ATMEL ATZB-X0-256-3-0-C Zigbit 2.4ghz wireless module Datasheet

ZIGBIT 2.4GHZ WIRELESS MODULES
ATZB-X0-256-3-0-C
DATASHEET
Features
•
•
•
•
•
•
Compact size (33.0 x 20.0mm)
High RX sensitivity (- 96dBm)
Outperforming link budget (up to 99.6dB)
Up to +3.6dBm output power
Very low power consumption:
• 6.3mA in RX mode(1)
• 20.5mA in TX mode(1)
• 0.3µA in sleep mode(2)
Ample memory resources:
• 256KBytes in-system self-programmable Flash memory, 4KBytes EEPROM,
16KBytes SRAM
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Wide range of interfaces (both analog and digital):
• 4- wire SPI, TWI
• ISP, JTAG
• Two analog comparator input
• UART, USART
• Timer, PWM
• Four ADC lines
• External clock input, internal clock output
• Up to 32 lines configurable as GPIO
Preassigned Atmel® MAC address that can be used on end product
Capability to use MAC address into the internal EEPROM
IEEE® 802.15.4 compliant transceiver
2.4GHz ISM band
Serial bootloader
High performance, low power Atmel® AVR® XMEGA® 8/16-bit Microcontroller
Rapid design-in with built-in chip antenna
RF test point using MS-147 RF connector
Small physical footprint and low profile for optimum fit in very small application
boards
Mesh networking capability
Easy-to-use low cost development kit
Single source of support for HW and SW
Worldwide license-free operation
Notes: 1. MCU is in active state with 3V Supply, CPU clock @ 16MHz, RX RPC enabled (for RX current),
PHY_TX_PWR=0x0 (for TX current), All digital outputs pulled high.
2. Controller Sleep Mode: SLEEP_MODE_PWR_DOWN.
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Table of Contents
1. Introduction ........................................................................................ 3
1.1
1.2
1.3
1.4
Summary ........................................................................................................... 3
Applications ....................................................................................................... 3
Abbreviations and Acronyms ............................................................................ 3
Related Documents........................................................................................... 5
2. ZigBit Module Overview ..................................................................... 6
2.1
Overview ........................................................................................................... 6
3. Specification....................................................................................... 8
3.1
3.2
3.3
3.4
3.5
3.6
3.7
Electrical Characteristics ................................................................................... 8
3.1.1
Absolute Maximum Ratings ................................................................ 8
3.1.2
Power Supply...................................................................................... 8
3.1.3
RF Characteristics .............................................................................. 9
3.1.4
ATXMEGA256A3U Microcontroller Characteristics .......................... 10
3.1.5
Module Interfaces Characteristics ..................................................... 10
Physical/Environmental Characteristics and Outline ....................................... 10
Pin Configuration............................................................................................. 11
Antenna orientation recommendation ............................................................. 12
Mounting Information ...................................................................................... 12
Soldering Profile .............................................................................................. 15
Antenna Reference Designs ........................................................................... 16
4. Schematics ...................................................................................... 16
4.1
4.2
Handling Instructions....................................................................................... 17
General Recommendations ............................................................................ 17
5. Persistence Memory ........................................................................ 17
6. Ordering Information ........................................................................ 19
7. Agency Certifications ....................................................................... 20
7.1
7.2
7.3
United States (FCC) ........................................................................................ 20
European Union (ETSI) ................................................................................... 21
Industry Canada (IC) Compliance statements ................................................ 21
8. Revision History ............................................................................... 23
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1.
Introduction
1.1
Summary
ATZB-X0-256-3-0-C ZigBit® is an ultra-compact and low-power 2.4GHz IEEE 802.15.4/ZigBee® OEM module from
Atmel. Based on the innovative mixed-signal hardware platform from Atmel, this module uses the ATxmega256A3U [1]
Microcontroller and AT86RF233 [5] 2.4GHz ISM band transceiver. The radio transceiver provides high data rates from
250kb/s up to 2Mb/s, frame handling, outstanding receiver sensitivity and high transmit output power enabling a very
robust wireless communication. The module is designed for wireless sensing, monitoring, control, data acquisition
applications, to name a few. This ZigBit module eliminates the need for costly and time-consuming RF development,
and shortens time-to-market for wireless applications.
The module has an MS-147 RF connector that can be used as an RF test port. The built-in chip antenna is designed
and tuned for the ZigBit design to enable quick integration of the ZigBit into any application.
1.2
Applications
The ZigBit module is compatible with robust IEEE 802.15.4/ZigBee stack that supports a self-healing, self-organizing
mesh network, while optimizing network traffic and minimizing power consumption.
For detailed software support information, please visit http://www.atmel.com/products/wireless.
The application areas include, but are not limited to:
•
•
•
•
•
•
•
•
1.3
Building automation and monitoring
o Lighting controls
o Wireless smoke- and CO-detectors
o Structural integrity monitoring
HVAC monitoring & control
Inventory management
Environmental monitoring
Security
Water metering
Industrial monitoring
o Machinery condition and performance monitoring
o Monitoring of plant system parameters such as temperature, pressure, flow, tank level, humidity, vibration, etc.
Automated meter reading (AMR)
Abbreviations and Acronyms
ADC
Analog-to-Digital Converter
API
Application Programming Interface
DC
Direct Current
DTR
Data Terminal Ready
EEPROM
Electrically Erasable Programmable Read-Only Memory
ESD
Electrostatic Discharge
GPIO
General Purpose Input/Output
HAF
High Frequency
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HVAC
Heating, Ventilating, and Air Conditioning
HW
Hardware
I2 C
Inter-Integrated Circuit
IEEE
Institute of Electrical and Electronics Engineers
IRQ
Interrupt Request
ISM
Industrial, Scientific and Medical radio band
JTAG
Digital interface for debugging of embedded device, also known as IEEE 1149.1 standard
interface
MAC
Medium Access Control layer
MCU
Microcontroller Unit. In this document it also means the processor, which is the core of a ZigBit
module
NRE
Network layer
OEM
Original Equipment Manufacturer
OTA
Over-The-Air upgrade
PA
Power Amplifier
PCB
Printed Circuit Board
PER
Package Error Ratio
RAM
Random Access Memory
RF
Radio Frequency
RPC
Reduced Power Consumption
RTS/CTS
Request to Send/ Clear to Send
RX
Receiver
SMA
Surface Mount Assembly
SoC
System on Chip
SPI
Serial Peripheral Interface
SW
Software
TTM
Time-To-Market
TX
Transmitter
UART
Universal Asynchronous Receiver/Transmitter
USART
Universal Synchronous/Asynchronous Receiver/Transmitter
USB
Universal Serial Bus
ZigBee, ZigBee PRO
Wireless networking standards targeted at low-power applications
802.15.4
The IEEE 802.15.4-2003 standard applicable to low-rate wireless Personal Area Network
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1.4
Related Documents
[1] ATXMEGA256A3U Datasheet in http://www.atmel.com/Images/Atmel-8386-8-and-16-bit-AVR-MicrocontrollerATxmega64A3U-128A3U-192A3U-256A3U_datasheet.pdf
[2] MS-147 Series Interface RF Connector with Switch, 3.9mm High, DC to 6GHz
http://www.hirose.co.jp/cataloge_hp/e35801505.pdf
[3] IEEE Std 802.15.4-2003 IEEE Standard for Information technology - Part 15.4 Wireless Medium Access Control
(MAC) and Physical Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks (LR-WPANs)
[4] ZigBee Specification. ZigBee Document 053474r17, October 19, 2007
[5] AT86RF233 Datasheet in http://www.atmel.com/Images/Atmel-8351-MCU_Wireless-AT86RF233_Datasheet.pdf
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2.
