1 of 3 Creation Date : February 28, 2017 (GMT) Multilayer Ceramic Chip Capacitors C3216C0G2E472J115AA TDK item description C3216C0G2E472JT**** Commercial Grade Applications Please refer to Part No. CGA5H3C0G2E472J115AA for Automotive use. Feature Mid Mid Voltage (100 to 630V) Series C3216 [EIA 1206] Status Production Size Length(L) 3.20mm ±0.20mm Width(W) 1.60mm ±0.20mm Thickness(T) 1.15mm ±0.15mm Terminal Width(B) 0.20mm Min. Terminal Spacing(G) 1.00mm Min. 2.10mm to 2.50mm(Flow Soldering) Recommended Land Pattern (PA) 2.00mm to 2.40mm(Reflow Soldering) 1.10mm to 1.30mm(Flow Soldering) Recommended Land Pattern (PB) 1.00mm to 1.20mm(Reflow Soldering) 1.00mm to 1.30mm(Flow Soldering) Recommended Land Pattern (PC) 1.10mm to 1.60mm(Reflow Soldering) Electrical Characteristics Capacitance 4.7nF ±5% Rated Voltage 250VDC Temperature Characteristic C0G(0±30ppm/°C) Q (Min.) 1000 Insulation Resistance (Min.) 10000MΩ Other Soldering Method Wave (Flow) Reflow AEC-Q200 No Packing Blister (Plastic)Taping [180mm Reel] Package Quantity 2000pcs ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. 2 of 3 Creation Date : February 28, 2017 (GMT) Multilayer Ceramic Chip Capacitors C3216C0G2E472J115AA Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.) Impedance C3216C0G2E472J115AA ESR C3216C0G2E472J115AA Capacitance C3216C0G2E472J115AA C3216C0G2E472J115AA Temperature Characteristic C3216C0G2E472J115AA(No Bias) DC Bias Characteristic C3216C0G2E472J115AA(DC Bias = 125V ) ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. Multilayer Ceramic Chip Capacitors C3216C0G2E472J115AA Associated Images Land Pattern (Terminal Connection) ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. 3 of 3 Creation Date : February 28, 2017 (GMT)