AVAGO AFBR-5701Z Sfp optical transceivers with optional dmi for gigabit ethernet Datasheet

AFBR-5701Z and AFBR-5705Z
Families of Multi-Mode Small Form Factor Pluggable (SFP) Optical
Transceivers with Optional DMI for Gigabit Ethernet (1.25 GBd) and
Fibre Channel (1.0625 GBd)
Data Sheet
Description
The AFBR-570xZ family of SFP optical transceivers offers
the customer a wide range of design options, including
optional DMI features (further described later), two
temperature ranges (extended or industrial), and choice
of standard or bail delatch. The AFBR-5705Z family
targets those applications requiring DMI features. The
AFBR-5701Z family is a streamlined product designed
for those applications where DMI features are not
needed. Throughout this document, AFBR-570xZ will
be used to refer collectively to the product family
encompassing this entire range of product options.
Part Number Options
The AFBR-570xZ SFP family includes the following
products:
Part Number
AFBR-5701LZ
AFBR-5701PZ
AFBR-5701ALZ
AFBR-5701APZ
AFBR-5705LZ
AFBR-5705PZ
AFBR-5705ALZ
AFBR-5705APZ
DMI
No
No
No
No
Yes
Yes
Yes
Yes
Temperature
Extended
Extended
Industrial
Industrial
Extended
Extended
Industrial
Industrial
Latch
Standard
Bail
Standard
Bail
Standard
Bail
Standard
Bail
* Extended Temperature Range is -10 to 85 °C
Industrial Temperature Range is -40 to 85 ° C
Related Products
• AFBR-5715Z family: 1.25 GBd Ethernet (1000BASE-SX)
SFP with DMI
• AFBR-5710Z family : 1.25 GBd Ethernet (1000BASE-SX)
SFP without DMI
• AFCT-5705Z family: 1.25 GBd Ethernet (1000BASE-LX) &
1.0265 GBd Fiber-Channel SFP with DMI
• AFCT-5701Z family: 1.25 GBd Ethernet (1000BASE-LX) &
1.0265 GBd Fiber-Channel SFP without DMI
Features
• ROHS-6 Compliant
• Compliant to IEEE 802.3 Gigabit Ethernet (1.25GBd)
1000BaseSX & Fiber Channel FC-PI 100-M5-SN-I & 100M6-SN-I
• Optional Digital Diagnostic Monitoring available
- AFBR-5701Z family: without DMI
- AFBR-5705Z family: with DMI
• Per SFF-8472, diagnostic features on AFBR-5705Z family
enable Diagnostic Monitoring Interface for optical
transceivers with real-time monitoring of:
- Transmitted optical power
- Received optical power
- Laser bias current
- Temperature
- Supply voltage
• Transceiver specifications according to SFP Multi-Source
Agreement (SFF-8074i) and SFF-8472, Revision 9.3
• Manufactured in an ISO 9001 compliant facility
• Hot-pluggable
• Temperature options
- (Extended) -10°C to +85°C
- (Industrial) -40°C to +85°C
• +3.3 V DC power supply
• Industry leading EMI performance for high port density
• 850 nm Vertical Cavity Surface Emitting Laser (VCSEL)
• Eye safety certified
• LC-Duplex fiber connector compliant
Applications
• Ethernet Switch
• Enterprise Router
• Broadband aggregation and wireless infrastructure
• Storage applications including Fiber Channel and iSCSCI
OPTICAL INTERFACE
LIGHT FROM FIBER
ELECTRICAL INTERFACE
RECEIVER
RD+ (RECEIVE DATA)
AMPLIFICATION
& QUANTIZATION
PHOTO-DETECTOR
RD—(RECEIVE DATA)
Rx LOSS OF SIGNAL
MOD-DEF2 (SDA)
CONTROLLER & MEMORY
MOD-DEF1 (SCL)
MOD-DEF0
TRANSMITTER
LIGHT TO FIBER
TX_DISABLE
LASER
DRIVER &
SAFETY
CIRCUITRY
VCSEL
TD+ (TRANSMIT DATA)
TD—(TRANSMIT DATA)
TX_FAULT
Figure 1. SFP Block Diagram
Overview
321
The AFBR-570xZ family of optical transceivers are
compliant with the specifications set forth in the
IEEE802.3 (1000BASE-SX), Fibre Channel (100-M5-SN-I,
100-M6-SN-I), and the Small Form-Factor Pluggable
(SFP) Multi-Source Agreement (MSA). This family of
transceivers is qualified in accordance with Telcordia
GR-468-CORE. Its primary application is servicing Gigabit
Ethernet and Fibre Channel links between optical
networking equipment.
20
VEET
19
The AFBR-570xZ offers maximum flexibility to designers,
manufacturers, and operators of Gigabit Ethernet
networking equipment. A pluggable architecture allows the
module to be installed into MSA standard SFP ports at any
time – even with the host equipment operating and online.
This facilitates the rapid configuration of equipment to
precisely the user’s needs – reducing inventory costs and
network downtime. Compared with traditional transceivers,
the size of the Small Form Factor package enables higher
port densities.
Module Diagrams
Figure 1 illustrates the major functional components of the
AFBR-570xZ. The external configuration of the module is
depicted in Figure 7. Figure 8 depicts the panel and host
board footprints.
2
321
ENGAGEMENT
SEQUENCE
1
VEET
TD–
2
TX FAULT
18
TD+
3
TX DISABLE
17
VEET
4
MOD-DEF(2)
16
VCCT
5
MOD-DEF(1)
15
VCCR
6
MOD-DEF(0)
14
VEER
7
RATE SELECT
13
RD+
8
LOS
12
RD–
9
VEER
11
VEER
10
VEER
TOP OF BOARD
BOTTOM OF BOARD
(AS VIEWED THROUGH TOP OF BOARD)
Figure 2. Pin description of the SFP electrical interface.
Installation
Transmit Fault (Tx_Fault)
The AFBR-570xZ can be installed in or removed from any
MSA-compliant Pluggable Small Form Factor port
regardless of whether the host equipment is operating or
not. The module is simply inserted, electrical-interface first,
under finger-pressure. Controlled hot-plugging is ensured
by 3-stage pin sequencing at the electrical interface. This
printed circuit board card-edge connector is depicted in
Figure 2.
A catastrophic laser fault will activate the transmitter signal,
TX_FAULT, and disable the laser. This signal is an open
collector output (pull-up required on the host board). A
low signal indicates normal laser operation and a high
signal indicates a fault. The TX_FAULT will be latched high
when a laser fault occurs and is cleared by toggling the
TX_DISABLE input or power cycling the transceiver. The
transmitter fault condition can also be monitored via the
2-wire serial interface (address A2, byte 110, bit 2).
