1
10
100
Frequency (MHz)
Frequency (MHz)
Impedance (Ω)
1
1000
1000
C50E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
1
BLM31P Series
0.7±0.3
■ Features
1.1±0.2
The chip ferrite beads BLM series is designed to
function nearly as a resistor at noise frequencies,
which greatly reduces the possibility of resonance and
leaves signal wave forms undistorted.
BLM series is effective in circuits without stable
ground lines because BLM series does not need a
connection to ground.
The nickel barrier structure of the external
electrodes provides excellent solder heat resistance.
BLM_P series can be used in high current circuits due
to its low DC resistance.
3.2±0.2
1.6±0.2
in mm
Impedance
(at 100MHz/20°C)
(ohm)
Rated Current
(mA)
DC Resistance (max.)
(ohm)
Operating
Temperature Range
(°C)
BLM31PG330SH1
33 ±25%
BLM31PG500SH1
50 (Typ.)
6000
0.01
-55 to +125
3000
0.025
BLM31PG121SH1
-55 to +125
120 ±25%
3000
0.025
-55 to +125
BLM31PG391SH1
390 ±25%
2000
0.05
-55 to +125
BLM31PG601SH1
600 ±25%
1500
0.09
-55 to +125
Part Number
For the items of rated current higher than 1500mA, derating is required.
Please refer to p.32, "Derating of Rated Current".
■ Equivalent Circuit
■ Impedance - Frequency (Typical)
700
600
BLM31PG601SH1
Impedance (ohm)
500
(Resistance element becomes dominant
at high frequencies.)
BLM31PG391SH1
400
BLM31PG121SH1
300
BLM31PG500SH1
200
BLM31PG330SH1
100
0
1
10
100
1000
Frequency (MHz)
■ Impedance - Frequency Characteristics
BLM31PG330SH1
BLM31PG500SH1
60
80
45
60
Z
Impedance (Ω)
Impedance (Ω)
Z
R
30
X
15
R
40
X
20
0
0
1
10
100
Frequency (MHz)
1000
1
10
100
1000
Frequency (MHz)
Continued on the following page.
29
C50E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
Continued from the preceding page.
■ Impedance - Frequency Characteristics
BLM31PG121SH1
BLM31PG391SH1
200
600
450
Z
Impedance (Ω)
Impedance (Ω)
150
R
100
50
Z
R
300
150
X
X
0
0
1
10
100
1000
1
10
Frequency (MHz)
100
1000
Frequency (MHz)
BLM31PG601SH1
800
600
Z
Impedance (Ω)
R
400
X
200
0
1
10
100
1000
Frequency (MHz)
BLM41P Series
0.7±0.3
■ Features
The chip ferrite beads BLM series is designed to
function nearly as a resistor at noise frequencies,
which greatly reduces the possibility of resonance and
leaves signal wave forms undistorted.
BLM series is effective in circuits without stable
ground lines because BLM series does not need a
connection to ground.
The nickel barrier structure of the external
electrodes provides excellent solder heat resistance.
BLM_P series can be used in high current circuits due
to its low DC resistance.
1.6±0.2
1
4.5±0.2
1.6±0.2
(in mm)
Impedance
(at 100MHz/20°C)
(ohm)
Rated Current
(mA)
DC Resistance (max.)
(ohm)
Operating
Temperature Range
(°C)
60 (Typ.)
6000
0.01
-55 to +125
BLM41PG750SH1
75 (Typ.)
3000
0.025
-55 to +125
BLM41PG181SH1
180 ±25%
3000
0.025
-55 to +125
BLM41PG471SH1
470 ±25%
2000
0.05
-55 to +125
BLM41PG102SH1
1000 ±25%
1500
0.09
-55 to +125
Part Number
BLM41PG600SH1
For the items of rated current higher than 1500mA, derating is required.
Please refer to p.32, "Derating of Rated Current".
30
C50E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
■ Equivalent Circuit
1
(Resistance element becomes dominant
at high frequencies.)
■ Impedance - Frequency (Typical)
1200
250
BLM41PG181SH1
200
900
Impedance (Ω)
Impedance (Ω)
BLM41PG102SH1
150
100
600
BLM41PG471SH1
BLM41PG750SH1
300
50
BLM41PG600SH1
0
0
1
10
100
1
1000
10
Frequency (MHz)
100
1000
Frequency (MHz)
■ Impedance - Frequency Characteristics
BLM41PG600SH1
BLM41PG750SH1
100
100
75
75
Z
R
Impedance (Ω)
Impedance (Ω)
Z
R
50
X
25
50
X
25
0
0
1
10
100
1
1000
10
100
1000
Frequency (MHz)
Frequency (MHz)
BLM41PG181SH1
BLM41PG471SH1
400
600
300
450
Impedance (Ω)
Impedance (Ω)
Z
200
Z
R
300
R
X
100
150
X
0
0
1
10
100
Frequency (MHz)
1000
1
10
100
1000
Frequency (MHz)
Continued on the following page.
31
C50E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
Continued from the preceding page.
■ Impedance - Frequency Characteristics
BLM41PG102SH1
1200
900
Z
Impedance (Ω)
R
600
X
300
0
1
10
100
1000
Frequency (MHz)
■ Notice (Rating)
In operating temperatures exceeding +85D, derating of
current is necessary for chip Ferrite Beads for which rated
current is 1200mA or over. Please apply the derating curve
shown in chart according to the operating temperature.
Derating
6
6A
5
Derated Current [A]
1
4
4A
3A
3
2.5A
2
2A
1.5A
1.4A
1.2A
1 1A
0
85
Operating Temperature [D]
32
125
C50E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
1
BLM18H Series
0.4±0.2
0.8±0.15
BLM18H series has a modified internal electrode
structure, that minimizes stray capacitance and
increases the effective frequency range.
■ Features
1. BLM18H series realizes high impedance at 1GHz and
is suitable for noise suppression from 500MHz to
GHz range. The impedance value of HG/HD-type is
about three times as large as that of A/B-type at
1GHz though the impedance characteristic of
HG/HD-type is similar to A/B-type at 100MHz or less.
2. HG-type is effective in noise suppression in wide
frequency range (several MHz to several GHz).
HD-type for high-speed signal line provides a
sharper roll-off after the cut off frequency.
3. The magnetic shielded structure minimizes cross talk.
1.6±0.15
0.8±0.15
(in mm)
Part Number
Impedance
(at 100MHz/20°C)
(ohm)
Impedance
(at 1GHz/20°C)
(ohm)
Rated Current
(mA)
DC Resistance (max.)
(ohm)
Operating
Temperature Range
(°C)
BLM18HG471SH1
470 ±25%
600 (Typ.)
200
0.85
-55 to +125
BLM18HG601SH1
600 ±25%
700 (Typ.)
200
1.00
-55 to +125
BLM18HG102SH1
1000 ±25%
1000 (Typ.)
100
1.60
-55 to +125
BLM18HD471SH1
470 ±25%
1000 (Typ.)
100
1.20
-55 to +125
BLM18HD601SH1
600 ±25%
1200 (Typ.)
100
1.50
-55 to +125
BLM18HD102SH1
1000 ±25%
1700 (Typ.)
50
1.80
-55 to +125
■ Equivalent Circuit
(Resistance element becomes dominant
at high frequencies.)
■ Impedance - Frequency (Typical)
2000
4000
3000
BLM18HG102SH1
Impedance (Ω)
Impedance (Ω)
1500
BLM18HG601SH1
1000
BLM18HG471SH1
500
BLM18HD102SH1
2000
BLM18HD601SH1
BLM18HD471SH1
1000
0
1
10
100
Frequency (MHz)
1000
2000
0
1
10
100
1000 2000
Frequency (MHz)
33
C50E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
■ Impedance - Frequency Characteristics
BLM18HG471SH1
BLM18HG601SH1
1000
800
750
Z
Z
Impedance (Ω)
Impedance (Ω)
600
R
400
R
500
X
X
250
200
0
0
1
10
1000
100
1
2000
10
2000
BLM18HD471SH1
2000
1500
1500
Impedance (Ω)
Impedance (Ω)
BLM18HG102SH1
2000
Z
1000
1000
100
Frequency (MHz)
Frequency (MHz)
R
Z
1000
R
500
500
X
X
0
0
1
10
1000
100
1
2000
10
1000
100
2000
Frequency (MHz)
Frequency (MHz)
BLM18HD601SH1
BLM18HD102SH1
4000
2000
3000
1500
Impedance (Ω)
Z
Impedance (Ω)
1
1000
2000
Z
X
500
1000
R
X
R
0
0
1
10
100
Frequency (MHz)
34
1000
2000
1
10
100
Frequency (MHz)
1000
2000
C50E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
1
BLM18E Series
1.6±0.15
0.8±0.15
T
BLM18E series has a modified internal electrode
structure, that minimizes stray capacitance and
increases the effective frequency range.
0.4±0.2
■ Features
1. Low DC Resistance and a large Rated Current are
suitable for noise suppression of the driver
circuit.
2. Excellent direct current characteristics.
3. Thin type (t=0.5mm) is suitable for small and
low profile equipment such as ETC, RKE.
T
BLM18EGpppTH1
0.5±0.15
BLM18EGpppSH1
0.8±0.15
(in mm)
Impedance
(at 100MHz/20°C)
(ohm)
Impedance
(at 1GHz/20°C)
(ohm)
Rated Current
(mA)
DC Resistance (max.)
(ohm)
Operating
Temperature Range
(°C)
BLM18EG101TH1
100 ±25%
140 (Typ.)
2000
0.045
-55 to +125
BLM18EG121SH1
120 ±25%
145 (Typ.)
2000
0.04
-55 to +125
BLM18EG181SH1
180 ±25%
260 (Typ.)
2000
0.05
-55 to +125
BLM18EG221TH1
220 ±25%
300 (Typ.)
1000
0.15
-55 to +125
BLM18EG331TH1
330 ±25%
450 (Typ.)
500
0.21
-55 to +125
BLM18EG391TH1
390 ±25%
520 (Typ.)
500
0.30
-55 to +125
BLM18EG471SH1
470 ±25%
550 (Typ.)
500
0.21
-55 to +125
BLM18EG601SH1
600 ±25%
700 (Typ.)
500
0.35
-55 to +125
Part Number
For the items of rated current higher than 2000mA, derating is required.
Please refer to p.37, "Derating of Rated Current".
■ Equivalent Circuit
(Resistance element becomes dominant
at high frequencies.)
■ Impedance - Frequency (Typical)
1000
1000
800
800
BLM18EG601SH1
BLM18EG471SH1
Impedance (Ω)
Impedance (Ω)
BLM18EG391TH1
BLM18EG331TH1
600
BLM18EG221TH1
400
BLM18EG101TH1
600
BLM18EG181SH1
400
BLM18EG121SH1
200
200
0
0
1
10
100
Frequency (MHz)
1000 2000
1
10
100
1000 2000
Frequency (MHz)
Continued on the following page.
35
C50E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
Continued from the preceding page.
■ Impedance - Frequency Characteristics
BLM18EG101TH1
BLM18EG121SH1
160
200
Z
120
160
Impedance (Ω)
Impedance (Ω)
Z
R
80
40
120
R
80
X
X
40
0
1
10
100
2000
1000
0
1
Frequency (MHz)
10
100
1000
2000
Frequency (MHz)
BLM18EG181SH1
BLM18EG221TH1
400
400
300
300
Impedance (Ω)
Impedance (Ω)
Z
Z
200
R
R
100
X
0
200
X
100
1
10
100
1000 2000
0
1
Frequency (MHz)
BLM18EG331TH1
10
100
Frequency (MHz)
1000
2000
BLM18EG391TH1
600
700
450
560
Z
Impedance (Ω)
Impedance (Ω)
Z
300
R
420
R
280
X
150
140
X
0
0
1
10
100
Frequency (MHz)
1000
1
2000
10
100
1000
2000
Frequency (MHz)
BLM18EG471SH1
BLM18EG601SH1
800
1000
600
Z
750
Impedance (Ω)
Impedance (Ω)
1
R
400
Z
R
500
X
X
200
250
0
0
1
10
100
Frequency (MHz)
1000
2000
1
10
100
1000
2000
Frequency (MHz)
Continued on the following page.
36
C50E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
Continued from the preceding page.
■ Notice (Rating)
1
Derating
6
6A
5
Derated Current [A]
In operating temperatures exceeding +85D, derating of
current is necessary for chip Ferrite Beads for which rated
current is 1200mA or over. Please apply the derating curve
shown in chart according to the operating temperature.
4
4A
3A
3
2.5A
2
2A
1.5A
1.4A
1.2A
1 1A
0
85
125
Operating Temperature [D]
37
C50E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
1
Specifications and Test Methods
c Test and Measurement Conditions
<Unless otherwise specified>
Temperature: Ordinary Temp. 15 to 35°C
Humidity: Ordinary Humidity 25 to 85% (RH)
<In case of doubt>
Temperature: 20±2°C
Humidity: 60 to 70% (RH)
Atmospheric Pressure: 86 to 106kPa
c Specifications
1. Electrical Performance
No.
Item
Specifications
Test Methods
Measuring Frequency
1
Impedance
Within the specified tolerance.
Impedance Frequency Characteristics (Typical):
See the appendix.
BLM15/18/21/31/41 series
100±1MHz
BLM18HG/HD type
100±1MHz, 1GHz±1MHz
Measuring Equipment: Agilent 4291A or the equivalent
Test Fixture
BLM15/18/21/31/41 series Agilent 16192A or the equivalent
2
DC Resistance
Meet specifications.
Measuring Equipment: Digital multi-meter
2. Mechanical Performance
No.
1
2
3
4
Item
Appearance and
Dimensions
Solderability∗1
Specifications
Test Methods
Meet dimensions.
Visual Inspection and measured with micrometer.
The electrodes should be at least 95% covered with
new solder coating.
Flux: Ethanol solution of rosin, 25wt%
Pre-heating: 150±10°C, 60 to 90s
Solder: qSn/Pb=60/40
wSn-3.0Ag-0.5Cu solder
Solder Temperature: q230±5°C
w240±5°C
Immersion Time: q4±1s
w3±1s (BLM15/18 series)
w4±1s (BLM21/31/41 series)
Immersion and emersion rates: 25mm/s
Flux: Ethanol solution of rosin, 25wt%
Pre-heating: 150±10°C, 60 to 90s
Solder: Sn/Pb=60/40 or Sn-3.0Ag-0.5Cu solder
Solder Temperature: 270±5°C
Immersion Time: 10±0.5s
Immersion and emersion rates: 25mm/s
Then measured after exposure to room conditions for 48±4 hrs.
Resistance to Soldering
Heat∗1
It should be soldered on the substrate.
Applying Force (F): 4.9N (BLM15 series)
6.8N (BLM18 series)
9.8N (BLM21/31/41 series)
Applying Time: 5±1s
Bonding Strength!∗1
(Side view)
F
F
Meet Table 1, two pages ahead.
R0.5
Substrate
It should be mounting with conductive glue on the substrate.
Applying Force (F): 8N
Applying Time: 5±1s
Applying Direction as shown below.
5
Bonding Strength@∗2
∗1 Except BLM18AGpppWH1
∗2 BLM18AGpppWH1 only.
Continued on the following page.
38
1
C50E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
Specifications and Test Methods
Continued from the preceding page.
No.
6
Item
Specifications
Test Methods
It should be soldered on the glass-epoxy substrate.
Substrate: 100 Z 40 Z 1.6mm
(BLM15 series: 100 Z 40 Z 0.8mm)
(BLM18H series: 100 Z 40 Z 1.0mm)
Deflection (n): 1.0mm
(BLM15 series: 2.0mm)
Pressure jig
(BLM18H series: 2.0mm)
Speed of Applying Force: 0.5mm/s
R340 F
Deflection
Keeping Time: 30s
Bending Strength∗1
45
Meet Table 1, next page.
7
8
45
Product
(in mm)
Vibration!∗1
It should be soldered on the substrate.
Oscillation Frequency: 10 to 2000 to 10Hz for 20 min.
Total Amplitude: 1.5mm or Acceleration amplitude 49m/s2
whichever is smaller.
Testing Time: A period of 2 hours in each of 3 mutually
perpendicular directions. (Total 6 hrs.)
Vibration@∗2
It should be mounted with conductive glue on the substrate.
Oscillation Frequency: 10 to 2000 to 10Hz for 20 min.
Total Amplitude: 1.5mm or Acceleration amplitude 49m/s2
whichever is smaller.
Testing Time: A period of 2 hours in each of 3 mutually
perpendicular directions. (Total 6 hrs.)
∗1 Except BLM18AGpppWH1
∗2 BLM18AGpppWH1 only.
3. Environmental Performance (It should be soldered on the substrate.)
No.
