NRND DS90LV027AH www.ti.com SNLS206A – SEPTEMBER 2005 – REVISED APRIL 2013 DS90LV027AH High Temperature LVDS Dual Differential Driver Check for Samples: DS90LV027AH FEATURES DESCRIPTION 1 • • • • • • • • 2 • • −40°C to +125°C operating temperature range >600 Mbps (300MHz) switching rates 0.3 ns typical differential skew 0.7 ns maximum differential skew 3.3V power supply design Low power dissipation (46 mW @ 3.3V static) Flow-through design simplifies PCB layout Power Off Protection (outputs in high impedance) Conforms to TIA/EIA-644 Standard 8-Lead SOIC package saves space The DS90LV027AH is a dual LVDS driver device optimized for high data rate and low power applications. The device is designed to support data rates in excess of 600Mbps (300MHz) utilizing Low Voltage Differential Signaling (LVDS) technology. The DS90LV027AH is a current mode driver allowing power dissipation to remain low even at high frequency. In addition, the short circuit fault current is also minimized. The device is in a 8-lead SOIC package. The DS90LV027AH has a flow-through design for easy PCB layout. The differential driver outputs provides low EMI with its typical low output swing of 360 mV. It is perfect for high speed transfer of clock and data. The DS90LV027AH can be paired with its companion dual line receiver, the DS90LV028AH, or with any of TI's LVDS receivers, to provide a high-speed point-topoint LVDS interface. Connection Diagram Figure 1. Dual-In-Line See Package Number D (R-PDSO-G8) Functional Diagram These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2005–2013, Texas Instruments Incorporated NRND DS90LV027AH SNLS206A – SEPTEMBER 2005 – REVISED APRIL 2013 Absolute Maximum Ratings www.ti.com (1) −0.3V to +4V Supply Voltage (VCC) Input Voltage (DI) −0.3V to +3.6V Output Voltage (DO±) −0.3V to +3.9V Maximum Package Power Dissipation @ +25°C D Package 1190 mW Derate D Package 9.5 mW/°C above +25°C −65°C to +150°C Storage Temperature Range Lead Temperature Range Soldering (4 sec.) +260°C ESD Ratings ≥ 8kV (HBM 1.5 kΩ, 100 pF) (EIAJ 0 Ω, 200 pF) ≥ 1000V (CDM) ≥ 1000V (IEC direct 330 Ω, 150 pF) (1) ≥ 4kV “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be ensured. They are not meant to imply that the devices should be operated at these limits. Electrical Characteristics specifies conditions of device operation. Recommended Operating Conditions Min Typ Max Units Supply Voltage (VCC) 3.0 3.3 3.6 V Temperature (TA) −40 25 +125 °C 2 Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: DS90LV027AH NRND DS90LV027AH www.ti.com SNLS206A – SEPTEMBER 2005 – REVISED APRIL 2013 Electrical Characteristics Over Supply Voltage and Operating Temperature ranges, unless otherwise specified. Symbol Parameter Conditions (1) (2) (3) Pin Min Typ Max Units DO+, DO− 250 360 450 mV 1 35 mV 1.4 1.6 V DIFFERENTIAL DRIVER CHARACTERISTICS VOD Output Differential Voltage ΔVOD VOD Magnitude Change RL = 100Ω (Figure 2) VOH Output High Voltage VOL Output Low Voltage VOS Offset Voltage ΔVOS Offset Magnitude Change IOXD Power-off Leakage IOSD Output Short Circuit Current VIH Input High Voltage VIL Input Low Voltage IIH Input High Current VIN = 3.3V or 2.4V IIL Input Low Current VIN = GND or 0.5V VCL Input Clamp Voltage ICL = −18 mA ICC Power Supply Current No Load 0.9 1.1 1.125 1.2 1.375 V 0 3 25 mV ±1 ±10 μA −5.7 −8 mA VCC V VOUT = VCC or GND, VCC = 0V DI 2.0 GND −1.5 VIN = VCC or GND VCC RL = 100Ω (1) (2) (3) V 0.8 V ±2 ±10 μA ±1 ±10 μA −0.6 V 8 14 mA 14 20 mA Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground except VOD. All typicals are given for: VCC = +3.3V and TA = +25°C. The DS90LV027AH is a current mode device and only function with datasheet specification when a resistive load is applied to the drivers outputs. Switching Characteristics Over Supply Voltage and Operating Temperature Ranges, unless otherwise specified. Symbol Parameter Conditions (1) (2) (3) (4) Min Typ Max Units 0.3 0.8 2.0 ns 0.3 1.1 2.0 ns 0 0.3 0.7 ns 0 0.4 0.8 ns DIFFERENTIAL DRIVER CHARACTERISTICS tPHLD Differential Propagation Delay High to Low tPLHD Differential Propagation Delay Low to High tSKD1 Differential Pulse Skew |tPHLD − tPLHD| tSKD2 Channel to Channel Skew tSKD3 Differential Part to Part Skew tSKD4 Differential Part to Part Skew (8) tTLH Transition Low to High Time tTHL Transition High to Low Time fMAX Maximum Operating Frequency (3) (4) (5) (6) (7) (8) (9) (5) (6) (7) (1) (2) RL = 100Ω, CL = 15 pF (Figure 3 and Figure 4) 0 1.0 ns 0 1.2 ns 0.5 1.0 ns 0.5 