AIC1953 Dual Output Low ESR Cap. Low-Dropout 600mA Linear Regulator FEATURES DESCRIPTION Up to 600mA Output Current for Each LDO. Low Quiescent Current ： 50µA (VOUT1 and VOUT2 Enable Mode). Low Dropout：470mV at 600mA Load Current and 3.3V Output Voltage. High PSRR：70dB at 1kHz. The AIC1953 is a dual output linear regulator in a SOP-8 package. It is optimized for low ESR ceramic capacitors operation and up to 600mA continuous current on each output. The AIC1953 offers high precision output voltage of 2%. At 600mA load current, a 470mV dropout is performed when output voltage is equal to 3.3V. The quality of low quiescent current and low dropout voltage makes this device ideal for battery power applications. The high ripple rejection and low noise of the AIC1953 provide enhanced performances for critical applications such as cellular phones, and PDAs. Independent Shutdown Controls. Current Limit and Thermal Protection. SOP-8 Package. APPLICATIONS Cellular Phones. PDAs. Digital Still Cameras. Portable Consumer Equipments. The AIC1953 includes current limit and thermal shutdown protection. Each of the output is controlled independently. TYPICAL APPLICATION CIRCUIT VOUT1=1.8V 1 V IN CO UT1 1μF 2 CIN 3 1μF V OUT2=3.3V 4 8 VOUT1 NC VIN GND VIN NC VOUT2 NC 7 6 5 CO UT2 1μF AIC1953-KZGR8 Analog Integrations Corporation Si-Soft Research Center DS-1953G-03 20111208 3A1, No.1, Li-Hsin Rd. I, Science Park, Hsinchu 300, Taiwan, R.O.C. TEL: 886-3-5772500, FAX: 886-3-5772510 www.analog.com.tw 1 AIC1953 ORDERING INFORMATION AIC1953-X X X XX XX PACKAGE TYPE SOP-8 (R8) Exposed Pad (Heat Sink) PACKING TYPE TR: TAPE & REEL BG: BAG PACKAGE TYPE R8: SOP-8 Exposed Pad (Heat Sink) S8: SOP-8 R8 (SOP-8) G: GREEN PACKAGE A : : Z 3 4 5 6 7 8 1: VOUT1 2: VIN 3: VIN 4: VOUT2 5: NC 6: NC 7: GND (TAB) 8: NC TOP VIEW ● 1 S8 (SOP-8) 1: 2: 3: 4: 5: 6: 7: 8: VOUT1 VIN VIN VOUT2 GND GND GND GND 8 2 7 GND 3 6 4 5 SOP-8 (S8) OUTPUT2 VOLTAGE: VOUT2 0.8V : : 3.3V 2.85V 3.4V 3.5V 3.6V 3.7V 3.8V PIN CONFIGURATION TOP VIEW ● 1 8 2 7 3 6 4 5 OUTPUT1 VOLTAGE: VOUT1 A 0.8V : : : : Z 3.3V 3 2.85V 4 3.4V 5 3.5V 6 3.6V 7 3.7V 8 3.8V (Internally set VOUT1、VOUT2 and PACKAGE TYPE, refer to the “designator xxxxxx” table below. For other combinations, a unit of 0.1V within 0.8~3.8V, additional voltage versions and package typ e are available on demand.) Example: AIC1953-KEGR8TR Vout1 = 1.8V, Vout2 = 1 .2V, with GR8 type pin configuration in SOP-8 Exposed Pad (Heat Sink) Green package and TAPE & REEL packing. AIC1953-ZKGS8TR Vout1 = 3.3V, Vout2 = 1 .8V, with GS8 type pin configuration in SOP-8 Green package and TAPE & REEL packing. 2 AIC1953 Designator xxxxx Designator Output Voltage xxxxx VOUT1 VOUT2 WWGR8 WWGS8 3.0 3.0 1.2 3.3 3.3 1.8 2.8 1.5 1.8 2.8 EZGR8 EZGS8 ZKGR8 ZKGS8 UHGR8 UHGS8 KUGR8 KUGS8 Designator xxxxx KEGR8 KEGS8 ZUGR8 ZUGS8 ZWGR8 ZWGS8 ZZGR8 ZZGS8 KZGR8 KZGS8 Output Voltage VOUT1 VOUT2 1.8 1.2 3.3 2.8 3.3 3.0 3.3 3.3 1.8 3.3 ABSOLUTE MAXIMUM RATINGS Input Voltage ....................................................................................................................................... 