NTC thermistors for temperature measurement NTC chip thermistors, bondable S860 series Series/Type: Ordering code: S860 B57860S Date: January 2015 Content of header bars 1 and 2 of data sheet will be automatically entered in headers and footers! Please fill in the table and then change the color to "white". This ensures that the table disappears (invisible) for the customer PDF. Don't change formatting when entering or pasting text in the table and don't add any cell or line in and to it! (header 1 + top left header bar): Identification/Classification 1 Identification/Classification 2 (header 2 + bottom left header bar): NTC thermistors for temperature measurement NTC chip thermistors, bondable S860 series Ordering code: B57860S Series/Type: (top right header bar) S860 Department: EPCOS AG 2015. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited. EPCOS AG is a TDK Group Company. NTC thermistors for temperature measurement NTC chip thermistors, bondable S860 series B57860S S860 Application Temperature measurement Features - NTC chip with termination on top and bottom side (silver or gold metallization) - Category temperature up to 150 °C General technical data Climatic category (IEC 60068-1) Max. power (at 25 °C) Rated temperature Dissipation factor (in air) Thermal cooling time constant (in air) Heat capacity B-value tolerance P25 TR δth τC Cth ∆B/B : 40/150/21 [mW] : Depending on mounting situation [°C] : 100 [mW/K] : Depending on mounting situation [s] : Depending on mounting situation [mJ/K] : Depending on mounting situation [%] : ± 1 Delivery mode On carrier tape (plastic foil) on 8-inch frame. For details see page 6. January 2015 Please read Cautions and warnings and Important notes at the end of this document. Page 2 of 10 NTC thermistors for temperature measurement NTC chip thermistors, bondable S860 series B57860S S860 Dimensional drawings Ordering code Chip size L [ mm ] Chip size W [ mm ] Chip size H [ mm ] B57860S0502J000 1.50 … 1.70 1.50 … 1.70 0.35 … 0.55 B57860S0103J000 0.45 … 0.60 0.45 … 0.60 0.25 … 0.45 B57860S0223J000 1.25 … 1.40 1.25 … 1.40 0.55 … 0.75 Upon request 0.80 … 1.10 0.80 … 1.10 0.45 … 0.65 B57860S0853J000 0.45 … 0.65 0.45 … 0.65 0.25 … 0.40 Upon request 0.50 … 0.60 0.50 … 0.60 0.45 … 0.65 Electrical specification and ordering codes Ordering code RT curve B25/100 [ K ] R25 [ Ω ] R125 [ Ω ] ∆T125 [ ± K ] Metallization B57860S0502J000 8016 3988 5000 170.9 2.2 Ag B57860S0103J000 7003 3625 10000 464.3 2.4 Au B57860S0223J000 8018 3964 21511 742.7 2.2 Ag Upon request 8018 3964 30000 1036 2.2 Ag B57860S0853J000 8304 4092 85000 2639 2.1 Au Upon request 8018 3964 100000 3453 2.2 Au *) *) *) * Further resistance values and tighter tolerances upon request. January 2015 Please read Cautions and warnings and Important notes at the end of this document. Page 3 of 10 NTC thermistors for temperature measurement NTC chip thermistors, bondable S860 series B57860S S860 Reliability Data Test Standard Test conditions ∆R25/R25 Remarks (typical) Storage in dry heat IEC 60068-2-2 Storage at upper category temperature Temperature: 150 °C Duration: 1000 h < 3% < 2% No visible damage < 2% No visible damage Storage in damp heat, steady state with test voltage IEC 60068-2-78 Temperature of air: 85 °C Relative humidity of air: 85% Duration: 1000 h Rapid change of temperature IEC 60068-2-14 Lower test temperature: -40 °C Upper test temperature: 150 °C Number of cycles: 100 No visible damage Storage of NTC in original packaging units. Note: It is strongly recommended to mount the NTC thermistor elements within one week of opening the package, depending on storage conditions. January 2015 Please read Cautions and warnings and Important notes at the end of this document. Page 4 of 10 NTC thermistors for temperature measurement NTC chip thermistors, bondable S860 series B57860S S860 RT characteristics January 2015 Please read Cautions and warnings and Important notes at the end of this document. Page 5 of 10 NTC thermistors for temperature measurement NTC chip thermistors, bondable S860 series B57860S S860 Frame for delivery: size 8-inch Frame loaded with 1 to 9 substrates. In case of less than 9 substrates the positions are filled beginning from position 1 continuously. Each position can be empty because of removed parts for resistance or optical check. January 2015 Please read Cautions and warnings and Important notes at the end of this document. Page 6 of 10 NTC thermistors for temperature measurement NTC chip thermistors, bondable S860 series B57860S S860 Cautions and warnings Storage • • • • • • • Store thermistors only in original packaging. Do not open the package prior to storage. Storage conditions in original packaging: storage temperature −25 °C ... +45 °C, relative humidity ≤75% annual mean, <95% maximum 30 days per annum, dew precipitation is inadmissible. Do not store thermistors where they are exposed to heat or direct sunlight. Otherwise, the packing material may be deformed or components may stick together, causing problems during mounting. Avoid contamination of thermistor surface during storage, handling and processing. Avoid storage of thermistors in harmful environments like corrosive gases (SOx, Cl etc). Use the components as soon as possible after opening the factory seals, i.e. the polyvinyl-sealed packages. Solder thermistors within the time specified after shipment from EPCOS. For leadless components with Au metallization this is 12 months. For leadless components with Ag metallization this is 6 months. Handling • • • • NTC thermistors must not be dropped. Chip-offs or any other damage must not be caused during handling of NTCs. Do not touch components with bare hands. Gloves are recommended. Avoid contamination of thermistor surface during handling. Washing processes may damage the product due to the possible static or cyclic mechanical loads (e.g. ultrasonic cleaning). They may cause cracks to develop on the product and its parts, which might lead to reduced reliability or lifetime. Soldering • • • • Use resin-type flux or non-activated flux. Insufficient preheating may cause ceramic cracks. Rapid cooling by dipping in solvent is not recommended. Complete removal of flux is recommended. January 2015 Please read Cautions and warnings and Important notes at the end of this document. Page 7 of 10 NTC thermistors for temperature measurement NTC chip thermistors, bondable