DS36C280 www.ti.com SNLS097C – JULY 2000 – REVISED FEBRUARY 2013 DS36C280 Slew Rate Controlled CMOS EIA-RS-485 Transceiver Check for Samples: DS36C280 FEATURES DESCRIPTION • The DS36C280 is a low power differential bus/line transceiver designed to meet the requirements of RS485 Standard for multipoint data transmission. In addition, it is compatible with TIA/EIA-422-B. 1 2 • • • • • • • • • • • (1) 100% RS-485 Compliant – Guaranteed RS-485 Device Interoperation Low Power CMOS Design: ICC 500 μA max Adjustable Slew Rate Control – Minimizes EMI Effects Built-In Power Up/Down Glitch-Free Circuitry – Permits Live Transceiver Insertion/Displacement SOIC Packages Industrial Temperature Range: −40°C to +85°C On-board Thermal Shutdown Circuitry – Prevents Damage to the Device in the Event of Excessive Power Dissipation Wide Common Mode Range: −7V to +12V Receiver Open Input Fail-safe (1) ¼ unit load (DS36C280): ≥128 nodes ½ unit load (DS36C280T): ≥64 nodes ESD (human body model): ≥2 kV Non-terminated, Open Inputs only The slew rate control feature allows the user to set the driver rise and fall times by using an external resistor. Controlled edge rates can reduce switching EMI. The CMOS design offers significant power savings over its bipolar and ALS counterparts without sacrificing ruggedness against ESD damage. The device is ideal for use in battery powered or power conscious applications. ICC is specified at 500 μA maximum. The driver and receiver outputs feature TRI-STATE capability. The driver outputs operate over the entire common mode range of −7V to +12V. Bus contention or fault situations are handled by a thermal shutdown circuit, which forces the driver outputs into the high impedance state. The receiver incorporates a fail safe circuit which guarantees a high output state when the inputs are left open (1). Connection and Logic Diagram Figure 1. See Package Number D (R-PDSO-G8) 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2000–2013, Texas Instruments Incorporated DS36C280 SNLS097C – JULY 2000 – REVISED FEBRUARY 2013 www.ti.com Truth Table (1) DRIVER SECTION DE/RE* DI DO/RI H H H DO*/RI* L H L L H L X Z Z RECEIVER SECTION DE/RE* RI-RI* RO L ≥+0.2V H L ≤−0.2V L H X Z L (1) OPEN (1) H Non-terminated, Open Inputs only These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) Supply Voltage (VCC) +12V −0.5V to (VCC +0.5V) Input Voltage (DE/RE*, & DI) Common Mode (VCM) Driver Output/Receiver Input ±15V Input Voltage (DO/RI, DO*/RI*) ±14V −0.5V to (VCC +0.5V) Receiver Output Voltage Maximum Package Power Dissipation @ +25°C M Package 1190 mV, derate 9.5 mW/°C above +25°C −65°C to +150°C Storage Temperature Range Lead Temperature +260°C (Soldering 4 sec.) (1) (2) “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the devices should be operated at these limits. The table of “Electrical Characteristics” specifies conditions of device operation. If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications. Recommended Operating Conditions Supply Voltage (VCC) Bus Voltage Min Typ Max Units +4.75 +5.0 +5.25 V +12 V −7 Operating Free Air Temperature (TA) DS36C280T DS36C280 2 −40 +25 +85 °C 0 +25 +70 °C Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: DS36C280 DS36C280 www.ti.com SNLS097C – JULY 2000 – REVISED FEBRUARY 2013 Electrical Characteristics (1) (2) Over Supply Voltage and Operating Temperature ranges, unless otherwise specified Symbol Parameter Conditions Reference Min Typ Max Units 1.5 5.0 V 0 5.0 V 0 5.0 V DIFFERENTIAL DRIVER CHARACTERISTICS VOD1 Differential Output Voltage IO = 0 mA (No Load) VOD0 Output Voltage IO = 0 mA VOD0* Output Voltage (Output to GND) VOD2 Differential Output Voltage (Termination Load) RL = 50Ω (422) RL = 27Ω (485) Balance of VOD2 RL = 27Ω or 50Ω ΔVOD2 (422) (485) VOC ΔVOC IOSD 2.0 2.8 1.5 2.3 5.0 V V −0.2 0.1 +0.2 V 1.5 2.0 5.0 V 0 3.0 V 0 3.0 V −0.2 +0.2 V (3) |VOD2 − VOD2*| VOD3 Figure 2 (422, 