1
2
Item
Specifications
Test Methods
Humidity
Temperature: 70±2°C
Humidity: 90 to 95% (RH)
Time: 1000 hrs. (±480hrs.)
Then measured after exposure to room conditions for
48±4 hrs.
Heat Life
Temperature: 150±3°C (BLM18AGpppWH1 only)
125±3°C (BLM15/18/21/31 series)∗ 1
85±3°C (BLM18PG330/121/181/221/331 type
BLM21PG/31PG/41PG series)
Applying Current: Rated Current
Time: 1000 hrs. (±480hrs.)
Then measured after exposure to room conditions for
48±4 hrs.
Meet Table 1, next page.
3
4
Cold Resistance
Temperature: -55±2°C
Time: 1000 hrs. (±480hrs.)
Then measured after exposure to room conditions for
48±4 hrs.
Temperature Cycle
1 Cycle
1 step: -55±03°C/30±3 min.
2 step: Room Temperature/within 5 min.
3 step: +125±30°C/30±3 min.
4 step: Room Temperature/within 5 min.
Total of 1000 cycles
Then measured after exposure to room conditions for
48±4 hrs.
∗1 Except BLM18AGpppWH1
Continued on the following page.
2
39
1
C50E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
1
Specifications and Test Methods
Continued from the preceding page.
4. Other Performance
No.
Item
Specifications
Test Methods
The products are adhered on the substrate with the conductive
glue and tested under the condition in Table, and then
measured after exposure in room condition for 1 or 2 hours.
Please refer to the figure about the equivalent circuit.
1
Capacitance for Charging and
Discharging
Resistance for Discharging R1
Resistance for
Charge R2
Applying Method
ESD Test!∗1
R2
150pF
330Ω
50 to 100MΩ
+20 times/-20 times
R1
SW1
Discharge Chip
SW2
Product
C
Discharge Return
Circuit Connection
Meet Table 1, below.
The products are adhered on the substrate with the conductive
glue and tested under the condition of Table, and then
measured after exposure in room condition for 1 or 2 hours.
2
ESD Test@∗1
Capacitance for Charging
and Discharging
Resistance for
Discharging R1
Resistance for
Charge R2
Applying Method
Applying Voltage
Machine
Model
(MM)
Human
Body Model
(HBM)
200pF
100pF
0Ω
1500Ω
1MΩ
1MΩ
±10 times
300V
±5 times
2kV
∗1 BLM18AGpppWH1 only.
Table 1.
Appearance
No damage
Impedance Change (at 100MHz)
within ±30%
DC Resistance
Meet Table 2, next page.
Continued on the following page.
40
3
C50E.pdf
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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
Specifications and Test Methods
Continued from the preceding page.
Table 2.
DC Resistance
(ohm max.)
Values After Testing
Part Number
DC Resistance
(ohm max.)
Values After Testing
BLM15AG100SH1
0.10
BLM18BA470SH1
0.65
BLM18HG601SH1
1.10
BLM21BD421SH1
0.40
BLM15AG700SH1
0.20
BLM18BB470SH1
0.35
BLM18HG102SH1
1.70
BLM21BB471SH1
0.55
BLM15AG121SH1
0.35
BLM18BD470SH1
0.40
BLM18HD471SH1
1.30
BLM21BD471SH1
0.45
BLM15AG221SH1
0.45
BLM18BB600SH1
0.35
BLM18HD601SH1
1.60
BLM21BD601SH1
0.45
BLM15AG601SH1
0.70
BLM18BA750SH1
0.80
BLM18HD102SH1
1.90
BLM21BD751SH1
0.50
BLM15AG102SH1
1.10
BLM18BB750SH1
0.40
BLM18EG101TH1
0.07
BLM21BD102SH1
0.50
BLM15BB050SH1
0.15
BLM18BA121SH1
1.00
BLM18EG121SH1
0.06
BLM21BD152SH1
0.55
BLM15BB100SH1
0.15
BLM18BB121SH1
0.40
BLM18EG181SH1
0.08
BLM21BD182SH1
0.60
BLM15BB220SH1
0.30
BLM18BD121SH1
0.50
BLM18EG221TH1
0.21
BLM21BD222SH1
0.70
BLM15BB470SH1
0.45
BLM18BB141SH1
0.45
BLM18EG331TH1
0.30
BLM21BD222TH1
0.70
0.90
0.02
Part Number
DC Resistance
(ohm max.)
Values After Testing
Part Number
BLM15BB750SH1
0.50
BLM18BB151SH1
0.47
BLM18EG391TH1
0.40
BLM21BD272SH1
BLM15BB121SH1
0.65
BLM18BD151SH1
0.50
BLM18EG471SH1
0.30
BLM21PG220SH1
BLM15BB221SH1
0.90
BLM18BB221SH1
0.55
BLM18EG601SH1
0.45
BLM15BD471SH1
0.70
BLM18BD221SH1
0.55
BLM15BD601SH1
0.75
BLM18BB331SH1
0.68
BLM15BD102SH1
1.00
BLM18BD331SH1
0.60
BLM15BD182SH1
1.50
BLM18BD421SH1
0.65
BLM21AG151SH1
0.25
BLM18BB471SH1
0.95
BLM21AG221SH1
0.30
BLM21AG121SH1
0.25
DC Resistance
(ohm max.)
Values After Testing
BLM21PG300SH1
0.03
BLM21PG600SH1
0.05
BLM21PG221SH1
0.10
BLM21PG331SH1
0.18
0.10
BLM18BD471SH1
0.65
BLM21AG331SH1
0.35
BLM31AJ601SH1
0.28
BLM18BD601SH1
0.75
BLM21AG471SH1
0.35
BLM31PG330SH1
0.02
BLM18AG151SH1
0.35
BLM18BD102SH1
0.95
BLM21AG601SH1
0.40
BLM31PG500SH1
0.05
BLM18AG221SH1
0.35
BLM18BD152SH1
1.30
BLM21AG102SH1
0.55
BLM31PG121SH1
0.05
BLM18AG331SH1
0.40
BLM18BD182SH1
1.60
BLM21BB050SH1
0.14
BLM31PG391SH1
0.10
BLM18AG471SH1
0.45
BLM18BD222SH1
1.60
BLM21BB600SH1
0.25
BLM31PG601SH1
0.18
BLM18AG601SH1
0.48
BLM18BD252SH1
1.60
BLM21BB750SH1
0.35
BLM18AG102SH1
0.60
BLM18PG300SH1
0.10
BLM21BB121SH1
0.35
BLM18AG471WH1
0.26
BLM18PG330SH1
0.05
BLM21BD121SH1
0.35
BLM41PG600SH1
0.02
BLM18AG102WH1
0.80
BLM18PG600SH1
0.20
BLM21BB151SH1
0.35
BLM41PG750SH1
0.05
BLM18BA050SH1
0.30
BLM18PG121SH1
0.10
BLM21BD151SH1
0.35
BLM41PG181SH1
0.05
BLM18BB050SH1
0.10
BLM18PG181SH1
0.18
BLM21BB201SH1
0.45
BLM41PG471SH1
0.10
BLM18BA100SH1
0.35
BLM18PG221SH1
0.14
BLM21BB221SH1
0.45
BLM41PG102SH1
0.18
BLM18BB100SH1
0.15
BLM18PG331SH1
0.195
BLM21BD221SH1
0.35
BLM18BA220SH1
0.45
BLM18PG471SH1
0.26
BLM21BB331SH1
0.50
BLM18BB220SH1
0.30
BLM18HG471SH1
0.95
BLM21BD331SH1
0.40
BLM18AG121SH1
4
Part Number
41
1
C50E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
On-Board Type (DC) EMI Suppression Filters (EMIFILr) for Automotive
Chip EMIFILr
Part Numbering
2
Chip EMIFILr Capacitor Type for Automotive
(Part Number)
NF
M
21
HC
102
R
1H
q
w
e
r
t
y
u i o
3 D
qProduct ID
yCharacteristics
Code
Product ID
NF
Chip EMI Filters Capacitor Type
wStructure
Capacitance Change (Temperature Characteristics)
C
±20%, ±22%
D
+20/-30%, +22/-33%
F
+30/-80%, +22/-82%
Code
Structure
R
±15%
M
Capacitor Type
U
-750 ±120ppm/°C
E
Block, LC Combined Type
Z
Other
eDimensions (LgW)
uRated Voltage
Code
Dimensions (LgW)
EIA
Code
Rated Voltage
21
2.0g1.25mm
0805
1A
10V
61
6.8g1.6mm
2606
1H
50V
2A
100V
rFeatures
Code
Features
iElectrode/Others
HC
For Automotive
Code
Electrode
HT
T Circuit for Heavy-duty
3
Sn Plating
9
Others
tCapacitance
Expressed by three figures. The unit is in pico-farad (pF). The first
and second figures are significant digits, and the third figure
expresses the number of zeros which follow the two figures.
42
oPackaging
Code
Packaging
L
Embossed Taping (ø180mm Reel)
K
Embossed Taping (ø330mm Reel)
B
Bulk
D
Paper Taping (ø180mm Reel)
Series
NFE
All series
NFM
C50E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
On-Board Type (DC) EMI Suppression Filters (EMIFILr) for Automotive
Chip EMIFILr Capacitor Type NFM21H Series
0.3±0.2
2
0.85±0.1
The chip "EMIFIL" NFM21H series is a chip type three
terminal EMI suppression filter. It can reduce
residual inductance to an extremely low level making
it excellent for noise suppression at high
frequencies.
0.6±0.2
2.0±0.2
1.25±0.1
(2)
■ Features
1. Wide operating temperature range (-55 to +125
degrees C)
2. Three terminal structure enables high performance
in high frequency range.
3. Uses original electrode structure which realizes
excellent solderability.
4. An electrostatic capacitance range of 22 to
470,000pF enables suppression of noise at specific
frequencies.
(3)
+0.2
0.2 -0.1
(1)
(2)
(in mm)
■ Applications
Severe EMI suppression and high impedance circuits
such as digital circuits.
Capacitance
(pF)
Rated Voltage
(Vdc)
Rated Current
(mA)
Insulation Resistance
(min.)
(M ohm)
Operating Temperature Range
(°C)
NFM21HC220U1H3
22 +20%,-20%
50
700
1000
-55 to +125
NFM21HC470U1H3
47 +20%,-20%
50
700
1000
-55 to +125
NFM21HC101U1H3
100 +20%,-20%
50
700
1000
-55 to +125
NFM21HC221R1H3
220 +20%,-20%
50
700
1000
-55 to +125
NFM21HC471R1H3
470 +20%,-20%
50
1000
1000
-55 to +125
NFM21HC102R1H3
1000 +20%,-20%
50
1000
1000
-55 to +125
NFM21HC222R1H3
2200 +20%,-20%
50
1000
1000
-55 to +125
NFM21HC223R1H3
22000 +20%,-20%
50
2000
1000
-55 to +125
NFM21HC104R1A3
100000 +20%,-20%
10
2000
1000
-55 to +125
NFM21HC224R1A3
220000 +20%,-20%
10
2000
1000
-55 to +125
NFM21HC474R1A3
470000 +20%,-20%
10
2000
1000
-55 to +125
Part Number
■ Equivalent Circuit
■ Insertion Loss Characteristics
(50Ω - 50Ω)
0
10
(1) Input
Output (3)
No polarity.
Insertion Loss (dB)
20
30
40
50
NFM21HC220U1H3
NFM21HC470U1H3
NFM21HC101U1H3
NFM21HC221R1H3
NFM21HC471R1H3
NFM21HC102R1H3
NFM21HC222R1H3
NFM21HC223R1H3
60
70
GND
(2)
80
90
100
1
NFM21HC104R1A3
NFM21HC224R1A3
NFM21HC474R1A3
10
100
1000
2000
Frequency (MHz)
43
C50E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
Specifications and Test Methods
c Test and Measurement Conditions
<Unless otherwise specified>
Temperature: Ordinary Temp. 15 to 35°C
Humidity: Ordinary Humidity 25 to 85% (RH)
<In case of doubt>
Temperature: 20±2°C
Humidity: 60 to 70% (RH)
Atmospheric Pressure: 86 to 106kPa
2
c Specifications
1. Electrical Performance
No.
Item
Specifications
Test Methods
Frequency
1
Capacitance (Cap.)
Within the specified tolerance.
22 to 100pF
220 to 470000pF
1.0±0.1MHz
1.0±0.1kHz
Voltage: 1±0.2Vrms
2
Insulation Resistance
(I.R.)
Voltage: Rated Voltage
Charging Time: 2 minutes max.
1000MΩ min.
Test Voltage
3
Withstanding Voltage
Products should not be damaged.
22 to 22000pF
100000 to 470000pF
150Vdc
30Vdc
Testing Time: 1 to 5s
Charge/Discharge Current: 50mA max.
Measured with 100mA max.
Rdc1: between signal terminals
Rdc2: between ground terminals
Rdc2
4
DC Resistance (Rdc1, 2)
22 to 2200pF: 0.3Ω max.
22000 to 470000pF: 0.03Ω max.
Rdc1
Rdc1
Rdc2
2. Mechanical Performance
No.
1
2
Item
Appearance and
Dimensions
Solderability
Specifications
Meet dimensions.
Visual Inspection and measured with micrometer.
Electrodes should be at least 90% covered with new solder coating.
Flux: Ethanol solution of rosin, 25wt%
Pre-heating: 150±10°C, 60 to 90s
Solder: qSn/Pb=60/40
wSn-3.0Ag-0.5Cu solder
Solder Temperature: q230± 5°C
w240± 3°C
Immersion Time: q2±0.5s
w3±1s
Immersion and emersion rates: 25mm/s
Meet Table 1.
Table 1
3
Resistance to
Soldering Heat
Test Methods
Appearance
Cap. Change
(%∆C)
I.R.
Rdc 1, 2
No damage
Within ± 7.5%
1000MΩ min.
22 to 2200pF
0.5Ω max.
0.05Ω max.
22000 to 470000pF
Flux: Ethanol solution of rosin, 25wt%
Pre-heating: 150±10°C, 60 to 90s
Solder: Sn/Pb = 60/40 or Sn-30Ag-0.5Cu solder
Solder Temperature: 270 ± 5°C
Immersion Time: 10±1s
Immersion and emersion rates: 25mm/s
Initial values: About 220 to 470000pF, measured after heat
treatment (150±010°C, 1 hour) and exposure in the room
condition for 48±4 hrs.
Then measured after exposure in room conditions for the
following hours.
22 to 100pF: 24±2 hrs.
220 to 470000pF: 48±4 hrs.
It should be soldered on the glass-epoxy substrate.
Applying Force: 17.6N
Applying Time: 60s
1.0
4
Bonding Strength
The electrodes should show no failure after testing.
0.8
0.6
0.6
(in mm)
Continued on the following page.
44
1
C50E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
Specifications and Test Methods
Continued from the preceding page.
No.
Item
Specifications
Test Methods
Meet Table 2.
Table 2
5
Bending Strength
Appearance
Cap. Change
(%∆C)
Rdc1, 2
No damage
22 to 2200pF
22000 to 470000pF
Appearance
Capacitance
Vibration
Rdc1, 2
R230
F
Deflection
0.5Ω max.
0.05Ω max.
No damage
Within the specified tolerance.
22 to 2200pF
0.5Ω max.
0.05Ω max.
22000 to 470000pF
2
Pressure jig
Within ± 12.5%
Meet Table 3.
Table 3
6
It should be soldered on the glass-epoxy substrate (t=1mm).
Deflection: 2.0mm
Keeping Time: 30s
45
45
Product (in mm)
It should be soldered on the glass-epoxy substrate.
Oscillation Frequency: 10 to 55 to 10Hz for 1 min.
Total Amplitude: 1.5mm
Testing Time: A period of 2 hrs. in each of 3 mutually
perpendicular directions. (Total 6 hrs.)
About 220 to 470000pF: heat treatment (150±010°C, 1 hr.)
3. Environment Performance (It should be soldered on the glass-epoxy substrate.)
No.
1
2
Item
Specifications
Humidity
Temperature: 70±2°C
Humidity: 90 to 95% (RH)
Time: 1000 hrs. (±480 hrs.)
Then measured after exposure to room conditions for the
following hours.
22 to 100pF: 24±2 hrs.
220 to 470000pF: 48±4 hrs.
Biased Humidity
Temperature: 85±2°C
Humidity: 80 to 85% (RH)
Test Voltage: Rated Voltage
Time: 1000 hrs. (±480 hrs.)
Then measured after exposure to room conditions for the
following hours.
22 to 100pF: 24±2 hrs.
220 to 470000pF: 48±4 hrs.
Meet Table 4.
Table 4
3
High Temperature
Exposure
Appearance
Cap. Change
(%∆C)
I.R.
5
No damage
Within ± 12.5%
1000MΩ min.