ZigBit Module Overview
2.1
Overview
The ATZB-X0-256-3-0-C ZigBit is a compact, low-power, high sensitivity IEEE 802.15.4/ZigBee OEM module. Based on
a solid combination of the latest Atmel MCU Wireless hardware platform, 2.4GHz ISM band transceiver and Atmel
Studio Wireless Composer - the ZigBit offers an unmatched combination of superior radio performance, ultra-low power
consumption and exceptional ease of integration.
Figure 2-1. ATZB-X0-256-3-0-C Block diagram
.
This ZigBit module contains Atmel’s ATxmega256A3U Microcontroller and AT86RF233 2.4GHz ISM band Transceiver
for ZigBee and IEEE 802.15.4 [1]. The module features 256KB in-system self-programmable Flash memory, 16KB
SRAM and 4KB EEPROM.
The compact all-in-one board design of MCU and radio transceiver with very minimal components on the RF path to
Antenna dramatically improves the ZigBit’s compact size, range performance on signal transmission and increases its
sensitivity. This ensures stable connectivity within a larger coverage area, and helps develop applications on smaller
footprint. The MS-147 connector [2] can be used as an RF Test port.
ZigBit Module contains a complete RF/MCU design with all the necessary passive components included. The module
can be easily mounted on a simple 2-layer PCB with a minimum of required external connection. The ZigBit Module
evaluation kit containing the ZigBit extension board for the Atmel Xplained PRO HW evaluation platform can be used to
develop FW using the Atmel Studio and evaluate using the Wireless Composer. Compared to a custom RF/MCU
solution, a module-based solution offers considerable savings in development time and NRE cost per unit during the
HW/FW design, prototyping, and mass production phases of product development.
All ZigBits are preloaded with a bootloader when they are sold as modules, either in single units or T&R.
Depending on end-user design requirements, the ZigBit can operate as a self-contained sensor node, where it would
function as a single MCU, or it can be paired with a host processor driving the module over a serial interface.
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The MAC stack running on the host processor can then control data transmission and manages module peripherals.
Thus very minimal firmware customization is required for successful module design-in. Third-party sensors can then be
connected directly to the module, thus expanding the existing set of peripheral interfaces.
Every ZigBit Module come pre loaded with Atmel assigned 64-bit MAC address stored in the signature bytes of the
device. This unique IEEE MAC address can be used as the MAC address of the end product, so there is no need to buy
a MAC address separately for the product using the ZigBit.
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3.
Specification
3.1
Electrical Characteristics
3.1.1
Absolute Maximum Ratings
Table 3-1.
Notes:
3.1.2
Absolute Maximum Ratings
(1)(2)
Parameter
Minimum
Maximum
Voltage on any pin, except RESET with respect to ground
-0.3V
3.6V (VDD max)
Input RF level
+10dBm
Current into Vcc pins
200mA
1.
Absolute Maximum Ratings are the values beyond which damage to the device may occur. Under no
circumstances must the absolute maximum ratings given in this table be violated. Stresses beyond those listed
under "Absolute Maximum Ratings" may cause permanent damage to the device.
This is a stress rating only. Functional operation of the device at these or other conditions, beyond those indicated
in the operational sections of this specification, is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
2.
Attention! ZigBit is an ESD-sensitive device. Precaution should be taken when handling the device in order to
prevent permanent damage.
Power Supply
Table 3-2.
°
Test Conditions (unless otherwise stated), Vcc = 3V, Tamb = 25 C.
Parameter
Range
Unit
Supply voltage, VDD
1.8 to 3.6
V
Active Current consumption: RX mode – BUSY_RX - Receive state
16.5
mA
Active Current consumption: RX mode - RX_ON with RPC, MCU Active
11.8
mA
Active Current consumption: RX mode - RX_ON, MCU Active
17.0
mA
Active Current consumption: RX mode - RX_ON with RPC, MCU Power_down
6.1
mA
Active Current consumption: RX mode - RX_ON, MCU Power_down
11.3
mA
20.5
mA
Active Current consumption: TX mode – PLL_ON
5.6
mA
Current consumption: TRX_OFF, MCU Active
5.5
mA
443
µA
0.3
µA
0.3
µA
380
µA
380
µA
8.5
µA
8.5
µA
388
µA
388
µA
Active Current consumption: TX mode
(1)
– BUSY_TX – Transmit state
Current consumption: TRX_OFF, MCU Power_down
Sleep Current consumption: TRX Sleep, MCU Power_down
Sleep Current consumption: TRX Sleep, MCU Power_save
Sleep Current consumption: TRX Sleep, MCU Standby
(2)
(2)
(2)
Sleep Current consumption: TRX Sleep, MCU Extended_Standby
Sleep Current consumption: TRX Deep_Sleep, MCU Power_down
Sleep Current consumption: TRX Deep_Sleep, MCU Power_save
Sleep Current consumption: TRX Deep_Sleep, MCU Standby
(2)
(2)
(2)
(2)
Sleep Current consumption: TRX Deep_Sleep, MCU Extended_Standby
(2)
Note 1: Output TX power (when measuring consumption in TX mode) is +3 dBm.
