TI1 ADS8555SPMR 16-bit, six-channel, simultaneous sampling analog-to-digital converter Datasheet

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ADS8555
SBAS531D – DECEMBER 2010 – REVISED FEBRUARY 2016
ADS8555
16-Bit, Six-Channel, Simultaneous Sampling Analog-to-Digital Converter
1 Features
3 Description
•
•
The ADS8555 device contains six low-power, 16-bit,
successive approximation register (SAR)-based
analog-to-digital converters (ADCs) with true bipolar
inputs. Each channel contains a sample-and-hold
circuit that allows simultaneous high-speed multichannel signal acquisition.
1
•
•
•
•
•
•
•
•
Six SAR ADCs Grouped in Three Pairs
Maximum Data Rate Per Channel With Internal
Clock and Reference:
630 kSPS (Parallel) or 450 kSPS (Serial)
Maximum Data Rate Per Channel With External
Clock and Reference:
800 kSPS (Parallel) or 500 kSPS (Serial)
Pin-Selectable or Programmable Input Voltage
Ranges: Up to ±12 V
Excellent AC Performance:
91.5-dB SNR, –94-dB THD
Programmable and Buffered Internal Reference:
0.5 V to 2.5 V and 0.5 V to 3 V
Comprehensive Power-Down Modes:
– Deep Power Down (Standby Mode)
– Auto-Nap Power Down
Selectable Parallel or Serial Interface
Operating Temperature Range: –40°C to 125°C
LQFP-64 Package
The ADS8555 device supports data rates of up to
630 kSPS in parallel interface mode or up to
450 kSPS if the serial interface is used. The bus
width of the parallel interface can be set to eight or 16
bits. In serial mode, up to three output channels can
be activated.
The ADS8555 device is specified over the extended
industrial temperature range of –40°C to 125°C and is
available in an LQFP-64 package.
Device Information(1)
PART NUMBER
ADS8555
Block Diagram
HVDD
Power Quality Measurements
Protection Relays
Multi-Axis Motor Controls
Programmable Logic Controllers
Industrial Data Acquisition
CH_A0
AGND
Signal-to-Noise Ratio (dB)
92
CONVST_B
90
REFC_B
CH_B1
AGND
88
86
84
CH_C0
AGND
82
CONVST_C
80
72
BVDD
SAR ADC
Control
Logic
REFC_A
CH_A1
AGND
CH_B0
AGND
74
AVDD
CONVST_A
94
76
HVSS
Clock
Generator
SNR vs Temperature
78
BODY SIZE (NOM)
10.00 mm × 10.00 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
2 Applications
•
•
•
•
•
PACKAGE
LQFP (64)
SAR ADC
SAR ADC
Config
Register
SAR ADC
SAR ADC
CS/FS
RD
DB[15:0]
WORD/BYTE
PAR/SER
I/O
REFC_C
CH_C1
AGND
AVDD = BVDD = 5V
HVSS = -15V, HVDD = 15V
fSIGNAL = 10kHz, fDATA = Max
Range = ±4 ´ VREF
Internal Reference
BUSY/INT
RANGE/XCLK
HW/SW
REFEN/WR
STBY
RESET
SAR ADC
String
DAC
REF_IO
2.5V/3V
REF
70
-40 -25 -10
5
20
35
50
65
Temperature (°C)
80
95
110 125
AGND
BGND
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
ADS8555
SBAS531D – DECEMBER 2010 – REVISED FEBRUARY 2016
www.ti.com
Table of Contents
1
2
3
4
5
6
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
6
6.1
6.2
6.3
6.4
6.5
6.6
6.7
Absolute Maximum Ratings ...................................... 6
ESD Ratings.............................................................. 7
Recommended Operating Conditions....................... 7
Thermal Information .................................................. 7
Electrical Characteristics........................................... 8
Serial Interface Timing Requirements..................... 11
Parallel Interface Timing Requirements (Read
Access) .................................................................... 11
6.8 Parallel Interface Timing Requirements (Write
Access) .................................................................... 11
6.9 Typical Characteristics ............................................ 14
7
Detailed Description ............................................ 19
7.1 Overview ................................................................. 19
7.2
7.3
7.4
7.5
8
Functional Block Diagram .......................................
Feature Description.................................................
Device Functional Modes........................................
Register Maps .........................................................
19
20
25
29
Applications and Implementation ...................... 31
8.1 Application Information............................................ 31
8.2 Typical Application .................................................. 31
9 Power Supply Recommendations...................... 35
10 Layout................................................................... 35
10.1 Layout Guidelines ................................................. 35
10.2 Layout Example .................................................... 36
11 Device and Documentation Support ................. 37
11.1
11.2
11.3
11.4
11.5
Documentation Support .......................................
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
37
37
37
37
37
12 Mechanical, Packaging, and Orderable
Information ........................................................... 37
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision C (October 2015) to Revision D
•
Changed Figure 36: changed capacitor values from 820 nF to 820 pF .............................................................................. 32
Changes from Revision B (February 2011) to Revision C
•
Page
Page
Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section ................................................................................................. 1
Changes from Revision A (January 2011) to Revision B
Page
•
Changed description of pin 18 in Pin Descriptions table........................................................................................................ 5
•
Added clarification of INT in BUSY/INT section ................................................................................................................... 23
•
Updated Table 4 ................................................................................................................................................................... 28
•
Changed bit C20 in Table 5.................................................................................................................................................. 30
Changes from Original (December 2010) to Revision A
Page
•
Changed description of CONVST_C, CONVST_B, and CONVST_A pins in Pin Descriptions table .................................... 5
•
Changed description of CONVST_x section ........................................................................................................................ 22
•
Changed first paragraph of BUSY/INT section..................................................................................................................... 23
2
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SBAS531D – DECEMBER 2010 – REVISED FEBRUARY 2016
5 Pin Configuration and Functions
DB15
REFEN/WR
HW/SW
PAR/SER
AVDD
AGND
REFC_C
AGND
REFC_B
AGND
REFC_A
AGND
AGND
REFIO
AVDD
AGND
PM Package
64-Pin LQFP
Top View
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
DB14/REFBUFEN
1
48 CH_C1
DB13/SDI
2
47 AVDD
DB12
3
46 AVDD
DB11
4
45 CH_C0
DB10/SDO_C
5
44 AGND
DB9/SDO_B
6
43 AGND
DB8/SDO_A
7
42 CH_B1
BGND
8
BVDD
9
ADS8555
41 AVDD
40 AVDD
DB7/HBEN/DCEN 10
39 CH_B0
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
RESET
WORD/BYTE
HVSS
HVDD
AGND
33 CH_A0
RANGE/XCLK
DB1/SEL_B 16
AVDD
34 AVDD
AGND
DB2/SEL_C 15
STBY
35 AVDD
CONVST_A
DB3/DCIN_C 14
CONVST_B
36 CH_A1
CONVST_C
DB4/DCIN_B 13
RD
37 AGND
CS/FS
DB5/DCIN_A 12
BUSY/INT
38 AGND
DB0/SEL_A
DB6/SCLK 11
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Pin Functions
PIN
NAME
NO.
DB14/REFBUFEN
1
DESCRIPTION
TYPE (1)
DIO/DI
PARALLEL INTERFACE (PAR/SER = 0)
Data bit 14 input/output
SERIAL INTERFACE (PAR/SER = 1)
Hardware mode (HW/SW = 0):
Reference buffers enable input.
When low, all reference buffers are enabled (mandatory if
internal reference is used). When high, all reference buffers
are disabled.
Software mode (HW/SW = 1):Connect to BGND or BVDD.
The reference buffers are controlled by bit C24 (REFBUF) in
control register (CR).
Hardware mode (HW/SW = 0): Connect to BGND
DB13/SDI
2
DIO/DI
Data bit 13 input/output
DB12
3
DIO
Data bit 12 input/output
Connect to BGND
DB11
4
DIO
Data bit 11 input/output
Connect to BGND
DB10/SDO_C
5
DIO/DO
Data bit 10 input/output
When SEL_C = 1, data output for channel C
When SEL_C = 0, tie this pin to BGND
DB9/SDO_B
6
DIO/DO
Data bit 9 input/output
When SEL_B = 1, data output for channel B
When SEL_B = 0, tie this pin to BGND
When SEL_C = 0, data from channel C1 are also available
on this output
Data bit 8 input/output
Data output for channel A
When SEL_C = 0, data from channel C0 are also available
on this output
When SEL_C = 0 and SEL_B = 0, SDO_A acts as the single
data output for all channels
Software mode (HW/SW = 1): Serial data input
DB8/SDO_A
7
DIO/DO
BGND
8
P
Buffer I/O ground, connect to digital ground plane
BVDD
9
P
Buffer I/O supply, connect to digital supply (2.7 V to 5.5 V). Decouple with a 1-μF ceramic capacitor or a
combination of 100-nF and 10-μF ceramic capacitors to BGND.
Word mode (WORD/BYTE = 0):
Data bit 7 input/output
DB7/HBEN/DCEN
10
DIO/DI/DI
DB6/SCLK
11
DIO/DI
DB5/DCIN_A
12
DIO/DI
DB4/DCIN_B
DB3/DCIN_C
DB2/SEL_C
DB1/SEL_B
(1)
4
13
14
15
16
DIO/DI
DIO/DI
DIO/DI
DIO/DI
Byte mode (WORD/BYTE = 1):
High byte enable input.
When high, the high byte is output first on
DB[15:8]. When low, the low byte is output first on
DB[15:8].
Word mode (WORD/BYTE = 0):
Data bit 6 input/output
Byte mode (WORD/BYTE = 1):
Connect to BGND or BVDD
Word mode (WORD/BYTE = 0):
Data bit 5 input/output
Byte mode (WORD/BYTE = 1):
Connect to BGND or BVDD
Word mode (WORD/BYTE = 0):
Data bit 4 input/output
Byte mode (WORD/BYTE = 1):
Connect to BGND or BVDD
Word mode (WORD/BYTE = 0):
Data bit 3 input/output
Byte mode (WORD/BYTE = 1):
Connect to BGND or BVDD
Word mode (WORD/BYTE = 0):
Data bit 2 input/output
Byte mode (WORD/BYTE = 1):
Connect to BGND or BVDD
Word mode (WORD/BYTE = 0):
Data bit 1 input/output
Byte mode (WORD/BYTE = 1):
Connect to BGND or BVDD
Daisy-chain enable input.