22 to 2200pF
0.5Ω max.
0.05Ω max.
22000 to 470000pF
Temperature: 150±2°C
Time: 1000 hrs. (±480 hrs.)
Then measured after exposure to room conditions for the
following hours.
22 to 100pF: 24±2 hrs.
220 to 470000pF: 48±4 hrs.
Heat Life
Temperature: 125±2°C
Test Voltage: Rated voltageA200%
Charge/Discharge Current: 50mA max.
Time: 1000hrs. (±480 hrs.)
Initial values: About 220 to 470000pF, measured after voltage
treatment (Maximum Operating Temperature ±2°C, Rated
VoltageA200%, 1 hour) and exposure in room condition
for 48±4 hrs.
Then measured after exposure to room conditions for the
following hours.
22 to100pF: 24±2 hrs.
220 to 470000pF: 48±4 hrs.
Cold Resistance
Temperature: -55 ± 2°C
Time: 1000 hrs. (±480 hrs.)
Then measured after exposure to room conditions for the
following hours.
22 to 100pF: 24±2 hrs.
220 to 470000pF: 48±4 hrs.
Rdc1, 2
4
Test Methods
Continued on the following page.
2
45
C50E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
Specifications and Test Methods
Continued from the preceding page.
No.
Item
Specifications
Meet Table 5.
Table 5
2
6
Temperature Cycle
Appearance
Cap. Change
(%∆C)
I.R.
Rdc1, 2
46
No damage
Within ± 7.5%
1000MΩ min.
22 to 2200pF
0.5Ω max.
0.05Ω max.
22000 to 470000pF
Test Methods
1 Cycle
1 step: -55±03 °C/30±3 minutes
2 step: Room Temperature/within 5 minutes
3 step: +125±30 °C/30 ±3 minutes
4 step: Room Temperature/within 5 minutes
Total of 1000 cycles
Initial values: About 220 to 470000pF, measured after heat
treatment (150±010°C, 1 hr.) and exposure in room condition
for 48±4 hrs.
Then measured after exposure to room conditions for the
following hours.
22 to 100pF: 24±2 hrs.
220 to 470000pF: 48±4 hrs.
3
C50E.pdf
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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
On-Board Type (DC) EMI Suppression Filters (EMIFILr) for Automotive
Chip EMIFILr LC Combined Type for Large Current NFE61H Series
2
The T-type chip EMI Filter NFE61H series consists of
a feedthrough capacitor and ferrite beads.
0.7±0.2
2.6±0.3
0.7±0.2
(1)
(2)
(3)
1.6±0.3
■ Features
1. Its large rated current of 2A and low voltage drop
due to small DC resistance are suitable for DC
power line use.
2. The feedthrough capacitor realizes excellent high
frequency characteristics.
3. The structure incorporates built-in ferrite beads
which minimize resonance with surrounding circuits.
4. 33 to 3,300pF lineups can be used in signal lines.
6.8+0.3
-0.5
1.6±0.3
(in mm)
Capacitance
(pF)
Rated Voltage
(Vdc)
Rated Current
(A)
Insulation Resistance
(min.)
(M ohm)
Operating Temperature Range
(°C)
NFE61HT330U2A9
33 +30%,-30%
100
2
1000
-55 to +125
NFE61HT680R2A9
68 +30%,-30%
100
2
1000
-55 to +125
NFE61HT101Z2A9
100 +30%,-30%
100
2
1000
-55 to +125
NFE61HT181C2A9
180 +30%,-30%
100
2
1000
-55 to +125
NFE61HT361C2A9
360 +20%,-20%
100
2
1000
-55 to +125
NFE61HT681D2A9
680 +30%,-30%
100
2
1000
-55 to +125
NFE61HT102F2A9
1000 +80%,-20%
100
2
1000
-55 to +125
NFE61HT332Z2A9
3300 +80%,-20%
100
2
1000
-55 to +125
Part Number
■ Equivalent Circuit
■ Insertion Loss Characteristics
(50Ω - 50Ω)
0
NFE61HT330U2A9
NFE61HT680R2A9
Input
(1)
Output
(3)
GND
(2)
No polarity.
Insertion Loss (dB)
10
NFE61HT101Z2A9
20
NFE61HT181C2A9
30
40
NFE61HT361C2A9
NFE61HT681D2A9
NFE61HT102F2A9
NFE61HT332Z2A9
50
60
0.1
1
10
100
1000
Frequency (MHz)
47
C50E.pdf
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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
Specifications and Test Methods
■ Test and Measurement Conditions
<Unless otherwise specified>
Temperature: Ordinary Temp. 15 to 35°C
Humidity: Ordinary Humidity 25 to 85% (RH)
<In case of doubt>
Temperature: 20±2°C
Humidity: 60 to 70% (RH)
Atmospheric Pressure: 86 to 106kPa
2
■ Specifications
1. Electrical Performance
No.
Item
Specifications
Test Methods
Table 1
Capacitance
33, 68, 100 (pF)
180, 360, 680, 1000, 3300 (pF)
Voltage
1 to 5Vrms
1±0.2Vrms
Frequency
1MHz±10%
1kHz±10%
1
Capacitance (Cap.)
Within the specified tolerance.
2
Insulation Resistance
(I.R. )
1000MΩ min.
Voltage: 100Vdc
Charging Time: 60±5s
3
Withstanding Voltage
Products should not be damaged.
Test Voltage: 250Vdc
Testing Time: 1 to 5s
Charge/Discharge Current: 10mA max.
Meet Table 2.
Table 2
Attenuating transient voltage of exponential function should be
applied to products in the following conditions.
Appearance
4
Resistance to
Surge Voltage
Cap. Change
I.R.
Withstanding
Voltage
Relay
No damage
33, 68, 100, 180,
within ±15%
360, 680 (pF)
within ±30%
1000, 3300 (pF)
1000MΩ min.
No damage
10Ω
1
Filter
2 3
100Ω
EB
0.47µF
EB 400V
Peak Voltage: 400V
Force Period: 1s
The number of Surges: 105
2. Mechanical Performance
No.
1
2
3
Item
Appearance and
Dimensions
Solderability
Resistance to
Soldering Heat
Specifications
Test Methods
Meet dimensions.
Visual Inspection and measured with micrometer.
The electrodes should be at least 75% covered with
new solder coating.
Flux: Ethanol solution of rosin, 25wt%
Pre-heat: 150±10°C, 60 to 90s
Solder: qSn/Pb = 60/40
wSn-3.0Ag-0.5Cu solder
Solder Temperature: q230±5°C
w240±3°C
Immersion Time: q4±1s
w3±1s
Immersion and emersion rates: 25mm/s
Meet Table 2, above.
Flux: Ethanol solution of rosin, 25wt%
Pre-heat: 150±10°C, 60 to 90s
Solder: Sn/Pb = 60/40 or Sn-3.0Ag-0.5Cu solder
Solder Temperature: 270±5°C
(for NFE61HT332Z2A9p: 250±5°C)
Immersion Time: 10±1s
Immersion and emersion rates: 25mm/s
Then measured after exposure in room condition for 4 to
48 hrs.
It should be soldered on the Paper-phenol substrate. (t=1.6mm)
Meet Table 3.
Table 3
4
Bending Strength
Appearance
Cap. Change
5
48
Vibration
Pressure jig
R340
No damage
33, 68, 100, 180,
within ±15%
360, 680 (pF)
within ±30%
1000, 3300 (pF)
Meet Table 2, above.
F
Deflection
45
45
Product (in mm)
Deflection: 3.0mm
Keeping Time: 30s
It should be soldered on the substrate.
Oscillation Frequency: 10 to 2000 to 10Hz for 20 min.
Total Amplitude: 1.5mm or Acceleration amplitude 49m/s2
whichever is smaller.
Testing Time: A period of 2 hours in each of 3 mutually
perpendicular directions (Total 6 hrs.)
1
C50E.pdf
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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
Specifications and Test Methods
3. Environment Performance (It should be soldered on the substrate.)
No.
1
Item
Specifications
Temperature: 85±2°C
Humidity: 85% (RH)
Time: 1000 hrs. (±480 hrs.)
Then measured after exposure in room condition for 4 to
48 hrs.
Humidity
Meet Table 4.
Table 4
Appearance
2
Heat Life
Cap. Change
I.R.
Withstanding
Voltage
3
4
2
Test Methods
No damage
33, 68, 100, 180,
within ±15%
360, 680 (pF)
within ±30%
1000, 3300 (pF)
100MΩ min.
No damage
Temperature: 125±2°C
Test Voltage:
33 to 680 (pF): Rated VoltageA200%
1000 to 3300 (pF): Rated VoltageA150%
Time: 1000 hrs. (±480 hrs.)
Then measured after exposure in room condition for 4 to
48 hrs.
Cold Resistance
Temperature: -55±2°C
Time: 500hrs. (±240 hrs.)
Then measured after exposure in room condition for 4 to
48 hrs.
Temperature Cycle
1 Cycle
1 step: -55±03°C/30±3 minutes
2 step: Room Temperature/within 5 minutes
3 step: +125±30°C/30±3 minutes
4 step: Room Temperature/within 5 minutes
Total of 500 cycles
Then measured after exposure in room condition for 4 to
48 hrs.
Meet Table 2, previous page.
2
49
C50E.pdf
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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
On-Board Type (DC) EMI Suppression Filters (EMIFILr) for Automotive
Chip Common Mode Choke Coils
Part Numbering
Chip Common Mode Choke Coils for Automotive
(Part Number)
H
DL
W
31 S
q
w
e r t
222 S
y
Q
2
L
u i o !0
qProduct ID
uCircuit
Code
Product ID
3
DL
Chip Common Mode Choke Coils
Circuit
S
Expressed by a letter.
X
wStructure
Code
Structure
W
Winding Type
iFeatures
Code
Features
Q
eDimensions (LgW)
K
Code
Dimensions (LgW)
EIA
31
3.2g1.6mm
1206
43
4.5g3.2mm
1812
rType
Code
Type
S
Magnetically Shielded One Circuit Type
tCategory
oNumber of Signal Lines
Code
Number of Signal Lines
2
Two Lines
!0Packaging
Code
Packaging
Series
K
Embossed Taping (ø330mm Reel)
DLW43S
Code
Category
L
Embossed Taping (ø180mm Reel)
H
For Automotive
B
Bulk
yImpedance (DLW31S)
Typical impedance at 100MHz is expressed by three figures. The
unit is in ohm (Ω). The first and second figures are significant
digits, and the third figure expresses the number of zeros which
follow the two figures.
yInductance (DLW43S)
Expressed by three-figures. The unit is micro-henry (µH). The first
and second figures are significant digits, and the third figure
expresses the number of zeros which follow the two figures.
50
Expressed by a letter.
P
All Series
C50E.pdf
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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
On-Board Type (DC) EMI Suppression Filters (EMIFILr) for Automotive
Chip Common Mode Choke Coil DLW31S/43S Series
(0.25)
DLW31S series is a high performance wound type
chip common mode choke coil.
1.9±0.2
DLW31S Series
■ Features
1.6±0.2
3.2±0.2
3
(1)
(2)
(4)
(3)
(0.6)
(0.6)
(0.6)
(0.6)
1. DLW31S is the small size (3.2x1.6x1.9mm).
2. Suitable for noise suppression at car area networks
like CAN (Controller Area Network) bus.
3. DLW31S has high common mode impedance so it is
suitable for noise suppression through wide
frequency range.
4. Wide operating temperature range (-40 to +125
degrees C)
(in mm)
■ Applications
Noise suppression at car area networks like CAN bus or
car navigation system.
Part Number
Common Mode Impedance
(at 100MHz/20 degree C)
(ohm)
Rated Current
(mA)
Rated Voltage
(Vdc)
Insulation Resistance
(min.)
(M ohm)
2200 ±25%
80
32
10
DLW31SH222SQ2
Withstand Voltage DC Resistance
(Vdc)
(ohm)
1.6 ±20%
80
Operating Temperature Range: -40°C to 125°C
■ Equivalent Circuit
■ Impedance - Frequency Characteristics
10000
Common mode
DLW31SH222SQ2
1000
(2)
Impedance (Ω)
(1)
100
10
DLW31SH222SQ2
(3)
(4)
No polarity.
1
Differential mode
0.1
1
10
100
1000
Frequency (MHz)
51
C50E.pdf
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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
DLW43S_XK Series
1. Small size: L4.5xW3.2xT2.6mm (EIA code: 1812)
Tolerance: +/-0.2mm
2. It realized common mode inductance of 100microH
(at 1MHz) though it is small size.
3. Common mode inductance items of 100microH and
51microH, and they can be used for each
applications.
(0.8)
4.5±0.2
3.2±0.2
(1)
(2)
(4)
(3)
■ Applications
(0.6): 100µH
(0.7): 51µH
(in mm)
For Automotive.
Common mode noise suppression of automotive LAN for
Flex Ray, CANBUS.
Common Mode Inductance
(µH)
Rated Current
(mA)
Rated Voltage
(Vdc)
Insulation Resistance
(min.)
(M ohm)
DLW43SH510XK2
51 -30%/+50% (at 1MHz)
230
50
10
125
1.0 max.
DLW43SH101XK2
100 -30%/+50% (at 1MHz)
200
50
10
125
2.0 max.
Part Number
Withstand Voltage DC Resistance
(Vdc)
(ohm)
Operating Temperature Range: -40°C to 125°C
■ Equivalent Circuit
■ Impedance - Frequency Characteristics
100000
DLW43SH101XK2
10000
(1)
(2)
Common mode
Impedance (Ω)
DLW43SH510XK2
1000
100
DLW43SH101XK2
(3)
(4)
Differential mode
10
DLW43SH510XK2
No polarity.
1
1
10
Frequency (MHz)
100
DLW43S_XP Series
■ Features
1. Small size: L4.5xW3.2xT2.7mm (EIA code: 1812)
Tolerance: +/-0.2mm
2. It realized common mode inductance of 100microH
(at 0.1MHz) though it is small size.
3. Suitable for noise suppression from low
frequency range (0.1MHz).
3.2±0.2
(1)
(2)
(4)
(3)
(0.6)
For Automotive.
Common mode noise suppression of automotive LAN for
Flex Ray etc.
DLW43SH101XP2
52
(in mm)
Common Mode Inductance
(µH)
Rated Current
(mA)
Rated Voltage
(Vdc)
Insulation Resistance
(min.)
(M ohm)
100 -30%/+80% (at 0.1MHz)
170
50
10
Operating Temperature Range: -40°C to 125°C
(0.8)
4.5±0.2
■ Applications
Part Number
(0.25)
2.7±0.2
3
(0.25)
2.6±0.2
■ Features
Withstand Voltage DC Resistance
(Vdc)
(ohm)
125
2.0 max.
C50E.pdf
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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
■ Equivalent Circuit
■ Impedance - Frequency Characteristics
10000
Common mode
1000
(2)
Impedance (Ω)
(1)
DLW43SH101XP2
100
10
(3)
(4)
DLW43SH101XP2
1
Differential mode
No polarity.
0.1
0.1
1
10
100
Frequency (MHz)
3
53
C50E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
Specifications and Test Methods
■ Test and Measurement Conditions
<Unless otherwise specified>
Temperature: Ordinary Temp. 15 to 35°C
Humidity: Ordinary Humidity 25 to 85% (RH)
<In case of doubt>
Temperature: 20±2°C
Humidity: 60 to 70% (RH)
Atmospheric Pressure: 86 to 106kPa
■ Specifications
1. Electrical Performance
No.
3
Item
Specifications
Test Methods
1
Common Mode
Impedance (Zc) *1
2
Common Mode
Inductance (Lc) *2
3
Insulation
Resistance (I.R.)
10MΩ min.
Measuring Voltage: Rated Voltage
Charging Time: 1 minute max.
4
Withstanding Voltage
Products should not be damaged.
Test Voltage: 2.5 times for Rated Voltage
Tsting Time: 1 to 5 s
Charge/Discharge Current: 1mA max.
5
DC Resistance
Meet the initial value specification.
Measuring Current: 10mA max.
(In case of doubt in the above mentioned standard conditions,
measure by 4 terminal methods.)
Within the specified tolerance.
Measuring Equipment: Agilent 4291A or the equivalent
Measuring Frequency: 100±1MHz
Measuring Equipment: Agilent 4294A or the equivalent
Measuring Frequency: 1MHz or 0.1MHz (DLW43SH101XP2)
*1 DLW31S only.
*2 DLW43S only.
2. Mechanical Performance
No.
1
2
Item
Appearance
and Dimensions
Solderability
Specifications
Meet dimensions.
The electrodes should be at least 90% covered with
new solder coating.
Test Methods
Visual Inspection and measured with micrometer.
