1 of 3 Creation Date : May 19, 2017 (GMT) Multilayer Ceramic Chip Capacitors C2012X7R1C225M125AB TDK item description C2012X7R1C225MT**** Commercial Grade Applications Please refer to Part No. CGA4J3X7R1C225M125AB for Automotive use. Feature General General (Up to 50V) Series C2012 [EIA 0805] Status Production Size Length(L) 2.00mm ±0.20mm Width(W) 1.25mm ±0.20mm Thickness(T) 1.25mm ±0.20mm Terminal Width(B) 0.20mm Min. Terminal Spacing(G) 0.50mm Min. 1.00mm to 1.30mm(Flow Soldering) Recommended Land Pattern (PA) 0.90mm to 1.20mm(Reflow Soldering) 1.00mm to 1.20mm(Flow Soldering) Recommended Land Pattern (PB) 0.70mm to 0.90mm(Reflow Soldering) 0.80mm to 1.10mm(Flow Soldering) Recommended Land Pattern (PC) 0.90mm to 1.20mm(Reflow Soldering) Electrical Characteristics Capacitance 2.2μF ±20% Rated Voltage 16VDC Temperature Characteristic X7R(±15%) Dissipation Factor (Max.) 7.5% Insulation Resistance (Min.) 45MΩ Other Soldering Method Wave (Flow) Reflow AEC-Q200 No Packing Blister (Plastic)Taping [180mm Reel] Package Quantity 2000pcs ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. 2 of 3 Creation Date : May 19, 2017 (GMT) Multilayer Ceramic Chip Capacitors C2012X7R1C225M125AB Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.) Impedance C2012X7R1C225M125AB ESR C2012X7R1C225M125AB Capacitance C2012X7R1C225M125AB C2012X7R1C225M125AB Temperature Characteristic C2012X7R1C225M125AB(No Bias) DC Bias Characteristic C2012X7R1C225M125AB(DC Bias = 8V ) ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. Ripple Temperature Rising C2012X7R1C225M125AB(100kHz) C2012X7R1C225M125AB(500kHz) C2012X7R1C225M125AB(1MHz) Multilayer Ceramic Chip Capacitors C2012X7R1C225M125AB Associated Images Land Pattern (Terminal Connection) ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. 3 of 3 Creation Date : May 19, 2017 (GMT)