As the module is inserted, first contact is made by the
housing ground shield, discharging any potentially
component-damaging static electricity. Ground pins
engage next and are followed by Tx and Rx power supplies.
Finally, signal lines are connected. Pin functions and
sequencing are listed in Table 2.
Transmitter Section
The transmitter section includes the Transmitter Optical
Subassembly (TOSA) and laser driver circuitry. The TOSA,
containing an 850 nm VCSEL (Vertical Cavity Surface
Emitting Laser) light source, is located at the optical
interface and mates with the LC optical connector. The
TOSA is driven by a custom IC, which converts differential
logic signals into an analog laser diode drive current. This
Tx driver circuit regulates the optical power at a constant
level provided the data pattern is DC balanced (8B10B
code for example).
Transmit Disable (Tx_Disable)
The AFBR-570xZ accepts a TTL and CMOS compatible
transmit disable control signal input (pin 3) which shuts
down the transmitter optical output. A high signal
implements this function while a low signal allows normal
transceiver operation. In the event of a fault (e.g. eye safety
circuit activated), cycling this control signal resets the
module as depicted in Figure 6. An internal pull-up resistor
disables the transceiver transmitter until the host pulls
the input low. Host systems should allow a 10ms interval
between successive assertions of this control signal.
Tx_Disable can also be asserted via the 2-wire serial
interface (address A2h, byte 110, bit 6) and monitored
(address A2h, byte 110, bit 7).
The contents of A2h, byte 110, bit 6 are logic OR’d with
hardware Tx_Disable (pin 3) to control transmitter
operation.
3
Eye Safety Circuit
The AFBR-570xZ provides Class 1 eye safety by design
and has been tested for compliance with the requirements
listed in Table 1. The eye safety circuit continuously
monitors optical output power levels and will disable the
transmitter and assert a TX_FAULT signal upon detecting
an unsafe condition. Such unsafe conditions can be created
by inputs from the host board (Vcc fluxuation, unbalanced
code) or faults within the module.
Receiver Section
The receiver section includes the Receiver Optical
Subassembly (ROSA) and amplification/quantization
circuitry. The ROSA, containing a PIN photodiode and
custom trans-impedance preamplifier, is located at the
optical interface and mates with the LC optical connector.
The ROSA is mated to a custom IC that provides postamplification and quantization. Also included is a Loss Of
Signal (LOS) detection circuit.
Receiver Loss of Signal (Rx_LOS)
The Loss Of Signal (LOS) output indicates an unusable
optical input power level. The Loss Of Signal thresholds
are set to indicate a definite optical fault has occurred
(e.g., disconnected or broken fiber connection to
receiver, failed transmitter, etc.).
The post-amplification IC includes transition detection
circuitry which monitors the ac level of incoming optical
signals and provides a TTL/CMOS compatible status
signal to the host (pin 8). An adequate optical input
results in a low Rx_LOS output while a high Rx_LOS
output indicates an unusable optical input. The Rx_LOS
thresholds are factory-set so that a high output indicates
a definite optical fault has occurred. For the AFBR-5705Z
family, Rx_LOS can also be monitored via the 2-wire
serial interface (address A2h, byte 110, bit 1).
Digital Diagnostic Interface and Serial Identification
(EEPROM)
Functional I/O
The AFBR-570xZ accepts industry standard differential
signals such as LVPECL and CML within the scope of the
SFP MSA. To simplify board requirements, transmitter
bias resistors and ac coupling capacitors are
incorporated, per SFF-8074i, and hence are not required
on the host board. The module is AC-coupled and
internally terminated.
The entire AFBR-570xZ family complies with the SFF8074i SFP specification. The AFBR-5705Z family further
complies with SFF-8472, the SFP specification for Digital
Diagnostic Monitoring Interface. Both specifications can
be found at http://www.sffcommittee.org.
The AFBR-570xZ features an EEPROM for Serial ID, which
contains the product data stored for retrieval by host
equipment. This data is accessed via the 2-wire serial
EEPROM protocol of the ATMEL AT24C01A or similar, in
compliance with the industry standard SFP Multi-Source
Agreement. The base EEPROM memory, bytes 0-255 at
memory address 0xA0, is organized in compliance with
SFF-8074i. Contents of this serial ID memory are shown
in Table 10.
Figure 3 illustrates a recommended interface circuit to
link the AFBR-570xZ to the supporting Physical Layer
integrated circuits.
Timing diagrams for the MSA compliant control signals
implemented in this module are depicted in Figure 6.
The AFBR-570xZ interfaces with the host circuit board
through twenty I/O pins (SFP electrical connector)
identified by function in Table 2. The AFBR-570xZ high
speed transmit and receive interfaces require SFP MSA
compliant signal lines on the host board. The Tx_Disable,
Tx_Fault, and Rx_LOS lines require TTL lines on the host
board (per SFF-8074i) if used. If an application chooses
not to take advantage of the functionality of these pins,
care must be taken to ground Tx_Disable (for normal
operation).
1 µH
VCCT,R
10 µF
0.1 µF
HOUSING
GROUND
1 µH
0.1
µF
TX_FAULT
VREFR
TX[0:9]
SO1+
50 Ω
SO1–
50 Ω
RBC
RX_RATE
SYN1
RC1(0:1)
RCM0
RFCT
RX_LOS
TD–
10
µF
R
LASER DRIVER
& EYE SAFETY
CIRCUITRY
VCCR
RD+
C
C
50 Ω
SI1–
VCCT,R
0.1
µF
50 Ω
SI1+
RD–
AMPLIFICATION
&
QUANTIZATION
REF_RATE
*RES
*RES
*RES
*RES
RX_LOS
MOD_DEF2
MOD_DEF1
MOD_DEF0
REFCLK
VEER
125 MHz
NOTE: * 4.7 k Ω < RES < 10 kΩ
Figure 3. Typical application configuration.
R
VEET
GPIO(X)
GPIO(X)
GP14
4
TD+
C
C
SYNC
LOOP
AVAGO
HDMP-1687
RX[0:9]
MAC
ASIC
*RES
TX_DISABLE
GP04
TX_FAULT
TBC
EWRAP
AVAGO
AFBR-570xZ
VCCT
*RES
EEPROM
As an enhancement to the conventional SFP interface
defined in SFF-8074i, the AFBR-5705Z family is compliant
to SFF-8472 (digital diagnostic interface for optical
transceivers). This new digital diagnostic information is
stored in bytes 0-255 at memory address 0xA2.Using
the 2-wire serial interface defined in the MSA, the AFBR5705Z provides real time temperature, supply voltage,
laser bias current, laser average output power and
received input power. These parameters are internally
calibrated, per the MSA.
The digital diagnostic interface also adds the ability to
disable the transmitter (TX_DISABLE), monitor for
Transmitter Faults (TX_FAULT), and monitor for Receiver
Loss of Signal (RX_LOS).