When high, DB[5:3] serve as daisy-chain inputs DCIN[A:C].
If daisy-chain mode is not used, connect to BGND.
Serial interface clock input (36 MHz, max)
When DCEN = 1, daisy-chain data input for channel A
When DCEN = 0, connect to BGND
When SEL_B = 1 and DCEN = 1, daisy-chain data input for
channel B
When DCEN = 0, connect to BGND
When SEL_C = 1 and DCEN = 1, daisy-chain data input for
channel C
When DCEN = 0, connect to BGND
Select SDO_C input.
When high, SDO_C is active. When low, SDO_C is disabled.
Select SDO_B input.
When high, SDO_B is active. When low, SDO_B is disabled.
AI = analog input; AIO = analog input/output; DI = digital input; DO = digital output; DIO = digital input/output; and P = power supply.
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Pin Functions (continued)
PIN
NAME
DB0/SEL_A
NO.
17
TYPE (1)
DIO/DI
BUSY/INT
18
DO
CS/FS
19
DI/DI
RD
20
DI
CONVST_C
CONVST_B
21
22
DI
DI
DESCRIPTION
PARALLEL INTERFACE (PAR/SER = 0)
Word mode (WORD/BYTE = 0):
Data bit 0 (LSB) input/output
Byte mode (WORD/BYTE = 1):
Connect to BGND or BVDD
SERIAL INTERFACE (PAR/SER = 1)
Select SDO_A input.
When high, SDO_A is active. When low, SDO_A is disabled.
Must always be high.
When CR bit C21 = 0 (BUSY/INT), converter busy status output. Transitions high when a conversion starts and
remains high during the entire process. Transitions low when the conversion data of all six channels are latched to
the output register and remains low thereafter.
In sequential mode (SEQ = 1 in the CR), the BUSY output transitions high when a conversion starts and goes low
for a single conversion clock cycle (tCCLK) whenever a channel pair conversion completes.
When bit C21 = 1 (BUSY/INT in CR), interrupt output. This bit transitions high after a conversion completes and
goes low with the first read data access.
The polarity of BUSY/INT output can be changed using bit C20 (BUSY L/H) in the control register.
Chip select input.
When low, the parallel interface is enabled. When
high, the interface is disabled.
Frame synchronization.
The falling edge of FS controls the frame transfer.
Read data input.
When low, the parallel data output is enabled.
When high, the data output is disabled.
Connect to BGND
Hardware mode (HW/SW = 0): Conversion start of channel pair C.
The rising edge of this signal initiates simultaneous conversion of analog signals at inputs CH_C[1:0].
Software mode (HW/SW = 1): Conversion start of channel pair C in sequential mode (CR bit C23 = 1) only;
connect to BGND or BVDD otherwise
Hardware mode (HW/SW = 0): Conversion start of channel pair B.
The rising edge of this signal initiates simultaneous conversion of analog signals at inputs CH_B[1:0].
Software mode (HW/SW = 1): Conversion start of channel pair B in sequential mode (CR bit C23 = 1) only;
connect to BGND or BVDD otherwise
Hardware mode (HW/SW = 0): Conversion start of channel pair A.
The rising edge of this signal initiates simultaneous conversion of analog signals at inputs CH_A[1:0].
CONVST_A
23
DI
STBY
24
DI
Standby mode input. When low, the entire device is powered down (including the internal clock and reference).
When high, the device operates in normal mode.
AGND
25, 32,
37, 38,
43, 44,
49, 52,
53, 55,
57, 59
P
Analog ground, connect to analog ground plane
Pin 25 can have a dedicated ground if the difference between its potential and AGND is always kept within ±300
mV.
AVDD
26, 34,
35, 40,
41, 46,
47, 50,
60
P
Analog power supply (4.5 V to 5.5 V). Decouple each pin with a 100-nF ceramic capacitor to AGND. Use an
additional 10-μF capacitor to AGND close to the device but without compromising the placement of the smaller
capacitor. Pin 26 can have a dedicated power supply if the difference between its potential and AVDD is always
kept within ±300 mV.
RANGE/XCLK
27
DI/DIO
RESET
28
DI
Reset input, active high. Aborts any ongoing conversions. Resets the internal control register to 0x000003FF. The
RESET pulse must be at least 50 ns long.
Software mode (HW/SW = 1): Conversion start of all selected channels except in sequential mode
(CR bit C23 = 1): Conversion start of channel pair A only
Hardware mode (HW/SW = 0): Input voltage range select input.
When low, the analog input range is ±4 VREF. When high, the analog input range is ±2 VREF.
Software mode (HW/SW = 1): External conversion clock input, if CR bit C11 (CLKSEL) is set high or internal
conversion clock output, if CR bit C10 (CLKOUT_EN) is set high. If not used, connect to BVDD or BGND.
WORD/BYTE
29
DI
Output mode selection input.
When low, data are transferred in word mode using
DB[15:0]. When high, data are transferred in byte
Connect to BGND
mode using DB[15:8] with the byte order controlled
by HBEN pin when two accesses are required for a
complete 16-bit transfer.
HVSS
30
P
Negative supply voltage for the analog inputs (–16.5 V to –5 V).
Decouple with a 10-0nF ceramic capacitor to AGND placed next to the device and a 10-μF capacitor to AGND
close to the device but without compromising the placement of the smaller capacitor.
HVDD
31
P
Positive supply voltage for the analog inputs (5 V to 16.5 V). Decouple with a 100-nF ceramic capacitor to AGND
placed next to the device and a 10-μF capacitor to AGND close to the device but without compromising the
placement of the smaller capacitor.
CH_A0
33
AI
Analog input of channel A0. The input voltage range is controlled by RANGE pin in hardware mode or CR bit C26
(RANGE_A) in software mode.
CH_A1
36
AI
Analog input of channel A1. The input voltage range is controlled by RANGE pin in hardware mode or CR bit C26
(RANGE_A) in software mode.
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Pin Functions (continued)
PIN
NAME
NO.
DESCRIPTION
TYPE (1)
PARALLEL INTERFACE (PAR/SER = 0)
SERIAL INTERFACE (PAR/SER = 1)
CH_B0
39
AI
Analog input of channel B0. The input voltage range is controlled by RANGE pin in hardware mode or CR bit C27
(RANGE_B) in software mode.
CH_B1
42
AI
Analog input of channel B1. The input voltage range is controlled by RANGE pin in hardware mode or CR bit C27
(RANGE_B) in software mode.
CH_C0
45
AI
Analog input of channel C0. The input voltage range is controlled by RANGE pin in hardware mode or CR bit C28
(RANGE_C) in software mode.
CH_C1
48
AI
Analog input of channel C1. The input voltage range is controlled by RANGE pin in hardware mode or CR bit C28
(RANGE_C) in software mode.
REFIO
51
AIO
Reference voltage input/output (0.5 V to 3.025 V).
The internal reference is enabled through REFEN/WR pin in hardware mode or CR bit C25 (REFEN) in software
mode. The output value is controlled by the internal DAC (CR bits C[9:0]). Connect a 470-nF ceramic decoupling
capacitor between this pin and pin 52.
REFC_A
54
AI
Decoupling capacitor for reference of channels A.
Connect a 10-μF ceramic decoupling capacitor between this pin and pin 53.
REFC_B
56
AI
Decoupling capacitor for reference of channels B.
Connect a 10-μF ceramic decoupling capacitor between this pin and pin 55.
REFC_C
58
AI
Decoupling capacitor for reference of channels C.
Connect a 10-μF ceramic decoupling capacitor between this pin and pin 57.
PAR/SER
61
DI
Interface mode selection input.
When low, the parallel interface is selected. When high, the serial interface is enabled.
HW/SW
62
DI
Mode selection input.
When low, the hardware mode is selected and the device works according to the settings of external pins. When
high, the software mode is selected in which the device is configured by writing into the control register.
REFEN/WR
DB15
63
64
DI
DIO
Hardware mode (HW/SW = 0):
Internal reference enable input.
When high, the internal reference is enabled (the
reference buffers are to be enabled). When low,
the internal reference is disabled and an external
reference is applied at REFIO.
Hardware mode (HW/SW = 0):
Internal reference enable input.
When high, the internal reference is enabled (the reference
buffers are to be enabled). When low, the internal reference
is disabled and an external reference must be applied at
REFIO.
Software mode (HW/SW = 1): Write input.
The parallel data input is enabled when CS and
WR are low. The internal reference is enabled by
the CR bit C25 (REFEN).
Software mode (HW/SW = 1): Connect to BGND or BVDD.
The internal reference is enabled by CR bit C25 (REFEN).
