Cypress CYW4343X Single-chip ieee 802.11 b/g/n mac/ baseband/radio with bluetooth 4.1,an fm receiver, and wireless charging Datasheet

CYW4343X
Single-Chip IEEE 802.11 b/g/n MAC/
Baseband/Radio with Bluetooth 4.1,
an FM Receiver, and Wireless Charging
The Cypress CYW4343X is a highly integrated single-chip solution and offers the lowest RBOM in the industry for smartphones
smartphones wearables, tablets, and a wide range of other portable devices. The chip includes a 2.4 GHz WLAN IEEE 802.11 b/g/n
MAC/baseband/radio, Bluetooth 4.1 support, and an FM receiver. In addition, it integrates a power amplifier (PA) that meets the output power requirements of most handheld systems, a low-noise amplifier (LNA) for best-in-class receiver sensitivity, and an internal
transmit/receive (iTR) RF switch, further reducing the overall solution cost and printed circuit board area.
The WLAN host interface supports gSPI and SDIO v2.0 modes, providing a raw data transfer rate up to 200 Mbps when operating in
4-bit mode at a 50 MHz bus frequency. An independent, high-speed UART is provided for the Bluetooth/FM host interface.Using
advanced design techniques and process technology to reduce active and idle power, the CYW4343X is designed to address the
needs of highly mobile devices that require minimal power consumption and compact size. It includes a power management unit that
simplifies the system power topology and allows for operation directly from a rechargeable mobile platform battery while maximizing
battery life.
The CYW4343X implements the world’s most advanced Enhanced Collaborative Coexistence algorithms and hardware mechanisms, allowing for an extremely collaborative WLAN and Bluetooth coexistence.
Figure 1. CYW4343X System Block Diagram
VDDIO
VBAT
WL_REG_ON
WLAN
Host I/F
WL_IRQ
SDIO*/SPI
2.4 GHz WLAN +
Bluetooth TX/RX
CLK_REQ
CYW4343X
BT_REG_ON
BPF
PCM
Bluetooth
Host I/F
BT_DEV_WAKE
FM
RX
BT_HOST_WAKE
UART
FM RX
Host I/F
I2S
Stereo Analog Out
Cypress Semiconductor Corporation
Document No. 002-14797 Rev. *H
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised October 19, 2016
CYW4343X
Figure 2. CYW4343X System Block Diagram
VDDIO
VBAT
WL_REG_ON
WLAN
Host I/F
WL_IRQ
SDIO*/SPI
2.4 GHz WLAN +
Bluetooth TX/RX
CLK_REQ
BT_REG_ON
PCM
Bluetooth
Host I/F
CYW4343X
BT_DEV_WAKE
BT_HOST_WAKE
UART
FM RX
Host I/F
BPF
FM
RX
Stereo Analog Out
Document No. 002-14797 Rev. *H
Page 2 of 128
CYW4343X
Features
IEEE 802.11x Key Features
■
Single-band 2.4 GHz IEEE 802.11b/g/n.
■
Support for 2.4 GHz Cypress TurboQAM® data rates
(256-QAM) and 20 MHz channel bandwidth.
■
Integrated iTR switch supports a single 2.4 GHz
antenna shared between WLAN and Bluetooth.
■
Supports explicit IEEE 802.11n transmit beamforming
■
Tx and Rx Low-density Parity Check (LDPC) support
for improved range and power efficiency.
■
Supports standard SDIO v2.0 and gSPI host interfaces.
■
Supports Space-Time Block Coding (STBC) in the
receiver.
Bluetooth and FM Key Features
■
Complies with Bluetooth Core Specification Version
4.1 with provisions for supporting future specifications.
■
Bluetooth Class 1 or Class 2 transmitter operation.
■
Supports extended Synchronous Connections
(eSCO), for enhanced voice quality by allowing for
retransmission of dropped packets.
■
Adaptive Frequency Hopping (AFH) for reducing radio
frequency interference.
■
Interface support — Host Controller Interface (HCI)
using a high-speed UART interface and PCM for audio
data.Bluetooth and FM Key Features (Continued)
General Features
■
Supports a battery voltage range from 3.0V to 4.8V
with an internal switching regulator.
■
Programmable dynamic power management.
■
4 Kbit One-Time Programmable (OTP) memory for
storing board parameters.
■
Can be routed on low-cost 1 x 1 PCB stack-ups.
■
74-ball[4343W+43CS4343W1]74-ball 63-ball WLBGA
package (4.87 mm × 2.87 mm, 0.4 mm pitch).
■
153-bump WLCSP package (115 μm bump diameter,
180 μm bump pitch).
■
Security:
❐ WPA and WPA2 (Personal) support for powerful
encryption and authentication.
Document No. 002-14797 Rev. *H
■
■
■
■
■
■
■
Integrated ARM Cortex-M3 processor and on-chip
memory for complete WLAN subsystem functionality,
minimizing the need to wake up the applications processor for standard WLAN functions. This allows for
further minimization of power consumption, while
maintaining the ability to field-upgrade with future features. On-chip memory includes 512 KB SRAM and
640 KB ROM.
OneDriver™ software architecture for easy migration
from existing embedded WLAN and Bluetooth devices
as well as to future devices.
FM receiver unit supports HCI for communication.
Low-power consumption improves battery life of handheld devices.
FM receiver: 65 MHz to 108 MHz FM bands; supports
the European Radio Data Systems (RDS) and the
North American Radio Broadcast Data System
(RBDS) standards.
Supports multiple simultaneous Advanced Audio Distribution Profiles (A2DP) for stereo sound.
Automatic frequency detection for standard crystal and
TCXO values.
AES in WLAN hardware for faster data encryption
and IEEE 802.11i compatibility.
❐ Reference WLAN subsystem provides Cisco Compatible Extensions (CCX, CCX 2.0, CCX 3.0, CCX
4.0, CCX 5.0).
❐ Reference WLAN subsystem provides Wi–Fi Protected Setup (WPS).
Worldwide regulatory support: Global products supported with worldwide homologated design.
Multimode wireless charging support that complies
with the Alliance for Wireless Power (A4WP), the
Wireless Power Consortium (WPC), and the Power
Matters Alliance (PMA).
❐
■
■
Page 3 of 128
CYW4343X
Introduction
This document provides details of the functional, operational, and electrical characteristics of the Cypress CYW4343X. It is intended
for hardware design, application, and OEM engineers.
Cypress part numbering scheme
Cypress is converting the acquired IoT part numbers from Broadcom to the Cypress part numbering scheme. Due to this conversion,
there is no change in form, fit, or function as a result of offering the device with Cypress part number marking. The table provides
Cypress ordering part number that matches an existing IoT part number.
Table 1. Mapping Table for Part Number between Broadcom and Cypress
Broadcom Part Number
Cypress Part Number
BCM4343SKUBG
CYW4343SKUBG
BCM4343WKUBG
CYW4343WKUBG
BCM4343WKWBG
CYW4343WKWBG
BCM4343W1KUBG
CYW4343W1KUBG
IoT Resources
Cypress provides a wealth of data at http://www.cypress.com/internet-things-iot to help you to select the right IoT device for your
design, and quickly and effectively integrate the device into your design. Cypress provides customer access to a wide range of information, including technical documentation, schematic diagrams, product bill of materials, PCB layout information, and software
updates. Customers can acquire technical documentation and software from the Cypress Support Community website (http://community.cypress.com/).
Document No. 002-14797 Rev. *H
Page 4 of 128
CYW4343X
Contents
1. Overview ............................................................ 7
7. Bluetooth + FM Subsystem Overview........... 40
1.1
Overview ............................................................. 7
7.1
Features .............................................................40
1.2
Features .............................................................. 9
7.2
1.3
Standards Compliance ........................................ 9
Bluetooth Radio ..................................................41
7.2.1 Transmit ..................................................41
7.2.2 Digital Modulator .....................................41
7.2.3 Digital Demodulator and Bit
Synchronizer ...........................................41
7.2.4 Power Amplifier ......................................42
7.2.5 Receiver .................................................42
7.2.6 Digital Demodulator and Bit
Synchronizer ...........................................42
7.2.7 Receiver Signal Strength Indicator .........42
7.2.8 Local Oscillator Generation ....................42
7.2.9 Calibration ..............................................42
2. Power Supplies and Power Management ..... 11
2.1
Power Supply Topology .................................... 11
2.2
CYW4343X PMU Features ............................... 11
2.3
WLAN Power Management ............................... 18
2.4
PMU Sequencing .............................................. 18
2.5
Power-Off Shutdown ......................................... 19
2.6
Power-Up/Power-Down/Reset Circuits ............. 19
2.7
Wireless Charging ............................................. 19
3. Frequency References ................................... 22
3.1
Crystal Interface and Clock Generation ............ 22
3.2
TCXO ................................................................ 22
3.3
External 32.768 kHz Low-Power Oscillator ....... 23
8. Bluetooth Baseband Core.............................. 43
8.1
Bluetooth 4.1 Features .......................................43
8.2
Link Control Layer ..............................................43
8.3
Test Mode Support .............................................43
8.4
Bluetooth Power Management Unit ...................44
8.4.1 RF Power Management ..........................44
8.4.2 Host Controller Power Management ......44
8.5
BBC Power Management ...................................45
8.5.1 FM Power Management .........................46
8.5.2 Wideband Speech ..................................46
8.6
Packet Loss Concealment .................................46
8.6.1 Codec Encoding .....................................47
8.6.2 Multiple Simultaneous A2DP
Audio Streams ........................................47
8.6.3 FM Over Bluetooth .................................47
8.7
Adaptive Frequency Hopping .............................47
8.8
Advanced Bluetooth/WLAN Coexistence ...........47
8.9
Fast Connection (Interlaced Page and
Inquiry Scans) ....................................................47
4. WLAN System Interfaces ............................... 25
4.1
SDIO v2.0 .......................................................... 25
4.1.1 SDIO Pin Descriptions ........................... 25
4.2
Generic SPI Mode ............................................. 26
4.3
SPI Protocol ...................................................... 27
4.3.1 Command Structure .............................. 28
4.3.1.1.Write ......................................................... 29
4.3.1.2.Write/Read ............................................... 29
4.3.1.3.Read ........................................................ 29
4.3.2 Status .................................................... 29
4.4
gSPI Host-Device Handshake ........................... 31
4.4.1 Boot-Up Sequence ................................ 32
5. Wireless LAN MAC and PHY.......................... 35
5.1
5.2
MAC Features ................................................... 35
5.1.1 MAC Description .................................... 35
5.1.1.1.PSM ......................................................... 36
5.1.1.2.WEP ......................................................... 36
5.1.1.3.TXE .......................................................... 36
5.1.1.4.RXE .......................................................... 36
5.1.1.5.IFS ........................................................... 37
5.1.1.6.TSF .......................................................... 37
5.1.1.7.NAV .......................................................... 37
5.1.1.8.MAC-PHY Interface ................................. 37
PHY Description ................................................ 37
5.2.1 PHY Features ........................................ 37
6. WLAN Radio Subsystem ................................ 39
6.1
Receive Path ..................................................... 39
6.2
Transmit Path .................................................... 40
6.3
Calibration ......................................................... 40
Document No. 002-14797 Rev. *H
9. Microprocessor and Memory Unit for Bluetooth
48
9.1
RAM, ROM, and Patch Memory .........................48
9.2
Reset ..................................................................48
10. Bluetooth Peripheral Transport Unit............. 48
10.1 PCM Interface ....................................................48
10.1.1 Slot Mapping ...........................................48
10.1.2 Frame Synchronization ...........................48
10.1.3 Data Formatting ......................................48
10.1.4 Wideband Speech Support .....................49
10.1.5 Multiplexed Bluetooth and FM
over PCM ................................................49
10.1.6 PCM Interface Timing .............................50
10.1.6.1.Short Frame Sync, Master Mode ............50
10.1.6.2.Short Frame Sync, Slave Mode ..............51
10.1.6.3.Long Frame Sync, Master Mode .............52
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CYW4343X
10.1.6.4.Long Frame Sync, Slave Mode .............. 53
15. DC Characteristics.......................................... 91
10.2 UART Interface ................................................. 53
15.1 Absolute Maximum Ratings ...............................91
10.3 I2S Interface ...................................................... 55
10.3.1 I2S Timing .............................................. 55
15.2 Environmental Ratings .......................................91
11. FM Receiver Subsystem................................. 57
11.1 FM Radio ........................................................... 57
15.4 Recommended Operating Conditions and
DC Characteristics .............................................92
11.2 Digital FM Audio Interfaces ............................... 57
16. WLAN RF Specifications................................ 93
11.3 Analog FM Audio Interfaces .............................. 57
16.1 2.4 GHz Band General RF Specifications ..........93
11.4 FM Over Bluetooth ............................................ 57
16.2 WLAN 2.4 GHz Receiver Performance
Specifications .....................................................93
11.5 eSCO ................................................................ 57
11.6 Wideband Speech Link ..................................... 57
11.7 A2DP ................................................................. 58
11.8 Autotune and Search Algorithms ...................... 58
15.3 Electrostatic Discharge Specifications ...............91
16.3 WLAN 2.4 GHz Transmitter Performance
Specifications .....................................................96
16.4 General Spurious Emissions Specifications .......97
11.9 Audio Features .................................................. 58
17. Bluetooth RF Specifications .......................... 98
11.10RDS/RBDS ....................................................... 60
18. FM Receiver Specifications ......................... 104
12. CPU and Global Functions............................. 61
12.1 WLAN CPU and Memory Subsystem ............... 61
19. Internal Regulator Electrical
Specifications ............................................... 108
12.2 One-Time Programmable Memory .................... 61
19.1 Core Buck Switching Regulator .......................108
12.3 GPIO Interface .................................................. 61
19.2 3.3V LDO (LDO3P3) ........................................108
12.4 External Coexistence Interface ......................... 61
12.4.1 2-Wire Coexistence ............................... 61
12.4.2 3-Wire and 4-Wire Coexistence
Interfaces ............................................... 62
19.3 CLDO ...............................................................109
12.5 JTAG Interface ................................................. 63
12.6 UART Interface ................................................ 63
13. WLAN Software Architecture......................... 64
19.4 LNLDO .............................................................110
20. System Power Consumption ....................... 111
20.1 WLAN Current Consumption ............................111
20.1.1 2.4 GHz Mode ......................................111
20.2 Bluetooth and FM Current Consumption ..........112
13.1 Host Software Architecture ............................... 64
21. Interface Timing and AC Characteristics ... 113
13.2 Device Software Architecture ............................ 64
21.1 SDIO Default Mode Timing ..............................113
13.3 Remote Downloader ......................................... 64
21.2 SDIO High-Speed Mode Timing .......................114
13.4 Wireless Configuration Utility ............................ 64
21.3 gSPI Signal Timing ...........................................115
14. Pinout and Signal Descriptions..................... 65
21.4 JTAG Timing ....................................................116
14.1 Ball Map ............................................................ 65
22. Power-Up Sequence and Timing ................. 117
14.2 WLBGA Ball List in Ball Number Order with
X-Y Coordinates ................................................ 67
22.1 Sequencing of Reset and Regulator
Control Signals .................................................117
22.1.1 Description of Control Signals ..............117
22.1.2 Control Signal Timing Diagrams ...........117
14.3 WLBGA Ball List in Ball Number Order with
X-Y Coordinates ................................................ 70
14.4 WLCSP Bump List in Bump Order with
X-Y Coordinates ................................................ 71
23. Package Information .................................... 119
14.6 WLBGA Ball List Ordered By Ball Name ........... 77
23.1 Package Thermal Characteristics ....................119
23.1.1 Junction Temperature Estimation and
PSI Versus Thetajc ......................................... 119
14.7 WLCSP Bump List Ordered By Name .............. 78
24. Mechanical Information................................ 120
14.8 Signal Descriptions ........................................... 80
25. Ordering Information.................................... 126
14.9 WLAN GPIO Signals and Strapping Options .... 87
Document History Page ............................................... 127
14.10Chip Debug Options ......................................... 87
Sales, Solutions, and Legal Information .................... 128
14.5 WLBGA Ball List Ordered By Ball Name ........... 76
14.11I/O States .......................................................... 88
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Page 6 of 128
CYW4343X
1. Overview
1.1 Overview
The Cypress CYW4343X provides the highest level of integration for a mobile or handheld wireless system, with integrated IEEE 802.11 b/g/n. It provides a small form-factor
solution with minimal external components to drive down cost for mass volumes and allows for handheld device flexibility in size, form, and function. The CYW4343X is
designed to address the needs of highly mobile devices that require minimal power consumption and reliable operation.
Figure 3 on page 7 Figure 4 on page 8 Figure 3 on page 7 shows the interconnection of all the major physical blocks in the CYW4343X and their associated external interfaces, which are described in greater detail in subsequent sections.
SDP
F M D ig ita l
ADC
FM
I/F
FM D em od.
M DX RDS
D ecode
LN A
ADC
A H B to A P B
B rid g e
AHB Bus Matrix
FM RF
RSSI
Debug
AHB
FM RX
FM _RX
ETM
C o rte x
M3
JTAG*
Figure 3. CYW4343X Block Diagram
P a tc h
W D T im e r
In te r C trl
S W T im e r
C o n tro l
LO
G en.
RAM
ROM
APB
D P LL
DMA
Bu s A rb
A R M IP
G P IO
C trl
ARM
CM3
LCU
RAM
R X /T X
G P IO
RO M
B u ffe r
IF
PLL
BT PHY
W ake/
o elx
SWleiM
e pa x CC tr
W iM a x
C o e x.
B T ‐W L A N
ECI
B T F M C lo c k C o n tr o l
S le e p ‐
tim e
K e e p in g
LPO
C lo c k
M anagem ent
PM U
C tr l
PM U
XO
B u ffe r
O TP
G P IO
G P IO
UART
S u p p o r te d o v e r S D IO o r B T P C M
UART
JT A G *
2 .4 G H z
PA
S h a re d LN A
BPF
PO R
W LA N
BT_REG_ON
VREGs
VBAT
PTU
XTAL
Pow er
S u p p ly
S le e p C L K
XTAL
W L_ REG _ O N
W DT
Radio
D ig ita l
M od.
2.4 GHz
PA
MAC
B lu e R F
In te rfa c e
gSPI
LNPPHY
I2 S / P C M
B T C lo c k /
Hopper
RF
IEEE 802.11a/b/g/n
I/O Port Control
D ig ita l
I/ O
M odem
D ig ita l
Dem od.
& B it
Sync
APU
Backplane
Debug
UART
SW REG
LD O x2
LPO
XTAL O SC.
PO R
PM U
C o n tr o l
S D IO
JTAG*
B u ffe r
Common and
BPL
UART
Radio Digital
JT A G s u p p o rte d o v e r S D IO o r B T P C M
S D IO o r g S P I
* V ia G P IO c o n fig u r a tio n , JT A G is su p p o r te d o v e r S D IO o r B T P C M
Document No. 002-14797 Rev. *H
Page 7 of 128
CYW4343X
FM RX
SDP
FM Digital
FM
I/F
FM Demod.
MDX RDS
Decode
LNA
ADC
AHB to APB
Bridge
AHB Bus Matrix
ADC
RSSI
Debug
AHB
FM RF
FM_RX
ETM
Cortex
M3
JTAG*
Figure 4. CYW4343X Block Diagram
Patch
WD Timer
InterCtrl
SW Timer
Control
LO
Gen.
RAM
ROM
APB
DPLL
DMA
Bus Arb
ARM IP
GPIO
Ctrl
JTAG supported over SDIO or BT PCM
SDIO or gSPI
gSPI
ARM
CM3
RX/TX
GPIO
ROM
Buffer
IF
PLL
BT PHY
Wake/
WiMax Ctrl
Coex
Sleep
WiMax
Coex.
BT‐WLAN
ECI
BTFM Clock Control
Sleep‐
time
Keeping
LPO
Clock
Management
PMU
XO
Buffer
PMU
Ctrl
JTAG*
2.4 GHz
PA
Shared LNA
BPF
POR
WLAN
BT_REG_ON
VREGs
VBAT
PTU
XTAL
GPIO
UART
Supported over SDIO or BT PCM
UART
Radio
RAM
OTP
GPIO
2.4 GHz
Digital
Mod.
LCU
Power
Supply
Sleep CLK
XTAL
WL_REG_ON
WDT
MAC
PA
LNPPHY
PCM
BlueRF
Interface
SDIO
IEEE 802.11a/b/g/n
I/O Port Control
Digital
I/O
BT Clock/
Hopper
RF
SWREG
LDOx2
LPO
XTAL OSC.
POR
PMU
Control
Backplane
Debug
UART
Modem
Digital
Demod.
& Bit
Sync
APU
JTAG*
Buffer
Common and
Radio Digital
BPL
UART
* Via GPIO configuration, JTAG is supported over SDIO or BT PCM
Document No. 002-14797 Rev. *H
Page 8 of 128
CYW4343X
1.2 Features
The CYW4343X supports the following WLAN, Bluetooth, and FM features:
■
IEEE 802.11b/g/n single-band radio with an internal power amplifier, LNA, and T/R switch
■
Bluetooth v4.1 with integrated Class 1 PA
■
Concurrent Bluetooth, FM (RX) RDS/RBDS, and WLAN operation
■
On-chip WLAN driver execution capable of supporting IEEE 802.11 functionality
■
Simultaneous BT/WLAN reception with a single antenna
■
WLAN host interface options:
❐ SDIO v2.0, including default and high-speed timing.
❐ gSPI—up to a 50 MHz clock rate
■
BT UART (up to 4 Mbps) host digital interface that can be used concurrently with the above WLAN host interfaces.
■
ECI—enhanced coexistence support, which coordinates BT SCO transmissions around WLAN receptions.
■
I2S/PCM for FM/BT audio, HCI for FM block control
HCI high-speed UART (H4 and H5) transport support
■
Wideband speech support (16 bits, 16 kHz sampling PCM, through I2S and PCM interfaces)
■
■
■
■
■
■
■
■
■
■
■
■
Bluetooth SmartAudio® technology improves voice and music quality to headsets.
Bluetooth low power inquiry and page scan
Bluetooth Low Energy (BLE) support
Bluetooth Packet Loss Concealment (PLC)
FM advanced internal antenna support
FM auto searching/tuning functions
FM multiple audio routing options: I2S, PCM, eSCO, and A2DP
FM mono-stereo blending and switching, and soft mute support
FM audio pause detection support
Multiple simultaneous A2DP audio streams
FM over Bluetooth operation and on-chip stereo headset emulation
1.3 Standards Compliance
The CYW4343X supports the following standards:
■
Bluetooth 2.1 + EDR
■
Bluetooth 3.0
■
Bluetooth 4.1 (Bluetooth Low Energy)
■
65 MHz to 108 MHz FM bands (US, Europe, and Japan)
■
IEEE 802.11n—Handheld Device Class (Section 11)
■
IEEE 802.11b
■
IEEE 802.11g
■
IEEE 802.11d
■
IEEE 802.11h
■
IEEE 802.11i
The CYW4343X will support the following future drafts/standards:
■
IEEE 802.11r — Fast Roaming (between APs)
■
IEEE 802.11k — Resource Management
■
IEEE 802.11w — Secure Management Frames
■
IEEE 802.11 Extensions:
■
■
■
■
IEEE 802.11e QoS Enhancements (as per the WMM® specification is already supported)
IEEE 802.11i MAC Enhancements
IEEE 802.11r Fast Roaming Support
IEEE 802.11k Radio Resource Measurement
Document No. 002-14797 Rev. *H
Page 9 of 128
CYW4343X
The CYW4343X supports the following security features and proprietary protocols:
■
Security:
❐ WEP
❐
WPA™ Personal
WPA2™ Personal
❐ WMM
❐ WMM-PS (U-APSD)
❐ WMM-SA
❐ WAPI
❐ AES (Hardware Accelerator)
❐ TKIP (host-computed)
❐ CKIP (SW Support)
Proprietary Protocols:
❐ CCXv2
❐ CCXv3
❐ CCXv4
❐ CCXv5
IEEE 802.15.2 Coexistence Compliance — on silicon solution compliant with IEEE 3-wire requirements.
❐
■
■
Document No. 002-14797 Rev. *H
Page 10 of 128
CYW4343X
2. Power Supplies and Power Management
2.1 Power Supply Topology
One Buck regulator, multiple LDO regulators, and a power management unit (PMU) are integrated into the CYW4343X. All regulators are programmable via the PMU. These blocks simplify power supply design for Bluetooth, WLAN, and FM functions in embedded designs.
A single VBAT (3.0V to 4.8V DC maximum) and VDDIO supply (1.8V to 3.3V) can be used, with all additional voltages being provided by the regulators in the CYW4343X.
Two control signals, BT_REG_ON and WL_REG_ON, are used to power up the regulators and take the respective circuit blocks out
of reset. The CBUCK CLDO and LNLDO power up when any of the reset signals are deasserted. All regulators are powered down
only when both BT_REG_ON and WL_REG_ON are deasserted. The CLDO and LNLDO can be turned on and off based on the
dynamic demands of the digital baseband.
The CYW4343X allows for an extremely low power-consumption mode by completely shutting down the CBUCK, CLDO, and
LNLDO regulators. When in this state, LPLDO1 provides the CYW4343X with all required voltage, further reducing leakage currents.
Note: VBAT should be connected to the LDO_VDDBAT5V and SR_VDDBAT5V pins of the device.
Note: VDDIO should be connected to the SYS_VDDIO and WCC_VDDIO pins WCC_VDDIO pin of the device.
2.2 CYW4343X PMU Features
The PMU supports the following:
■
VBAT to 1.35Vout (170 mA nominal, 370 mA maximum) Core-Buck (CBUCK) switching regulator
■
VBAT to 3.3Vout (250 mA nominal, 450 mA maximum 800 mA peak maximum) LDO3P3
■
1.35V to 1.2Vout (100 mA nominal, 150 mA maximum) LNLDO
■
1.35V to 1.2Vout (80 mA nominal, 200 mA maximum) CLDO with bypass mode for deep sleep
■
Additional internal LDOs (not externally accessible)
■
PMU internal timer auto-calibration by the crystal clock for precise wake-up timing from extremely low power-consumption
mode.
■
PMU input supplies automatic sensing and fast switching to support A4WP operations.
Figure 5 on page 12 Figure 6 on page 13 Figure 7 on page 14 and Figure 8 on page 15Figure 9 on page 16 Figure 10 on page 17
show the typical power topology of the CYW4343X.
Document No. 002-14797 Rev. *H
Page 11 of 128
CYW4343X
Figure 5. Typical Power Topology (1 of 2)(4343S)
SR_VDDBAT5V
VBAT
Mini PMU
CYW4343S_WPT
1.2V
VBAT:
Operational:
2.4—4.8V
Performance:
3.0—4.8V
Absolute Maximum: 5.5V
VDDIO
Operational:
1.8—3.3V
Core Buck
Int_SR_VBAT
Regulator
Peak: 370 mA
Avg: 170 mA
(320 mA)
VDD1P35
1.2V
WL RF—LOGEN
Internal RXLDO
10 mA (NMOS)
1.2V
WL RF—RX LNA
Internal ADCLDO
10 mA (NMOS)
1.2V
WL RF—ADC REF
Internal TXLDO
80 mA (PMOS)
1.2V
WL RF—TX
Internal AFELDO
80 mA (NMOS)
1.2V
LDO_VDD_1P5
SR_VBAT5V
SR_PVSS
WL RF—AFE and TIA
Mini PMU is placed
in WL radio
2.2 uH
0603
VBAT
WCC_VDDIO
Internal VCOLDO
80 mA (NMOS)
1.35V
SR_VLX
SW1
GND
WL RF—TX Mixer and PA
(not all versions)
4.7 uF
0402
LNLDO
(100 mA)
1.2V
600 @
100 MHz
WL RF—XTAL
FM_RFVDD
VOUT_LNLDO
2.2 uF
0402
PMU_VSS
WLRF_XTAL_
VDD1P2
FM LNA, Mixer
0.1 uF
0201
FM_RFPLL
WPT_1P8
WCC_VDDIO
(40 mA)
(40 mA)
LPLDO1
(5 mA)
1.1V
WLAN/BT/CLB/Top, Always On
VSEL1
(40 mA)
WPT_1P8
o_wpt_resetb
WL_REG_ON
BT_REG_ON
4.6 mA
FM PLL, LOGEN, Audio DAC
SYS_VDDIO
SYS_VDDIO
10 mA average,
> 10 mA at start‐up
WL RF—RFPLL PFD and MMD
VDDC1
1.3V, 1.2V,
WPTLDO
(40 mA)
1.3V
CL LDO
or 0.95V
Peak: 200 mA (AVS)
Avg: 80 mA
(Bypass in deep‐
VOUT_CLDO
sleep)
WL OTP
VDDC2
2.2 uF
0402
o_wl_resetb
o_bt_resetb
Supply ball
WL Digital and PHY
WL VDDM (SROMs & AOS)
Supply bump/pad
Power switch
BT VDDM
Ground ball
Ground bump/pad
No power switch
BT/WLAN reset
balls
External to chip
No dedicated power switch, but internal power‐
down modes and block‐specific power switches
Document No. 002-14797 Rev. *H
BT Digital
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CYW4343X
Figure 6. Typical Power Topology (1 of 2)(4343W+43CS4343W1)
SR_VDDBAT5V
VBAT
WL RF—TX Mixer and PA
(not all versions)
CYW4343X
Mini PMU
1.2V
VBAT:
Operational:
2.4—4.8V
Performance:
3.0—4.8V
Absolute Maximum: 5.5V
VDDIO
Operational:
1.8—3.3V
VDD1P35
Internal VCOLDO
80 mA (NMOS)
1.2V
WL RF—LOGEN
Internal RXLDO
10 mA (NMOS)
1.2V
WL RF—RX LNA
Internal ADCLDO
10 mA (NMOS)
1.2V
WL RF—ADC REF
Internal TXLDO
80 mA (PMOS)
1.2V
WL RF—TX
Internal AFELDO
80 mA (NMOS)
1.2V
1.35V
Core Buck
Int_SR_VBAT
Regulator
Peak: 370 mA
Avg: 170 mA
(320 mA)
SR_VLX
Mini PMU is placed
in WL radio
2.2 uH
0603
SW1
LDO_VDD_1P5
SR_VBAT5V
VBAT
SR_PVSS
GND
WCC_VDDIO
WL RF—AFE and TIA
4.7 uF
0402
LNLDO
(100 mA)
1.2V
600 @
100 MHz
WL RF—XTAL
FM_RFVDD
VOUT_LNLDO
2.2 uF
0402
PMU_VSS
WLRF_XTAL_
VDD1P2
FM LNA, Mixer
0.1 uF
0201
FM_RFPLL
WPT_1P8
WCC_VDDIO
(40 mA)
(40 mA)
LPLDO1
(5 mA)
1.1V
WLAN/BT/CLB/Top, Always On
VSEL1
(40 mA)
WPT_1P8
o_wpt_resetb
WL_REG_ON
BT_REG_ON
4.6 mA
FM PLL, LOGEN, Audio DAC
SYS_VDDIO
SYS_VDDIO
10 mA average,
> 10 mA at start‐up
WL RF—RFPLL PFD and MMD
VDDC1
1.3V, 1.2V,
WPTLDO
(40 mA)
1.3V
CL LDO
or 0.95V
Peak: 200 mA (AVS)
Avg: 80 mA
(Bypass in deep‐
VOUT_CLDO
sleep)
WL OTP
VDDC2
2.2 uF
0402
o_wl_resetb
o_bt_resetb
Supply ball
WL Digital and PHY
WL VDDM (SROMs & AOS)
Supply bump/pad
Power switch
BT VDDM
Ground ball
Ground bump/pad
No power switch
BT/WLAN reset
balls
External to chip
No dedicated power switch, but internal power‐
down modes and block‐specific power switches
Document No. 002-14797 Rev. *H
BT Digital
Page 13 of 128
CYW4343X
Figure 7. Typical Power Topology (1 of 2)
SR_VDDBAT5V
VBAT
Mini PMU
CYW4343X
1.2V
VBAT:
Operational:
2.4—4.8V
Performance:
3.0—4.8V
Absolute Maximum: 5.5V
VDDIO
Operational:
1.8—3.3V
Core Buck
Int_SR_VBAT
Regulator
Peak: 370 mA
Avg: 170 mA
(320 mA)
VDD1P35
Internal VCOLDO
80 mA (NMOS)
1.2V
WL RF—LOGEN
Internal RXLDO
10 mA (NMOS)
1.2V
WL RF—RX LNA
Internal ADCLDO
10 mA (NMOS)
1.2V
WL RF—ADC REF
Internal TXLDO
80 mA (PMOS)
1.2V
WL RF—TX
Internal AFELDO
80 mA (NMOS)
1.2V
1.35V
SR_VLX
LDO_VDD_1P5
SR_VBAT5V
VBAT
SR_PVSS
WL RF—AFE and TIA
Mini PMU is placed
in WL radio
2.2 uH
0603
SW1
GND
WL RF—TX Mixer and PA
(not all versions)
4.7 uF
0402
LNLDO
(100 mA)
1.2V
600 @
100 MHz
WL RF—XTAL
FM_RF_VDD
VOUT_LNLDO
2.2 uF
0402
PMU_VSS
WLRF_XTAL_
VDD1P2
FM LNA, Mixer, TIA, VCO
BTFM_PLL_VDD 6.4 mA
BT_IF_VDD
WCC_VDDIO
(40 mA)
LPLDO1
(5 mA)
4.6 mA
0.1 uF
0201
BT_VCO_VDD
WCC_VDDIO
10 mA average,
> 10 mA at start‐up
WL RF—RFPLL PFD and MMD
FM PLL, LOGEN, Audio DAC/BT PLL
BT LNA, Mixer, VCO
BT ADC, Filter
1.1V
WLAN/BT/CLB/Top, Always On
VDDC1
1.3V, 1.2V,
CL LDO
or 0.95V
Peak: 200 mA (AVS)
Avg: 80 mA
(Bypass in deep‐
VOUT_CLDO
sleep)
WL_REG_ON
BT_REG_ON
WL OTP
VDDC2
2.2 uF
0402
o_wl_resetb
o_bt_resetb
Supply ball
WL Digital and PHY
WL VDDM (SROMs & AOS)
Supply bump/pad
Power switch
BT VDDM
Ground ball
Ground bump/pad
No power switch
BT/WLAN reset
balls
External to chip
No dedicated power switch, but internal power‐
down modes and block‐specific power switches
Document No. 002-14797 Rev. *H
BT Digital
Page 14 of 128
CYW4343X
Figure 8. Typical Power Topology (2 of 2)(4343S)
CYW4343S_WPT
1.8V, 2.5V, and 3.3V
VBAT
LDO_
VDDBAT5V
6.4 mA
WL BBPLL/DFLL
WL OTP 3.3V
LDO3P3 with
Back‐Power
VOUT_3P3
Protection
4.7 uF
(Peak 450‐800 mA
200 mA Average) 3.3V
0402
WPT_3P3
SW2
Peak: 92 mA
Average: 75 mA
Resistance: 1 ohm
WLRF_PA_VDD
480 to 800 mA
WL RF—PA (2.4 GHz)
1 uF
0201
2.5V Cap‐less
LNLDO
(10 mA)
22
ohm
6.4 mA
WL RF—ADC, AFE, LOGEN,
LNA, NMOS Mini‐PMU LDOs
Placed inside WL Radio
BT_PAVDD
Peak: 70 mA
Average: 15 mA
BT Class 1 PA
1 uF
0201
Power switch
External to chip
No power switch
Supply ball
No dedicated power switch, but internal power‐
down modes and block‐specific power switches
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Page 15 of 128
CYW4343X
Figure 9. Typical Power Topology (2 of 2)(4343W+43CS4343W1)
CYW4343X
6.4 mA
1.8V, 2.5V, and 3.3V
VBAT
LDO_
VDDBAT5V
WL BBPLL/DFLL
WL OTP 3.3V
LDO3P3 with
Back‐Power
VOUT_3P3
Protection
4.7 uF
(Peak 450‐800 mA
200 mA Average) 3.3V
0402
WPT_3P3
SW2
Peak: 92 mA
Average: 75 mA
Resistance: 1 ohm
480 to 800 mA
WLRF_PA_VDD
WL RF—PA (2.4 GHz)
1 uF
0201
2.5V Cap‐less
LNLDO
(10 mA)
22
ohm
6.4 mA
WL RF—ADC, AFE, LOGEN,
LNA, NMOS Mini‐PMU LDOs
Placed inside WL Radio
BT_PAVDD
Peak: 70 mA
Average: 15 mA
BT Class 1 PA
1 uF
0201
Power switch
External to chip
No power switch
Supply ball
No dedicated power switch, but internal power‐
down modes and block‐specific power switches
Document No. 002-14797 Rev. *H
Page 16 of 128
CYW4343X
Figure 10. Typical Power Topology (2 of 2)
CYW4343X
1.8V, 2.5V, and 3.3V
VBAT
LDO_
VDDBAT5V
6.4 mA
WL BBPLL/DFLL
WL OTP 3.3V
LDO3P3 with
Back‐Power
VOUT_3P3
Protection
4.7 uF
(Peak 450‐800 mA
200 mA Average) 3.3V
0402
WLRF_PA_VDD
480 to 800 mA
WL RF—PA (2.4 GHz)
1 uF
0201
2.5V Cap‐less
LNLDO
(10 mA)
22
ohm
6.4 mA
WL RF—ADC, AFE, LOGEN,
LNA, NMOS Mini‐PMU LDOs
Placed inside WL Radio
BT_PAVDD
Peak: 70 mA
Average: 15 mA
BT Class 1 PA
1 uF
0201
Power switch
External to chip
No power switch
Supply ball
No dedicated power switch, but internal power‐
down modes and block‐specific power switches
Document No. 002-14797 Rev. *H
Page 17 of 128
CYW4343X
2.3 WLAN Power Management
The CYW4343X has been designed with the stringent power consumption requirements of mobile devices in mind. All areas of the
chip design are optimized to minimize power consumption. Silicon processes and cell libraries were chosen to reduce leakage current and supply voltages. Additionally, the CYW4343X integrated RAM is a high volatile memory with dynamic clock control. The
dominant supply current consumed by the RAM is leakage current only. Additionally, the CYW4343X includes an advanced WLAN
power management unit (PMU) sequencer. The PMU sequencer provides significant power savings by putting the CYW4343X into
various power management states appropriate to the operating environment and the activities that are being performed. The power
management unit enables and disables internal regulators, switches, and other blocks based on a computation of the required
resources and a table that describes the relationship between resources and the time needed to enable and disable them. Power-up
sequences are fully programmable. Configurable, free-running counters (running at the 32.768 kHz LPO clock) in the PMU
sequencer are used to turn on/turn off individual regulators and power switches. Clock speeds are dynamically changed (or gated
altogether) for the current mode. Slower clock speeds are used wherever possible.