The new diagnostic information provides the
opportunity for Predictive Failure Identification,
Compliance Prediction, Fault Isolation and Component
Monitoring.
Predictive Failure Identification
The predictive failure feature allows a host to identify
potential link problems before system performance is
impacted. Prior identification of link problems enables
a host to service an application via “fail over” to a
redundant link or replace a suspect device, maintaining
system uptime in the process. For applications where
ultra-high system uptime is required, a digital SFP
provides a means to monitor two real-time laser metrics
associated with observing laser degradation and
predicting failure: average laser bias current (Tx_Bias)
and average laser optical power (Tx_Power).
Compliance Prediction
Compliance prediction is the ability to determine if an
optical transceiver is operating within its operating and
environmental requirements. AFBR-5705Z devices
provide real-time access to transceiver internal supply
voltage and temperature, allowing a host to identify
potential component compliance issues. Received
optical power is also available to assess compliance of a
cable plant and remote transmitter. When operating out
of requirements, the link cannot guarantee error free
transmission.
Fault Isolation
The fault isolation feature allows a host to quickly
pinpoint the location of a link failure, minimizing
downtime. For optical links, the ability to identify a fault
at a local device, remote device or cable plant is crucial
to speeding service of an installation. AFBR-5705Z realtime monitors of Tx_Bias, Tx_Power, Vcc, Temperature
and Rx_Power can be used to assess local transceiver
current operating conditions. In addition, status flags
Tx_Disable and Rx Loss of Signal (LOS) are mirrored in
memory and available via the two-wire serial interface.
Component Monitoring
Component evaluation is a more casual use of the
AFBR-5705Z real-time monitors of Tx_Bias, Tx_Power,
Vcc, Temperature and Rx_Power. Potential uses are as
debugging aids for system installation and design, and
transceiver parametric evaluation for factory or field
qualification. For example, temperature per module can
be observed in high density applications to facilitate
thermal evaluation of blades, PCI cards and systems.
Required Host Board Components
The MSA power supply noise rejection filter is required
on the host PCB to meet data sheet performance. The
MSA filter incorporates an inductor which should be
rated 400 mADC and 1 Ω series resistance or better. It
should not be replaced with a ferrite. The required filter
is illustrated in Figure 4.
The MSA also specifies that 4.7 K to 10 KΩ pull-up
resistors for TX_FAULT, LOS, and MOD_DEF0,1,2 are
required on the host PCB.
1 µH
VCCT
0.1 µF
1 µH
3.3 V
VCCR
0.1 µF
SFP MODULE
10 µF
HOST BOARD
Figure 4. MSA required power supply filter.
5
0.1 µF
10 µF
Fiber Compatibility
The AFBR-570xZ transciever is capable of transmission
at 2 to 550 meters with 50/125 µm fiber, and at 2 to
275 meters with 62.5 125 µm fiber, for 1.25 GBd
Ethernet. It is capable of transmission up to 500m with
50/125 µm fiber and up to 300m with 62.5/125 µm
fiber, for 1.0625 GBd Fiber Channel.
Application Support
To assist in the transceiver evaluation process, Agilent
offers a 1.25 Gbd Gigabit Ethernet evaluation board
which facilitates testing of the AFBR-570xZ. It can be
obtained through the Agilent Field Organization by
referencing Agilent part number HFBR-0571.
A Reference Design including the AFBR-570xZ and the
HDMP-1687 GigaBit Quad SerDes is available. It may
be obtained through the Agilent Field Sales
organization.
Regulatory Compliance
See Table 1 for transceiver Regulatory Compliance.
Certification level is dependent on the overall
configuration of the host equipment. The transceiver
performance is offered as a figure of merit to assist the
designer.
Electrostatic Discharge (ESD)
The AFBR-570xZ exceeds typical industry standards
and is compatible with ESD levels found in typical
manufacturing and operating environments as
described in Table 1.
There are two design cases in which immunity to ESD
damage is important.
The first case is during handling of the transceiver prior
to insertion into the transceiver port. To protect the
transceiver, it’s important to use normal ESD handling
6
precautions. These precautions include using grounded
wrist straps, work benches, and floor mats in ESD
controlled areas. The ESD sensitivity of the AFBR-570xZ
is compatible with typical industry production
environments.
The second case to consider is static discharges to the
exterior of the host equipment chassis after installation.
To the extent that the optical interface is exposed to
the outside of the host equipment chassis, it may be
subject to system-level ESD requirements.
Electromagnetic Interference (EMI)
Equipment using the AFBR-570xZ family of transceivers
is typically required to meet the requirements of the
FCC in the United States, CENELEC EN55022 (CISPR 22)
in Europe, and VCCI in Japan.
The metal housing and shielded design of the AFBR570xZ minimize the EMI challenge facing the host
equipment designer.
EMI Immunity
Equipment hosting AFBR-570xZ modules will be
subjected to radio-frequency electromagnetic fields in
some environments. The transceiver has excellent
immunity to such fields due to its shielded design.
Flammability
The AFBR-570xZ transceiver is made of metal and high
strength, heat resistant, chemically resistant, and UL
94V-0 flame retardant plastic.
Customer Manufacturing Processes
This module is pluggable and is not designed for
aqueous wash, IR reflow, or wave soldering processes.
Table 1. Regulatory Compliance
Feature
Test Method
Performance
Electrostatic Discharge
JEDEC/EIA
(ESD)to the Electrical Pins JESD22-A114-A
Class 2 (> +2000 Volts)
Electrostatic Discharge
(ESD) to the Duplex LC
Reseptacle
Variation of IEC 6100-4-2
Typically withstands at least 25 kV without
damage when the duplex LC connector
receptacle is contacted by a Human Body
Model probe
Electromagnetic
Interference(EMI)
FCC Class B CENELEC EN55022
Class B (CISPR 22A) VCCI Class 1
Applications with high SFP port counts are
expected to be compliant; however, margins are
dependent on customer board and chassis
design.
Immunity
Variation of IEC 61000-4-3
Typically shows a negligible effect from a 10
V/m field swept from 80 to 1000 MHz applied
to the transceiver without a chassis enclosure.
Eye Safety
US FDA CDRH AEL Class 1
EN(IEC)60825-1,2, EN60950 Class 1
CDRH certification #9720151-57
TUV file R 72050685
Component Recognition
Underwriters Laboratories and Canadian
Standards Association Joint Component
Recognition for Information Technology
Equipment Including Electrical Business
Equipment
UL File #E173874
ROHS Compliance
Caution
There are no user serviceable parts nor any
maintenance required for the AFBR-570xZ. All
adjustments are made at the factory before shipment
to our customers. Tampering with, modifying, misusing
or improperly handling the AFBR-570xZ will void the
product warranty. It may also result in improper
operation of the AFBR-570xZ circuitry, and possible
overstress of the laser source. Device degradation or
product failure may result. Connection of the AFBR570xZ to a non-Gigabit Ethernet compliant or non-Fiber
Channel compliant optical source, operating above the
recommended absolute maximum conditions or
operating the AFBR-570xZ in a manner inconsistent
with its design and function may result in hazardous
radiation exposure and may be considered an act of
modifying or manufacturing a laser product. The
person(s) performing such an act is required by law to
re-certify and re-identify the laser product under the
provisions of U.S. 21 CFR (Subchapter J).