Data bit 15 (MSB) input/output
Connect to BGND
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN
MAX
UNIT
–0.3
18
V
Supply voltage, HVSS to AGND
–18
0.3
V
Supply voltage, AVDD to AGND
–0.3
6
V
Supply voltage, BVDD to BGND
–0.3
6
V
Analog input voltage
HVSS – 0.3
HVDD + 0.3
V
Reference input voltage with respect to AGND
AGND – 0.3
AVDD + 0.3
V
Digital input voltage with respect to BGND
BGND – 0.3
BVDD + 0.3
V
Supply voltage, HVDD to AGND
Ground voltage difference AGND to BGND
Input current to all pins except supply
–10
Maximum virtual junction temperature, TJ
Storage temperature, Tstg
(1)
6
–65
±0.3
V
10
mA
150
°C
150
°C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
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SBAS531D – DECEMBER 2010 – REVISED FEBRUARY 2016
6.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
±2000
Charged-device model (CDM), per JEDEC specification JESD22-C101 (2)
±500
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
MIN
NOM
MAX
4.5
5
5.5
Low-voltage levels
2.7
3
3.6
5-V logic levels
4.5
5
5.5
Supply voltage, AVDD to AGND
Supply voltage, BVDD to BGND
Input supply voltage, HVDD to AGND
Input supply voltage, HVSS to AGND
Input range = ±2 × VREF
2 × VREF
16.5
Input range = ±4 × VREF
4 × VREF
16.5
Input range = ±2 × VREF
–16.5
–2 × VREF
Input range = ±4 × VREF
–16.5
–4 × VREF
Input range = ±2 × VREF
–2 × VREF
2 × VREF
Input range = ±4 × VREF
–4 × VREF
4 × VREF
–40
125
Reference input voltage (VREF)
Analog inputs
(also see the Analog Inputs section)
0.5
Operating ambient temperature, TA
2.5
3
UNIT
V
V
V
V
V
V
°C
6.4 Thermal Information
ADS8555
THERMAL METRIC (1)
PM (LQFP)
UNIT
64 PINS
RθJA
Junction-to-ambient thermal resistance
48
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
16
°C/W
RθJB
Junction-to-board thermal resistance
N/A
°C/W
ψJT
Junction-to-top characterization parameter
N/A
°C/W
ψJB
Junction-to-board characterization parameter
N/A
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
N/A
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
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6.5 Electrical Characteristics
over recommended operating free-air temperature range of –40°C to 125°C, AVDD = 4.5 V to 5.5 V, BVDD = 2.7 V to 5.5 V,
HVDD = 10 V to 15 V, HVSS = –15 V to –10 V, VREF = 2.5 V (internal), and fDATA = maximum (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP (1)
MAX
UNIT
DC ACCURACY
Resolution
16
No missing codes
Bits
16
Integral linearity error
INL
Differential linearity error
DNL
Bits
At TA = –40°C to 85°C
–3
±1.5
3
At TA = –40°C to 125°C
–4
±1.5
4
At TA = –40°C to 85°C
–1
±0.75
1.5
At TA = –40°C to 125°C
–1
±0.75
2
–4
±0.8
4
Offset error
Offset error drift
mV
Gain error
Referenced to voltage at REFIO
Gain error drift
Referenced to voltage at REFIO
±6
ppm/°C
At output code FFFFh, related to AVDD
60
dB
Power-supply rejection ratio
PSRR
±0.25
LSB
μV/°C
±3.5
–0.75
LSB
0.75
%FSR
SAMPLING DYNAMICS
Acquisition time
tACQ
Conversion time per ADC
tCONV
Internal conversion clock period
tCCLK
Throughput rate
fDATA
280
ns
1.26
μs
18.5
tCCLK
68
Parallel interface, internal clock and reference
630
Serial interface, internal clock and reference
450
ns
kSPS
AC ACCURACY
Signal-to-noise ratio
SNR
Signal-to-noise ratio + distortion
SINAD
Total harmonic distortion (2)
THD
Spurious-free dynamic range
SFDR
Channel-to-channel isolation
At fIN = 10 kHz, TA = –40°C to 85°C
90
91.5
At fIN = 10 kHz, TA = –40°C to 125°C
89
91.5
87
89.5
86.5
89.5
At fIN = 10 kHz, TA = –40°C to 85°C
At fIN = 10 kHz, TA = –40°C to 125°C
dB
At fIN = 10 kHz, TA = –40°C to 85°C
–94
–90
At fIN = 10 kHz, TA = –40°C to 125°C
–94
–89.5
At fIN = 10 kHz, TA = –40°C to 85°C
At fIN = 10 kHz, TA = –40°C to 125°C
90
95
89.5
95
At fIN = 10 kHz
–3-dB small-signal bandwidth
dB
dB
100
Input range = ±4 × VREF
48
Input range = ±2 × VREF
24
dB
dB
MHz
ANALOG INPUT
Bipolar full-scale range
CHXX
Input capacitance
Input leakage current
RANGE pin, RANGE bit = 0
–4 × VREF
4 × VREF
RANGE pin, RANGE bit = 1
–2 × VREF
2 × VREF
Input range = ±4 × VREF
10
Input range = ±2 × VREF
20
No ongoing conversion
Aperture delay matching
pF
±1
Aperture delay
Common CONVST for all channels
Aperture jitter
V
μA
5
ns
250
ps
50
ps
EXTERNAL CLOCK INPUT (XCLK)
External clock frequency
fXCLK
An external reference must be used for fXCLK > fCCLK
External clock duty cycle
(1)
(2)
8
1
45%
18
20
MHz
55%
All values are at TA = 25°C.
Calculated on the first nine harmonics of the input frequency.
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Electrical Characteristics (continued)
over recommended operating free-air temperature range of –40°C to 125°C, AVDD = 4.5 V to 5.5 V, BVDD = 2.7 V to 5.5 V,
HVDD = 10 V to 15 V, HVSS = –15 V to –10 V, VREF = 2.5 V (internal), and fDATA = maximum (unless otherwise noted)
MIN
TYP (1)
MAX
2.5-V operation, REFDAC = 0x3FF
2.485
2.5
2.515
2.5-V operation, REFDAC = 0x3FF at 25°C
2.496
2.5
2.504
3-V operation, REFDAC = 0x3FF
2.985
3
3.015
3-V operation, REFDAC = 0x3FF at 25°C
2.995
3
3.005
PARAMETER
TEST CONDITIONS
UNIT
REFERENCE VOLTAGE OUTPUT (REFOUT)
Reference voltage
VREF
Reference voltage drift
dVREF/dT
Power-supply rejection ratio
PSRR
Output current
IREFOUT
Short circuit current (3)
IREFSC
50
mA
Turnon settling time
tREFON
10
ms
μF
External load capacitance
Tuning range
REFDAC
±10
V
ppm/°C
73
With dc current
2
At CREF_x pins
4.7
10
At REFIO pins
100
470
Internal reference output voltage range
REFDAC resolution
dB
–2
nF
0.2 × VREF
VREF
10
REFDAC differential nonlinearity
DNLDAC
REFDAC integral nonlinearity
INLDAC
REFDAC offset error
VOSDAC
–1
VREF = 0.5 V (DAC = 0x0CC)
mA
V
Bits
±0.1
1
LSB
–2
±0.1
2
LSB
–4
±0.65
4
LSB
2.5
3.025
REFERENCE VOLTAGE INPUT (REFIN)
Reference input voltage
VREFIN
0.5
Input resistance
100
Input capacitance
V
MΩ
5
pF
Reference input current
1
μA
SERIAL CLOCK INPUT (SCLK)
Serial clock input frequency
fSCLK
0.1
36
MHz
Serial clock period
tSCLK
0.0278
10
μs
40%
60%
Serial clock duty cycle
DIGITAL INPUTS (4)
Logic family
CMOS with Schmitt-Trigger
High-level input voltage
0.7 × BVDD
BVDD + 0.3
Low-level input voltage
BGND – 0.3
0.3 × BVDD
V
–50
50
nA
Input current
VI = BVDD to BGND
Input capacitance
5
V
pF
DIGITAL OUTPUTS (4)
Logic family
CMOS
High-level output voltage
IOH = 100 μA
Low-level output voltage
IOH = –100 μA
High-impedance-state output current
Output capacitance
BVDD
BGND
BGND + 0.4
V
–50
50
nA
5
Load capacitance
(3)
(4)
BVDD – 0.6
V
pF
30
pF
Reference output current is not limited internally.
Specified by design.
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Electrical Characteristics (continued)
over recommended operating free-air temperature range of –40°C to 125°C, AVDD = 4.5 V to 5.5 V, BVDD = 2.7 V to 5.5 V,
HVDD = 10 V to 15 V, HVSS = –15 V to –10 V, VREF = 2.5 V (internal), and fDATA = maximum (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP (1)
MAX
UNIT
POWER-SUPPLY REQUIREMENTS
Analog supply voltage
AVDD
4.5
5
5.5
V
Buffer I/O supply voltage
BVDD
2.7
3
5.5
V
Input positive supply voltage
HVDD
5
10
16.5
V
Input negative supply voltage
HVSS
–16.5
–10
–5
V
fDATA = maximum
30
36
fDATA = 250 kSPS (auto-NAP mode)
14
16.5
4
6
Power-down mode
0.1
50
fDATA = maximum
0.9
2
fDATA = 250 kSPS (auto-NAP mode)
0.5
1.5
Auto-NAP mode, no ongoing conversion,
internal conversion clock
0.1
10
Power-down mode
0.1
10
Analog supply current (5)
Buffer I/O supply current
IAVDD
(6)
IBVDD
Auto-NAP mode, no ongoing conversion,
internal conversion clock
fDATA = maximum
Input positive supply current
(7)
Input negative supply current (8)
IHVDD
IHVSS
Power dissipation (9)
(5)
(6)
(7)
(8)
(9)
10
3
3.5
fDATA = 250 kSPS (auto-NAP mode)
1.6
2
Auto-NAP mode, no ongoing conversion,
internal conversion clock
0.2
0.3
Power-down mode
0.1
10
fDATA = maximum
3.6
4
fDATA = 250 kSPS (auto-NAP mode)
1.8
2.2
Auto-NAP mode, no ongoing conversion,
internal conversion clock
0.2
0.25
Power-down mode
0.1
10
fDATA = maximum
251.7
298.5
fDATA = 250 kSPS (auto-NAP mode)
122.5
150
Auto-NAP mode, no ongoing conversion,
internal conversion clock
26
38.3
Power-down mode
3.8
580
mA
μA
mA
μA
mA
μA
mA
μA
mW
μW
At AVDD = 5 V.
At BVDD = 3 V, parallel mode, load capacitance = 6 pF per pin.
At HVDD = 15 V.
At HVSS = –15 V.
At AVDD = 5 V, BVDD = 3 V, HVDD = 15 V, and HVSS = –15 V.
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6.6 Serial Interface Timing Requirements
over recommended operating free-air temperature range at –40°C to 125°C, AVDD = 5 V, and BVDD = 2.7 V to 5.5 V (unless
otherwise noted) (1)
MIN
MAX
Acquisition time
tCONV
Conversion time
t1
CONVST_x low time
t2
BUSY low to FS low time
t3
Bus access finished to next conversion start time
tD1
CONVST_x high to BUSY high delay
5
20
ns
tD2
FS low to SDO_x active delay
5
12
ns
tD3
SCLK rising edge to new data valid delay
15
ns
tD4
FS high to SDO_x 3-state delay
10
ns
tH1
Input data to SCLK falling edge hold time
5
ns
tH2
Output data to SCLK rising edge hold time
5
ns
tS1
Input data to SCLK falling edge setup time
3
ns
tS3
CONVST_x high to XCLK falling or rising edge setup time
6
tSCLK
Serial clock period
(1)
280
UNIT
tACQ
ns
1.26
µs
20
ns
0
ns
40
ns
0.0278
ns
10
μs
All input signals are specified with tR = tF = 1.5 ns (10% to 90% of BVDD) and timed from a voltage level of (VIL + VIH) / 2.