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Note 2:
a)
All interfaces are set to the default state (see Pin Assignment Table).
b)
JTAG is not connected.
c)
CPU Clock configured when doing this measurement – 16MHz for all modes except Power save and Power down modes
Current consumption depends on multiple factors, including but not limited to, the board design and materials, Protocol settings,
network activity, EEPROM read/write operations. It also depends on MCU load and/or peripherals used by an application.
3.1.3
RF Characteristics
Table 3-3.
RF Characteristics
(1)
.
Parameter
Condition
Typical Values
Unit
Frequency band
2.4000 to 2.4835
GHz
Numbers of channels
16
Channel spacing
5
MHz
Transmitter output power
Adjusted in 16 steps
-17 to +4
dBm
Receiver sensitivity
PER = 1%
-96
dBm
250, upto 2000
Kbps
50
Ω
On-air data rate
TX output/ RX input nominal impedance
Range
For balanced
Open field, LoS, Elevated
48 – 178
#
m
Note # Range measured is Line of Sight and at 10ft elevation from Ground at different combinations of orientations of transmitter and
receiver, with special conditions were there is minimal or no RF interference from other sources. For best case orientation of the ZigBits
to achieve maximum range, refer to section 3.4
Table 3-4.
TX power settings
PHY_TX_PWR 3:0 Register value
Power register setting
[dBm]
Typical Output power [dBm]
(values at RF connector)
0
+4
+3
1
+3.7
+2.9
2
+3.4
+2.7
3
+3
+2.6
4
+2.5
+2.5
5
+2
+0.4
6
+1
-0.3
7
0
-1
8
-1
-2
9
-2
-3.0
10
-3
-4.
11
-4
-5.7
12
-6
-7.5
13
-8
-9.8
14
-12
-13.0
15
-17
-17.9
Note 1: For detailed characteristics, refer to [2].
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3.1.4
ATXMEGA256A3U Microcontroller Characteristics
Table 3-5.
ATXMEGA256A3U Characteristics.
Parameter
Range
Unit
On-chip flash memory size
256K
Bytes
On-chip RAM size
16K
Bytes
On-chip EEPROM size
4K
Bytes
Operation frequency
16
MHz
3.1.5
Module Interfaces Characteristics
Table 3-6.
Module Interfaces Characteristics
Parameters
(1)
.
Condition
UART maximum baud rate
Range
Unit
115.2
Kbps
ADC conversion time (latency)
(RES+2)/2+(GAIN !=0)
RES (Resolution) = 8 or 12
5-8
ClkADC cycles
ADC input resistance
Static load resistor of input signal
4.0
kΩ
ADC reference voltage (VREF)
1.0 to AVcc – 0.6
V
ADC input voltage
0 - AVDD
V
TWI maximum clock
400
kHz
GPIO High level input voltage
Vcc = 2.7-3.6V
2 to Vcc+0.3
V
GPIO Low level input voltage
Vcc = 2.7-3.6V
-0.3 to 0.3 VDD
V
GPIO High level output voltage VOH
Vcc = 3.0-3.6V
2.4 to 0.94Vcc
V
GPIO Low level output voltage VOL
Vcc = 3.0-3.6V
0.05Vcc typ
Max 0.4
V
32.768
kHz
Real-time oscillator frequency
Note 1: For detailed characteristics, refer to [1].
3.2
Physical/Environmental Characteristics and Outline
Table 3-7.
Physical characteristics.
Parameters
Value
Size
33.0 x 20.0 mm
Operating temperature range
-40°C to +85°C
Comments
-40°C to +85°C operational
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3.3
Pin Configuration
Table 3-8.
Pin Out
ATZB-X0-256-3-0-C Pinout description
Pin descriptions
Function
1
AVSS
Analog Ground
2
AVSS
Analog Ground
3
DEVDD
Digital Power input pin
4
DEVDD
Digital Power input pin
5
RSET/PDI_CLOCK
RESET
6
PD4/SS
SPI
7
PD5/MOSI/XCK1
SPI
8
PD6/MISO/RXD1/D-
SPI
9
PD7/SCK/TXD1/D+
SPI
10
PA5
GPIO / ADC / Analog COMP+
11
PA4
GPIO/ADC/Analog Comp-
12
DVSS
Digital Ground
13
PD2/SYNC/ASYNC/OC0C/
UART
14
PD3/SYNC/TXD0/OC0D
UART
15
PD1/SCL/INT/OC0B
USART
16
17
PDI_DATA
PA6
PWM/TC
GPIO/ADC
18
PA7
GPIO/ADC
19
PB3
GPIO/ADC/DAC1
20
PB2
GPIO/ADC/DAC/intwkup
21
PF1/OC0B/INT/XCK0
INT/PWM/GPIO
22
PF2/OC0C/INT/RXD0
INT/PWM/GPIO
23
PF3/OC0D/INT/TXD0
INT/PWM/GPIO
24
25
PB0/IAREF/INT
PA0/ADC0/INT
Adc ref
ADC/ GPIO
26
PA1/ADC1/INT
ADC/ GPIO
27
PA2/ADC2/INT
ADC/ GPIO
28
PA3/ADC3/INT
ADC/ GPIO
29
DVSS
Digital Ground
30
PB6/TCK/INT
JTAG
31
PB4/TMS/INT
JTAG
32
PB7/TDO/INT
JTAG
33
PB5/TDI/INT
JTAG
34
PE3/TXD
GPIO/output counter
35
36
PE2/RXD
PE1/XCK
Wakeup INT
TWI/INT/GPIO
37
PE0
TWI/INT/GPIO
38
PE5/OC1B/INT
GPIO/TC
39
PE4/SYNC/OC1A
Master Clock out put
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Pin Out
3.4
Pin descriptions
Function
40
PF0
GPIO/Timer
41
DVSS
Digital Ground
42
DVSS
Digital Ground
Antenna orientation recommendation
The Antenna in this module is designed to provide the best possible LoS range in the direction indicated in this
illustration.
3.5
Mounting Information
The Figures below shows the PCB layout recommended for a ZigBit module. Neither via-holes nor wires are allowed on
the PCB upper layer in the area occupied by the module. As a critical requirement, RF_GND pins should be grounded
via several via-holes to be located right next to the pins thus minimizing inductance and preventing both mismatch and
losses.
