ALM-32220 1.7 GHz – 2.7 GHz 2 Watt High Linearity Amplifier Data Sheet Description Features Avago Technologies’ ALM-32220 is a high linearity 2 Watt PA with good OIP3 performance and exceptionally good PAE at 1dB gain compression point, achieved through the use of Avago Technologies’ proprietary 0.25 µm GaAs Enhancement-mode pHEMT process. • Fully matched, input and output All matching components are fully integrated within the module. This makes the ALM-32220 extremely easy to use. The adjustable temperature-compensated internal bias circuit allows the device to be operated at either class A or class AB operation. The ALM-32220 is housed inside a miniature 7.0 × 10.0 × 1.1 mm3 20-lead multiple-chips-onboard (MCOB) module package. • High linearity and P1dB • Unconditionally stable across load condition • Built-in adjustable temperature compensated internal bias circuitry • GaAs E-pHEMT Technology[1] • 5V supply • Excellent uniformity in product specifications • Tape-and-Reel packaging option available • MSL-3 and Lead-free Component Image • High MTTF for base station application 7.0 × 10.0 × 1.1 mm3 20-Lead MCOB Package Specifications 1 • 14.8 dB Gain 16 2 • 50.0 dBm Output IP3 15 3 • 34.4 dBm Output Power at 1dB gain compression 14 4 13 5 12 6 17 32220 WWYY XXXX 18 20 19 • 47.5% PAE at P1dB RF OUT 11 7 10 Vdd2 Top View 2GHz; 5V, 800mA (typical) Vctrl Vdd1 9 8 Not Used Bottom View Notes: Package marking provides orientation and identification “32220” = Device Part Number “WWYY” = Work week and year of manufacture “XXXX” = Last 4 digit of lot number RF IN • 3.5dB Noise Figure Applications • Class A driver amplifier for GSM/PCS/W-CDMA/WiMAX Base Stations. • General purpose gain block. Note: 1. Enhancement mode technology employs positive gate voltage, thereby eliminating the need of negative gate voltage associated with conventional depletion mode devices. 2. Good RF practice requires all unused pins to be earthed. Attention: Observe precautions for handling electrostatic sensitive devices. ESD Machine Model = 200 V ESD Human Body Model = 1000 V Refer to Avago Application Note A004R: Electrostatic Discharge, Damage and Control. Absolute Maximum Rating [1] TA=25°C Thermal Resistance [2] θjc = 14 ºC/W (Vdd=5, Ids=800mA, Tc=85°C) Symbol Parameter Units Absolute Max. Vdd,max Device Voltage, RF output to ground V 5.5 Ids,max Device Drain Current mA 1500 Vctrl,max Control Voltage V 5.5 Pin,max CW RF Input Power dBm 28 Pdiss Total Power Dissipation [3] W 8.25 Tj, max Junction Temperature °C 150 TSTG Storage Temperature °C -65 to 150 Notes: 1. Operation of this device in excess of any of these limits may cause permanent damage. 2. Thermal resistance measured using Infra-Red measurement technique. 