6.7 Parallel Interface Timing Requirements (Read Access)
over recommended operating free-air temperature range at –40°C to 125°C, AVDD = 5 V, and BVDD = 2.7 V to 5.5 V (unless
otherwise noted) (1)
MIN
tACQ
Acquisition time
tCONV
Conversion time
t1
CONVST_x low time
t2
BUSY low to CS low time
t3
Bus access finished to next conversion start time (2)
t4
t5
t6
MAX
UNIT
1.26
µs
280
ns
20
ns
0
ns
40
ns
CS low to RD low time
0
ns
RD high to CS high time
0
ns
RD pulse width
30
ns
t7
Minimum time between two read accesses
10
ns
tD1
CONVST_x high to BUSY high delay
tD5
RD falling edge to output data valid delay
tH3
Output data to RD rising edge hold time
(1)
(2)
5
20
ns
20
ns
5
ns
All input signals are specified with tR = tF = 1.5 ns (10% to 90% of BVDD) and timed from a voltage level of (VIL + VIH) / 2.
Refer to the CS signal or RD, whichever occurs first.
6.8 Parallel Interface Timing Requirements (Write Access)
over recommended operating free-air temperature range at –40°C to 125°C, AVDD = 5 V, and BVDD = 2.7 V to 5.5 V (unless
otherwise noted) (1)
MIN
MAX
UNIT
t8
CS low to WR low time
0
ns
t9
WR low pulse duration
15
ns
t10
WR high pulse duration
10
ns
t11
WR high to CS high time
0
ns
tS2
Output data to WR rising edge setup time
5
ns
tH4
Data output to WR rising edge hold time
5
ns
(1)
All input signals are specified with tR = tF = 1.5 ns (10% to 90% of BVDD) and timed from a voltage level of (VIL + VIH) / 2.
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XCLK
(C11 = 1)
tS3
tS3
t1
CONVST_x
tACQ
tCONV
tD1
BUSY
(C20 = C21 = 0)
t3
t2
FS
tSCLK
32
1
SCLK
tD3
tD4
tD2
ADS8556
SDO_x
tH2
CH_x1
D3
CH_x0
MSB
tS1
SDI or
DCIN_x
D31
Don’t Care
D3
CH_x1
D2
tH1
CH_x1
D1
CH_x1
LSB
D2
D1
D0
Don’t
Care
Figure 1. Serial Operation Timing Diagram (All Three SDOs Active)
t1
CONVST_A
CONVST_B
CONVST_C
tCONV
tACQ
tD1
BUSY
(C20 = C21 = 0)
t3
t2
CS
t4
t6
t5
t7
RD
tD5
CH
A0
DB[15:0]
CH
A1
CH
B0
CH
B1
tH3
CH
C0
CH
C1
Figure 2. Parallel Read Access Timing Diagram
12
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CS
t9
t10
t11
t8
WR
tS2
tH4
DB[15:0]
C
[31:16]
C
[15:0]
Word Mode
(WORD/BYTE = 0)
Don’t
Care
C
[31:24]
C
[23:16]
C
[15:8]
C
[7:0]
Byte Mode
(WORD/BYTE = 1)
Figure 3. Parallel Write Access Timing Diagram
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6.9 Typical Characteristics
3.0
3.0
2.5
2.5
2.0
2.0
Integral Nonlinearity (LSB)
Integral Nonlinearity (LSB)
at 25°C, over entire supply voltage range, VREF = 2.5 V (internal), and fDATA = maximum (unless otherwise noted)
1.5
1.0
0.5
0
-0.5
-1.0
-1.5
1.5
1.0
0.5
0
-0.5
-1.0
-1.5
-2.0
-2.0
-2.5
-2.5
-3.0
-3.0
0
0
8190 16380 24570 32760 40950 49140 57330 65520
8190 16380 24570 32760 40950 49140 57330 65520
Code
Code
Figure 4. INL vs Code (±10-VIN Range)
Figure 5. INL vs Code (±5-VIN Range)
1.5
Differential Nonlinearity (LSB)
Differential Nonlinearity (LSB)
1.5
1.0
0.5
0
-0.5
1.0
0.5
0
-0.5
-1.0
-1.0
0
0
8190 16380 24570 32760 40950 49140 57330 65520
8190 16380 24570 32760 40950 49140 57330 65520
Code
Code
Figure 6. DNL vs Code (±10-VIN Range)
Figure 7. DNL vs Code (±5-VIN Range)
4
0.75
3
0.50
Gain Error (%)
Offset Error (mV)
2
1
0
-1
0.25
0
-0.25
-2
-0.50
-3
-0.75
-4
-40 -25 -10
5
20
35
50
65
80
95
110 125
-40 -25 -10
Temperature (°C)
20
35
50
65
80
95
110 125
Temperature (°C)
Figure 8. Offset Error vs Temperature
14
5
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Figure 9. Gain Error vs Temperature
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Typical Characteristics (continued)
at 25°C, over entire supply voltage range, VREF = 2.5 V (internal), and fDATA = maximum (unless otherwise noted)
1.40
1.35
-40
Conversion Time (ms)
Power-Supply Rejection Ratio (dB)
-30
-50
-60
-70
1.30
1.25
1.20
1.15
1.10
1.05
1.00
-80
0.95
-90
0.90
0
20
40
60
80
100 120 140 160 180
-40 -25 -10
200
5
5500
94
5000
92
4500
90
4000
3500
3000
2500
2000
1500
1000
95
110 125
84
82
80
AVDD = BVDD = 5V
HVSS = -15V, HVDD = 15V
fSIGNAL = 10kHz, fDATA = Max
Range = ±4 ´ VREF
Internal Reference
78
76
74
-2
-1
0
1
-40 -25 -10
2
5
20
35
50
65
80
95
110 125
Temperature (°C)
Figure 12. Code Histogram (8192 Hits)
Figure 13. SNR vs Temperature
94
-86
AVDD = BVDD = 5V, HVSS = -15V, HVDD = 15V
fSIGNAL = 10kHz, fDATA = Max, Range = ±4 ´ VREF
Internal Reference
92
Total Harmonic Distortion (dB)
Signal-to-Noise Ratio and Distortion (dB)
80
86
Code
90
88
86
84
82
80
72
65
70
-3
74
50
88
72
500
76
35
Figure 11. Conversion Time vs Temperature
Signal-to-Noise Ratio (dB)
Number of Occurrences
Figure 10. PSRR vs AVDD Noise Frequency
78
20
Temperature (°C)
AVDD Noise Frequency (kHz)
AVDD = BVDD = 5V
HVSS = -15V, HVDD = 15V
fSIGNAL = 10kHz, fDATA = Max
Range = ±4 ´ VREF
Internal Reference
-88
-90
-92
-94
-96
-98
70
-40 -25 -10
5
20
35
50
65
80
95
110 125
-40 -25 -10
5
20
35
50
65
80
95
Temperature (°C)
Temperature (°C)
Figure 14. SINAD vs Temperature
Figure 15. THD vs Temperature
110 125
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Typical Characteristics (continued)
at 25°C, over entire supply voltage range, VREF = 2.5 V (internal), and fDATA = maximum (unless otherwise noted)
0
-20
98
-40
96
Amplitude (dB)
Spurious-Free Dynamic Range (dB)
100
94
92
AVDD = BVDD = 5V
HVSS = -15V, HVDD = 15V
fSIGNAL = 10kHz, fDATA = Max
Range = ±4 ´ VREF
Internal Reference
90
88
5
20
35
50
65
80
95
-80
-100
-120
-140
-160
86
-40 -25 -10
-60
-180
110 125
0
25
50
75
Temperature (°C)
100 125 150 175 200 225
250
Frequency (kHz)
fIN = 10 kHz
Figure 17. Frequency Spectrum
(2048-Point FFT, ±10-VIN Range)
0
120
-20
115
-40
110
-60
Isolation (dB)
Amplitude (dB)
Figure 16. SFDR vs Temperature
-80
-100
-120
105
100
95
90
-140
85
-160
80
-180
0
25
50
75
100 125 150 175 200 225
250
30
0
60
90
Frequency (kHz)
120 150 180 210 240 270
300
Noise Frequency (kHz)
fIN = 10 kHz
Figure 19. Channel-to-Channel Isolation vs
Input Noise Frequency
2.504
2.504
2.503
2.503
2.502
2.502
2.501
VREF (V)
VREF (V)
Figure 18. Frequency Spectrum
(2048-Point FFT, ±5-VIN Range)
VREF
2.500
2.501
2.500
2.499
2.499
2.498
2.498
2.497
2.497
2.496
2.496
4.5
4.6
4.7
4.8
4.9
5.0
5.1
5.2
5.3
5.4
5.5
-40 -25 -10
Figure 20. Internal Reference Voltage vs Analog Supply
Voltage (2.5-V Mode)
16
5
20
35
50
65
80
95
110 125
Temperature (°C)
AVDD (V)
Figure 21. Internal Reference Voltage vs Temperature
(2.5-V Mode)
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Typical Characteristics (continued)
at 25°C, over entire supply voltage range, VREF = 2.5 V (internal), and fDATA = maximum (unless otherwise noted)
3.005
3.004
3.003
IAVDD (mA)
VREF (V)
3.002
3.001
3.000
2.999
2.998
2.997
2.996
2.995
-40 -25 -10
5
20
35
50
65
80
95
36
34
32
30
28
26
24
22
20
18
16
14
12
10
110 125
fDATA = Max
fDATA = 250kSPS (A-NAP)
-40 -25 -10
5
20
Temperature (°C)
A-NAP Mode
1.4
1.2
fDATA = Max
1.0
0.8
0.6
fDATA = 250kSPS (A-NAP)
0.4
0.2
-40 -25 -10
45 90 135 180 225 270 315 360 405 450 495 540 585 630
5
20
35
50
65
80
95
110 125
Temperature (°C)
Figure 24. Analog Supply Current vs Data Rate
Figure 25. Buffer I/O Supply Current vs Temperature
4.5
IHVSS (fDATA = Max)
4.0
3.50
Input Supply Current (mA)
Input Supply Current (mA)
110 125
1.6
4.00
IHVDD (fDATA = Max)
2.75
2.50
2.25
IHVSS (250kSPS A-NAP)
1.75
1.50
95
1.8
Sample Rate (kSPS)
2.00
80
Normal Operation
0
3.00
65
2.0
36
34
32
30
28
26
24
22
20
18
16
14
12
10
8
6
4
2
3.25
50
Figure 23. Analog Supply Current vs Temperature
IBVDD (mA)
IAVDD (mA)
Figure 22. Internal Reference Voltage vs Temperature
(3-V Mode)
3.75
35
Temperature (°C)
IHVDD (250kSPS A-NAP)
IHVSS (fDATA = Max)
3.5
3.0
IHVDD (fDATA = Max)
2.5
2.0
1.5
1.0
IHVSS (250kSPS A-NAP)
0.5
1.25
IHVDD (250kSPS A-NAP)
0
1.00
-40 -25 -10
5
20
35
50
65
80
95
110 125
5
6
7
8
9
10
11
12
13
14
15
HVDD, |HVSS| (V)
Temperature (°C)
Figure 26. Input Supply Current vs Temperature
Figure 27. Input Supply Current vs Input Supply Voltage
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Typical Characteristics (continued)
at 25°C, over entire supply voltage range, VREF = 2.5 V (internal), and fDATA = maximum (unless otherwise noted)
3.6
IHVSS
3.3
3.0
IHVSS (A-NAP)
IHVxx (mA)
2.7
2.4
2.1
IHVDD (A-NAP)
1.8
1.5
IHVDD
1.2
0.9
0.6
0.3
0
0
90
180
270
360
450
540
630
Data Rate (kSPS)
Figure 28. Input Supply Current vs Data Rate
18
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7 Detailed Description
7.1 Overview
The ADS8555 device includes six 16-bit analog-to-digital converters (ADCs) that operate based on the
successive approximation register (SAR) principle. The architecture is designed on the charge redistribution
principle that inherently includes a sample-and-hold function. The six analog inputs are grouped into three
channel pairs. These channel pairs can be sampled and converted simultaneously, preserving the relative phase
information of the signals of each pair. Separate conversion start signals allow simultaneous sampling on each
channel pair, on four channels or on all six channels.