Flux: Ethanol solution of rosin, 25wt% includes activator
equivalent to 0.06 to 0.10wt% chlorine
Pre-heating: 150±5°C, 60±5s
Solder: qSn/Pb=60/40
wSn-3.0Ag-0.5Cu solder
Solder Temperature: q230±5°C
w245±3°C
Immersion Time: q3±0.5s
w4±1s
Immersion and emersion rates: 25mm/s
Stainless tweezers
Please hold product as shown.
3
4
Resistance to
Soldering Heat
Bonding Strength
Meet Table 1, next page.
No evidence of coming off substrate.
Products should not be mechanically damaged.
Flux: Ethanol solution of rosin, 25wt% includes activator
equipment to 0.06 to 0.10wt% chlorine
Pre-heating: 150±5°C, 60±5s
Solder: Sn/Pb=60/40 or Sn-3.0Ag-0.5Cu solder
Solder Temperature: 260±5°C
Immersion Time: 10±0.5s
Immersion and emersion rates: 25mm/s
Then measured after exposure in room condition for 4 to
48 hrs.
It should be soldered on the substrate.
Applying Force (F): 10N (DLW31S Series)
17.7N (DLW43S Series)
Applying Time: 5±1s (DLW31S Series)
60s (DLW43S Series)
Pressure
Substrate
Product
Test board fixture
Continued on the following page.
54
1
C50E.pdf
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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
Specifications and Test Methods
Continued from the preceding page.
No.
5
Item
Specifications
Test Methods
It should be soldered on the Glass-epoxy substrate.
(t=1.0mm DLW31S Series)
(t=1.6mm DLW43S Series)
Deflection (n): 2.0mm
Keeping time: 5s (DLW31S Series)
60s (DLW43S Series)
Speed of Applying Force: 0.5mm/s
Pressure jig
Bending Strength
R230
Deflection
Meet Table 1, below.
6
F
45
45
Product
(in mm)
It should be soldered on the substrate.
Oscillation Frequency: 10 to 2000 to 10Hz for 20 min.
Total Amplitude 1.5mm or acceleration amplitude 49m/s2
whichever is smaller. (DLW31S Series)
Total Amplitude 3.0mm or acceleration amplitude 245m/s2
whichever is smaller. (DLW43S Series)
Testing Time: A period of 4 hrs. in each of 3 mutually
perpendicular directions. (Total 12 hrs.)
Vibration
3
3. Environmental Performance (It should be soldered on the substrate.)
No.
Item
Specifications
Test Methods
Humidity
Temperature: 85±2°C
Humidity: 85% (RH)
Time: 1000hrs. (±480 hrs.)
Then measured after exposure in room condition for 4 to
48 hrs.
2
Heat Life
Temperature: 125±2°C
Applying Current: Rated Current
Time: 1000hrs. (±480 hrs.)
Then measured after exposure in room condition for 4 to
48 hrs.
3
Cold Resistance
Temperature: -40± 2°C
Time: 1000hrs. (±480 hrs.)
Then measured after exposure in room condition for 4 to
48 hrs.
1
4
Meet Table 1, below.
1 Cycle
Step 1: -40±03°C/30±3 minutes
Step 2: Room Temperature/within 5 minutes (DLW31S Series)
Room Temperature/within 10 to 15 minutes (DLW43S Series)
Step 3: +125±30°C/30±3 minutes
Step 4: Room Temperature/within 5 minutes (DLW31S Series)
Room Temperature/within 10 to 15 minutes (DLW43S Series)
Total of 1000 cycles (DLW31S Series)
Total of 300 cycles (DLW43S Series)
Then measured after exposure in room condition for 4 to
48 hrs.
Temperature Cycle
Table 1
Appearance
Common Mode
Impedance Change
Common Mode
Inductance
Insulation Resistance
DC Resistance
Withstanding Voltage
No damage
within ±20% (DLW31S Series)
Meet the initial value specification.
(DLW43S Series)
10MΩ min.
Meet the initial value specification.
(DLW43S Series)
No damage
Continued on the following page.
2
55
C50E.pdf
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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
Specifications and Test Methods
Continued from the preceding page.
4. Test Terminal (When measuring and supplying the voltage, the following terminal is applied.)
No.
Item
1
Common Mode Impedance (Measurement Terminal)
Common Mode Inductance (Measurement Terminal)
2
Withstanding Voltage (Measurement Terminal)
Terminal to be Tested
Terminal
Terminal
Terminal
Terminal
Terminal
Terminal
Terminal
Terminal
3
3
DC Resistance (Measurement Terminal)
Terminal
4
Insulation Resistance (Measurement Terminal)
Terminal
Terminal
5
Heat Life (Supply Terminal)
Terminal
■ Measuring Method for Common Mode Impedance
Measured common mode impedance may include
measurement error due to stray capacitance, residual
inductance of test fixture.
To correct this error, the common mode impedance should
be calculated as follows;
(1) Measure admittance of the fixture (opened), Go Bo.
(2) Measure impedance of the fixture (shorted), Rs Xs.
(3) Measure admittance of the specimen, Gm Bm.
(4) Calculate corrected impedance |Z| using the formula
below.
|Z| = (Rx2+Xx2) 1/2
Where
Rx =
Xx =
56
Gm - Go
- Rs
(Gm-Go)2 + (Bm-Bo)2
-(Bm - Bo)
- Xs
(Gm-Go)2 + (Bm-Bo)2
3
C50E.pdf
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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
On-Board Type (DC) EMI Suppression Filters (EMIFILr) for Automotive
Block Type EMIFILr BNX024H/025H/012H Series
Block Type EMIFILr SMD Type
12.1±0.2
BNX02p*
(4)
7.0±0.2 1.55±0.2
1.3±0.2
0.3±0.1
(3)
(2.45)
(1)
(4)
(2)
(4)
(2)
1.0±0.3
0.3±0.1
■ Features
4.2±0.3
(3)
(1)
*
Part Number Appearance
(4) BNX024H01 BNX024
BNX025H01 BNX025
1.05±0.2
3.5±0.2
(3)
(2)
1.6±0.3
(1)
9.1±0.2
BNX024H/025H (Block Type EMIFIL for automotive) is
EMI suppression filter suppporting large cuurent,
wide frequency.
And it also support SMD mounting.
This product is effective for noise suppression
for DC switching line of automotive device and
FA/OA device, because it covers wide temperature
range from -55C degrees to 125 C degrees.
: Electrode
2.5±0.2 1.55±0.2
1. Supporting large current (15A)
2. Supporting wide frequency range
From 50kHz to 1GHz:35dB min.(BNX025)
3. Suitable for miniaturization with SMD shape.
(in mm)
(4)
4
■ Applications
Automotive devices/Displays (PDP/LCD-TV)/
Digital AV equipments/Amusement equipments/
PC peripheral equipments/Industry equipments/
Measurement equipments/Power supplies
Rated
Voltage
(Vdc)
Part Number
Withstand
Voltage
(Vdc)
Rated
Current
(A)
Insulation
Resistance (min.)
(M ohm)
Insertion Loss
BNX024H01
50
125
15
100
100kHz to 1GHz:35dB min. (20 to 25 degrees C line impedance=50 ohm)
BNX025H01
25
62.5
15
50
50kHz to 1GHz:35dB min. (20 to 25 degrees C line impedance=50 ohm)
Operating Temperature Range: -55°C to 125°C
■ Equivalent Circuit
■ Insertion Loss Characteristics
BNX024H01
0
10
20
(1)
L3
C2
B
L2
CB (2)
C1
CG (4)
(3) PSG
Insertion Loss (dB)
L1
30
40
50
60
70
(1)-(4): Terminal Number
PSG: Power Supply Ground
CG: Circuit Ground
CB: Circuit+B
80
90
100
0.01
0.1
1
10
Frequency (MHz)
100
1000
Continued on the following page.
57
C50E.pdf
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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
Continued from the preceding page.
■ Insertion Loss Characteristics
BNX025H01
0
10
Insertion Loss (dB)
20
30
40
50
60
70
80
90
100
0.01
0.1
1
10
Frequency (MHz)
100
1000
■ Derating of Rated Current
Derating
15
Derated Current (A)
1
0
-40
85
125
Operating Temperature (°C)
Block Type EMIFILr Lead Type
(1)
(3)
11.0±0.2
BNX012H series is noise suppression filter and ESD
surge protection filter for Automotive.
Suitable for the power supply circuits which is large
current and wide frequency range.
(4)
(2)
8.0±0.5
BNX012H
2D
1. Large rated current(15A) and Low DC Resistance
(0.8m ohm-Typ.)
2. High insertion loss characteristic over a wide
frequency range of 1MHz to 1GHz.
3. Low profile (height: 8.0mm except lead terminal)
(4)
0.8
±0.1
ø0.8
7.5±0.2
4.0±0.5
■ Features
12.0±0.5
12.0±0.2
3.2±0.5
4
In operating temperatures exceeding +85°C, derating of
current is necessary for BNX024H/025H series. Please
apply the derating curve shown in chart according to the
operating temperature.
2.5±0.2
ø0.8
ø0.8
0.6
±0.1
(4)
2.5±0.2
(in mm)
■ Applications
Noise suppression and ESD surge protection for power
lines such as ECU, DC-DC Converters , and Inverter
circuits.
Part Number
BNX012H01
Rated
Voltage
(Vdc)
Withstand
Voltage
(Vdc)
Rated
Current
(A)
Insulation
Resistance (min.)
(M ohm)
Insertion Loss
50
125
15
500
1MHz to 1GHz:40dB min. (20 to 25 degrees C line impedance=50 ohm)
Operating Temperature Range: -55°C to 125°C
58
C50E.pdf
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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
■ Equivalent Circuit
■ Insertion Loss Characteristics
(50Ω - 50Ω)
0
10
(1)
20
L3
C2
B
L2
CB (2)
C1
CG (4)
(3) PSG
(1)-(4): Terminal Number
PSG: Power Supply Ground
CG: Circuit Ground
CB: Circuit+B
Insertion Loss (dB)
L1
30
40
50
60
70
80
90
0.1
1
10
100
1000
Frequency (MHz)
In operating temperatures exceeding +85°C, derating of
current is necessary for BNX012H series. Please apply the
derating curve shown in chart according to the operating
temperature.
Derating
15
Derated Current (A)
■ Derating of Rated Current
" Rating
4
10
3
0
-55
105
85
125
Operating Temperature (°C)
" Connecting ± Power Line
In case of using ± power line, please connect to each
terminal as shown.
Power Supply
(BNX Input)
Power Supply W Bias
Power Supply Ground
Power Supply Y Bias
Power Supply Ground
BNX
Circuit
(BNX Output)
B
PSG
CB
CG
Load Circuit W Bias
B
PSG
CB
CG
Load Circuit Y Bias
Load Circuit Ground
Load Circuit Ground
59
C50E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
Specifications and Test Methods
BNX024H/025H series Specifications and Test Methods
c Test and Measurement Conditions
<Unless otherwise specified>
Temperature: Ordinary Temp. 15 to 35°C
Humidity: Ordinary Humidity 25 to 85% (RH)
<In case of doubt>
Temperature: 20°C±2°C
Humidity: 60 to 70% (RH)
Atmospheric pressure: 86 to 106kPa
c Specifications
1. Electrical Performance
No.
1
Item
Insulation Resistance
Specifications
Test Methods
BNX024H01: 100MΩ min.
BNX025H01: 50MΩ min.
Measured at DC rated voltage between terminal (1)(2) and
(3)(4).
Time: 60s max.
Charging Current: 50mA max.
Measuring Equipment: R8340A or the equivalent
2
Dielectric Strength
Filter should not fail.
Withstanding voltage shall be applied between terminal (1)(2)
and (3)(4).
Test Voltage: BNX024H01 125V (DC)
BNX025H01 62.5V (DC)
Time: 5±1s
Charging current: 50mA max.
3
DC Resistance
0.43±0.20mΩ
Measured by the way of 4 terminal method between (1) and (2)
and between (3) and (4).
Capacitance
BNX024H01: 4.7µF±15%
BNX025H01: 10µF±15%
Measured by the follwing condition between Terminal (1)(2)
and (3)(4).
Frequency: 1±0.1kHz
Voltage: 1V (rms) max.
Measuring Equipment: HP4278A or the equivalent
4
4
50Ω
10dB
Attenuator
Balun
1
2
Specimen
50Ω
3
50Ω
10dB
Attenuator
4
E
5
Insertion Loss
BNX024H01: 35dB min. (100kHz to 1GHz)
BNX025H01: 35dB min. (50kHz to 1GHz)
50Ω
SG
*Method of measurement based on MIL-STD-220
Insertion Loss = -20 log E1/E0 (dB)
E0: Level without FILTER (short)
E1: Level with FILTER
After soldering the part on the test substrate, measure the
voltage with passing the rated current as shown in the
schematic below.
A
(i)
V
Specimen
(ii)
6
Voltage Drop
45mV max.
Where the terminals of the part shall be connected as follows:
Referring to the terminal No. shown in item 5, connect terminal
No. (2) and (4) by soldering copper wire with diameter more
than 1mm / length less than 6mm.
Then connect terminal No. (1) as (i) and terminal No. (3) as (ii)
the measurement circuit as mentioned above.
The probe for measuring the voltage shall be touched on the
solder fillet of (1)(3).
Continued on the following page.
60
1
C50E.pdf
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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
Specifications and Test Methods
BNX024H/025H series Specifications and Test Methods
Continued from the preceding page.
2. Mechanical Performance
No.
Item
Specifications
Test Methods
1
Appearance and
Dimensions
Meet dimensions.
Visual Inspection and measured with micrometer caliper and
slid caliper.
2
Marking
Marking can be read easily.
It is inspected Visually.
3
Reflow Solderability
Appropriate solder fillet is formed.
Comfirm the solder mounting condition after mounting based
on standard solder mounting method.
4
Resistance to
Soldering Heat
Soldering Iron: 100W max.
Tip Temperature: 450±5°C
Soldering Time: 5s, 2 times
Do not touch the products directly with the tip of the soldering
iron.
Meet Table 1.
Table 1
Appearance
Insulation Resistance
5
Bending Strength
Dielectric Strength
Capacitance Change
No damaged
BNX024H01: 100MΩ min.
BNX025H01: 50MΩ min.
No failure
Within ±7.5%
It shall be soldered on the glass-epoxy substrate.
(100mm x 40mm x 1.6mm)
Pressure jig
F
R230
Deflection
45
45
Product
(in mm)
4
Deflection: 2mm
Keeping Time: 30s
Speed: 0.5mm/s
6
It shall be dropped on concrete or steel board.
Method: free fall
Height: 1m
The Number of Time: 10 times
Drop
Meet Table 2.
Table 2
7
Vibration
Appearance
Insulation Resistance
Dielectric Strength
Capacitance Change
8
No damaged
BNX024H01: 100MΩ min.
BNX025H01: 50MΩ min.
No failure
Within ±15%
Shock
It shall be soldered on the glass-epoxy substrate.
Oscillation Frequency: 10 to 2000 to 10Hz for 20 minutes
Total amplitude 3.0mm or Acceleration amplitude 196m/s2
whichever is smaller.
Time: A period of 3 hours in each of 3 mutually perpendicular
directions. (Total 9 hours)
It shall be soldered on the glass-epoxy substrate.
Acceleration: 14700m/s2
Normal duration: 0.5ms
Waveform: Half-sine wave
Direction: 6 direction
Testing Time: 3 times for each direction
3. Environmental Performance (It should be soldered on the substrate.)
No.
Item
Specifications
Meet Table 3.
Table 3
1
Biased Humidity
Appearance
Insulation Resistance
Capacitance Change
No damaged
BNX024H01: 5MΩ min.
BNX025H01: 2.5MΩ min.
Within ±12.5%
Meet Table 4.
Table 4
2
Heat Life
Appearance
Insulation Resistance
Capacitance Change
3
2
Heat Shock
Meet Table 4.
No damaged
BNX024H01: 10MΩ min.
BNX025H01: 5MΩ min.
Within ±12.5%
Test Methods
Temperature: 85±2°C
Humidity: 80 to 85% (RH)
Voltage: Rated Voltage
Time: 1000±48
0hrs.
Then measure values after exposure in room condition for
48±4 hours.
Temperature: 125±2°C
Voltage: Rated Voltage x 2
Time: 1000±48
0hrs.
Then measure values after exposure in room condition for
48±4 hours.
1 Cycle:
3
1 step: -55±0
3°C/30± 0min.
2 step: Room Temperature/within 0.5 min.
3
3 step: +125±3
0°C/30± 0min.
4 step: Room Temperature/within 0.5 min.
Total Cycles: 1000 cycles
Then measure values after exposure in room condition for
48±4 hours.