7
Less than 1000ppm of: cadmium, lead, mercury,
hexavalent chromium, polybrominated
biphenyls, and polybrominated biphenyl ethers.
Table 2. Pin Description
Pin
Name
Function/Description
Engagement
Order(insertion)
1
VeeT
Transmitter Ground
1
2
TX Fault
Transmitter Fault Indication
3
1
3
TX Disable
Transmitter Disable - Module disables on high or open
3
2
4
MOD-DEF2
Module Definition 2 - Two wire serial ID interface
3
3
5
MOD-DEF1
Module Definition 1 - Two wire serial ID interface
3
3
6
MOD-DEF0
Module Definition 0 - Grounded in module
3
3
7
Rate Selection
Not Connected
3
8
LOS
Loss of Signal
3
9
VeeR
Receiver Ground
1
10
VeeR
Receiver Ground
1
11
VeeR
Receiver Ground
1
12
RD-
Inverse Received Data Out
3
5
13
RD+
Received Data Out
3
5
14
VeeR
Reciver Ground
1
15
VccR
Receiver Power -3.3 V ±5%
2
6
16
VccT
Transmitter Power -3.3 V ±5%
2
6
17
VeeT
Transmitter Ground
1
18
TD+
Transmitter Data In
3
7
19
TD-
Inverse Transmitter Data In
3
7
20
VeeT
Transmitter Ground
1
Notes
4
Notes:
1. TX Fault is an open collector/drain output which should be pulled up externally with a 4.7KΩ – 10 KΩ resistor on the host board to a supply
<VccT+0.3 V or VccR+0.3 V. When high, this output indicates a laser fault of some kind. Low indicates normal operation. In the low state, the
output will be pulled to < 0.8 V.
2. TX disable input is used to shut down the laser output per the state table below. It is pulled up within the module with a 4.7-10 KΩ resistor.
Low (0 – 0.8 V):
Transmitter on
Between (0.8 V and 2.0 V):
Undefined
High (2.0 – 3.465 V):
Transmitter Disabled
Open:
Transmitter Disabled
3. Mod-Def 0,1,2. These are the module definition pins. They should be pulled up with a 4.7-10 KΩ resistor on the host board to a supply less than
VccT +0.3 V or VccR+0.3 V.
Mod-Def 0 is grounded by the module to indicate that the module is present
Mod-Def 1 is clock line of two wire serial interface for optional serial ID
Mod-Def 2 is data line of two wire serial interface for optional serial ID
4. LOS (Loss of Signal) is an open collector/drain output which should be pulled up externally with a 4.7 K – 10 KΩ resistor on the host board to a
supply < VccT,R+0.3 V. When high, this output indicates the received optical power is below the worst case receiver sensitivity (as defined by the
standard in use). Low indicates normal operatio0n. In the low state, the output will be pulled to < 0.8 V.
5. RD-/+: These are the differential receiver outputs. They are AC coupled 100 Ω differential lines which should be terminated with 100 Ω differential
at the user SERDES. The AC coupling is done inside the module and is thus not required on the host board. The voltage swing on these lines must be
between 370 and 2000 mV differential (185 – 1000 mV single ended) according to the MSA. Typically it will be 1500mv differential.
6. VccR and VccT are the receiver and transmitter power supplies. They are defined as 3.135 – 3.465 V at the SFP connector pin. The in-rush current will
typically be no more than 30 mA above steady state supply current after 500 nanoseconds.
7. TD-/+: These are the differential transmitter inputs. They are AC coupled differential lines with 100 Ω differential termination inside the module. The
AC coupling is done inside the module and is thus not required on the host board. The inputs will accept differential swings of 500 – 2400 mV (250 –
1200 mV single ended). However, the applicable recommended differential voltage swing is found in Table 5.
8
Table 3. Absolute Maximum Ratings
Parameter
Symbol
Minimum
Maximum
Unit
Notes
Ambient Storage Temperature(Nonoperating)
Ts
-40
+100
°C
1, 2
Case Temperature
TC
-40
+85
°C
1, 2
Relative Humidity
RH
5
95
%
1
Supply Voltage
VCCT,R
-0.5
3.8
V
1, 2, 3
Low Speed Input Voltage
VIN
-0.5
VCC+0.5
V
1
Notes:
1. Absolute Maximum Ratings are those values beyond which damage to the device may occur if these limits are exceeded. See Reliability Data Sheet
for specific reliability performance.
2. Between Absolute Maximum Ratings and the Recommended Operating Conditions functional performance is not intended, device reliability is not
implied, and damage to the device may occur.
3. The module supply voltages, VCCT and V CCR, must not differ by more than 0.5V or damage to the device may occur.
Table 4. Recommended Operating Conditions
Parameter
Symbol
Minimum
Typical
Maximum
Unit
Notes
Case Temperature
AFBR-570xLZ/PZ
AFBR-570xALZ/APZ
TC
TC
-10
-40
25
25
85
85
°C
°C
1, 2
1, 2
Supply Voltage
VCC
3.135
3.3
3.465
V
1
1.25
Gb/s
1,3, 4
Data Rate
1.0625
Notes:
1. Recommended Operating Conditions are those within which functional performance within data sheet characteristics is intended.
2. Refer to the Reliability Data Sheet for specific reliability performance predictions.
3. IEEE802.3 Gigabit Ethernet.
4. ANSIX3.230 (FC-PI).
9
Table 5. Transceiver Electrical Characteristics
Parameter
Symbol
Module Supply Current
Minimum
Typical
Maximum
Unit
ICC
160
220
mA
Power Dissipation
PDISS
530
765
mW
Power Supply Noise
Rejection(peak-peak)
PSNR
100
Data input:
Transmitter Differential Input
Voltage (TD +/-)
VI
500
Data Output:
Receiver Differential Output
Voltage (RD +/-)
VO
370
Receive Data Rise & Fall Times
TRF
Low Speed Outputs:
Transmit Fault (TX_FAULT) Loss
of Signal (LOS), MOD_DEF2
VOH
2.0
VCCT,R+0.3
V
VOL
0
0.8
V
Low Speed Inputs:
Transmitter Disable
(TX_DISABLE), MOD_DEF 1,
MOD_DEF 2
VIH
2.0
VCC
V
VIL
0
0.8
V
1500
mVPP
1
2400
mVPP
2
2000
mVPP
3
220
ps
Notes:
1. Measured at the input of the required MSA Filter on host board.
2. Internally AC coupled and terminated to 100 Ω differential load.
3. Internally AC coupled, but requires a 100 Ω differential termination at or internal to Serializer/Deserializer.
4. Pulled up externally with a 4.7-10 KΩ resistor on the host board to VCCT,R.
5. Mod_Def1 and Mod_Def2 must be pulled up externally with a 4.7-10 KΩ resistor on the host board to VCCT,R.
10
Notes
4
5
Table 6. Transmitter Optical Characteristics
Parameter
Symbol
Minimum
Typical
Maximum
Unit
Notes
Output Optical Power (Average)
POUT
-9.5
-6.5
-3
dBm
1,2,3
Optical Extinction Ratio
ER
9
12
dB
1
Center Wavelength
λC
830
850
860
nm
1
Spectral Width - rms
σ
0.85
nm
1
Optical Rise/Fall Time (1.25GBd)
TRISE/FALL
150
260
ps
1
Optical Rise/Fall Time (1.0625GBd)
TRISE/FALL
150
300
ps
1,4
Relative Intensity Noise
RIN
-117
dB/Hz
1
Total Jitter
(TP1 to TP2 Contribution 1.25 GBd)
TJ
227
ps
1
0.284
UI
1
252
ps
4
0.267
UI
4
(TP1 to TP2 contribution 1.0625 GBd)
Deterministic Jitter
DJ
(TP1 to TP2 Contribution 1.0625 GBd)
85
ps
4
0.09
UI
4
Pout TX_DISABLE Assorted
POFF
-35
dBm
1
Optical Modulation Amplitude
OMA
µW
4
156
Notes:
1. IEEE 802.3.
2. Max. Pout is the lesser of 0 dBm or Maximum allowable per Eye Safety Standard.
3. 50/125 µm fiber with NA = 0.2, 62.5/125 µm fiber with NA = 0.275.
4. ANSIX3.230 (FC-PI).
NORMALIZED TIME (UNIT INTERVAL)
0.22
0.375
0.625
0.78
1.0
130
1.30
100
1.00
80
0.80
50
0.50
20
0.20
NORMALIZED AMPLITUDE
NORMALIZED AMPLITUDE (%)
0
0
0
–0.20
–20
0
22
37.5
62.5
78
100
NORMALIZED TIME (% OF UNIT INTERVAL)
Figure 5a. Gigabit Ethernet transmitter eye mask diagram
11
Figure 5b. Typical AFBR-570xZ eye mask diagram
Table 7. Receiver Optical Characteristics
Parameter
Symbol
Minimum
Optical Input Power
PR
-17
Receiver Sensitivity
(Optical Input Power)
PRMIN
Typical
Maximum
Unit
Notes
0
dBm
1
-17
dBm
1
-12.5
dBm
1,2
-13.5
dBm
1,3
67
µW
2,4
55
µW
3,4
266
ps
1
0.332
UI
1
205
ps
4
0.218
UI
4
113
ps
4
0.12
UI
4
-12
dB
1
-17
dBm
1
dBm
1
dB
1
µW
4
-21
Stressed Receiver Sensitivity
1.25GBd(GBE)
Stressed Receiver Sensitivity
1.0625GBd (FC-PI) OMA
Total Jitter
(TP3 to TP4 Contribution 1.25GBd)
TJ
Total Jitter
(TP3 to TP4 Contribution 1.0625GBd)
TJ
Deterministic Jitter
(TP3 to TP4 Contribution 1.0625GBd)
DJ
Return Loss
LOS De-Asserted
PD
-
LOS Asserted
PA
-30
LOS Hysterisis
PD-PA
Optical Modulation Amplitude
OMA
Notes:
1. IEEE 802.3.
2. 62.5/125 µm fiber.
3. 50/125 µm fiber.
4. ANSIX3.230 (FC-PI).
12
3
31
Table 8. Transceiver SOFT DIAGNOSTIC Timing Characteristics
Parameter
Symbol
Hardware TX_DISABLE Assert Time
Minimum
Maximum
Unit
Notes
t_off
10
µs
Note 1
Hardware TX_DISABLE Negate Time
t_on
1
ms
Note 2
Time to initialize, including reset of TX_FAULT
t_init
300
ms
Note 3
Hardware TX_FAULT Assert Time
t_fault
100
µs
Note 4
Hardware TX_DISABLE to Reset
t_reset
µs
Note 5
Hardware RX_LOS Assert Time
t_loss_on
100
µs
Note 6
Hardware RX_LOS De-Assert Time
t_loss_off
100
µs
Note 7
Software TX_DISABLE Assert Time
t_off_soft
100
ms
Note 8
Software TX_DISABLE Negate Time
t_on_soft
100
ms
Note 9
Software Tx_FAULT Assert Time
t_fault_soft
100
ms
Note 10
Software Rx_LOS Assert Time
t_loss_on_soft
100
ms
Note 11
Software Rx_LOS De-Assert Time
t_loss_off_soft
100
ms
Note 12
Analog parameter data ready
t_data
1000
ms
Note 13
Serial bus hardware ready
t_serial
300
ms
Note 14
Write Cycle Time
t_write
10
ms
Note 15
Serial ID Clock Rate
f_serial_clock
400
kHz
10
Notes:
1. Time from rising edge of TX_DISABLE to when the optical output falls below 10% of nominal.
2. Time from falling edge of TX_DISABLE to when the modulated optical output rises above 90% of nominal.
3. Time from power on or falling edge of Tx_Disable to when the modulated optical output rises above 90% of nominal.
4. From power on or negation of TX_FAULT using TX_DISABLE.
5. Time TX_DISABLE must be held high to reset the laser fault shutdown circuitry.
6. Time from loss of optical signal to Rx_LOS Assertion.
7. Time from valid optical signal to Rx_LOS De-Assertion.
8. Time from two-wire interface assertion of TX_DISABLE (A2h, byte 110, bit 6) to when the optical output falls below 10% of nominal. Measured from
falling clock edge after stop bit of write transaction.
9. Time from two-wire interface de-assertion of TX_DISABLE (A2h, byte 110, bit 6) to when the modulated optical output rises above 90% of nominal.
10. Time from fault to two-wire interface TX_FAULT (A2h, byte 110, bit 2) asserted.
11. Time for two-wire interface assertion of Rx_LOS (A2h, byte 110, bit 1) from loss of optical signal.
12. Time for two-wire interface de-assertion of Rx_LOS (A2h, byte 110, bit 1) from presence of valid optical signal.
13. From power on to data ready bit asserted (A2h, byte 110, bit 0). Data ready indicates analog monitoring circuitry is functional.