3. This is limited by maximum Vdd and Ids. Derate 71.4mW/ °C for Tc> 34.5 °C. Product Consistency Distribution Charts[4] LSL USL LSL Std Dev = 0.038 .600 .700 Std Dev = 0.364 .800 .900 1.000 47 48 49 50 51 52 53 Figure 2. OIP3; LSL = 48dBm, nominal = 50dBm Figure 1. Ids; LSL = 640mA, nominal = 800mA, USL = 910mA LSL Std Dev = 0.633 Std Dev = 0.062 33 33.5 34 34.5 35 Figure 3. P1dB; LSL = 33dBm, nominal = 34.4dBm LSL 40 42 44 46 48 50 52 54 Figure 4. PAE at P1dB; nominal = 47.5% USL Std Dev = 0.147 13 13.5 14 14.5 15 15.5 16 16.5 17 Figure 5. Gain; LSL=13.5dB, Nominal = 14.8dB, USL=16.8dB Note: 4. Distribution data sample size is 500 samples taken from 3 different wafer lots. TA = 25°C, Vdd = 5V, Vctrl = 5V, RF performance at 2GHz unless otherwise specified. Future wafers allocated to this product may have nominal values anywhere between the upper and lower limits. 5. Measurements are made on a production test board. Input trace losses have not been de-embedded from actual measurements. 2 Electrical Specifications [1] TA = 25 °C, Vdd =5V, Vctrl =5V, RF performance at 2GHz, measured on demo board (see Figure 7) unless otherwise specified. Symbol Parameter and Test Condition Units Min. Typ. Max. Ids Quiescent current mA 640 800 910 Ictrl Vctrl current mA - 11 - Gain Gain dB 13.5 14.8 16.8 OIP3 [2] Output Third Order Intercept Point dBm 48 50 - OP1dB Output Power at 1dB Gain Compression dBm 33.0 34.4 - PAE Power Added Efficiency % - 47.5 - NF Noise Figure (Typ.Vctrl=5.0V) dB - 3.5 - S11 Input Return Loss, 50Ω source dB - -9.0 - S22 Output Return Loss, 50Ω load dB - -9.0 - S12 Reverse Isolation dB - -30 - Notes: 1. Measurements at 2GHz obtained using demo board described in Figure 6 and 7. 2. OIP3 test condition: FRF1 - FRF2 = 10MHz with input power of -5dBm per tone measured at worst side band 3. Use proper biasing, heat sink and de-rating to ensure maximum channel temperature is not exceeded. See absolute maximum ratings and application note (if applicable) for more details. 3 S-Parameter [1] (Vdd = 5V, Vctrl = 5V, T = 25ºC, matched 50Ω) Freq (GHz) 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 4.0 4.1 4.2 4.3 4.4 4.5 4.6 4.7 4.8 4.9 5.0 5.1 5.2 5.3 5.4 5.5 5.6 5.7 5.8 5.9 6.0 S11 (dB) -0.12 -0.17 -0.22 -0.27 -0.31 -0.36 -0.40 -0.46 -0.52 -0.62 -0.79 -1.09 -1.63 -2.80 -4.88 -8.64 -12.43 -12.86 -10.82 -9.55 -9.33 -9.87 -11.08 -12.82 -14.28 -14.07 -12.18 -10.02 -8.46 -7.63 -7.58 -8.60 -12.27 -18.53 -16.10 -7.18 -3.72 -2.28 -1.56 -1.24 -1.06 -0.94 -0.86 -0.80 -0.76 -0.73 -0.71 -0.69 -0.68 -0.68 -0.68 -0.68 -0.68 -0.69 -0.70 -0.72 -0.74 -0.76 -0.78 -0.80 S11 (ang) 167.05 154.51 141.94 129.27 116.37 103.12 89.42 75.11 59.95 43.63 25.71 5.58 -17.59 -49.13 -85.12 -135.16 151.26 72.48 15.65 -22.12 -53.81 -84.59 -117.80 -157.62 151.74 94.58 42.86 1.82 -31.95 -62.00 -90.50 -119.31 -151.73 116.33 1.49 -65.40 -97.57 -123.55 -147.17 -164.84 179.56 165.36 152.19 139.80 127.98 116.61 105.59 94.84 84.29 73.89 63.60 53.36 43.12 32.87 22.57 12.17 1.67 -8.98 -19.79 -30.78 S21 (dB) -72.88 -66.14 -54.09 -42.75 -36.01 -30.60 -24.80 -19.48 -14.26 -9.03 -3.80 