485) Differential Output Voltage (Full Load) R1 = 54Ω, R2 = 375Ω Figure 3 Driver Common Mode Output Voltage RL = 27Ω (485) RL = 50Ω (422) Balance of VOC RL = 27Ω or |VOC − VOC*| RL = 50Ω Driver Output Short-Circuit Current VO = +12V (485) 200 +250 mA VO = −7V (485) −190 −250 mA +0.035 +0.2 V VTEST = −7V to +12V Figure 2 (3) (422, 485) RECEIVER CHARACTERISTICS Differential Input High Threshold Voltage VO = VOH, IO = −0.4 mA Differential Input Low Threshold Voltage VO = VOL, IO = 0.4 mA VHST Hysteresis (5) VCM = 0V RIN Input Resistance −7V ≤ VCM ≤ +12V DS36C280T 24 RIN Input Resistance −7V ≤ VCM ≤ +12V DS36C280 48 IIN Line Input Current Other Input = 0V VTH VTL (6) −7V ≤ VCM ≤ +12V (4) (422, 485) −0.2 −7V ≤ VCM ≤ +12V DS36C280 DE = VIL, RE* = VIL VCC = 4.75 to 5.25 DS36C280T or 0V IING Line Input Current Glitch (6) Other Input = 0V DS36C280 DE = VIL, RE* = VIL VCC = +3.0V DS36C280T or 0V TA = 25°C IB Input Balance Test RS = 500Ω VOH High Level Output Voltage IOH = −4 mA, VID = +0.2V VOL Low Level Output Voltage IOL = +4 mA, VID = −0.2V IOSR Short Circuit Current VO = GND IOZR TRI-STATE Leakage Current VO = 0.4V to 2.4V −0.035 V 70 mV 68 kΩ 68 kΩ VIN = +12V 0 0.19 0.25 mA VIN = −7V 0 −0.1 −0.2 mA VIN = +12V 0 0.19 0.5 mA VIN = −7V 0 −0.1 −0.4 mA VIN = +12V 0 0.19 0.25 mA VIN = −7V 0 −0.1 −0.2 mA VIN = +12V 0 0.19 0.5 mA VIN = −7V 0 −0.1 −0.4 mA ±400 mV (422) (7) RO Figure 12 3.5 RO 7 4.6 V 0.3 0.5 V 35 85 mA ±1 μA DEVICE CHARACTERISTICS (1) (2) (3) (4) (5) (6) (7) Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground except VOD1 and VOD2. All typicals are given for: VCC = +5.0V, TA = + 25°C. Delta |VOD2| and Delta |VOC| are changes in magnitude of VOD2 and VOC, respectively, that occur when input changes state. Threshold parameter limits specified as an algebraic value rather than by magnitude. Hysteresis defined as VHST = VTH − VTL. IIN includes the receiver input current and driver TRI-STATE leakage current. For complete details of test, see RS-485. Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: DS36C280 3 DS36C280 SNLS097C – JULY 2000 – REVISED FEBRUARY 2013 www.ti.com Electrical Characteristics(1)(2) (continued) Over Supply Voltage and Operating Temperature ranges, unless otherwise specified Symbol Parameter Conditions Reference Min Typ Max Units V VIH High Level Input Voltage 2.0 VCC VIL Low Level Input Voltage GND 0.8 V IIH High Level Input Current VIH = VCC 2 μA IIL Low Level Input Current VCC = 5.0V −2 μA VCC = +3.0V DE/RE*, DI VIL = 0V SR = 0V ICCR Power Supply Current (No Load) ICCD −2 μA −1 mA 200 500 μA 200 500 μA SR Driver OFF, Receiver ON VCC Driver ON, Receiver OFF Switching Characteristics (1) (2) (3) Over Supply Voltage and Operating Temperature ranges, unless otherwise specified Symbol Parameter Conditions Reference Min Typ Max Units Figure 6, Figure 7 10 399 1000 ns 10 400 1000 ns 0 1 10 ns DRIVER CHARACTERISTICS tPHLD Differential Propagation Delay High to Low tPLHD Differential Propagation Delay Low to High tSKD Differential Skew RL = 54Ω, CL = 100 pF |tPHLD − tPLHD| tr Rise Time tf Fall Time tr Rise Time tf Fall Time tr Rise Time tf Fall Time tPHZ Disable Time High to Z tPLZ Disable Time Low to Z tPZH Enable Time Z to High tPZL Enable Time Z to Low SR = Open SR = 100 kΩ SR = Short CL = 15 pF CL = 100 pF 2870 ns 3070 ns 1590 ns 1640 ns 100 337 1000 ns 100 348 1000 ns Figure 8, Figure 9 1100 2000 ns Figure 10, Figure 11 500 800 ns Figure 8, Figure 9 300 500 ns Figure 10, Figure 11 300 500 ns 30 210 400 ns 30 190 400 ns 0 20 50 ns 50 150 ns 55 150 ns 40 150 ns 45 150 ns RECEIVER CHARACTERISTICS tPHL Propagation Delay High to Low tPLH Propagation Delay Low to High tSK Skew, |tPHL − tPLH| tPLZ Output Disable Time CL = 15 pF Figure 13, Figure 14 CL = 15 pF tPHZ tPZL Figure 15, Figure 16, Figure 17 Output Enable Time tPZH (1) (2) (3) 4 All typicals are given for: VCC = +5.0V, TA = + 25°C. CL includes probe and jig capacitance. SR = GND for all Switching Characteristics unless otherwise specified. Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: DS36C280 DS36C280 www.ti.com SNLS097C – JULY 2000 – REVISED FEBRUARY 2013 PARAMETER MEASUREMENT INFORMATION Figure 2. Driver VOD2 and VOC Figure 3. Driver VOD3 Figure 4. Driver VOH and VOL Vtest = −7V to +12V Figure 5. Driver IOSD Figure 6. Driver Differential Propagation Delay Test Circuit Figure 7. Driver Differential Propagation Delays and Differential Rise and Fall Times Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: DS36C280 5 DS36C280 SNLS097C – JULY 2000 – REVISED FEBRUARY 2013 www.ti.com Figure 8. TRI-STATE Test Circuit (tPZH , tPHZ) Figure 9. TRI-STATE Waveforms (tPZH, tPHZ) Figure 10. TRI-STATE Test Circuit (tPZL, tPLZ) Figure 11. TRI-STATE Waveforms (tPZL, tPLZ) Figure 12. Receiver VOH and VOL Figure 13. Receiver Differential Propagation Delay Test Circuit Figure 14. Receiver Differential Propagation Delay Waveforms 6 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: DS36C280 DS36C280 www.ti.com SNLS097C – JULY 2000 – REVISED FEBRUARY 2013 Figure 15. Receiver TRI-STATE Test Circuit Figure 16. Receiver Enable and Disable Waveforms (tPLZ, tPZL) Figure 17. Receiver Enable and Disable Waveforms (tPHZ, tPZH) Typical Application Information Figure 18. Typical Pin Connection Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: DS36C280 7 DS36C280 SNLS097C – JULY 2000 – REVISED FEBRUARY 2013 www.ti.com Table 1. DEVICE PIN DESCRIPTIONS Pin # Name Description 1 RO Receiver Output: When DE/RE* (Receiver Enable) is LOW, the receiver is enabled (ON), if DO/RI ≥ DO*/RI* by 200 mV, RO will be HIGH. If DO/RI ≤ DO*/RI* by 200 mV, RO will be LOW. Additionally RO will be HIGH for OPEN (Nonterminated) inputs. 2 SR Slew Rate Control: A resistor connected to Ground controls the Driver Output rising and falling edge rates. 3 DE/RE* Combined Driver and Receiver Output Enable: When signal is LOW the receiver output is enabled and the driver outputs are in TRI-STATE (OFF). When signaI is HlGH, the receiver output is in TRI-STATE (OFF) and the driver outputs are enabled. 4 DI Driver Input: When DE/RE* is HlGH, the driver is enabled, if DI is LOW, then DO/RI will be LOW and DO*/RI* will be HIGH. If DI is HIGH, then DO/RI is HIGH and DO*/RI* is LOW. 5 GND Ground Connection 6 DO/RI Driver Output/Receiver Input, 485 Bus Pin. 7 DO*/RI* Driver Output/Receiver Input, 485 Bus Pin. 8 VCC Positive Power Supply Connection: Recommended operating range for VCC is +4.75V to +5.25V. Unit Load A unit load for a RS-485 receiver is defined by the input current versus the input voltage curve. The gray shaded region is the defined operating range from −7V to +12V. The top border extending from −3V at 0 mA to +12V at +1 mA is defined as one unit load. Likewise, the bottom border extending from +5V at 0 mA to −7V at −0.8 mA is also defined as one unit load (see Figure 19 ). A RS-485 driver is capable of driving up to 32 unit loads. This allows upto 32 nodes on a single bus. Although sufficient for many applications, it is sometime desirable to have even more nodes. For example an aircraft that has 32 rows with 4 seats per row could benefit from having 128 nodes on one bus. This would allow signals to be transferred to and from each individual seat to 1 main station. Usually there is one or two less seats in the last row of the aircraft near the restrooms and food storage area. This frees the node for the main station. The DS36C278, the DS36C279, and the DS36C280 all have ½ unit load and ¼ unit load (UL) options available. These devices will allow upto 64 nodes or 128 nodes guaranteed over temperature depending upon which option is selected. The ½ UL option is available in industrial temperature and the ¼ UL is available in commercial temperature. First, for a ½ UL device the top and bottom borders shown in Figure 19 are scaled. Both 