The CYW4343X WLAN power states are described as follows:
■
Active mode— All WLAN blocks in the CYW4343X are powered up and fully functional with active carrier sensing and
frame transmission and receiving. All required regulators are enabled and put in the most efficient mode based on the load
current. Clock speeds are dynamically adjusted by the PMU sequencer.
■
Doze mode—The radio, analog domains, and most of the linear regulators are powered down. The rest of the CYW4343X
remains powered up in an IDLE state. All main clocks (PLL, crystal oscillator) are shut down to reduce active power to the
minimum. The 32.768 kHz LPO clock is available only for the PMU sequencer. This condition is necessary to allow the
PMU sequencer to wake up the chip and transition to Active mode. In Doze mode, the primary power consumed is due to
leakage current.
■
Deep-sleep mode—Most of the chip, including analog and digital domains, and most of the regulators are powered off.
Logic states in the digital core are saved and preserved to retention memory in the always-on domain before the digital core
is powered off. To avoid lengthy hardware reinitialization, the logic states in the digital core are restored to their pre-deepsleep settings when a wake-up event is triggered by an external interrupt, a host resume through the SDIO bus, or by the
PMU timers.
■
Power-down mode—The CYW4343X is effectively powered off by shutting down all internal regulators. The chip is brought
out of this mode by external logic re-enabling the internal regulators.
2.4 PMU Sequencing
The PMU sequencer is used to minimize system power consumption. It enables and disables various system resources based on a
computation of required resources and a table that describes the relationship between resources and the time required to enable
and disable them.
Resource requests can derive from several sources: clock requests from cores, the minimum resources defined in the ResourceMin
register, and the resources requested by any active resource request timers. The PMU sequencer maps clock requests into a set of
resources required to produce the requested clocks.
Each resource is in one of the following four states:
■
enabled
■
disabled
■
transition_on
■
transition_off
The timer value is 0 when the resource is enabled or disabled and nonzero during state transition. The timer is loaded with the
time_on or time_off value of the resource when the PMU determines that the resource must be enabled or disabled. That timer decrements on each 32.768 kHz PMU clock. When it reaches 0, the state changes from transition_off to disabled or transition_on to
enabled. If the time_on value is 0, the resource can transition immediately from disabled to enabled. Similarly, a time_off value of 0
indicates that the resource can transition immediately from enabled to disabled. The terms enable sequence and disable sequence
refer to either the immediate transition or the timer load-decrement sequence.
During each clock cycle, the PMU sequencer performs the following actions:
■
Computes the required resource set based on requests and the resource dependency table.
■
Decrements all timers whose values are nonzero. If a timer reaches 0, the PMU clears the ResourcePending bit for the
resource and inverts the ResourceState bit.
■
Compares the request with the current resource status and determines which resources must be enabled or disabled.
■
Initiates a disable sequence for each resource that is enabled, no longer being requested, and has no powered-up dependents.
Document No. 002-14797 Rev. *H
Page 18 of 128
CYW4343X
■
Initiates an enable sequence for each resource that is disabled, is being requested, and has all of its dependencies
enabled.
2.5 Power-Off Shutdown
The CYW4343X provides a low-power shutdown feature that allows the device to be turned off while the host, and any other devices
in the system, remain operational. When the CYW4343X is not needed in the system, VDDIO_RF and VDDC are shut down while
VDDIO remains powered. This allows the CYW4343X to be effectively off while keeping the I/O pins powered so that they do not
draw extra current from any other devices connected to the I/O.
During a low-power shutdown state, provided VDDIO remains applied to the CYW4343X, all outputs are tristated, and most input
signals are disabled. Input voltages must remain within the limits defined for normal operation. This is done to prevent current paths
or create loading on any digital signals in the system, and enables the CYW4343X to be fully integrated in an embedded device and
to take full advantage of the lowest power-savings modes.
When the CYW4343X is powered on from this state, it is the same as a normal power-up, and the device does not retain any information about its state from before it was powered down.
2.6 Power-Up/Power-Down/Reset Circuits
The CYW4343X has two signals (see Table 2) that enable or disable the Bluetooth and WLAN circuits and the internal regulator
blocks, allowing the host to control power consumption. For timing diagrams of these signals and the required power-up sequences,
see Section 22.: “Power-Up Sequence and Timing,” on page 116.
Table 2. Power-Up/Power-Down/Reset Control Signals
Signal
Description
WL_REG_ON
This signal is used by the PMU (with BT_REG_ON) to power-up the WLAN section. It is also OR-gated with the
BT_REG_ON input to control the internal CYW4343X regulators. When this pin is high, the regulators are enabled and
the WLAN section is out of reset. When this pin is low, the WLAN section is in reset. If BT_REG_ON and WL_REG_ON
are both low, the regulators are disabled. This pin has an internal 200 k pull-down resistor that is enabled by default.
It can be disabled through programming.
BT_REG_ON
This signal is used by the PMU (with WL_REG_ON) to decide whether or not to power down the internal CYW4343X
regulators. If BT_REG_ON and WL_REG_ON are low, the regulators will be disabled. This pin has an internal 200 k
pull-down resistor that is enabled by default. It can be disabled through programming.
2.7 Wireless Charging
The CYW4343X, when paired with a Broadcom BCM5935X wireless power transfer (WPT) front-end device, complies with the following three wireless charging standards:
■
Alliance for Wireless Power (A4WP)
■
Wireless Power Consortium (WPC)
■
Power Matters Alliance (PMA)
To support the WPC and PMA standards, control-plane signaling is accomplished using in-band signaling between the BCM5935X
WPT front-end device (located in the power receiving entity) and the power transmitting wireless charger.
To support the A4WP standard, energy is transferred from a Power Transmitting Unit (PTU) to a Power Receiving Unit (PRU). The
energy transferred charges the PRU battery. Bidirectional communication between the PTU and PRU is accomplished using Bluetooth Low Energy (BLE), where the PTU is a BLE client and the PRU is a BLE server. Using a BLE link, the PRU sends performance
data to the PTU so that it can adapt its power output to meet the needs of the PRU.
The most common use for wireless charging is to charge a mobile device battery.
Figure 11 shows a simple block diagram of a system that supports the A4WP standard.
Document No. 002-14797 Rev. *H
Page 19 of 128
CYW4343X
Figure 11. A4WP System Block Diagram
BT
Power Receiving Unit
(PRU)
Bluetooth low‐energy (BLE) bidirectional
communication enables the transmitter to
adapt to mobile device system needs.
A4WP‐Compatible Mobile Device
BLE Server
Wireless Power Transfer at 6.78 MHz
BT
Power Transmitting Unit
(PTU)
aka Power Plate
BLE Client
Note: A single PTU can be used to charge multiple devices.
Figure 12 shows an example of the magnetic coupling between a single PTU and one or more PRUs.
Figure 12. Magnetic Coupling for Wireless Charging
Power Transmitting
Unit
Power Receiving Unit(s)
RX1
TX
RX2
RX3
Figure 13 shows an example A4WP-compliant wireless charging implementation.
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Page 20 of 128
CYW4343X
Figure 13. An Example Multimode Wireless Charging Implementation
Motherboard
BSC
BSC
WPC/PMA
Coil
USB
NTC
WPT Front End (Power IC)
Load
Control
A4WP
Coil
Bridge
Rectifier
BSC IF
Slave
Voltage
Regulator
Power
3.3V
LDO
1.8V
LDO
External Charger
Battery
Charging
VDDIO
Host (AP)
VBAT
V1P8SYS
VBAT
VBAT
SPDT
WPT_3V3 (VBAT)
1V8
SPDT
WPT_1V8 (VDDIO)
Monitoring/
Control
WPT_IRQ
PMU
BT_REG_ON
LDO_VDDBAT5V,
SR_VDDBAT5V
SYS_VDDIO,
WCC_VDDIO
BCM5935X
WL_REG_ON
PMU
Wake‐Up
POR
Internal
Power
WPT_IRQ
BSC_CLK
BSC_SDA
NFC IC
NFC_GPIO
BT_VDDIO Domain
OTP for A4WPT
Parameters
CYW4343X
Figure 14 shows the signal interface between a CYW4343X and a CYW59350.
Figure 14. CYW4343X Interface to a BCM59350
BT_GPIO_3 (WPT_INTb)
CYW4343X
BT_GPIO_4 (BSC_SDA)
BCM59350
Wireless
Charging PMU
BT_GPIO_5 (BSC_SCL)
Document No. 002-14797 Rev. *H
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CYW4343X
3. Frequency References
An external crystal is used for generating all radio frequencies and normal operation clocking. As an alternative, an external frequency reference driven by a temperature-compensated crystal oscillator (TCXO) signal may be used. No software settings are
required to differentiate between the two. In addition, a low-power oscillator (LPO) is provided for lower power mode timing.
3.1 Crystal Interface and Clock Generation
The CYW4343X can use an external crystal to provide a frequency reference. The recommended configuration for the crystal oscillator, including all external components, is shown in Figure 15. Consult the reference schematics for the latest configuration.
Figure 15. Recommended Oscillator Configuration
C
WLRF_XTAL_XOP
12 – 27 pF
C
WLRF_XTAL_XON
12 – 27 pF
R
Note: Resistor value determined by crystal drive level.
See reference schematics for details.
The CYW4343X uses a fractional-N synthesizer to generate the radio frequencies, clocks, and data/packet timing so that it can
operate using numerous frequency references. The frequency reference can be an external source such as a TCXO or a crystal
interfaced directly to the CYW4343X.
The default frequency reference setting is a 37.4 MHz crystal or TCXO. The signal requirements and characteristics for the crystal
interface are shown in Table 3 on page 23.
Note: Although the fractional-N synthesizer can support many reference frequencies, frequencies other than the default require
support to be added in the driver, plus additional extensive system testing. Contact Broadcom for further details.
3.2 TCXO
As an alternative to a crystal, an external precision TCXO can be used as the frequency reference, provided that it meets the phase
noise requirements listed in Table 3 on page 23.
If the TCXO is dedicated to driving the CYW4343X, it should be connected to the WLRF_XTAL_XOP pin through an external capacitor with value ranges from 200 pF to 1000 pF as shown in Figure 16.
Document No. 002-14797 Rev. *H
Page 22 of 128
CYW4343X
Figure 16. Recommended Circuit to Use with an External Dedicated TCXO
200 pF – 1000 pF
TCXO
WLRF_XTAL_XOP
NC
WLRF_XTAL_XON
Table 3. Crystal Oscillator and External Clock Requirements and Performance
External Frequency
Reference
Crystal
Parameter
Conditions/Notes
Min.
Frequency
–
–
Crystal load capacitance
–
–
ESR
–
Drive level
External crystal must be able to tolerate
this drive level.
Input Impedance
(WLRF_XTAL_XOP)
Typ.
Max.
Min.
Typ.
Max.
Units
37.4
–
–
–
–
MHz
12
–
–
–
–
pF
–
–
60
–
–
–
Ω
200
–
–
–
–
–
μW
Resistive
–
–
–
10k
100k
–
Ω
Capacitive
–
–
–
–
–
7
pF
WLRF_XTAL_XOP input
voltage
AC-coupled analog signal
–
–
–
400b
–
1260
mVp-p
WLRF_XTAL_XOP input
low level
DC-coupled digital signal
–
–
–
0
–
0.2
V
WLRF_XTAL_XOP input
high level
DC-coupled digital signal
–
–
–
1.0
–
1.26
V
Frequency tolerance
Initial + over temperature
–
–20
–
20
–20
–
20
ppm
Duty cycle
37.4 MHz clock
–
–
–
40
50
60
%
Phase Noisec, d, e
(IEEE 802.11 b/g)
37.4 MHz clock at 10 kHz offset
–
–
–
–
–
–129
dBc/Hz
37.4 MHz clock at 100 kHz offset
–
–
–
–
–
–136
dBc/Hz
c, d, e
Phase Noise
(IEEE 802.11n, 2.4 GHz)
37.4 MHz clock at 10 kHz offset
–
–
–
–
–
–134
dBc/Hz
37.4 MHz clock at 100 kHz offset
–
–
–
–
–
–141
dBc/Hz
Phase Noisec, d, e
(256-QAM)
37.4 MHz clock at 10 kHz offset
–
–
–
–
–
–140
dBc/Hz
37.4 MHz clock at 100 kHz offset
–
–
–
–
–
–147
dBc/Hz
a.
a
The frequency step size is approximately 80 Hz. The CYW4343X does not auto-detect the reference clock frequency; the frequency is specified
in the software and/or NVRAM file.
b.
To use 256-QAM, a 800 mV minimum voltage is required.
c.
For a clock reference other than 37.4 MHz, 20 × log10(f/37.4) dB should be added to the limits, where f = the reference clock frequency in MHz.
d.
Phase noise is assumed flat above 100 kHz.
e.
The CYW4343X supports a 26 MHz reference clock sharing option. See the phase noise requirement in the table.
3.3 External 32.768 kHz Low-Power Oscillator
The CYW4343X uses a secondary low-frequency sleep clock for low-power mode timing. Either the internal low-precision LPO or an
external 32.768 kHz precision oscillator is required. The internal LPO frequency range is approximately 33 kHz ± 30% over process,
voltage, and temperature, which is adequate for some applications. However, one trade-off caused by this wide LPO tolerance is a
small current consumption increase during power save mode that is incurred by the need to wake up earlier to avoid missing beacons.
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CYW4343X
Whenever possible, the preferred approach is to use a precision external 32.768 kHz clock that meets the requirements listed in
Table 4 on page 24.
Note: The CYW4343X will auto-detect the LPO clock. If it senses a clock on the EXT_SLEEP_CLK pin, it will use that clock. If it
doesn't sense a clock, it will use its own internal LPO.
■
To use the internal LPO: Tie EXT_SLEEP_CLK to ground. Do not leave this pin floating.
■
To use an external LPO: Connect the external 32.768 kHz clock to EXT_SLEEP_CLK.
Table 4. External 32.768 kHz Sleep-Clock Specifications
Parameter
LPO Clock
Units
Nominal input frequency
32.768
kHz
Frequency accuracy
±200
ppm
Duty cycle
30–70
%
Input signal amplitude
200–3300
mV, p-p
Signal type
Input impedance
a
Clock jitter
Square wave or sine wave
–
>100
kΩ
<5
pF
<10,000
ppm
a. When power is applied or switched off.
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4. WL AN System Interfaces
4.1 SDIO v2.0
The CYW4343X WLAN section supports SDIO version 2.0. for both 1-bit (25 Mbps) and 4-bit modes (100 Mbps), as well as high
speed 4-bit mode (50 MHz clocks—200 Mbps). It has the ability to map the interrupt signal on a GPIO pin. This out-of-band interrupt
signal notifies the host when the WLAN device wants to turn on the SDIO interface. The ability to force control of the gated clocks
from within the WLAN chip is also provided.
SDIO mode is enabled using the strapping option pins. See Table 24 on page 86 for details.
Three functions are supported:
■
Function 0 standard SDIO function. The maximum block size is 32 bytes.
■
Function 1 backplane function to access the internal System-on-a-Chip (SoC) address space. The maximum block size is
64 bytes.
■
Function 2 WLAN function for efficient WLAN packet transfer through DMA. The maximum block size is 512 bytes.
4.1.1 SDIO Pin Descriptions
Table 5. SDIO Pin Descriptions
SD 4-Bit Mode
SD 1-Bit Mode
DATA0
Data line 0
DATA
DATA1
Data line 1 or Interrupt
DATA2
Data line 2
DATA3
Data line 3
NC
gSPI Mode
Data line
DO
Data output
IRQ
Interrupt
IRQ
Interrupt
NC
Not used
NC
Not used
Not used
CS
Card select
CLK
Clock
CLK
Clock
SCLK
Clock
CMD
Command line
CMD
Command line
DI
Data input
Figure 17. Signal Connections to SDIO Host (SD 4-Bit Mode)
CLK
CMD
SD Host
CYW4343X
DAT[3:0]
Figure 18. Signal Connections to SDIO Host (SD 1-Bit Mode)
CLK
CMD
CYW4343X
SD Host
DATA
IRQ
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4.2 Generic SPI Mode
In addition to the full SDIO mode, the CYW4343X includes the option of using the simplified generic SPI (gSPI) interface/protocol.
Characteristics of the gSPI mode include:
■
Up to 50 MHz operation
■
Fixed delays for responses and data from the device
■
Alignment to host gSPI frames (16 or 32 bits)
■
Up to 2 KB frame size per transfer
■
Little-endian and big-endian configurations
■
A configurable active edge for shifting
■
Packet transfer through DMA for WLAN
gSPI mode is enabled using the strapping option pins. See Table 24 on page 86 for details.
Figure 19. Signal Connections to SDIO Host (gSPI Mode)
SCLK
DI
DO
SD Host
CYW4343X
IRQ
CS
4.3 SPI Protocol
The SPI protocol supports both 16-bit and 32-bit word operation. Byte endianess is supported in both modes. Figure 20 and
Figure 21 on page 27 show the basic write and write/read commands.
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CYW4343X
Figure 20. gSPI Write Protocol
Figure 21. gSPI Read Protocol
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CYW4343X
4.3.1 Command Structure
The gSPI command structure is 32 bits. The bit positions and definitions are shown in Figure 22.
Figure 22. gSPI Command Structure
BCM_SPID Command Structure
31 30 29 28 27
C
A
11 10
F1 F0
Address – 17 bits
0
Packet length - 11bits *
* 11’h0 = 2048 bytes
Function No: 00 – Func 0:
0 All SPI-specific registers
01 – Func 1:
1 Registers and memories belonging to other blocks in the chip (64 bytes max)
10 – Func 2:
2 DMA channel 1. WLAN packets up to 2048 bytes.
11 – Func 3:
3 DMA channel 2 (optional). Packets up to 2048 bytes.
Access : 0 – Fixed address
1 – Incremental address
Command : 0 – Read
1 – Write
4.3.1.1 Write
The host puts the first bit of the data onto the bus half a clock-cycle before the first active edge following the CS going low. The following bits are clocked out on the falling edge of the gSPI clock. The device samples the data on the active edge.
4.3.1.2 Write/Read
The host reads on the rising edge of the clock requiring data from the device to be made available before the first rising-clock edge
of the data. The last clock edge of the fixed delay word can be used to represent the first bit of the following data word. This allows
data to be ready for the first clock edge without relying on asynchronous delays.
4.3.1.3 Read
The read command always follows a separate write to set up the WLAN device for a read. This command differs from the write/read
command in the following respects: a) chip selects go high between the command/address and the data, and b) the time interval
between the command/address is not fixed.
4.3.2 Status
The gSPI interface supports status notification to the host after a read/write transaction. This status notification provides information
about packet errors, protocol errors, available packets in the RX queue, etc. The status information helps reduce the number of interrupts to the host. The status-reporting feature can be switched off using a register bit, without any timing overhead. The gSPI bus
timing for read/write transactions with and without status notification are as shown in Figure 23 below and Figure 24 on page 30.
See Table 6 on page 30 for information on status-field details.
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Figure 23. gSPI Signal Timing Without Status
Write
CS
SCLK
MOSI
C31
C31 C30
C30
C1
C1
C0
C0
D31
D31 D30
D30
Command 32 bits
Write-Read
D1
D1
D0
D0
Write Data 16*n bits
CS
SCLK
MOSI
C31
C31 C30
C30
C0
C0
MISO
D31
D31 D30
D30
Response
Delay
Command
32 bits
Read
D1
D1
D0
D0
Read Data 16*n bits
CS
SCLK
MOSI
C31
C31 C30
C30
C0
C0
D31
D31 D30
D30
MISO
Command
32 bits
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Response
Delay
D0
D0
Read Data
16*n bits
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CYW4343X
Figure 24. gSPI Signal Timing with Status (Response Delay = 0)
CS
Write
SCLK
C31
C31
MOSI
C1
C1
C0
C0
D31
D31
D1
D1
D0
D0
S31
S31
MISO
Command 32 bits
Write-Read
Write Data 16*n bits
S1
S1
S0
S0
Status 32 bits
CS
SCLK
C31
C31
MOSI
C0
C0
MISO
D31
D31
Command 32 bits
D1
D1
D0
D0
S31
S31
Read Data 16*n bits
S0
S0
Status 32 bits
CS
Read
SCLK
MOSI
C31
C31
C0
C0
MISO
D31
D31
Command 32 bits
D1
D1
D0
D0
S31
S31
Read Data 16*n bits
S0
S0
Status 32 bits
Table 6. gSPI Status Field Details
Bit
Name
Description
0
Data not available
The requested read data is not available.
1
Underflow
FIFO underflow occurred due to current (F2, F3) read command.
2
Overflow
FIFO overflow occurred due to current (F1, F2, F3) write command.
3
F2 interrupt
F2 channel interrupt.
5
F2 RX ready
F2 FIFO is ready to receive data (FIFO empty).
7
Reserved
–
8
F2 packet available
Packet is available/ready in F2 TX FIFO.
9:19
F2 packet length
Length of packet available in F2 FIFO
4.4 gSPI Host-Device Handshake
To initiate communication through the gSPI after power-up, the host needs to bring up the WLAN chip by writing to the wake-up
WLAN register bit. Writing a 1 to this bit will start up the necessary crystals and PLLs so that the CYW4343X is ready for data transfer. The device can signal an interrupt to the host indicating that the device is awake and ready. This procedure also needs to be followed for waking up the device in sleep mode. The device can interrupt the host using the WLAN IRQ line whenever it has any
information to pass to the host. On getting an interrupt, the host needs to read the interrupt and/or status register to determine the
cause of the interrupt and then take necessary actions.
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CYW4343X
4.4.1 Boot-Up Sequence
After power-up, the gSPI host needs to wait 50 ms for the device to be out of reset. For this, the host needs to poll with a read command to F0 address 0x14. Address 0x14 contains a predefined bit pattern. As soon as the host gets a response back with the correct
register content, it implies that the device has powered up and is out of reset. After that, the host needs to set the wake-up WLAN bit
(F0 reg 0x00 bit 7). Wake-up WLAN turns the PLL on; however, the PLL doesn't lock until the host programs the PLL registers to set
the crystal frequency.
For the first time after power-up, the host needs to wait for the availability of the low-power clock inside the device. Once it is available, the host needs to write to a PMU register to set the crystal frequency. This will turn on the PLL. After the PLL is locked, the chipActive interrupt is issued to the host. This indicates device awake/ready status. See Table 7 for information on gSPI registers.
In Table 7, the following notation is used for register access:
■
R: Readable from host and CPU
■
W: Writable from host
■
U: Writable from CPU
Table 7. gSPI Registers
Address
x0000
Register
Bit
Access
Default
Description
Word length
0
R/W/U
0
0: 16-bit word length
1: 32-bit word length
Endianess
1
R/W/U
0
0: Little endian
1: Big endian
High-speed mode
4
R/W/U
1
0: Normal mode. Sample on SPICLK rising edge, output on
falling edge.
1: High-speed mode. Sample and output on rising edge of
SPICLK (default).
Interrupt polarity
5
R/W/U
1
0: Interrupt active polarity is low.
1: Interrupt active polarity is high (default).
Wake-up
7
R/W
0
A write of 1 denotes a wake-up command from host to device.
This will be followed by an F2 interrupt from the gSPI device
to host, indicating device awake status.
Status enable
0
R/W
1
0: No status sent to host after a read/write.
1: Status sent to host after a read/write.
Interrupt with status
1
R/W
0
0: Do not interrupt if status is sent.
1: Interrupt host even if status is sent.
x0003
Reserved
–
–
–
–
x0004
Interrupt register
0
R/W
0
Requested data not available. Cleared by writing a 1 to this
location.
1
R
0
F2/F3 FIFO underflow from the last read.
2
R
0
F2/F3 FIFO overflow from the last write.
5
R
0
F2 packet available
6
R
0
F3 packet available
7
R
0
F1 overflow from the last write.
5
R
0
F1 Interrupt
6
R
0
F2 Interrupt
7
R
0
F3 Interrupt
x0002
x0005
Interrupt register
x0006,
x0007
Interrupt enable
register
15:0
R/W/U
16'hE0E7
Particular interrupt is enabled if a corresponding bit is set.
x0008 to
x000B
Status register
31:0
R
32'h0000
Same as status bit definitions
x000C,
x000D
F1 info. register
0
R
1
F1 enabled
1
R
0
F1 ready for data transfer
13:2
R/U
12'h40
F1 maximum packet size
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CYW4343X
Table 7. gSPI Registers (Cont.)
Address
x000E,
x000F
Register
F2 info. register
Bit
Access
0
R/U
1
15:2
Default
Description
1
F2 enabled
R
0
F2 ready for data transfer
R/U
14'h800
F2 maximum packet size
x0014 to
x0017
Test-Read only register 31:0
R
32'hFEEDBEA This register contains a predefined pattern, which the host can
D
read to determine if the gSPI interface is working properly.
x0018 to
x001B
Test–R/W register
31:0
R/W/U
32'h00000000 This is a dummy register where the host can write some
pattern and read it back to determine if the gSPI interface is
working properly.
x001C to
x001F
Response delay
registers
7:0
R/W
0x1D = 4, other Individual response delays for F0, F1, F2, and F3. The value
registers = 0
of the registers is the number of byte delays that are
introduced before data is shifted out of the gSPI interface
during host reads.
Figure 25 on page 33 shows the WLAN boot-up sequence from power-up to firmware download, including the initial device poweron reset (POR) evoked by the WL_REG_ON signal. After initial power-up, the WL_REG_ON signal can be held low to disable the
CYW4343X or pulsed low to induce a subsequent reset.
Note: The CYW4343X has an internal power-on reset (POR) circuit. The device will be held in reset for a maximum of 3 ms after
VDDC and VDDIO have both passed the 0.6V threshold.
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Figure 25. WLAN Boot-Up Sequence
Ramp time from 0V to 4.3V > 40 µs
0.6V
VBAT
VDDIO
> 2 Sleep Clock cycles
WL_REG_ON
< 1.5 ms
VDDC
(from internal PMU)
< 3 ms
Internal POR
< 50 ms
After a fixed delay following internal POR going high,
the device responds to host F0 (address 0x14) reads.
Device requests a reference clock.
1
15 ms
1
After 15 ms the reference clock
is assumed to be up. Access to
PLL registers is possible.
SPI Host Interaction:
Host polls F0 (address 0x14) until it reads
a predefined pattern.
Host sets wake‐up‐wlan bit
1
and waits 15 ms , the
maximum time for
reference clock availability.
1
After 15 ms, the host
programs the PLL registers to
set the crystal frequency.
Chip‐active interrupt is asserted after the PLL locks.
WL_IRQ
Host downloads
code.
1
This wait time is programmable in sleep‐clock increments from 1 to 255 (30 us to 15 ms).
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5. Wireless LAN MAC and PHY
5.1 MAC Features
The CYW4343X WLAN MAC supports features specified in the IEEE 802.11 base standard, and amended by IEEE 802.11n. The
salient features are listed below:
■
Transmission and reception of aggregated MPDUs (A-MPDU).
■
Support for power management schemes, including WMM power-save, power-save multipoll (PSMP) and multiphase
PSMP operation.
■
Support for immediate ACK and Block-ACK policies.
■
Interframe space timing support, including RIFS.
■
Support for RTS/CTS and CTS-to-self frame sequences for protecting frame exchanges.
■
Back-off counters in hardware for supporting multiple priorities as specified in the WMM specification.
■
Timing synchronization function (TSF), network allocation vector (NAV) maintenance, and target beacon transmission time
(TBTT) generation in hardware.
■
Hardware off-load for AES-CCMP, legacy WPA TKIP, legacy WEP ciphers, WAPI, and support for key management.
■
Support for coexistence with Bluetooth and other external radios.
■
Programmable independent basic service set (IBSS) or infrastructure basic service set functionality
■
Statistics counters for MIB support.
5.1.1 MAC Description
The CYW4343X WLAN MAC is designed to support high throughput operation with low-power consumption. It does so without compromising on Bluetooth coexistence policies, thereby enabling optimal performance over both networks. In addition, several powersaving modes that have been implemented allow the MAC to consume very little power while maintaining network-wide timing synchronization. The architecture diagram of the MAC is shown in Figure 26 on page 34.