These devices accept single-ended, bipolar analog input signals in the selectable ranges of ±4 VREF or ±2 VREF
with an absolute value of up to ±12 V; see the Analog Inputs section for more details.
The devices offer an internal 2.5-V, 3-V reference source followed by a 10-bit, digital-to-analog converter (DAC)
that allows the reference voltage VREF to be adjusted in 2.44-mV or 2.93-mV steps, respectively.
The ADS8555 device also offers a selectable parallel or serial interface that can be used in hardware or software
mode; see the Device Configuration section for details.
7.2 Functional Block Diagram
HVDD
HVSS
AVDD
BVDD
Clock
Generator
CH_A0
AGND
SAR ADC
CONVST_A
Control
Logic
REFC_A
CH_A1
AGND
SAR ADC
CH_B0
AGND
BUSY/INT
RANGE/XCLK
HW/SW
REFEN/WR
STBY
RESET
SAR ADC
CONVST_B
Config
Register
REFC_B
CH_B1
AGND
SAR ADC
CH_C0
AGND
SAR ADC
CONVST_C
CS/FS
RD
DB[15:0]
WORD/BYTE
PAR/SER
I/O
REFC_C
CH_C1
AGND
SAR ADC
String
DAC
REF_IO
AGND
2.5V/3V
REF
BGND
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7.3 Feature Description
7.3.1 Analog
This section addresses the analog input circuit, the ADCs and control signals, and the reference design of the
device.
7.3.1.1 Analog Inputs
The inputs and the converters are of the single-ended, bipolar type. The absolute voltage range can be selected
using the RANGE pin (in hardware mode) or RANGE_x bits (in software mode) in the control register (CR, see
Table 5) to either ±4 VREF or ±2 VREF. With the reference set to 2.5 V (CR bit C18 = 0), the input voltage range
can be ±10 V or ±5 V. With the reference source set to 3 V (CR bit C18 = 1), an input voltage range of ±12 V or
±6 V can be configured. The logic state of the RANGE pin is latched with the falling edge of BUSY (if CR bit C20
= 0).
The input current on the analog inputs depends on the actual sample rate, input voltage, and signal source
impedance. Essentially, the current into the analog inputs charges the internal capacitor array only during the
sampling period (tACQ). The source of the analog input voltage must be able to charge the input capacitance of
10 pF in ±4-VREF mode or 20 pF in ±2-VREF mode to a 12-, 14-, 16-bit accuracy level within the acquisition time
of 280 ns at maximum data rate, as shown in Figure 29.
Input range: ±2VREF
RSER = 200W
Input range: ±4VREF
RSW = 130W
RSER = 200W
CH_XX
RSW = 130W
CH_XX
CS = 20pF
CS = 10pF
VDC
CPAR = 5pF
CPAR = 5pF
VDC
CS = 20pF
AGND
CS = 10pF
AGND
RSER = 200W
RSW = 130W
RSER = 200W
RSW = 130W
Figure 29. Equivalent Input Circuits
During the conversion period, there is no further input current flow and the input impedance is greater than 1 MΩ.
To ensure a defined start condition, the sampling capacitors of the ADS8555 device are precharged to a fixed
internal voltage, before switching into sampling mode.
To maintain the linearity of the converter, the inputs must always remain within the specified range of HVSS –
0.2 V to HVDD + 0.2 V.
The minimum –3-dB bandwidth of the driving operational amplifier can be calculated using Equation 1:
ln(2) ´ (n + 1)
f-3dB =
2p ´ tACQ
where
•
n = 16 (n is the resolution of the device)
(1)
With a minimum acquisition time of tACQ = 280 ns, the required minimum bandwidth of the driving amplifier is 6.7
MHz. The required bandwidth can be lower if the application allows a longer acquisition time. A gain error occurs
if a given application does not fulfill the bandwidth requirement shown in Equation 1.
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Feature Description (continued)
A driving operational amplifier may not be required if the impedance of the signal source (RSOURCE) fulfills the
requirement of Equation 2:
tACQ
RSOURCE <
- (RSER + RSW)
CS ln(2) ´ (n + 1)
where
•
•
•
•
n = 16 (n is the resolution of the ADC)
CS = 10 pF is the sample capacitor value for VIN = ±4 × VREF mode
RSER = 200 Ω is the input resistor value
RSW = 130 Ω is the switch resistance value
(2)
With tACQ = 280 ns, the maximum source impedance must be less than 2 kΩ in VIN = ±4-VREF mode or less than
0.9 kΩ in VIN = ±2-VREF mode. The source impedance can be higher if the application allows longer acquisition
time.
7.3.1.2 Analog-to-Digital Converter (ADC)
The devices include six ADCs that operate with either an internal or an external conversion clock. The
conversion time is 1.26 μs with the internal conversion clock. When an external clock and reference are used,
the minimum conversion time is 925 ns.
7.3.1.3 Conversion Clock
The device uses either an internally-generated or an external (XCLK) conversion clock signal (in software mode
only). In default mode, the device generates an internal clock. When the CLKSEL bit is set high (bit C11 in
Table 5), an external conversion clock of up to 20 MHz (maximum) can be applied on pin 27. In both cases, 18.5
clock cycles are required for a complete conversion including the precharging of the sample capacitors. The
external clock can remain low between conversions.
The conversion clock duty cycle must be 50%. However, the ADS8555 device functions properly with a duty
cycle from 45% to 55%.
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Feature Description (continued)
7.3.1.4 CONVST_x
The analog inputs of each channel pair (CH_x0, CH_x1) are held with the rising edge of the corresponding
CONVST_x signal. Only in software mode (except sequential mode), CONVST_A is used for all six ADCs. The
conversion automatically starts with the next edge of the conversion clock.
A conversion start must not be issued during an ongoing conversion on the same channel pair. However,
conversions are allowed to be initiated on other input pairs; see the Sequential Mode section for more details.
If a parallel interface is used, the behavior of the output port depends on which CONVST_x signals are issued.
Figure 30 shows examples of different scenarios.
BUSY
(C20 = C21 = 0)
CS
CONVST_A
CONVST_C
CONVST_B
RD
DB[15:0]
CH
A0
CH
A1
CH
C0
CH
C1
CH
A0
CH
A1
CH
C0
CH
B0
CH
B1
CH
B0
CH
B1
CH
B0
CH
B1
CH
B0
CONVST_B
CONVST_A
CONVST_B
RD
DB[15:0]
NOTE: Boxed areas indicate the minimum required frame to acquire all data.
Figure 30. Data Output vs CONVST_x
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Feature Description (continued)
7.3.1.5 BUSY/INT
The BUSY signal indicates if a conversion is in progress. The BUSY signal goes high with a rising edge of any
CONVST_x signal and goes low when the output data of the last channel pair are available in the respective
output register. The readout of the data can be initiated immediately after the falling edge of BUSY.
In sequential mode, the BUSY signal goes low only for one clock cycle; see the Sequential Mode section for
more details.
The INT output goes high at completion of a conversion process and remains high after first read data access.
The polarity of the BUSY/INT signal can be changed using Table 5 bit C20.
7.3.1.6 Reference
The ADS8555 device provides an internal, low-drift, 2.5-V reference source. To increase the input voltage range,
the reference voltage can be switched to 3-V mode using the VREF bit (bit C18 in the CR). The reference feeds
a 10-bit string-DAC controlled by bits C[9:0] in the control register. The buffered DAC output is connected to the
REFIO pin. In this way, the voltage at this pin is programmable in 2.44 mV (2.92 mV in 3-V mode) steps and
adjustable to the application needs without additional external components. The actual output voltage can be
calculated using Equation 3:
Range ´ (Code + 1)
VREF =
1024
where
•
•
Range = the chosen maximum reference voltage output range (2.5 V or 3 V)
Code = the decimal value of the DAC register content
(3)
Table 1 lists some examples of internal reference DAC settings with a reference range set to 2.5 V. However, to
ensure proper performance, the DAC output voltage should not be programmed below 0.5 V.
Decouple the buffered output of the DAC with a 100-nF capacitor (minimum); for best performance, TI
recommends a 470-nF capacitor. If the internal reference is placed into power-down (default), an external
reference voltage can drive the REFIO pin.
The voltage at the REFIO pin is buffered with three internal amplifiers, one for each ADC pair. The output of
each buffer must be decoupled with a 10-μF capacitor between pin pairs 53 and 54, 55 and 56, and 57 and 58.
The 10-μF capacitors are available as ceramic 0805-SMD components and in X5R quality.