0 mA reference points at +5V and −3V stay the same. The other reference points are +12V at +0.5 mA for the top border and −7V at −0.4 mA for the bottom border (see Figure 19 ). Second, for a ¼ UL device the top and bottom borders shown in Figure 19 are scaled also. Again, both 0 mA reference points at +5V and −3V stay the same. The other reference points are +12V at +0.25 mA for the top border and −7V at −0.2 mA for the bottom border (see Figure 19 ). The advantage of the ½ UL and ¼ UL devices is the increased number of nodes on one bus. In a single master multi-slave type of application were the number of slaves exceeds 32, the DS36C278/279/280 may save in the cost of extra devices like repeaters, extra media like cable, and/or extra components like resistors. The DS36C279 and DS36C280 have addition feature which offer more advantages. The DS36C279 has an automatic sleep mode function for power conscious applications. The DS36C280 has a slew rate control for EMI conscious applications. Refer to the sleep mode and slew rate control portion of the application information section in the corresponding datasheet for more information on these features. Figure 19. Input Current vs Input Voltage Operating Range 8 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: DS36C280 DS36C280 www.ti.com SNLS097C – JULY 2000 – REVISED FEBRUARY 2013 Slew Rate Control The DS36C280 features an adjustable slew rate control. This feature allows more control over EMl levels than tradition fixed edge rate devices. The slew rate control may be adjusted with or without any external components. The DS36C280 offers both low power (ICC 500 μA max) and low EMI for an RS-485 interface. The slew rate control is located at pin two of the device and only controls the driver output edges. The slew rate control pin (SR) may be left open or shorted to ground, with or without a resistor. When the SR pin is shorted to ground without a resistor, the driver output edges will transition typically 350 ns. When the SR pin is left open, the driver output edges will transition typically 3 μs. When the SR pin is shorted to ground with a resistor, the driver output edges will transition between 350 ns and 3 μs depending on the resistor value. Refer to the slew rate versus resistor value curve in this datasheet for determining resistor values and expected typical slew rate value. Please note, when slowing the edge rates of the device will decrease the maximum data rate also. Figure 20. Slew Rate Resistor vs Differential Rise/Rise/Fall Time Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: DS36C280 9 DS36C280 SNLS097C – JULY 2000 – REVISED FEBRUARY 2013 www.ti.com REVISION HISTORY Changes from Revision B (February 2013) to Revision C • 10 Page Changed layout of National Data Sheet to TI format ............................................................................................................ 9 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: DS36C280 PACKAGE OPTION ADDENDUM www.ti.com 12-Oct-2014 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) DS36C280M/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 36C28 0M DS36C280MX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 36C28 0M DS36C280TM/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 36C28 0TM DS36C280TMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 36C28 0TM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 12-Oct-2014 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 11-Oct-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DS36C280MX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 DS36C280TMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Oct-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DS36C280MX/NOPB SOIC D 8 2500 367.0 367.0 35.0 DS36C280TMX/NOPB SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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