Figure 26. WLAN MAC Architecture
Embedded CPU Interface
Host Registers, DMA Engines
TX‐FIFO
32 KB
PMQ
RX‐FIFO
10 KB
PSM
PSM
UCODE
Memory
IFS
Backoff, BTCX
WEP
WEP, TKIP, AES
TSF
SHM
BUS
IHR
NAV
BUS
TXE
TX A‐MPDU
EXT‐ IHR
MAC ‐
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RXE
RX A‐MPDU
Shared Memory
6 KB
PHY Interface
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CYW4343X
The following sections provide an overview of the important modules in the MAC.
5.1.1.1 PSM
The programmable state machine (PSM) is a microcoded engine that provides most of the low-level control to the hardware to implement the IEEE 802.11 specification. It is a microcontroller that is highly optimized for flow-control operations, which are predominant
in implementations of communication protocols. The instruction set and fundamental operations are simple and general, which
allows algorithms to be optimized until very late in the design process. It also allows for changes to the algorithms to track evolving
IEEE 802.11 specifications.
The PSM fetches instructions from the microcode memory. It uses the shared memory to obtain operands for instructions, as a data
store, and to exchange data between both the host and the MAC data pipeline (via the SHM bus). The PSM also uses a scratch-pad
memory (similar to a register bank) to store frequently accessed and temporary variables.
The PSM exercises fine-grained control over the hardware engines by programming internal hardware registers (IHR). These IHRs
are collocated with the hardware functions they control and are accessed by the PSM via the IHR bus.
The PSM fetches instructions from the microcode memory using an address determined by the program counter, an instruction literal, or a program stack. For ALU operations, the operands are obtained from shared memory, scratch-pad memory, IHRs, or
instruction literals, and the results are written into the shared memory, scratch-pad memory, or IHRs.
There are two basic branch instructions: conditional branches and ALU-based branches. To better support the many decision points
in the IEEE 802.11 algorithms, branches can depend on either readily available signals from the hardware modules (branch condition signals are available to the PSM without polling the IHRs) or on the results of ALU operations.
5.1.1.2 WEP
The wired equivalent privacy (WEP) engine encapsulates all the hardware accelerators to perform the encryption and decryption, as
well as the MIC computation and verification. The accelerators implement the following cipher algorithms: legacy WEP, WPA TKIP,
and WPA2 AES-CCMP.
Based on the frame type and association information, the PSM determines the appropriate cipher algorithm to be used. It supplies
the keys to the hardware engines from an on-chip key table. The WEP interfaces with the transmit engine (TXE) to encrypt and compute the MIC on transmit frames and the receive engine (RXE) to decrypt and verify the MIC on receive frames. WAPI is also supported.
5.1.1.3 TXE
The transmit engine (TXE) constitutes the transmit data path of the MAC. It coordinates the DMA engines to store the transmit
frames in the TXFIFO. It interfaces with WEP module to encrypt frames and transfers the frames across the MAC-PHY interface at
the appropriate time determined by the channel access mechanisms.
The data received from the DMA engines are stored in transmit FIFOs. The MAC supports multiple logical queues to support traffic
streams that have different QoS priority requirements. The PSM uses the channel access information from the IFS module to schedule a queue from which the next frame is transmitted. Once the frame is scheduled, the TXE hardware transmits the frame based on
a precise timing trigger received from the IFS module.
The TXE module also contains the hardware that allows the rapid assembly of MPDUs into an A-MPDU for transmission. The hardware module aggregates the encrypted MPDUs by adding appropriate headers and pad delimiters as needed.
5.1.1.4 RXE
The receive engine (RXE) constitutes the receive data path of the MAC. It interfaces with the DMA engine to drain the received
frames from the RX FIFO. It transfers bytes across the MAC-PHY interface and interfaces with the WEP module to decrypt frames.
The decrypted data is stored in the RX FIFO.
The RXE module contains programmable filters that are programmed by the PSM to accept or filter frames based on several criteria
such as receiver address, BSSID, and certain frame types.
The RXE module also contains the hardware required to detect A-MPDUs, parse the headers of the containers, and disaggregate
them into component MPDUS.
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5.1.1.5 IFS
The IFS module contains the timers required to determine interframe space timing including RIFS timing. It also contains multiple
back-off engines required to support prioritized access to the medium as specified by WMM.
The interframe spacing timers are triggered by the cessation of channel activity on the medium, as indicated by the PHY. These timers provide precise timing to the TXE to begin frame transmission. The TXE uses this information to send response frames or perform transmit frame-bursting (RIFS or SIFS separated, as within a TXOP).
The back-off engines (for each access category) monitor channel activity, in each slot duration, to determine whether to continue or
pause the back-off counters. When the back-off counters reach 0, the TXE gets notified so that it may commence frame transmission. In the event of multiple back-off counters decrementing to 0 at the same time, the hardware resolves the conflict based on policies provided by the PSM.
The IFS module also incorporates hardware that allows the MAC to enter a low-power state when operating under the IEEE powersaving mode. In this mode, the MAC is in a suspended state with its clock turned off. A sleep timer, whose count value is initialized
by the PSM, runs on a slow clock and determines the duration over which the MAC remains in this suspended state. Once the timer
expires, the MAC is restored to its functional state. The PSM updates the TSF timer based on the sleep duration, ensuring that the
TSF is synchronized to the network.
The IFS module also contains the PTA hardware that assists the PSM in Bluetooth coexistence functions.
5.1.1.6 TSF
The timing synchronization function (TSF) module maintains the TSF timer of the MAC. It also maintains the target beacon transmission time (TBTT). The TSF timer hardware, under the control of the PSM, is capable of adopting timestamps received from beacon
and probe response frames in order to maintain synchronization with the network.
The TSF module also generates trigger signals for events that are specified as offsets from the TSF timer, such as uplink and downlink transmission times used in PSMP.
5.1.1.7 NAV
The network allocation vector (NAV) timer module is responsible for maintaining the NAV information conveyed through the duration
field of MAC frames. This ensures that the MAC complies with the protection mechanisms specified in the standard.
The hardware, under the control of the PSM, maintains the NAV timer and updates the timer appropriately based on received
frames. This timing information is provided to the IFS module, which uses it as a virtual carrier-sense indication.
5.1.1.8 MAC-PHY Interface
The MAC-PHY interface consists of a data path interface to exchange RX/TX data from/to the PHY. In addition, there is a programming interface, which can be controlled either by the host or the PSM to configure and control the PHY.
5.2 PHY Description
The CYW4343X WLAN digital PHY is designed to comply with IEEE 802.11b/g/n single stream to provide wireless LAN connectivity
supporting data rates from 1 Mbps to 96 Mbps for low-power, high-performance handheld applications.
The PHY has been designed to meet specification requirements in the presence of interference, radio nonlinearity, and impairments.
It incorporates efficient implementations of the filters, FFT, and Viterbi decoder algorithms. Efficient algorithms have been designed
to achieve maximum throughput and reliability, including algorithms for carrier sense/rejection, frequency/phase/timing acquisition
and tracking, and channel estimation and tracking. The PHY receiver also contains a robust IEEE 802.11b demodulator. The PHY
carrier sense has been tuned to provide high throughput for IEEE 802.11g/IEEE 802.11b hybrid networks with Bluetooth coexistence.
5.2.1 PHY Features
■
Supports the IEEE 802.11b/g/n single-stream standards.
■
Explicit IEEE 802.11n transmit beamforming.
■
Supports optional Greenfield mode in TX and RX.
■
Tx and Rx LDPC for improved range and power efficiency.
■
Supports IEEE 802.11h/d for worldwide operation.
■
Algorithms achieving low power, enhanced sensitivity, range, and reliability.
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CYW4343X
■
■
■
■
■
Algorithms to maximize throughput performance in the presence of Bluetooth signals.
Automatic gain control scheme for blocking and nonblocking application scenarios for cellular applications.
Closed-loop transmit power control.
Designed to meet FCC and other regulatory requirements.
Support for 2.4 GHz Broadcom TurboQAM data rates and 20 MHz channel bandwidth.
Figure 27. WLAN PHY Block Diagram
Filters
and
Radio
Comp
AFE
and
Radio
Radio
Control
Block
CCK/DSSS
Demodulate
Frequency
and Timing
Synch
Carrier Sense,
AGC, and Rx
FSM
Tx FSM
OFDM
Demodulate
Buffers
Viterbi
Decoder
Descramble
and
Deframe
MAC
Interface
FFT/IFFT
Modulation
and Coding
Frame and
Scramble
Filters and
Radio Comp
PA Comp
Modulate/
Spread
COEX
The PHY is capable of fully calibrating the RF front-end to extract the highest performance. On power-up, the PHY performs a full
calibration suite to correct for IQ mismatch and local oscillator leakage. The PHY also performs periodic calibration to compensate
for any temperature related drift, thus maintaining high-performance over time. A closed-loop transmit control algorithm maintains
the output power at its required level and can control TX power on a per-packet basis.
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6. WLAN Radio Subsystem
The CYW4343X includes an integrated WLAN RF transceiver that has been optimized for use in 2.4 GHz Wireless LAN systems. It
is designed to provide low power, low cost, and robust communications for applications operating in the globally available 2.4 GHz
unlicensed ISM band. The transmit and receive sections include all on-chip filtering, mixing, and gain control functions. Improvements to the radio design include shared TX/RX baseband filters and high immunity to supply noise.
Figure 28 shows the radio functional block diagram.
Figure 28. Radio Functional Block Diagram
WL DAC
WL TXLPF
WL PA
WL DAC
WL PGA
WL TX G‐Mixer
WL TXLPF
Voltage
Regulators
WLAN BB
4 ~ 6 nH
Recommend
Q = 40
WLRF_2G_RF
WL ADC
10 pF
WL RXLPF
WLRF_2G_eLG
SLNA
WL ADC
WL G‐LNA12
WL RX G‐Mixer WL RXLPF
WL ATX
WL ARX
WL GTX
WL GRX
Gm
BT LNA GM
CLB
WL LOGEN
WL PLL
Shared XO
BT RX
BT TX
BT LOGEN
BT PLL
LPO/Ext LPO/RCAL
BT ADC
BT RXLPF
BT ADC
BT LNA Load
BT PA
BT RX Mixer
BT RXLPF
BT BB
BT FM
BT DAC
BT DAC
BT TX Mixer
BT TXLPF
6.1 Receive Path
The CYW4343X has a wide dynamic range, direct conversion receiver. It employs high-order on-chip channel filtering to ensure reliable operation in the noisy 2.4 GHz ISM band.
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6.2 Transmit Path
Baseband data is modulated and upconverted to the 2.4 GHz ISM band. A linear on-chip power amplifier is included, which is capable of delivering high output powers while meeting IEEE 802.11b/g/n specifications without the need for an external PA. This PA is
supplied by an internal LDO that is directly supplied by VBAT, thereby eliminating the need for a separate PALDO. Closed-loop output power control is integrated.
6.3 Calibration
The CYW4343X features dynamic on-chip calibration, eliminating process variation across components. This enables the
CYW4343X to be used in high-volume applications because calibration routines are not required during manufacturing testing.
These calibration routines are performed periodically during normal radio operation. Automatic calibration examples include baseband filter calibration for optimum transmit and receive performance and LOFT calibration for leakage reduction. In addition, I/Q calibration, R calibration, and VCO calibration are performed on-chip.
7 . B l u e t o o t h + F M Subsystem Overview
The Cypress CYW4343X is a Bluetooth 4.1-compliant, baseband processor and 2.4 GHz transceiver with an integrated FM/RDS/
RBDS receiver. It features the highest level of integration and eliminates all critical external components, thus minimizing the footprint, power consumption, and system cost of a Bluetooth plus FM radio solution.
The CYW4343X is the optimal solution for any Bluetooth voice and/or data application that also requires an FM radio receiver. The
Bluetooth subsystem presents a standard Host Controller Interface (HCI) via a high speed UART and PCM interface for audio. The
FM subsystem supports the HCI control interface as well as I2S, PCM, and stereo analog interfaces. The CYW4343X incorporates
all Bluetooth 4.1 features including secure simple pairing, sniff subrating, and encryption pause and resume.
The CYW4343X Bluetooth radio transceiver provides enhanced radio performance to meet the most stringent mobile phone temperature applications and the tightest integration into mobile handsets and portable devices. It is fully compatible with any of the
standard TCXO frequencies and provides full radio compatibility to operate simultaneously with GPS, WLAN, NFC, and cellular
radios.
The Bluetooth transmitter also features a Class 1 power amplifier with Class 2 capability.
7.1 Features
Major Bluetooth features of the CYW4343X include:
■
■
■
■
■
■
■
■
■
Supports key features of upcoming Bluetooth standards
Fully supports Bluetooth Core Specification version 4.1 plus enhanced data rate (EDR) features:
❐ Adaptive Frequency Hopping (AFH)
❐ Quality of Service (QoS)
❐ Extended Synchronous Connections (eSCO)—voice connections
❐ Fast connect (interlaced page and inquiry scans)
❐ Secure Simple Pairing (SSP)
❐ Sniff Subrating (SSR)
❐ Encryption Pause Resume (EPR)
❐ Extended Inquiry Response (EIR)
❐ Link Supervision Timeout (LST)
UART baud rates up to 4 Mbps
Supports all Bluetooth 4.1 packet types
Supports maximum Bluetooth data rates over HCI UART
Multipoint operation with up to seven active slaves
❐ Maximum of seven simultaneous active ACL links
❐ Maximum of three simultaneous active SCO and eSCO connections with scatternet support
Trigger Beacon fast connect (TBFC)
Narrowband and wideband packet loss concealment
Scatternet operation with up to four active piconets with background scan and support for scatter mode
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■
■
■
■
■
■
High-speed HCI UART transport support with low-power out-of-band BT_DEV_WAKE and BT_HOST_WAKE signaling
(see Host Controller Power Management on page 43)
Channel-quality driven data rate and packet type selection
Standard Bluetooth test modes
Extended radio and production test mode features
Full support for power savings modes
❐ Bluetooth clock request
❐ Bluetooth standard sniff
❐ Deep-sleep modes and software regulator shutdown
TCXO input and auto-detection of all standard handset clock frequencies. Also supports a low-power crystal, which can be
used during power save mode for better timing accuracy.
Major FM Radio features include:
■
65 MHz to 108 MHz FM bands supported (US, Europe, and Japan)
FM subsystem control using the Bluetooth HCI interface
FM subsystem operates from reference clock inputs.
■
Improved audio interface capabilities with full-featured bidirectional PCM, I2S, and stereo analog output.
■
I2S can be master or slave.
■
■
FM Receiver-Specific Features Include:
■
■
■
■
■
■
■
■
Excellent FM radio performance with 1 µV sensitivity for 26 dB (S+N)/N
Signal-dependent stereo/mono blending
Signal dependent soft mute
Auto search and tuning modes
Audio silence detection
RSSI and IF frequency status indicators
RDS and RBDS demodulator and decoder with filter and buffering functions
Automatic frequency jump
7.2 Bluetooth Radio
The CYW4343X has an integrated radio transceiver that has been optimized for use in 2.4 GHz Bluetooth wireless systems. It has
been designed to provide low-power, low-cost, robust communications for applications operating in the globally available 2.4 GHz
unlicensed ISM band. It is fully compliant with the Bluetooth Radio Specification and EDR specification and meets or exceeds the
requirements to provide the highest communication link quality of service.
7.2.1 Transmit
The CYW4343X features a fully integrated zero-IF transmitter. The baseband transmit data is GFSK-modulated in the modem block
and upconverted to the 2.4 GHz ISM band in the transmitter path. The transmitter path has signal filters, an I/Q upconverter, an output power amplifier, and RF filters. The transmitter path also incorporates /4–DQPSK for 2 Mbps and 8–DPSK for 3 Mbps to support EDR. The transmitter section is compatible with the Bluetooth Low Energy specification. The transmitter PA bias can also be
adjusted to provide Bluetooth Class 1 or Class 2 operation.
7.2.2 Digital Modulator
The digital modulator performs the data modulation and filtering required for the GFSK, /4–DQPSK, and 8–DPSK signal. The fully
digital modulator minimizes any frequency drift or anomalies in the modulation characteristics of the transmitted signal and is much
more stable than direct VCO modulation schemes.
7.2.3 Digital Demodulator and Bit Synchronizer
The digital demodulator and bit synchronizer take the low-IF received signal and perform an optimal frequency tracking and bit-synchronization algorithm.
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7.2.4 Power Amplifier
The fully integrated PA supports Class 1 or Class 2 output using a highly linearized, temperature-compensated design. This provides
greater flexibility in front-end matching and filtering. Due to the linear nature of the PA combined with some integrated filtering, external filtering is required to meet the Bluetooth and regulatory harmonic and spurious requirements. For integrated mobile handset
applications in which Bluetooth is integrated next to the cellular radio, external filtering can be applied to achieve near-thermal noise
levels for spurious and radiated noise emissions. The transmitter features a sophisticated on-chip transmit signal strength indicator
(TSSI) block to keep the absolute output power variation within a tight range across process, voltage, and temperature.
7.2.5 Receiver
The receiver path uses a low-IF scheme to downconvert the received signal for demodulation in the digital demodulator and bit synchronizer. The receiver path provides a high degree of linearity, an extended dynamic range, and high-order on-chip channel filtering
to ensure reliable operation in the noisy 2.4 GHz ISM band. The front-end topology with built-in out-of-band attenuation enables the
CYW4343X to be used in most applications with minimal off-chip filtering. For integrated handset operation, in which the Bluetooth
function is integrated close to the cellular transmitter, external filtering is required to eliminate the desensitization of the receiver by
the cellular transmit signal.
7.2.6 Digital Demodulator and Bit Synchronizer
The digital demodulator and bit synchronizer take the low-IF received signal and perform an optimal frequency tracking and bit synchronization algorithm.
7.2.7 Receiver Signal Strength Indicator
The radio portion of the CYW4343X provides a Receiver Signal Strength Indicator (RSSI) signal to the baseband so that the controller can take part in a Bluetooth power-controlled link by providing a metric of its own receiver signal strength to determine whether
the transmitter should increase or decrease its output power.
7.2.8 Local Oscillator Generation
Local Oscillator (LO) generation provides fast frequency hopping (1600 hops/second) across the 79 maximum available channels.
The LO generation subblock employs an architecture for high immunity to LO pulling during PA operation. The CYW4343X uses an
internal RF and IF loop filter.
7.2.9 Calibration
The CYW4343X radio transceiver features an automated calibration scheme that is self contained in the radio. No user interaction is
required during normal operation or during manufacturing to optimize performance. Calibration optimizes the performance of all the
major blocks within the radio to within 2% of optimal conditions, including filter gain and phase characteristics, matching between
key components, and key gain blocks. This takes into account process variation and temperature variation. Calibration occurs transparently during normal operation during the settling time of the hops and calibrates for temperature variations as the device cools
and heats during normal operation in its environment.
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8. Bluetooth Baseband Core
The Bluetooth Baseband Core (BBC) implements all of the time-critical functions required for high-performance Bluetooth operation.
The BBC manages the buffering, segmentation, and routing of data for all connections. It also buffers data that passes through it,
handles data flow control, schedules SCO/ACL TX/RX transactions, monitors Bluetooth slot usage, optimally segments and packages data into baseband packets, manages connection status indicators, and composes and decodes HCI packets. In addition to
these functions, it independently handles HCI event types and HCI command types.
The following transmit and receive functions are also implemented in the BBC hardware to increase the reliability and security of
data before sending and receiving it over the air:
■
Symbol timing recovery, data deframing, forward error correction (FEC), header error control (HEC), cyclic redundancy
check (CRC), data decryption, and data dewhitening in the receiver.
■
Data framing, FEC generation, HEC generation, CRC generation, key generation, data encryption, and data whitening in
the transmitter.
8.1 Bluetooth 4.1 Features
The BBC supports all Bluetooth 4.1 features, with the following benefits:
■
Dual-mode classic Bluetooth and classic Low Energy (BT and BLE) operation.
■
Low energy physical layer
■
Low energy link layer
■
Enhancements to HCI for low energy
■
Low energy direct test mode
■
128 AES-CCM secure connection for both BT and BLE
Note: The CYW4343X is compatible with the Bluetooth Low Energy operating mode, which provides a dramatic reduction in the power
consumption of the Bluetooth radio and baseband. The primary application for this mode is to provide support for low data rate
devices, such as sensors and remote controls.
8.2 Link Control Layer
The link control layer is part of the Bluetooth link control functions that are implemented in dedicated logic in the link control unit
(LCU). This layer contains the command controller that takes commands from the software, and other controllers that are activated
or configured by the command controller, to perform the link control tasks. Each task performs a different state in the Bluetooth link
controller.
■
Major states:
❐ Standby
❐ Connection
■
Substates:
❐ Page
❐ Page Scan
❐ Inquiry
❐ Inquiry Scan
❐ Sniff
❐ BLE Adv
❐ BLE Scan/Initiation
8.3 Test Mode Support
The CYW4343X fully supports Bluetooth Test mode as described in Part I:1 of the Specification of the Bluetooth System Version 3.0.
This includes the transmitter tests, normal and delayed loopback tests, and reduced hopping sequence.
In addition to the standard Bluetooth Test Mode, the CYW4343X also supports enhanced testing features to simplify RF debugging
and qualification as well as type-approval testing. These features include:
■
Fixed frequency carrier-wave (unmodulated) transmission
❐ Simplifies some type-approval measurements (Japan)
❐ Aids in transmitter performance analysis
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■
■
Fixed frequency constant receiver mode
❐ Receiver output directed to an I/O pin
❐ Allows for direct BER measurements using standard RF test equipment
❐ Facilitates spurious emissions testing for receive mode
Fixed frequency constant transmission
❐ Eight-bit fixed pattern or PRBS-9
❐ Enables modulated signal measurements with standard RF test equipment
8.4 Bluetooth Power Management Unit
The Bluetooth Power Management Unit (PMU) provides power management features that can be invoked by either software through
power management registers or packet handling in the baseband core. The power management functions provided by the
CYW4343X are:
■
RF Power Management
■
Host Controller Power Management
■
BBC Power Management
■
FM Power Management
8.4.1 RF Power Management
The BBC generates power-down control signals for the transmit path, receive path, PLL, and power amplifier to the 2.4 GHz transceiver. The transceiver then processes the power-down functions accordingly.
8.4.2 Host Controller Power Management
When running in UART mode, the CYW4343X can be configured so that dedicated signals are used for power management handshaking between the CYW4343X and the host. The basic power saving functions supported by those handshaking signals include
the standard Bluetooth defined power savings modes and standby modes of operation.
Table 8 describes the power-control handshake signals used with the UART interface.
Table 8. Power Control Pin Description
Signal
Type
Description
BT_DEV_WAKE
I
Bluetooth device wake-up signal: Signal from the host to the CYW4343X indicating that the host
requires attention.
• Asserted: The Bluetooth device must wake up or remain awake.
• Deasserted: The Bluetooth device may sleep when sleep criteria are met.
The polarity of this signal is software configurable and can be asserted high or low.
BT_HOST_WAKE
O
Host wake-up signal. Signal from the CYW4343X to the host indicating that the CYW4343X requires
attention.
• Asserted: Host device must wake up or remain awake.
• Deasserted: Host device may sleep when sleep criteria are met.
The polarity of this signal is software configurable and can be asserted high or low.
CLK_REQ
O
The CYW4343X asserts CLK_REQ when Bluetooth or WLAN directs the host to turn on the reference
clock. The CLK_REQ polarity is active-high. Add an external 100 kΩ pull-down resistor to ensure the
signal is deasserted when the CYW4343X powers up or resets when VDDIO is present.
Note: Pad function Control Register is set to 0 for these pins.
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Figure 29. Startup Signaling Sequence
LPO
VDDIO
Host IOs unconfigured
Host IOs configured
HostResetX
T1
BT_GPIO_0
(BT_DEV_WAKE)
T2
BTH IOs unconfigured BTH IOs configured
BT_REG_ON
BT_GPIO_1
(BT_HOST_WAKE)
T3
Host side drives
this line low
BT_UART_CTS_N
T4
BT_UART_RTS_N
CLK_REQ_OUT
T5
BTH device drives this
line low indicating
transport is ready
Driven
Pulled
Notes :
T1 is the time for host to settle it’s IOs after a reset.
T2 is the time for host to drive BT_REG_ON high after the Host IOs are configured.
T3 is the time for BTH (Bluetooth) device to settle its IOs after a reset and reference clock settling time has
elapsed.
T4 is the time for BTH device to drive BT_UART_RTS_N low after the host drives BT_UART_CTS_N low. This
assumes the BTH device has already completed initialization.
T5 is the time for BTH device to drive CLK_REQ_OUT high after BT_REG_ON goes high. Note this pin is used for
designs that use an external reference clock source from the Host. This pin is irrelevant for Crystal reference
clock based designs where the BTH device generates it’s own reference clock from an external crystal connected
to it’s oscillator circuit.
Timing diagram assumes VBAT is present.
8.5 BBC Power Management
The following are low-power operations for the BBC:
■
Physical layer packet-handling turns the RF on and off dynamically within transmit/receive packets.
■
Bluetooth-specified low-power connection modes: sniff and hold. While in these modes, the CYW4343X runs on the lowpower oscillator and wakes up after a predefined time period.
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■
A low-power shutdown feature allows the device to be turned off while the host and any other devices in the system remain
operational. When the CYW4343X is not needed in the system, the RF and core supplies are shut down while the I/O
remains powered. This allows the CYW4343X to effectively be off while keeping the I/O pins powered, so they do not draw
extra current from any other I/O-connected devices.
During the low-power shut-down state, provided VDDIO remains applied to the CYW4343X, all outputs are tristated, and most input
signals are disabled. Input voltages must remain within the limits defined for normal operation. This is done to prevent current paths
or create loading on digital signals in the system and enables the CYW4343X to be fully integrated in an embedded device to take
full advantage of the lowest power-saving modes.
Two CYW4343X input signals are designed to be high-impedance inputs that do not load the driving signal even if the chip does not
have VDDIO power supplied to it: the frequency reference input (WRF_TCXO_IN) and the 32.768 kHz input (LPO). When the
CYW4343X is powered on from this state, it is the same as a normal power-up, and the device does not contain any information
about its state from the time before it was powered down.
8.5.1 FM Power Management
The CYW4343X FM subsystem can operate independently of, or in tandem with, the Bluetooth RF and BBC subsystems. The FM
subsystem power management scheme operates in conjunction with the Bluetooth RF and BBC subsystems. The FM block does
not have a low power state, it is either on or off.
8.5.2 Wideband Speech
The CYW4343X provides support for wideband speech (WBS) technology. The CYW4343X can perform subband-codec (SBC), as
well as mSBC, encoding and decoding of linear 16 bits at 16 kHz (256 kbps rate) transferred over the PCM bus.
8.6 Packet Loss Concealment
Packet Loss Concealment (PLC) improves the apparent audio quality for systems with marginal link performance. Bluetooth messages are sent in packets. When a packet is lost, it creates a gap in the received audio bit-stream. Packet loss can be mitigated in
several ways:
■
Fill in zeros.
■
Ramp down the output audio signal toward zero (this is the method used in current Bluetooth headsets).
■
Repeat the last frame (or packet) of the received bit-stream and decode it as usual (frame repeat).
These techniques cause distortion and popping in the audio stream. The CYW4343X uses a proprietary waveform extension algorithm to provide dramatic improvement in the audio quality. Figure 30 and Figure 31 show audio waveforms with and without Packet
Loss Concealment. Cypress PLC/BEC algorithms also support wideband speech.
Figure 30. CVSD Decoder Output Waveform Without PLC
Packet losses causes ramp-down
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Figure 31. CVSD Decoder Output Waveform After Applying PLC
8.6.1 Codec Encoding
The CYW4343X can support SBC and mSBC encoding and decoding for wideband speech.
8.6.2 Multiple Simultaneous A2DP Audio Streams
The CYW4343X has the ability to take a single audio stream and output it to multiple Bluetooth devices simultaneously. This allows
a user to share his or her music (or any audio stream) with a friend.
8.6.3 FM Over Bluetooth
FM Over Bluetooth enables the CYW4343X to stream data from FM over Bluetooth without requiring the host to be awake. This can
significantly extend battery life for usage cases where someone is listening to FM radio on a Bluetooth headset.
8.7 Adaptive Frequency Hopping
The CYW4343X gathers link quality statistics on a channel by channel basis to facilitate channel assessment and channel map
selection. The link quality is determined using both RF and baseband signal processing to provide a more accurate frequency-hop
map.
8.8 Advanced Bluetooth/WLAN Coexistence
The CYW4343X includes advanced coexistence technologies that are only possible with a Bluetooth/WLAN integrated die solution.
These coexistence technologies are targeted at small form-factor platforms, such as cell phones and media players, including applications such as VoWLAN + SCO and Video-over-WLAN + High Fidelity BT Stereo.
Support is provided for platforms that share a single antenna between Bluetooth and WLAN. Dual-antenna applications are also
supported. The CYW4343X radio architecture allows for lossless simultaneous Bluetooth and WLAN reception for shared antenna
applications. This is possible only via an integrated solution (shared LNA and joint AGC algorithm). It has superior performance versus implementations that need to arbitrate between Bluetooth and WLAN reception.
The CYW4343X integrated solution enables MAC-layer signaling (firmware) and a greater degree of sharing via an enhanced coexistence interface. Information is exchanged between the Bluetooth and WLAN cores without host processor involvement.
The CYW4343X also supports Transmit Power Control (TPC) on the STA together with standard Bluetooth TPC to limit mutual interference and receiver desensitization. Preemption mechanisms are utilized to prevent AP transmissions from colliding with Bluetooth
frames. Improved channel classification techniques have been implemented in Bluetooth for faster and more accurate detection and
elimination of interferers (including non-WLAN 2.4 GHz interference).
The Bluetooth AFH classification is also enhanced by the WLAN core’s channel information.
8.9 Fast Connection (Interlaced Page and Inquiry Scans)
The CYW4343X supports page scan and inquiry scan modes that significantly reduce the average inquiry response and connection
times. These scanning modes are compatible with the Bluetooth version 2.1 page and inquiry procedures.
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9. Microprocessor and Me mory Unit for Bluetooth
The Bluetooth microprocessor core is based on the ARM Cortex-M3 32-bit RISC processor with embedded ICE-RT debug and
JTAG interface units. It runs software from the link control (LC) layer up to the host controller interface (HCI).
The ARM core is paired with a memory unit that contains 576 KB of ROM for program storage and boot ROM, and 160 KB of RAM
for data scratch-pad and patch RAM code. The internal ROM allows for flexibility during power-on reset (POR) to enable the same
device to be used in various configurations. At power-up, the lower-layer protocol stack is executed from the internal ROM memory.
External patches may be applied to the ROM-based firmware to provide flexibility for bug fixes or feature additions. These patches
may be downloaded from the host to the CYW4343X through the UART transports.
9.1 RAM, ROM, and Patch Memory
The CYW4343X Bluetooth core has 160 KB of internal RAM which is mapped between general purpose scratch-pad memory and
patch memory, and 576 KB of ROM used for the lower-layer protocol stack, test mode software, and boot ROM. The patch memory
is used for bug fixes and feature additions to ROM memory code.
9.2 Reset
The CYW4343X has an integrated power-on reset circuit that resets all circuits to a known power-on state. The BT POR circuit is out
of reset after BT_REG_ON goes high. If BT_REG_ON is low, then the POR circuit is held in reset.
10. Bluetooth Peripheral Transport Unit
10.1 PCM Interface
The CYW4343X supports two independent PCM interfaces that share pins with the I2S interfaces. The PCM interface on the
CYW4343X can connect to linear PCM codec devices in master or slave mode. In master mode, the CYW4343X generates the
PCM_CLK and PCM_SYNC signals, and in slave mode, these signals are provided by another master on the PCM interface and are
inputs to the CYW4343X. The configuration of the PCM interface may be adjusted by the host through the use of vendor-specific
HCI commands.
10.1.1 Slot Mapping
The CYW4343X supports up to three simultaneous full-duplex SCO or eSCO channels through the PCM interface. These three
channels are time-multiplexed onto the single PCM interface by using a time-slotting scheme where the 8 kHz or 16 kHz audio sample interval is divided into as many as 16 slots. The number of slots is dependent on the selected interface rate of 128 kHz, 512 kHz,
or 1024 kHz. The corresponding number of slots for these interface rates is 1, 2, 4, 8, and 16, respectively. Transmit and receive
PCM data from an SCO channel is always mapped to the same slot. The PCM data output driver tristates its output on unused slots
to allow other devices to share the same PCM interface signals. The data output driver tristates its output after the falling edge of the
PCM clock during the last bit of the slot.
10.1.2 Frame Synchronization
The CYW4343X supports both short- and long-frame synchronization in both master and slave modes. In short-frame synchronization mode, the frame synchronization signal is an active-high pulse at the audio frame rate that is a single-bit period in width and is
synchronized to the rising edge of the bit clock. The PCM slave looks for a high on the falling edge of the bit clock and expects the
first bit of the first slot to start at the next rising edge of the clock. In long-frame synchronization mode, the frame synchronization signal is again an active-high pulse at the audio frame rate; however, the duration is three bit periods and the pulse starts coincident
with the first bit of the first slot.