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Figure 3-1. ATZB-X0-256-3-0-C Dimensions
Figure 3-2. ATZB-X0-256-3-0-C Pinout
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Figure 3-3. ATZB-X0-256-3-0-C Foot Print Dimensions
Figure 3-4. ATZB-X0-256-3-0-C Mounting Information (Preferred Placement)
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Figure 3-5. Figure 3-4. ATZB-X0-256-3-0-C Mounting Information (Alternative Placement)
The ZigBit’s location and orientation on the carrier board is illustrated in the above Mounting information drawing. The
Recommended placement of ZigBit on Carrier Board needs to be accurately followed to ensure performance on the end
application
Please note the areas in the Mounting information drawing for copper and component keep out to ensure superior
performance of the ZigBits on your End application. Copper keep out recommended in the drawing applies for all layers
of the carrier board
The dimension A of the carrier board should be equal to or greater than 20mm. Similarly, the dimension B should be
equal to or greater than 33mm
3.6
Soldering Profile
The J-STD-020C-compliant soldering profile is recommended according to Table 3-9.
Table 3-9.
Soldering profile
(1)
Profile feature
Green package
Average ramp-up rate (217°C to peak)
3°C/s max
Preheat temperature 175°C ±25°C
180s max
Temperature maintained above 217°C
60s to 150s
Time within 5°C of actual peak temperature
20s to 40s
Peak temperature range
260°C
Ramp-down rate
6°C/s max
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Profile feature
Green package
Time within 25°C to peak temperature
8 minutes
Note:
3.7
1.
The package is backward compatible with PB/Sn soldering profile.
Antenna Reference Designs
Multiple factors affect proper antenna match, hence, affecting the antenna pattern. The particular factors are the board
material and thickness, shields, the material used for enclosure, the board neighborhood, and other components
adjacent to antenna. Following guidelines need to be followed when designing the base board for the ZigBit.
General Recommendations:
•
Metal enclosure should not be used. Using low profile enclosure might also affect antenna tuning.
•
Placing high profile components next to antenna should be avoided.
•
Having holes/vias punched around the periphery of the board eliminates parasitic radiation from the board
edges also distorting antenna pattern.
•
ZigBit module should not be placed next to consumer electronics which might interfere with ZigBit’s RF band
frequency.
The board design should prevent propagation of microwave field inside the board material. Electromagnetic waves of
high frequency may penetrate the board thus making the edges of the board radiate, which may distort the antenna
pattern. To eliminate this effect, metalized and grounded holes/vias must be placed around the board's edges.
4.
Schematics
The following schematic drawings for the ATZB-X0-256-3-0-C are in the following order:
• Top level schematics
• Connector schematics
• ATxmega256A3BU schematics
• AT86RF233 schematics
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1
2
3
4
5
6
7
8
A
A
CONNECTOR
XMEGA233
SPI INTERFACE
RF
SPI INTERFACE
GPIO/ADC
GPIO/ADC
B
B
GPIO/ADC/ANALOGCOMP
GPIO/ADC/ANALOGCOMP
GPIO/ADC/DAC
GPIO/ADC/DAC
INT/PWM/GPIO
INT/PWM/GPIO
TRX_I/F
JTAG
JTAG
TWI
TWI
UART/USART
TRX_I/F
UART/USART
PDI/GPIO
PDI/GPIO
Xmega_233_RF.SchDoc
Xmega_233_Connector.SchDoc
Xmega_233_MCU.SchDoc
C
C
COPCB200
PCB200
COLABEL1
LABEL1
a
Product number/revision
Serial number
D
Label ZigBit Shield
B
ATMEL R&D
OJS
RMZ Millenia
MSK
Perungudi
*
D
Chennai
ZigBit Xmega 2.4GHz board PCB
Date:
4/5/2013
Document number: *
4:38:22 PM
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TITLE: ATZB-X0-256-3-0-C
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1
2
3
4
5
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7
8
A
A
COZ200
Z200
PD4
PD5
POSPI
POSPI
INTERFACE0PD4
INTERFACE0PD5
INTERFACE0PD6
INTERFACE
SPIINTERFACE0PD7
INTERFACE
SPI INTERFACE
PD6
PD7
PD1
POUART0USART0PD3
POUART0USART0PD2
POUART0USART0PD1
POUART0USART
UART/USART
UART/USART
PD2
PD3
B
PA0
PA1
PA2
GPIO/ADC
POGPIO0ADC0PA7
POGPIO0ADC0PA6
POGPIO0ADC0PA3
POGPIO0ADC0PA2
POGPIO0ADC0PA1
POGPIO0ADC0PA0
POGPIO0ADC0AREF
POGPIO0ADC
GPIO/ADC
PA3
PA6
PA7
AREF
POGPIO0ADC0DAC0PB3
POGPIO0ADC0DAC0PB2
POGPIO0ADC0DAC
GPIO/ADC/DAC
PB2
GPIO/ADC/DAC
PB3
GND
PD4_SS
GND
PD5_MOSI_XCK1
VCC_3V3