7V Operating Ambient Temperature Range TA ......................................................................... -40ºC~85ºC Operating Maximum Junction Temperature TJ ............................................................................. 150ºC Storage Temperature Range TSTG ..................................................................................... -65ºC~150ºC Lead Temperature (Soldering 10 Sec.)......................................................................................... 260ºC Thermal Resistance Junction to Case SOP-8 (Exposed Pad)* ........................................ 15ºC /W SOP-8 .................................................................. 40ºC /W Thermal Resistance Junction to Ambient SOP-8 (Exposed Pad)*… .................................... 60ºC /W SOP-8 ................................................................ 160ºC /W (Assume no ambient airflow) Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. * The package is placed on a two layers PCB with 2 ounces copper and 2 square inch, connected by 8 vias 3 AIC1953 ELECTRICAL CHARACTERISTICS (VIN = VOUT + 1V, VEN1=VEN2= VIN, TJ=25C, unless otherwise specified) (Note 1) PARAMETER TEST CONDITIONS Input Voltage (Note 2) Output Voltage Tolerance VIN= 6.0V, IOUT = 1mA Continuous Output Current SYMBOL MIN. VIN TYP. MAX. UNIT 1.6 6.0 V VOUT -2 2 % IOUT 600 mA Quiescent Current VEN2 = VEN1 = VIN IQ 50 80 A GND Pin Current IOUT1 = 600mA & IOUT2 = 600mA, VEN2 = VEN1 = VIN IGND 55 80 A Standby Current VEN1=VEN2= 0 ISTBY 0.1 A Output Current Limit VOUT = GND IIL VOUT=1.8V Dropout Voltage IOUT = 600mA VOUT=2.5V VDROP VOUT=3.3V 650 950 mA 710 850 580 700 470 560 mV Line Regulation VIN = VOUT + 1V to 6V VLIR 3 16 mV Load Regulation IOUT = 1mA to 600mA VLOR 2 10 mV Ripple Rejection f=1kHz, Ripple=0.5Vp-p, PSRR 70 dB Output Noise Voltage f= 10~100KHz 24 Vrms 50 ppm/℃ 150 ℃ 35 ℃ Temperature Coefficient Thermal Shutdown Temperature Thermal Shutdown Hysteresis TC VIN = VOUT + 1V Note 1: Specifications are production tested at TA=25C. Specifications over the -40C to 85C operating temperature range are assured by design, characterization and correlation with Statistical Quality Controls (SQC). Note 2: VIN(min) is the higher value of Vout + Dropout Voltage or 1.6V. 4 AIC1953 TYPICAL PERFORMANCE CHARACTERISTICS 0.3 VIN =1.8V VOUT =0.8V Quiescent Current (A) Output Voltage Variation (%) 0.2 48 0.1 0.0 -0.1 -0.2 44 40 36 -0.3 VIN =1.8V VOUT1 =VOUT2 =0.8V 32 -0.4 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 -40 -30 -20 -10 Temperature (℃) Dropout Voltage (mV) Output Voltage Variation (%) 0.1 0.0 -0.1 -0.2 -0.3 10 20 30 40 50 60 70 800 750 700 650 600 550 500 450 400 350 300 250 200 150 100 50 0 0.3 0.2 0.1 0.0 -0.1 -0.2 40 70 80 TA=85℃ 100 150 200 250 300 350 400 450 500 550 600 Fig.4 Dropout Voltage vs. Output Current Dropout Voltage (mV) Output Voltage Variation (%) 0.4 30 60 Output Current (mA) VIN =4.3V VOUT =3.3V 20 50 TA=25℃ 50 80 0.5 10 40 TA=-40℃ Fig.3 Output Voltage Variation vs. Temperature 0 30 VOUT =2.5V Temperature (℃) -0.3 -40 -30 -20 -10 20 Fig.2 Dual LDO Quiescent Current vs. Temperature VIN=3.5V VOUT=2.5V 0.2 0 10 Temperature (℃) Fig.1 Output Voltage Variation vs. Temperature -40 -30 -20 -10 0 50 60 70 Temperature (℃) Fig.5 Output Voltage Variation vs. Temperature 80 600 