10.1.3 Data Formatting
The CYW4343X may be configured to generate and accept several different data formats. For conventional narrowband speech
mode, the CYW4343X uses 13 of the 16 bits in each PCM frame. The location and order of these 13 bits can be configured to support various data formats on the PCM interface. The remaining three bits are ignored on the input and may be filled with 0’s, 1’s, a
sign bit, or a programmed value on the output. The default format is 13-bit 2’s complement data, left justified, and clocked MSB first.
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10.1.4 Wideband Speech Support
When the host encodes Wideband Speech (WBS) packets in transparent mode, the encoded packets are transferred over the PCM
bus for an eSCO voice connection. In this mode, the PCM bus is typically configured in master mode for a 4 kHz sync rate with 16bit samples, resulting in a 64 kbps bit rate. The CYW4343X also supports slave transparent mode using a proprietary rate-matching
scheme. In SBC-code mode, linear 16-bit data at 16 kHz (256 kbps rate) is transferred over the PCM bus.
10.1.5 Multiplexed Bluetooth and FM over PCM
In this mode of operation, the CYW4343X multiplexes both FM and Bluetooth audio PCM channels over the same interface, reducing the number of required I/Os. This mode of operation is initiated through an HCI command from the host. The data stream format
contains three channels: a Bluetooth channel followed by two FM channels (audio left and right). In this mode of operation, the bus
data rate only supports 48 kHz operation per channel with 16 bits sent for each channel. This is done to allow the low data rate Bluetooth data to coexist in the same interface as the higher speed I2S data. To accomplish this, the Bluetooth data is repeated six times
for 8 kHz data and three times for 16 kHz data. An initial sync pulse on the PCM_SYNC line is used to indicate the beginning of the
frame.
To support multiple Bluetooth audio streams within the Bluetooth channel, both 16 kHz and 8 kHz streams can be multiplexed. This
mode of operation is only supported when the Bluetooth host is the master. Figure 32 shows the operation of the multiplexed transport with three simultaneous SCO connections. To accommodate additional SCO channels, the transport clock speed is increased.
To change between modes of operation, the transport must be halted and restarted in the new configuration.
Figure 32. Functional Multiplex Data Diagram
1 Frame
BT SCO 1 RX
BT SCO 2 RX
BT SCO 3 RX
PCM_OUT
BT SCO 1 TX
BT SCO 2 TX
FM right
FM left
FM right
FM left
16 bits per frame
16 bits per frame
BT SCO 3 TX
PCM_IN
PCM_SYNC
CLK
PCM_CLK
16 bits per SCO frame
Each SCO channel duplicates the data 6 times.
Each WBS frame duplicates the data 3 times per frame.
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10.1.6 PCM Interface Timing
10.1.6.1 Short Frame Sync, Master Mode
Figure 33. PCM Timing Diagram (Short Frame Sync, Master Mode)
1
2
3
PCM_BCLK
4
PCM_SYNC
8
PCM_OUT
High Impedance
5
7
6
PCM_IN
Table 9. PCM Interface Timing Specifications (Short Frame Sync, Master Mode)
Ref No.
Characteristics
Minimum
Typical
Maximum
Unit
1
PCM bit clock frequency
–
–
12
MHz
2
PCM bit clock low
41
–
–
ns
3
PCM bit clock high
41
–
–
ns
4
PCM_SYNC delay
0
–
25
ns
5
PCM_OUT delay
0
–
25
ns
6
PCM_IN setup
8
–
–
ns
7
PCM_IN hold
8
–
–
ns
8
Delay from rising edge of PCM_BCLK during last bit period to
PCM_OUT becoming high impedance
0
–
25
ns
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10.1.6.2 Short Frame Sync, Slave Mode
Figure 34. PCM Timing Diagram (Short Frame Sync, Slave Mode)
1
2
3
PCM_BCLK
4
5
PCM_SYNC
9
PCM_OUT
High Impedance
6
8
7
PCM_IN
Table 10. PCM Interface Timing Specifications (Short Frame Sync, Slave Mode)
Ref No.
Characteristics
Minimum
Typical
Maximum
Unit
1
PCM bit clock frequency
–
–
12
MHz
2
PCM bit clock low
41
–
–
ns
3
PCM bit clock high
41
–
–
ns
4
PCM_SYNC setup
8
–
–
ns
5
PCM_SYNC hold
8
–
–
ns
6
PCM_OUT delay
0
–
25
ns
7
PCM_IN setup
8
–
–
ns
8
PCM_IN hold
8
–
–
ns
9
Delay from rising edge of PCM_BCLK during last bit period to
PCM_OUT becoming high impedance
0
–
25
ns
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10.1.6.3 Long Frame Sync, Master Mode
Figure 35. PCM Timing Diagram (Long Frame Sync, Master Mode)
1
2
3
PCM_BCLK
4
PCM_SYNC
8
PCM_OUT
Bit 0
Bit 1
Bit 0
Bit 1
High Impedance
5
7
6
PCM_IN
Table 11. PCM Interface Timing Specifications (Long Frame Sync, Master Mode)
Ref No.
Characteristics
Minimum
Typical
Maximum
Unit
1
PCM bit clock frequency
–
–
12
MHz
2
PCM bit clock low
41
–
–
ns
3
PCM bit clock high
41
–
–
ns
4
PCM_SYNC delay
0
–
25
ns
5
PCM_OUT delay
0
–
25
ns
6
PCM_IN setup
8
–
–
ns
7
PCM_IN hold
8
–
–
ns
8
Delay from rising edge of PCM_BCLK during last bit period to
PCM_OUT becoming high impedance
0
–
25
ns
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10.1.6.4 Long Frame Sync, Slave Mode
Figure 36. PCM Timing Diagram (Long Frame Sync, Slave Mode)
1
2
3
PCM_BCLK
4
5
PCM_SYNC
9
PCM_OUT
Bit 0
HIGH IMPEDANCE
Bit 1
6
7
Bit 0
PCM_IN
8
Bit 1
Table 12. PCM Interface Timing Specifications (Long Frame Sync, Slave Mode)
Ref No.
Characteristics
Minimum
Typical
Maximum
Unit
1
PCM bit clock frequency
–
–
12
MHz
2
PCM bit clock low
41
–
–
ns
3
PCM bit clock high
41
–
–
ns
4
PCM_SYNC setup
8
–
–
ns
5
PCM_SYNC hold
8
–
–
ns
6
PCM_OUT delay
0
–
25
ns
7
PCM_IN setup
8
–
–
ns
8
PCM_IN hold
8
–
–
ns
9
Delay from rising edge of PCM_BCLK during last bit period to
PCM_OUT becoming high impedance
0
–
25
ns
10.2 UART Interface
The CYW4343X shares a single UART for Bluetooth and FM. The UART is a standard 4-wire interface (RX, TX, RTS, and CTS) with
adjustable baud rates from 9600 bps to 4.0 Mbps. The interface features an automatic baud rate detection capability that returns a
baud rate selection. Alternatively, the baud rate may be selected through a vendor-specific UART HCI command.
The UART has a 1040-byte receive FIFO and a 1040-byte transmit FIFO to support EDR. Access to the FIFOs is conducted through
the Advanced High Performance Bus (AHB) interface through either DMA or the CPU. The UART supports the Bluetooth 4.1 UART
HCI specification: H4 and H5. The default baud rate is 115.2 Kbaud.
The UART supports the 3-wire H5 UART transport as described in the Bluetooth specification (Three-wire UART Transport Layer).
Compared to H4, the H5 UART transport reduces the number of signal lines required by eliminating the CTS and RTS signals.
The CYW4343X UART can perform XON/XOFF flow control and includes hardware support for the Serial Line Input Protocol (SLIP).
It can also perform a wake-on activity function. For example, activity on the RX or CTS inputs can wake the chip from a sleep state.
Normally, the UART baud rate is set by a configuration record downloaded after device reset or by automatic baud rate detection,
and the host does not need to adjust the baud rate. Support for changing the baud rate during normal HCI UART operation is
included through a vendor-specific command that allows the host to adjust the contents of the baud rate registers. The CYW4343X
UARTs operate correctly with the host UART as long as the combined baud rate error of the two devices is within ±2% (see
Table 13).
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Table 13. Example of Common Baud Rates
Desired Rate
Actual Rate
Error (%)
4000000
4000000
0.00
3692000
3692308
0.01
3000000
3000000
0.00
2000000
2000000
0.00
1500000
1500000
0.00
1444444
1454544
0.70
921600
923077
0.16
460800
461538
0.16
230400
230796
0.17
115200
115385
0.16
57600
57692
0.16
38400
38400
0.00
28800
28846
0.16
19200
19200
0.00
14400
14423
0.16
9600
9600
0.00
UART timing is defined in Figure 37 and Table 14.
Figure 37. UART Timing
UART_CTS_N
1
2
UART_TXD
Midpoint of STOP bit
Midpoint of STOP bit
UART_RXD
3
UART_RTS_N
Table 14. UART Timing Specifications
Ref No.
Characteristics
Minimum
Typical
Maximum
Unit
1
Delay time, UART_CTS_N low to UART_TXD valid
–
–
1.5
Bit periods
2
Setup time, UART_CTS_N high before midpoint
of stop bit
–
–
0.5
Bit periods
3
Delay time, midpoint of stop bit to UART_RTS_N high
–
–
0.5
Bit periods
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10.3 I2S Interface
The CYW4343X supports an independent I2S digital audio port for high-fidelity FM audio or Bluetooth audio. The I2S interface supports both master and slave modes. The I2S signals are:
■
I2S Clock: I2S SCK
■
I2S Word Select: I2S WS
■
I2S Data Out: I2S SDO
■
I2S Data In: I2S SDI
I2S SCK and I2S WS become outputs in master mode and inputs in slave mode, while I2S SDO is always an output. The channel
word length is 16 bits and the data is justified so that the MSB of the left-channel data is aligned with the MSB of the I2S bus, per the
I2S specification. The MSB of each data word is transmitted one bit-clock cycle after the I2S WS transition, synchronous with the falling edge of the bit clock. Left-channel data is transmitted when I2S WS is low, and right-channel data is transmitted when I2S WS is
high. Data bits sent by the CYW4343X are synchronized with the falling edge of I2S_SCK and should be sampled by the receiver on
the rising edge of I2S_SSCK.
The clock rate in master mode is either of the following:
48 kHz x 32 bits per frame = 1.536 MHz
48 kHz x 50 bits per frame = 2.400 MHz
The master clock is generated from the input reference clock using an N/M clock divider.
In slave mode, clock rates up to 3.072 MHz are supported.
10.3.1 I2S Timing
Note: Timing values specified in Table 15 are relative to high and low threshold levels
Table 15. Timing for I2S Transmitters and Receivers
Transmitter
Lower LImit
Receiver
Upper Limit
Lower Limit
Upper Limit
Min.
Max.
Min.
Max.
Min.
Max.
Min.
Max.
Notes
Ttr
–
–
–
Tr
–
–
–
1
Clock period T
Master mode: Clock generated by transmitter or receiver.
High tHC
0.35Ttr
–
–
–
0.35Ttr
–
–
–
2
Low tLC
0.35Ttr
–
–
–
0.35Ttr
–
–
–
2
Slave mode: Clock accepted by transmitter or receiver.
High tHC
–
0.35Ttr
–
–
–
0.35Ttr
–
–
3
Low tLC
–
0.35Ttr
–
–
–
0.35Ttr
–
–
3
Rise time tRC
–
–
0.15Ttr
–
–
–
–
–
4
Transmitter
Delay tdtr
–
–
–
0.8T
–
–
–
–
5
Hold time thtr
0
–
–
–
–
–
–
–
4
Receiver
Setup time tsr
–
–
–
–
–
0.2Tr
–
–
6
Hold time thr
–
–
–
–
–
0
–
–
6
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Note:
■
■
The system clock period T must be greater than Ttr and Tr because both the transmitter and receiver have to be able to
handle the data transfer rate.
At all data rates in master mode, the transmitter or receiver generates a clock signal with a fixed mark/space ratio. For this
reason, tHC and tLC are specified with respect to T.
■
In slave mode, the transmitter and receiver need a clock signal with minimum high and low periods so that they can detect
the signal. As long as the minimum periods are greater than 0.35Tr, any clock that meets the requirements can be used.
■
Because the delay (tdtr) and the maximum transmitter speed (defined by Ttr) are related, a fast transmitter driven by a slow
clock edge can result in tdtr not exceeding tRC, which means thtr becomes zero or negative. Therefore, the transmitter has
to guarantee that thtr is greater than or equal to zero, as long as the clock rise-time, tRC, does not exceed tRCmax, where
tRCmax is not less than 0.15Ttr.
■
To allow data to be clocked out on a falling edge, the delay is specified with respect to the rising edge of the clock signal
and T, always giving the receiver sufficient setup time.
The data setup and hold time must not be less than the specified receiver setup and hold time.
Note: The time periods specified in Figure 38 and Figure 39 are defined by the transmitter speed. The receiver specifications must
match transmitter performance.
Figure 38. I2S Transmitter Timing
T
tRC*
tLC > 0.35T
tHC > 0.35T
VH = 2.0V
SCK
thtr > 0
VL = 0.8V
tdtr < 0.8T
SD and WS
T = Clock period
Ttr = Minimum allowed clock period for transmitter
T = Ttr
* tRC is only relevant for transmitters in slave mode.
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Figure 39. I2S Receiver Timing
T
tLC > 0.35T
tHC > 0.35
VH = 2.0V
SCK
VL = 0.8V
tsr > 0.2T
thr > 0
SD and WS
T = Clock period
Tr = Minimum allowed clock period for transmitter
T > Tr
11. FM Receiver Su bsystem
11.1 FM Radio
The CYW4343X includes a completely integrated FM radio receiver with RDS/RBDS covering all FM bands from 65 MHz to 108
MHz. The receiver is controlled through commands on the HCI. FM received audio is available as a stereo analog output or in digital
form through I2S or PCM. The FM radio operates from the external clock reference.
11.2 Digital FM Audio Interfaces
The FM audio can be transmitted via the shared PCM and I2S pins, and the sampling rate is programmable. The CYW4343X supports a three-wire PCM or I2S audio interface in either a master or slave configuration. The master or slave configuration is selected
using vendor specific commands over the HCI interface. In addition, multiple sampling rates are supported, derived from either the
FM or Bluetooth clocks. In master mode, the clock rate is either of the following:
■
48 kHz x 32 bits per frame = 1.536 MHz
■
48 kHz x 50 bits per frame = 2.400 MHz
In slave mode, clock rates up to 3.072 MHz are supported.
11.3 Analog FM Audio Interfaces
The demodulated FM audio signal is available as line-level analog stereo output, generated by twin internal high SNR audio DACs.
11.4 FM Over Bluetooth
The CYW4343X can output received FM audio onto Bluetooth using one of following three links: eSCO, WBS, or A2DP. For all link
types, after a link has been established, the host processor can enter sleep mode while the CYW4343X streams FM audio to the
remote Bluetooth device, thus minimizing system current consumption.
11.5 eSCO
In this use case, the stereo FM audio is downsampled to 8 kHz and a mono or stereo stream is sent through the Bluetooth eSCO link
to a remote Bluetooth device, typically a headset. Two Bluetooth voice connections must be used to transport stereo.
11.6 Wideband Speech Link
In this case, the stereo FM audio is downsampled to 16 kHz and a mono or stereo stream is sent through the Bluetooth wideband
speech link to a remote Bluetooth device, typically a headset. Two Bluetooth voice connections must be used to transport stereo.
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11.7 A2DP
In this case, the stereo FM audio is encoded by the on-chip SBC encoder and transported as an A2DP link to a remote Bluetooth
device. Sampling rates of 48 kHz, 44.1 kHz, and 32 kHz joint stereo are supported. An A2DP lite stack is implemented in the
CYW4343X to support this use case, which eliminates the need to route the SBC-encoded audio back to the host to create the
A2DP packets.
11.8 Autotune and Search Algorithms
The CYW4343X supports a number of FM search and tune functions, allowing the host to implement many convenient user functions by accessing the Broadcom FM stack.
■
Tune to Play—Allows the FM receiver to be programmed to a specific frequency.
■
Search for SNR > Threshold—Checks the power level of the available channel and the estimated SNR of the channel to
help achieve precise control of the expected sound quality for the selected FM channel. Specifically, the host can adjust its
SNR requirements to retrieve a signal with a specific sound quality, or adjust this to return the weakest channels.
■
Alternate Frequency Jump—Allows the FM receiver to automatically jump to an alternate FM channel that carries the same
information, but has a better SNR. For example, when traveling, a user may pass through a region where a number of
channels carry the same station. When the user passes from one area to the next, the FM receiver can automatically switch
to another channel with a stronger signal to spare the user from having to manually change the channel to continue listening to the same station.
11.9 Audio Features
A number of features are implemented in the CYW4343X to provide the best possible audio experience for the user.
■
Mono/Stereo Blend or Switch—The CYW4343X provides automatic control of the stereo or mono settings based on the FM
signal carrier-to-noise ratio (C/N). This feature is used to maintain the best possible audio SNR based on the FM channel
condition. Two modes of operation are supported:
❐ Blend: In this mode, fine control of stereo separation is used to achieve optimal audio quality over a wide range of input
C/N. The amount of separation is fully programmable. In Figure 40, the separation is programmed to maintain a minimum 50 dB SNR across the blend range.
❐ Switch: In this mode, the audio switches from full stereo to full mono at a predetermined level to maintain optimal audio
quality. The stereo-to-mono switch point and the mono-to-stereo switch points are fully programmable to provide the
desired amount of audio SNR. In Figure 41, the switch point is programmed to switch to mono to maintain a 40 dB SNR.
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Audio SNR (dB)
Figure 40. Blending and Switching Usage
Input C/N (dB)
Channel Separation (dB)
Figure 41. Blending and Switching Separation
Input C/N (dB)
■
Soft Mute—Improves the user experience by dynamically muting the output audio proportionate to the FM signal C/N. This
prevents a blast of static to the user. The mute characteristic is fully programmable to accommodate fine tuning of the output signal level. An example mute characteristic is shown in Figure 42.
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Audio Gain (dB)
Figure 42. Soft Muting Characteristic
Input C/N (dB)
■
■
■
High Cut—A programmable high-cut filter is provided to reduce the amount of high-frequency noise caused by static in the
output audio signal. Like the soft mute circuit, it is fully programmable to provide any amount of high cut based on the FM
signal C/N.
Audio Pause Detect—The FM receiver monitors the magnitude of the audio signal and notifies the host through an interrupt when the magnitude of the signal has fallen below the threshold set for a programmable period. This feature can be
used to provide alternate frequency jumps during periods of silence to minimize disturbances to the listener. Filtering techniques are used within the audio pause detection block to provide more robust presence-to-silence detection and silenceto-presence detection.
Automatic Antenna Tuning—The CYW4343X has an on-chip automatic antenna tuning network. When used with a single
off-chip inductor, the on-chip circuitry automatically chooses an optimal on-chip matching component to obtain the highest
signal strength for the desired frequency. The high-Q nature of this matching network simultaneously provides out-of-band
blocking protection as well as a reduction of radiated spurious emissions from the FM antenna. It is designed to accommodate a wide range of external wire antennas.
11.10 RDS/RBDS
The CYW4343X integrates a RDS/RBDS modem, the decoder includes programmable filtering and buffering functions. The RDS/
RBDS data can be read out through the HCI interface.
In addition, the RDS/RBDS receive functionality supports the following:
■
Block decoding, error correction, and synchronization
■
A flywheel synchronization feature, allowing the host to set parameters for acquisition, maintenance, and loss of sync. (It is
possible to set up the CYW4343X such that synchronization is achieved when a minimum of two good blocks (error free)
are decoded in sequence. The number of good blocks required for sync is programmable.)
■
Storage capability up to 126 blocks of RDS data
■
Full or partial block-B match detection with host interruption
■
Audio pause detection with programmable parameters
■
Program Identification (PI) code detection with host interruption
■
Automatic frequency jumping
■
Block-E filtering
■
Soft muting
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■
Signal dependent mono/stereo blending
12. CP U a nd G l o b a l F u n c t i o n s
12.1 WLAN CPU and Memory Subsystem
The CYW4343X includes an integrated ARM Cortex-M3 processor with internal RAM and ROM. The ARM Cortex-M3 processor is a
low-power processor that features low gate count, low interrupt latency, and low-cost debugging. It is intended for deeply embedded
applications that require fast interrupt response features. The processor implements the ARM architecture v7-M with support for the
Thumb-2 instruction set. ARM Cortex-M3 provides a 30% performance gain over ARM7TDMI.
At 0.19 µW/MHz, the Cortex-M3 is the most power efficient general purpose microprocessor available, outperforming 8- and 16-bit
devices on MIPS/µW. It supports integrated sleep modes.
ARM Cortex-M3 uses multiple technologies to reduce cost through improved memory utilization, reduced pin overhead, and reduced
silicon area. ARM Cortex-M3 supports independent buses for code and data access (ICode/DCode and system buses). ARM Cortex-M3 supports extensive debug features including real-time tracing of program execution.
On-chip memory for the CPU includes 512 KB SRAM and 640 KB ROM.
12.2 One-Time Programmable Memory
Various hardware configuration parameters may be stored in an internal 4096-bit One-Time Programmable (OTP) memory, which is
read by system software after a device reset. In addition, customer-specific parameters, including the system vendor ID and the
MAC address, can be stored, depending on the specific board design.
The initial state of all bits in an unprogrammed OTP device is 0. After any bit is programmed to a 1, it cannot be reprogrammed to 0.
The entire OTP array can be programmed in a single write cycle using a utility provided with the Broadcom WLAN manufacturing
test tools. Alternatively, multiple write cycles can be used to selectively program specific bytes, but only bits which are still in the 0
state can be altered during each programming cycle.
Prior to OTP memory programming, all values should be verified using the appropriate editable nvram.txt file, which is provided with
the reference board design package. Documentation on the OTP development process is available on the Broadcom customer support portal (http://www.broadcom.com/support).
12.3 GPIO Interface
Five general purpose I/O (GPIO) pins are available on the CYW4343X that can be used to connect to various external devices.
GPIOs are tristated by default. Subsequently, they can be programmed to be either input or output pins via the GPIO control register.
They can also be programmed to have internal pull-up or pull-down resistors.
GPIO_0 is normally used as a WL_HOST_WAKE signal.
The CYW4343X supports a 2-wire coexistence configuration using GPIO_1 and GPIO_2. The CYW4343X supports 2-wire, 3-wire,
and 4-wire coexistence configurations using GPIO_1 through GPIO_4. The signal functions of GPIO_1 through GPIO_4 are programmable to support the three coexistence configurations.
12.4 External Coexistence Interface
The CYW4343X supports a 2-wire, 3-wire, and 4-wire coexistence interfaceinterfaces to enable signaling between the device and an
external colocated wireless device in order to manage wireless medium sharing for optimal performance. The external colocated
device can be any of the following ICs: GPS, WiMAX, LTE, or UWB. An LTE IC is used in this section for illustration.
12.4.1 2-Wire Coexistence
Figure 43 shows a 2-wire LTE coexistence example. The following definitions apply to the GPIOs in the figure:
■
GPIO_1: WLAN_SECI_TX output to an LTE IC.
■
GPIO_2: WLAN_SECI_RX input from an LTE IC.
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Figure 43. 2-Wire Coexistence Interface to an LTE IC
WLAN
GPIO_1
WLAN_SECI_TX
GPIO_2
WLAN_SECI_RX
Coexistence
Interface
UART_IN
UART_OUT
BT/FM
CYW4343X
LTE/IC
Notes:
 OR’ing to generate ISM_RX_PRIORITY for ERCX_TXCONF or BT_RX_PRIORITY is achieved by
setting the GPIO mask registers appropriately.
 WLAN_SECI_OUT and WLAN_SECI_IN are multiplexed on the GPIOs.
See Figure 37 on page 53 and Table 14, “UART Timing Specifications,” on page 53 for UART timing.
12.4.2 3-Wire and 4-Wire Coexistence Interfaces
Figure 44 and Figure 45 show 3-wire and 4-wire LTE coexistence examples, respectively. The following definitions apply to the
GPIOs in the figures:
■
For the 3-wire coexistence interface:
■
GPIO_2: WLAN priority output to an LTE IC.
■
GPIO_3: LTE_RX input from an LTE IC.
■
GPIO_4: LTE_TX input from an LTE IC.
For the 4-wire coexistence interface:
■
GPIO_1: WLAN priority output to an LTE IC.
■
GPIO_2: LTE frame sync input from an LTE IC. This GPIO applies only to the 4-wire coexistence interface.
■
GPIO_3: LTE_RX input from an LTE IC.
■
GPIO_4: LTE_TX input from an LTE IC.
Figure 44. 3-Wire Coexistence Interface to an LTE IC
GPIO_2
WLAN
Coexistence
Interface
WLAN Priority
GPIO_3
LTE_RX
GPIO_4
LTE_TX
BT/FM
CYW4343X
LTE/IC
Note: OR’ing to generate WCN_PRIORITY for ERCX_TXCONF or BT_RX_PRIORITY is achieved by
setting the GPIO mask registers appropriately.
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Figure 45. 4-Wire Coexistence Interface to an LTE IC
GPIO_1
WLAN
GPIO_2
Coexistence
Interface
GPIO_3
GPIO_4
WLAN Priority
LTE_Frame_Sync
LTE_RX
LTE_TX
BT/FM
CYW4343X
LTE/IC
Note: OR’ing to generate WCN_PRIORITY for ERCX_TXCONF or BT_RX_PRIORITY is achieved by
setting the GPIO mask registers appropriately.
12.5 JTAG Interface
The CYW4343X supports the IEEE 1149.1 JTAG boundary scan standard over SDIO for performing device package and PCB
assembly testing during manufacturing. In addition, the JTAG interface allows Cypress to assist customers by using proprietary
debug and characterization test tools during board bring-up. Therefore, it is highly recommended to provide access to the JTAG pins
by means of test points or a header on all PCB designs.
12.6 UART Interface
One UART interface can be enabled by software as an alternate function on the JTAG pins. UART_RX is available on the JTAG_TDI
pin, and UART_TX is available on the JTAG_TDO pin.
The UART is primarily for debugging during development. By adding an external RS-232 transceiver, this UART enables the
CYW4343X to operate as RS-232 data termination equipment (DTE) for exchanging and managing data with other serial devices. It
is compatible with the industry standard 16550 UART, and it provides a FIFO size of 64 × 8 in each direction.
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13. WLAN Software Architecture
13.1 Host Software Architecture
The host driver (DHD) provides a transparent connection between the host operating system and the CYW4343X media (for example, WLAN) by presenting a network driver interface to the host operating system and communicating with the CYW4343X over an
interface-specific bus (SPI, SDIO, and so on) to:
■
Forward transmit and receive frames between the host network stack and the CYW4343X device.
■
Pass control requests from the host to the CYW4343X device, returning the CYW4343X device responses.
The driver communicates with the CYW4343X over the bus using a control channel and a data channel to pass control messages
and data messages. The actual message format is based on the BDC protocol.
13.2 Device Software Architecture
The wireless device, protocol, and bus drivers are run on the embedded ARM processor using a Broadcom-defined operating system called HNDRTE, which transfers data over a propriety Broadcom format over the SDIO/SPI interface between the host and
device (BDC/LMAC). The data portion of the format consists of IEEE 802.11 frames wrapped in a Broadcom encapsulation. The host
architecture provides all missing functionality between a network device and the Broadcom device interface. The host can also be
customized to provide functionality between the Broadcom device interface and a full network device interface.
This transfer requires a message-oriented (framed) interconnect between the host and device. The SDIO bus is an addressed bus—
each host-initiated bus operation contains an explicit device target address—and does not natively support a higher-level data frame
concept. Broadcom has implemented a hardware/software message encapsulation scheme that ignores the bus operation code
address and prefixes each frame with a 4-byte length tag for framing. The device presents a packet-level interface over which data,
control, and asynchronous event (from the device) packets are supported.
The data and control packets received from the bus are initially processed by the bus driver and then passed on to the protocol
driver. If the packets are data packets, they are transferred to the wireless device driver (and out through its medium), and a data
packet received from the device medium follows the same path in the reverse direction. If the packets are control packets, the protocol header is decoded by the protocol driver. If the packets are wireless IOCTL packets, the IOCTL API of the wireless driver is
called to configure the wireless device. The microcode running in the D11 core processes all time-critical tasks.
13.3 Remote Downloader
When the CYW4343X powers up, the DHD initializes and downloads the firmware to run in the device.
Figure 46. WLAN Software Architecture
DHD Host Driver
SPI/SDIO
BDC/LMAC Protocol
W ireless Device Driver
D11 Core
13.4 Wireless Configuration Utility
The device driver that supports the Cypress IEEE 802.11 family of wireless solutions provides an input/output control (IOCTL) interface for making advanced configuration settings. The IOCTL interface makes it possible to make settings that are normally not possible when using just the native operating system-specific IEEE 802.11 configuration mechanisms. The utility uses IOCTLs to query
or set a number of different driver/chip operating properties.
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14. Pinout and Signal Descriptions
14.1 Ball Map
Figure 48 on page 65 shows the 63-ball WLBGA ball map.Figure 47 shows the 74-ball WLBGA ball map. Figure 49 on page 66 shows the 153-bump
WLCSP.
Figure 47. 74-Ball WLBGA Ball Map (Bottom View)
A
B
C
1
BT_UART_
RXD
BT_DEV_
WAKE
BT_HOST_
WAKE
2
BT_UART_ BT_UART_
TXD
CTS_N
FM_OUT1
FM_OUT2
BT_UART_
RTS_N
VDDC
4
BT_I2S_CL BT_PCM_O BT_PCM_I
K
UT
N
VSSC
5
BT_PCM_C BT_PCM_S SYS_VDDI
WPT_1P8
LK
YNC
O
3
6
BT_I2S_
WS
SR_VLX
7 SR_PVSS
BT_I2S_DO
D
E
FM_RF_IN
F
G
A
Document No. 002-14797 Rev. *H
B
C
D
J
K
L
BT_VCO_V
WLRF_2G_ WLRF_2G_
BT_IF_VDD BT_PAVDD
DD
eLG
RF
M
WLRF_PA_
1
VDD
WLRF_GE
WLRF_VD
FM_RF_VD BTFM_PLL BTFM_PLL
WLRF_LNA
WLRF_PA_
BT_IF_VSS
NERAL_GN
D_
D
_VDD
_VSS
_GND
GND
D
1P35
FM_RF_VS
S
BT_VCO_V WLRF_GPI
SS
O
BT_GPIO_3
WPT_3P3
LPO_IN
VDDC
VOUT_3P3
LDO_VDD
BAT5V
E
F
WLRF_AFE
_GND
BT_GPIO_4 BT_GPIO_5
PMU_AVS VOUT_CLD VOUT_LNL BT_REG_O WCC_VDDI WL_REG_
S
O
DO
N
O
ON
SR_VDDB LDO_VDD1
AT5V
P5
H
GPIO_1
WLRF_VC
O_GND
GPIO_3
VSSC
GPIO_0
GPIO_4
G
H
J
WLRF_XTA
L_
3
VDD1P2
WLRF_XTA WLRF_XTA
4
L_GND
L_XOP
GPIO_2
WLRF_XTA
5
L_XON
SDIO_DAT
SDIO_CMD CLK_REQ
A_0
SDIO_DAT SDIO_DAT
A_1
A_3
2
6
SDIO_DAT
SDIO_CLK 7
A_2
K
L
M
Page 64 of 128
CYW4343X
Figure 48. 63-Ball WLBGA Ball Map (Bottom View)
A
B
C
1
BT_UART_
RXD
BT_DEV_
WAKE
BT_HOST_
WAKE
2
BT_UART_ BT_UART_
TXD
CTS_N
FM_OUT1
3
BT_PCM_
OUT
4
5
BT_PCM_
CLK
6
SR_VLX
7
SR_PVSS
D
E
F
G
H
J
K
FM_RF_IN
BT_VCO_
VDD
BT_IF_
VDD
BT_PAVDD
WLRF_
2G_eLG
WLRF_
2G_RF
FM_OUT2
FM_RF_
VDD
BTFM_
PLL_VDD
BTFM_
PLL_VSS
BT_IF_VSS
BT_UART_
RTS_N
VDDC
FM_RF_VS
S
BT_PCM_I
N
VSSC
VDDC
BT_PCM_
SYNC
WLRF_XTA WLRF_XTA
4
L_GND
L_XOP
VSSC
SR_
LDO_VDD1
VDDBAT5V
P5
SDIO_
DATA_1
SDIO_
DATA_3
H
J
Document No. 002-14797 Rev. *H
C
D
E
F
G
2
WLRF_AFE
_GND
GPIO_0
B
1
WLRF_VC WLRF_XTA
3
O_GND
L_VDD1P2
GPIO_1
A
WLRF_
PA_VDD
WLRF_
WLRF_VD
WLRF_
WLRF_PA_
GENERAL_
D_
LNA_GND
GND
GND
1P35
PMU_AVS VOUT_CLD VOUT_LNL BT_REG_O WCC_VDDI WL_REG_
S
O
DO
N
O
ON
LDO_
VDDBAT5V
M
BT_VCO_V WLRF_GPI
SS
O
LPO_IN
VOUT_3P3
L
GPIO_2
SDIO_
DATA_0
K
WLRF_XTA
5
L_XON
SDIO_CMD CLK_REQ
SDIO_
DATA_2
SDIO_CLK
L
M
6
7
Page 65 of 128
CYW4343X
Figure 49. 153-Bump WLCSP (Top View)(4343W)
14.2 WLBGA Ball List in Ball Number Order with X-Y Coordinates
Table 16 provides ball numbers and names in ball number order. The table includes the X and Y coordinates for a top
view with a (0,0) center.