The internal reference buffers can be powered down to decrease the power dissipation of the device. In this
case, external reference drivers can be connected to REFC_A, REFC_B, and REFC_C pins. With 10-μF
decoupling capacitors, the minimum required bandwidth can be calculated using Equation 4.
ln(2)
f-3dB =
2p ´ tCONV
(4)
With the minimum tCONV of 1.26 μs, the external reference buffers require a minimum bandwidth of 88 kHz.
Table 1. DAC Setting Examples (2.5-V Operation)
VREF OUT
(V)
DECIMAL
CODE
BINARY
CODE
HEXADECIMAL
CODE
0.5
204
00 1100 1100
CC
1.25
511
01 1111 1111
1FF
2.5
1023
11 1111 1111
3FF
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7.3.2 Digital
This section describes the digital control and the timing of the device in detail.
7.3.2.1 Device Configuration
Depending on the desired mode of operation, the ADS8555 device can be configured using the external pins or
the control register (see Table 5), as shown in Table 2.
Table 2. ADS8555 Configuration Settings
INTERFACE MODE
HARDWARE MODE (HW/SW = 0)
CONVERSION START CONTROLLED BY SEPARATE
CONVST_x PINS
SOFTWARE MODE (HW/SW = 1)
CONVERSION START CONTROLLED BY CONVST_A
PIN ONLY, EXCEPT IN SEQUENTIAL MODE
Parallel
(PAR/SER = 0)
Configuration using pins, optionally, control bits C[22:18],
C[15:13], and C[9:0]
Configuration using control register bits C[31:0] only;
status of pins 27 (only if used as RANGE input) and 63 is
disregarded
Serial
(PAR/SER = 1)
Configuration using pins, optionally, control bits C[22:18],
C[15:13], and C[9:0]; bits C[31:24] are disregarded
Configuration using control register bits C[31:0] only;
status of pins 1, 27 (only if used as RANGE input), and
63 is disregarded; each access requires a control register
update through SDI (see the Serial Interface section for
details)
7.3.2.2 Parallel Interface
To use the device with the parallel interface, hold the PAR/SER pin low. The maximum achievable data
throughput rate using the internal clock is 630 kSPS in this case.
Access to the ADS8555 device is controlled as illustrated in Figure 2 and Figure 3.
The device can either operate with a 16-bit (WORD/BYTE pin set low) or an 8-bit (WORD/BYTE pin set high)
parallel interface. If 8-bit operation is used, the HBEN pin selects if the low-byte (DB7 low) or the high-byte (DB7
high) is available on the data output DB[15:8] first.
7.3.2.3 Serial Interface
The serial interface mode is selected by setting the PAR/SER pin high. In this case, each data transfer starts with
the falling edge of the frame synchronization input (FS). The conversion results are presented on the serial data
output pins SDO_A, SDO_B, and SDO_C depending on the selections made using the SEL_x pins. Starting with
the most significant bit (MSB), the output data are changed at the rising edge of SCLK, so that the host
processor can read it at the following falling edge.
Serial data input SDI are latched at the falling edge of SCLK.
The serial interface can be used with one, two, or three output ports. These ports are enabled with pins SEL_A,
SEL_B, and SEL_C. If all three serial data output ports (SDO_A, SDO_B, and SDO_C) are selected, the data
can be read with either two 16-bit data transfers or with one 32-bit data transfer. The data of channels CH_x0 are
available first, followed by data from channels CH_x1. The maximum achievable data throughput rate is 450
kSPS in this case.
If the application allows a data transfer using two ports only, SDO_A and SDO_B outputs are used. The device
outputs data from channel CH_A0 followed by CH_A1 and CH_C0 on SDO_A, and data from channel CH_B0
followed by CH_B1 and CH_C1 occurs on SDO_B. In this case, a data transfer of three consecutive 16-bit words
or one continuous 48-bit word is supported. The maximum achievable data throughput rate is 375 kSPS.
The output SDO_A is selected if only one serial data port is used in the application. The data are available in the
following order: CH_A0, CH_A1, CH_B0, CH_B1, CH_C0, and, finally CH_C1. Data can be read using six 16-bit
transfers, three 32-bit transfers, or a single 96-bit transfer. The maximum achievable data throughput rate is 250
kSPS in this case.
Figure 1 (the serial operation timing diagram) and Figure 31 illustrate all possible scenarios in more detail.
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CONVST_A
CONVST_B
CONVST_C
BUSY
(C20 = C21 = 0)
48 SCLKs
SEL_A = SEL_B = 1, SEL_C = 0
FS
SDO_A
CHA0
CHA1
CHC0
SDO_B
CHB0
CHB1
CHC1
SEL_A = 1, SEL_B = SEL_C = 0
96 SCLKs
FS
SDO_A
CHA0
CHA1
CHB0
CHB1
CHC0
CHC1
Figure 31. Serial Interface: Data Output With One or Two Active SDOs
7.3.2.4 Output Data Format
The data output format of the ADS8555 is binary twos complement, as shown in Table 3.
Table 3. Output Data Format
DESCRIPTION
INPUT VOLTAGE VALUE
BINARY CODE (HEXADECIMAL CODE)
0111 1111 1111 1111 (7FFF)
Positive full-scale
4 VREF or 2 VREF
Midscale + 0.5 LSB
VREF / (2 × resolution)
0000 0000 0000 0000 (0000)
Midscale – 0.5 LSB
–VREF / (2 × resolution)
1111 1111 1111 1111 (FFFF)
Negative full-scale
–4 VREF or –2 VREF
1000 0000 0000 0000 (8000)
7.4 Device Functional Modes
7.4.1 Hardware Mode
With the HW/SW input (pin 62) set low, the device functions are controlled through the pins and, optionally,
control register bits C[22:18], C[15:13], and C[9:0].
Generally, the device can be used in hardware mode and switched into software mode to initialize or adjust the
control register settings (for example, the internal reference DAC) and then switched back to hardware mode
thereafter.
7.4.2 Software Mode
When the HW/SW input is set high, the device operates in software mode with functionality set only by the
control register bits (corresponding pin settings are ignored).
If parallel interface is used, an update of all control register settings is performed by issuing two 16-bit write
accesses on pins DB[15:0] in word mode or four 8-bit accesses on pins DB[15:8] in byte mode (to avoid losing
data, the entire sequence must be finished before starting a new conversion). Hold CS low during the two or four
write accesses to completely update the configuration register. Updating only the upper eight bits (C[31:24]) is
possible using a single write access and pins DB[15:8] in both word and byte modes. In word mode, the first
write access updates only the upper eight bits and stores the lower eight bits (C[23:16]) for an update that takes
place with the second write access along with C[15:0].
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Device Functional Modes (continued)
If the serial interface is used, input data containing control register contents are required with each read access
to the device in this mode (combined read/write access). For initialization purposes, all 32 bits of the register
must be set (bit C16 must be set to 1 during that access to allow the update of the entire register content). To
minimize switching noise on the interface, an update of the first eight bits (C[31:24]) with the remaining bits held
low can be performed thereafter.
Figure 35 illustrates the different control register update options.
7.4.3 Daisy-Chain Mode (In Serial Mode Only)
The serial interface of the ADS8555 device supports a daisy-chain feature that allows cascading of multiple
devices to minimize the board space requirements and simplify routing of the data and control lines. In this case,
pins DB5/DCIN_A, DB4/DCIN_B, and DB3/DCIN_C are used as serial data inputs for channels A, B, and C,
respectively. Figure 32 shows an example of a daisy-chain connection of three devices sharing a common
CONVST line to allow simultaneous sampling of 18 analog channels along with the corresponding timing
diagram. To activate the daisy-chain mode, the DCEN pin must be pulled high. As a result of the time
specifications tS1, tH1, and tD3, the maximum SCLK frequency that may be used in daisy-chain mode is 27.78
MHz (assuming 50% duty cycle).
CONVST
FS
SCLK
ADS8555
#1
ADS8555
#2
ADS8555
#3
CONVST_A
CONVST_A
CONVST_A
FS
SCLK
FS
SCLK
FS
SCLK
DCIN_A
DCIN_B
DCIN_C
SDO_A
SDO_B
SDO_C
DCEN = ‘0’
SDO_A
SDO_B
SDO_C
DCIN_A
DCIN_B
DCIN_C
DCEN = ‘1’
SDO_A
SDO_B
SDO_C
To
Processing
Unit
DCEN = ‘1’
CONVST
BUSY
(C20 = C21 = 0)
FS
SDO_x #3
Don’t Care
16-Bit Data CHx0
ADS8555 #3
16-Bit Data CHx1
ADS8555 #3
16-Bit Data CHx0
ADS8555 #2
16-Bit Data CHx1
ADS8555 #2
16-Bit Data CHx0
ADS8555 #1
16-Bit Data CHx1
ADS8555 #1
Figure 32. Example of Daisy-Chaining Three ADS8555 Devices
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Device Functional Modes (continued)
7.4.4 Sequential Mode (In Software Mode With External Conversion Clock Only)
The three channel pairs of the ADS8555 device can be run in sequential mode, with the corresponding
CONVST_x signals interleaved, when an external clock is used. To activate the device in sequential mode, CR
bits C11 (CLKSEL) and C23 (SEQ) must be asserted. In this case, the BUSY output indicates a finished
conversion by going low (when C20 = 0) or high (when C20 = 1) for only a single conversion clock cycle in case
of ongoing conversions of any other channel pairs. Figure 33 shows the behavior of the BUSY output in this
mode. Initiate each conversion start during the high phase of the external clock, as shown in Figure 33. The
minimum time required between two CONVST_x pulses is the time required to read the conversion result of a
channel (pair).
XCLK
EOC
CHBx
(1)
EOC
CHAx
(1)
CONVST_A
EOC
CHCx
(1)
CONVST_B
CONVST_C
tCCLK
BUSY
(C20 = 0)
CS
RD
CH
A0
D[15:0]
(1)
CH
A1
CH
B0
CH
B1
CH
C0
CH
C1
EOC = end of conversion (internal signal).
Figure 33. Sequential Mode Timing
7.4.5 Reset and Power-Down Modes
The device supports two reset mechanisms: a power-on reset (POR) and a pin-controlled reset (RESET) that
can be issued using pin 28. Both the POR and RESET act as a master reset that causes any ongoing
conversion to be interrupted, the control register content to be set to the default value, and all channels to be
switched into sample mode.