14. Time from power on until module is ready for data transmission over the serial bus (reads or writes over A0h and A2h).
15. Time from stop bit to completion of a 1-8 byte write command.
13
Table 9. Transceiver Digital Diagnostic Monitor (Real Time Sense) Characteristics
Parameter
Transceiver Internal Temperature
Accuracy
Transceiver Internal Supply
Voltage Accuracy
Symbol
TINT
Min.
±3.0
Units
˚C
Notes
Temperature is measured internal to the transceiver.
Valid from = -40˚C to 85 ˚C case temperature.
Supply voltage is measured internal to the transceiver
and can, with less accuracy, be correlated to
voltage at the SFP Vcc pin. Valid over 3.3 V ±5%.
IINT is better than ±10% of the nominal value.
VINT
±0.1
V
Transmitter Laser DC Bias Current
Accuracy
Transmitted Average Optical
Output Power Accuracy
Received Average Optical Input
Power Accuracy
IINT
±10
%
PT
±3.0
dB
Coupled into 50/125 µm multi-mode fiber.
Valid from 100 µW to 500 µW, avg.
PR
±3.0
dB
Coupled from 50/125 µm multi-mode fiber.
Valid from 31 µW to 500 µW, avg.
V CC > 3.15 V
V CC > 3.15 V
TX_FAULT
TX_FAULT
TX_DISABLE
TX_DISABLE
TRANSMITTED SIGNAL
TRANSMITTED SIGNAL
t_init
t_init
t-init: TX DISABLE NEGATED
t-init: TX DISABLE ASSERTED
V CC > 3.15 V
TX_FAULT
TX_FAULT
TX_DISABLE
TX_DISABLE
TRANSMITTED SIGNAL
TRANSMITTED SIGNAL
t_off
t_init
t_on
INSERTION
t-init: TX DISABLE NEGATED, MODULE HOT PLUGGED
t-off & t-on: TX DISABLE ASSERTED THEN NEGATED
OCCURANCE OF FAULT
OCCURANCE OF FAULT
TX_FAULT
TX_FAULT
TX_DISABLE
TX_DISABLE
TRANSMITTED SIGNAL
TRANSMITTED SIGNAL
t_fault
* SFP SHALL CLEAR TX_FAULT IN
t_init IF THE FAILURE IS TRANSIENT
t-fault: TX FAULT ASSERTED, TX SIGNAL NOT RECOVERED
t_reset
t_init*
t-reset: TX DISABLE ASSERTED THEN NEGATED, TX SIGNAL RECOVERED
OCCURANCE OF FAULT
OPTICAL SIGNAL
TX_FAULT
OCCURANCE OF LOSS
TX_DISABLE
LOS
TRANSMITTED SIGNAL
t_fault2
* SFP SHALL CLEAR Tx_FAULT IN
t_init IF THE FAILURE IS TRANSIENT
t_loss_on
t_reset
t-fault2: TX DISABLE ASSERTED THEN NEGATED,
TX SIGNAL NOT RECOVERED
t_init*
t-loss-on & t-loss-off
NOTE: t_fault2 timing is typically 1.7 to 2 ms.
Figure 6. Transceiver timing diagrams (Module installed except where noted).
14
t_loss_off
Table 10. EEPROM Serial ID Memory Contents, Page A0h
Byte # Data
Decimal Hex
Notes
Byte #
Decimal
Data
Hex
Notes
0
03
SFP physical device
37
00
Vendor OUI (Note 4)
1
04
SFP function defined by serial ID only
38
17
Vendor OUI (Note 4)
2
07
LC optical connector
39
6A
Vendor OUI (Note 4)
3
00
40
41
"A" - Vendor Part Number ASCII character
4
00
41
46
"F" - Vendor Part Number ASCII character
5
00
42
42
"B" - Vendor Part Number ASCII character
6
01
1000BaseSX
43
52
"R" - Vendor Part Number ASCII character
7
20
Intermediate distance (per FC-PI)
44
2D
"-" - Vendor Part Number ASCII character
8
40
Shortwave laser without OFC (open fiber control)
45
35
"5" - Vendor Part Number ASCII character
9
0C
Multi-mode 50 m and 62.5 m optical media
46
37
"7" - Vendor Part Number ASCII character
10
01
100 Mbytes/sec FC-PI speed[1]
47
30
"0" - Vendor Part Number ASCII character
11
01
Compatible with 8B/10B encoded data
48
Note 5
12
0C
1200Mbps nominal bit rate (1.25Gbps)
49
Note 5
13
00
50
Note 5
14
00
51
Note 5
15
00
52
20
" " - Vendor Part Number ASCII character
16
37
550m of 50/125µm fiber @ 1.25Gbps (Note 2)
53
20
" " - Vendor Part Number ASCII character
17
1B
275m of 62.5/125µm fiber @ 1.25Gbps (Note 3
54
20
" " - Vendor Part Number ASCII character
18
00
55
20
" " - Vendor Part Number ASCII character
19
00
56
20
" " - Vendor Revision Number ASCII character
20
41
'A' - Vendor Name ASCII character
57
20
" " - Vendor Revision Number ASCII character
21
56
"V" - Vendor Name ASCII character
58
20
" " - Vendor Revision Number ASCII character
22
41
"A" - Vendor Name ASCII character
59
20
" " - Vendor Revision Number ASCII character
23
47
"G"- Vendor Name ASCII character
60
03
Hex Byte of Laser Wavelength (Note 6)
24
4F
"O" - Vendor Name ASCII character
61
52
Hex Byte of Laser Wavelength (Note 6)
25
20
" " - Vendor Name ASCII character
62
00
26
20
" " - Vendor Name ASCII character
63
27
20
" " - Vendor Name ASCII character
64
00
28
20
" " - Vendor Name ASCII character
65
1A
29
20
" " - Vendor Name ASCII character
66
00
00
Checksum for bytes 0-62 (Note 7)
Hardware SFP TX_DISABLE, TX_FAULT,
& RX_LOS
30
20
" " - Vendor Name ASCII character
67
31
20
" " - Vendor Name ASCII character
68-83
Vendor Serial Number, ASCII (Note 8)
32
20
" " - Vendor Name ASCII character
84-91
Vendor Date Code, ASCII (Note 9)
33
20
" " - Vendor Name ASCII character
92
Note 5
34
20
" " - Vendor Name ASCII character
93
Note 5
35
20
" " - Vendor Name ASCII character
94
Note 5
36
00
95
96 - 255
Checksum for bytes 64-94 (Note 7)
00
Notes:
1. FC-PI speed 100 MBytes/sec is a serial bit rate of 1.0625 GBit/sec.
2. Link distance with 50/125µm cable at 1.25Gbps is 550m.
3. Link distance with 62.5/125µm cable at 1.25Gbps is 275m.
4. The IEEE Organizationally Unique Identifier (OUI) assigned to Avago Technologies is 00-17-6A (3 bytes of hex).
5. See Table 11 for part number extensions and data-fields.
6. Laser wavelength is represented in 16 unsigned bits. The hex representation of 850nm is 0352.
7. Addresses 63 and 95 are checksums calculated per SFF-8472 and SFF-8074, and stored prior to product shipment.
8. Addresses 68-83 specify the module’s ASCII serial number and will vary by unit.
9. Addresses 84-91 specify the module’s ASCII date code and will vary according to manufactured date-code.
15
Table 11. Part Number Extensions
AFBR-5701ALZ
Address
Hex
48
49
AFBR-5701APZ
ASCII
Address
Hex
AFBR-5701PZ
ASCII
Address
31
1
48
31
1
48
31
1
48
31
1
41
A
49
41
A
49
4C
L
49
50
P
ASCII
Address
Hex
Z
Z
50
4C
L
50
50
P
50
5A
50
5A
51
5A
Z
51
5A
Z
51
20
51
20
92
00
92
00
92
00
92
00
93
00
93
00
93
00
93
00
94
00
94
00
94
00
94
00
AFBR-5705ALZ
Address
Hex
48
49
16
Hex
AFBR-5701LZ
AFBR-5705APZ
AFBR-5705LZ
Address
Hex
35
5
48
35
5
48
35
41
A
49
41
A
49
4C
50
4C
L
50
50
P
50
5A
Z
Z
Z
51
5A
68
51
5A
92
68
93
94
F0
93
01
94
Address
Hex
AFBR-5705PZ
ASCII
92
ASCII
ASCII
ASCII
Address
Hex
5
48
35
5
L
49
50
P
50
5A
Z
51
20
51
20
92
68
92
68
F0
93
F0
93
F0
01
94
01
94
01
ASCII
Table 12. EEPROM Serial ID Memory Contents - Address A2h (AFBR-5705Z family only)
Byte #
Decimal
Notes
Byte #
Decimal
Notes
Byte #
Decimal
Notes
0
Temp H Alarm MSB1
26
Tx Pwr L Alarm MSB4
104
Real Time Rx PAV MSB5
1
Temp H Alarm LSB1
27
Tx Pwr L Alarm LSB4
105
Real Time Rx PAV LSB5
2
Temp L Alarm MSB1
28
Tx Pwr H Warning MSB4
106
Reserved
3
Temp L Alarm LSB1
29
Tx Pwr H Warning LSB4
107
Reserved
4
Temp H Warning MSB1
30
Tx Pwr L Warning MSB4
108
Reserved
5
Temp H Warning LSB1
31
Tx Pwr L Warning LSB4
109
Reserved
6
Temp L Warning MSB1
32
Rx Pwr H Alarm MSB5
110
Status/Control - see Table 13
7
Temp L Warning LSB1
33
Rx Pwr H Alarm LSB5
111
Reserved
8
VCC H Alarm MSB2
34
Rx Pwr L Alarm MSB5
112
Flag Bits - see Table 14
9
VCC H Alarm LSB2
35
Rx Pwr L Alarm LSB5
113
Flag Bit - see Table 14
10
VCC L Alarm MSB2
36
Rx Pwr H Warning MSB5
114
Reserved
11
VCC L Alarm LSB2
37
Rx Pwr H Warning LSB5
115
Reserved
12
VCC H Warning MSB2
38
Rx Pwr L Warning MSB5
116
Flag Bits - see Table 14
13
VCC H Warning LSB2
39
Rx Pwr L Warning LSB5
117
Flag Bits - see Table 14
14
VCC L Warning MSB2
40-55
Reserved
118
Reserved
15
VCC L Warning LSB2
56-94
External Calibration Constants6
119
Reserved
16
Tx Bias H Alarm MSB3
95
Checksum for Bytes 0-947
120-122
Reserved
17
Tx Bias H Alarm LSB3
96
Real Time Temperature MSB1
123
18
Tx Bias L Alarm MSB3
97
Real Time Temperature LSB1
124
19
Tx Bias L Alarm LSB3
98
Real Time Vcc MSB2
125
20
Tx Bias H Warning MSB3
99
Real Time Vcc LSB2
126
21
Tx Bias H Warning LSB3
100
Real Time Tx Bias MSB3
127
Reserved8
22
Tx Bias L Warning MSB3
101
Real Time Tx Bias LSB3
128-247
Customer Writable9
23
Tx Bias L Warning LSB3
102
Real Time Tx Power MSB4
248-255
Vendor Specific
24
Tx Pwr H Alarm MSB4
103
Real Time Tx Power LSB4
25
Tx Pwr H Alarm LSB4
Notes:
1. Temperature (Temp) is decoded as a 16 bit signed twos compliment integer in increments of 1/256 °C.
2. Supply voltage (VCC) is decoded as a 16 bit unsigned integer in increments of 100 µV.
3. Laser bias current (Tx Bias) is decoded as a 16 bit unsigned integer in increments of 2 µA.
4. Transmitted average optical power (Tx Pwr) is decoded as a 16 bit unsigned integer in increments of 0.1 µW.
5. Received average optical power (Rx Pwr) is decoded as a 16 bit unsigned integer in increments of 0.1 µW.
6. Bytes 55-94 are not intended from use with AFBR-5705Z, but have been set to default values per SFF-8472.
7. Bytes 95 is a checksum calculated (per SFF-8472) and stored prior to product shipment.
8. Byte 127 accepts a write but performs no action (reserved legacy byte).
9. Bytes 128-247 are write enabled (customer writable).
17
Table 13. EEPROM Serial ID Memory Contents - Address A2h, Byte 110 (AFBR-5705Z family only)
Bit #
Status/Control Name
Description
7
Tx Disable State
Digital state of SFP Tx Disable Input Pin (1 = Tx_ Disable asserted)
6
Soft Tx Disable
Read/write bit for changing digital state of SFP Tx_Disable function1
5
Reserved
4
Rx Rate Select State
3
Reserved
2
Tx Fault State
Digital state of the SFP Tx Fault Output Pin (1 = Tx Fault asserted)
1
Rx LOS State
Digital state of the SFP LOS Output Pin (1 = LOS asserted)
0
Data Ready (Bar)
Indicates transceiver is powered and real time sense data is ready (0 = Ready)
Digital state of SFP Rate Select Input Pin (1 = full bandwidth of 155 Mbit)2
Notes:
1. Bit 6 is logic OR’d with the SFP Tx_Disable input pin 3 ... either asserted will disable the SFP transmitter.
2. AFBR-5705Z does not respond to state changes on Rate Select Input Pin. It is internally hardwired to full bandwidth.
Table 14. EEPROM Serial ID Memory Contents - Address A2h, Bytes 112, 113, 116, 117 (AFBR-5705Z family only)
Byte
Bit # Flag Bit Name
Description
112
7
Temp High Alarm
Set when transceiver nternal temperature exceeds high alarm threshold.