Table 16. CYW4343X WLBGA Ball List — Ordered By Ball Number
Ball Number
Ball Name
X Coordinate
Y Coordinate
A1
BT_UART_RXD
–1200.006
2199.996
A2
BT_UART_TXD
–799.992
2199.996
Document No. 002-14797 Rev. *H
Page 66 of 128
CYW4343X
Table 16. CYW4343X WLBGA Ball List — Ordered By Ball Number (Cont.)
Ball Number
Ball Name
X Coordinate
Y Coordinate
A3
BT_I2S_WS or BT_PCM_SYNC
–399.996
2199.996
A4
BT_I2S_CLK or BT_PCM_CLK
0
2199.996
A5
BT_PCM_CLK or BT_I2S_CLK
399.996
2199.996
A6
SR_VLX
799.992
2199.978
A7
SR_PVSS
1199.988
2199.978
B1
BT_DEV_WAKE
–1200.006
1800
B2
BT_UART_CTS_N
–799.992
1800
B3
BT_I2S_DO or BT_PCM_OUT
–399.996
1800
B4
BT_PCM_OUT or BT_I2S_DO
0
1800
B5
BT_PCM_SYNC or BT_I2S_WS
399.996
1800
B6
PMU_AVSS
799.992
1799.982
B7
SR_VBAT5V
1199.988
1799.982
C1
BT_HOST_WAKE
–1200.006
1399.995
C2
FM_OUT1
–799.992
1399.986
C3
BT_UART_RTS_N
–399.996
1399.995
C4
BT_PCM_IN or BT_I2S_DI
0
1399.995
C5
SYS_VDDIO
399.996
1399.986
C6
VOUT_CLDO
799.992
1399.986
C7
LDO_VDD15V
1199.988
1399.986
D2
FM_OUT2
–799.992
999.99
D3
VDDC
–399.996
999.999
D4
VSSC
0
999.999
D5
WPT_1P8
399.996
999.99
D6
VOUT_LNLDO
799.992
999.99
E1
FM_RF_IN
–1199.988
599.994
E2
FM_RF_VDD
–799.992
599.994
E3
FM_RF_VSS
–399.996
599.994
E5
WPT_3P3
399.996
599.994
E6
BT_REG_ON
799.992
599.994
E7
VOUT_3P3
1199.988
599.994
F1
BT_VCO_VDD
–1199.988
199.998
F2
BTFM_PLL_VDD
–799.992
199.998
F4
BT_GPIO_3
0
199.998
F5
LPO_IN
399.996
199.998
F6
WCC_VDDIO
800.001
199.998
F7
LDO_VBAT5V
1199.988
199.998
G1
BT_IF_VDD
–1199.988
–199.998
G2
BTFM_PLL_VSS
–799.992
–199.998
Document No. 002-14797 Rev. *H
Page 67 of 128
CYW4343X
Table 16. CYW4343X WLBGA Ball List — Ordered By Ball Number (Cont.)
Ball Number
Ball Name
X Coordinate
Y Coordinate
G4
VDDC
0
–199.998
G5
BT_GPIO_4
399.996
–199.998
G6
WL_REG_ON
800.001
–199.998
H1
BT_PAVDD
–1199.988
–599.994
H2
BT_IF_VSS
–799.992
–599.994
H3
BT_VCO_VSS
–399.996
–599.994
H4
WLRF_AFE_GND
0
–599.994
H5
BT_GPIO_5
399.996
–599.994
H6
GPIO_1
800.001
–599.994
H7
SDIO_DATA_1
1200.006
–599.994
J1
WLRF_2G_eLG
–1199.988
–999.99
J2
WLRF_LNA_GND
–799.992
–999.99
J3
WLRF_GPIO
–399.996
–999.99
J5
VSSC
399.996
–999.999
J6
GPIO_0
800.001
–999.999
J7
SDIO_DATA_3
1200.006
–999.999
K1
WLRF_2G_RF
–1199.988
–1399.986
K2
WLRF_GENERAL_GND
–799.992
–1399.986
K4
GPIO_3
0
–1399.995
K5
GPIO_4
399.996
–1399.995
K6
SDIO_DATA_0
800.001
–1399.995
L2
WLRF_PA_GND
–799.992
–1799.982
L3
WLRF_VCO_GND
–399.996
–1799.982
L4
WLRF_XTAL_GND
0
–1799.982
L5
GPIO_2
399.996
–1799.991
L6
SDIO_CMD
800.001
–1799.991
L7
SDIO_DATA_2
1200.006
–1799.991
M1
WLRF_PA_VDD
–1199.988
–2199.978
M2
WLRF_VDD_1P35
–799.992
–2199.978
M3
WLRF_XTAL_VDD1P2
–399.996
–2199.978
M4
WLRF_XTAL_XOP
0
–2199.978
M5
WLRF_XTAL_XON
399.996
–2199.978
M6
CLK_REQ
800.001
–2199.996
M7
SDIO_CLK
1200.006
–2199.996
Document No. 002-14797 Rev. *H
Page 68 of 128
CYW4343X
14.3 WLBGA Ball List in Ball Number Order with X-Y Coordinates
Table 17 provides ball numbers and names in ball number order. The table includes the X and Y coordinates for a top view with a
(0,0) center.
Table 17. CYW4343X WLBGA Ball List — Ordered By Ball Number
Ball Number
Ball Name
X Coordinate
Y Coordinate
A1
BT_UART_RXD
–1200.006
2199.996
A2
BT_UART_TXD
–799.992
2199.996
A5
BT_PCM_CLK or BT_I2S_CLK
399.996
2199.996
A6
SR_VLX
799.992
2199.978
A7
SR_PVSS
1199.988
2199.978
B1
BT_DEV_WAKE
–1200.006
1800
B2
BT_UART_CTS_N
–799.992
1800
B4
BT_PCM_OUT or BT_I2S_DO
0
1800
B5
BT_PCM_SYNC or BT_I2S_WS
399.996
1800
B6
PMU_AVSS
799.992
1799.982
B7
SR_VBAT5V
1199.988
1799.982
C1
BT_HOST_WAKE
–1200.006
1399.995
C2
FM_OUT1
–799.992
1399.986
C3
BT_UART_RTS_N
–399.996
1399.995
C4
BT_PCM_IN or BT_I2S_DI
0
1399.995
C6
VOUT_CLDO
799.992
1399.986
C7
LDO_VDD15V
1199.988
1399.986
D2
FM_OUT2
–799.992
999.99
D3
VDDC
–399.996
999.999
D4
VSSC
0
999.999
D6
VOUT_LNLDO
799.992
999.99
E1
FM_RF_IN
–1199.988
599.994
E2
FM_RF_VDD
–799.992
599.994
E3
FM_RF_VSS
–399.996
599.994
E6
BT_REG_ON
799.992
599.994
E7
VOUT_3P3
1199.988
599.994
F1
BT_VCO_VDD
–1199.988
199.998
F2
BTFM_PLL_VDD
–799.992
199.998
F5
LPO_IN
399.996
199.998
F6
WCC_VDDIO
800.001
199.998
F7
LDO_VBAT5V
1199.988
199.998
G1
BT_IF_VDD
–1199.988
–199.998
G2
BTFM_PLL_VSS
–799.992
–199.998
G4
VDDC
0
–199.998
Document No. 002-14797 Rev. *H
Page 69 of 128
CYW4343X
Table 17. CYW4343X WLBGA Ball List — Ordered By Ball Number (Cont.)
Ball Number
Ball Name
X Coordinate
Y Coordinate
G6
WL_REG_ON
800.001
–199.998
H1
BT_PAVDD
–1199.988
–599.994
H2
BT_IF_VSS
–799.992
–599.994
H3
BT_VCO_VSS
–399.996
–599.994
H4
WLRF_AFE_GND
0
–599.994
H6
GPIO_1
800.001
–599.994
H7
SDIO_DATA_1
1200.006
–599.994
J1
WLRF_2G_eLG
–1199.988
–999.99
J2
WLRF_LNA_GND
–799.992
–999.99
J3
WLRF_GPIO
–399.996
–999.99
J5
VSSC
399.996
–999.999
J6
GPIO_0
800.001
–999.999
J7
SDIO_DATA_3
1200.006
–999.999
K1
WLRF_2G_RF
–1199.988
–1399.986
K2
WLRF_GENERAL_GND
–799.992
–1399.986
K6
SDIO_DATA_0
800.001
–1399.995
L2
WLRF_PA_GND
–799.992
–1799.982
L3
WLRF_VCO_GND
–399.996
–1799.982
L4
WLRF_XTAL_GND
0
–1799.982
L5
GPIO_2
399.996
–1799.991
L6
SDIO_CMD
800.001
–1799.991
L7
SDIO_DATA_2
1200.006
–1799.991
M1
WLRF_PA_VDD
–1199.988
–2199.978
M2
WLRF_VDD_1P35
–799.992
–2199.978
M3
WLRF_XTAL_VDD1P2
–399.996
–2199.978
M4
WLRF_XTAL_XOP
0
–2199.978
M5
WLRF_XTAL_XON
399.996
–2199.978
M6
CLK_REQ
800.001
–2199.996
M7
SDIO_CLK
1200.006
–2199.996
14.4 WLCSP Bump List in Bump Order with X-Y Coordinates
Table 18. CYW4343X WLCSP Bump List — Ordered By Bump Number
Bump
Number
Bump View
(0,0 Center of Die)
Bump Name
X Coordinate
Y Coordinate
Top View
(0,0 Center of Die)
X Coordinate
Y Coordinate
1
BT_UART_RXD
1228.248
2133.594
–1228.248
2133.594
2
BT_VDDC_ISO_2
944.082
2195.919
–944.082
2195.919
3
BT_PCM_CLK or BT_I2S_CLK
238.266
2275.020
–238.266
2275.020
Document No. 002-14797 Rev. *H
Page 70 of 128
CYW4343X
Table 18. CYW4343X WLCSP Bump List — Ordered By Bump Number (Cont.)
Bump View
(0,0 Center of Die)
Bump
Number
Bump Name
X Coordinate
Y Coordinate
Top View
(0,0 Center of Die)
X Coordinate
Y Coordinate
4
BT_TM1
–327.438
2275.020
327.438
2275.020
5
BT_GPIO_3
662.544
2133.594
–662.544
2133.594
6
BT_DEV_WAKE
379.692
2133.594
–379.692
2133.594
7
BT_UART_RTS_N
1086.822
1992.168
–1086.822
1992.168
8
BT_GPIO_4
521.118
1992.168
–521.118
1992.168
9
BT_VDDC_ISO_1
–44.586
1992.168
44.586
1992.168
10
BT_GPIO_5
–327.438
1992.168
327.438
1992.168
11
BT_HOST_WAKE
1228.248
1850.742
–1228.248
1850.742
12
BT_UART_TXD
945.396
1850.742
–945.396
1850.742
13
BT_GPIO_2
662.544
1850.742
–662.544
1850.742
14
BT_VDDC
379.692
1850.742
–379.692
1850.742
15
BT_I2S_CLK or BT_PCM_CLK
–186.012
1850.742
186.012
1850.742
16
BT_VDDC
516.501
1717.578
–516.501
1717.578
17
BT_PCM_SYNC or BT_I2S_WS
1086.822
1709.316
–1086.822
1709.316
18
BT_I2S_WS or BT_PCM_SYNC
238.266
1709.316
–238.266
1709.316
19
BT_PCM_OUT or BT_I2S_DO
–327.438
1709.316
327.438
1709.316
20
BT_PCM_IN or BT_I2S_DI
662.544
1567.890
–662.544
1567.890
21
VSSC
96.840
1567.890
–96.840
1567.890
22
BT_UART_CTS_N
–186.012
1567.890
186.012
1567.890
23
BT_I2S_DI or BT_PCM_IN
238.266
1426.464
–238.266
1426.464
24
BT_I2S_DO or BT_PCM_OUT
–327.438
1426.464
327.438
1426.464
25
VSSC
96.840
1285.038
–96.840
1285.038
26
BT_VDDC
518.391
1189.863
–518.391
1189.863
27
VSSC
238.266
860.760
–238.266
860.760
28
BT_VDDC
–44.586
719.334
44.586
719.334
29
VSSC
110.286
561.303
–110.286
561.303
30
VSSC
–327.438
436.482
327.438
436.482
31
BT_VDDC
521.118
436.473
–521.118
436.473
32
VSSC
238.266
153.630
–238.266
153.630
33
VSSC
–44.586
153.630
44.586
153.630
34
BT_VDDC
229.986
–185.976
–229.986
–185.976
35
BT_PAVSS
1185.471
–455.270
–1185.471
–455.270
36
VSSC
–875.142
–836.352
875.142
–836.352
37
FM_DAC_VOUT1
1243.031
1443.096
–1243.031
1443.096
38
FM_DAC_AVSS
1043.033
1443.096
–1043.033
1443.096
39
FM_PLLAVSS
820.485
1275.098
–820.485
1275.098
40
FM_DAC_VOUT2
1243.031
1243.098
–1243.031
1243.098
41
FM_DAC_AVDD
1043.033
1243.098
–1043.033
1243.098
42
FM_VCOVSS
1252.220
1043.100
–1252.220
1043.100
Document No. 002-14797 Rev. *H
Page 71 of 128
CYW4343X
Table 18. CYW4343X WLCSP Bump List — Ordered By Bump Number (Cont.)
Bump View
(0,0 Center of Die)
Bump
Number
43
Bump Name
X Coordinate
Y Coordinate
Top View
(0,0 Center of Die)
X Coordinate
Y Coordinate
FM_PLLDVDD1P2
820.485
960.593
–820.485
960.593
44
FM_VCOVDD1P2
1120.383
892.373
–1120.383
892.373
45
FM_RFVDD1P2
1274.787
764.213
–1274.787
764.213
46
FM_RFVSS
1172.988
563.990
–1172.988
563.990
47
FM_IFVSS
972.990
563.990
–972.990
563.990
48
FM_IFDVDD1P2
772.304
563.990
–772.304
563.990
49
FM_RFINMAIN
1276.551
383.225
–1276.551
383.225
50
BT_DVSS
686.628
160.911
–686.628
160.911
51
BT_IFVDD1P2
886.626
148.775
–886.626
148.775
52
BT_AGPIO
1185.471
–55.274
–1185.471
–55.274
53
BT_PAVDD2P5
1185.462
–255.272
–1185.462
–255.272
54
BT_LNAVDD1P2
781.893
–263.768
–781.893
–263.768
55
BT_LNAVSS
781.893
–463.766
–781.893
–463.766
56
BT_PLLVSS
429.885
–499.995
–429.885
–499.995
57
BT_VCOVDD1P2
1185.471
–655.268
–1185.471
–655.268
58
BT_VCOVSS
786.393
–663.764
–786.393
–663.764
59
BT_PLLVDD1P2
429.885
–699.993
–429.885
–699.993
60
WRF_AFE_GND
583.250
–999.990
–583.250
–999.990
61
WRF_RFIN_ELG_2G
1262.642
–1006.290
–1262.642
–1006.290
62
WRF_RX2G_GND
1082.642
–1006.290
–1082.642
–1006.290
63
WRF_RFIO_2G
1206.990
–1458.198
–1206.990
–1458.198
64
WRF_GENERAL_GND
628.713
–1590.210
–628.713
–1590.210
65
WRF_PA_GND3P3
986.531
–1649.615
–986.531
–1649.615
66
WRF_VCO_GND
451.188
–1682.370
–451.188
–1682.370
67
WRF_GPAIO_OUT
799.992
–1729.224
–799.992
–1729.224
68
WRF_PMU_VDD1P35
612.878
–1800.135
–612.878
–1800.135
69
WRF_PA_GND3P3
986.531
–1829.615
–986.531
–1829.615
70
WRF_PA_VDD3P3
1249.686
–2016.945
–1249.686
–2016.945
71
WRF_PA_VDD3P3
1069.686
–2016.945
–1069.686
–2016.945
72
WRF_XTAL_GND1P2
274.613
–2086.677
–274.613
–2086.677
73
WRF_XTAL_VDD1P2
75.519
–2106.621
–75.519
–2106.621
74
WRF_XTAL_XOP
311.126
–2298.978
–311.126
–2298.978
75
WRF_XTAL_XON
131.126
–2298.978
–131.126
–2298.978
76
LPO_IN
96.840
2133.594
–96.840
2133.594
77
WCC_VDDIO
–186.012
2133.594
186.012
2133.594
78
VSSC
96.813
1850.742
–96.813
1850.742
79
WCC_VDDIO
–44.586
1002.186
44.586
1002.186
80
GPIO_12
–1299.420
436.482
1299.420
436.482
81
GPIO_11
–1157.994
295.056
1157.994
295.056
Document No. 002-14797 Rev. *H
Page 72 of 128
CYW4343X
Table 18. CYW4343X WLCSP Bump List — Ordered By Bump Number (Cont.)
Bump View
(0,0 Center of Die)
Bump
Number
Bump Name
X Coordinate
–1016.568
Y Coordinate
Top View
(0,0 Center of Die)
X Coordinate
Y Coordinate
82
GPIO_9
153.630
1016.568
153.630
83
GPIO_10
84
GPIO_8
–1299.420
153.630
1299.420
153.630
–1157.994
12.204
1157.994
12.204
85
VSSC
–186.012
–129.222
186.012
–129.222
86
VDDC
–468.864
–129.222
468.864
–129.222
87
GPIO_7
–1299.420
–129.222
1299.420
–129.222
88
VSSC
–610.290
–270.648
610.290
–270.648
89
GPIO_6
–1157.994
–270.648
1157.994
–270.648
90
VSSC
–44.586
–412.074
44.586
–412.074
91
GPIO_4
–1299.420
–412.074
1299.420
–412.074
92
VSSC
96.840
–553.500
–96.840
–553.500
93
VDDC
–186.012
–553.500
186.012
–553.500
94
GPIO_5
–1157.994
–553.500
1157.994
–553.500
95
VDDC
–44.586
–694.926
44.586
–694.926
96
WL_VDDP_ISO
–733.716
–694.926
733.716
–694.926
97
GPIO_2
–1299.420
–694.926
1299.420
–694.926
98
GPIO_3
–1157.994
–836.352
1157.994
–836.352
99
WCC_VDDIO
–1016.568
–977.778
1016.568
–977.778
100
GPIO_0
–1299.420
–977.778
1299.420
–977.778
101
GPIO_1
–1157.994
–1119.204
1157.994
–1119.204
102
VSSC
–720.954
–1120.266
720.954
–1120.266
103
WCC_VDDIO
–1016.568
–1260.630
1016.568
–1260.630
104
SDIO_CMD
–1299.420
–1260.630
1299.420
–1260.630
105
GPIO_14
–137.700
–1268.568
137.700
–1268.568
106
VSSC
–841.113
–1402.056
841.113
–1402.056
107
VDDC
–1016.568
–1543.482
1016.568
–1543.482
108
SDIO_CLK
–1299.420
–1543.482
1299.420
–1543.482
109
GPIO_15
109.152
–1551.420
–109.152
–1551.420
110
PACKAGEOPTION_0
–173.700
–1551.420
173.700
–1551.420
111
VSSC
–843.237
–1682.775
843.237
–1682.775
112
SDIO_DATA_0
–1157.994
–1684.908
1157.994
–1684.908
113
PACKAGEOPTION_1
–32.274
–1692.846
32.274
–1692.846
114
VDDC
–1016.568
–1826.334
1016.568
–1826.334
115
SDIO_DATA_1
–1299.420
–1826.334
1299.420
–1826.334
116
PACKAGEOPTION_2
109.152
–1834.272
–109.152
–1834.272
117
JTAG_SEL
–173.700
–1834.272
173.700
–1834.272
118
SDIO_DATA_2
–1157.994
–1967.760
1157.994
–1967.760
119
GPIO_13
–232.227
–2056.131
232.227
–2056.131
120
WCC_VDDIO
–1016.568
–2109.186
1016.568
–2109.186
Document No. 002-14797 Rev. *H
Page 73 of 128
CYW4343X
Table 18. CYW4343X WLCSP Bump List — Ordered By Bump Number (Cont.)
Bump View
(0,0 Center of Die)
Bump
Number
121
Bump Name
VSSC
X Coordinate
–1299.420
Y Coordinate
–2109.186
Top View
(0,0 Center of Die)
X Coordinate
1299.420
Y Coordinate
–2109.186
122
SDIO_DATA_3
–1157.994
–2250.612
1157.994
–2250.612
123
SR_PVSS
–739.130
2274.984
739.130
2274.984
124
SR_PVSS
–1021.973
2274.984
1021.973
2274.984
125
VSSC
–597.708
2133.563
597.708
2133.563
126
SR_VLX
–880.551
2133.563
880.551
2133.563
127
SR_VLX
–1163.394
2133.563
1163.394
2133.563
128
SR_VLX
–739.130
1992.141
739.130
1992.141
129
SR_VDDBAT5V
–1021.973
1992.141
1021.973
1992.141
130
SR_VDDBAT5V
–1304.816
1992.141
1304.816
1992.141
131
PMU_AVSS
–597.708
1850.720
597.708
1850.720
132
SR_VDDBAT5V
–880.551
1850.720
880.551
1850.720
133
LDO_VDD1P5
–1021.973
1709.298
1021.973
1709.298
134
VOUT_CLDO
–880.551
1567.877
880.551
1567.877
135
LDO_VDD1P5
–1163.394
1567.877
1163.394
1567.877
136
VOUT_CLDO
–739.130
1426.455
739.130
1426.455
137
WCC_VDDIO
–597.708
1285.034
597.708
1285.034
138
VOUT_LNLDO
–880.551
1285.034
880.551
1285.034
139
VOUT_3P3
–1163.394
1285.034
1163.394
1285.034
140
SYS_VDDIO
–739.130
1143.612
739.130
1143.612
141
LDO_VDDBAT5V
–1304.816
1143.612
1304.816
1143.612
142
VSSC
–597.708
1002.191
597.708
1002.191
143
VOUT_3P3_SENSE
–880.551
1002.191
880.551
1002.191
144
VOUT_3P3
–1163.394
1002.191
1163.394
1002.191
145
WPT_1P8
–739.130
860.769
739.130
860.769
146
WPT_3P3
–1021.973
860.769
1021.973
860.769
147
LDO_VDDBAT5V
–1304.816
860.769
1304.816
860.769
148
WL_REG_ON
–597.708
719.348
597.708
719.348
149
BT_REG_ON
–880.551
719.348
880.551
719.348
150
WL_VDDM_ISO
–875.142
12.204
875.142
12.204
151
PLL_VSSC
–116.586
–985.716
116.586
-985.716
152
PLL_VDDC
29.286
–1130.076
–29.286
–1130.076
153
CLK_REQ
238.266
1992.168
–238.266
1992.168
Document No. 002-14797 Rev. *H
Page 74 of 128
CYW4343X
14.5 WLBGA Ball List Ordered By Ball Name
Table 19 provides the ball numbers and names in ball name order.
Table 19. CYW4343X WLBGA Ball List — Ordered By Ball Name
Ball Name
Ball Name
Ball Number
Ball Number
B1
LPO_IN
F5
BT_GPIO_3
F4
PMU_AVSS
B6
BT_GPIO_4
G5
SDIO_CLK
M7
BT_GPIO_5
H5
SDIO_CMD
L6
BT_HOST_WAKE
C1
SDIO_DATA_0
K6
BT_I2S_CLK or BT_PCM_CLK
A4
SDIO_DATA_1
H7
BT_I2S_DO or BT_PCM_OUT
B3
SDIO_DATA_2
L7
BT_I2S_WS or BT_PCM_SYNC
A3
SDIO_DATA_3
J7
BT_IF_VDD
G1
SR_PVSS
A7
BT_IF_VSS
H2
SR_VDDBAT5V
B7
BT_PAVDD
H1
SR_VLX
A6
BT_PCM_CLK or BT_I2S_CLK
A5
SYS_VDDIO
C5
BT_PCM_IN or BT_I2S_DI
C4
VDDC
D3
BT_PCM_OUT or BT_I2S_DO
B4
VDDC
G4
BT_PCM_SYNC or BT_I2S_WS
B5
VOUT_3P3
E7
BT_REG_ON
E6
VOUT_CLDO
C6
BT_UART_CTS_N
B2
VOUT_LNLDO
D6
BT_UART_RTS_N
C3
VSSC
D4
BT_UART_RXD
A1
VSSC
J5
BT_UART_TXD
A2
WCC_VDDIO
F6
BT_VCO_VDD
F1
WL_REG_ON
G6
BT_VCO_VSS
H3
WLRF_2G_eLG
J1
BTFM_PLL_VDD
F2
WLRF_2G_RF
K1
BTFM_PLL_VSS
G2
WLRF_AFE_GND
H4
CLK_REQ
M6
WLRF_GENERAL_GND
K2
FM_OUT1
C2
WLRF_GPIO
J3
FM_OUT2
D2
WLRF_LNA_GND
J2
FM_RF_IN
E1
WLRF_PA_GND
L2
FM_RF_VDD
E2
WLRF_PA_VDD
M1
FM_RF_VSS
E3
WLRF_VCO_GND
L3
GPIO_0
J6
WLRF_VDD_1P35
M2
GPIO_1
H6
WLRF_XTAL_GND
L4
GPIO_2
L5
WLRF_XTAL_VDD1P2
M3
GPIO_3
K4
WLRF_XTAL_XON
M5
GPIO_4
K5
WLRF_XTAL_XOP
M4
LDO_VDD1P5
C7
WPT_1P8
D5
LDO_VDDBAT5V
F7
WPT_3P3
E5
BT_DEV_WAKE
Document No. 002-14797 Rev. *H
Page 75 of 128
CYW4343X
14.6 WLBGA Ball List Ordered By Ball Name
Table 20 provides the ball numbers and names in ball name order.
Table 20. CYW4343X WLBGA Ball List — Ordered By Ball Name
Ball Name
Ball Name
Ball Number
Ball Number
BT_DEV_WAKE
B1
SDIO_CMD
L6
BT_HOST_WAKE
C1
SDIO_DATA_0
K6
BT_IF_VDD
G1
SDIO_DATA_1
H7
BT_IF_VSS
H2
SDIO_DATA_2
L7
BT_PAVDD
H1
SDIO_DATA_3
J7
BT_PCM_CLK or BT_I2S_CLK
A5
SR_PVSS
A7
BT_PCM_IN or BT_I2S_DI
C4
SR_VDDBAT5V
B7
BT_PCM_OUT or BT_I2S_DO
B4
SR_VLX
A6
BT_PCM_SYNC or BT_I2S_WS
B5
VDDC
D3
BT_REG_ON
E6
VDDC
G4
BT_UART_CTS_N
B2
VOUT_3P3
E7
BT_UART_RTS_N
C3
VOUT_CLDO
C6
BT_UART_RXD
A1
VOUT_LNLDO
D6
BT_UART_TXD
A2
VSSC
D4
BT_VCO_VDD
F1
VSSC
J5
BT_VCO_VSS
H3
WCC_VDDIO
F6
BTFM_PLL_VDD
F2
WL_REG_ON
G6
BTFM_PLL_VSS
G2
WLRF_2G_eLG
J1
CLK_REQ
M6
WLRF_2G_RF
K1
FM_OUT1
C2
WLRF_AFE_GND
H4
FM_OUT2
D2
WLRF_GENERAL_GND
K2
FM_RF_IN
E1
WLRF_GPIO
J3
FM_RF_VDD
E2
WLRF_LNA_GND
J2
FM_RF_VSS
E3
WLRF_PA_GND
L2
GPIO_0
J6
WLRF_PA_VDD
M1
GPIO_1
H6
WLRF_VCO_GND
L3
GPIO_2
L5
WLRF_VDD_1P35
M2
LDO_VDD1P5
C7
WLRF_XTAL_GND
L4
LDO_VDDBAT5V
F7
WLRF_XTAL_VDD1P2
M3
LPO_IN
F5
WLRF_XTAL_XON
M5
PMU_AVSS
B6
WLRF_XTAL_XOP
M4
SDIO_CLK
M7
Document No. 002-14797 Rev. *H
Page 76 of 128
CYW4343X
14.7 WLCSP Bump List Ordered By Name
Table 21 provides the bump numbers and names in bump name order.
Table 21. CYW4343X WLCSP Bump List — Ordered By Bump Name
Bump Name
Bump Name
Bump Number(s)
Bump Number(s)
BT_AGPIO
52
FM_DAC_VOUT1
BT_DEV_WAKE
6
FM_DAC_VOUT2
40
BT_DVSS
50
FM_IFDVDD1P2
48
BT_GPIO_2
13
FM_IFVSS
47
BT_GPIO_3
5
FM_PLLAVSS
39
BT_GPIO_4
8
FM_PLLDVDD1P2
43
BT_GPIO_5
10
FM_RFINMAIN
49
BT_HOST_WAKE
11
FM_RFVDD1P2
45
BT_I2S_CLK or BT_PCM_CLK
15
FM_RFVSS
46
BT_I2S_DI or BT_PCM_IN
23
FM_VCOVDD1P2
44
BT_I2S_DO or BT_PCM_OUT
24
FM_VCOVSS
42
BT_I2S_WS or BT_PCM_SYNC
18
GPIO_0
100
BT_IFVDD1P2
51
GPIO_1
101
BT_LNAVDD1P2
54
GPIO_2
97
BT_LNAVSS
55
GPIO_3
98
BT_PAVDD2P5
53
GPIO_4
91
BT_PAVSS
35
GPIO_5
94
BT_PCM_CLK or BT_I2S_CLK
3
GPIO_6
89
BT_PCM_IN or BT_I2S_DI
20
GPIO_7
87
BT_PCM_OUT or BT_I2S_DO
19
GPIO_8
84
BT_PCM_SYNC or BT_I2S_WS
17
GPIO_9
82
BT_PLLVDD1P2
59
GPIO_10
83
BT_PLLVSS
56
GPIO_11
81
BT_REG_ON
149
GPIO_12
80
BT_TM1
4
GPIO_13
119
BT_UART_CTS_N
22
GPIO_14
105
BT_UART_RTS_N
7
GPIO_15
109
BT_UART_RXD
1
JTAG_SEL
117
BT_UART_TXD
12
LDO_VDD1P5
133, 135
BT_VCOVDD1P2
57
LDO_VDDBAT5V
141, 147
BT_VCOVSS
58
LPO_IN
76
BT_VDDC
14, 16, 26, 28, 31, 34
PACKAGEOPTION_0
110
BT_VDDC_ISO_1
9
PACKAGEOPTION_1
113
BT_VDDC_ISO_2
2
PACKAGEOPTION_2
116
CLK_REQ
153
PLL_VDDC
152
FM_DAC_AVDD
41
PLL_VSSC
151
38
PMU_AVSS
131
FM_DAC_AVSS
Document No. 002-14797 Rev. *H
37
Page 77 of 128
CYW4343X
Bump Name
SDIO_CLK
Bump Number(s)
108
SDIO_CMD
104
SDIO_DATA_0
112
SDIO_DATA_1
115
SDIO_DATA_2
118
SDIO_DATA_3
122
SR_PVSS
123, 124
SR_VDDBAT5V
129, 130, 132
SR_VLX
126, 127, 128
SYS_VDDIO
140
VDDC
86, 93, 95, 107, 114
VOUT_3P3
139, 144
VOUT_3P3_SENSE
143
VOUT_CLDO
134, 136
VOUT_LNLDO
138
VSSC
21, 25, 27, 29, 30, 32,
33, 36, 78, 85, 88, 90,
92, 102, 106, 111, 121,
125, 142
WCC_VDDIO
77, 79, 99, 103, 120,
137
WL_REG_ON
148
WL_VDDM_ISO
150
WL_VDDP_ISO
96
WPT_1P8
145
WPT_3P3
146
WRF_AFE_GND
60
WRF_GENERAL_GND
64
WRF_GPAIO_OUT
67
WRF_PA_GND3P3
65, 69, 70, 71
WRF_PMU_VDD1P35
68
WRF_RFIN_ELG_2G
61
WRF_RFIO_2G
63
WRF_RX2G_GND
62
WRF_VCO_GND
66
WRF_XTAL_GND1P2
72
WRF_XTAL_VDD1P2
73
WRF_XTAL_XON
75
WRF_XTAL_XOP
74
Document No. 002-14797 Rev. *H
Page 78 of 128
CYW4343X
14.8 Signal Descriptions
Table 22 provides the WLBGA package signal descriptions.
Table 22. WLBGA Signal Descriptions
Signal Name
WLBGA Ball
Type
Description
RF Signal Interface
WLRF_2G_RF
K1
O
2.4 GHz BT and WLAN RF output port
SDIO_CLK
M7
I
SDIO clock input
SDIO_CMD
L6
I/O
SDIO command line
SDIO_DATA_0
K6
I/O
SDIO data line 0
SDIO_DATA_1
H7
I/O
SDIO data line 1.
SDIO_DATA_2
L7
I/O
SDIO data line 2. Also used as a strapping option (see
Table 26 on page 87).
SDIO_DATA_3
J7
I/O
SDIO data line 3
SDIO Bus Interface
Note: Per Section 6 of the SDIO specification, 10 to 100 kΩ pull-ups are required on the four DATA lines and the CMD line.
This requirement must be met during all operating states by using external pull-up resistors or properly programming internal
SDIO host pull-ups.