When the device is powered up, the POR sets the device in default mode when AVDD reaches 1.5 V. When the
device is powered down, the POR circuit requires AVDD to remain below 125 mV at least 350 ms to ensure
proper discharging of internal capacitors and to ensure correct behavior of the device when powered up again. If
the AVDD drops below 400 mV but remains above 125 mV (see the undefined zone in Figure 34), the internal
POR capacitor does not discharge fully and the device requires a pin-controlled reset to perform correctly after
the recovery of AVDD.
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Device Functional Modes (continued)
AVDD (V)
5.500
Specified Supply
Voltage Range
5.000
4.500
4.000
3.000
2.000
POR
Trigger Level
1.500
1.000
0.400
0.125
Undefined Zone
0.350
0
t (s)
Figure 34. POR: Relevant Voltage Levels
The entire device, except the digital interface, can be powered down by pulling the STBY pin low (pin 24).
Because the digital interface section remains active, data can be retrieved when in stand-by mode. To power the
device on again, the STBY pin must be brought high. The device is ready to start a new conversion after the 10
ms required to activate and settle the internal circuitry. This user-controlled approach can be used in applications
that require lower data throughput rates and lowest power dissipation. The content of CR is not changed during
standby mode. A pin-controlled reset is not required after returning to normal operation.
Although the standby mode affects the entire device, each device channel pair can also be individually switched
off by setting control register bits C[15:13] (PD_x). When reactivated, the relevant channel pair requires 10 ms to
fully settle before starting a new conversion. The internal reference remains active, except all channels are
powered down at the same time.
The auto-NAP power-down mode is enabled by asserting the A-NAP bit (C22) in the control register. If the autoNAP mode is enabled, the ADS8555 device automatically reduces the current requirement to 6 mA after finishing
a conversion; thus, the end of conversion actually activates the power-down mode. Triggering a new conversion
by applying a positive CONVST_x edge puts the device back into normal operation, starts the acquisition of the
analog input, and automatically starts a new conversion six conversion clock cycles later. Therefore, a complete
conversion cycle takes 24.5 conversion clock cycles; thus, the maximum throughput rate in auto-NAP powerdown mode is reduced to a maximum of 380 kSPS in serial mode, and 500 kSPS in parallel mode. The internal
reference remains active during the auto-NAP mode. Table 4 compares the analog current requirements of the
device in the different modes.
Table 4. Maximum Analog Current (IAVDD) Demand of the ADS8555
OPERATIONAL
MODE
ANALOG
CURRENT
(IAVDD)
ENABLED BY
ACTIVATED
BY
NORMAL
OPERATION
TO POWERDOWN DELAY
RESUMED BY
POWER UP
TO NORMAL
OPERATION
DELAY
POWER UP
TO NEXT
CONVERSION
START TIME
DISABLED BY
Normal operation
12mA/channel
pair (maximum
data rate)
Power on
CONVST_x
—
—
—
—
Power off
Auto-NAP
6mA
A-NAP = 1
(CR bit)
Each end of
conversion
At falling edge
of BUSY
CONVST_x
Immediate
6 × tCCLK
A-NAP = 0
(CR bit)
Power down of
channel pair x
16μA
(channel pair x)
HW/SW = 1
PD_x = 1
(CR bit)
Immediate
PD_x = 0
(CR bit)
Immediate after
completing
register update
10ms
HW/SW = 0
Stand-by
50μA
Power on
STBY = 0
Immediate
STBY = 1
Immediate
10ms
Power off
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7.5 Register Maps
7.5.1 Control Register (CR); Default Value = 0x000003FF
The control register settings can only be changed in software mode and are not affected when switching to
hardware mode thereafter. The register values are independent from input pin settings. Changes are active with
the rising edge of WR in parallel interface mode or with the 32nd falling SCLK edge of the access in which the
register content has been updated in serial mode. Optionally, the register can also be partially updated by writing
only the upper eight bits (C[31:24]). The CR content is defined in Table 5.
RESET
(or Power-Up)
BUSY
(C20 = C21 = 0)
PAR/SER = 1
FS
C[31:0]
Initialization Data
SDI
Continuous Update
Continuous Update
C
[31:24]
C
[31:24]
PAR/SER = 0; WORD/BYTE = 0
CS
WR
Initialization Data
DB[15:0]
C
[31:16]
Update
C
[15:0]
C
[31:24]
C
[15:0]
PAR/SER = 0; WORD/BYTE = 1
WR
Initialization Data
DB[15:8]
C
[31:24]
C
[23:16]
C
[15:8]
Update
C
[31:24]
C
[7:0]
C
[23:16]
Figure 35. Control Register Update Options
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Register Maps (continued)
Table 5. Control Register (CR) Map
30
ACTIVE IN
HARDWARE MODE
BIT
NAME
DESCRIPTION
C31
CH_C
0 = Channel pair C disabled for next conversion (default)
1 = Channel pair C enabled
No
C30
CH_B
0 = Channel pair B disabled for next conversion (default)
1 = Channel pair B enabled
No
C29
CH_A
0 = Channel pair A disabled for next conversion (default)
1 = Channel pair A enabled
No
C28
RANGE_C
0 = Input voltage range selection for channel pair C: 4 VREF (default)
1 = Input voltage range selection for channel pair C: 2 VREF
No
C27
RANGE_B
0 = Input voltage range selection for channel pair B: 4 VREF (default)
1 = Input voltage range selection for channel pair B: 2 VREF
No
C26
RANGE_A
0 = Input voltage range selection for channel pair A: 4 VREF (default)
1 = Input voltage range selection for channel pair A: 2 VREF
No
C25
REFEN
0 = Internal reference source disabled (default)
1 = Internal reference source enabled
No
C24
REFBUF
0 = Internal reference buffers enabled (default)
1 = Internal reference buffers disabled
No
C23
SEQ
0 = Sequential convert start mode disabled (default)
1 = Sequential convert start mode enabled (bit 11 must be 1 in this case)
No
C22
A-NAP
0 = Normal operation (default)
1 = Auto-NAP feature enabled
Yes
C21
BUSY/INT
0 = BUSY/INT pin in normal mode (BUSY) (default)
1 = BUSY/INT pin in interrupt mode (INT)
Yes
C20
BUSY L/H
0 = BUSY/INT active high (default)
1 = BUSY/INT active low
Yes
C19
Don’t use
This bit is always set to 0
—
0 = Internal reference voltage: 2.5 V (default)
1 = Internal reference voltage: 3 V
Yes
C18
VREF
C17
READ_EN
0 = Normal operation (conversion results available on SDO_x) (default)
1 = Control register contents output on SDO_x with next access
Yes
C16
C23:0_EN
0 = Control register bits C[31:24] update only (serial mode only) (default)
1 = Entire control register update enabled (serial mode only)
Yes
C15
PD_C
0 = Normal operation (default)
1 = Power down for channel pair C enabled (bit 31 must be 0 in this case)
Yes
C14
PD_B
0 = Normal operation (default)
1 = Power down for channel pair B enabled (bit 30 must be 0 in this case)
Yes
C13
PD_A
0 = Normal operation (default)
1 = Power down for channel pair A enabled (bit 29 must be 0 in this case)
Yes
C12
Don't use
This bit is always 0
—
C11
CLKSEL
0 = Normal operation with internal conversion clock (mandatory in hardware mode) (default)
1 = External conversion clock (applied through pin 27) used
No
C10
CLKOUT_EN
0 = Normal operation (default)
1 = Internal conversion clock available at pin 27
No
C9
REFDAC[9]
Bit 9 (MSB) of reference DAC value; default = 1
Yes
C8
REFDAC[8]
Bit 8 of reference DAC value; default = 1
Yes
C7
REFDAC[7]
Bit 7 of reference DAC value; default = 1
Yes
C6
REFDAC[6]
Bit 6 of reference DAC value; default = 1
Yes
C5
REFDAC[5]
Bit 5 of reference DAC value; default = 1
Yes
C4
REFDAC[4]
Bit 4 of reference DAC value; default = 1
Yes
C3
REFDAC[3]
Bit 3 of reference DAC value; default = 1
Yes
C2
REFDAC[2]
Bit 2 of reference DAC value; default = 1
Yes
C1
REFDAC[1]
Bit 1 of reference DAC value; default = 1
Yes
C0
REFDAC[0]
Bit 0 (LSB) of reference DAC value; default = 1
Yes
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8 Applications and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The ADS8555 device enables high-precision measurement of up to six analog signals simultaneously. The
following sections summarize some of the typical use cases for the ADS8555 device and the main steps and
components used around the analog-to-digital converter.
8.2 Typical Application
8.2.1 Measurement of Electrical Variables in a 3-Phase Power System
The accurate measurement of electrical variables in a power grid is extremely critical because it helps determine
the operating status and running quality of the grid. Such accurate measurements also help diagnose problems
with the power network thereby enabling prompt solutions and minimizing down time. The key electrical variables
measured in 3-phase power systems are the three line voltages and the three line currents; see Figure 36.
These variables enable metrology and power automation systems to determine the amplitude, frequency and
phase information to perform harmonic analysis, power factor calculation and power quality assessment among
others.
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Typical Application (continued)
0.1 F
HVDD
OPA2277
50 k
ADS8555
From
reference
block
REFIO
49.9
0.47 F
BVDD
CH_A1
HVSS
100 k
From analog
front ends of
CH_B1 and
CH_C1
370 pF
0.1 F
100 k
820 pF
To analog front ends of
CH_B1 and CH_C1
REFEN/WR
HW/SW
HVSS
PT3
370 pF
PAR/SER
+15 V
WORD/BYTE
HVDD
100 k
820 pF
10 F
0.1 F
10 F
0.1 F
-15 V
AGND
HVSS
+5 V
AVDD
CT1
40 F
Phase A
AGND
+3.3 V
Phase B
CT2
BVDD
1 F
Neutral
BGND
REFCP
Load
Three Phase
Power System
CH_C1
CH_A0
100 k
PT2
STBY
RANGE
HVDD
OPA2277 49.9
50 k
PT1
CH_B1
Phase C
CT3
10 F
From analog
front end of
CH_C0
CH_C0
REFBP
10 F
To analog front ends of
CH_B0 and CH_C0
From analog
front end of
CH_B0
REFBN
CH_B0
REFAP
10 F
Host
controller
REFCN
REFAN
CONVST_A
CONVST_B
CONVST_C
RESET
CS
RD
DB[15:0]
Figure 36. Simultaneous Acquisition of Voltage and Current in a 3-Phase Power System
32
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Typical Application (continued)
8.2.1.1 Design Requirements
To
•
•
•
•
•
•
begin the design process, a few parameters must be decided upon. The designer must know the following:
Output range of the potential transformers (elements labeled PT1, PT2, and PT3 in Figure 36)
Output range of the current transformers (elements labeled CT1, CT2, and CT3 in Figure 36)
Input impedance required from the analog front end for each channel
Fundamental frequency of the power system
Number of harmonics that must be acquired
Type of signal conditioning required from the analog front end for each channel
8.2.1.2 Detailed Design Procedure
Figure 37 shows the topology chosen to meet the design requirements. A feedback capacitor CF is included to
provide a low-pass filter characteristic and attenuate signals outside the band of interest.