61
C50E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
Specifications and Test Methods
BNX012H series Specifications and Test Methods
c Test and Measurement Conditions
<Unless otherwise specified>
Temperature: Ordinary Temp. 15 to 35°C
Humidity: Ordinary Humidity 25 to 85% (RH)
<In case of doubt>
Temperature: 20°C±2°C
Humidity: 60 to 70% (RH)
Atmospheric pressure: 86 to 106kPa
c Specifications
1. Electrical Performance
No.
1
Item
Insulation Resistance
Specifications
Test Methods
500MΩ min.
Measured at DC rated voltage between terminal (1)(2) and
(3)(4).
Voltage: 50Vdc
Charging time: 2 minutes
Suitable resistor: 1MΩ
2
Dielectric Strength
Filter should not fail.
Test voltage should be applied between terminal (1)(2) and
(3)(4).
Test Voltage: 125Vdc
Testing Time: 1 to 5s
Charge/Discharge Current: 50mA max.
3
Capacitance
1.0µF±15%
Measured at the following conditions between terminal (1)(2)
and (3)(4).
Frequency: 1.0±0.1kHz
Voltage: 1Vrms max.
4
Measured by the following circuit.
Measuring Equipment: R3767 C (manufactured by
ADVANTEST) or the equivalent.
Sample: build product into Balun.
NETWORK ANALYZER
Port 1 (50Ω)
4
Insertion Loss
Port 2 (50Ω)
40dB min. (1MHz to 1GHz)
Balun (*) Product
(1)
(2)
1 2
3 4
(3)
(3)
(*): It uses the Balun or 1 to 1 transformer.
Rated Current: 15 A
Substrate: 100x100x1.6mm (paper-phenol)
Soldering: Insert the terminals into the holes on P.C. board
completely.
Voltage Drop Value: V1+V2
V1
Product
(4)
(3)
(2)
(1)
(1) to (4): Terminal
A
5
Voltage Drop
35mV max.
V2
Substrate
Probe of each voltmeter should contact the center of soldering
parts as shown in the following figure.
Paper-phenol
Substrate
Probe
Copper foil pattern
Solder
Product’s Terminal
Continued on the following page.
62
1
C50E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
Specifications and Test Methods
BNX012H series Specifications and Test Methods
Continued from the preceding page.
2. Mechanical Performance
No.
Item
Specifications
Test Methods
1
Appearance and
Dimensions
Meet dimensions.
Visual Inspection and measured with micrometer.
2
Marking
Marking can be read easily.
It is inspected Visually.
Flux: Ethanol solution of rosin, 25(wt)%
Pre-Heating: 150±10°C, 60 to 90s
Solder: Sn-3.0Ag-0.5Cu
Solder Temperature: 235±0
5°C
Immersion Time: 5±0.5s
3
Solderability
The lead is covered with a new solder coating at least
95% of the total surface of the immersed part.
BNX012H
61
1.6±0.8mm
Molten Solder
Meet Table 1.
Table 1
4
Resistance to
Soldering Heat
Appearance
Insulation Resistance
Dielectric Strength
Capacitance Change
No damage
500MΩ min.
No failure
Within ±7.5%
Meet Table 2.
Table 2
5
No damage
500MΩ min.
No failure
1.0µF±15%
Appearance
Insulation Resistance
Dielectric Strength
Capacitance
Vibration
Flux: Ethanol solution of rosin, 25(wt)%
Pre-Heating: 150±10°C, 60 to 90s
Solder: Sn-3.0Ag-0.5Cu
Solder Temperature: 270±10°C
Immersion Time: 10±2
0s
Then measure values after exposure in room condition for 24
to 48 hrs.
4
It should be soldered on the substrate.
Oscillation Frequency: 10 to 2000 to 10Hz for 20min.
Testing Time: A period of 3 hours in each of 3 mutually
perpendicular directions. (Total 9 hrs.)
Total amplitude 1.5mm or Acceleration amplitude 196m/s2
whichever is smaller.
Then measure values after exposure in room condition for 4 to
24 hrs.
3. Environmental Performance (It should be soldered on the substrate.)
No.
1
2
Item
Humidity
Specifications
Temperature: 85±2°C
Humidity: 80 to 85%(RH)
Time: 1000±48
0hrs.
Remove the drops and then measure values after exposure in
room condition for 24 to 48 hrs.
Meet Table 1.
Temperature: 85±2°C
Humidity: 80 to 85%(RH)
Test Voltage: 50Vdc
Time: 1000±48
0hrs.
Remove the drops and then measure values after exposure in
room condition for 24 to 48 hrs.
Biased Humidity
Meet Table 3.
Table 3
No damage
50MΩ min.
Within ±12.5%
Temperature: 125±2°C
Test Voltage: 100Vdc
Time: 1000±48
0hrs.
Then measure values after exposure in room condition for 24
to 48 hrs.
3
Heat Life
4
Cold Resistance
Temperature: -55±2°C
Time: 1000±48
0hrs.
Then measure values after exposure in room condition for 24
to 48 hrs.
Temperature Cycle
1 Cycle:
1 step: -55±0
3°C/30 minutes
2 step: Room Temperature/within 1 minute
3 step: +125±3
0°C/30 minutes
4 step: Room Temperature/within 1 minute
Total of 1000 cycles
Then measure values after exposure in room condition for 24
to 48 hrs.
5
2
Appearance
Insulation Resistance
Capacitance Change
Test Methods
Meet Table 1.
63
C50E.pdf
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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
Chip EMIFILr!Caution/Notice
■ !Caution (Rating)
1. Do not use products beyond the rated current and rated
voltage as this may create excessive heat and
deteriorate the insulation resistance.
2. Be sure to provide an appropriate fail-safe
function on your product to prevent a second damage
that may be caused by the abnormal function or
the failure our product.
■ !Caution (Soldering and Mounting)
1. Self-heating
4
Please provide special attention when mounting chip
"EMIFIL" (BLM_P) series in close proximity to other
products that radiate heat.
The heat generated by other products may deteriorate
the insulation resistance and cause excessive heat in this
component.
2. Mounting Direction
Mount Chip Common Mode Choke Coils (DLW31S/43S)
in right direction. Wrong direction, which is 90 degrees
rotated from right direction, causes not only open or short
circuit but also flames or other serious trouble.
Z
right direction
Z
wrong direction
■ Notice (Storage and Operating Condition)
< Operating Environment >
Do not use products in a chemical atmosphere such as
chlorine gas, acid or sulfide gas.
< Storage and Handling Requirements >
1. Storage Period
BLM series should be used within 6 months, the
other series should be used within 12 months.
Products to be used after this period should be
checked for solderability or bondability with
glue.
2. Storage Conditions
(1) Storage temperature: -10 to 40 degrees C
Relative humidity: 30 to 70%
Avoid sudden changes in temperature and humidity.
(2) Do not store products in a chemical atmosphere
such as chlorine gas, acid or sulfide gas.
■ Notice (Soldering and Mounting)
1. Washing
Failure and degradation of a product are caused
by the washing method. When you wash in conditions
that are not in mounting information, please contact
Murata engineering.
2. Soldering
Reliability decreases with improper soldering
methods. Please solder by the standard soldering
conditions shown in mounting information.
3. Mounting on-boad with Conductive Glue
BLM18AG_WH is designed for conductive glue
mounting method. Please refer to Mounting
infomation.
64
4. Other
Noise suppression levels resulting from Murata's
EMI suppression filters "EMIFIL" may vary,
depending on the circuits and ICs used, type of
noise, mounting pattern, mounting location, and
other operating conditions. Be sure to check and
confirm in advance the noise suppression effect
of each filter, in actual circuits, etc. before
applying the filter in a commercial-purpose
equipment design.
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
C50E.pdf
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
Chip EMIFILr!Caution/Notice
■ Notice (Handling)
1. Resin coating (DLW31S)
Do not make any resin coating DLW31S series.
The impedance value may change due to high
cure-stress of resin to be used for coating/ molding
products.
An open circuit issue may occur by mechanical
stress caused by the resin, amount/ cured shape of
resin, or operating condition etc. Some resin
contains some impurities or chloride possible to
generate chlorine by hydrolysis under some operating
condition may cause corrosion of wire of coil,
leading to open circuit.
So, please pay your careful attention in selecting
resin in case of coating/ molding the products with
the resin.
2. Resin coating (DLW43S)
The inductance value may change due to high
cure-stress of resin to be used for
coating/ molding products.
An open circuit issue may occur by mechanical
stress caused by the resin, amount/ cured shape of
resin, or operating condition etc. Some resin
contains some impurities or chloride possible to
generate chlorine by hydrolysis under some operating
condition may cause corrosion of wire of coil,
leading to open circuit.
So, please pay your careful attention in selecting
resin in case of coating/ molding the products with
the resin. Prior to use the coating resin,
please make sure no reliability issue is observed
by evaluating products mounted on your board.
3. Resin coating (Except DLW31S/43S)
It may affect the product's performance when using
resin for coating/ molding products, except
DLW31S/43S.
So please pay careful attention in selecting resin.
Prior to use, please evaluate reliability with the
product mounted in your application set.
4. Caution for use (DLW31S/43S)
Sharp material, such as a pair of tweezers,
should not touch the winding portion to prevent
breaking the wire.
Mechanical shock should not be applied to the
products mounted on the board to prevent breaking
the core.
4
65
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
C50E.pdf
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
Lead Type EMIFILr!Caution/Notice
■ Notice (Rating)
Do not use products beyond the rated current and rated
voltage as this may create excessive heat and
deteriorate the insulation resistance.
■ Notice (Soldering and Mounting)
Mounting holes should be designed as specified in these
specifications. Other designs than shown in these
specifications may cause cracks in ceramics which may
lead to smoking or firing.
■ Notice (Storage and Operating Condition)
4
<Operating Environment>
1. Do not use products in a chemical atmosphere such
as chlorine gas, acid or sulfide gas.
2. Do not use products near water, oil or organic
solvents. Avoid environment where dust or dirt may
adhere to product.
<Storage and Handling Requirements>
1. Storage Period
Used the products within 12 months after delivery.
Solderability should be checked if this period is
exceeded.
2. Storage Conditions
(1) Storage temperature: -10 to 40 degrees C
Relative humidity: 30 to 70%
Avoid sudden changes in temperature and
humidity.
(2) Do not store products in a chemical atmosphere
such as chlorine gas, acid or sulfide gas.
■ Notice (Soldering and Mounting)
1. Washing
Failure and degradation of a product are caused
by the washing method. When you wash in conditions
that are not in mounting information, please
contact Murata engineering.
2. Soldering
Reliability decreases with improper soldering
methods. Please solder by the standard soldering
conditions shown in mounting information.
66
3. Other
Noise suppression levels resulting from Murata's
EMI suppression filters "EMIFIL" may vary,
depending on the circuits and ICs used, type of
noise, mounting pattern, mounting location, and
other operating conditions. Be sure to check and
confirm in advance the noise suppression effect
of each filter, in actual circuits, etc. before
applying the filter in a commercial-purpose
equipment design.
C50E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
Chip EMIFILr (Soldering and Mounting)
1. Standard Land Pattern Dimensions
Land Pattern
+ Solder Resist
Land Pattern
Solder Resist
oReflow and Flow
BLM Series (Except BLMppP series)
BLMppP
c
d (pattern)
c
BLM15
BLM18
BLM21
BLM31
BLM41
(in mm)
a
b
Type
BLM15∗1
a
b
Soldering
a
b
c
Reflow
0.4
1.2-1.4
0.5
BLM18∗2
(Except 18PG)
Reflow
BLM21
(Except 21PG)
Flow/
Reflow
1.2
3.0-4.0
1.0
BLM31
(Except 31PG)
Flow/
Reflow
2.0
4.2-5.2
1.2
Flow
0.7
Rated
Current Soldering a
(A)
Type
2.2-2.6
0.7
1.8-2.0
BLM21PG
0.7
0.7
1.2
0.7
1.5
1.0
1.0
1.0
2
1.2
1.0
1.0
2.4
1.2
1.0
6.4
3.3 1.65
1.2
1.2
1.2
2.4
1.2
1.2
6.4
3.3 1.65
1.2
1.2
1.2
2.4
1.2
1.2
6.4
3.3 1.65
1.2 3.0-4.0 1.0
3
Flow/
Reflow
1.5/2
BLM31PG
BLM18A_WH series
is designed for
conductive glue
mounting method,
not for normal
soldering method.
Please contact us
for applicable
mounting method for
BLM18A_WH series.
NFM21H
18µm 35µm 70µm
0.7
6
∗2
3
2.0 4.2-5.2
6
1.2
1-2
BLM41PG
Land pad thickness
and dimension d
0.7
2
3
∗1 BLM15 is specially adapted for reflow soldering.
c
0.7
Flow
2.2-2.6
0.7 1.2
0.7
Reflow
1.8-2.0
2.4
0.5-1.5
BLM18PG
b
3
3.0 5.5-6.5
6
4
• Do not apply narrower pattern than listed above to BLMppP.
Narrow pattern can cause excessive heat or open circuit.
o Reflow Soldering
Chip mounting side
d
e
f
g
Small diameter thru hole ø0.4
a
b
c
Size (mm)
Part Number
NFM21H
b
c
d
e
f
g
0.6
1.4
2.6
0.6
0.8
1.9
2.3
• NFM21 is specially adapted for reflow soldering.
o Reflow Soldering
o Flow Soldering (Except NFE61HT332)
Chip mounting side
Chip mounting side
2.0
4.8
8.8
3.2
3.6
Small diameter thru hole ø0.4
0.6
1.2
Small diameter thru hole ø0.4
1.6
2.6
3.0
NFE61H
a
The chip EMI filter suppresses noise by conducting the highfrequency noise to ground. Therefore, to get enough noise
reduction, feed through holes which are connected to groundplane should be arranged according to the figure to reinforce
the ground pattern.
1.5
3.8
4.8
9.0
Continued on the following page.
67
C50E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
Chip EMIFILr (Soldering and Mounting)
Continued from the preceding page.
Land Pattern
+ Solder Resist
Land Pattern
Solder Resist
oReflow Soldering
∗ 1 : If the pattern is made with wider than 1.6mm (DLW31S) it
may result in components turning around, because
melting speed is different. In the worst case, short circuit
between lines may occur.
∗ 2 : If the pattern is made with less than 0.4mm, in the worst
case, short circuit between lines may occur due to spread
of soldering paste or mount placing accuracy.
∗ 3 : If the pattern is made with wider than 1.6mm (DLW31S),
the bending strength will be reduced.
Do not use gilded pattern; excess soldering heat may dissolve
metal of a copper wire.
d
∗1
c
∗2
DLW31S
(in mm)
∗3
a
b
Series
DLW31S
DLW43S
a
b
c
d
1.6
3.7
0.4
1.6
oReflow Soldering
∗ 1 : If the pattern is made with wider than 3.4mm, it may result
in components turning around, because melting speed is
different. In the worst case, short circuit between lines
may be occur.
∗ 2 : If the pattern is made with less than 1.6mm, in the worst
case, short circuit between lines may occur due to the
spread of soldering paste or mount placing accuracy.
∗ 3 : If the pattern is made with wider, the strength of bending
will be reduced.
Do not use gilded pattern; excess soldering heat may dissolve
metal of a copper wire.
3.4 ∗1
1.6
∗2
4
∗3
a
5.9
Series
DLW43SH510XK2
DLW43SH101XK2
DLW43SH101XP2
a
3.0
3.2
2. Solder Paste Printing and Adhesive Application
When reflow soldering the chip EMI suppression filter, the
printing must be conducted in accordance with the
following cream solder printing conditions.
If too much solder is applied, the chip will be prone to
damage by mechanical and thermal stress from the PCB
and may crack. In contrast, if too little solder is applied,
there is the potential that the termination strength will be
insufficient, creating the potential for detachment.
Standard land dimensions should be used for resist and
copper foil patterns.
When flow soldering the EMI suppression filter, apply the
adhesive in accordance with the following conditions.
If too much adhesive is applied, then it may overflow into
the land or termination areas and yield poor solderability.
In contrast, if insufficient adhesive is applied, or if the
adhesive is not sufficiently hardened, then the chip may
become detached during flow soldering process.
(in mm)
Series
Adhesive Application
oEnsure that solder is applied smoothly to a
minimum height of 0.2mm to 0.3mm at the end
surface of the part.
oCoat the solder paste a thickness: 100-200µm
0.2−0.3mm min.
BLM15
BLM18
BLM21
BLM31
BLM41
Solder Paste Printing
Coating amount is illustrated in the
following diagram.
Chip Solid Inductor
a:20−70µm
b:30−35µm
c:50−105µm
a
c
PCB
Bonding agent
Land
b
Continued on the following page.
68
C50E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
Chip EMIFILr (Soldering and Mounting)
Continued from the preceding page.