WLAN GPIO Interface
WLRF_GPIO
J3
I/O
Test pin. Not connected in normal operation.
Clocks
WLRF_XTAL_XON
M5
O
XTAL oscillator output
WLRF_XTAL_XOP
M4
I
XTAL oscillator input
CLK_REQ
M6
O
External system clock request—Used when the system
clock is not provided by a dedicated crystal (for example,
when a shared TCXO is used). Asserted to indicate to the
host that the clock is required. Shared by BT, and WLAN.
LPO_IN
F5
I
External sleep clock input (32.768 kHz). If an external
32.768 kHz clock cannot be provided, pull this pin low.
However, BLE will be always on and cannot go to deep
sleep.
FM_OUT1
C2
O
FM analog output 1
FM_OUT2
D2
O
FM analog output 2
FM_RF_IN
E1
I
FM radio antenna port
FM_RF_VDD
E2
I
FM power supply
BT_PCM_CLK or BT_I2S_CLK
A5
I/O
PCM or I2S clock; can be master (output) or slave (input)
BT_PCM_IN or BT_I2S_DI
C4
I
PCM or I2S data input sensing
BT_PCM_OUT or BT_I2S_DO
B4
O
PCM or I2S data output
BT_PCM_SYNC or BT_I2S_WS
B5
I/O
PCM SYNC or I2S_WS; can be master (output) or slave
(input)
FM Receiver
Bluetooth PCM
Bluetooth GPIO
BT_GPIO_3
F4
I/O
Bluetooth general purpose I/O.WPT_INTb to wireless
charging PMU.
BT_GPIO_4
G5
I/O
Bluetooth general purpose I/O.BSC_SDA to/from
wireless charging PMU.
BT_GPIO_5
H5
I/O
Bluetooth general purpose I/O.BSC_SCL from wireless
charging PMU.
Document No. 002-14797 Rev. *H
Page 79 of 128
CYW4343X
Table 22. WLBGA Signal Descriptions (Cont.)
Signal Name
WLBGA Ball
Type
Description
Bluetooth UART and Wake
BT_UART_CTS_N
B2
I
UART clear-to-send. Active-low clear-to-send signal for
the HCI UART interface.
BT_UART_RTS_N
C3
O
UART request-to-send. Active-low request-to-send
signal for the HCI UART interface.
BT_UART_RXD
A1
I
UART serial input. Serial data input for the HCI UART
interface.
BT_UART_TXD
A2
O
UART serial output. Serial data output for the HCI UART
interface.
BT_DEV_WAKE
B1
I/O
DEV_WAKE or general-purpose I/O signal.
BT_HOST_WAKE
C1
I/O
HOST_WAKE or general-purpose I/O signal.
Note: By default, the Bluetooth BT WAKE signals provide GPIO/WAKE functionality, and the UART pins provide UART functionality.
Through software configuration, the PCM interface can also be routed over the
BT_WAKE/UART signals as follows:
• PCM_CLK on the UART_RTS_N pin
• PCM_OUT on the UART_CTS_N pin
• PCM_SYNC on the BT_HOST_WAKE pin
• PCM_IN on the BT_DEV_WAKE pin
In this case, the BT HCI transport included sleep signaling will operate using UART_RXD and UART_TXD; that is, using a 3-Wire UART
Transport.
Bluetooth/FM I2S
BT_I2S_CLK or BT_PCM_CLK
A4
I/O
I2S or PCM clock; can be master (output) or slave (input)
BT_I2S_DO or BT_PCM_OUT
B3
I/O
I2S or PCM data output
BT_I2S_WS or BT_PCM_SYNC
A3
I/O
I2S WS or PCM sync; can be master (output) or slave
(input)
WL_REG_ON
G6
I
Used by PMU to power up or power down the internal
regulators used by the WLAN section. Also, when
deasserted, this pin holds the WLAN section in reset.
This pin has an internal 200 k pull-down resistor that is
enabled by default. It can be disabled through
programming.
BT_REG_ON
E6
I
Used by PMU to power up or power down the internal
regulators used by the Bluetooth/FM section. Also, when
deasserted, this pin holds the Bluetooth/FM section in
reset. This pin has an internal 200 k pull-down resistor
that is enabled by default. It can be disabled through
programming.
WPT_3P3
E5
N/A
Not used. Do not connect to this pin.
WPT_1P8
D5
N/A
Not used. Do not connect to this pin.
GPIO_0
J6
I/O
Programmable GPIO pins. This pin becomes an output
pin when it is used as WLAN_HOST_WAKE/out-of-band
signal.
GPIO_1
H6
I/O
Programmable GPIO pins
GPIO_2
L5
I/O
Programmable GPIO pins
GPIO_3
K4
I/O
Programmable GPIO pins
GPIO_4
K5
I/O
Programmable GPIO pins
WLRF_2G_eLG
J1
I
Connect to an external inductor. See the reference
schematic for details.
Miscellaneous
Document No. 002-14797 Rev. *H
Page 80 of 128
CYW4343X
Table 22. WLBGA Signal Descriptions (Cont.)
Signal Name
WLBGA Ball
Type
Description
Integrated Voltage Regulators
SR_VDDBAT5V
B7
I
SR VBAT input power supply
SR_VLX
A6
O
CBUCK switching regulator output. See Table 42 on
page 107 for details of the inductor and capacitor
required on this output.
LDO_VDDBAT5V
F7
I
LDO VBAT
LDO_VDD1P5
C7
I
LNLDO input
VOUT_LNLDO
D6
O
Output of low-noise LNLDO
VOUT_CLDO
C6
O
Output of core LDO
Bluetooth Power Supplies
BT_PAVDD
H1
I
BT_IF_VDD
G1
I
Bluetooth IF block power supply
BTFM_PLL_VDD
F2
I
Bluetooth RF PLL power supply
BT_VCO_VDD
F1
I
Bluetooth RF power supply
Document No. 002-14797 Rev. *H
Bluetooth PA power supply
Page 81 of 128
CYW4343X
Table 22. WLBGA Signal Descriptions (Cont.)
Signal Name
WLBGA Ball
Type
Description
Power Supplies
WLRF_XTAL_VDD1P2
M3
I
XTAL oscillator supply
WLRF_PA_VDD
M1
I
Power amplifier supply
WCC_VDDIO
F6
I
VDDIO input supply. Connect to VDDIO.
SYS_VDDIO[4343S+4343W+43CS4343W1]
C5
I
VDDIO input supply. Connect to VDDIO.
WLRF_VDD_1P35
M2
I
LNLDO input supply
VDDC
D3, G4
I
Core supply for WLAN and BT.
VOUT_3P3
E7
O
3.3V output supply. See the reference schematic for
details.
Ground
BT_IF_VSS
H2
I
BTFM_PLL_VSS
G2
I
1.2V Bluetooth IF block ground
Bluetooth/FM RF PLL ground
BT_VCO_VSS
H3
I
1.2V Bluetooth RF ground
FM_RF_VSS
E3
I
FM RF ground
PMU_AVSS
B6
I
Quiet ground
SR_PVSS
A7
I
Switcher-power ground
VSSC
D4, J5
I
Core ground for WLAN and BT
WLRF_AFE_GND
H4
I
AFE ground
WLRF_LNA_GND
J2
I
2.4 GHz internal LNA ground
WLRF_GENERAL_GND
K2
I
Miscellaneous RF ground
WLRF_PA_GND
L2
I
2.4 GHz PA ground
WLRF_VCO_GND
L3
I
VCO/LO generator ground
WLRF_XTAL_GND
L4
I
XTAL ground
[4343W]Table 23 provides the WLCSP package signal descriptions.
Table 23. WLCSP Signal Descriptions
Signal Name
WLCSP Bump
Type
Description or Instruction
RF Signal Interface
WRF_RFIN_ELG_2G
61
I
Connect to an external inductor. See the
reference schematic for details.
WRF_RFIO_2G
63
I/O
2.4 GHz BT and WLAN RF input/output port
SDIO Bus Interface
SDIO_CLK
108
I
SDIO clock input
SDIO_CMD
104
I/O
SDIO command line
SDIO_DATA_0
112
I/O
SDIO data line 0
SDIO_DATA_1
115
I/O
SDIO data line 1.
SDIO_DATA_2
118
I/O
SDIO data line 2. Also used as a strapping option (see
Table 26 on page 87).
SDIO_DATA_3
122
I/O
SDIO data line 3
Note: Per Section 6 of the SDIO specification, 10 to 100 kΩ pull-ups are required on the four DATA lines and the CMD line.
This requirement must be met during all operating states by using external pull-up resistors or properly programming internal
SDIO host pull-ups.
Document No. 002-14797 Rev. *H
Page 82 of 128
CYW4343X
Table 23. WLCSP Signal Descriptions (Cont.)
Signal Name
WLCSP Bump
Type
Description or Instruction
WLAN GPIO Interface
WRF_GPAIO_OUT
67
O
Test pin. Not connected in normal operation.
Clocks
WRF_XTAL_XON
75
O
XTAL oscillator output
WRF_XTAL_XOP
74
I
XTAL oscillator input
CLK_REQ
153
O
External system clock request—Used when the system
clock is not provided by a dedicated crystal (for example,
when a shared TCXO is used). Asserted to indicate to the
host that the clock is required. Shared by BT, and WLAN.
LPO_IN
76
I
External sleep clock input (32.768 kHz). If an external 32.768
kHz clock cannot be provided, pull this pin low. However,
BLE will be always on and cannot go to deep sleep.
FM
FM_DAC_VOUT1
37
O
FM_DAC_VOUT2
40
O
FM DAC output 1
FM DAC output 2
FM_RFINMAIN
49
I
FM RF input
Bluetooth PCM
BT_PCM_CLK or BT_I2S_CLK
3
I/O
PCM or I2S clock; can be master (output) or slave (input)
BT_PCM_IN or BT_I2S_DI
20
I
PCM or I2S data input sensing
BT_PCM_OUT or BT_I2S_DO
19
O
PCM or I2S data output
BT_PCMM_SYNC or BT_I2S_WS
17
I/O
PCM SYNC or I2S WS; can be master (output) or slave
(input)
Bluetooth GPIO
BT_AGPIO
52
I/O
Bluetooth analog GPIO
BT_GPIO_2
13
I/O
Bluetooth general purpose I/O
BT_GPIO_3
5
I/O
WPT_INTb to wireless charging PMU.
BT_GPIO_4
8
I/O
BSC_SDA to/from wireless charging PMU.
BT_GPIO_5
10
I/O
BSC_SCL from wireless charging PMU
BT_TM1
4
I/O
ARM JTAG mode
BT_UART_CTS_N
22
I
UART clear-to-send. Active-low clear-to-send signal for the
HCI UART interface.
BT_UART_RTS_N
7
O
UART request-to-send. Active-low request-to-send signal for
the HCI UART interface.
BT_UART_RXD
1
I
UART serial input. Serial data input for the HCI UART
interface.
BT_UART_TXD
12
O
UART serial output. Serial data output for the HCI UART
interface.
BT_DEV_WAKE
6
I/O
DEV_WAKE or general-purpose
I/O signal
BT_HOST_WAKE
11
I/O
HOST_WAKE or general-purpose I/O signal
Bluetooth UART and Wake
Note: By default, the Bluetooth BT WAKE signals provide GPIO/WAKE functionality, and the UART pins provide UART functionality.
Through software configuration, the PCM interface can also be routed over the
BT_WAKE/UART signals as follows:
• PCM_CLK on the UART_RTS_N pin
• PCM_OUT on the UART_CTS_N pin
• PCM_SYNC on the BT_HOST_WAKE pin
• PCM_IN on the BT_DEV_WAKE pin
In this case, the BT HCI transport included sleep signaling will operate using UART_RXD and UART_TXD; that is, using a 3-Wire UART
Transport.
Document No. 002-14797 Rev. *H
Page 83 of 128
CYW4343X
Table 23. WLCSP Signal Descriptions (Cont.)
Signal Name
WLCSP Bump
Type
Description or Instruction
Bluetooth/FM I2S
BT_I2S_CLK or BT_PCM_CLK
15
I/O
I2S or PCM clock; can be master (output) or slave (input)
BT_I2S_DI or BT_PCM_IN
23
I
I2S or PCM data input
BT_I2S_DO or BT_PCM_OUT
24
O
I2S or PCM data output
BT_I2S_WS or BT_PCM_SYNC
18
I/O
I2S WS or PCM SYNC; can be master (output) or slave
(input)
Miscellaneous
WL_REG_ON
148
I
Used by PMU to power up or power down the internal
regulators used by the WLAN section. Also, when
deasserted, this pin holds the WLAN section in reset. This
pin has an internal 200 k pull-down resistor that is enabled
by default. It can be disabled through programming.
BT_REG_ON
149
I
Used by PMU to power up or power down the internal
regulators used by the Bluetooth/FM section. Also, when
deasserted, this pin holds the Bluetooth/FM section in reset.
This pin has an internal 200 k pull-down resistor that is
enabled by default. It can be disabled through programming.
WPT_3P3
146
N/A
Not used. Do not connect to this pin.
WPT_1P8
145
N/A
Not used. Do not connect to this pin.
GPIO_0
100
I/O
Programmable GPIO pin. This pin becomes an output pin
when it is used as WLAN_HOST_WAKE/out-of-band signal.
GPIO_1
101
I/O
Programmable GPIO pin
GPIO_2
97
I/O
Programmable GPIO pin
GPIO_3
98
I/O
Programmable GPIO pin
GPIO_4
91
I/O
Programmable GPIO pin
GPIO_5
94
I/O
Programmable GPIO pin
GPIO_6
89
I/O
Programmable GPIO pin
GPIO_7
87
I/O
Programmable GPIO pin
GPIO_8
84
I/O
Programmable GPIO pin
GPIO_9
82
I/O
Programmable GPIO pin
GPIO_10
83
I/O
Programmable GPIO pin
GPIO_11
81
I/O
Programmable GPIO pin
GPIO_12
80
I/O
Programmable GPIO pin
GPIO_13
119
I/O
Programmable GPIO pin
GPIO_14
105
I/O
Programmable GPIO pin
GPIO_15
109
I/O
Programmable GPIO pin
PACKAGEOPTION_0
110
I
VDDIO
PACKAGEOPTION_1
113
I
Ground
PACKAGEOPTION_2
116
I
Ground
JTAG_SEL
117
I
JTAG select. Connect to ground.
Integrated Voltage Regulators
SR_VDDBAT5V
129, 130, 132
I
SR VBAT input power supply
SR_VLX
126, 127, 128
O
CBUCK switching regulator output. See Table 42 on
page 107 for details of the inductor and capacitor required on
this output.
LDO_VDDBAT5V
141, 147
I
LDO VBAT
LDO_VDD1P5
133, 135
I
LNLDO input
VOUT_LNLDO
138
O
Output of low-noise LDO (LNLDO)
VOUT_CLDO
134, 136
O
Output of core LDO
Document No. 002-14797 Rev. *H
Page 84 of 128
CYW4343X
Table 23. WLCSP Signal Descriptions (Cont.)
Signal Name
WLCSP Bump
Type
Description or Instruction
Bluetooth Power Supplies
BT_IFVDD1P2
51
PWR
BT_LNAVDD1P2
54
PWR
Bluetooth IF-block power supply
Bluetooth RF LNA power supply
BT_PAVDD2P5
53
PWR
Bluetooth RF PA power supply
BT_PLLVDD1P2
59
PWR
Bluetooth RF PLL power supply
BT_VCOVDD1P2
57
PWR
Bluetooth RF power supply
BT_VDDC
14, 16, 26, 28, 31,
34
PWR
Bluetooth core power supply
BT_VDDC_ISO_1
9
PWR
Bluetooth core power supply
BT_VDDC_ISO_2
2
PWR
Bluetooth core power supply
Power Supplies
FM_DAC_AVDD
41
PWR
FM_IFDVDD1P2
48
PWR
FM DAC power supply
FM IF power supply
FM_PLLDVDD1P2
43
PWR
FM PLL power supply
FM_RFVDD1P2
45
PWR
FM RF power supply
FM_VCOVDD1P2
44
PWR
FM VCO power supply
PLL_VDDC
152
PWR
Core PLL power supply
SYS_VDDIO
140
I
VDDIO input supply. Connect to VDDIO.
VDDC
86, 93, 95, 107, 114 I
VOUT_3P3
139, 144
O
3.3V output supply. See the reference schematic for details.
VOUT_3P3_SENSE
143
O
Voltage sense pin for LDO 3.3V output
WCC_VDDIO
77, 79, 99, 103,
120, 137
I
VDDIO input supply. Connect to VDDIO.
Core supply for WLAN and BT
WL_VDDM_ISO
150
–
Test pin. Not connected in normal operation.
WL_VDDP_ISO
96
–
Test pin. Not connected in normal operation.
WRF_XTAL_VDD1P2
73
I
XTAL oscillator supply
WRF_PA_VDD3P3
70, 71
I
Power amplifier supply
WRF_PMU_VDD1P35
68
I
LNLDO input supply
Document No. 002-14797 Rev. *H
Page 85 of 128
CYW4343X
Table 23. WLCSP Signal Descriptions (Cont.)
Signal Name
WLCSP Bump
Type
Description or Instruction
Ground
BT_DVSS
50
GND
Bluetooth digital ground
BT_LNAVSS
55
GND
Bluetooth LNA ground
Bluetooth PA ground
BT_PAVSS
35
GND
BT_PLLVSS
56
GND
Bluetooth PLL ground
BT_VCOVSS
58
GND
Bluetooth VCO ground
FM_DAC_AVSS
38
GND
FM DAC analog ground
FM_IFVSS
47
GND
FM IF-block ground
FM_PLLAVSS
39
GND
FM PLL analog ground
FM_RFVSS
46
GND
FM RF ground
FM_VCOVSS
42
GND
FM VCO ground
PLL_VSSC
151
GND
PLL core ground
PMU_AVSS
131
I
Quiet ground
SR_PVSS
123, 124
I
Switcher-power ground
VSSC
21, 25, 27, 29, 30, I
32, 33, 36, 78, 85,
88, 90, 92, 102,
106, 111, 121, 125,
142
Core ground for WLAN and BT
WRF_AFE_GND
60
I
AFE ground
WRF_RX2G_GND
62
I
2.4 GHz internal LNA ground
WRF_GENERAL_GND
64
I
Miscellaneous RF ground
WRF_PA_GND3P3
65, 69
I
2.4 GHz PA ground
WRF_VCO_GND
66
I
VCO/LO generator ground
WRF_XTAL_GND1P2
72
I
XTAL ground
14.9 WLAN GPIO Signals and Strapping Options
The pins listed in Table 24 are sampled at power-on reset (POR) to determine the various operating modes. Sampling occurs a few
milliseconds after an internal POR or deassertion of the external POR. After the POR, each pin assumes the GPIO or alternative
function specified in the signal descriptions table. Each strapping option pin has an internal pull-up (PU) or pull-down (PD) resistor
that determines the default mode. To change the mode, connect an external PU resistor to VDDIO or a PD resistor to ground using
a 10 kΩ resistor or less.
Note: Refer to the reference board schematics for more information.
Table 24. GPIO Functions and Strapping Options
Pin Name
WLBGA Pin #
SDIO_DATA_2
L7
Default
1
Function
WLAN host interface
select
Description
This pin selects the WLAN host interface mode. The
default is SDIO. For gSPI, pull this pin low.
14.10 Chip Debug Options
The chip can be accessed for debugging via the JTAG interface, multiplexed on the SDIO_DATA_0 through SDIO_DATA_3 (and
SDIO_CLK) I/O or the Bluetooth PCM I/O depending on the bootstrap state of GPIO_1 and GPIO_2.
Table 25 shows the debug options of the device.
Table 25. Chip Debug Options
JTAG_SEL
GPIO_2
GPIO_1
Function
SDIO I/O Pad Function
BT PCM I/O Pad
Function
0
0
0
Normal mode
SDIO
BT PCM
0
0
1
JTAG over SDIO
JTAG
BT PCM
Document No. 002-14797 Rev. *H
Page 86 of 128
CYW4343X
Table 25. Chip Debug Options (Cont.)
JTAG_SEL
GPIO_2
GPIO_1
Function
SDIO I/O Pad Function
BT PCM I/O Pad
Function
0
1
0
JTAG over BT PCM
SDIO
JTAG
0
1
1
SWD over GPIO_1/
GPIO_2
SDIO
BT PCM
14.11 I/O States
The following notations are used in Table 26 on page 87:
■
I: Input signal
■
O: Output signal
■
I/O: Input/Output signal
■
PU = Pulled up
■
PD = Pulled down
■
NoPull = Neither pulled up nor pulled down
Table 26. I/O Statesa
Name
I/O Keeperb Active Mode
Power-Downc
Low Power State/Sleep WL_REG_ON = 0
BT_REG_ON = 0
(All Power Present)
Out-of-Reset;
(WL_REG_ON = 1;
BT_REG_ON =
Do Not Care)
Out-of-Reset;
(WL_REG_ON = 1 (WL_REG_ON = 0
BT_REG_ON = 0) BT_REG_ON = 1)
VDDIOs Present
VDDIOs Present
Power Rail
WL_REG_ON
I
N
Input; PD (pull-down can Input; PD (pull-down can Input; PD (of 200K)
be disabled)
be disabled)
Input; PD (200k)
Input; PD (200k)
–
–
BT_REG_ON
I
N
Input; PD (pull down can Input; PD (pull down can Input; PD (of 200K)
be disabled)
be disabled)
Input; PD (200k)
Input; PD (200k)
Input; PD (200k)
–
CLK_REQ
I/O
Y
Open drain or push-pull Open drain or push-pull PD
(programmable). Active (programmable). Active
high
high.
Open drain,
active high.
Open drain,
active high.
Open drain,
active high.
WCC_VDDIO
BT_HOST_
WAKE
I/O
Y
I/O; PU, PD, NoPull
(programmable)
I/O; PU, PD, NoPull
(programmable)
High-Z, NoPull
–
Input, PD
Output, Drive low
WCC_VDDIO
BT_DEV_WAKE I/O
Y
I/O; PU, PD, NoPull
(programmable)
Input; PU, PD, NoPull
(programmable)
High-Z, NoPull
–
Input, PD
Input, PD
WCC_VDDIO
BT_UART_CTS
I
Y
Input; NoPull
Input; NoPull
High-Z, NoPull
–
Input; PU
Input, NoPull
WCC_VDDIO
BT_UART_RTS
O
Y
Output; NoPull
Output; NoPull
High-Z, NoPull
–
Input; PU
Output, NoPull
WCC_VDDIO
BT_UART_RXD
I
Y
Input; PU
Input; NoPull
High-Z, NoPull
–
Input; PU
Input, NoPull
WCC_VDDIO
BT_UART_TXD
O
Y
Output; NoPull
Output; NoPull
High-Z, NoPull
–
Input; PU
Output, NoPull
WCC_VDDIO
SDIO_DATA_0
I/O
N
SDIO MODE -> NoPull
SDIO MODE -> NoPull
SDIO MODE -> NoPull SDIO MODE -> PU
SDIO MODE ->
NoPull
Input; PU
WCC_VDDIO
SDIO_DATA_1
I/O
N
SDIO MODE -> NoPull
SDIO MODE -> NoPull
SDIO MODE -> NoPull SDIO MODE -> PU
SDIO MODE ->
NoPull
Input; PU
WCC_VDDIO
Document No. 002-14797 Rev. *H
Page 87 of 128
CYW4343X
Table 26. I/O Statesa (Cont.)
Out-of-Reset;
(WL_REG_ON = 1;
BT_REG_ON =
Do Not Care)
Out-of-Reset;
(WL_REG_ON = 1 (WL_REG_ON = 0
BT_REG_ON = 0) BT_REG_ON = 1)
VDDIOs Present
VDDIOs Present
Name
I/O Keeperb Active Mode
Power-Downc
Low Power State/Sleep WL_REG_ON = 0
BT_REG_ON = 0
(All Power Present)
SDIO_DATA_2
I/O
N
SDIO MODE -> NoPull
SDIO MODE -> NoPull
SDIO MODE -> NoPull SDIO MODE -> PU
SDIO MODE ->
NoPull
Input; PU
WCC_VDDIO
SDIO_DATA_3
I/O
N
SDIO MODE -> NoPull
SDIO MODE -> NoPull
SDIO MODE -> NoPull SDIO MODE -> PU
SDIO MODE ->
NoPull
Input; PU
WCC_VDDIO
SDIO_CMD
I/O
N
SDIO MODE -> NoPull
SDIO MODE -> NoPull
SDIO MODE -> NoPull SDIO MODE -> PU
SDIO MODE ->
NoPull
Input; PU
WCC_VDDIO
SDIO_CLK
I
N
SDIO MODE -> NoPull
SDIO MODE -> NoPull
SDIO MODE -> NoPull SDIO MODE -> NoPull SDIO MODE ->
NoPull
Input
WCC_VDDIO
BT_PCM_CLK
I/O
Y
Input; NoPulld
Input; NoPulld
High-Z, NoPull
–
Input, PD
Input, PD
WCC_VDDIO
BT_PCM_IN
I/O
Y
Input; NoPulld
Input; NoPulld
High-Z, NoPull
–
Input, PD
Input, PD
WCC_VDDIO
BT_PCM_OUT
Input;
NoPulld
High-Z, NoPull
–
Input, PD
Input, PD
WCC_VDDIO
Input;
NoPulld
High-Z, NoPull
–
Input, PD
Input, PD
WCC_VDDIO
Power Rail
I/O
Y
Input; NoPull
d
BT_PCM_SYNC I/O
Y
Input; NoPull
d
BT_I2S_WS
I/O
Y
Input; NoPulle
Input; NoPulle
High-Z, NoPull
–
Input, PD
Input, PD
WCC_VDDIO
BT_I2S_CLK ]
I/O
Y
Input; NoPulle
Input; NoPulle
High-Z, NoPull
–
Input, PD
Output, Drive low
WCC_VDDIO
BT_I2S_DO [
I/O
Y
Input; NoPulle
Input; NoPulle
High-Z, NoPull
–
Input, PD
Input, PD
WCC_VDDIO
JTAG_SEL
I
Y
PD
PD
High-Z, NoPull
Input, PD
PD
Input, PD
WCC_VDDIO
GPIO_0
I/O
Y
TBD
Active mode
High-Z, NoPullf
Input, SDIO OOB Int,
NoPull
Active mode
Input, NoPull
WCC_VDDIO
GPIO_1
I/O
Y
TBD
Active mode
High-Z, NoPullf
Input, PD
Active mode
Input, Strap, PD
WCC_VDDIO
GPIO_2
I/O
Y
TBD
Active mode
High-Z, NoPullf
Input, GCI GPIO[7],
NoPull
Active mode
Input, Strap, NoPull WCC_VDDIO
GPIO_3
I/O
Y
TBD
Active mode
High-Z, NoPullf
Input, GCI GPIO[0],
PU
Active mode
Input, PU
WCC_VDDIO
GPIO_4
I/O
Y
TBD
Active mode
High-Z, NoPullf
Input, GCI GPIO[1],
PU
Active mode
Input, PU
WCC_VDDIO
GPIO_5
I/O
N
TBD
Active mode
High-Z, NoPullf
Input, GCI GPIO[2],
PU
Active mode
Input, PU
WCC_VDDIO
GPIO_6
I/O
Y
TBD
Active mode
High-Z, NoPullf
Input, GCI GPIO[3],
NoPull
Active mode
Input, NoPull
WCC_VDDIO
GPIO_7
I/O
Y
TBD
Active mode
High-Z, NoPullf
Output, WLAN UART
RTS#, NoPull
Active mode
Output, NoPull, Low WCC_VDDIO
GPIO_8
I/O
Y
TBD
Active mode
High-Z, NoPullf
Input, WLAN UART
CTS#, NoPull
Active mode
Input, NoPull
Document No. 002-14797 Rev. *H
WCC_VDDIO
Page 88 of 128
CYW4343X
Table 26. I/O Statesa (Cont.)
Out-of-Reset;
(WL_REG_ON = 1;
BT_REG_ON =
Do Not Care)
Out-of-Reset;
(WL_REG_ON = 1 (WL_REG_ON = 0
BT_REG_ON = 0) BT_REG_ON = 1)
VDDIOs Present
VDDIOs Present
Power Rail
Input, WLAN UART
RX, NoPull
Active mode
Input, NoPull
WCC_VDDIO
Name
I/O Keeperb Active Mode
Power-Downc
Low Power State/Sleep WL_REG_ON = 0
BT_REG_ON = 0
(All Power Present)
GPIO_9
I/O
Y
TBD
Active mode
High-Z, NoPull
GPIO_10
I/O
Y
TBD
Active mode
High-Z, NoPullf
Output, WLAN UART
TX, NoPull
Active mode
Output, NoPull, Low WCC_VDDIO
GPIO_11
I/O
Y
TBD
Active mode
High-Z, NoPullf
Input, Low, NoPull
Active mode
Input, NoPull
WCC_VDDIO
GPIO_12
I/O
Y
TBD
Active mode
High-Z, NoPullf
Input, GCI GPIO[6],
NoPull
Active mode
Input, NoPull
WCC_VDDIO
GPIO_13
I/O
Y
TBD
Active mode
High-Z, NoPullf
Input, GCI GPIO[7],
NoPull
Active mode
Input, NoPull
WCC_VDDIO
GPIO_14
I/O
Y
TBD
Active mode
High-Z, NoPullf
Input, PD
Active mode
Input, PD
WCC_VDDIO
GPIO_15
I/O
Y
TBD
Active mode
f
Input, PD
Active mode
Input, PD
WCC_VDDIO
High-Z, NoPull
f
a.
PU = pulled up, PD = pulled down.
b.
N = pad has no keeper. Y = pad has a keeper. Keeper is always active except in the power-down state. If there is no keeper, and it is an input and there is NoPull, then the pad should be driven to prevent
leakage due to floating pad, for example, SDIO_CLK.
c.
In the Power-down state (xx_REG_ON = 0): High-Z; NoPull => The pad is disabled because power is not supplied.
d.
Depending on whether the PCM interface is enabled and the configuration is master or slave mode, it can be either an output or input.
e. Depending on whether the I2S interface is enabled and the configuration is master or slave mode, it can be either an output or input.
f.
The GPIO pull states for the active and low-power states are hardware defaults. They can all be subsequently programmed as a pull-up or pull-down.
Document No. 002-14797 Rev. *H
Page 89 of 128
CYW4343X
15. DC Ch aracteristics
Note: Values in this data sheet are design goals and are subject to change based on the results of device characterization.
15.1 Absolute Maximum Ratings
Caution! The absolute maximum ratings in Table 27 indicate levels where permanent damage to the device can occur, even if these
limits are exceeded for only a brief duration. Functional operation is not guaranteed under these conditions. Excluding VBAT,
operation at the absolute maximum conditions for extended periods can adversely affect long-term reliability of the device.
Table 27. Absolute Maximum Ratings
Rating
Symbol
DC supply for VBAT and PA driver supply
Value
VBAT
Unit
V
–0.5 to +6.0a
DC supply voltage for digital I/O
VDDIO
–0.5 to 3.9
V
DC supply voltage for RF switch I/Os
VDDIO_RF
–0.5 to 3.9
V
DC input supply voltage for CLDO and LNLDO
–
–0.5 to 1.575
V
DC supply voltage for RF analog
VDDRF
–0.5 to 1.32
V
VDDC
–0.5 to 1.32
V
Vundershoot
–0.5
V
Vovershoot
VDDIO + 0.5
V
Tj
125
°C
DC supply voltage for core
b
Maximum undershoot voltage for I/O
Maximum overshoot voltage for I/O
b
Maximum junction temperature
a.
Continuous operation at 6.0V is supported.
b.
Duration not to exceed 25% of the duty cycle.
15.2 Environmental Ratings
The environmental ratings are shown in Table 28.
Table 28. Environmental Ratings
Characteristic
Value
Ambient temperature (TA)
–30 to +70°C a
Units
C
Conditions/Comments
Operation
Storage temperature
–40 to +125°C
C
–
Relative humidity
Less than 60
%
Storage
Less than 85
%
Operation
a.
Functionality is guaranteed, but specifications require derating at extreme temperatures (see the specification tables for details).
15.3 Electrostatic Discharge Specifications
Extreme caution must be exercised to prevent electrostatic discharge (ESD) damage. Proper use of wrist and heel grounding straps
to discharge static electricity is required when handling these devices. Always store unused material in its antistatic packaging.
Table 29. ESD Specifications
Pin Type
Symbol
Condition
ESD Rating
Unit
ESD, Handling Reference:
NQY00083, Section 3.4, Group
D9, Table B
ESD_HAND_HBM
Human Body Model Contact Discharge per 1000
JEDEC EID/JESD22-A114
V
Machine Model (MM)
ESD_HAND_MM
Machine Model Contact
V
CDM
ESD_HAND_CDM
Charged Device Model Contact Discharge 300
per JEDEC EIA/JESD22-C101
Document No. 002-14797 Rev. *H
30
V
Page 90 of 128
CYW4343X
15.4 Recommended Operating Conditions and DC Characteristics
Functional operation is not guaranteed outside the limits shown in Table 30, and operation outside these limits for extended periods
can adversely affect long-term reliability of the device.