1.30 5.96 10.24 12.97 14.60 15.17 15.03 14.63 14.24 13.97 13.80 13.66 13.49 13.20 12.75 12.12 11.35 10.53 9.76 9.15 8.74 8.45 7.94 6.52 3.48 -1.29 -7.21 -14.31 -20.56 -26.60 -32.42 -38.05 -43.54 -48.92 -54.23 -59.32 -64.09 -68.17 -71.08 -72.64 -72.71 -72.21 -71.69 -70.99 -70.50 -70.30 -69.59 -68.40 -67.44 S21 (ang) -39.59 -158.67 133.83 82.54 46.13 22.23 -0.29 -23.43 -47.47 -73.73 -103.65 -138.69 -179.54 128.61 79.36 29.33 -18.76 -62.58 -101.86 -137.94 -172.34 153.80 119.80 85.33 50.34 15.04 -20.16 -54.87 -88.93 -122.65 -156.82 167.14 127.18 81.10 28.43 -27.36 -79.83 -124.21 -163.92 167.75 143.99 123.38 104.98 88.20 72.49 57.03 40.69 21.68 -0.97 -27.44 -52.75 -75.04 -93.36 -109.91 -123.52 -136.61 -151.08 -161.98 -173.74 170.18 S12 (dB) -71.31 -81.47 -83.30 -82.65 -81.29 -77.95 -74.29 -69.46 -64.39 -58.93 -53.26 -47.63 -42.41 -37.50 -34.22 -32.08 -31.04 -30.80 -30.88 -30.97 -30.97 -30.88 -30.77 -30.69 -30.73 -30.94 -31.33 -31.85 -32.42 -32.93 -33.29 -33.44 -33.46 -33.69 -34.77 -37.41 -41.67 -46.96 -53.10 -58.09 -62.44 -66.05 -68.88 -71.02 -72.27 -73.27 -74.09 -73.99 -73.51 -73.12 -73.02 -72.84 -72.23 -71.73 -71.21 -70.94 -70.62 -70.28 -69.09 -67.88 S12 (ang) 25.90 113.84 142.58 25.72 -2.31 -26.99 -51.86 -78.75 -104.61 -131.78 -160.90 165.38 126.02 76.05 28.25 -20.60 -67.80 -110.89 -149.49 175.02 141.10 107.62 73.84 39.45 4.36 -31.18 -66.74 -101.95 -136.65 -171.22 153.55 116.26 74.80 26.96 -27.86 -86.28 -141.89 170.25 126.90 96.38 71.41 50.40 33.27 19.99 9.22 -0.11 -11.00 -23.90 -35.51 -50.12 -64.79 -75.81 -87.59 -103.98 -118.95 -133.97 -145.93 -156.21 -169.51 173.43 S22 (dB) -0.14 -0.21 -0.27 -0.32 -0.37 -0.42 -0.49 -0.58 -0.72 -0.99 -1.52 -2.60 -4.63 -8.36 -12.17 -13.91 -12.65 -10.60 -9.50 -9.24 -9.53 -10.13 -10.81 -11.26 -11.15 -10.40 -9.27 -8.11 -7.17 -6.53 -6.23 -6.32 -6.90 -8.15 -10.02 -10.44 -8.12 -5.17 -3.22 -2.32 -1.80 -1.48 -1.27 -1.13 -1.03 -0.96 -0.90 -0.86 -0.83 -0.81 -0.79 -0.78 -0.77 -0.77 -0.77 -0.78 -0.78 -0.79 -0.81 -0.82 Notes: 1. S-parameter is measured with reference plane at SMA end launch using demo board shown in Figure 7. 2. Demo board 50Ω transmission line is CPWG with W = 21.7 mils, G = 19.2 mils, L = 615.5 mils, 10 mils Rogers RO4350, 0.5oz Cu. 3. Demo board SMA end launch is Johnson 142-0701-851. 4 S22 (ang) -175.93 162.14 144.44 128.65 113.24 97.62 81.41 64.21 45.51 24.59 0.54 -27.56 -59.95 -101.83 -149.98 147.00 83.78 35.03 -2.71 -35.61 -66.92 -98.77 -132.83 -170.10 150.06 109.90 71.72 36.49 3.96 -26.60 -56.10 -85.65 -117.01 -154.18 152.45 77.07 1.80 -51.70 -92.25 -119.49 -141.97 -161.39 -178.69 165.54 150.91 137.18 124.15 111.68 99.66 87.99 76.60 65.42 54.39 43.48 32.63 21.79 10.94 0.04 -10.92 -21.98 3 Vsense1 Vdd1 8 Vctrl 1,2 R4 To A R1 R3 To B C3 C2 C5 C4 Z1 C1 Bias Input match C7 C6 B 13 R2 18 50-Ohms TL C8 C9 C10 Z2 Size Value Description C1, C10 0805 2.2uF Ceramic Chip Capacitor C2, C4, C9 0402 0.1uF Ceramic Chip Capacitor