1 of 3 Creation Date : November 09, 2017 (GMT) Multilayer Ceramic Chip Capacitors CGA2B3X8R2A332M050BE TDK item description CGA2B3X8R2A332MT***S Applications Automotive Grade Mid Mid Voltage (100 to 630V) Feature 150°C High Temperature Application Soft Soft Termination AEC-Q200 AEC-Q200 Series CGA2(1005) [EIA 0402] Status Production Size Length(L) 1.00mm +0.15,-0.05mm Width(W) 0.50mm +0.10,-0.05mm Thickness(T) 0.50mm +0.10,-0.05mm Terminal Width(B) 0.10mm Min. Terminal Spacing(G) 0.30mm Min. Recommended Land Pattern (PA) 0.30mm to 0.50mm Recommended Land Pattern (PB) 0.35mm to 0.45mm Recommended Land Pattern (PC) 0.40mm to 0.60mm Electrical Characteristics Capacitance 3.3nF ±20% Rated Voltage 100VDC Temperature Characteristic X8R(±15%) Dissipation Factor (Max.) 3% Insulation Resistance (Min.) 10000MΩ Other Soldering Method Reflow AEC-Q200 Yes Packing Punched (Paper)Taping [180mm Reel] Package Quantity 10000pcs ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. 2 of 3 Creation Date : November 09, 2017 (GMT) Multilayer Ceramic Chip Capacitors CGA2B3X8R2A332M050BE Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.) Impedance CGA2B3X8R2A332M050BE ESR CGA2B3X8R2A332M050BE Capacitance CGA2B3X8R2A332M050BE CGA2B3X8R2A332M050BE Temperature Characteristic CGA2B3X8R2A332M050BE(No Bias) DC Bias Characteristic CGA2B3X8R2A332M050BE(DC Bias = 50V) ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. Ripple Temperature Rising CGA2B3X8R2A332M050BE(100kHz) CGA2B3X8R2A332M050BE(500kHz) CGA2B3X8R2A332M050BE(1MHz) Multilayer Ceramic Chip Capacitors CGA2B3X8R2A332M050BE Associated Images Land Pattern (Terminal Connection) ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. 3 of 3 Creation Date : November 09, 2017 (GMT)