Table 30. Recommended Operating Conditions and DC Characteristics
Value
Element
Symbol
DC supply voltage for VBAT
VBAT
DC supply voltage for core
DC supply voltage for RF blocks in chip
DC supply voltage for digital I/O
VDD
VDDRF
VDDIO,
VDDIO_SD
VDDIO_RF
TSSI
Vth_POR
DC supply voltage for RF switch I/Os
External TSSI input
Internal POR threshold
Minimum
a
Typical
–
Maximum
b
Unit
V
3.0
1.14
1.14
1.71
1.2
1.2
–
4.8
1.26
1.26
3.63
V
V
V
3.13
0.15
0.4
3.3
–
–
3.46
0.95
0.7
V
V
V
SDIO Interface I/O Pins
For VDDIO_SD = 1.8V:
Input high voltage
Input low voltage
Output high voltage @ 2 mA
Output low voltage @ 2 mA
For VDDIO_SD = 3.3V:
Input high voltage
Input low voltage
Output high voltage @ 2 mA
Output low voltage @ 2 mA
VIH
VIL
VOH
VOL
1.27
–
1.40
–
–
–
–
–
–
0.58
–
0.45
V
V
V
V
VIH
VIL
VOH
VOL
0.625 × VDDIO
–
0.75 × VDDIO
–
–
–
–
–
–
0.25 × VDDIO
–
0.125 ×
VDDIO
V
V
V
V
Other Digital I/O Pins
For VDDIO = 1.8V:
Input high voltage
Input low voltage
Output high voltage @ 2 mA
Output low voltage @ 2 mA
For VDDIO = 3.3V:
Input high voltage
Input low voltage
Output high voltage @ 2 mA
Output low Voltage @ 2 mA
VIH
VIL
VOH
VOL
0.65 × VDDIO
–
VDDIO – 0.45
–
–
–
–
–
–
0.35 × VDDIO
–
0.45
V
V
V
V
VIH
VIL
VOH
VOL
2.00
–
VDDIO – 0.4
–
–
–
–
–
–
0.80
–
0.40
V
V
V
V
–
–
–
–
0.40
5
V
V
pF
RF Switch Control Output Pinsc
For VDDIO_RF = 3.3V:
Output high voltage @ 2 mA
Output low voltage @ 2 mA
Input capacitance
VOH
VOL
CIN
VDDIO – 0.4
–
–
a.
The CYW4343X is functional across this range of voltages. However, optimal RF performance specified in the data sheet is guaranteed only for
3.2V < VBAT < 4.8V.
b.
The maximum continuous voltage is 4.8V. Voltages up to 6.0V for up to 10 seconds, cumulative duration over the lifetime of the device are
allowed. Voltages as high as 5.0V for up to 250 seconds, cumulative duration over the lifetime of the device are allowed.
c.
Programmable 2 mA to 16 mA drive strength. Default is 10 mA.
Document No. 002-14797 Rev. *H
Page 91 of 128
CYW4343X
16. WLAN RF Sp ecifications
The CYW4343X includes an integrated direct conversion radio that supports the 2.4 GHz band. This section describes the RF characteristics of the 2.4 GHz radio.
Note: Values in this data sheet are design goals and may change based on device characterization results.
Unless otherwise stated, the specifications in this section apply when the operating conditions are within the limits specified in
Table 28, “Environmental Ratings,” on page 90 and Table 30, “Recommended Operating Conditions and DC Characteristics,” on
page 91. Functional operation outside these limits is not guaranteed.
Typical values apply for the following conditions:
■
VBAT = 3.6V.
■
Ambient temperature +25°C.
Figure 50. RF Port Location
Chip
Port
C2
TX
Filter
Antenna
Port
10 pF
CYW4343X
C1
L1
RX
4.7 nH
10 pF
Note: All specifications apply at the chip port unless otherwise specified.
16.1 2.4 GHz Band General RF Specifications
Table 31. 2.4 GHz Band General RF Specifications
Item
Condition
Minimum
Typical
Maximum
Unit
TX/RX switch time
Including TX ramp down
–
–
5
µs
RX/TX switch time
Including TX ramp up
–
–
2
µs
16.2 WLAN 2.4 GHz Receiver Performance Specifications
Note: Unless otherwise specified, the specifications in Table 32 are measured at the chip port (for the location of the chip port, see
Figure 50 on page 92).
Table 32. WLAN 2.4 GHz Receiver Performance Specifications
Parameter
Condition/Notes
Minimum
Typical
Maximum
Unit
Frequency range
–
2400
–
2500
MHz
RX sensitivity (8% PER for 1024
octet PSDU) a
1 Mbps DSSS
–97.5
–99.5
–
dBm
2 Mbps DSSS
–93.5
–95.5
–
dBm
5.5 Mbps DSSS
–91.5
–93.5
–
dBm
11 Mbps DSSS
–88.5
–90.5
–
dBm
Document No. 002-14797 Rev. *H
Page 92 of 128
CYW4343X
Table 32. WLAN 2.4 GHz Receiver Performance Specifications (Cont.)
Parameter
RX sensitivity (10% PER for 1000
octet PSDU) at WLAN RF port a
RX sensitivity
(10% PER for 4096 octet PSDU).
Defined for default parameters:
Mixed mode, 800 ns GI.
Condition/Notes
Minimum
Typical
Maximum
Unit
6 Mbps OFDM
–91.5
–93.5
–
dBm
9 Mbps OFDM
–90.5
–92.5
–
dBm
12 Mbps OFDM
–87.5
–89.5
–
dBm
18 Mbps OFDM
–85.5
–87.5
–
dBm
24 Mbps OFDM
–82.5
–84.5
–
dBm
36 Mbps OFDM
–80.5
–82.5
–
dBm
48 Mbps OFDM
–76.5
–78.5
–
dBm
54 Mbps OFDM
–75.5
–77.5
–
dBm
dBm
20 MHz channel spacing for all MCS rates (Mixed mode)
256-QAM, R = 5/6
–67.5
–69.5
–
256-QAM, R = 3/4
–69.5
–71.5
–
dBm
MCS7
–71.5
–73.5
–
dBm
MCS6
–73.5
–75.5
–
dBm
MCS5
–74.5
–76.5
–
dBm
MCS4
–79.5
–81.5
–
dBm
MCS3
–82.5
–84.5
–
dBm
MCS2
–84.5
–86.5
–
dBm
MCS1
–86.5
–88.5
–
dBm
MCS0
–90.5
–92.5
–
dBm
Document No. 002-14797 Rev. *H
Page 93 of 128
CYW4343X
Table 32. WLAN 2.4 GHz Receiver Performance Specifications (Cont.)
Parameter
Blocking level for 3 dB RX
sensitivity degradation (without
external filtering).b
Maximum receive level
@ 2.4 GHz
Condition/Notes
Minimum
–
Typical
–13
Maximum
–
Unit
704–716 MHz
LTE
dBm
777–787 MHz
LTE
–
–13
–
dBm
776–794 MHz
CDMA2000
–
–13.5
–
dBm
815–830 MHz
LTE
–
–12.5
–
dBm
816–824 MHz
CDMA2000
–
–13.5
–
dBm
816–849 MHz
LTE
–
–11.5
–
dBm
824–849 MHz
WCDMA
–
–11.5
–
dBm
824–849 MHz
CDMA2000
–
–12.5
–
dBm
824–849 MHz
LTE
–
–11.5
–
dBm
824–849 MHz
GSM850
–
–8
–
dBm
830–845 MHz
LTE
–
–11.5
–
dBm
832–862 MHz
LTE
–
–11.5
–
dBm
880–915 MHz
WCDMA
–
–10
–
dBm
880–915 MHz
LTE
–
–12
–
dBm
880–915 MHz
E-GSM
–
–9
–
dBm
1710–1755 MHz
WCDMA
–
–13
–
dBm
1710–1755 MHz
LTE
–
–14.5
–
dBm
1710–1755 MHz
CDMA2000
–
–14.5
–
dBm
1710–1785 MHz
WCDMA
–
–13
–
dBm
1710–1785 MHz
LTE
–
–14.5
–
dBm
1710–1785 MHz
GSM1800
–
–12.5
–
dBm
dBm
1850–1910 MHz
GSM1900
–
–11.5
–
1850–1910 MHz
CDMA2000
–
–16
–
dBm
1850–1910 MHz
WCDMA
–
–13.5
–
dBm
1850–1910 MHz
LTE
–
–16
–
dBm
1850–1915 MHz
LTE
–
–17
–
dBm
1920–1980 MHz
WCDMA
–
–17.5
–
dBm
1920–1980 MHz
CDMA2000
–
–19.5
–
dBm
1920–1980 MHz
LTE
–
–19.5
–
dBm
2300–2400 MHz
LTE
–
–44
–
dBm
2500–2570 MHz
LTE
–
–43
–
dBm
2570–2620 MHz
LTE
–
–34
–
dBm
5G
WLAN
–
>–4
–
dBm
@ 1, 2 Mbps (8% PER, 1024 octets)
–6
–
–
dBm
@ 5.5, 11 Mbps (8% PER, 1024 octets)
–12
–
–
dBm
@ 6–54 Mbps (10% PER, 1000 octets)
–15.5
–
–
dBm
35
–
–
dB
Adjacent channel rejection-DSSS. 11 Mbps DSSS
(Difference between interfering and
desired signal [25 MHz apart] at 8%
PER for 1024 octet PSDU with
desired signal level as specified in
Condition/Notes.)
Document No. 002-14797 Rev. *H
–70 dBm
Page 94 of 128
CYW4343X
Table 32. WLAN 2.4 GHz Receiver Performance Specifications (Cont.)
Parameter
Condition/Notes
Adjacent channel rejection-OFDM.
(Difference between interfering and
desired signal (25 MHz apart) at
10% PER for 1000c octet PSDU
with desired signal level as
specified in Condition/Notes.)
RCPI
accuracyd
Return loss
Minimum
Typical
Maximum
Unit
6 Mbps OFDM
–79 dBm
16
–
–
dB
9 Mbps OFDM
–78 dBm
15
–
–
dB
12 Mbps OFDM
–76 dBm
13
–
–
dB
18 Mbps OFDM
–74 dBm
11
–
–
dB
24 Mbps OFDM
–71 dBm
8
–
–
dB
36 Mbps OFDM
–67 dBm
4
–
–
dB
48 Mbps OFDM
–63 dBm
0
–
–
dB
54 Mbps OFDM
–62 dBm
–1
–
–
dB
65 Mbps OFDM
–61 dBm
–2
–
–
dB
Range –98 dBm to –75 dBm
–3
–
3
dB
Range above –75 dBm
–5
–
5
dB
Zo = 50Ω across the dynamic range.
10
–
–
dB
a.
Optimal RF performance, as specified in this data sheet, is guaranteed only for temperatures between –10°C and 55°C.
b.
The cellular standard listed for each band indicates the type of modulation used to generate the interfering signal in that band for the purpose of
this test. It is not intended to indicate any specific usage of each band in any specific country.
c.
For 65 Mbps, the size is 4096.
d.
The minimum and maximum values shown have a 95% confidence level.
16.3 WLAN 2.4 GHz Transmitter Performance Specifications
Note: Unless otherwise specified, the specifications in Table 32 are measured at the chip port (for the location of the chip port, see
Figure 50 on page 92).
Table 33. WLAN 2.4 GHz Transmitter Performance Specifications
Parameter
Frequency range
Condition/Notes
–
Transmitted power in cellular and 776–794 MHz
WLAN 5G bands (at 21 dBm,
869–960 MHz
90% duty cycle, 1 Mbps CCK).a
1450–1495 MHz
Minimum
Typical
Maximum
Unit
–
–
–
MHz
CDMA2000
–
–167.5
–
dBm/Hz
CDMAOne, GSM850
–
–163.5
–
dBm/Hz
DAB
–
–154.5
–
dBm/Hz
GPS
–
–152.5
–
dBm/Hz
1592–1610 MHz
GLONASS
–
–149.5
–
dBm/Hz
1710–1800 MHz
DSC-1800-Uplink
–
–145.5
–
dBm/Hz
1805–1880 MHz
GSM1800
–
–143.5
–
dBm/Hz
1850–1910 MHz
GSM1900
–
–140.5
–
dBm/Hz
1910–1930 MHz
TDSCDMA, LTE
–
–138.5
–
dBm/Hz
1930–1990 MHz
GSM1900, CDMAOne,
WCDMA
–
–139
–
dBm/Hz
1570–1580 MHz
2010–2075 MHz
TDSCDMA
–
–127.5
–
dBm/Hz
2110–2170 MHz
WCDMA
–
–124.5
–
dBm/Hz
2305–2370 MHz
LTE Band 40
–
–104.5
–
dBm/Hz
2370–2400 MHz
LTE Band 40
–
–81.5
–
dBm/Hz
2496–2530 MHz
LTE Band 41
–
–94.5
–
dBm/Hz
2530–2560 MHz
LTE Band 41
–
–120.5
–
dBm/Hz
2570–2690 MHz
LTE Band 41
–
–121.5
–
dBm/Hz
5000–5900 MHz
WLAN 5G
–
–109.5
–
–
Document No. 002-14797 Rev. *H
Page 95 of 128
CYW4343X
Table 33. WLAN 2.4 GHz Transmitter Performance Specifications (Cont.)
Parameter
Condition/Notes
Harmonic level (at 21 dBm with
90% duty cycle, 1 Mbps CCK)
Minimum
Typical
7.2–7.5 GHz
3rd harmonic
–
–23.5
–
dBm/ MHz
9.6–10 GHz
4th harmonic
–
–32.5
–
dBm/ MHz
–
–
dBm
OFDM, QPSK
–26.5
–
Unit
2nd harmonic
TX power at the chip port for the –
highest power level setting at
25°C, VBA = 3.6V, and spectral IEEE 802.11b
(DSSS/CCK)
mask and EVM complianceb, c
OFDM, BPSK
–
Maximum
4.8–5.0 GHz
dBm/ MHz
EVM Does Not Exceed
–9 dB
21
–8 dB
20.5
–
–
dBm
–13 dB
20.5
–
–
dBm
OFDM, 16-QAM
–19 dB
20.5
–
–
dBm
OFDM, 64-QAM
(R = 3/4)
–25 dB
18
–
–
dBm
OFDM, 64-QAM
(R = 5/6)
–27 dB
17.5
–
–
dBm
OFDM, 256-QAM (R = –32 dB
5/6)
15
–
–
dBm
–
9
–
–
dB
Closed loop TX power variation at Across full temperature and voltage range. Applies –
highest power level setting
across 5 to 21 dBm output power range.
–
±1.5
dB
TX power control
dynamic range
Carrier suppression
–
15
–
–
dBc
Gain control step
–
–
0.25
–
dB
Return loss
Zo = 50
dB
Load pull variation for output
power, EVM, and Adjacent
Channel Power Ratio (ACPR)
VSWR = 2:1.
VSWR = 3:1.
4
6
–
EVM degradation
–
3.5
–
dB
Output power variation
–
±2
–
dB
ACPR-compliant power level –
15
–
dBm
EVM degradation
–
4
–
dB
Output power variation
–
±3
–
dB
ACPR-compliant power level –
15
–
dBm
a.
The cellular standards listed indicate only typical usages of that band in some countries. Other standards may also be used within those bands.
b.
TX power for channel 1 and channel 11 is specified separately by nonvolatile memory parameters to ensure band-edge compliance.
c.
Optimal RF performance, as specified in this data sheet, is guaranteed only for temperatures between –10°C and 55°C.
16.4 General Spurious Emissions Specifications
Table 34. General Spurious Emissions Specifications
Parameter
Frequency range
Condition/Notes
–
Minimum
2400
Typical
Maximum
Unit
–
2500
MHz
General Spurious Emissions
TX emissions
RX/standby
emissions
30 MHz < f < 1 GHz
RBW = 100 kHz
–
–99
–96
dBm
1 GHz < f < 12.75 GHz
RBW = 1 MHz
–
–44
–41
dBm
1.8 GHz < f < 1.9 GHz
RBW = 1 MHz
–
–68
–65
dBm
5.15 GHz < f < 5.3 GHz
RBW = 1 MHz
–
–88
–85
dBm
30 MHz < f < 1 GHz
RBW = 100 kHz
–
–99
–96
dBm
1 GHz < f < 12.75 GHz
RBW = 1 MHz
–
–54
–51
dBm
1.8 GHz < f < 1.9 GHz
RBW = 1 MHz
–
–88
–85
dBm
5.15 GHz < f < 5.3 GHz
RBW = 1 MHz
–
–88
–85
dBm
Note: The specifications in this table apply at the chip port.
Document No. 002-14797 Rev. *H
Page 96 of 128
CYW4343X
17. Bluetooth RF Specifications
Note: Values in this data sheet are design goals and are subject to change based on the results of device characterization.
Unless otherwise stated, limit values apply for the conditions specified in Table 28, “Environmental Ratings,” on page 90 and
Table 30, “Recommended Operating Conditions and DC Characteristics,” on page 91. Typical values apply for the following conditions:
■
VBAT = 3.6V.
■
Ambient temperature +25°C.
Note: All Bluetooth specifications apply at the chip port. For the location of the chip port, see Figure 50: “RF Port Location,” on page
92.
Table 35. Bluetooth Receiver RF Specifications
Parameter
Conditions
Minimum
Typical
Maximum
Unit
Note: The specifications in this table are measured at the chip output port unless otherwise specified.
General
Frequency range
–
2402
–
2480
MHz
RX sensitivity
GFSK, 0.1% BER, 1 Mbps
–
–94
–
dBm
dBm
/4–DQPSK, 0.01% BER, 2 Mbps –
–96
–
8–DPSK, 0.01% BER, 3 Mbps
–
–90
–
dBm
Input IP3
–
–16
–
–
dBm
Maximum input at antenna
–
–
–
–20
dBm
Interference Performancea
C/I co-channel
GFSK, 0.1% BER
–
–
11
dB
C/I 1 MHz adjacent channel
GFSK, 0.1% BER
–
–
0.0
dB
C/I 2 MHz adjacent channel
GFSK, 0.1% BER
–
–
–30
dB
C/I  3 MHz adjacent channel
GFSK, 0.1% BER
–
–
–40
dB
C/I image channel
GFSK, 0.1% BER
–
–
–9
dB
C/I 1 MHz adjacent to image channel
GFSK, 0.1% BER
–
–
–20
dB
C/I co-channel
/4–DQPSK, 0.1% BER
–
–
13
dB
C/I 1 MHz adjacent channel
/4–DQPSK, 0.1% BER
–
–
0.0
dB
C/I 2 MHz adjacent channel
/4–DQPSK, 0.1% BER
–
–
–30
dB
C/I  3 MHz adjacent channel
/4–DQPSK, 0.1% BER
–
–
–40
dB
C/I image channel
/4–DQPSK, 0.1% BER
–
–
–7
dB
C/I 1 MHz adjacent to image channel
/4–DQPSK, 0.1% BER
–
–
–20
dB
C/I co-channel
8–DPSK, 0.1% BER
–
–
21
dB
C/I 1 MHz adjacent channel
8–DPSK, 0.1% BER
–
–
5.0
dB
C/I 2 MHz adjacent channel
8–DPSK, 0.1% BER
–
–
–25
dB
C/I  3 MHz adjacent channel
8–DPSK, 0.1% BER
–
–
–33
dB
C/I Image channel
8–DPSK, 0.1% BER
–
–
0.0
dB
C/I 1 MHz adjacent to image channel
8–DPSK, 0.1% BER
–
–
–13
dB
Out-of-Band Blocking Performance (CW)
30–2000 MHz
0.1% BER
–
–10.0
–
dBm
2000–2399 MHz
0.1% BER
–
–27
–
dBm
2498–3000 MHz
0.1% BER
–
–27
–
dBm
3000 MHz–12.75 GHz
0.1% BER
–
–10.0
–
dBm
Document No. 002-14797 Rev. *H
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Table 35. Bluetooth Receiver RF Specifications (Cont.)
Parameter
Conditions
Minimum
Typical
Maximum
Unit
Out-of-Band Blocking Performance, Modulated Interferer (LTE)
GFSK (1 Mbps)
2310 MHz
LTE band40 TDD 20M BW
–
–20
–
dBm
2330 MHz
LTE band40 TDD 20M BW
–
–19
–
dBm
2350 MHz
LTE band40 TDD 20M BW
–
–20
–
dBm
2370 MHz
LTE band40 TDD 20M BW
–
–24
–
dBm
2510 MHz
LTE band7 FDD 20M BW
–
–24
–
dBm
2530 MHz
LTE band7 FDD 20M BW
–
–21
–
dBm
2550 MHz
LTE band7 FDD 20M BW
–
–21
–
dBm
2570 MHz
LTE band7 FDD 20M BW
–
–20
–
dBm
2310 MHz
LTE band40 TDD 20M BW
–
–20
–
dBm
2330 MHz
LTE band40 TDD 20M BW
–
–19
–
dBm
2350 MHz
LTE band40 TDD 20M BW
–
–20
–
dBm
 /4 DPSK (2 Mbps)
2370 MHz
LTE band40 TDD 20M BW
–
–24
–
dBm
2510 MHz
LTE band7 FDD 20M BW
–
–24
–
dBm
2530 MHz
LTE band7 FDD 20M BW
–
–20
–
dBm
2550 MHz
LTE band7 FDD 20M BW
–
–20
–
dBm
2570 MHz
LTE band7 FDD 20M BW
–
–20
–
dBm
8DPSK (3 Mbps)
2310 MHz
LTE band40 TDD 20M BW
–
–20
–
dBm
2330 MHz
LTE band40 TDD 20M BW
–
–19
–
dBm
2350 MHz
LTE band40 TDD 20M BW
–
–20
–
dBm
2370 MHz
LTE band40 TDD 20M BW
–
–24
–
dBm
2510 MHz
LTE band7 FDD 20M BW
–
–24
–
dBm
2530 MHz
LTE band7 FDD 20M BW
–
–21
–
dBm
2550 MHz
LTE band7 FDD 20M BW
–
–20
–
dBm
2570 MHz
LTE band7 FDD 20M BW
–
–20
–
dBm
Out-of-Band Blocking Performance, Modulated Interferer (Non-LTE)
GFSK (1 Mbps)a
698–716 MHz
WCDMA
–
–12
–
dBm
776–849 MHz
WCDMA
–
–12
–
dBm
824–849 MHz
GSM850
–
–12
–
dBm
824–849 MHz
WCDMA
–
–11
–
dBm
880–915 MHz
E-GSM
–
–11
–
dBm
880–915 MHz
WCDMA
–
–16
–
dBm
1710–1785 MHz
GSM1800
–
–15
–
dBm
1710–1785 MHz
WCDMA
–
–18
–
dBm
1850–1910 MHz
GSM1900
–
–20
–
dBm
Document No. 002-14797 Rev. *H
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CYW4343X
Table 35. Bluetooth Receiver RF Specifications (Cont.)
Parameter
Conditions
Minimum
–
Typical
1880–1920 MHz
TD-SCDMA
–
–18
–
dBm
1920–1980 MHz
WCDMA
–
–18
–
dBm
2010–2025 MHz
TD–SCDMA
–
–18
–
dBm
2500–2570 MHz
WCDMA
–
–21
–
dBm
698–716 MHz
WCDMA
–
–8
–
dBm
776–794 MHz
WCDMA
–
–8
–
dBm
824–849 MHz
GSM850
–
–9
–
dBm
824–849 MHz
WCDMA
–
–9
–
dBm
880–915 MHz
E-GSM
–
–8
–
dBm
880–915 MHz
WCDMA
–
–8
–
dBm
1710–1785 MHz
GSM1800
–
–14
–
dBm
1710–1785 MHz
WCDMA
–
–14
–
dBm
1850–1910 MHz
GSM1900
–
–15
–
dBm
1850–1910 MHz
WCDMA
–
–14
–
dBm
1880–1920 MHz
TD-SCDMA
–
–16
–
dBm
1920–1980 MHz
WCDMA
–
–15
–
dBm
2010–2025 MHz
TD-SCDMA
–
–17
–
dBm
2500–2570 MHz
WCDMA
–
–21
–
dBm
dBm
8DPSK (3
–
Unit
WCDMA
 /4 DPSK (2 Mbps)a
–17
Maximum
1850–1910 MHz
dBm
Mbps)a
698–716 MHz
WCDMA
–
–11
–
776–794 MHz
WCDMA
–
–11
–
dBm
824–849 MHz
GSM850
–
–11
–
dBm
824–849 MHz
WCDMA
–
–12
–
dBm
880–915 MHz
E-GSM
–
–11
–
dBm
880–915 MHz
WCDMA
–
–11
–
dBm
1710–1785 MHz
GSM1800
–
–16
–
dBm
1710–1785 MHz
WCDMA
–
–15
–
dBm
1850–1910 MHz
GSM1900
–
–17
–
dBm
1850–1910 MHz
WCDMA
–
–17
–
dBm
1880–1920 MHz
TD-SCDMA
–
–17
–
dBm
1920–1980 MHz
WCDMA
–
–17
–
dBm
2010–2025 MHz
TD-SCDMA
–
–18
–
dBm
2500–2570 MHz
WCDMA
–
–21
–
dBm
–90.0
–80.0
dBm
–95
–62
dBm
RX LO Leakage
2.4 GHz band
–
–
Spurious Emissions
30 MHz–1 GHz
–
1–12.75 GHz
–
–70
–47
dBm
869–894 MHz
–
–147
–
dBm/Hz
925–960 MHz
–
–147
–
dBm/Hz
1805–1880 MHz
–
–147
–
dBm/Hz
1930–1990 MHz
–
–147
–
dBm/Hz
Document No. 002-14797 Rev. *H
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CYW4343X
Table 35. Bluetooth Receiver RF Specifications (Cont.)
Parameter
Conditions
2110–2170 MHz
a.
Minimum
–
Typical
–147
Maximum
–
Unit
dBm/Hz
The Bluetooth reference level for the required signal at the Bluetooth chip port is 3 dB higher than the typical sensitivity level.
Table 36. LTE Specifications for Spurious Emissions
Parameter
Conditions
Typical
Unit
2500–2570 MHz
Band 7
–147
dBm/Hz
2300–2400 MHz
Band 40
–147
dBm/Hz
2570–2620 MHz
Band 38
–147
dBm/Hz
2545–2575 MHz
XGP Band
–147
dBm/Hz
Document No. 002-14797 Rev. *H
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CYW4343X
Table 37. Bluetooth Transmitter RF Specificationsa
Parameter
Conditions
Minimum
Typical
Maximum
Unit
General
Frequency range
2402
–
2480
Basic rate (GFSK) TX power at Bluetooth
–
12.0
–
dBm
QPSK TX power at Bluetooth
–
8.0
–
dBm
–
8.0
–
dBm
2
4
8
dB
0.93
1
MHz
8PSK TX power at Bluetooth
Power control step
–
MHz
GFSK In-Band Spurious Emissions
–20 dBc BW
–
–
EDR In-Band Spurious Emissions
|M – N|  2.5 MHzb
M – N = the frequency range for which –
the spurious emission is measured
relative to the transmit center frequency. –
–
30 MHz to 1 GHz
–
–
–
–36.0 c,d
dBm
1 GHz to 12.75 GHz
–
–
–
–30.0 d,e,f
dBm
1.0 MHz < |M – N| < 1.5 MHz
1.5 MHz < |M – N| < 2.5 MHz
–38
–26.0
dBc
–31
–20.0
dBm
–43
–40.0
dBm
Out-of-Band Spurious Emissions
1.8 GHz to 1.9 GHz
–
–
–
–47.0
dBm
5.15 GHz to 5.3 GHz
–
–
–
–47.0
dBm
Spurious emissions
–
–103
–
dBm
–147
–
dBm/Hz
GPS Band Spurious Emissions
–
Out-of-Band Noise Floorg
65–108 MHz
FM RX
–
776–794 MHz
CDMA2000
–
–146
–
dBm/Hz
869–960 MHz
cdmaOne, GSM850
–
–146
–
dBm/Hz
925–960 MHz
E-GSM
–
–146
–
dBm/Hz
1570–1580 MHz
GPS
–
–146
–
dBm/Hz
1805–1880 MHz
GSM1800
–
–144
–
dBm/Hz
1930–1990 MHz
GSM1900, cdmaOne, WCDMA
–
–143
–
dBm/Hz
2110–2170 MHz
WCDMA
–
–137
–
dBm/Hz
a.
Unless otherwise specified, the specifications in this table apply at the chip output port, and output power specifications are with the temperature
correction algorithm and TSSI enabled.
b.
Typically measured at an offset of ±3 MHz.
c.
The maximum value represents the value required for Bluetooth qualification as defined in the v4.1 specification.
d.
The spurious emissions during Idle mode are the same as specified in Table 37 on page 101.
e.
Specified at the Bluetooth antenna port.
f.
Meets this specification using a front-end band-pass filter.
g.
Transmitted power in cellular and FM bands at the Bluetooth antenna port. See Figure 50 on page 92 for location of the port.
Table 38. LTE Specifications for Out-of-Band Noise Floor
Parameter
Conditions
Typical
Unit
2500–2570 MHz
Band 7
–130
dBm/Hz
2300–2400 MHz
Band 40
–130
dBm/Hz
2570–2620 MHz
Band 38
–130
dBm/Hz
Document No. 002-14797 Rev. *H
Page 101 of 128
CYW4343X
Table 38. LTE Specifications for Out-of-Band Noise Floor (Cont.)
Parameter
Conditions
2545–2575 MHz
Typical
XGP Band
–130
Unit
dBm/Hz
Table 39. Local Oscillator Performance
Parameter
Minimum
Typical
Maximum
Unit
LO Performance
Lock time
–
72
–
s
Initial carrier frequency tolerance
–
±25
±75
kHz
Frequency Drift
DH1 packet
–
±8
±25
kHz
DH3 packet
–
±8
±40
kHz
DH5 packet
–
±8
±40
kHz
Drift rate
–
5
20
kHz/50 µs
Frequency Deviation
00001111 sequence in payloada
140
155
175
kHz
payloadb
115
140
–
kHz
–
1
–
MHz
10101010 sequence in
Channel spacing
a. This pattern represents an average deviation in payload.
b. Pattern represents the maximum deviation in payload for 99.9% of all frequency deviations.
Table 40. BLE RF Specifications
Parameter
Frequency range
Conditions
–
Minimum
2402
Typical
–
Maximum
2480
Unit
MHz
a
GFSK, 0.1% BER, 1 Mbps
–
–97
–
dBm
b
–
–
8.5
–
dBm
–
225
255
275
kHz
–
99.9
–
–
%
–
0.8
0.95
–
%
RX sense
TX power
Mod Char: delta f1 average
Mod Char: delta f2 max
Mod Char: ratio
c
a.
The Bluetooth tester is set so that Dirty TX is on.
b.
BLE TX power can be increased to compensate for front-end losses such as BPF, diplexer, switch, etc.). The output is capped at 12 dBm. The
BLE TX power at the antenna port cannot exceed the 10 dBm specification limit.
c.
At least 99.9% of all delta F2 max. frequency values recorded over 10 packets must be greater than 185 kHz.
Document No. 002-14797 Rev. *H
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18. FM Receiver Sp ecifications
Note: Values in this data sheet are design goals and are subject to change based on the results of device characterization.
Unless otherwise stated, limit values apply for the conditions specified inTable 28, “Environmental Ratings,” on page 90 and
Table 30, “Recommended Operating Conditions and DC Characteristics,” on page 91. Typical values apply for the following conditions:
■
VBAT = 3.6V.
■
Ambient temperature +25°C.
Table 41. FM Receiver Specifications
Conditionsa
Parameter
Minimum
Typical
Maximum
Units
RF Parameters
b
Operating frequency
Sensitivity
c
Receiver adjacent channel
selectivityc,d
Frequencies inclusive
65
–
108
MHz
FM only,
SNR ≥ 26 dB
–
1
–
dBµV EMF
–
1.1
–
µV EMF
–
–5
–
dBµV
Measured for 30 dB SNR at audio output.
Signal of interest: 23 dBµV EMF (14.1 µV EMF).
At ±200 kHz.
–
51
–
dB
At ±400 kHz.
–
62
–
dB
45
53
–
dB
Intermediate signal-plusVin = 20 dBµV (10 µV EMF).
noise to noise ratio (S + N)/
N, stereoc
Intermodulation
performancec,d
–
Blocker level increased until desired at
30 dB SNR.
Wanted signal: 33 dBµV EMF (45 µV EMF)
Modulated interferer: At fWanted + 400 kHz and + 4 MHz.
CW interferer: At fWanted + 800 kHz and + 8 MHz.
55
–
dBc
AM suppression, monoc
Vin = 23 dBµV EMF (14.1 µV EMF).
AM at 400 Hz with m = 0.3.
No A-weighted or any other filtering applied.
40
–
–
dB
–
17
–
dBµV EMF
RDS
RDS sensitivitye,f
RDS deviation = 1.2 kHz.
RDS deviation = 2 kHz.
RDS selectivityf
–
7.1
–
µV EMF
–
11
–
dBµV
–
13
–
dBµV EMF
–
4.4
–
µV EMF
–
7
–
dBµV
±200 kHz
–
49
–
dB
±300 kHz
–
52
–
dB
±400 kHz
–
52
–
dB
Wanted Signal: 33 dBµV EMF (45 µV EMF),
2 kHz RDS deviation.
Interferer: ∆f = 40 kHz, fmod = 1 kHz.
RF Input
RF input impedance
–
1.5
–
–
kΩ
Antenna tuning cap
–
2.5
–
30
pF
Document No. 002-14797 Rev. *H
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CYW4343X
Table 41. FM Receiver Specifications (Cont.)
Conditionsa
Parameter
Minimum
Maximum input
levelc
SNR > 26 dB.