C3, C5, C8 0402 10nF Ceramic Chip Capacitor C6, C7 0402 Not Used N/A R1, R2 1206 0 Ohm Chip Resistor R3 0402 Not Used N/A R4 0805 0 Ohm Chip Resistor Z1, Z2 0805 Optional Zener Diode 5.6V (Optional) A Vdd2 Module Output match Vsens2 50-Ohms TL Circuit Symbol Note: To supply Vdd1 and Vdd2 individually, remove R4 and supply Vdd1 from pin 1,2 and Vdd2 from pin 19,20 Figure 6. Demo board application schematics and components table DC Pin Configuration of 20-pin Connector Pins pointing out of the page Unit is on top 20 pin Connector 10 1 2 3 4 5 6 7 8 9 10 1 20 19 18 17 16 15 14 13 12 11 Vdd 1 – Pin 1, 2 Vsense1 – Pin 3 Vdd 2 – Pin 19, 20 (optional) Vsense2 – Pin 18 (optional) Vctrl – Pin 8 RF input Other pins are grounded Figure 7. Demo board Layout 1. Recommended PCB material is 10 mils Rogers RO4350, with FR4 backing for mechanical strength. 2. Suggested component values may vary according to layout and PCB material. 5 RF output ALM-32220 Typical Over-Temperature Performance Vdd = 5V, Vctrl = 5V, Input Signal = CW unless stated otherwise. 1100 1000 OIP3 (dBm) Ids (mA) 900 800 700 600 500 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 Temperature (˚C) Figure 8. Over temperature Ids 60 58 56 54 52 50 48 46 44 42 40 1.7 1.8 1.9 2.0 2.1 2.2 2.3 Frequency (GHz) 2.4 2.5 2.6 2.7 Figure 9. Over temperature OIP3 vs Frequency 18 37 85˚C 25˚C -40˚C 36 35 85˚C 25˚C -40˚C 17 16 Gain (dB) P1dB (dBm) 85˚C 25˚C -40˚C 34 33 15 14 13 12 32 31 1.7 11 1.8 1.9 2.0 2.1 2.2 2.3 Frequency (GHz) 2.4 2.5 2.6 10 1.7 2.7 Figure 10. Over temperature P1dB vs Frequency -6 2.1 2.2 2.3 Frequency (GHz) 2.4 2.5 2.6 2.7 -6 -9 -12 -15 -9 -12 -15 -18 -18 -21 -21 1.8 1.9 2.0 2.1 2.2 2.3 2.4 Frequency (GHz) Figure 12. Over temperature S11 vs Frequency 2.5 2.6 85˚C 25˚C -40˚C -3 S22 (dB) S11 (dB) 2.0 0 85˚C 25˚C -40˚C -3 6 1.9 Figure 11. Over temperature Gain vs Frequency 0 -24 1.7 1.8 2.7 -24 1.7 1.8 1.9 2.0 2.1 2.2 2.3 Frequency (GHz) Figure 13. Over temperature S22 vs Frequency 2.4 2.5 2.6 2.7 5 85˚C 25˚C -40˚C 4 EVM (%) S12 (dB) -25 -26 -27 -28 -29 -30 -31 -32 -33 -34 -35 1.7 1.8 1.9 2.0 2.1 2.2 2.3 Frequency (GHz) 2.4 2.5 2.6 2 -20 -25 -30 -35 -40 -45 -50 -55 -60 -65 -70 22.0 22.5 85˚C 25˚C -40˚C 3GPP WCD MA Test Model 1 +64D PCH +/- 5MHz Offset 23.0 23.5 24.0 24.5 25.0 25.5 26.0 26.5 27.0 Output Channel Power (dBm) 85˚C 25˚C -40˚C 3GPP WCD MA Test Model 1 +64D PCH +/- 5MHz Offset 23.0 23.5 24.0 24.5 25.0 25.5 26.0 26.5 27.0 Output Channel Power (dBm) Figure 18. Over temperature WCDMA ACPR vs Channel Power @ 2.6GHz -20 -25 -30 -35 -40 -45 -50 -55 -60 -65 -70 22.0 22.5 85˚C 25˚C -40˚C 3GPP WCD MA Test Model 1 +64D PCH +/- 5MHz Offset 23.0 23.5 24.0 24.5 25.0 25.5 26.0 26.5 27.0 Output Channel Power (dBm) Figure 17. Over temperature WCDMA ACPR vs Channel Power @ 2.5GHz ACPR (dBc) -20 -25 -30 -35 -40 -45 -50 -55 -60 -65 -70 22.0 22.5 Figure 15. Over temperature WiMAX EVM vs Output Power @ 2.5GHz ACPR (dBc) ACPR (dBc) 3 0 22.0 22.5 23.0 23.5 24.0 24.5 25.0 25.5 26.0 26.5 27.0 Output Channel Power (dBm) 2.7 Figure 16. Over temperature WCDMA ACPR vs Channel Power @ 2.14GHz ACPR (dBc) IEEE 802.16d 64-QAM BW 20MHz 1 Figure 14. Over temperature S12 vs Frequency 7 85˚C 25˚C -40˚C -20 -25 -30 -35 -40 -45 -50 -55 -60 -65 -70 22.0 22.5 85˚C 25˚C -40˚C 3GPP WCD MA Test Model 1 +64D PCH +/- 5MHz Offset 23.0 23.5 24.0 24.5 25.0 25.5 26.0 26.5 27.0 Output Channel Power (dBm) Figure 19. Over temperature WCDMA ACPR vs Channel Power @ 2.7GHz PCB Layout and Stencil Design 0.90 0.30 3.96 C'fer 0.3X45° ∅0.30 0.30 0.70 4.05 3.64 1.10 0.99 0.70 0.90 0.30 0.81 0.30 3.03 4.05 0.90 1.20 1.40 Stencil Outline 3.96 3.64 0.99 0.81 3.03 0.81 1.26 0.81 1.08 Combined PCB and stencil layout Land Pattern (Top View) 8 1.26 0.60 PCB Land Pattern (Top View) Note: All dimensions are in millimeters. 0.81 0.81 1.08 MCOB 7 x 10 Package Dimensions 7.00±0.10 0.60 Pin 1 identification 32220 WWYY XXXX 10.00±0.10 Top View 1.05±0.10 (4x) 0.90Sq (2x) 1.40 0.10 18 17 5.00 1 Pin 1 2 3 (6x) 1.20 (2x) 1.10 14 0.07 20 19 16 15 (Gaps between SM and metal) Side View (4x) 1.20 (2x) 0.90 4 13 5 12 6 11 7 10 9 8 5.00 0.10 (All corner) 2.05 2.90 Bottom View Notes: 1. All dimensions are in milimeters 2. Dimensions are inclusive of plating 3. Dimensions are exclusive of mold flash and metal burr 9 0.16 (SM width) C'fer 0.3X45° Part Number Ordering Information Product Family Part Number No. of Devices Container ALM-32220-TR1G 1000 ALM-32220-TR2G 3000 ALM-32220-BLKG 100 Frequency Band 13” Reel Output Power 700MHz-1GHz 1.7- 2.7GHz 3.3-3.9GHz 13” Reel 0.5W MGA-30116 MGA-30216 MGA-30316 1W ALM-31122 ALM-31222 ALM-31322 2W ALM-32120 ALM-32220 ALM-32320 antistatic bag Device Orientation REEL USER FEED DIRECTION CARRIER TAPE 32220 WWYY XXXX 32220 WWYY XXXX 32220 WWYY XXXX TOP VIEW USER FEED DIRECTION END VIEW COVER TAPE Tape Dimensions 12.00 ± .10 [.472 ± .004] 1.50 + .10 [.059 + .004] 4.00 ± .10 [.157 ± .004] 2.00 ± .10 [.079 ± .004] 1.75 ± .10 [.069 ± .004] 11.50 ± .10 [.453 ± .004] 24.00 + .30 − .10 [.945 + .012 − .004] 1.50 + .25 [.059 + .010] .330 ± .013 [.0130 ± .0005] 8˚ MAX 10 7˚ MAX 7.11 ± .10 [.280 ± .004] 1.52 ± .10 [.060 ± .004] 10.08 ± .10 [.397 ± .004] A. K. B. MM [INCH] Reel Dimensions – 13 Inch ESD Label (See Below) Recycle Symbol Detail ‘X’ 30.5mm 76.2mm Embossed Line X2 90.0mm Length Lines 147.0mm away Embossed ‘M’ 5.0mm Height from center point ESD Label FRONT VIEW Ø20.2 (Min) 25.65±1.75** 25.4±1.0* Recycle Symbol +0.5 Ø13.1 -0.2 2.2±0.5 See Detail ‘X’ FRONT BACK Ø100.0±0.5 Ø331.5 Max Detail ‘X’ 1.0 BACK VIEW Detail ‘Y’ Slot 10.0±0.5(2x) Slot 5.0±0.5***(1x) For product information and a complete list of distributors, please go to our web site: 4.0 30.4* Max www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2013 Avago Technologies. All rights reserved. AV02-1146EN - March 18, 2013 Detail ‘Y’ (Slot Hole)