1.0 0.2 0.2 (9) 350 ns MHz All typicals are given for: VCC = +3.3V and TA = +25°C. These parameters are ensured by design. The limits are based on statistical analysis of the device over PVT (process, voltage, temperature) ranges. CL includes probe and fixture capacitance. Generator waveform for all tests unless otherwise specified: f = 1 MHz, ZO = 50Ω, tr ≤ 1 ns, tf ≤ 1 ns (10%-90%). tSKD1, |tPHLD − tPLHD|, is the magnitude difference in differential propagation delay time between the positive going edge and the negative going edge of the same channel. tSKD2 is the Differential Channel to Channel Skew of any event on the same device. tSKD3, Differential Part to Part Skew, is defined as the difference between the minimum and maximum specified differential propagation delays. This specification applies to devices at the same VCC and within 5°C of each other within the operating temperature range. tSKD4, part to part skew, is the differential channel to channel skew of any event between devices. This specification applies to devices over recommended operating temperature and voltage ranges, and across process distribution. tSKD4 is defined as |Max − Min| differential propagation delay. fMAX generator input conditions: tr = tf < 1 ns (0% to 100%), 50% duty cycle, 0V to 3V. Output criteria: duty cycle = 45%/55%, VOD > 250mV, all channels switching. Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: DS90LV027AH 3 NRND DS90LV027AH SNLS206A – SEPTEMBER 2005 – REVISED APRIL 2013 www.ti.com PARAMETER MEASUREMENT INFORMATION Figure 2. Differential Driver DC Test Circuit Figure 3. Differential Driver Propagation Delay and Transition Time Test Circuit Figure 4. Differential Driver Propagation Delay and Transition Time Waveforms APPLICATION INFORMATION Table 1. Device Pin Descriptions Pin # 4 Name Description 2, 3 DI TTL/CMOS driver input pins 6, 7 DO+ Non-inverting driver output pin 5, 8 DO− Inverting driver output pin 4 GND Ground pin 1 VCC Positive power supply pin, +3.3V ± 0.3V Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: DS90LV027AH NRND DS90LV027AH www.ti.com SNLS206A – SEPTEMBER 2005 – REVISED APRIL 2013 TYPICAL PERFORMANCE CURVES Output High Voltage vs Power Supply Voltage Output Low Voltage vs Power Supply Voltage Output Short Circuit Current vs Power Supply Voltage Differential Output Voltage vs Power Supply Voltage Differential Output Voltage vs Load Resistor Offset Voltage vs Power Supply Voltage Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: DS90LV027AH 5 NRND DS90LV027AH SNLS206A – SEPTEMBER 2005 – REVISED APRIL 2013 www.ti.com TYPICAL PERFORMANCE CURVES (continued) 6 Power Supply Current vs Frequency Power Supply Current vs Power Supply Voltage Power Supply Current vs Ambient Temperature Differential Propagation Delay vs Power Supply Voltage Differential Propagation Delay vs Ambient Temperature Differential Skew vs Power Supply Voltage Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: DS90LV027AH NRND DS90LV027AH www.ti.com SNLS206A – SEPTEMBER 2005 – REVISED APRIL 2013 TYPICAL PERFORMANCE CURVES (continued) Differential Skew vs Ambient Temperature Transition Time vs Power Supply Voltage Transition Time vs Ambient Temperature Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: DS90LV027AH 7 NRND DS90LV027AH SNLS206A – SEPTEMBER 2005 – REVISED APRIL 2013 www.ti.com REVISION HISTORY Changes from Original (April 2013) to Revision A • 8 Page Changed layout of National Data Sheet to TI format ............................................................................................................ 7 Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: DS90LV027AH PACKAGE OPTION ADDENDUM www.ti.com 30-Oct-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) DS90LV027AHM/NOPB NRND SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM LV27A HM DS90LV027AHMX/NOPB NRND SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM LV27A HM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 11-Oct-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device DS90LV027AHMX/NOPB Package Package Pins Type Drawing SOIC D 8 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2500 330.0 12.4 Pack Materials-Page 1 6.5 B0 (mm) K0 (mm) P1 (mm) 5.4 2.0 8.0 W Pin1 (mm) Quadrant 12.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Oct-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DS90LV027AHMX/NOPB SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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