(in mm)
Series
Adhesive Application
0.8
1.9
oUse Sn/Pb=60/40 or Sn-3.0Ag-0.5Cu solder for
pattern printing. Use of Sn-Zn based solder will
deteriorate performance of products. If using
Sn-Zn based solder, please contact Murata in
advance.
oCoat the solder paste a thickness: 100-150µm
0.6
NFM21H
Solder Paste Printing
0.6
1.4
2.6
Apply 1.0mg of bonding agent at each chip.
oUse Sn/Pb=60/40 or Sn-3.0Ag-0.5Cu solder for
pattern printing.
oCoat the solder paste a thickness: 150-200µm
0.6
4
1.6
2.6
1.2
3.2
NFE61H
1.5
4.8
8.8
1.5
4.8
9.0
Bonding agent
Bonding agent
*Except NFE61HT332
d
oUse Sn/Pb=60/40 or Sn-3.0Ag-0.5Cu solder for
pattern printing.
oCoat the solder paste a thickness: 100-150µm
*Solderability is subject to reflow condition and thermal
conductivity. Please make sure that your product has
been evaluated in view of your specifications with our
product being mounted to your product.
c
DLW31S
Series
a
b
b
c
d
d
oUse Sn/Pb=60/40 or Sn-3.0Ag-0.5Cu solder for
pattern printing.
oCoat the solder paste a thickness: 150µm
*Solderability is subject to reflow condition and thermal
conductivity. Please make sure that your product has
been evaluated in view of your specifications with our
product being mounted to your product.
c
DLW43S
a
1.6 3.7 0.4 1.6
DLW31S
Series
a
b
a
b
c
d
3.0 (510)
5.9 1.6 3.4
DLW43S
3.2 (101)
Continued on the following page.
69
C50E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
Chip EMIFILr (Soldering and Mounting)
Continued from the preceding page.
3. Standard Soldering Conditions
(1) Soldering Methods
Use flow and reflow soldering methods only.
Use standard soldering conditions when soldering chip
EMI suppression filters.
In cases where several different parts are soldered, each
having different soldering conditions, use those
conditions requiring the least heat and minimum time.
Solder: H60A H63A solder (JIS Z 3238)
In case of lead-free solder, use Sn-3.0Ag-0.5Cu
solder. Use of Sn-Zn based solder will deteriorate
performance of products. If using NFM series with
Sn-Zn based solder, please contact Murata in
advance.
(2) Soldering Profile
oFlow Soldering profile
(Eutectic solder, Sn-3.0Ag-0.5Cu solder)
oReflow Soldering profile
qSoldering profile for Lead-free solder (Sn-3.0Ag-0.5Cu)
T3
T2
t2
Heating
T1
Limit Profile
Standard Profile
Temperature (°C)
T4
Temperature (°C)
T2
T1
T3
180
150
Limit Profile
Pre-heating
t1
Standard Profile
t2
Pre-heating
t1
Series
Pre-heating
90s±30s
time (s)
Standard Profile
Heating
Limit Profile
Heating
Cycle
Cycle
Temp. (T1) Time. (t1) Temp. (T2) Time. (t2) of flow Temp. (T3) Time. (t2) of flow
BLM
2
2
5s
(Except BLM15) 150°C 60s 250°C 4 to 6s times 265
times
min.
max.
±3°C
max.
max.
NFE61H*
*Except NFE61HT332
time (s)
Standard Profile
Series
Limit Profile
Peak
Peak
Heating
temperature Cycle
temperature Cycle
of
reflow
Temp. (T1) Time. (t1) (T2)
Temp. (T3) Time. (t2) (T4) of reflow
Heating
BLM, NFE
230°C 60s 260°C
NFM,
min. max. /10s
DLW31S 220°C 30 to 245 2 times
2 times
min. 60s ±3°C max.
max.
240°C
30s
DLW43S
260°C
min. max.
wSoldering profile for Eutectic solder
(Limit profile: refer to q)
T3
Temperature (°C)
4
Flux:
o Use Rosin-based flux.
In case of DLW31/43 series, use Rosin-based flux with
converting chlorine content of 0.06 to 0.1wt%.
In case of using RA type solder, products should be
cleaned completely with no residual flux.
o Do not use strong acidic flux (with chlorine content
exceeding 0.20wt%)
o Do not use water-soluble flux.
T2
T1
t2
Standard Profile
t1
Series
time (s)
Standard Profile
Pre-heating
Heating
Temp. (T1) Time. (t1) Temp. (T2) Time. (t2)
BLM, NFE
NFM, DLW
150°C
60s
min.
183°C
min.
60s
max.
Peak
Cycle
temperature
of reflow
(T3)
230°C
2 times
max.
Continued on the following page.
70
C50E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
Chip EMIFILr (Soldering and Mounting)
Continued from the preceding page.
(3) Reworking with Soldering Iron
The following conditions must be strictly followed when
using a soldering iron.
Pre-heating: 150°C 60s min.
Soldering iron power output: 30W max.
Temperature of soldering iron tip / Soldering time:
BLM/NFM21H/DLW31S/DLW43S
– 350°C max./3s max. (2 Times max.)
Do not allow the tip of the soldering iron to directly
contact the chip.
For additional methods of reworking with a soldering iron,
please contact Murata engineering.
4. Mounting on-board with Conductive Glue of BLM18AG_WH1
Please adhere rigidly to the condition below which shows
the method of mounting with conductive glue.
Please coat print pads with conductive glue using
metal mask and metal squeegee, and then mount our
products on the substrates with a mount machine or
human hand.
Please put the substrates into a oven (140 to 150°C)
for 30 minutes in order to cure the adhesive.
Please check whether the chips and the substrates are
connected with the conductive glue or not and there is
no electrical short of the conductive glue.
5. Cleaning
Following conditions should be observed when cleaning
chip EMI filter.
(1) Cleaning Temperature: 60°C max. (40°C max. for
alcohol type cleaner)
(2) Ultrasonic
Output: 20W/liter max.
Duration: 5 minutes max.
Frequency: 28 to 40kHz
(3) Cleaning agent
The following list of cleaning agents have been tested on
the individual components. Evaluation of final assembly
should be completed prior to production.
Conductive Glue
Print Pads
4
Board
1. Board
Ceramic Board or Alumina Board
2. Thickness of Glue
30 to 50µm
3. Recommended Conductive
Glue
PC3000
(Manufactured by Heraeus)
Do not clean BLM18AGpppWH1/DLW31S/43S series.
Before cleaning, please contact Murata engineering.
(a) Alcohol cleaning agent
Isopropyl alcohol (IPA)
(b) Aqueous cleaning agent
Pine Alpha ST-100S
(4) Ensure that flux residue is completely removed.
Component should be thoroughly dried after aqueous
agent has been removed with deionized water.
For additional cleaning methods, please contact Murata
engineering.
71
C50E.pdf
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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
Block Type EMIFILr SMD Type (Soldering and Mounting)
1. Standard Land Pattern Dimensions
Land Pattern
+ Solder Resist
Land Pattern
Through Hole
BNX024H
BNX025H
12.5
10.2
9.9
9.6
7.1
6.2
5.3
CG
2.8
2.3
B
CB
PSG
CG
(1) A double-sided print board (or multilayer board) as shown in
the left figure is designed, and please apply a soldering Cu
electrode with a product electrode to a "Land Pattern", apply
resist to a "Land Pattern + Solder Resist" at Cu electrode.
(2) Please drop CG on a ground electrode on the back layer
(the same also in a multilayer case) by the through hole. And
a surface grand electrode layer may also take a large area
as much as possible.
(3) It is recommended to use a double-sided printed circuit
board with BNX mounting on one side and the ground
pattern on the other in order to maximize filtering
performance, multiple feed through holes are required to
maximize the BNX's connection to ground.
(4) The ground pattern should be designed to be as large as
possible to achieve maximum filtering performance.
17.5
10.3
5.8
3.8
0
4
13.2
13.7
CG
0
(in mm)
2. Solder Paste Printing and Adhesive Application
(in mm)
Series
Adhesive Application
oUse Sn-3.0Ag-0.5Cu pattern printing solder.
oCoat with solder paste to the following thickness:
150-200µm
12.5
CG
10.2
9.6
CB
PSG
CG
CG
5.8
3.8
0
0
17.5
2.8
2.3
B
10.3
7.1
5.3
13.7
BNX024H
BNX025H
Solder Paste Printing
3. Standard Soldering Conditions
(1) Soldering Methods
BNX024H/025H is only for reflow soldering.
Solder: Use Sn-3.0Ag-0.5Cu solder.
Flux:
o Use Rosin-based flux.
o Do not use strong acidic flux (with chlorine content
exceeding 0.20wt%)
o Do not use water-soluble flux.
For additional mounting methods, please contact Murata.
Continued on the following page.
72
C50E.pdf
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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
Block Type EMIFILr SMD Type (Soldering and Mounting)
Continued from the preceding page.
(2) Soldering profile
oReflow Soldering profile
qSoldering profile for Lead-free solder (Sn-3.0Ag-0.5Cu)
Temperature (°C)
T4
T2
T1
T3
180
150
Limit Profile
Pre-heating
t1
Standard Profile
t2
90s±30s
time (s)
Standard Profile
Series
BNX024H/025H
Temp. (T1)
Time. (t1)
Peak
temperature
(T2)
220°C min.
30 to 60s
250±3°C
Heating
(3) Reworking with Solder Iron
The following conditions must be strictly followed when
using a soldering iron.
Pre-heating: 150°C 60s min.
Soldering iron power output: 100W max.
Temperature of soldering iron tip / Soldering time:
BNX024H/025H: 450°C max./5s max.
Limit Profile
Cycle
of reflow
2 times
max.
Temp. (T3)
Time. (t2)
Peak
temperature
(T4)
230°C min.
60s max.
260°C/10s
Heating
Cycle
of reflow
2 times
max.
4
Do not allow the tip of the soldering iron to directly
contact the chip.
For additional methods of reworking with a soldering iron,
please contact Murata engineering.
4. Cleaning
Do not clean BNX024H/025H.
Before cleaning, please contact Murata engineering.
73
C50E.pdf
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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
Block Type EMIFILr Lead Type (Soldering and Mounting)
1. Mounting Hole
Mounting holes should be designed as specified below.
Part Number
BNX012H
Bulk Type (in mm)
Component Side
TERMINAL LAYOUT (Bottom figure)
(B)
(CG)
(CG)
(CG)
2.5±0.1
2.5±0.1 2.5±0.1
ø1.2
(PSG)
CB
CG
CG
(CB)
5.0±0.1
7.5±0.1
P. C. BOARD PATTERNS
Use a bilateral P.C. board. Insert the BNX into the P.C.board until
the root of the terminal is secured, then solder.
(1) COMPONENT SIDE VIEW
PSG
(2) BOTTOM VIEW
B
B
PSG
B
PSG
Shield plate
PSG
CG
B
CG
CG CG
CB
CG
CB CG
Copper foil pattern
Recommended Land Pattern
3.2
3.2
Through holes
ø1.2
B
PSG
2.5
(2) Self-heating
Though this product has a large rated current, localized selfheating may be caused depending on soldering conditions.
To avoid this, attention should be paid to the following:
(a) Use P.C. board with our recommendation on hole
diameter / land pattern dimensions, mentioned in the
right hand drawing, especially for 4 terminals which
pass current.
(b) Solder the terminals to the P.C. board with soldercover area at least 90%. Otherwise, excess selfheating at connection between terminals and P.C.
board may lead to smoke and / or fire of the product
even when operating at rated current.
(c) After installing this product in your product, please
make sure of the self-heating with the rated current.
PSG : Power supply ground
CG : Load circuit ground
CB : Load circuit + Bias
B
CG
CG
2.5
4
2. Using The Block Type EMIFILr Effectively
(1) How to use effectively
This product effectively prevents undesired radiation and
external noise from going out / entering the circuit by
grounding the high frequency components which cause
noise problems. Therefore, grounding conditions may affect
the performance of the filter and attention should be paid to
the following for effective use.
(a) Design maximized grounding area in the P.C. board,
and grounding pattern for all the grounding terminals
of the product to be connected. (Please follow the
specified recommendations.)
(b) Minimize the distance between ground of the P.C.
board and the ground plate of the product.
(Recommended to use through-hole connection
between grounding area both of component side and
bottom side.)
(c) Insert the terminals into the holes on P.C. board
completely.
(d) Don't connect PSG terminal with CG terminal directly.
(See the item 1. TERMINAL LAYOUT)
PSG
CG
CB
3.2
(in mm)
2.5
5.0
Copper foil pattern
7.5
Continued on the following page.
1
74
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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
Block Type EMIFILr Lead Type (Soldering and Mounting)
Continued from the preceding page.
3. Soldering
(1) Solder: H60A, H63A solder (JIS Z 3238)
In case of lead-free solder, use Sn-3.0Ag-0.5Cu solder.
(2) Use Rosin-based flux. Do not use strong acidic flux with
halide content exceeding 0.2wt% (chlorine conversion
value).
(3) Products and the leads should not be subjected to any
mechanical stress during the soldering process, or while
subjected to the equivalent high temperatures.
(4) Standard flow soldering profile
Pre-heating
Temperature (°C)
300
Soldering
Gradual cooling
(in air)
Soldering temperature
250
200
150
150°C
100
50
60s min.
Solder
4. Cleaning Conditions
Following conditions should be observed when cleaning
BNX012H series.
(1) Cleaning temperature should be limited to 60°C max.
(40°C max for alcohol type cleaner.)
(2) Ultrasonic cleaning should comply with the following
conditions, avoiding the resonance phenomenon at the
mounted products and P.C.B.
Power: 20 W / l max. Frequency: 28 to 40kHz
Time: 5 min. max.
(3) Cleaner
(a) Alcohol type cleaner
Isopropyl alcohol (IPA)
4
Soldering time
Soldering temperature Soldering time
Sn/Pb=60/40, Sn/Pb=63/37
240 to 260˚C
5s max.
Sn-3.0Ag-0.5Cu solder
250 to 260˚C
4 to 6s
(b) Aqueous agent
PINE ALPHA ST-100S
(4) There should be no residual flux or residual cleaner left
after cleaning.
In the case of using aqueous agent, products should be
dried completely after rinsing with de-ionized water in
order to remove the cleaner.
(5) The surface of products may become dirty after cleaning,
but there is no deterioration on mechanical, electrical
characteristics and reliability.
(6) Other cleaning: Please contact us.
2
75
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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
Package
■ Minimum Quantity and Dimensions of 8mm Width Paper / Embossed Tape
<Embossed>
c
d
1.75±0.1
ø1.5 +0.1
-0
a
(in mm)
Direction of feed
b
There are holes in the cavities of the BLM21BD222SH1/
BD272SH1 and BLM31 only. ø1.0 +0.3
-0
4
c: Depth of Cavity
c
c: Total Thickness of Tape
(Embossed Tape)
(Paper Tape)
∗1 BLM15: 2.0±0.1
Minimum Qty. (pcs.)
Cavity Size (in mm)
Part Number
<paper>
3.5±0.05
8.0
∗1 2.0±0.05
4.0±0.1 4.0±0.1
ø180mm reel
ø330mm reel
Paper Tape Embossed Tape Paper Tape Embossed Tape
Bulk
a
b
c
d
BLM15
1.15
0.65
0.8 max.
-
10000
-
50000
-
1000
BLM18
1.85
1.05
1.1 max.
-
4000
-
10000
-
1000
BLM21
2.25
1.45
1.1 max.
-
4000
-
10000
-
1000
BLM21BD222SH1/272SH1
2.25
1.45
1.3
0.2
-
3000
-
10000
1000
BLM31
3.5
1.9
1.3
0.2
-
3000
-
10000
1000
NFM21
2.3
1.55
1.1 max.
-
4000
-
-
-
500
DLW31S
3.6
2.0
2.1
0.3
-
2000
-
-
500
• Please contact us for BLM15/18 in bulk case.
■ Minimum Quantity and Dimensions of 12mm Width Embossed Tape
b
There are holes in the cavities
of the BLM41 only. ø1.5 +0.3
-0
c: Depth of Cavity
1.75±0.1
c
0.3
12.0
ø1.5
+0.1
-0
5.5±0.05
a
∗1 2.0±0.05
4.0±0.1 4.0±0.1
Direction of feed
Part Number
Cavity Size
Minimum Qty. (pcs.)
