Bond-Ply® LMS-HD October 2014 PRODUCT DESCRIPTION Laminate Material - Silicone, High Durability, Optional Lamination Methods FEATURES AND BENEFITS • TO-220 Thermal performance: 2.3°C/W, initial pressure only lamination • Exceptional dielectric strength • Very low interfacial resistance • 200 psi adhesion strength • Continuous use of -60 to 180°C • Eliminates mechanical fasteners TYPICAL PROPERTIES OF BOND-PLY LMS-HD PROPERTY Color IMPERIAL VALUE Yellow Shelf Life: Bond-Ply LMS-HD is a heat-cured material and should be stored in temperature controlled conditions. The recommended storage temperature range of 5-25°C should be used to maintain optimum characteristics for a 5-month shelf life. ® Note: To build a part number, visit our website at www.bergquistcompany.com. TEST METHOD Visual Reinforcement Carrier Fiberglass Fiberglass — Thickness (inch) / (mm) 0.010, 0.012 0.254, 0.305 ASTM D374 Continuous Use Temp (°F) / (°C) -76 to 356 -60 to 180 — ADHESION Lap Shear @ RT (psi) / (MPa) 200 ELECTRICAL Breakdown Voltage, Sheet (Vac) (1) 1.4 VALUE 5000 Breakdown Voltage, Laminated (Vac) (2) ASTM D1002 TEST METHOD ASTM D149 4000 ASTM D149 Dielectric Constant (1000 Hz) 5.0 ASTM D150 Volume Resistivity (Ohm-meter) 10 ASTM D257 Flame Rating V-O U.L. 94 THERMAL Post-Cured Thermal Conductivity (W/m-K) (3) 1.4 ASTM D5470 Constant IPO TO-220 Thermal Performance (°C/W) 2.1 2.3 CURE SCHEDULE Cure @ 125°C (minutes) (5) 30 30 Cure @ 160°C (minutes) (5) 6 6 11 THERMAL IMPEDANCE vs LAMINATION METHOD Lamination Pressure (75 psi) (4) Bond-Ply® LMS-HD is a thermally conductive heat curable laminate material. The product consists of a high performance thermally conductive low modulus silicone compound coated on a cured core, and double lined with protective films. The low modulus silicone design effectively absorbs mechanical stresses induced by assembly-level CTE mismatch, shock and vibration while providing exceptional thermal performance (vs PSA technologies) and long-term integrity. Bond-Ply® LMS-HD will typically be used for structurally adhering power components and PCBs to a heat sink. METRIC VALUE Yellow 1) The ASTM D149 test method on cured LMS-HD material. No pressure was applied to the LMS-HD during the cure cycle. 2) A 1/2" diameter probe was laminated with LMS-HD to a 2" X 2" plate at 200 psi for 30 seconds, then cured with no pressure at 160°C for 6 minutes. The cured assembly was then tested per ASTM D149. This LMS-HD sample resembles a typical lamination application. 3). The ASTM D5470 (Bergquist Modified) test procedure was used on post-cured LMS-HD material. The recorded value includes interfacial thermal resistance. These values are given for customer reference only. 4). TO-220 Thermal Performance testing, per The Bergquist RD2010 specification for Laminates, was completed on laminated TO-220 assemblies. Lamination was completed at 75 psi for 30 seconds for "IPO" (Initial Pressure Only) and at a constant 75 psi during the lamination and curing process for "Constant". No additional pressure was applied during TO-220 thermal performance testing. 5). Cure Schedule – time after cure temperature is achieved at the interface. Ramp time is application dependent. TYPICAL APPLICATIONS INCLUDE • Discrete semi-conductor packages bonded to heat spreader or heat sink CONFIGURATIONS AVAILABLE • Roll form • Sheet form • Die-cut parts Liner Overall Thickness 10 or 12 mil Uncured Silicone Dispersion Fiberglass Cured Core Liner Note: Not to scale PDS_BP_LMS HD_October 2014 TDS Bond-Ply® LMS-HD, October 2014 Disclaimer Note: The information provided in this Technical Data Sheet (TDS) including the recommendations for use and application of the product are based on our knowledge and experience of the product as at the date of this TDS. The product can have a variety of different applications as well as differing application and working conditions in your environment that are beyond our control. Henkel is, therefore, not liable for the suitability of our product for the production processes and conditions in respect of which you use them, as well as the intended applications and results. We strongly recommend that you carry out your own prior trials to confirm such suitability of our product. Any liability in respect of the information in the Technical Data Sheet or any other written or oral recommendation(s) regarding the concerned product is excluded, except if otherwise explicitly agreed and except in relation to death or personal injury caused by our negligence and any liability under any applicable mandatory product liability law. In case products are delivered by Henkel Belgium NV, Henkel Electronic Materials NV, Henkel Nederland BV, Henkel Technologies France SAS and Henkel France SA please additionally note the following: In case Henkel would be nevertheless held liable, on whatever legal ground, Henkel’s liability will in no event exceed the amount of the concerned delivery. In case products are delivered by Henkel Colombiana, S.A.S. the following disclaimer is applicable: The information provided in this Technical Data Sheet (TDS) including the recommendations for use and application of the product are based on our knowledge and experience of the product as at the date of this TDS. Henkel is, therefore, not liable for the suitability of our product for the production processes and conditions in respect of which you use them, as well as the intended applications and results. We strongly recommend that you carry out your own prior trials to confirm such suitability of our product. Any liability in respect of the information in the Technical Data Sheet or any other written or oral recommendation(s) regarding the concerned product is excluded, except if otherwise explicitly agreed and except in relation to death or personal injury caused by our negligence and any liability under any applicable mandatory product liability law. In case products are delivered by Henkel Corporation, Resin Technology Group, Inc., or Henkel Canada Corporation, the following disclaimer is applicable: The data contained herein are furnished for information only and are believed to be reliable. We cannot assume responsibility for the results obtained by others over whose methods we have no control. It is the user’s responsibility to determine suitability for the user’s purpose of any production methods mentioned herein and to adopt such precautions as may be advisable for the protection of property and of persons against any hazards that may be involved in the handling and use thereof. In light of the foregoing, Henkel Corporation specifically disclaims all warranties expressed or implied, including warranties of merchantability or fitness for a particular purpose, arising from sale or use of Henkel Corporation’s products. Henkel Corporation specifically disclaims any liability for consequential or incidental damages of any kind, including lost profits. The discussion herein of various processes or compositions is not to be interpreted as representation that they are free from domination of patents owned by others or as a license under any Henkel Corporation patents that may cover such processes or compositions. We recommend that each prospective user test his proposed application before repetitive use, using this data as a guide. This product may be covered by one or more United States or foreign patents or patent applications. 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