USBD_N
VCC_3V3
USBD_P
POGPIO0ADC0ANALOGCOMP0PA5
POGPIO0ADC0ANALOGCOMP0PA4
POGPIO0ADC0ANALOGCOMP
GPIO/ADC/ANALOGCOMP
GPIO/ADC/ANALOG COMP
PA4
PA5
2
PIZ20002
3
PIZ20003
PIZ20004
4
nRST
5
PIZ20005
PD4_SS
PIZ20006
PD1_XCK0
6
GND
GND
GND
GND
VDD
PF0
VDD
PE4/SYNC/OC1A
RSET/PDI_CLOCK
PE5/OC1B/INT
PD4/SS
PE0/SDA
7
PD5_MOSI_XCK1PIZ20007
PD5/MOSI/XCK1
PD2_RXD0
8
USBD_N
PIZ20008
USBD_P
PIZ20009
9
PD3_TXD0
PA0_ADC0_INT
PA5
10
PIZ200010
PA1_ADC1_INT
PA4
PIZ200011
PA2_ADC2_INT
11
GND
12
PIZ200012
13
PA3_ADC3_INT
PD2_RXD0
PIZ200013
PA6
PD3_TXD0
14
PIZ200014
PA7
PD1_XCK0
15
PIZ200015
PB0_AREF_INT
PDI_DATA
16
PIZ200016
PA6
17
PIZ200017
PA7
PIZ200018
PB2
18
PB3
19
PIZ200019
PB2
20
PIZ200020
PB3
PF1_OC0B_INT_XCK0
C
1
PIZ20001
21
PIZ200021
PE1/SCL
PD6/MISO/RXD1/D-
PE2/ASYNC
PD7/SCK/TXD1/D+
PE3
PA5
PB5/TDI/INT
PA4
PB7/TDO/INT
GND
PB4/TMS/INT
PD2/RXD0
PB6/TCK/INT
PD3/TXD0
GND
PD1/XCK0
PA3/ADC3/INT
PDI_DATA
PA2/ADC2/INT
PA6
PA1/ADC1/INT
PA7
PA0/ADC0/INT
PB3
PB0/IAREF/INT
PB2
PF3/OC0D/INT/TXD0
PF1/OC0B/INT/XCK0
PF2/OC0C/INT/RXD0
42
GND
PIZ200042
41
PIZ200041
40
PE1_SCL
PF0
PIZ200039
39
PE4_SYNC_OC1A
38
PIZ200038
PE5_OC1B_INT
37
PIZ200037
PE0_SDA
36
PIZ200036
PE1_SCL
35
PIZ200035
PE2_ASYNC
PIZ200034
34
PE3_GPIO
33
PIZ200033
PB5_TDI_INT
32
PB7_TDO_INT
PB4_TMS_INT
30
29
PIZ200029
28
PIZ200028
27
PIZ200027
26
PIZ200026
25
PB5_TDI_INT
PB6_TCK_INT
PB7_TDO_INT
GND
PF1_OC0B_INT_XCK0
PF2_OC0C_INT_RXD0
PA2_ADC2_INT
PE0
PE1
TWI
PE2
POTWI0PE3
POTWI0PE2
POTWI0PE1
POTWI0PE0
POTWI
TWI
PE3
nRST
B
PB4
PB5
JTAG
JTAG
POJTAG0PB7
POJTAG0PB6
POJTAG0PB5
POJTAG0PB4
POJTAG0NRST
POJTAG
PB6
PB7
PF3_OC0D_INT_TXD0
PF1
PF2
INT/PWM/GPIO
POINT0PWM0GPIO0PF3
POINT0PWM0GPIO0PF2
POINT0PWM0GPIO0PF1
POINT0PWM0GPIO
INT/PWM/GPIO
PF3
PA1_ADC1_INT
24
PIZ200024
PB0_AREF_INT
22
nRST
PA3_ADC3_INT
PA0_ADC0_INT
PIZ200022
PE3_GPIO
PB6_TCK_INT
PIZ200025
23
PIZ200023
PE2_ASYNC
PB4_TMS_INT
PIZ200032
31
PIZ200031
PIZ200030
PE0_SDA
GND
PIZ200040
PF0
PF0
PDI_DATA
PF3_OC0D_INT_TXD0
PE4_SYNC_OC1A
PF2_OC0C_INT_RXD0
PE5_OC1B_INT
PDI
PDI/GPIO
PE4
PDI/GPIO
POPDI0GPIO0PF0
POPDI0GPIO0PE5
POPDI0GPIO0PE4
POPDI0GPIO0PDI
POPDI0GPIO
PE5
PA4
C
ATZB-X-0-256-3-0-C
PA5
COZ201
Z201 EMI Shield
1
2
3
4
PIZ201 PIZ201 2PIZ201 3 PIZ201 4
D
B
a
ATMEL Norway
OJS
Vestre Rosten 79 MSK
N-7075 TILLER
D
*
NORWAY
Date:
4/5/2013
Document number: *
4:38:23 PM
PAGE:
2
of
Revision: A
TITLE: ATZB-X0-256-3-0-C
Xmega_233_Connector.SchDoc
1
2
3
4
5
6
7
8
4
1
2
3
4
5
6
PD5_MOSI_XCK1
PD5
PA3_ADC3_INT
PA3
2
3
PIU20002
PIU20003
PIU20004
4
5
PIU20005
6
PIU20006
7
8
PIU20007
PA6
PA6
PB2
PB3
PB4_TMS_INT
PB5_TDI_INT
PB6_TCK_INT
PB7_TDO_INT
PA7
PA7
PB0_AREF_INT
AREF
GND
VCC_3V3
PIU20008
PIU20009
9
10
PIU200010
11
PIU200011
12
13
PIU200012
PIU200013
14
PIU200014
15
PIU200015
PC0_TRX_nRST
16
PIU200016
PA3(ADCA3/ACA3)
PA4(ADCA4/ACA4)
PA5(ADCA5/ACA5)
PA6(ADCA6/ACA6)
PA7(ADCA7/ACA7)
PB0(ADCB0/ACB0/AREFB)
PB1(ADCB1/ACB1)
PB2(ADCB2/ACB2/DACB0)
PB3(ADCB3/ACB3/DACB1)
PB4(ADCB4/ACB4/TMS)
PB5(ADCB5/ACB5/TDI)
PB6(ADCB6/ACB6/TCK)
PB7(ADCB7/ACB7/TDO)
GND
VCC
PC0(SDA/OC0A/OC0ALS)
PB2
PB2
POGPIO0ADC0DAC0PB3
POGPIO0ADC0DAC0PB2
POGPIO0ADC0DAC
GPIO/ADC/DAC
GPIO/ADC/DAC
PB3
PB3
C
GPIO/ADC/ANALOG COMP
GPIO/ADC/ANALOGCOMP
POGPIO0ADC0ANALOGCOMP0PA5
POGPIO0ADC0ANALOGCOMP0PA4
POGPIO0ADC0ANALOGCOMP
PE3
nRST
nRST
PB4_TMS_INT
PB5_TDI_INT
PB6_TCK_INT
48
PIU200048
47
46
PIU200047
PIU200046
PIU200045
45
PF2_OC0C_INT_RXD0
PF1_OC0B_INT_XCK0
PF0
42
41
PIU200042
PIU200041
PIU200040
40
39
PIU200039
38
PIU200038
37
36
PIU200037
PIU200036
35
PIU200035
TOSC1
TOSC2
PE5_OC1B_INT
PE4_SYNC_OC1A
PE3_GPIO
PE2_ASYNC
PE1_SCL
PE0_SDA
PA5
USBD_P
PC5_TRX_SPI_MOSI
VCC_3V3
PC6_TRX_SPI_MISO
COL200
L200
100n
100n
100n
PIC20101
+
C201
C206
PIL20101
GND_RF
PIC205 2 PIC206 2
PIC205 1COC205 PIC206 1COC206
C205
100n
C202
PIL20102
BLM15BB221SN1
D
PIC203 2 PIC204 2
PIC203 1COC203 PIC204 1COC204
C203
PIC20 2
PIC20 1CO 20
100n
PIL20002
L201
COL201
C204
PIL20001
BLM15BB221SN1
4.7uF/10V
AN_VCC_3V3
PIC20102COC201
PC0_TRX_nRST
PIC20802
PIC208 1
C208
100n
PC2_TRX_IRQ
PC1_TRX_DIG2
GND
CLKM
GND
GND
GND
GND
GND
GND
GND
INT/PWM/GPIO
POINT0PWM0GPIO0PF3
POINT0PWM0GPIO0PF2
POINT0PWM0GPIO0PF1
POINT0PWM0GPIO
INT/PWM/GPIO
i
PCB Rule
PF1_OC0B_INT_XCK0
PF2_OC0C_INT_RXD0
PF3_OC0D_INT_TXD0
PF1
PF2
PF3
PF0
i PCB Rule
PF0
PDI_DATA
GND
PDI
PE4_SYNC_OC1A
PE4
POPDI0GPIO0PF0
POPDI0GPIO0PE5
POPDI0GPIO0PE4
POPDI0GPIO0PDI
POPDI0GPIO
PDI/GPIO
PDI/GPIO
C
PE5_OC1B_INT
PE5
TOSC2
Place xtal circuit closer
to MCU. Isolate from
digital signals.