S860 series B57860S S860 Mounting • • • • • • Ensure that no thermo-mechanical stress occurs due to production processes (curing or overmolding processes) when thermistors are sealed, potted or overmolded or during their subsequent operation. The maximum temperature of the thermistor must not be exceeded. Ensure that the materials used (sealing/potting compound and plastic material) are chemically neutral. Electrodes/contacts must not be scratched or damaged before/during/after the mounting process. Contacts and housing used for assembly with the thermistor must be clean before mounting. Ensure that adjacent materials are designed for operation at temperatures comparable to the surface temperature of the thermistor. Be sure that surrounding parts and materials can withstand the temperature. Avoid contamination of the thermistor surface during processing. Avoid using chemical substances as mounting aids. It must be ensured that no water or other liquids enter the NTC thermistors (e.g. through plug terminals). In particular, water based substances (e.g. soap suds) must not be used as mounting aids for sensors. Operation • • • • • • Use thermistors only within the specified operating temperature range. Use thermistors only within the specified power range. Environmental conditions must not harm the thermistors. Only use the thermistors under normal atmospheric conditions or within the specified conditions. Contact of NTC thermistors with any liquids and solvents shall be prevented. It must be ensured that no water enters the NTC thermistors (e.g. through plug terminals). For measurement purposes (checking the specified resistance vs. temperature), the component must not be immersed in water but in suitable liquids (e.g. Perfluorpolyether such as Galden). Avoid dewing and condensation unless thermistor is specified for these conditions. Be sure to provide an appropriate fail-safe function to prevent secondary product damage caused by malfunction. This listing does not claim to be complete, but merely reflects the experience of EPCOS AG. Display of ordering codes for EPCOS products The ordering code for one and the same EPCOS product can be represented differently in data sheets, data books, other publications, on the EPCOS website, or in order-related documents such as shipping notes, order confirmations and product labels. The varying representations of the ordering codes are due to different processes employed and do not affect the specifications of the respective products. Detailed information can be found on the Internet under www.epcos.com/orderingcodes January 2015 Please read Cautions and warnings and Important notes at the end of this document. Page 8 of 10 NTC thermistors for temperature measurement NTC chip thermistors, bondable S860 series B57860S S860 January 2015 Please read Cautions and warnings and Important notes at the end of this document. Page 9 of 10 Important notes The following applies to all products named in this publication: 1. Some parts of this publication contain statements about the suitability of our products for certain areas of application. These statements are based on our knowledge of typical requirements that are often placed on our products in the areas of application concerned. We nevertheless expressly point out that such statements cannot be regarded as binding statements about the suitability of our products for a particular customer application. As a rule, EPCOS is either unfamiliar with individual customer applications or less familiar with them than the customers themselves. For these reasons, it is always ultimately incumbent on the customer to check and decide whether an EPCOS product with the properties described in the product specification is suitable for use in a particular customer application. 2. We also point out that in individual cases, a malfunction of electronic components or failure before the end of their usual service life cannot be completely ruled out in the current state of the art, even if they are operated as specified. In customer applications requiring a very high level of operational safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health (e.g. in accident prevention or life-saving systems), it must therefore be ensured by means of suitable design of the customer application or other action taken by the customer (e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or failure of an electronic component. 3. The warnings, cautions and product-specific notes must be observed. 4. In order to satisfy certain technical requirements, some of the products described in this publication may contain substances subject to restrictions in certain jurisdictions (e.g. because they are classed as hazardous). Useful information on this will be found in our Material Data Sheets on the Internet (www.epcos.com/material). Should you have any more detailed questions, please contact our sales offices. 5. We constantly strive to improve our products. Consequently, the products described in this publication may change from time to time. The same is true of the corresponding product specifications. Please check therefore to what extent product descriptions and specifications contained in this publication are still applicable before or when you place an order. We also reserve the right to discontinue production and delivery of products. Consequently, we cannot guarantee that all products named in this publication will always be available. The aforementioned does not apply in the case of individual agreements deviating from the foregoing for customer-specific products. 6. Unless otherwise agreed in individual contracts, all orders are subject to the current version of the “General Terms of Delivery for Products and Services in the Electrical Industry” published by the German Electrical and Electronics Industry Association (ZVEI). 7. The trade names EPCOS, Alu-X, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP, CSSP, CTVS, DeltaCap, DigiSiMic, DSSP, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell, MKD, MKK, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PQSine, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, SIP5D, SIP5K, TFAP, ThermoFuse, WindCap are trademarks registered or pending in Europe and in other countries. Further information will be found on the Internet at www.epcos.com/trademarks. Page 10 of 10