560 520 480 440 400 360 320 280 240 200 160 120 80 40 TA=85℃ VOUT =3.3V TA=25℃ TA=-40℃ 50 100 150 200 250 300 350 400 450 500 550 600 Output Current (mA) Fig.6 Dropout Voltage vs. Output Current 5 AIC1953 TYPICAL PERFORMANCE CHARACTERISTICS (Continued) 56 50 54 45 50 Quiescent Current (A) Ground Current (A) 52 IOUT =600mA 48 46 IOUT =0mA 44 42 40 36 4.0 4.5 5.0 35 30 25 VIN=1.8V VIN=1.9V VOUT1 =VOUT2 =0.8V 20 VOUT1=3.3V, VOUT2=0.8V, TA=25℃ 38 40 5.5 15 -40 6.0 -20 0 Input Voltage (V) Fig.7 Dual LDO Quiescent Current and Ground Current vs. Input Voltage 40 60 80 Fig.8 Quiescent Current vs. Temperature. 30 Single LDO Quiescent Current (A) 30 Single LDO Quiescent Current (A) 20 Temperature (℃) 28 26 24 TA=25℃ VOUT1=1.8V VOUT2=Shutdown Mode 22 28 26 24 TA=25℃ VOUT1=2.5V VOUT2=Shutdown Mode 22 20 20 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Input Voltage (V) Fig.9 Single LDO Quiescent Current vs. Input Voltage 2.5 3.0 3.5 4.0 4.5 Output Current Fig.11Load Transient Response at VIN=2.8V, VOUT=0.8V 5.5 6.0 Fig.10 Single LDO Quiescent Current vs. Input Voltage CIN=COUT1=COUT2=1F IOUT= 50mA to 600mA CIN=COUT1=COUT2=1F IOUT= 50mA to 600mA Output Voltage Ripple 5.0 Input Voltage (V) Output Voltage Ripple Output Current Fig.12Load Transient Response at VIN=4.8V, VOUT=3.8V 6 AIC1953 TYPICAL PERFORMANCE CHARACTERISTICS (Continued) CIN=COUT1=COUT2=1F IOUT= 50mA to 600mA CIN=COUT1=COUT2=1F IOUT= 50mA to 600mA Output Voltage Ripple Output Voltage Ripple Output Current Output Current Fig.13Load Transient Response at VIN=3.8V, VOUT=2.8V Fig.14Load Transient Response at VIN=4.3V, VOUT=3.3V CIN=COUT1=COUT2=1F IOUT1= 50mA to 600mA & IOUT2=0mA CIN=COUT1=COUT2=1F IOUT2= 50mA to 600mA & IOUT1=0mA Output1 Voltage Ripple Output1 Voltage Ripple Output2 Voltage Ripple Output2 Current Output1 Current Output2 Voltage Ripple Fig.15 Cross Talk at VIN=4.3V, VOUT1=2.8V and VOUT2=3.3V Fig.16 Cross Talk at VIN=4.3V, VOUT1=2.8V and VOUT2=3.3V -40 -0.5 Simulation Verified CIN=COUT1=COUT2=1F 0.0 -50 0.5 PSRR (dB) Output Voltage Variation (%) -45 1.0 VOUT =0.8V, IOUT =120mA VIN =1.6V VIN =1.7V 1.5 2.0 -40 -20 0 20 40 60 Temperature (℃) Fig.17 Output Voltage Variation vs. Temperature. 80 -55 -60 -65 -70 -75 10 100 1k 10k 100k 1M 10M Frequency (Hz) Fig.18 PSRR at VIN=2.5V, VOUT=1.0V and IOUT=10mA. 7 AIC1953 BLOCK DIAGRAM Functional Block Diagram of AIC1953 PIN DESCRIPTION VIN PIN GND PIN VOUT1 PIN VOUT2 PIN - Power input. - Ground. - Output 1. - Output 2. 8 AIC1953 APPLICATION INFORMATION The AIC1953 is a low-dropout, low quiescent-current, dual-output linear regulator for battery power applications. These parts are available with preset output voltages ranging from 0.8V to 3.8V, and the parts can supply loads up to 600mA. CURRENT LIMIT The AIC1953 includes two independent current limiters, which monitor and control the maximum output current. If the output is overloaded or shorted to ground, this can protect the device from being damaged. THERMAL PROTECTION The AIC1953 includes a thermal-limiting circuit, which is designed to protect the device against overload condition. When the junction temperature exceeds TJ=150ºC, the thermal-limiting circuit turns off the pass transistors and allows the