6
Temp Low Alarm
Set when transceiver internal temperature exceeds alarm threshold.
5
VCC High Alarm
Set when transceiver internal supply voltage exceeds high alarm threshold.
4
VCC Low Alarm
Set when transceiver internal supply voltage exceeds low alarm threshold.
3
Tx Bias High Alarm
Set when transceiver laser bias current exceeds high alarm threshold.
2
Tx Bias Low Alarm
Set when transceiver laser bias current exceeds low alarm threshold.
1
Tx Power High Alarm
Set when transmitted average optical power exceeds high alarm threshold.
0
Tx Power Low Alarm
Set when transmitted average optical power exceeds low alarm threshold.
7
Rx Power High Alarm
Set when received P_Avg optical power exceeds high alarm threshold.
6
Rx Power Low Alarm
Set when received P_Avg optical power exceeds low alarm threshold.
0-5
Reserved
7
Temp High Warning
Set when transceiver internal temperature exceeds high warning threshold.
6
Temp Low Warning
Set when transceiver internal temperature exceeds low warning threshold.
5
VCC High Warning
Set when transceiver internal supply voltage exceeds high warning threshold.
4
VCC Low Warning
Set when transceiver internal supply voltage exceeds low warning threshold.
3
Tx Bias High Warning
Set when transceiver laser bias current exceeds high warning threshold.
2
Tx Bias Low Warning
Set when transceiver laser bias current exceeds low warning threshold.
1
Tx Power High Warning
Set when transmitted average optical power exceeds high warning threshold.
0
Tx Power Low Warning
Set when transmitted average optical power exceeds low warning threshold.
7
Rx Power High Warning
Set when received P_Avg optical power exceeds high warning threshold.
9
Rx Power Low Warning
Set when received P_Avg optical power exceeds low warning threshold.
0-5
Reserved
113
116
117
18
AVAGO
AFBR-570xZ
850 nm LASER PROD
21CFR(J) CLASS 1
COUNTRY OF ORIGIN YYWW
TUV
XXXXXX
UL
13.8±0.1
[0.541±0.004]
DEVICE SHOWN WITH
DUST CAP AND BAIL
WIRE DELATCH
13.4±0.1
[0.528±0.004]
2.60
[0.10]
55.2±0.2
[2.17±0.01]
FRONT EDGE OF SFP
TRANSCEIVER CAGE
6.25±0.05
[0.246±0.002]
0.7 MAX. UNCOMPRESSED
[0.028]
13.0±0.2
[0.512±0.008]
TX
8.5±0.1
[0.335±0.004]
RX
AREA
FOR
PROCESS
PLUG
6.6
[0.261]
13.50
[0.53]
14.8 MAX. UNCOMPRESSED
[0.583]
STANDARD DELATCH
12.1±0.2
[0.48±0.01]
Figure 7. Module drawing
19
DIMENSIONS ARE IN MILLIMETERS (INCHES)
X
Y
34.5
3x 10
7.2
10x 1.05 ± 0.01
Æ 0.1 S X A S
B
1
16.25
MIN.PITCH
7.1
2.5
Æ 0.85 ± 0.05
Æ 0.1 S X Y
A
1
2.5
PCB
EDGE
3.68
5.68
20
PIN 1
8.58
16.25 14.2511.08
REF.
2x 1.7
8.48
9.6
4.8
11
10
11x 2.0
11x 2.0
5
26.8
3
11.93
SEE DET AIL 1
9x 0.95 ± 0.05
Æ 0.1 L X A S
2
3x 10
41.3
42.3
3.2
5
0.9
PIN 1
9.6
20x 0.5 ± 0.03
0.06 S A S B S
20
10.53
10.93
0.8
TYP.
10
11.93
11
4
2 ± 0.05 TYP.
0.06 L A S B S
2x 1.55 ± 0.05
Æ 0.1 L A S B S
DETAIL 1
Figure 8. SFP host board mechanical layout
20
NOTES
1. PADS AND VIAS ARE CHASSIS GROUND
2. THROUGH HOLES, PLATING OPTIONAL.
3. HATCHED AREA DENOTES COMPONENT AND
TRACE KEEPOUT (EXCEPT CHASSIS GROUND).
4. AREA DENOTES COMPONENT KEEPOUT
(TRACES ALLOWED).
DIMENSIONS IN MILLIMETERS
1.7 ± 0.9
(0.07 ± 0.04)
PCB
3.5 ± 0.3
(0.14 ± 0.01)
41.73 ± 0.5
(1.64 ± 0.02)
BEZEL
15 MAX.
(0.59)
AREA
FOR
PROCESS
PLUG
CAGE ASSEMBLY
15.25 ± 0.1
(0.60 ± 0.004)
11 REF.
(0.43)
10.4 ± 0.1
(0.41 ± 0.004)
9.8 MAX.
(0.39)
1.5 REF.
(0.06)
BELOW PCB
10 REF
(0.39)
TO PCB
0.4 ± 0.1
(0.02 ± 0.004)
BELOW PCB
16.25 ± 0.1 MIN. PITCH
(0.64 ± 0.004)
MSA-SPECIFIED BEZEL
DIMENSIONS ARE IN MILLIMETERS (INCHES).
Figure 9. Assembly drawing.
21
Ordering Information
Please contact your local field sales engineer or one of Avago Technologies franchised distributors for ordering
information. For technical information, please visit Avago Technologies’ web-page at www.avagotech.com or
contact one of Avago Technologies’ regional Technical Response Centers. For information related to SFF Committee
documentation visit www.sffcommittee.org.
AFBR-5705LZ
AFBR-5705PZ
AFBR-5705ALZ
AFBR-5705APZ
AFBR-5701LZ
AFBR-5701PZ
AFBR-5701ALZ
AFBR-5701APZ
DMI
DMI
DMI
DMI
No DMI
No DMI
No DMI
No DMI
Extended Temperature (-10°C to 85°C)
Extended Temperature (-10°C to 85°C)
Industrial Temperature (-40°C to 85°C)
Industrial Temperature (-40°C to 85°C)
Extended Temperature (-10°C to 85°C)
Extended Temperature (-10°C to 85°C)
Industrial Temperature (-40°C to 85°C)
Industrial Temperature (-40°C to 85°C)
Standard Delatch
Bail Delatch
Standard Delatch
Bail Delatch
Standard Delatch
Bail Delatch
Standard Delatch
Bail Delatch
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Pte. in the United States and other countries.
Data subject to change. Copyright © 2006 Avago Technologies Pte. All rights reserved.
AV01-0093EN - May 7, 2006
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