COC200
C200
PIC20001
10
pF
PIC20002
COC207
C207
PIC20701
10
PIC20702pF
PAGE:
3
PIXC20 01
COXC200
XC200
FC-135 32.768 kHz
PIXC20 2
TOSC1
TRX_MOSI
GND
TRX_MISO
TRX_I/F
POTRX0I0F0TRX0SCK
POTRX0I0F0TRX0NSEL
POTRX0I0F0TRX0NRST
POTRX0I0F0TRX0MOSI
POTRX0I0F0TRX0MISO
POTRX0I0F0TRX0IRQ
POTRX0I0F0TRX0DIG2
POTRX0I0F0SLP0TR
POTRX0I0F0CLKM
POTRX0I0F
TRX_I/F
SLP_TR
ATMEL India
OJS
TRX_IRQ
RMZ Millenia
MSK
TRX_DIG2
MGR Road
*
CLKM
Chennai
Date:
Place de-coupling closer
to MCU
POUART0USART0PD3
POUART0USART0PD2
POUART0USART0PD1
POUART0USART
UART/USART
PD3
TRX_SCK
TRX_nRST
PC3_TRX_SLP_TR
COC208
UART/USART
PB7
PD2
PD3_TXD0
TRX_nSEL
PC7_TRX_SPI_SCK
VCC_3V3
POJTAG0PB7
POJTAG0PB6
POJTAG0PB5
POJTAG0PB4
POJTAG0NRST
POJTAG
JTAG
PB6
PD1
PD2_RXD0
GND
VCC_3V3
PC4_TRX_SPI_SS
VCC_3V3
JTAG
PB5
B
PD1_XCK0
VCC_3V3
34
PIU200034
33
PIU200033
PB4
VCC_3V3
GND
44
PIU200044
43
PIU200043
PB7_TDO_INT
PIU20 17PIU20 18 PIU20 19 PIU20 PIU20 1 PIU20 PIU20 3 PIU20 4 PIU20 5 PIU20 6 PIU20 7PIU20 8 PIU20 9 PIU20 3 PIU20 31 PIU20 3
PA4
PA5
POTWI0PE3
POTWI0PE2
POTWI0PE1
POTWI0PE0
POTWI
TWI
TWI
PE2
COU200
U200
(OC0C/RXD0)PF2
(OC0B/XCK0)PF1
(OC0A)PF0
VCC
GND
PE7
PE6
(OC1B)PE5
(OC1A)PE4
(OC0D/TXD0)PE3
(OC0C/RXD0)PE2
(OC0B/XCK0/SCL)PE1
(OC0A/SDA)PE0
VCC
GND
(D+/TXD1/SCK)PD7
PC1_TRX_DIG2
PC2_TRX_IRQ
PC3_TRX_SLP_TR
PC4_TRX_SPI_SS
PC5_TRX_SPI_MOSI
PC6_TRX_SPI_MISO
PC7_TRX_SPI_SCK
ATxmega256A3U-MH
PA4
PE1
PE2_ASYNC
PD1_XCK0
PD2_RXD0
PD3_TXD0
PD4_SS
PD5_MOSI_XCK1
USBD_N
PA2_ADC2_INT
1
PIU20001
PIU20 64PIU20 63 PIU20 6 PIU20 61 PIU20 6 PIU20 59PIU20 58 PIU20 57 PIU20 56 PIU20 5 PIU20 54PIU20 53 PIU20 5 PIU20 51 PIU20 5 PIU20 49
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
65
PAD_GND
GPIO/ADC
PA3_ADC3_INT
PA4
PA5
PA6
PA7
PB0_AREF_INT
PA1_ADC1_INT
PA2
PE0
PE1_SCL
(ACA2/ADCA2)PA2
(ACA1/ADCA1)PA1
(AREFA/ACA0/ADCA0)PA0
AVCC
GND
(XTAL1)PR1
(XTAL2)PR0
PDI_CLK/RESET
PDI_DATA
PF7
PF6
VCC
GND
PF5
(OC0A)PF4
(OC0D/TXD0)PF3
PIU20 65
PA0_ADC0_INT
PA1
A
PE0_SDA
PC1(SCL/XCK0/OC0B/OC0AHS)
PC2(RXD0/OC0C/OC0BLS)
PC3(TXD0/OC0D/OC0BHS)
PC4(SS/OC1A/OC0CLS)
PC5(XCK1/MOSI/OC1B/OC0CHS)
PC6(RXD1/MISO/OC0DLS)
PC7(TXD1/SCK/OC0DHS)
GND
VCC
PD0(OC0A)
PD1(XCK0/OC0B)
PD2(RXD0/OC0C)
PD3(TXD0/OC0D)
PD4(SS/OC1A)
PD5(MOSI/XCK1/OC1B)
PD6(MISO/RXD1/D-)
USBD_P
PA0
GPIO/ADC
GND
8
PE3_GPIO
GND
B
VCC_3V3
7
VCC_3V3
USBD_N
PD6
PD7
POGPIO0ADC0PA7
POGPIO0ADC0PA6
POGPIO0ADC0PA3
POGPIO0ADC0PA2
POGPIO0ADC0PA1
POGPIO0ADC0PA0
POGPIO0ADC0AREF
POGPIO0ADC
GND
VCC_3V3
PIR20002
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
SPI INTERFACE
COR200
R200
100K
PF3_OC0D_INT_TXD0
PD4_SS
PD4
POSPI
POSPI
INTERFACE0PD4
INTERFACE0PD5
INTERFACE0PD6
INTERFACE0PD7
INTERFACE
SPI INTERFACE
CLKM
A
nRST
PDI_DATA
PA2_ADC2_INT
PA1_ADC1_INT
PA0_ADC0_INT
nRST PIR20001
Place 4.7uF closer to
Vcc input for module
4/5/2013
Document number: *
D
4:38:23 PM
of
Revision: 4
TITLE: ATZB-X0-256-3-0-C
Xmega_233_MCU.SchDoc
1
2
3
4
5
6
7
8
4
1
A
2
POTRX0I0F0TRX0SCK
POTRX0I0F0TRX0NSEL
POTRX0I0F0TRX0NRST
POTRX0I0F0TRX0MOSI
POTRX0I0F0TRX0MISO
POTRX0I0F0TRX0IRQ
POTRX0I0F0TRX0DIG2
POTRX0I0F0SLP0TR
POTRX0I0F0CLKM
POTRX0I0F
TRX_I/F
TRX_I/F
3
CLKM
CLKM
TRX_nSEL
nSEL
TRX_SCK
SCLK
TRX_MOSI
MOSI
TRX_MISO
MISO
TRX_nRST
RESET_N
4
5
6
7
8
A
SLP_TR
SLP_TR
IRQ
TRX_IRQ
DIG2
TRX_DIG2
VCC_3V3
C1
COC1
PIC101
C2
PIC102
SLP_TR
DIG2
DIG1
1uF
9
DIG1
RF_N
4
RFP PIU104
RF_P
i
PCB Rule
50Ohm
1
PIB10001
1
PIJ101
COC4
C4
PIC402
3
2
RF_IN RF_OUT PIJ102
PIJ104
PIB10 5 PIB10 6
GND_RF
3
2
Bal
PIC4013 pF
PIL201COL2
COA1
A1
PIA103 2450AT42B100
1
2
PIA101
FEED POINT NC PIA102
PIA104
PIL101COL1
L1
L2
GND_RF
3.3nH
3.3nH
PIL202
PIL102
GND_RF
GND_RF
32
31
30
29
28