C1
R1
HVDD
R2
Vout
RIN
To ADS8555
input
C2
HVSS
RF
Vin
From PT
or CT
CF
Figure 37. Op Amp in an Inverting Configuration
The potential transformers (PTs) and current transformers (CTs) used in the system depicted in Figure 36
provide the six input variables required. These transformers have a ±10-V output range. Although the PTs and
CTs provide isolation from the power system, the value of RIN is selected as 100 kΩ to provide an additional,
high-impedance safety element to the input of the ADC. Moreover, selecting a low-frequency gain of –1 V/V (as
shown in Equation 5) provides a ±10-V output that can be fed into the ADS8555 device; therefore, the value of
RF is selected as 100 kΩ.
V out
Low f
RF
V in
R IN
100 k :
Vin
100 k :
V in
(5)
The primary goal of the acquisition system depicted in Figure 36 is to measure up to 20 harmonics in a 60-Hz
power network. Thus, the analog front-end must have sufficient bandwidth to detect signals up to 1260 Hz, as
shown in Equation 6.
f MAX
( 20 1) 60 Hz
1260 Hz
(6)
Based on the bandwidth found in Equation 6 the ADS8555 device is set to simultaneously sample all six
channels at 15.36 kSPS, which provides enough samples to clearly resolve even the highest harmonic required.
The passband of the configuration shown in Figure 37 is determined by the –3-dB frequency according to
Equation 7. The value of CF is selected as 820 pF, which is a standard capacitance value available in 0603 size
(surface-mount component) and such values, combined with that of RF, result in sufficient bandwidth to
accommodate the required 20 harmonics (at 60 Hz).
f
3 dB
1
2S R F C F
1
2S (100 k : )( 820 pF )
1940 Hz
(7)
The value of R1 is selected as the parallel combination of RIN and RF to prevent the input bias current of the
operational amplifier from generating an offset error.
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Typical Application (continued)
The value of component C1 is chosen as 0.1 µF to provide a low-impedance path for noise signals that can be
picked up by R1; the 0.1-µF capacitance value improves the EMI robustness and noise performance of the
system.
The OPA2277 device is chosen for its low input offset voltage, low drift, bipolar swing, sufficient gain-bandwidth
product and low quiescent current. For additional information on the procedure to select SAR ADC input drivers,
see reference guide TIDU181.
The charge injection damping circuit is composed of R2 (49.9 Ω) and C2 (370 pF); these components reject highfrequency noise and meet the settling requirements of the ADS8555 device input.
Figure 38 shows the reference block used in this design.
REF5025
AVDD
10
VIN
10 F
0.1 F
OPA211
OUT
100
To REFIO
1
GND
TRIM
47 F
AGND
47 F 10 nF
AVDD
47 F
1 F
10 nF
22 F
49.9
Figure 38. Op Amp in an Inverting Configuration
For more information on the design of charge injection damping circuits and reference driving circuits for SAR
ADCs, consult reference guide TIDU014.
8.2.1.3 Application Curve
Figure 39 shows the frequency spectrum of the data acquired by the ADS8555 device for a sinusoidal, 20-VPP
input at 60 Hz.
Figure 39. Frequency Spectrum for a Sinusoidal 20-VPP Signal at 60 Hz
The ac performance parameters are:
34
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Typical Application (continued)
•
•
•
•
SNR: 91.9 dB
THD: –99.68 dB
SNDR: 91.23 dB
SFDR: 103.65 dB
9 Power Supply Recommendations
The ADS8555 device requires four separate supplies: the analog supply for the ADC (AVDD), the buffer I/O
supply for the digital interface (BVDD), and the two high-voltage supplies driving the analog input circuitry (HVDD
and HVSS). Generally, there are no specific requirements with regard to the power sequencing of the device.
However, when HVDD is supplied before AVDD, the internal ESD structure conducts, increasing IHVDD beyond
the specified value.
The AVDD supply provides power to the internal circuitry of the ADC. AVDD can be set in the range of 4.5 V to
5.5 V. Because the supply current of the device is typically 30 mA, a passive filter cannot be used between the
digital board supply of the application and the AVDD pin. TI recommends a linear regulator to generate the
analog supply voltage. Decouple each AVDD pin to AGND with a 100-nF capacitor. In addition, place a single
10-μF capacitor close to the device but without compromising the placement of the smaller capacitor. Optionally,
each supply pin can be decoupled using a 1-μF ceramic capacitor without the requirement for a 10-μF capacitor.
The BVDD supply is only used to drive the digital I/O buffers and can be set in the range of 2.7 V to 5.5 V. This
range allows the device to interface with most state-of-the-art processors and controllers. To limit the noise
energy from the external digital circuitry to the device, filter BVDD. A 10-Ω resistor can be placed between the
external digital circuitry and the device because the current drawn is typically below 2 mA (depending on the
external loads). Place a bypass ceramic capacitor of 1 μF (or alternatively, a pair of 100-nF and 10-μF
capacitors) between the BVDD pin and pin 8.
The high-voltage supplies (HVSS and HVDD) are connected to the analog inputs. Noise and glitches on these
supplies directly couple into the input signals. Place a 100-nF ceramic decoupling capacitor, located as close to
the device as possible, between each of pins 30, 31, and AGND. An additional 10-μF capacitor is used that must
be placed close to the device but without compromising the placement of the smaller capacitor.
10 Layout
10.1 Layout Guidelines
All GND pins must be connected to a clean ground reference. This connection must be kept as short as possible
to minimize the inductance of this path. TI recommends using vias connecting the pads directly to the ground
plane. In designs without ground planes, keep the ground trace as wide as possible. Avoid connections that are
too close to the grounding point of a microcontroller or digital signal processor.
Depending on the circuit density on the board, placement of the analog and digital components, and the related
current loops, a single solid ground plane for the entire printed-circuit-board (PCB) or a dedicated analog ground
area can be used. In case of a separated analog ground area, ensure a low-impedance connection between the
analog and digital ground of the ADC by placing a bridge underneath (or next) to the ADC. Otherwise, even short
undershoots on the digital interface lower than –300 mV lead to the conduction of ESD diodes causing current
flow through the substrate and degrading the analog performance.
During PCB layout, take care to avoid any return currents crossing sensitive analog areas or signals.
Figure 40 illustrates a layout recommendation for the ADS8555 device along with the proper decoupling and
reference capacitor placement and connections.
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ADS8555
SBAS531D – DECEMBER 2010 – REVISED FEBRUARY 2016
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10.2 Layout Example
ADS8555
Top View
To AVDD
To AVDD
AVDD Source
To DUT
10
mF
AVDD
51
0.1mF
AGND
54
0.47mF
AGND
56
10mF
AGND
58
10mF
AGND
61
AGND
62
10mF
1
48
2
AVDD
3
AVDD
4
45
5
AGND
6
AGND
7
42
BGND
AVDD
BVDD
AVDD
AGND
13
36
14
AVDD
15
AVDD
16
33
17
18
19
20
21 22
23
24
0.1mF
LEGEND
To
AVDD
27
28
29
0.1
mF
To AVDD
0.1
mF
0.1
mF
To AVDD
0.1
mF
0.1
mF
To AVDD
0.1
mF
AGND
12
HVDD
AGND
HVSS
39
11
AVDD
10
AGND
1
mF
To
BVDD
63
AVDD
64
AGND
0.1mF
0.1mF
0.1mF
10mF
10mF
To
HVSS/HVDD
TOP layer; copper pour and traces
Lower layer; AGND area
Lower layer; BGND area
Via
(1)
All 0.1-μF, 0.47-μF, and 1-μF capacitors must be placed as close to the ADS8555 device as possible.
(2)
All 10-μF capacitors must be close to the device but without compromising the placement of the smaller capacitors.
Figure 40. Layout Recommendation
36
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SBAS531D – DECEMBER 2010 – REVISED FEBRUARY 2016
11 Device and Documentation Support
11.1 Documentation Support
11.1.1 Related Documentation
For related documentation see the following:
• OPA2277 Data Sheet, SBOS079
• REF5025 Data Sheet, SBOS410
• Power-Optimized 16-Bit 1-MSPS Data Acquisition Block Design Guide, TIDU014
• 16-Bit 400-KSPS 4-Channel Multiplexed Data Acquisition System Design Guide, TIDU181
11.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
www.ti.com
2-Feb-2016
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
ADS8555SPM
ACTIVE
LQFP
PM
64
160
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 125
ADS
8555
ADS8555SPMR
ACTIVE
LQFP
PM
64
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 125
ADS
8555
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
2-Feb-2016
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
2-Feb-2016
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
ADS8555SPMR
Package Package Pins
Type Drawing
LQFP
PM
64
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
1000
330.0
24.4
Pack Materials-Page 1
13.0
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
13.0
2.1
16.0
24.0
Q2
PACKAGE MATERIALS INFORMATION
www.ti.com
2-Feb-2016
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
ADS8555SPMR
LQFP
PM
64
1000
367.0
367.0
45.0
Pack Materials-Page 2
MECHANICAL DATA
MTQF008A – JANUARY 1995 – REVISED DECEMBER 1996
PM (S-PQFP-G64)
PLASTIC QUAD FLATPACK
0,27
0,17
0,50
0,08 M
33
48
49
32
64
17
0,13 NOM
1
16
7,50 TYP
Gage Plane
10,20
SQ
9,80
12,20
SQ
11,80
0,25
0,05 MIN
0°– 7°
0,75
0,45
1,45
1,35
Seating Plane
0,08
1,60 MAX
4040152 / C 11/96
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Falls within JEDEC MS-026
May also be thermally enhanced plastic with leads connected to the die pads.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
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