AP2348GN-HF
Halogen-Free Product
Advanced Power
Electronics Corp.
N-CHANNEL ENHANCEMENT MODE
POWER MOSFET
▼ Simple Drive Requirement
D
▼ Small Package Outline
▼ Surface Mount Device
100V
RDS(ON)
300mΩ
ID
G
▼ RoHS Compliant & Halogen-Free
BVDSS
1.5A
S
D
Description
AP2348 series are from Advanced Power innovated design and
silicon process technology to achieve the lowest possible onresistance and fast switching performance. It provides the designer
with an extreme efficient device for use in a wide range of power
applications.
The special design SOT-23 package with good thermal performance
is widely preferred for all commercial-industrial surface mount
applications using infrared reflow technique and suited for voltage
conversion or switch applications.
S
SOT-23
G
Absolute Maximum Ratings
Symbol
Parameter
Rating
Units
VDS
Drain-Source Voltage
100
V
VGS
Gate-Source Voltage
+20
V
ID@TA=25℃
Continuous Drain Current3, VGS @ 10V
1.5
A
1.2
A
6
A
1.38
W
ID@TA=70℃
3
Continuous Drain Current , VGS @ 10V
1
IDM
Pulsed Drain Current
PD@TA=25℃
Total Power Dissipation
TSTG
Storage Temperature Range
-55 to 150
℃
TJ
Operating Junction Temperature Range
-55 to 150
℃
Thermal Data
Symbol
Rthj-a
Parameter
Maximum Thermal Resistance, Junction-ambient
Data and specifications subject to change without notice
3
Value
Unit
90
℃/W
1
201307241
AP2348GN-HF
Electrical Characteristics@Tj=25oC(unless otherwise specified)
Symbol
BVDSS
RDS(ON)
Parameter
Test Conditions
Drain-Source Breakdown Voltage
Static Drain-Source On-Resistance
Min.
Typ.
100
-
-
V
VGS=10V, ID=1A
-
-
300
mΩ
VGS=4.5V, ID=0.5A
-
-
600
mΩ
VGS=0V, ID=250uA
2
Max. Units
VGS(th)
Gate Threshold Voltage
VDS=VGS, ID=250uA
1
-
3
V
gfs
Forward Transconductance
VDS=10V, ID=1A
-
1.6
-
S
IDSS
Drain-Source Leakage Current
VDS=80V, VGS=0V
-
-
100
uA
IGSS
Gate-Source Leakage
VGS=+20V, VDS=0V
-
-
+100
nA
Qg
Total Gate Charge
ID=1A
-
3
4.8
nC
Qgs
Gate-Source Charge
VDS=50V
-
1
-
nC
Qgd
Gate-Drain ("Miller") Charge
VGS=4.5V
-
1.5
-
nC
td(on)
Turn-on Delay Time
VDS=50V
-
3
-
ns
tr
Rise Time
ID=1A
-
19
-
ns
td(off)
Turn-off Delay Time
RG=3.3Ω
-
8
-
ns
tf
Fall Time
VGS=10V
-
20
-
ns
Ciss
Input Capacitance
VGS=0V
-
200
320
pF
Coss
Output Capacitance
VDS=25V
-
30
-
pF
Crss
Reverse Transfer Capacitance
f=1.0MHz
-
20
-
pF
Min.
Typ.
Source-Drain Diode
Symbol
Parameter
2
Test Conditions
Max. Units
VSD
Forward On Voltage
IS=1A, VGS=0V
-
-
1.3
V
trr
Reverse Recovery Time
IS=1A, VGS=0V,
-
30
-
ns
Qrr
Reverse Recovery Charge
dI/dt=100A/µs
-
12
-
nC
Notes:
1.Pulse width limited by Max. junction temperature.
2.Pulse test
3.Surface mounted on 1 in2 copper pad of FR4 board t ≦ 10s ; 270℃/W when mounted on min. copper pad.
THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION.
USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED.
APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED
HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN.
2
AP2348GN-HF
4
10
10V
7.0V
6.0V
ID , Drain Current (A)
8
10V
7.0V
6.0V
5.0V
V G = 4.0V
T A = 150 o C
ID , Drain Current (A)
o
T A =25 C
5.0V
6
4
V G = 4.0V
3
2
1
2
0
0
0
4
8
12
0
16
2
Fig 1. Typical Output Characteristics
6
8
Fig 2. Typical Output Characteristics
400
2.4
ID=1A
V GS =10V
I D =0.5A
T A =25 o C
360
2.0
Normalized RDS(ON)
RDS(ON) (mΩ)
4
V DS , Drain-to-Source Voltage (V)
V DS , Drain-to-Source Voltage (V)
320
280
1.6
1.2
0.8
240
0.4
200
2
4
6
8
-50
10
0
50
100
150
o
V GS Gate-to-Source Voltage (V)
T j , Junction Temperature ( C)
Fig 3. On-Resistance v.s. Gate Voltage
Fig 4. Normalized On-Resistance
v.s. Junction Temperature
2.0
2
I D =250uA
1.6
Normalized VGS(th)
IS(A)
1.6
1.2
T j =150 o C
T j =25 o C
0.8
1.2
0.8
0.4
0.4
0.0
0
0
0.2
0.4
0.6
0.8
1
1.2
V SD , Source-to-Drain Voltage (V)
Fig 5. Forward Characteristic of
Reverse Diode
1.4
-50
0
50
100
150
o
T j , Junction Temperature ( C)
Fig 6. Gate Threshold Voltage v.s.
Junction Temperature
3
AP2348GN-HF
f=1.0MHz
400
I D = 1A
V DS =50V
6
300
C (pF)
VGS , Gate to Source Voltage (V)
8
4
200
2
100
0
0
0
1
2
3
4
5
C iss
C oss
C rss
1
5
Q G , Total Gate Charge (nC)
9
13
17
21
25
29
V DS , Drain-to-Source Voltage (V)
Fig 7. Gate Charge Characteristics
Fig 8. Typical Capacitance Characteristics
1
10
Normalized Thermal Response (Rthja)
Duty factor=0.5
Operation in this
area limited by
RDS(ON)
100us
1
ID (A)
1ms
10ms
0.1
100ms
1s
DC
0.01
o
T A =25 C
Single Pulse
0.001
0.2
0.1
0.1
0.05
PDM
t
0.01
T
0.01
Duty factor = t/T
Peak Tj = PDM x Rthja + T a
Single Pulse
Rthja = 270℃/W
0.001
0.1
1
10
100
1000
0.0001
0.001
V DS , Drain-to-Source Voltage (V)
0.01
0.1
1
10
100
1000
t , Pulse Width (s)
Fig 9. Maximum Safe Operating Area
Fig 10. Effective Transient Thermal Impedance
2
VG
ID , Drain Current (A)
1.6
QG
4.5V
1.2
QGS
QGD
0.8
0.4
Charge
Q
0
25
50
75
100
125
150
T A , Ambient Temperature ( o C )
Fig 11. Maximum Continuous Drain Current
v.s. Ambient Temperature
Fig 12. Gate Charge Waveform
4