ø180mm reel ø330mm reel
Bulk
a
b
c
BLM41
4.8
1.9
1.75
2500
8000
1000
NFE61
7.2
1.9
1.75
2500
8000
500
DLW43S_XK
4.9
3.6
2.7
500
2500
100
DLW43S_XP
4.9
3.6
2.9
500
2500
100
∗1 DLW43S: 8.0±0.1
(in mm)
76
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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
Package
Minimum Quantity and Dimensions of 24mm Width Embossed Tape
4.0x10pitch=40.0±0.2
+0.1
-0
c: 3.6±0.1
ø1.5
a: 12.4±0.1
11.5±0.1
12.0±0.1
24.0±0.2
ø1.5
1.75±0.1
2.0±0.1
3.6±0.1
4.0±0.1
+0.5
-0
0.3±0.1
b: 9.4±0.1
Part Number
BNX024H/025H
Cavity Size
Minimum Qty. (pcs.)
a
b
c
12.4
9.4
3.6
ø180mm reel ø330mm reel
400
1500
4
Bulk
100
(in mm)
77
C50E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
Chip EMI Suppression Filter Design Kits
Design Kits
oEKEMAT15B (Chip Ferrite Beads 0402 Size for Automotive)
No.
Part Number
Quantity
(pcs.)
Impedance typ. (at 100MHz, 20°C)
(Ω)
Rated Current
(mA)
DC Resistance
(Ω) max.
1
BLM15AG100SH1
10
10 (Typ.)
1000
0.05
2
BLM15AG700SH1
10
70 (Typ.)
500
0.15
3
BLM15AG121SH1
10
120 ±25%
500
0.25
4
BLM15AG221SH1
10
220 ±25%
300
0.35
5
BLM15AG601SH1
10
600 ±25%
300
0.6
6
BLM15AG102SH1
10
1000 ±25%
200
1.0
7
BLM15BB050SH1
10
5 ±25%
500
0.08
8
BLM15BB100SH1
10
10 ±25%
300
0.1
9
BLM15BB220SH1
10
22 ±25%
300
0.2
10
BLM15BB470SH1
10
47 ±25%
300
0.35
11
BLM15BB750SH1
10
75 ±25%
300
0.4
12
BLM15BB121SH1
10
120 ±25%
300
0.55
13
BLM15BB221SH1
10
220 ±25%
200
0.8
14
BLM15BD471SH1
10
470 ±25%
200
0.6
15
BLM15BD601SH1
10
600 ±25%
200
0.65
16
BLM15BD102SH1
10
1000 ±25%
200
0.9
17
BLM15BD182SH1
10
1800 ±25%
200
1.4
4
oEKEMAT18C (Chip Ferrite Beads 0603 Size for Automotive)
1
BLM18AG121SH1
10
Impedance typ.
(at 100MHz, 20°C)
(Ω)
120 ±25%
2
BLM18AG151SH1
10
150 ±25%
-
500
0.25
3
BLM18AG221SH1
10
220 ±25%
-
500
0.25
4
BLM18AG331SH1
10
330 ±25%
-
500
0.30
5
BLM18AG471SH1
10
470 ±25%
-
500
0.35
6
BLM18AG601SH1
10
600 ±25%
-
500
0.38
7
BLM18AG102SH1
10
1000 ±25%
-
400
0.50
8
BLM18BA050SH1
10
5 ±25%
-
500
0.2
9
BLM18BA100SH1
10
10 ±25%
-
500
0.25
10
BLM18BA220SH1
10
22 ±25%
-
500
0.35
11
BLM18BA470SH1
10
47 ±25%
-
300
0.55
12
BLM18BA750SH1
10
75 ±25%
-
300
0.7
13
BLM18BA121SH1
10
120 ±25%
-
200
0.9
14
BLM18BB050SH1
10
5 ±25%
-
700
0.05
15
BLM18BB100SH1
10
10 ±25%
-
700
0.10
16
BLM18BB220SH1
10
22 ±25%
-
600
0.20
17
BLM18BB470SH1
10
47 ±25%
-
550
0.25
18
BLM18BB600SH1
10
60 ±25%
-
550
0.25
19
BLM18BB750SH1
10
75 ±25%
-
500
0.30
No.
Part Number
Quantity
(pcs.)
Impedance typ.
(at 1GHz, 20°C)
(Ω)
-
Rated Current
(mA)
DC Resistance
(Ω) max.
500
0.18
Continued on the following page.
78
1
C50E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
Chip EMI Suppression Filter Design Kits
Design Kits
Continued from the preceding page.
Quantity
(pcs.)
Impedance typ.
(at 100MHz, 20°C)
(Ω)
Impedance typ.
(at 1GHz, 20°C)
(Ω)
Rated Current
(mA)
DC Resistance
(Ω) max.
BLM18BB121SH1
10
120 ±25%
-
500
0.30
21
BLM18BB141SH1
10
140 ±25%
-
450
0.35
22
BLM18BB151SH1
10
150 ±25%
-
450
0.37
23
BLM18BB221SH1
10
220 ±25%
-
450
0.45
24
BLM18BB331SH1
10
330 ±25%
-
400
0.58
25
BLM18BB471SH1
10
470 ±25%
-
300
0.85
26
BLM18BD470SH1
10
47 ±25%
-
500
0.30
27
BLM18BD121SH1
10
120 ±25%
-
200
0.4
28
BLM18BD151SH1
10
150 ±25%
-
200
0.4
29
BLM18BD221SH1
10
220 ±25%
-
200
0.45
30
BLM18BD331SH1
10
330 ±25%
-
200
0.5
31
BLM18BD421SH1
10
420 ±25%
-
200
0.55
32
BLM18BD471SH1
10
470 ±25%
-
200
0.55
33
BLM18BD601SH1
10
600 ±25%
-
200
0.65
34
BLM18BD102SH1
10
1000 ±25%
-
100
0.85
35
BLM18BD152SH1
10
1500 ±25%
-
50
1.2
36
BLM18BD182SH1
10
1800 ±25%
-
50
1.5
-
50
1.5
No.
Part Number
20
37
BLM18BD222SH1
10
2200 ±25%
38
BLM18BD252SH1
10
2500 ±25%
-
50
1.5
39
BLM18HG471SH1
10
470 ±25%
600 (Typ.)
200
0.85
40
BLM18HG601SH1
10
600 ±25%
700 (Typ.)
200
1.0
41
BLM18HG102SH1
10
1000 ±25%
1000 (Typ.)
100
1.6
42
BLM18HD471SH1
10
470 ±25%
1000 (Typ.)
100
1.2
43
BLM18HD601SH1
10
600 ±25%
1200 (Typ.)
100
1.5
44
BLM18HD102SH1
10
1000 ±25%
1700 (Typ.)
50
1.8
45
BLM18EG101TH1
10
100 ±25%
140 (Typ.)
2000
0.04
46
BLM18EG121SH1
10
120 ±25%
145 (Typ.)
2000
0.04
47
BLM18EG181SH1
10
180 ±25%
260 (Typ.)
2000
0.05
48
BLM18EG221TH1
10
220 ±25%
300 (Typ.)
1000
0.15
49
BLM18EG331TH1
10
330 ±25%
450 (Typ.)
500
0.21
50
BLM18EG391TH1
10
390 ±25%
520 (Typ.)
500
0.30
51
BLM18EG471SH1
10
470 ±25%
550 (Typ.)
500
0.21
52
BLM18EG601SH1
10
600 ±25%
700 (Typ.)
500
0.35
4
oEKEMAT21A (Chip Ferrite Beads 0805 / 1206 Size for Automotive)
No.
Part Number
Quantity
(pcs.)
Impedance typ. (at 100MHz, 20°C)
(Ω)
Rated Current
(mA)
DC Resistance
(Ω) max.
1
BLM21AG121SH1
10
120 ±25%
200
0.15
2
BLM21AG151SH1
10
150 ±25%
200
0.15
3
BLM21AG221SH1
10
220 ±25%
200
0.2
4
BLM21AG331SH1
10
330 ±25%
200
0.25
5
BLM21AG471SH1
10
470 ±25%
200
0.25
6
BLM21AG601SH1
10
600 ±25%
200
0.3
7
BLM21AG102SH1
10
1000 ±25%
200
0.45
8
BLM31AJ601SH1
10
600 ±25%
200
0.9
9
BLM21BB050SH1
10
5 ±25%
500
0.07
10
BLM21BB600SH1
10
60 ±25%
200
0.2
11
BLM21BB750SH1
10
75 ±25%
200
0.25
12
BLM21BB121SH1
10
120 ±25%
200
0.25
13
BLM21BB151SH1
10
150 ±25%
200
0.25
14
BLM21BB201SH1
10
200 ±25%
200
0.35
15
BLM21BB221SH1
10
220 ±25%
200
0.35
Continued on the following page.
2
79
C50E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
Chip EMI Suppression Filter Design Kits
Design Kits
Continued from the preceding page.
4
Quantity
(pcs.)
Impedance typ. (at 100MHz, 20°C)
(Ω)
Rated Current
(mA)
DC Resistance
(Ω) max.
BLM21BB331SH1
10
330 ±25%
200
0.4
17
BLM21BB471SH1
10
470 ±25%
200
0.45
18
BLM21BD121SH1
10
120 ±25%
200
0.25
19
BLM21BD151SH1
10
150 ±25%
200
0.25
20
BLM21BD221SH1
10
220 ±25%
200
0.25
21
BLM21BD331SH1
10
330 ±25%
200
0.3
22
BLM21BD421SH1
10
420 ±25%
200
0.3
23
BLM21BD471SH1
10
470 ±25%
200
0.35
24
BLM21BD601SH1
10
600 ±25%
200
0.35
25
BLM21BD751SH1
10
750 ±25%
200
0.4
26
BLM21BD102SH1
10
1000 ±25%
200
0.4
27
BLM21BD152SH1
10
1500 ±25%
200
0.45
28
BLM21BD182SH1
10
1800 ±25%
200
0.5
29
BLM21BD222TH1
10
2200 ±25%
200
0.6
30
BLM21BD222SH1
10
2250 (Typ.)
200
0.6
31
BLM21BD272SH1
10
2700 ±25%
200
0.8
Impedance typ. (at 100MHz, 20°C)
(Ω)
Rated Current
(mA)
DC Resistance
(Ω) max.
No.
Part Number
16
oEKEMATPWA (Chip EMIFILr for Automotive / for Power Supplies)
No.
Part Number
Quantity
(pcs.)
1
BLM18PG300SH1
10
30 (Typ.)
1000
0.05
2
BLM18PG330SH1
10
33 ±25%
3000
0.025
3
BLM18PG600SH1
10
60 (Typ.)
500
0.10
4
BLM18PG121SH1
10
120 ±25%
2000
0.05
5
BLM18PG181SH1
10
180 ±25%
1500
0.09
6
BLM18PG221SH1
10
220 ±25%
1400
0.1
7
BLM18PG331SH1
10
330 ±25%
1200
0.15
8
BLM18PG471SH1
10
470 ±25%
1000
0.2
9
BLM21PG220SH1
10
22 ±25%
6000
0.01
10
BLM21PG300SH1
10
30 (Typ.)
3000
0.015
11
BLM21PG600SH1
10
60 ±25%
3000
0.025
12
BLM21PG221SH1
10
220 ±25%
2000
0.050
13
BLM21PG331SH1
10
330 ±25%
1500
0.09
14
BLM31PG330SH1
10
33 ±25%
6000
0.01
15
BLM31PG500SH1
10
50 (Typ.)
3000
0.025
16
BLM31PG121SH1
10
120 ±25%
3000
0.025
17
BLM31PG391SH1
10
390 ±25%
2000
0.05
18
BLM31PG601SH1
10
600 ±25%
1500
0.09
19
BLM41PG600SH1
10
60 (Typ.)
6000
0.01
20
BLM41PG750SH1
10
75 (Typ.)
3000
0.025
21
BLM41PG181SH1
10
180 ±25%
3000
0.025
22
BLM41PG471SH1
10
470 ±25%
2000
0.05
23
BLM41PG102SH1
10
1000 ±25%
1500
0.09
No.
Part Number
Quantity
(pcs.)
Capacitance
(pF)
Rated Voltage
(Vdc)
Rated Current
(mA)
Insulation Resistance
(MΩ) min.
22 ±20%
50
700
1000
24
NFM21HC220U1H3
10
25
NFM21HC470U1H3
10
47 ±20%
50
700
1000
26
NFM21HC101U1H3
10
100 ±20%
50
700
1000
27
NFM21HC221R1H3
10
220 ±20%
50
700
1000
28
NFM21HC471R1H3
10
470 ±20%
50
1000
1000
29
NFM21HC102R1H3
10
1000 ±20%
50
1000
1000
Continued on the following page.
80
3
C50E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
Chip EMI Suppression Filter Design Kits
Design Kits
Continued from the preceding page.
No.
Part Number
Quantity
(pcs.)
Capacitance
(pF)
Rated Voltage
(Vdc)
Rated Current
(mA)
Insulation Resistance
(MΩ) min.
2200 ±20%
50
1000
1000
30
NFM21HC222R1H3
10
31
NFM21HC223R1H3
10
22000 ±20%
50
2000
1000
32
NFM21HC104R1A3
10
100000 ±20%
10
2000
1000
33
NFM21HC224R1A3
10
220000 ±20%
10
2000
1000
34
NFM21HC474R1A3
10
470000 ±20%
10
2000
1000
35
NFE61HT330U2A9
10
33 ±30%
100
2000
1000
36
NFE61HT680R2A9
10
68 ±30%
100
2000
1000
37
NFE61HT101Z2A9
10
100 ±30%
100
2000
1000
38
NFE61HT181C2A9
10
180 ±30%
100
2000
1000
39
NFE61HT361C2A9
10
360 ±20%
100
2000
1000
40
NFE61HT681D2A9
10
680 ±30%
100
2000
1000
41
NFE61HT102F2A9
10
1000 +80%, -20%
100
2000
1000
42
NFE61HT332Z2A9
10
3300 +80%, -20%
100
2000
1000
4
4
81
C50E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
Outlines of Major Noise Regulation Standards
1. EMI Regulations
Equipment
Countries
Generic Standard
Information Regulation
Japan
USA
Europe
CISPR61000-6-3
EN50081-1
(Residential, Commercial
(Residential, Commercial
and Light Industry)
and Light Industry)
IEC61000-6-4
EN50081-2
(Industrial)
(Industrial)
ITE : Information Technology
Equipment
Printer, Personal computer
VCCI
FCC Part 15
∗1
Subpart B
CISPR 11
∗1
FCC Part 18
EN55011
CISPR 12
JASO
FCC Part 15
Automotive
Subpart B
Directive
CISPR 13
∗1
CISPR 14
∗1
CISPR 15
∗1
FCC Part 18
Radio Act
FCC Part 15
CISPR 22
EN55022
Word processor, Display
ISM equipment, Microwave
Emission
Igniter
(Automobile, Motorboat)
TV, Radio, Audio, VTR
FCC Part 15
Subpart B
EN55013
Household electrical
equipment
EN55014
Portable tool
Fluorescent Lamp, Luminary
Transceiver
(Reference) Power Supply
Higher Harmonic
Basic Standard
Immunity
Generic Standard
ITU-T
ARIB
Subpart C
(Voluntary Regulation)
FCC Part 22
Industrial Voluntary
IEC61000-3
Regulation
IEC61000-4
JIS C 61000-4
EN55015
ETS300 Series
EN61000-3
EN61000-4 Series
IEC61000-6-1
JIS C 61000-6-1
EN50082-1
(Residential, Commercial
(Residential, Commercial
(Residential, Commercial
and Light Industry)
and Light Industry)
and Light Industry)
IEC61000-6-2
JIS C 61000-6-2
EN50082-2
(Industrial)
(Industrial)
(Industrial)
Industrial Process Measurement
and Control Equipment
Radio, TV
ITE : Information Technology
Equipment
CISPR 20
CISPR 24
Industrial Voluntary
Action
EN55020
EN55024
∗1 Electrical Appliance and Material Safety Law
There are EMI regulations in each country to meet EMI
noise levels emitted from digital equipment.
In the countries which regulate EMI, equipment which does
not satisfy regulations is not allowed to be sold.
Continued on the following page.
82
C50E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
Outlines of Major Noise Regulation Standards
Continued from the preceding page.
2. Measurement Point and Noise Detection
Regulation
CISPR 22/
EN55022
VCCI
FCC Part 15
Measuring Item
Polarization and Measuring Point
Frequency (Hz)
Detection
Measuring Devices
Radiated Interference
Horizontal Pol. Vertical Pol.
30M to 1GHz
Quasi-Peak Detection
Antenna
Main Interference Voltage
AC Main Ports
150k to 30MHz
Quasi-Peak Detection Mean Detection
Artificial Main Network
Radiated Interference
Horizontal Pol. Vertical Pol.
30M to 1GHz
Quasi-Peak Detection
Dipole Antenna
Main Interference Voltage
AC Main Ports
150k to 30MHz
Quasi-Peak Detection Mean Detection
Artificial Main Network
Radiated Interference
Horizontal Pol. Vertical Pol.