27
25
33
3
4
PIB10004
tune the values for
Antenna matching
GND_RF
MS147
PIU1025 PIU1026 PIU1027 PIU1028 PIU1029 PIU103 PIU1031 PIU1032
4
PIQ104
PIQ101
PIQ102
C
2 16.0MHz
GND_RF
COC9
PIC901
C9
100n
GND_RF
COC10
C10
1uFGND_RF
PIC1001 PIC1002
10 pF
AN_VCC_3V3
GND_RF
PIC902
COC11
PIC1101 PIC1102
C11
Bal
COJ1
J1
GND_RF
PIQ103
1
COQ1
Q1
GND_RF
AVSS
DIE
PIU103
AVSS
DIG3
COC8
C8
10 pF
PIC801 PIC802
3
AVSS PIU103
AVSS
1
DIG3 PIU101
AVDD
IRQ
24
PIU1024
AVSS
DIG4
EVDD
2
DIG4 PIU102
XTAL1
SEL
XTAL2
MOSI
23
PIU1023
IRQ
3
PIB10003
GND_RF
2450BM15A0015E
GND
PCB Rule
i
PIB10 2
4
5
RFN PIU105
B100
GND
AVSS
COB100
GND
11
12
10
DIG2
DVSS
13
14
DVSS
22
PIU1022
nSEL
C
Place xtal circuit closer
to TRX . Isolate from
digital signals.
15
MISO
PIJ103
RESET_N
GND
MOSI
26
GND
SCLK
6
PIU106
4
21
PIU1021
7
DVSS PIU107
GND
20
PIU1020
MISO
B
AT86RF233-ZU
8
RSTN PIU108
GND
SCLK
GND
CLKM
DVSS
MLF32
19
PIU1019
AT86RF233
18
PIU1018
SLP_TR
17
PIR102680R PIU1017
DVDD
DVSS
GND
COC3
C3
2.2 pF COR1
R1
PIC301 PIC302
PIR101
DVDD
16
PIU10 6 PIU10 5 PIU10 4 PIU10 3 PIU10 2 PIU10 1 PIU10 PIU109
COU1
U1
CLKM
DEVDD
B
GND
6
GND
5
PIC202
100n
COC2
PIC201
Place de-coupling closer
to TRX
Place de-coupling closer
to TRX
GND_RF
D
ATMEL India
OJS
RMZ Millenia
MSK
MGR Road
*
D
Chennai
Date:
4/5/2013
Document number: *
4:38:23 PM
PAGE:
4
of
Revision: 4
TITLE: ATZB-X0-256-3-0-C
Xmega_233_RF.SchDoc
1
2
3
4
5
6
7
8
4
4.1
Handling Instructions
The ZigBit Modules are fixed with an EMI Shield to ensure compliance to Emission and Immunity rules. This shield is
galvanic and NOT air tight. So cleaning of the module with IPA / other similar agents is not advised. Humidity protection
coating (conformal) will cause deviated RF behavior and coating material being trapped inside EMI Shield. So this
should be avoided. For products requiring conformal coating, it is advised to suitably mask the ZigBit before applying
the coating to rest of the ZigBit carrier board. To protect ZigBit from humidity, the housing of the product should ensure
suitable Ingress Protection standards are complied with.
The MS-147 connector should never be exposed to varnish / similar conformal coating material which will affect
electrical connection on the surfaces of connector.
The in-built chip antenna has been tuned for the particular design
4.2
General Recommendations
• Metal enclosure should not be used. Using low profile enclosure might also affect antenna tuning
• Placing high profile components next to antenna should be avoided
• Having holes/vias punched around the periphery of the board eliminates parasitic radiation from the board edges
also distorting antenna pattern
•
5.
ZigBit module should not be placed next to consumer electronics which might interfere with ZigBit RF frequency
band
Persistence Memory
A dedicated memory space is allocated to store product specific information and called the Persistence Memory. The
organization of the persistence memory is as follows:
Table 5-1.
Persistence Memory
Data
Size
Structure Revision
MAC address
2 bytes
(1)
8 bytes
Board information overall
49 bytes
Board information – PCBA Name
30 bytes
Board information – PCBA Serial number
10 bytes
Board information – PCBA Atmel Part Number
8 bytes
Board information – PCBA Revision
1 byte
Reserved
3 bytes
XTAL Calibration Value
1 byte
Reserved
7 bytes
Reserved
4 bytes
CRC
2 bytes
In ATZB-X0-256-3-0-C, the persistence memory is stored in User signature Row of Atxmega256A3U microcontroller
starting from address 0x0000. This section is not erased by chip erase and requires a dedicated erase command.