IC to cool. For continuous load condition, maximum rating of junction temperature must not be exceeded. INPUT-OUTPUT CAPACITORS Linear regulators require input and output capacitors to maintain stability. Input capacitor at 1F with a 1F ceramic output capacitor for each regulator is recommended. When choosing the input and output ceramic capacitors, X5R and X7R types are recommended because they retain their capacitance over wider ranges of voltage and temperature than other types. POWER DISSIPATION The maximum power dissipation of AIC1953 depends on the thermal resistance of its case and circuit board, the temperature difference between the die junction and ambient air, and the rate of airflow. The rate of temperature rise is greatly affected by the mounting pad configuration on the PCB, the board material, and the ambient temperature. When the IC mounting with good thermal conductivity is used, the junction temperature will be low even when large power dissipation applies. The power dissipation across the device is P = IOUT1 (VIN-VOUT1)+ IOUT2 (VIN-VOUT2) The maximum power dissipation is: PMAX (TJ-max - TA ) Rθ JA Where TJ-max is the maximum allowable junction temperature (150C), and TA is the ambient temperature suitable in application. As a general rule, the lower temperature is, the better reliability of the device is. So the PCB mounting pad should provide maximum thermal conductivity to maintain low device temperature. 9 AIC1953 PHYSICAL DIMENSIONS SOP-8 Exposed Pad (Heat Sink) PACKAGE OUTLINE DRAWING D D1 EXPOSED THERMAL PAD(Heat Sink) (BOTTOM CENTER OF PACKAGE) h X 45° A A SEE VIEW B A e H E E1 WITH PLATING 0.25 C A1 B GAUGE PLANE SEATING PLANE L VIEW B BASE METAL SECTION A-A Note : 1. Refer to JEDEC MS-012E. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side . 3. Dimension "E" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact. S Y M B O L SOP-8 Exposed Pad(Heat Sink) MILLIMETERS MIN. MAX. A 1.35 1.75 A1 0.00 0.15 B 0.31 0.51 C 0.17 0.25 D 4.80 5.00 D1 1.50 3.50 E 3.80 4.00 E1 1.0 e 2.55 1.27 BSC H 5.80 h 0.25 0.50 L 0.40 1.27 θ 0° 8° 6.20 10 AIC1953 SOP-8 PACKAGE OUTLINE DRAWING h X 45° A A SEE VIEW B A e H E D WITH PLATING 0.25 C A1 B GAUGE PLANE SEATING PLANE θ L VIEW B BASE METAL SECTION A-A Note: 1. Refer to JEDEC MS-012AA. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side . 3. Dimension "E" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact. S Y M B O L SOP-8 MILLIMETERS MIN. MAX. A 1.35 1.75 A1 0.10 0.25 B 0.33 0.51 C 0.19 0.25 D 4.80 5.00 E 3.80 4.00 e 1.27 BSC H 5.80 6.20 h 0.25 0.50 L 0.40 1.27 θ 0° 8° Note: Information provided by AIC is believed to be accurate and reliable. However, we cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in an AIC product; nor for any infringement of patents or other rights of third parties that may result from its use. We reserve the right to change the circuitry and specifications without notice. Life Support Policy: AIC does not authorize any AIC product for use in life support devices and/or systems. Life support devices or systems are devices or systems which, (I) are intended for surgical implant into the body or (ii) support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 11