RF conducted emissions
Local oscillator breakthrough measured on the
reference port.
869–894 MHz, 925–960 MHz,
1805–1880 MHz, and 1930–1990 MHz. GPS.
Typical
Maximum
Units
–
–
113
dBµV EMF
–
–
446
mV EMF
–
–
107
dBµV
–
–
–55
dBm
–
–
–90
dBm
–
7
–
dBm
–
0
–
dBm
GSM DCS 1800, PCS 1900 (standard, edge);
BW = 0.2 MHz.
1710–1785 MHz,
1850–1910 MHz.
–
12
–
dBm
WCDMA: II (I), III (IV,X); BW = 5 MHz.
1710–1785 MHz (1710–1755 MHz,
1710–1770 MHz),
1850–1980 MHz (1920–1980 MHz).
–
12
–
dBm
WCDMA: V (VI), VIII, XII, XIII, XIV;
BW = 5 MHz.
824–849 MHz (830–840 MHz),
880–915 MHz.
–
5
–
dBm
CDMA2000, CDMA One; BW = 1.25 MHz.
776–794 MHz,
824–849 MHz,
887–925 MHz.
–
0
–
dBm
CDMA2000, CDMA One; BW= 1.25 MHz.
1750–1780 MHz,
1850–1910 MHz,
1920–1980 MHz.
–
12
–
dBm
Bluetooth; BW = 1 MHz.
2402–2480 MHz.
–
11
–
dBm
LTE, Band 38, Band 40, XGP Band
–
11
–
dBm
WLAN-g/b; BW = 20 MHz.
2400–2483.5 MHz.
–
11
–
dBm
WLAN-a; BW = 20 MHz.
4915–5825 MHz.
–
6
–
dBm
RF blocking levels at the FM GSM850, E-GSM (standard); BW = 0.2 MHz.
antenna input with a 40 dB 824–849 MHz,
SNR (assumes a 50Ω input 880–915 MHz.
and excludes spurs)
GSM 850, E-GSM (edge); BW = 0.2 MHz.
824–849 MHz,
880–915 MHz.
Tuning
Frequency step
–
10
–
–
kHz
Settling time
Single frequency switch in any direction
to a frequency within the 88–108 MHz or
76–90 MHz bands. Time measured to within 5 kHz of
the final frequency.
–
150
–
µs
Search time
–
Total time for an automatic search to
sweep from 88–108 MHz or 76–90 MHz
(or in the reverse direction) assuming no channels are
found.
–
8
sec
Document No. 002-14797 Rev. *H
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CYW4343X
Table 41. FM Receiver Specifications (Cont.)
Conditionsa
Parameter
Minimum
Typical
Maximum
Units
General Audio
–
–14.5
–
–12.5
dBFS
Maximum audio output
levelh
–
–
–
0
dBFS
DAC audio output level
Conditions:
Vin = 66 dBµV EMF (2 mV EMF),
∆f = 22.5 kHz, fmod = 1 kHz,
∆f Pilot = 6.75 kHz
72
–
88
mV RMS
–
333
–
mV RMS
–1
–
1
dB
Audio output
levelg
Maximum DAC audio output –
levelh
Audio DAC output level
differencei
–
Left and right AC mute
FM input signal fully muted with DAC enabled
60
–
–
dB
Left and right hard mute
FM input signal fully muted with DAC disabled
80
–
–
dB
Soft mute attenuation and
start level
Muting is performed dynamically, proportional to the desired FM input signal C/N. The muting characteristic
is fully programmable. See Audio Features on page 57.
Maximum signal plus noise- –
to-noise ratio
(S + N)/N, monoi
–
69
–
dB
Maximum signal plus noise- –
to-noise ratio (S + N)/N,
stereog
–
64
–
dB
Total harmonic distortion,
mono
Vin = 66 dBµV EMF(2 mV EMF):
–
–
–
–
∆f = 75 kHz, fmod = 400 Hz.
–
–
0.8
%
∆f = 75 kHz, fmod = 1 kHz.
–
–
0.8
%
∆f = 75 kHz, fmod = 3 kHz.
–
–
0.8
%
∆f = 100 kHz, fmod = 1 kHz.
–
–
1.0
%
Total harmonic distortion,
stereo
Vin = 66 dBµV EMF (2 mV EMF),
∆f = 67.5 kHz, fmod = 1 kHz,
∆f pilot = 6.75 kHz, L = R
–
–
1.5
%
Audio spurious productsi
Range from 300 Hz to 15 kHz
with respect to a 1 kHz tone.
–
–
–60
dBc
Audio bandwidth, upper (–
3 dB point)
Vin = 66 dBµV EMF (2 mV EMF)
∆f = 8 kHz, for 50 µs
15
–
–
kHz
–
–
20
Hz
Audio bandwidth, lower (–
3 dB point)
Audio in-band ripple
100 Hz to 13 kHz,
Vin = 66 dBµV EMF (2 mV EMF),
∆f = 8 kHz, for 50 µs.
–0.5
–
0.5
dB
Deemphasis time constant
tolerance
With respect to 50 and 75 µs.
–
–
±5
%
RSSI range
With 1 dB resolution and ±5 dB accuracy
at room temperature.
3
–
83
dBµV EMF
1.41
–
1.41E+4
µV EMF
–3
–
77
dBµV
–
44
–
dB
Stereo Decoder
Stereo channel separation
Forced Stereo mode
Vin = 66 dBµV EMF (2 mV EMF),
∆f = 67.5 kHz, fmod = 1 kHz,
∆f Pilot = 6.75 kHz,
R = 0, L = 1
Document No. 002-14797 Rev. *H
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CYW4343X
Table 41. FM Receiver Specifications (Cont.)
Conditionsa
Parameter
Minimum
Typical
Maximum
Units
Mono stereo blend and
switching
Dynamically proportional to the desired FM input signal C/N. The blending and switching characteristics are
fully programmable. See Audio Features on page 57.
Pilot suppression
Vin = 66 dBµV EMF (2 mV EMF),
∆f = 75 kHz, fmod = 1 kHz.
46
–
–
dB
Pause Detection
Audio level at which
a pause is detected
Relative to 1-kHz tone, ∆f = 22.5 kHz.
–
–
–
–
4 values in 3 dB steps
–21
–
–12
dB
Audio pause
duration
4 values
20
–
40
ms
a.
The following conditions are applied to all relevant tests unless otherwise indicated: Preemphasis and deemphasis of 50 µs, R = L for mono,
BAF = 300 Hz to 15 kHz, A-weighted filtering applied.
b.
Contact your Broadcom representative for applications operating between 65–76 MHz.
c.
Signal of interest: ∆f = 22.5 kHz, fmod = 1 kHz.
d.
Interferer: ∆f = 22.5 kHz, fmod = 1 kHz.
e.
RDS sensitivity numbers are for 87.5–108 MHz only.
f.
Vin = ∆f = 32 kHz, fmod = 1 kHz, ∆f pilot = 7.5 kHz, and with an interferer for 95% of blocks decoded with no errors after correction, over a
sample of 5000 blocks.
g.
Vin = 66 dBµV EMF (2 mV EMF), ∆f = 22.5 kHz, fmod = 1 kHz, ∆f pilot = 6.75 kHz.
h.
Vin = 66 dBµV EMF (2 mV EMF), ∆f = 100 kHz, fmod = 1 kHz, ∆f pilot = 6.75 kHz.
i.
Vin = 66 dBµV EMF (2 mV EMF), ∆f = 22.5 kHz, fmod = 1 kHz.
Document No. 002-14797 Rev. *H
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CYW4343X
19. Internal Regulator Electrical Specificatio ns
Note: Values in this data sheet are design goals and are subject to change based on device characterization results.
Functional operation is not guaranteed outside of the specification limits provided in this section.
19.1 Core Buck Switching Regulator
Table 42. Core Buck Switching Regulator (CBUCK) Specifications
Specification
Notes
Min.
Typ.
Max.
Units
Input supply voltage (DC)
DC voltage range inclusive of disturbances.
2.4
3.6
4.8a
V
PWM mode switching
frequency
CCM, load > 100 mA VBAT = 3.6V.
–
4
–
MHz
PWM output current
–
–
–
370
mA
Output current limit
–
–
1400
–
mA
Output voltage range
Programmable, 30 mV steps.
Default = 1.35V.
1.2
1.35
1.5
V
PWM output voltage
DC accuracy
Includes load and line regulation.
Forced PWM mode.
–4
–
4
%
PWM ripple voltage, static
Measure with 20 MHz bandwidth limit.
Static load, max. ripple based on VBAT = 3.6V,
Vout = 1.35V,
Fsw = 4 MHz, 2.2 μH inductor L > 1.05 μH, Cap +
Board total-ESR < 20 mΩ,
Cout > 1.9 μF, ESL<200 pH
–
7
20
mVpp
PWM mode peak efficiency
Peak efficiency at 200 mA load, inductor DCR = 200 –
mΩ, VBAT = 3.6V, VOUT = 1.35V
85
–
%
PFM mode efficiency
10 mA load current, inductor DCR = 200 mΩ, VBAT = –
3.6V, VOUT = 1.35V
77
–
%
Start-up time from
power down
VDDIO already ON and steady.
Time from REG_ON rising edge to CLDO reaching
1.2V
–
400
500
µs
External inductor
0603 size, 2.2 μH ±20%,
DCR = 0.2Ω ± 25%
–
2.2
–
µH
External output capacitor
Ceramic, X5R, 0402,
ESR <30 mΩ at 4 MHz, 4.7 μF ±20%, 10V
2.0b
4.7
10c
µF
External input capacitor
For SR_VDDBATP5V pin,
ceramic, X5R, 0603,
ESR < 30 mΩ at 4 MHz, ±4.7 μF ±20%, 10V
0.67b
4.7
–
µF
Input supply voltage ramp-up time
0 to 4.3V
40
–
–
µs
a.
The maximum continuous voltage is 4.8V. Voltages up to 6.0V for up to 10 seconds, cumulative duration, over the lifetime of the device are
allowed. Voltages as high as 5.0V for up to 250 seconds, cumulative duration, over the lifetime of the device are allowed.
b.
Minimum capacitor value refers to the residual capacitor value after taking into account the part-to-part tolerance, DC-bias, temperature, and
aging.
c.
Total capacitance includes those connected at the far end of the active load.
19.2 3.3V LDO (LDO3P3)
Table 43. LDO3P3 Specifications
Specification
Input supply voltage, Vin
Notes
Min.
Typ.
Max.
Units
3.1
3.6
4.8
V
Output current
Nominal output voltage, Vo
Min. = Vo + 0.2V = 3.5V dropout voltage
requirement must be met under maximum load
for performance specifications.
–
Default = 3.3V.
0.001
–
–
3.3
450
–
mA
V
Dropout voltage
At max. load.
–
–
200
mV
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CYW4343X
Table 43. LDO3P3 Specifications (Cont.)
Specification
Notes
Min.
Typ.
Max.
Units
Output voltage DC accuracy
Quiescent current
Line regulation
Includes line/load regulation.
No load
Vin from (Vo + 0.2V) to 4.8V, max. load
–5
–
–
–
66
–
+5
85
3.5
%
µA
mV/V
Load regulation
PSRR
load from 1 mA to 450 mA
Vin ≥ Vo + 0.2V,
Vo = 3.3V, Co = 4.7 µF,
Max. load, 100 Hz to 100 kHz
Chip already powered up.
Ceramic, X5R, 0402,
(ESR: 5 mΩ–240 mΩ), ± 10%, 10V
For SR_VDDBATA5V pin (shared with band gap)
Ceramic, X5R, 0402,
(ESR: 30m-200 mΩ), ± 10%, 10V.
Not needed if sharing VBAT capacitor 4.7 µF with
SR_VDDBATP5V.
–
20
–
–
0.3
–
mV/mA
dB
1.0
160
4.7
250
5.64
µs
µF
–
4.7
–
µF
LDO turn-on time
External output capacitor, Co
External input capacitor
–
b
a.
The maximum continuous voltage is 4.8V. Voltages up to 6.0V for up to 10 seconds, cumulative duration, over the lifetime of the device are
allowed. Voltages as high as 5.0V for up to 250 seconds, cumulative duration, over the lifetime of the device are allowed.
b.
Minimum capacitor value refers to the residual capacitor value after taking into account the part-to-part tolerance, DC-bias, temperature, and
aging.
19.3 CLDO
Table 44. CLDO Specifications
Specification
Notes
Min.
Typ.
Max.
Units
Input supply voltage, Vin
Min. = 1.2 + 0.15V = 1.35V dropout voltage requirement 1.3
must be met under maximum load.
1.35
1.5
V
Output current
–
0.2
–
200
mA
Output voltage, Vo
Programmable in 10 mV steps.
Default = 1.2.V
0.95
1.2
1.26
V
Dropout voltage
At max. load
–
–
150
mV
Output voltage DC accuracy
Includes line/load regulation
–4
–
+4
%
Quiescent current
No load
–
13
–
µA
200 mA load
–
1.24
–
mA
Vin from (Vo + 0.15V) to 1.5V,
maximum load
–
–
5
mV/V
Line regulation
Load regulation
Load from 1 mA to 300 mA
–
0.02
0.05
mV/mA
Leakage current
Power down
–
5
20
µA
Bypass mode
–
1
3
µA
PSRR
@1 kHz, Vin ≥ 1.35V, Co = 4.7 µF
20
–
–
dB
Start-up time of PMU
VDDIO up and steady. Time from the REG_ON rising
edge to the CLDO
reaching 1.2V.
–
–
700
µs
LDO turn-on time
LDO turn-on time when rest of the
chip is up.
–
140
180
µs
External output capacitor, Co
Total ESR: 5 mΩ–240 mΩ
1.1a
2.2
–
µF
External input capacitor
Only use an external input capacitor
at the VDD_LDO pin if it is not supplied
from CBUCK output.
–
1
2.2
µF
a.
Minimum capacitor value refers to the residual capacitor value after taking into account the part-to-part tolerance, DC-bias, temperature, and
aging.
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19.4 LNLDO
Table 45. LNLDO Specifications
Specification
Notes
Min.
Typ.
Max.
Units
Input supply voltage, Vin
1.3
Min. VIN = VO + 0.15V = 1.35V
(where VO = 1.2V) dropout voltage requirement must be
met under maximum load.
1.35
1.5
V
Output current
–
0.1
–
150
mA
Output voltage, Vo
Programmable in 25 mV steps.
Default = 1.2V
1.1
1.2
1.275
V
Dropout voltage
At maximum load
–
–
150
mV
Output voltage DC accuracy
Includes line/load regulation
–4
–
+4
%
Quiescent current
No load
–
10
12
µA
Max. load
–
970
990
µA
Line regulation
Vin from (Vo + 0.15V) to 1.5V,
200 mA load
–
–
5
mV/V
Load regulation
Load from 1 mA to 200 mA:
Vin ≥ (Vo + 0.12V)
–
0.025
0.045
mV/mA
Leakage current
Power-down, junction temp. = 85°C
–
5
20
µA
Output noise
@30 kHz, 60–150 mA load Co = 2.2 µF
@100 kHz, 60–150 mA load Co = 2.2 µF
–
–
60
35
–nV/
PSRR
@1 kHz, Vin ≥ (Vo + 0.15V), Co = 4.7 µF
20
–
–
dB
LDO turn-on time
LDO turn-on time when rest of chip is up
–
External output capacitor, Co
Total ESR (trace/capacitor):
5 mΩ–240 mΩ
External input capacitor
Only use an external input capacitor at the VDD_LDO –
pin if it is not supplied from CBUCK output.
Total ESR (trace/capacitor): 30 mΩ–200 mΩ
a.
a
0.5
140
180
µs
2.2
4.7
µF
1
2.2
µF
Hz
Minimum capacitor value refers to the residual capacitor value after taking into account the part-to-part tolerance, DC-bias, temperature, and
aging.
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CYW4343X
20. System Power Con sumption
Note: The values in this data sheet are design goals and are subject to change based on device characterization.Unless otherwise
stated, these values apply for the conditions specified in Table 30, “Recommended Operating Conditions and DC Characteristics,” on
page 91.
20.1 WLAN Current Consumption
Table 46 shows typical currents consumed by the CYW4343X’s WLAN section. All values shown are with the Bluetooth core in Reset
mode with Bluetooth and FM off.
20.1.1 2.4 GHz Mode
Table 46. 2.4 GHz Mode WLAN Power Consumption
VBAT = 3.6V, VDDIO = 1.8V, TA 25°C
Mode
Rate
VBAT (mA)
Vio (µA)
Sleep Modes
Leakage (OFF)
N/A
0.0035
0.08
N/A
0.0058
80
Rate 1
0.0058
80
IEEE Power Save PM1 DTIM1 (Avg.) c
Rate 1
1.05
74
IEEE Power Save PM1 DTIM3 (Avg.) d
Rate 1
0.35
86
IEEE Power Save PM2 DTIM1 (Avg.)
c
Rate 1
1.05
74
IEEE Power Save PM2 DTIM3 (Avg.)
d
Rate 1
0.35
86
N/A
37
12
Rate 1
39
12
Sleep (idle, unassociated)
a
Sleep (idle, associated, inter-beacons)
b
Active Modes
Rx Listen Mode e
Rx Active (at –50dBm RSSI)
Tx
f
f
Rate 11
40
12
Rate 54
40
12
Rate MCS7
41
12
Rate 1 @ 20 dBm
320
15
Rate 11 @ 18 dBm
290
15
Rate 54 @ 15 dBm
260
15
Rate MCS7 @ 15 dBm
260
15
a.
Device is initialized in Sleep mode, but not associated.
b.
Device is associated, and then enters Power Save mode (idle between beacons).
c.
Beacon interval = 100 ms; beacon duration = 1 ms @ 1 Mbps (Integrated Sleep + wakeup + beacon).
d.
Beacon interval = 300 ms; beacon duration = 1 ms @ 1 Mbps (Integrated Sleep + wakeup + beacon).
e.
Carrier sense (CCA) when no carrier present.
f.
Tx output power is measured on the chip-out side; duty cycle =100%. Tx Active mode is measured in Packet Engine mode (pseudo-random data)
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20.2 Bluetooth and FM Current Consumption
The Bluetooth, BLE, and FM current consumption measurements are shown in Table 47.
Note:
■
The WLAN core is in reset (WLAN_REG_ON = low) for all measurements provided in Table 47.
■
For FM measurements, the Bluetooth core is in Sleep mode.
■
The BT current consumption numbers are measured based on GFSK TX output power = 10 dBm.
Table 47. Bluetooth BLE and FM Current Consumption
VBAT (VBAT = 3.6V)
Typical
Operating Mode
VDDIO (VDDIO = 1.8V)
Typical
Units
Sleep
6
150
µA
Standard 1.28s Inquiry Scan
193
162
µA
500 ms Sniff Master
305
172
µA
DM1/DH1 Master
23.3
–
mA
DM3/DH3 Master
28.4
–
mA
DM5/DH5 Master
29.1
–
mA
3DH5/3DH5 Master
25.1
–
mA
SCO HV3 Master
11.8
–
mA
FMRX Analog Audio onlya
8.6
–
mA
FMRX I2S Audioa
8
–
mA
FMRX
I2S Audio
+
RDSa
FMRX Analog Audio +
RDSa
BLE Scanb
8
–
mA
8.6
–
mA
187
164
µA
BLE Adv. – Unconnectable 1.00 sec
93
163
µA
BLE Connected 1 sec
71
163
µA
a.
In Mono/Stereo blend mode.
b.
No devices present. A 1.28 second interval with a scan window of 11.25 ms.
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CYW4343X
21. Interface Ti ming and AC Characteristics
Note: Values in this data sheet are design goals and are subject to change based on the results of device characterization.
Unless otherwise stated, the specifications in this section apply when the operating conditions are within the limits specified in
Table 28 on page 90 and Table 30 on page 91. Functional operation outside of these limits is not guaranteed.
21.1 SDIO Default Mode Timing
SDIO default mode timing is shown by the combination of Figure 51 and Table 48 on page 113.
Figure 51. SDIO Bus Timing (Default Mode)
fPP
tWL
tWH
SDIO_CLK
tTHL
tTLH
tISU
tIH
Input
Output
tODLY
(max)
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tODLY
(min)
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CYW4343X
Table 48. SDIO Bus Timing a Parameters (Default Mode)
Parameter
Symbol
Minimum
Typical
Maximum
Unit
SDIO CLK (All values are referred to minimum VIH and maximum VILb)
Frequency—Data Transfer mode
fPP
0
–
25
MHz
Frequency—Identification mode
fOD
0
–
400
kHz
Clock low time
tWL
10
–
–
ns
Clock high time
tWH
10
–
–
ns
Clock rise time
tTLH
–
–
10
ns
Clock fall time
tTHL
–
–
10
ns
Inputs: CMD, DAT (referenced to CLK)
Input setup time
tISU
5
–
–
ns
Input hold time
tIH
5
–
–
ns
Outputs: CMD, DAT (referenced to CLK)
Output delay time—Data Transfer mode
tODLY
0
–
14
ns
Output delay time—Identification mode
tODLY
0
–
50
ns
a.
Timing is based on CL  40 pF load on command and data.
b.
min(Vih) = 0.7 × VDDIO and max(Vil) = 0.2 × VDDIO.
21.2 SDIO High-Speed Mode Timing
SDIO high-speed mode timing is shown by the combination of Figure 52 and Table 49.
Figure 52. SDIO Bus Timing (High-Speed Mode)
fPP
tWL
tWH
50% VDD
SDIO_CLK
tTHL
tISU
tTLH
tIH
Input
Output
tODLY
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Table 49. SDIO Bus Timing a Parameters (High-Speed Mode)
Parameter
Symbol
Minimum
Typical
Maximum
Unit
SDIO CLK (all values are referred to minimum VIH and maximum VILb)
Frequency – Data Transfer Mode
fPP
0
–
50
MHz
Frequency – Identification Mode
fOD
0
–
400
kHz
Clock low time
tWL
7
–
–
ns
Clock high time
tWH
7
–
–
ns
Clock rise time
tTLH
–
–
3
ns
Clock fall time
tTHL
–
–
3
ns
Inputs: CMD, DAT (referenced to CLK)
Input setup time
tISU
6
–
–
ns
Input hold time
tIH
2
–
–
ns
Outputs: CMD, DAT (referenced to CLK)
Output delay time – Data Transfer Mode
tODLY
–
–
14
ns
Output hold time
tOH
2.5
–
–
ns
Total system capacitance (each line)
CL
–
–
40
pF
a.
Timing is based on CL  40 pF load on command and data.
b.
min(Vih) = 0.7 × VDDIO and max(Vil) = 0.2 × VDDIO.
21.3 gSPI Signal Timing
The gSPI device always samples data on the rising edge of the clock.
Figure 53. gSPI Timing
T1
T4
T2
T5
T3
SPI_CLK
T6
T7
SPI_DIN
T8
T9
SPI_DOUT
(falling edge)
Table 50. gSPI Timing Parameters
Parameter
Symbol
Minimum
Maximum
Units
Note
Clock period
T1
20.8
–
ns
Fmax = 50 MHz
Clock high/low
T2/T3
(0.45 × T1) – T4
(0.55 × T1) – T4
ns
–
Clock rise/fall time
T4/T5
–
2.5
ns
–
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Table 50. gSPI Timing Parameters (Cont.)
Parameter
Symbol
Minimum
Maximum
Units
Note
Input setup time
T6
5.0
–
ns
Setup time, SIMO valid to SPI_CLK
active edge
Input hold time
T7
5.0
–
ns
Hold time, SPI_CLK active edge to
SIMO invalid
Output setup time
T8
5.0
–
ns
Setup time, SOMI valid before
SPI_CLK rising
Output hold time
T9
5.0
–
ns
Hold time, SPI_CLK active edge to
SOMI invalid
CSX to clocka
–
7.86
–
ns
CSX fall to 1st rising edge
Clock to CSXc
–
–
–
ns
Last falling edge to CSX high
a.
SPI_CSx remains active for entire duration of gSPI read/write/write_read transaction (that is, overall words for multiple word transaction)
21.4 JTAG Timing
Table 51. JTAG Timing Characteristics
Signal Name
Output
Maximum
Period
Output
Minimum
Setup
Hold
TCK
125 ns
–
–
–
–
TDI
–
–
–
20 ns
0 ns
TMS
–
–
–
20 ns
0 ns
TDO
–
100 ns
0 ns
–
–
JTAG_TRST
250 ns
–
–
–
–
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CYW4343X
22. Power-Up Sequence and Timing
22.1 Sequencing of Reset and Regulator Control Signals
The CYW4343X has two signals that allow the host to control power consumption by enabling or disabling the Bluetooth, WLAN,
and internal regulator blocks. These signals are described below. Additionally, diagrams are provided to indicate proper sequencing
of the signals for various operational states (see Figure 54 on page 116 through Figure 57 on page 117). The timing values indicated
are minimum required values; longer delays are also acceptable.
Note:
■
The WL_REG_ON and BT_REG_ON signals are OR’ed in the CYW4343X. The diagrams show both signals going high at
the same time (as would be the case if both REG signals were controlled by a single host GPIO). If two independent host
GPIOs are used (one for WL_REG_ON and one for BT_REG_ON), then only one of the two signals needs to be high to
enable the CYW4343X regulators.
■
The reset requirements for the Bluetooth core are also applicable for the FM core. In other words, if FM is to be used, then
the Bluetooth core must be enabled.
■
The CYW4343X has an internal power-on reset (POR) circuit. The device will be held in reset for a maximum of 110 ms
after VDDC and VDDIO have both passed the POR threshold (see Table 30, “Recommended Operating Conditions and DC
Characteristics,” on page 91). Wait at least 150 ms after VDDC and VDDIO are available before initiating SDIO accesses.
■
VBAT and VDDIO should not rise faster than 40 µs. VBAT should be up before or at the same time as VDDIO. VDDIO
should not be present first or be held high before VBAT is high.
22.1.1 Description of Control Signals
■
WL_REG_ON: Used by the PMU to power up the WLAN section. It is also OR-gated with the BT_REG_ON input to control
the internal CYW4343X regulators. When this pin is high, the regulators are enabled and the WLAN section is out of reset.
When this pin is low the WLAN section is in reset. If both the BT_REG_ON and WL_REG_ON pins are low, the regulators
are disabled.
■
BT_REG_ON: Used by the PMU (OR-gated with WL_REG_ON) to power up the internal CYW4343X regulators. If both the
BT_REG_ON and WL_REG_ON pins are low, the regulators are disabled. When this pin is low and WL_REG_ON is high,
the BT section is in reset.
Note: For both the WL_REG_ON and BT_REG_ON pins, there should be at least a 10 ms time delay between consecutive toggles
(where both signals have been driven low). This is to allow time for the CBUCK regulator to discharge. If this delay is not followed,
then there may be a VDDIO in-rush current on the order of 36 mA during the next PMU cold start.
22.1.2 Control Signal Timing Diagrams
Figure 54. WLAN = ON, Bluetooth = ON
32.678 kHz
Sleep Clock
VBAT
90% of VH
VDDIO
~ 2 Sleep cycles
WL_REG_ON
BT_REG_ON
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Figure 55. WLAN = OFF, Bluetooth = OFF
32.678 kHz
Sleep Clock
VBAT
VDDIO
WL_REG_ON
BT_REG_ON
Figure 56. WLAN = ON, Bluetooth = OFF
32.678 kHz
Sleep Clock
VBAT
90% of VH
VDDIO
~ 2 Sleep cycles
WL_REG_ON
BT_REG_ON
Figure 57. WLAN = OFF, Bluetooth = ON
32.678 kHz
Sleep Clock
VBAT
90% of VH
VDDIO
~ 2 Sleep cycles
WL_REG_ON
BT_REG_ON
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CYW4343X
23. Package Information
23.1 Package Thermal Characteristics
Table 52. Package Thermal Characteristicsa
Characteristic
Value in Still Air
JA (°C/W)
53.11
54.75
JB (°C/W)
13.14
15.38
JC (°C/W)
6.36
7.16
JT (°C/W)
0.04
JB (°C/W)
14.21
Maximum Junction Temperature Tj (°C)b
125
Maximum Power Dissipation (W)
1.2
a.
No heat sink, TA = 70°C. This is an estimate based on a 4-layer PCB that conforms to EIA/JESD51–7
(101.6 mm x 114.3 mm x 1.6 mm) and P = 1.2W continuous dissipation.
b.
Absolute junction temperature limits maintained through active thermal monitoring and dynamic TX duty cycle limiting.
23.1.1 Junction Temperature Estimation and PSI Versus Thetajc
Package thermal characterization parameter PSI-JT (JT) yields a better estimation of actual junction temperature (TJ) versus using
the junction-to-case thermal resistance parameter Theta-JC (JC). The reason for this is JC assumes that all the power is dissipated
through the top surface of the package case. In actual applications, some of the power is dissipated through the bottom and sides of
the package. JT takes into account power dissipated through the top, bottom, and sides of the package. The equation for calculating the device junction temperature is as follows:
TJ = TT + P JT
Where:
■
TJ = junction temperature at steady-state condition, °C
■
TT = package case top center temperature at steady-state condition, °C
■
P = device power dissipation, Watts
JT = package thermal characteristics (no airflow), °C/W
■
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24. Mechanical Info rmation
Figure 58 shows the mechanical drawing for the CYW4343X WLBGA package.
Figure 58. 74-Ball WLBGA Mechanical Information
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CYW4343X
Figure 59 shows the mechanical drawing for the CYW4343X WLBGA package.
Figure 59. 63-Ball WLBGA Mechanical Information
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CYW4343X
Figure 60 shows the mechanical drawing for the CYW4343X WLCSP package. Figure 61 shows the WLCSP keep-out areas.
Figure 60. 153-Bump WLCSP Mechanical Information
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CYW4343X
Note: No top-layer metal is allowed in the keep-out areas.
Note: A DXF file containing WLBGA keep-outs can be imported into a layout program. Contact your Cypress FAE for more
information.[
Figure 61. WLCSP Package Keep-Out Areas—Top View with the Bumps Facing Down
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Figure 62. WLBGA Package Keep-Out Areas—Top View with the Bumps Facing Down
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Figure 63. WLBGA Package Keep-Out Areas—Top View with the Bumps Facing Down[
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CYW4343X
25. Ordering Information
Table 53. Part Ordering Information
Part Number a
Package
Description
Operating
Ambient
Temperature
CYW4343SKUBG
74-ball WLBGA halogen-free package
(4.87 mm x 2.87 mm, 0.40 pitch)
2.4 GHz single-band WLAN IEEE 802.11n –30°C to +70°C
+ BT 4.1 + FMRX
CYW4343WKUBG
74-ball WLBGA halogen-free package
(4.87 mm x 2.87 mm, 0.40 pitch)
2.4 GHz single-band WLAN IEEE 802.11n –30°C to +70°C
+ BT 4.1 + FMRX + Wireless Charging
CYW4343WKWBG
153-bump WLCSP
2.4 GHz single-band WLAN IEEE 802.11n –30°C to +70°C
+ BT 4.1 + FMRX + Wireless Charging
CYW4343W1KUBG
74-ball WLBGA halogen-free package
(4.87 mm x 2.87 mm, 0.40 pitch)
2.4 GHz single-band WLAN IEEE 802.11n –30°C to +70°C
+ BT 4.1 + FMRX + Wireless Charging
a. Add “T” to the end of the part number to specify “Tape and Reel.”
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CYW4343X
1Document
History Page
Document Title: CYW4343X Single-Chip IEEE 802.11 b/g/n MAC/Baseband/Radio with Bluetooth 4.1, an FM Receiver, and
Wireless Charging
Document Number: 002-14797
Revision
Orig. of
Change
ECN
Submission
Date
Description of Change
**
–
–
03/10/14
*A to *F
–
–
04/08/2014 to (4343W-DS101-R
07/01/2015
4343W-DS102-R
4343W-DS103-R
4343W-DS104-R
4343W-DS105-R
4343W-DS106-R)
Updated:
Table 26, “I/O States,” on page 87.
Table 29, “ESD Specifications,” on page 90.
Table 32, “WLAN 2.4 GHz Receiver Performance Specifications,” on page 92.
Table 33, “WLAN 2.4 GHz Transmitter Performance Specifications,” on page 95.
Table 41, “FM Receiver Specifications,” on page 103.
Table 46, “2.4 GHz Mode WLAN Power Consumption,” on page 110.
[4343W]Table 53, “Part Ordering Information,” on page 125.
*G
–
UTSV
08/24/15
4343W-DS107-R
Updated:
Figure 5: “Typical Power Topology (1 of 2)(4343S),” on page 12Figure 6: “Typical
Power Topology (1 of 2)(4343W+43CS4343W1),” on page 13 Figure 7: “Typical
Power Topology (1 of 2),” on page 14 and [4343S]Figure 8: “Typical Power Topology
(2 of 2)(4343S),” on page 15[4343W+43CS4343W1]Figure 9: “Typical Power
Topology (2 of 2)(4343W+43CS4343W1),” on page 16 Figure 10: “Typical Power
Topology (2 of 2),” on page 17.
Table 3, “Crystal Oscillator and External Clock Requirements and Performance,” on
page 23.
Table 26, “I/O States,” on page 87.
*H
5445248 UTSV
10/19/2016
Migrated to Cypress template format
Added Cypress part numbering scheme
4343W-DS100-R
Initial release
1.
Document No. 002-14797 Rev. *H
Page 127 of 128
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Document No. 002-14797 Rev. *H
Revised October 19, 2016
Page 128 of 128