ATZB-X0-256-3-0-C ZigBit 2.4GHz Wireless Modules [DATASHEET]
42172B−WIRELESS−03/2014
17
The user signature row is a separate memory section that is fully accessible (read and write) from application software
and external programmers. See section “Read User Signature Row / Production Signature Row” under section “NVM
Flash Commands” in Xmega AU manual [1] for details in reading the user signature data from application software
Note:
1. The MAC address stored inside the MCU is a uniquely assigned ID for each ZigBit and owned by Atmel.
User of the ZigBit application can use this unique MAC ID to address the ZigBit in end-applications. The
MAC ID can be read from the ZigBit using the Performance Analyzer Application that is supplied through
Atmel Studio Gallery Extension.
ATZB-X0-256-3-0-C ZigBit 2.4GHz Wireless Modules [DATASHEET]
42172B−WIRELESS−03/2014
18
6.
Ordering Information
Part number
Description
ATZB-X0-256-3-0-C
2.4GHz IEEE802.15.4/ZigBee OEM module based on ATXMEGA256A3U MCU and AT86RF233
Transceiver with MS-147 test connector and chip antenna, Single unit
(1)
ATZB-X0-256-3-0-CR
Note:
2.4GHz IEEE802.15.4/ZigBee OEM module based on ATXMEGA256A3U MCU and AT86RF233
Transceiver with MS-147 test connector and chip antenna, Tape & Reel
1. Tape and reel quantity: 200.
ATZB-X0-256-3-0-C ZigBit 2.4GHz Wireless Modules [DATASHEET]
42172B−WIRELESS−03/2014
19
7.
Agency Certifications
7.1
United States (FCC)
This equipment complies with Part 15 of the FCC rules and regulations. To fulfill FCC Certification requirements, an
OEM manufacturer must comply with the following regulations:
1.
The ATZB-X0-256-3-0-C modular transmitter must be labeled with its own FCC ID number, and, if the FCC ID
is not visible when the module is installed inside another device, then the outside of the device into which the
module is installed must also display a label referring to the enclosed module. This exterior label can use
wording such as the following:
Contains FCC ID: VW4A091731 The enclosed device complies with Part 15 of the FCC Rules. Operation is
subject to the following two conditions: (i.) this device may not cause harmful interference and (ii.) this device
must accept any interference received, including interference that may cause undesired operation.
Any similar wording that expresses the same meaning may be used.
IMPORTANT: This equipment complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference
received, including interference that may cause undesired operation (FCC 15.19).
The internal antenna used for this mobile transmitter must provide a separation distance of at least 20 cm from all
persons and must not be colocated or operating in conjunction with any other antenna or transmitter.
Installers must be provided with antenna installation instructions and transmitter operating conditions for satisfying RF
exposure compliance. This device is approved as a mobile device with respect to RF exposure compliance, and may
only be marketed to OEM installers. Use in portable exposure conditions (FCC 2.1093) requires separate equipment
authorization.
IMPORTANT: Modifications not expressly approved by this company could void the user's authority to operate this
equipment (FCC section 15.21).
IMPORTANT: This equipment has been tested and found to comply with the limits for a Class A digital device,
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference when the equipment is operated in a commercial environment. This equipment generates, uses, and
can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may
cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to
cause harmful interference in which case the user will be required to correct the interference at his own expense
(FCC section 15.105).
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7.2
European Union (ETSI)
The ATZB-X0-256-3-0-C Module has been certified for use in European Union countries. If these modules are
incorporated into a product, the manufacturer must ensure compliance of the final product to the European harmonized
EMC and lowvoltage/safety standards. A Declaration of Conformity must be issued for each of these standards and
kept on file as described in Annex II of the R&TTE Directive.
Furthermore, the manufacturer must maintain a copy of the modules' documentation and ensure the final product does
not exceed the specified power ratings, antenna specifications, and/or installation requirements as specified in the user
manual. If any of these specifications are exceeded in the final product, a submission must be made to a notified body
for compliance testing to all required standards.
IMPORTANT: The 'CE' marking must be affixed to a visible location on the OEM product. The CE mark shall
consist of the initials "CE" taking the following form:
The CE marking must have a height of at least 5mm except where this is not possible on account of the nature of the
apparatus.
The CE marking must be affixed visibly, legibly, and indelibly.
More detailed information about CE marking requirements you can find at "DIRECTIVE 1999/5/EC OF THE
EUROPEAN PARLIAMENT AND OF THE COUNCIL" on 9 March 1999 at section 12.
7.3
Industry Canada (IC) Compliance statements
This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two
conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including
interference that may cause undesired operation of the device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence.
L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2)
l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en
compromettre le fonctionnement.
This equipment complies with radio frequency exposure limits set forth by Industry Canada for an uncontrolled
environment. This equipment should be installed and operated with minimum distance 20 cm between the device and
the user or bystanders.
Cet équipement est conforme aux limites d'exposition aux radiofréquences définies par Industrie Canada pour un
environnement non contrôlé. Cet équipement doit être installé et utilisé avec un minimum de 20 cm de distance entre le
dispositif et l'utilisateur ou des tiers
CAUTION: Any changes or modifications not expressly approved by the party responsible for compliance could void the
user’s authority to operate the equipment.
The OEM integrator is still responsible for testing their end-product for any additional compliance requirements required
with this module installed (for example, digital device emissions, PC peripheral requirements, etc.).
This Module is labelled with its own IC ID. If the IC ID Certification Number is not visible while installed inside another
device, then the device should display the label on it referring the enclosed module. In that case, the final end product
must be labelled in a visible area with the following:
“Contains Transmitter Module IC:11019A-091731”
OR
“Contains IC: 11019A-091731”
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Ce module est étiqueté avec son propre ID IC. Si le numéro de certification IC ID n'est pas visible lorsqu'il est installé à
l'intérieur d'un autre appareil, l'appareil doit afficher l'étiquette sur le module de référence ci-joint. Dans ce cas, le
produit final doit être étiqueté dans un endroit visible par le texte suivant:
“Contains Transmitter Module IC: 11019A-091731”
OR
“Contains IC: 11019A-091731”
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8.
Revision History
Doc. Rev.
Date
Comments
42172B
04/2014
Removed a table note below Table 3-8
42172A
11/2013
Initial revision.
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