30M to 40GHz
Quasi-Peak Detection Mean Detection
Antenna
Main Interference Voltage
AC Main Ports
150k to 30MHz
Quasi-Peak Detection
Artificial Main Network
PeakUQuasi-PeakUAverage
(Qp)
V
V
Peak Detection
Quasi-Peak Detection
Peak Detection
Average Detection
Quasi-Peak Detection
Average Detection
t
t
Short Repetition Period
Long Repetition Period
3. Limits of CISPR 22/EN55022
Conversion
←
Limitation for
Limitation for
10m Distance
3m Distance
R10 (dB µ V/m)
R3 (dB µ V/m)
r10 (µ V/m)
r3 (µ V/m)
R10=20 log r10
R3=20 log r3
R3=R10+20 (1-log3)
Main Terminal Interference Voltage (Power Supply)
90
Voltage (dBµV)
(1) CISPR 22 recommends measurement at 10m distance.
However, other distance is acceptable if the limitation is
converted according to the following calculation.
Limitation shown left is converted to limitation for 3m
distance.
79
Class A Quasi-peak value 73
66
Class A Mean value
70
56
50
60
56
Class B Quasi-peak value 50
46
Class B Mean value
30
10k
100k 150k 500k 1M
5M 10M 30M 100M
Frequency (Hz)
Radiated Interference
r3 = 10 r10
3
Field Strength (dBµV/m)
90
70
57
50
50
40
Class A
47
Class B
30
10M
30M
100M
230M
1G
Frequency (Hz)
On the border frequency, lower limit should be applied.
Class A Equipment: The equipment which is used in light
industrial commercial areas.
Class B Equipment: The equipment which is used in
residential areas.
Continued on the following page.
83
C50E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
Outlines of Major Noise Regulation Standards
Continued from the preceding page.
(2) Scope of CISPR 22 Regulation
This regulation applies to information technology
equipment (ITE) which are defined as:
(a) Equipment that receives data from external signal
sources;
(b) Equipment that processes received data;
(c) Equipment that outputs data; and
(d) Equipment that has less than 600V rated voltage in
power supply.
CISPR Regulations
CISPR 10 Organization, Regulations and Procedures of CISPR
CISPR 11 Industrial, Scientific and Medical (ISM) Radio-Frequency
Equipment
CISPR 12 Vehicles, Motor Boats and Spark-Ignited Engine driven
CISPR 13 Sound and Television Receivers
CISPR 14 Household Electrical Appliances, Portable Tools and Similar
Electrical Apparatus
CISPR 15 Fluorescent Lamps and Iuminaries
CISPR 16 Radio Interference Measuring Apparatus and Measurement
Methods
CISPR 17 Passive Radio Interference Filters and Suppression
Components
CISPR 18 Power Transmission Cables and High Voltage equipment
CISPR 19 Microwave Ovens for Frequencies above 1GHz
CISPR 20 Immunity of Sound and TV Broadcast Receivers
and Associated Equipment
CISPR 21 Interference to Mobile Radio Communications in the Presence
of Impulsive Noise
CISPR 22 Information Technology Equipment
CISPR 23 Industrial Scientific and Medical (ISM) Equipment
CISPR 24 Immunity Regulation of Information Technology Equipment
CISPR 25 Receiver used onboard vehicles, boats, and on devices
4. Limits of VCCI Voluntary Regulation
90
Voltage (dBµV)
(2) Scope of VCCI Voluntary Regulation
This regulation applies to information technology
equipment (same as CISPR Pub.22), but the application
is excluded on the following equipment:
· Equipment for which other regulations already exist
(e.g., household electrical appliances, radio and TV
receivers)
· In station equipment principal purpose of which is
electrical communication
· Industrial plant control system for which information
processing is a secondary system function
· Industrial, commercial and medical testing and
measuring systems for which data processing is a
secondary system function
· Information equipment for which CISPR is conducting
further deliberation
VCCI is the acronym of Voluntary Control Council for
Interference by Data Processing Equipment and
Electronic Office Machines.
VCCI is organized by the following organizations:
· Japan Electronics and Information Technology
Industries Association (JEITA)
· Japan Business Machine and Information System
Industries Association (JBMIA)
· Communication and Information Network Association
of Japan (CIAJ)
Main Terminal Interference Voltage (Power Supply)
79
Class A Quasi-peak value 73
66
Class A Mean value
70
56
50
60
56 Class B Quasi-peak value 50
46 Class B Mean value
30
100k 150k 500k 1M
10k
5M 10M 30M 100M
Frequency (Hz)
Radiated Interference
90
Field Strength (dBµV/m)
(1) VCCI recommends measurement at 10m distance;
3m or 30m distance measurements are also allowed.
70
Class A Quasi-peak value
50
57
50
47
40
Class B Quasi-peak value
30
10M
30M
100M
230M
1G
Frequency (Hz)
On the border frequency, lower limit should be applied.
Class B ITE: Equipment that is designed to be used at home.
Class A ITE: Equipment that does not meet interference
limits of class B equipment, but satisfies
interference limits of class A equipment.
Continued on the following page.
84
C50E.pdf
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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
Outlines of Major Noise Regulation Standards
Continued from the preceding page.
5. Limits of FCC Part 15 Subpart B
Main Terminal Interference Voltage (Power Supply)
90
Voltage (dBµV)
(1) Class A recommended to be measured with 10m distance.
Class B recommended to be measured with 3m distance.
(2) The FCC Part 15 regulation controls radiated interference
by establishing quasi-peak and mean value limits for frequencies ranging from 30MHz to 40GHz (or maximum
frequency's fifth harmonic, whichever is lower).
For AC main ports, the FCC Part 15 regulation controls
main terminal interference voltage by establishing quasipeak value limits for frequencies ranging from 450kHz to
30MHz.
79
Class A Quasi-peak value 73
66
Class A Mean value
70
56
60
56 Class B Quasi-peak value 50
50
46 Class B Mean value
30
Measurement Frequency Range for Radiated Interference
Upper End of Measurement
Frequency Range
(MHz)
Less than 1.705
30
1.705 to 108
1000
108 to 500
2000
500 to 1000
5000
Over 1000
Maximum Frequency's Fifth
Harmonic or 40GHz,
Whichever is Lower
100k 150k 500k 1M
10k
5M 10M 30M 100M
Frequency (Hz)
Radiated Interference
90
Field Strength (dBµV/m)
Maximum Frequency
the Equipment Internally
Generates, Uses or Operates
or Synchronizes (MHz)
Noise level is regulated up to lower
frequency of the 5th harmonics of
maximum signal frequency and 40GHz.
70
50
49.5
40
54
43.5
Class A
54
56.9
46
60
Class B
30
10M
30M
88M100M 216M
960M1G
Frequency (Hz)
On the border frequency, lower limit should be applied.
Class A Equipment: The digital equipment that is sold for
commercial, industrial and office use.
Class B Equipment: The digital equipment that is sold to be
used in residential areas.
(3)There is no regulation on power interference.
FCC Regulations
Part 1
Part 2
Part 15
Part 18
Part 22
Part 68
Part 76
Procedures
Frequency Division and Radio Wave Treaty Issues and
General Rules
Radio Wave Equipment
• Intentionally electromagnetic radiation equipment
• Non-intentionally electromagnetic radiation equipment
• Incidentally electromagnetic radiation equipment
Industrial, Scientific and Medical Equipment
Public Mobile Wireless Operations
Connecting Terminal Equipment to Telephone Circuit Network
Cable Television
Continued on the following page.
85
C50E.pdf
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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
Outlines of Major Noise Regulation Standards
Continued from the preceding page.
6. Immunity Regulations in the European Union
All electric/electronic equipment cannot be sold in Europe
without CE marking. To use CE marking, they must
satisfy related EC directives such as EMC directives.
For Information Technology Equipment, in EMC directive,
emission regulations are integrated, and immunity
regulations are applied. Although these immunity
regulations are prepared by CENELEC, almost all
contents are same as standards issued by IEC or CISPR.
All products which are sold in EU must satisfy EC directive which
contains immunity regulation.
Principal EC Directive
EMC Directive
89/336/EEC
92/31/EEC
Low-Voltage Electrical
Products Directive
73/23/EEC
Machines Directive
89/392/EEC
7. Immunity Regulations in Japan
Equipment
TV, Radio, Audio
ITE
Association
JEITA (Japan Electronics and Information Technology)
Office Machine
JBMIA (Japan Business Machine and Information System Industries Association)
Mi
CIAJ (Communication and Information Network Association of Japan)
ARIB (Association of Radio Industries and Business)
Machine To Builders
JMTBA (Japan Machine Tool Builders' Association)
Industrial Measuring Control Equipment
JEMIMA (Japan Electric Measuring Instruments Manufacturers' Association)
Industrial Robot
JARA (Japan Robot Association)
The table on the right shows the preparation situation of
JIS for EMC. At this moment, the immunity standards by
JIS do not have a legal force like the Electrical Application
and Material Safety Law/VCCI.
86
Classification
Information Regulation
JIS
Terms
ISO60050-161
(IEV terms 161)
JIS C 0161
Basic Standards
IEC61000-4- 2
IEC61000-4- 3
IEC61000-4- 4
IEC61000-4- 5
IEC61000-4- 6
IEC61000-4- 7
IEC61000-4- 8
IEC61000-4-11
IEC61000-4-14
IEC61000-4-17
JIS C 61000-4-2
JIS C 61000-4-3
JIS C 61000-4-4
JIS C 61000-4-5
JIS C 61000-4-6
JIS C 61000-4-7
JIS C 61000-4-8
JIS C 61000-4-11
JIS C 61000-4-14
JIS C 61000-4-17
Generic Standards
IEC61000-6-1
IEC61000-6-2
JIS C 61000-6-1
JIS C 61000-6-2
C50E.pdf
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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
Principles of Noise Suppression by DC EMIFILr
1. Function of DC EMI Suppression Filters
DC EMI suppression filters absorb and eliminate high
frequency noise which may produce electromagnetic
interference in PC board circuits.
These filters are used in secondary circuits, and are small
in size and light in weight, which further enhances their
excellent noise suppression functions.
Chip and adhesive type filters can be mounted on PC
boards automatically.
These filters are effective in the suppression of radiation
noise in computers, peripheral equipment, and digital
circuit application equipment (including various types of
microcomputer application equipment), and function to
suppress noise in audio/visual equipment, which uses
digital memory chips and DSP.
These filters are also effective for improving the noise
immunity of equipment used in noisy environments (such
as electronic equipment for automobiles).
2. Noise Filter Suppression Principles
Generally, noise problems occur when the noise source
and electronic equipment sensitive to the influence of
noise are located in close proximity to one another.
In such situations, as shown in Figure at right, noise is
conducted through a conductor, which produces an
inductive field around the noise source.
To overcome such noise problems, it is preferable to
reduce the amount of noise generated by the noise
source or improve the noise resistance of adjacent
equipment.
In order to satisfy equipment performance specifications
and eliminate noise effectively at the same time, however,
it is customary to reduce the amount of noise generated
by the noise source, if it can't be eliminated altogether.
EMI Propagation Mode and Model of Noise Filter Suppression
r
q
EMI Source
Equipment or Device
Affected by EMI
e
w
qConduction mode
eConduction mode
Radiation mode
wRadiation mode
rRadiation mode
Conduction mode
r
EMI Filter
q
EMI Source
EMI Filter
EMI Filter
e
EMI Filter
Equipment or Device
Affected by EMI
w
Shield
Shield
3. Configuration of EMI Suppression Filters (DC)
DC EMI suppression filters are used to suppress noise
produced by conductors. Noise radiation can be
suppressed, if it is eliminated with a filter in advance.
Generally, such noise suppression is achieved with DC
EMI suppression filters, according to the capacitive and
inductive frequency characteristics of the respective
conductors in the circuit.
Filters of this kind can be roughly divided into those:
(1) employing a capacitor,
(2) employing an inductor,
(3) employing a capacitor and inductor combination.
Continued on the following page.
87
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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
Principles of Noise Suppression by DC EMIFILr
Continued from the preceding page.
4. Capacitive Noise Suppression
When a capacitor is connected (bypass capacitor) to
ground from a noisy signal line or power line, the circuit
impedance decreases as the frequency increases. Since
noise is a high frequency phenomenon, it flows to ground
if a capacitor has been connected to ground, thereby
making it possible to eliminate noise. (See Fig.)
EMI suppression filters employing a capacitor in this way
are used to eliminate this type of noise.
5. High frequency Capacitor Characteristics Used
for EMI Suppression Filters
Noise+Signal/DC Power
Noise
Z =
1
2πfc
Signal/DC Power
f : Frequency
c : Capacitance Value
Equivalent circuit of general-purpose capacitor and
three terminal capacitor in the high frequency area
and comparison of insertion loss
(a) Equivalent circuit of capacitors which concerns the ESL effect.
(b) Improvement of Insertion Loss Characteristics
(50 ohm - 50 ohm)
0
Insertion Loss (dB)
Even general-purpose capacitors can be used for noise
suppression. However, since noise has an extremely high
frequency range, general-purpose capacitors may not
function as effective bypass capacitors, due to the large
residual inductance built into the capacitor.
All the capacitors used in Murata's EMI suppression
filters employ a three terminal structure or thru-type
structure, which functions effectively even at high
frequencies, thereby minimizing the influence of residual
inductance. Consequently, an effective filter circuit can be
formed even at frequencies exceeding 1GHz.
(Refer to Fig.)
Capacitive Noise Suppression
10
Two terminal capacitor
C=22,000pF
20
Three terminal capacitor
C=22,000pF
30
40
50
60
70
80
1
10
100
Frequency (MHz)
1000
10000
6. Inductive Noise Suppression
When an inductor is inserted in series in a noise
producing circuit (See Fig.), its impedance increases with
frequency. In this configuration it is possible to attenuate
and eliminate noise components (high frequency
components). The Murata EMI suppression filter
functions in this way.
Inductive Noise Suppression
Noise
Noise+Signal/DC Power
Z =2πfL
Signal/DC Power
f : Frequency
L : Inductance Value
Continued on the following page.
88
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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
Principles of Noise Suppression by DC EMIFILr
Continued from the preceding page.
General-purpose inductors also function to suppress
noise when configured in series with a noise producing
circuit. However, when general-purpose inductors are
used, resonance may result in peripheral circuits, signal
wave forms may become distorted, and satisfactory
impedance may not be obtained at noise frequencies
(due to insufficient high frequency impedance
characteristics).
The inductors used for Murata's EMI suppression filters
are designed to function nearly as a resistor at noise
frequencies, which greatly reduces the possibility of
resonance and leaves signal wave forms undistorted.
And since sufficient impedance is obtained for
frequencies ranging to hundreds of MHz, these
specifically designed inductors operate effectively to
suppress high-frequency noise. (See Fig.)
Equivalent Circuit
R(f)
(Resistance element becomes dominant at high frequency.)
Example of impedance frequency characteristics of
inductor type EMIFILr
BLM18AG102
1200
Z
900
Impedance (Ω)
7. Characteristics of Inductors Used
in EMI Suppression Filters
R
600
300
0
X
1
10
100
1000
Frequency (MHz)
8. Capacitive-Inductive EMI Suppression Filters
If capacitive and inductive suppression characteristics are
combined, it is possible to configure a much higher
performance filter. In signal circuit applications where this
combination is applied, noise suppression effects which
have little influence on the signal wave form become
possible.
This type of filter is also effective in the suppression of
high-speed signal circuit noise. When used in DC power
circuits, capacitive-inductive filters prevent resonance
from occurring in peripheral circuits, thus making it
possible to achieve significant noise suppression under
normal service conditions.
9. Other EMI Suppression Filters
In addition to the capacitive-inductive filter, Murata also
has a common mode choke coil, effective for common
mode noise suppression.
Murata also has a range of built-in filter connectors which
greatly reduce filter mounting space requirements.
Continued on the following page.
89
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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Aug.28,2008
Principles of Noise Suppression by DC EMIFILr
Continued from the preceding page.
10. Expressing EMI Suppression Filter Effects
EMI Suppression Filter effects are expressed in terms of
the insertion loss measured in the circuit, normally
specified in MIL-STD 220A. As shown in the 50Ω
impedance circuit in the Figure at right, insertion loss is
represented by the logarithmic ratio of the circuit output
voltage with and without a filter in the circuit, which is
multiplied by 20 and expressed in dB.
Therefore, an insertion loss of 20dB indicates an output
voltage ratio (B/C) of 1/10, and an insertion loss of 40dB
indicates an output voltage ratio (B/C) of 1/100.
Measuring Circuit of Insertion Loss
Measuring Circuit of Insertion Loss
50Ω
(a)
B(V)
A(V)
50Ω
(b)
A(V)
EMI
Suppression
Filter
C(V)
Insertion Loss = 20 log B (dB)
C
90
50Ω
50Ω
C50E.pdf
Aug.28,2008